chiliGREEN D945GBZ User Manual
Intel® Desktop Board
D945GCZ
Technical Product Specification
May 2005
Order Number: D14068-001US
The Intel® Desktop Board D945GCZ may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board D945GCZ Specification Update.
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board D945GCZ Technical Product
Specification.
This product specification applies to only the standard Intel Desktop Board D945GCZ with BIOS
identifier NT94510J.86A.
Changes to this specification will be published in the Intel Desktop Board D945GCZ Specification
Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED
BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH
PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT,
COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN
MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.
All Intel desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for
installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or
embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may
not be supported without further evaluation by Intel.
May 2005
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property
rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not
provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other
intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.”
Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising
from future changes to them.
®
Intel
desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,
Germany 44-0-1793-421-333, other Countries 708-296-9333.
Intel, Pentium, and Celeron are registered trademarks of Intel Corporation or its subsidiaries in the United States and other
countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2005, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
®
power and environmental requirements, and the BIOS for the Intel
describes the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board D945GCZ
and its components to the vendors, system integrators, and other engineers and technicians who
need this level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Desktop Board D945GCZ
2 A map of the resources of the Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
Desktop Board D945GCZ. It
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these
symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
#
NOTE
Notes call attention to important information.
INTEGRATOR’S NOTES
Integrator’s notes are used to call attention to information that may be useful to system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
WARNING
Warnings indicate conditions, which if not observed, can cause personal injury.
iii
Intel Desktop Board D945GCZ Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
(NxnX) When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the Desktop Board D945GCZ, and X is the instance of the
particular part at that general location. For example, J5J1 is a connector, located at 5J. It is
the first connector in the 5J area.
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbits/sec Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Power Connector Terminology Change ......................................................................... 9
1.2 Overview ...................................................................................................................... 10
1.2.1 Feature Summary.......................................................................................... 10
1.2.2 Manufacturing Options ..................................................................................11
1.2.3 Board Layout ................................................................................................. 12
1.2.4 Block Diagram ............................................................................................... 14
1.3 Online Support ............................................................................................................. 15
1.4 Processor .....................................................................................................................15
1.5 System Memory ........................................................................................................... 16
1.5.1 Memory Configurations .................................................................................17
1.6 Intel® 945G Chipset .....................................................................................................21
1.6.1 Intel 945G Graphics Subsystem.................................................................... 21
1.6.2 USB ............................................................................................................... 23
1.6.3 IDE Support ................................................................................................... 24
1.6.4 Real-Time Clock, CMOS SRAM, and Battery................................................ 25
1.7 PCI Express* Connectors ............................................................................................26
1.8 IEEE-1394a Connectors (Optional).............................................................................. 26
1.9 Legacy I/O Controller ................................................................................................... 27
1.9.1 Serial Port...................................................................................................... 27
1.9.2 Parallel Port ...................................................................................................27
1.9.3 Diskette Drive Controller................................................................................ 27
1.9.4 Keyboard and Mouse Interface .....................................................................27
1.10 Audio Subsystem ......................................................................................................... 28
1.10.1 Audio Subsystem Software ...........................................................................28
1.10.2 Audio Connectors .......................................................................................... 28
1.10.3 8-Channel (7.1) Audio Subsystem................................................................. 28
1.10.4 6-Channel (5.1) Audio Subsystem................................................................. 30
1.11 LAN Subsystem ...........................................................................................................31
1.11.1 LAN Subsystem Software.............................................................................. 31
1.11.2 10/100 Mbits/sec LAN Subsystem................................................................. 32
1.11.3 Gigabit LAN Subsystem ................................................................................33
1.11.4 Intel® Active Management Technology (Optional)......................................... 34
1.11.5 Alert Standard Format (ASF) Support (Optional) .......................................... 35
1.12 Hardware Management Subsystem............................................................................. 36
1.12.1 Hardware Monitoring and Fan Control ASIC ................................................. 36
1.12.2 Chassis Intrusion and Detection.................................................................... 36
1.12.3 Fan Monitoring............................................................................................... 36
1.12.4 Thermal Monitoring........................................................................................ 37
1.13 Power Management ..................................................................................................... 38
1.13.1 ACPI .............................................................................................................. 38
1.13.2 Hardware Support .........................................................................................40
1.14 Trusted Platform Module (Optional) ............................................................................. 43
v
Intel Desktop Board D945GCZ Technical Product Specification
2 Technical Reference
2.1 Introduction ..................................................................................................................45
2.2 Memory Resources ...................................................................................................... 45
2.2.1 Addressable Memory..................................................................................... 45
2.2.2 Memory Map.................................................................................................. 47
2.3 DMA Channels ............................................................................................................. 47
2.4 Fixed I/O Map............................................................................................................... 48
2.5 PCI Configuration Space Map...................................................................................... 49
2.6 Interrupts ......................................................................................................................50
2.7 PCI Conventional Interrupt Routing Map .....................................................................51
2.8 Connectors................................................................................................................... 53
2.8.1 Back Panel Connectors ................................................................................. 53
2.8.2 Component-side Connectors......................................................................... 56
2.9 Jumper Block ...............................................................................................................64
2.10 Mechanical Considerations ..........................................................................................65
2.10.1 Form Factor ................................................................................................... 65
2.10.2 I/O Shield....................................................................................................... 66
2.11 Electrical Considerations.............................................................................................. 68
2.11.1 DC Loading.................................................................................................... 68
2.11.2 Add-in Board Considerations......................................................................... 68
2.11.3 Fan Connector Current Capability ................................................................. 69
2.11.4 Power Supply Considerations .......................................................................69
2.12 Thermal Considerations ............................................................................................... 70
2.13 Reliability...................................................................................................................... 72
2.14 Environmental .............................................................................................................. 73
2.15 Regulatory Compliance................................................................................................ 74
2.15.1 Safety Regulations ........................................................................................74
2.15.2 EMC Regulations........................................................................................... 74
2.15.3 European Union Declaration of Conformity Statement.................................. 75
2.15.4 Recycling Considerations ..............................................................................76
2.15.5 Product Certification Markings (Board Level) ................................................ 77
3 Overview of BIOS Features
3.1 Introduction ..................................................................................................................79
3.2 BIOS Flash Memory Organization ...............................................................................80
3.3 Resource Configuration ...............................................................................................80
3.3.1 PCI Autoconfiguration.................................................................................... 80
3.3.2 PCI IDE Support ............................................................................................ 80
3.4 System Management BIOS (SMBIOS) ........................................................................81
3.5 Legacy USB Support.................................................................................................... 81
3.6 BIOS Updates .............................................................................................................. 82
3.6.1 Language Support .........................................................................................82
3.6.2 Custom Splash Screen.................................................................................. 82
3.7 Boot Options ................................................................................................................83
3.7.1 CD-ROM Boot ...............................................................................................83
3.7.2 Network Boot ................................................................................................. 83
3.7.3 Booting Without Attached Devices ................................................................ 83
3.7.4 Changing the Default Boot Device During POST .......................................... 83
vi
3.8 Adjusting Boot Speed................................................................................................... 84
3.8.1 Peripheral Selection and Configuration ......................................................... 84
3.8.2 BIOS Boot Optimizations............................................................................... 84
3.9 BIOS Security Features ...............................................................................................85
4 Error Messages and Beep Codes
4.1 Speaker ....................................................................................................................... 87
4.2 BIOS Beep Codes........................................................................................................ 87
4.3 BIOS Error Messages .................................................................................................. 87
4.4 Port 80h POST Codes .................................................................................................88
Figures
1. Board Components ...................................................................................................... 12
2. Block Diagram.............................................................................................................. 14
3. Memory Channel and DIMM Configuration.................................................................. 17
4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs ..............................18
5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs............................ 18
6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs.............................. 19
7. Single Channel (Asymmetric) Mode Configuration with One DIMM............................. 20
8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs ........................ 20
9. Front/Back Panel Audio Connector Options for 8-Channel (7.1) Audio Subsystem .... 29
10. 8-channel (7.1) Audio Subsystem Block Diagram........................................................ 29
11. Front/Back Panel Audio Connector Options for 6-Channel (5.1) Audio Subsystem .... 30
12. 6-Channel (5.1) Audio Subsystem Block Diagram....................................................... 30
13. LAN Connector LED Locations .................................................................................... 32
14. LAN Connector LED Locations .................................................................................... 33
15. Thermal Sensors and Fan Connectors ........................................................................ 37
16. Location of the Standby Power Indicator LED .............................................................43
17. Detailed System Memory Address Map....................................................................... 46
18. Back Panel Connectors for 8-Channel (7.1) Audio Subsystem ...................................54
19. Back Panel Connectors for 6-Channel (5.1) Audio Subsystem ...................................55
20. Component-side Connectors .......................................................................................56
21. Connection Diagram for Front Panel Connector .......................................................... 61
22. Connection Diagram for Front Panel USB Connectors................................................ 63
23. Connection Diagram for IEEE 1394a Connectors........................................................ 63
24. Location of the Jumper Block....................................................................................... 64
25. Board Dimensions........................................................................................................ 65
26. I/O Shield Dimensions for Boards with the 8-Channel (7.1) Audio Subsystem............ 66
27. I/O Shield Dimensions for Boards with the 6-Channel (5.1) Audio Subsystem............ 67
28. Processor Heatsink for Omni-directional Airflow.......................................................... 70
29. Localized High Temperature Zones .............................................................................71
Contents
vii
Intel Desktop Board D945GCZ Technical Product Specification
Tables
1. Feature Summary ........................................................................................................10
2. Manufacturing Options ................................................................................................. 11
3. Board Components Shown in Figure 1 ........................................................................ 13
4. Supported Memory Configurations ..............................................................................16
5. LAN Connector LED States .........................................................................................32
6. LAN Connector LED States .........................................................................................33
7. Effects of Pressing the Power Switch ..........................................................................38
8. Power States and Targeted System Power ................................................................. 39
9. Wake-up Devices and Events ...................................................................................... 40
10. System Memory Map ................................................................................................... 47
11. DMA Channels ............................................................................................................. 47
12. I/O Map ........................................................................................................................48
13. PCI Configuration Space Map...................................................................................... 49
14. Interrupts ......................................................................................................................50
15. PCI Interrupt Routing Map ...........................................................................................52
16. Back Panel Connectors Shown in Figure 18................................................................ 54
17. Back Panel Connectors Shown in Figure 19................................................................ 55
18. Component-side Connectors Shown in Figure 20 .......................................................57
19. Front Panel Audio Connector....................................................................................... 58
20. Chassis Intrusion Connector ........................................................................................58
21. Serial ATA Connectors................................................................................................. 58
22. Processor Fan Connector ............................................................................................ 58
23. Front and Rear Chassis Fan Connectors..................................................................... 58
24. Main Power Connector................................................................................................. 59
25. Processor Core Power Connector ...............................................................................59
26. Auxiliary Front Panel Power/Sleep LED Connector ..................................................... 60
27. Front Panel Connector .................................................................................................61
28. States for a One-Color Power LED .............................................................................. 62
29. States for a Two-Color Power LED .............................................................................. 62
30. BIOS Setup Configuration Jumper Settings................................................................. 64
31. DC Loading Characteristics .........................................................................................68
32. Fan Connector Current Capability................................................................................ 69
33. Thermal Considerations for Components ....................................................................72
34. Environmental Specifications .......................................................................................73
35. Safety Regulations .......................................................................................................74
36. EMC Regulations ......................................................................................................... 74
37. Product Certification Markings ..................................................................................... 77
38. BIOS Setup Program Menu Bar................................................................................... 80
39. BIOS Setup Program Function Keys............................................................................ 80
40. Boot Device Menu Options ..........................................................................................83
41. Supervisor and User Password Functions ................................................................... 85
42. Beep Codes .................................................................................................................87
43. BIOS Error Messages .................................................................................................. 87
44. Port 80h POST Code Ranges...................................................................................... 88
45. Port 80h POST Codes .................................................................................................89
46. Typical Port 80h POST Sequence ............................................................................... 92
viii
1 Product Description
What This Chapter Contains
1.1 Power Connector Terminology Change ......................................................................... 9
1.2 Overview ...................................................................................................................... 10
1.3 Online Support ............................................................................................................. 15
1.4 Processor .....................................................................................................................15
1.5 System Memory ........................................................................................................... 16
1.6 Intel® 945G Chipset .....................................................................................................21
1.7 PCI Express* Connectors ............................................................................................26
1.8 IEEE-1394a Connectors (Optional).............................................................................. 26
1.9 Legacy I/O Controller ................................................................................................... 27
1.10 Audio Subsystem ......................................................................................................... 28
1.11 LAN Subsystem ...........................................................................................................31
1.12 Hardware Management Subsystem............................................................................. 36
1.13 Power Management ..................................................................................................... 38
1.14 Trusted Platform Module (Optional) ............................................................................. 43
1.1 Power Connector Terminology Change
Technical Product Specifications for ATX and microATX desktop boards referred to the 2 x 2
power connector as the ATX12V connector. With the arrival of BTX form factor desktop boards,
this connector will henceforth be referred to as the Processor Core Power connector.
For information about Refer to
The BTX form factor http://www.formfactors.org
9
Intel Desktop Board D945GCZ Technical Product Specification
1.2 Overview
1.2.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor microBTX Form Factor (10.40 inches by 10.50 inches [264.16 millimeters by
266.70 millimeters])
Processor Support for an Intel® Pentium® 4 processor in an LGA775 socket with a 1066, 800,
or 533 MHz system bus
Memory
Chipset
Video Intel® GMA950 onboard graphics subsystem
Audio Refer to Table 2 on page 11 for a description of audio subsystem options
Legacy I/O Control Legacy I/O controller for diskette drive, serial, parallel, and PS/2* ports
USB Support for USB 2.0 devices
Peripheral
Interfaces
LAN Support Refer to Table 2 on page 11 for a description of LAN subsystem options.
BIOS
Expansion
Capabilities
Instantly Available
PC Technology
• Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR2 667, DDR2 533, or DDR2 400 MHz DIMMs
• Support for up to 4 GB of system memory
®
Intel
945G Chipset, consisting of:
®
• Intel
• Intel
• Eight USB ports
• One serial port
• One parallel port
• Four Serial ATA interfaces
• One Parallel ATA IDE interface with UDMA 33, ATA-66/100 support
• One diskette drive interface
• PS/2 keyboard and mouse ports
• Intel
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
• Two PCI Conventional* bus connectors
• One PCI Express* x1 bus add-in card connector
• One PCI Express x16 bus add-in card connector
• Support for PCI Local Bus Specification Revision 2.3
• Support for PCI Express Revision 1.0a
• Suspend to RAM support
• Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
82945G Graphics Memory Controller Hub (GMCH)
®
82801G I/O Controller Hub (ICH7)
®
BIOS (resident in the SPI Flash device)
and SMBIOS
continued
10
Product Description
Table 1. Feature Summary (continued)
Hardware Monitor
Subsystem
• Hardware monitoring and fan control ASIC
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan connectors
• Three fan sense inputs used to monitor fan activity
• Fan speed control
1.2.2 Manufacturing Options
Table 2 describes the manufacturing options. Not every manufacturing option is available in all
marketing channels. Please contact your Intel representative to determine which manufacturing
options are available to you.
Table 2. Manufacturing Options
Audio Subsystem Intel® High Definition Audio subsystem in one of the following configurations:
• 8-channel (7.1) audio subsystem with five analog audio outputs and one S/PDIF
optical digital audio output using the Sigmatel 9223 audio codec
• 6-channel (5.1) audio subsystem with three analog audio outputs using the
Sigmatel 9220 audio codec
IEEE-1394a
Interface
LAN subsystem The board provides one of the following:
SATA RAID Intel® 82801GR I/O Controller Hub (ICH7-R) for RAID support (levels 0,1, 0+1, and 5)
Trusted Platform
Module (TPM),
revision 1.2
For information about Refer to
Available configurations for the board Section 1.3, page 15
IEEE-1394a controller and three IEEE-1394a connectors (one back panel connector,
two front-panel connectors)
• Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the
®
82573E/82573V/82574V Gigabit Ethernet Controller
Intel
®
• 10/100 Mbits/sec LAN subsystem using the Intel
LAN Connect (PLC) device
on the SATA interface
A component that enhances platform security
82562GX/82562GZ Platform
11
Intel Desktop Board D945GCZ Technical Product Specification
1.2.3 Board Layout
Figure 1 shows the location of the major components.
BA C
FF
EE
DD
CC
BB
AA
Z
D
E
F
G
H
Y
X
W
Figure 1. Board Components
Table 3 lists the components identified in Figure 1.
I
J
K
L
M
N
P
OS RTUV Q
OM17934
12
Table 3. Board Components Shown in Figure 1
Item/callout
from Figure 1 Description
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
AA
BB
CC
DD
EE
FF
Front panel audio connector
Back panel connectors
Main power connector
Front panel USB connectors [2]
Serial ATA connectors [4]
PCI Express x16 bus add-in card connector
PCI Conventional bus add-in card connectors [2]
PCI Express x1 bus add-in card connector
Speaker
IEEE-1394a controller (optional)
BIOS Setup configuration jumper block
Front panel IEEE-1394a connectors (optional) [2]
Legacy I/O controller
Diskette drive connector
Front panel connector
Front chassis fan connector
Auxiliary front panel power LED connector
Intel 82801G I/O Controller Hub (ICH7)
LGA775 processor socket
Intel 82945G GMCH
Remote thermal sensor
Processor core power connector
Processor fan connector
DIMM Channel A sockets [2]
DIMM Channel B sockets [2]
Rear chassis fan connector
SPI flash device
Battery
Ethernet device
Audio codec
Parallel ATE IDE connector
Chassis intrusion connector
Product Description
13
Intel Desktop Board D945GCZ Technical Product Specification
1.2.4 Block Diagram
Figure 2 is a block diagram of the major functional areas.
PCI Express x1 Slot 1
Parallel ATA
IDE Connector
LGA775
Processor Socket
PCI Express
x16 Interface
PCI Express
x16
Connector
VGA
Port
Channel A
DIMMs (2)
Channel B
DIMMs (2)
Display Interface
PCI Express x1 Interface
Parallel ATA
IDE Interface
System Bus
(1066/800/533 MHz)
Intel 945G Chipset
Intel 82945G
Graphics and
Memory Controller
Hub (GMCH)
Dual-Channel
Memory Bus
SMBus
Gigabit Ethernet
Controller (Optional)
USB
Legacy
I/O
Controller
LPC
Bus
Intel 82801G
I/O Controller Hub
(ICH7)
DMI Interconnect
Interface
LAN Connect
Back Panel/Front Panel
USB Ports
Serial Port
Parallel Port
PS/2 Mouse
PS/2 Keyboard
Serial Peripheral
Interface (SPI)
Flash Device
LPC
Bus
10/100
LAN PLC
(Optional)
TPM Component
LAN
Connector
Diskette Drive
Connector
(Optional)
LAN
Connector
14
IEEE-1394a Connectors
(Optional)
PCI Slot 1
PCI Slot 2
= connector or socket
IEEE-1394a
PCI Bus
Controller
(Optional)
SMBus
Hardware Monitoring
and Fan Control ASIC
PCI
Bus
Figure 2. Block Diagram
Serial ATA IDE
Connectors (4)
Line Out
Mic In
Center and LFE/
Surround L-R/
OM17820
High Definition Audio Link
Serial ATA
IDE Interface
Audio
Codec
Line In/Retaski ng Jack
Line Out/Retasking Jack
Mic In/Retasking Jack
Retasking Jack (optional )
Retasking Jack (optional )
S/PDIF (optional)
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board D945GCZ under
“Desktop Board Products” or “Desktop
Board Support”
Available configurations for the Desktop
Board D945GCZ
Processor data sheets http://www.intel.com/design/litcentr
ICH7 addressing http://developer.intel.com/products/chipsets
Custom splash screens http://intel.com/design/motherbd/gen_indx.htm
Audio software and utilities http://www.intel.com/design/motherbd
LAN software and drivers http://www.intel.com/design/motherbd
Supported video modes http://www.intel.com/design/motherbd/cz/cz_documentation.htm
Intel® Active Management Technology http://www.intel.com/technology/manage/iamt/index.htm
1.4 Processor
Product Description
http://www.intel.com/design/motherbd
http://support.intel.com/support/motherboards/desktop
http://developer.intel.com/design/motherbd/cz/cz_available.htm
The board is designed to support Intel Pentium 4 processors in an LGA775 processor socket with a
1066, 800, or 533 MHz system bus. See the Intel web site listed below for the most up-to-date list
of supported processors.
For information about… Refer to:
Supported processors http://www.intel.com/design/motherbd/cz/cz_proc.htm
CAUTION
Use only the processors listed on web site above. Use of unsupported processors can damage the
board, the processor, and the power supply.
INTEGRATOR’S NOTE
#
Use only ATX12V-compliant power supplies.
For information about Refer to
Power supply connectors Section 2.8.2.1, page 59
15
Intel Desktop Board D945GCZ Technical Product Specification
1.5 System Memory
The board has four DIMM sockets and support the following memory features:
• 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMS with x16 organization are not supported.
• 4 GB maximum total system memory. Refer to Section 2.2.1 on page 45 for information on the
total amount of addressable memory.
• Minimum total system memory: 128 MB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR2 667, DDR2 533, or DDR2 400 MHz SDRAM DIMMs
NOTES
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be
populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows
the BIOS to read the SPD data and program the chipset to accurately configure memory settings
for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly
configure the memory settings, but performance and reliability may be impacted or the DIMMs
may not function under the determined frequency.
Table 4 lists the supported DIMM configurations.
Table 4. Supported Memory Configurations
DIMM
Capacity
128 MB SS 256 Mbit 16 M x 16/empty 4
256 MB SS 256 Mbit 32 M x 8/empty 8
256 MB SS 512 Mbit 32 M x 16/empty 4
512 MB DS 256 Mbit 32 M x 8/32 M x 8 16
512 MB SS 512 Mbit 64 M x 8/empty 8
512 MB SS 1 Gbit 64 M x 16/empty 4
1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16
1024 MB SS 1 Gbit 128 M x 8/empty 8
2048 MB DS 1 Gbit 128 M x 8/128 M x 8 16
Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers
to single-sided memory modules (containing one row of SDRAM).
INTEGRATOR’S NOTE
#
Configuration
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
It is possible to install four 2048 MB (2 GB) modules for a total of 8 GB of system memory,
however, only 4 GB of address space is available. Refer to Section 2.2.1, on page 45 for additional
information on available memory.
16
Product Description
1.5.1 Memory Configurations
The Intel 82945G GMCH supports two types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for real world
applications. Dual channel mode is enabled when the installed memory capacities of both
DIMM channels are equal. Technology and device width can vary from one channel to the
other but the installed memory capacity for each channel must be equal. If different speed
DIMMs are used between channels, the slowest memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth
operation for real world applications. This mode is used when only a single DIMM is installed
or the memory capacities are unequal. Technology and device width can vary from one
channel to the other. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
Figure 3 illustrates the memory channel and DIMM configuration.
NOTE
The DIMM0 sockets of both channels are blue. The DIMM1 sockets of both channels are black.
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM17941
Figure 3. Memory Channel and DIMM Configuration
17
Intel Desktop Board D945GCZ Technical Product Specification
1.5.1.1 Dual Channel (Interleaved) Mode Configurations
Figure 4 shows a dual channel configuration using two DIMMs. In this example, the DIMM0
(blue) sockets of both channels are populated with identical DIMMs.
1 GB
Channel A, DIMM 0
Channel A, DIMM 1
1 GB
Channel B, DIMM 0
Channel B, DIMM 1
OM17942
Figure 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs
Figure 5 shows a dual channel configuration using three DIMMs. In this example, the combined
capacity of the two DIMMs in Channel A equal the capacity of the single DIMM in the DIMM0
(blue) socket of Channel B.
256 MB
256 MB
512 MB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
18
OM17943
Figure 5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs
Product Description
Figure 6 shows a dual channel configuration using four DIMMs. In this example, the combined
capacity of the two DIMMs in Channel A equal the combined capacity of the two DIMMs in
Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1 of both channels.
256 MB
512 MB
256 MB
512 MB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM17944
Figure 6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs
19
Intel Desktop Board D945GCZ Technical Product Specification
1.5.1.2 Single Channel (Asymmetric) Mode Configurations
NOTE
Dual channel (Interleaved) mode configurations provide the highest memory throughput.
Figure 7 shows a single channel configuration using one DIMM. In this example, only the DIMM0
(blue) socket of Channel A is populated. Channel B is not populated.
256 MB
Figure 7. Single Channel (Asymmetric) Mode Configuration with One DIMM
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM17945
Figure 8 shows a single channel configuration using three DIMMs. In this example, the combined
capacity of the two DIMMs in Channel A does not equal the capacity of the single DIMM in the
DIMM0 (blue) socket of Channel B.
20
256 MB
512 MB
512 MB
Figure 8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM17946
Product Description
1.6 Intel
The Intel 945G chipset consists of the following devices:
• Intel 82945G Graphics Memory Controller Hub (GMCH) with Direct Media Interface (DMI)
• Intel 82801G I/O Controller Hub (ICH7) with DMI interconnect
The GMCH component provides interfaces to the CPU, memory, PCI Express, and the DMI
interconnect. The component also provides integrated graphics capabilities supporting 3D, 2D and
display capabilities. The ICH7 is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel 945G chipset http://developer.intel.com/
Resources used by the chipset Chapter 2
®
945G Chipset
interconnect
1.6.1 Intel 945G Graphics Subsystem
The Intel 945G chipset contains two separate, mutually exclusive graphics options. Either the
GMA950 graphics controller (contained within the 82945G GMCH) is used, or a PCI Express x16
add-in card can be used. When a PCI Express x16 add-in card is installed, the GMA950 graphics
controller is disabled.
1.6.1.1 Intel
®
GMA950 Graphics Controller
The Intel GMA950 graphics controller features the following:
• 400 MHz core frequency
• High performance 3-D setup and render engine
• High quality texture engine
⎯ DX9* Compliant Hardware Pixel Shader 2.0
⎯ Alpha and luminance maps
⎯ Texture color-keying/chroma-keying
⎯ Cubic environment reflection mapping
⎯ Enhanced texture blending functions
• 3D Graphics Rendering enhancements
⎯ 1.3 Dual Texture GigaPixel/Sec Fill Rate
⎯ 16 and 32 bit color
⎯ Maximum 3D supported resolution of 1600 x 1200 x 32 at 85 Hz
⎯ Vertex cache
⎯ Anti-aliased lines
⎯ OpenGL* version 1.4 support with vertex buffer and EXT_Shadow extensions
• 2D Graphics enhancements
⎯ 8, 16,and 32 bit color
⎯ Optimized 256-bit BLT engine
⎯ Color space conversion
⎯ Anti-aliased lines
21
Intel Desktop Board D945GCZ Technical Product Specification
• Video
⎯ Hardware motion compensation for MPEG2
⎯ Software DVD at 30 fps full screen
• Display
⎯ Integrated 24-bit 400 MHz RAMDAC
⎯ Up to 2048 x 1536 at 75 Hz refresh (QXGA)
⎯ DDC2B compliant interface
⎯ With Advanced Digital Display 2 or 2+ (ADD2/ADD2+) cards, support for TV-out / TV-in
and DVI digital display connections
⎯ Supports flat panels up to 2048 x 1536 at 60Hz or digital CRT/HDTV at 1920 x 1080 at 85
Hz (with ADD2/ADD2+)
⎯ Two multiplexed DVO port interfaces with 200 MHz pixel clocks using an ADD2/ADD2+
card
• Dynamic Video Memory Technology (DVMT) support up to 224 MB
®
• Intel
For information about Refer to
DVMT Section 1.6.1.2, page 22
Obtaining graphics software and utilities Section 1.3, page 15
Zoom Utility
1.6.1.2 Dynamic Video Memory Technology (DVMT)
DVMT enables enhanced graphics and memory performance through Direct AGP, and highly
efficient memory utilization. DVMT ensures the most efficient use of available system memory for
maximum 2-D/3-D graphics performance. Up to 224 MB of system memory can be allocated to
DVMT on systems that have 512 MB or more of total system memory installed. Up to 128 MB can
be allocated to DVMT on systems that have 256 MB but less than 512 MB of total installed system
memory. Up to 64 MB can be allocated to DVMT when less than 256 MB of system memory is
installed. DVMT returns system memory back to the operating system when the additional system
memory is no longer required by the graphics subsystem.
DVMT will always use a minimal fixed portion of system physical memory (as set in the BIOS
Setup program) for compatibility with legacy applications. An example of this would be when
using VGA graphics under DOS. Once loaded, the operating system and graphics drivers allocate
additional system memory to the graphics buffer as needed for performing graphics functions.
NOTE
The use of DVMT requires operating system driver support.
1.6.1.3 Advanced Digital Display (ADD2/ADD2+) Card Support
The GMCH routes two multiplexed DVO ports that are each capable of driving up to a 200 MHz
pixel clock to the PCI Express x16 connector. The DVO ports can be paired for a dual channel
configuration to support up to a 400 MHz pixel clock. When an ADD2/ADD2+ card is detected,
the Intel GMA950 graphics controller is enabled and the PCI Express x16 connector is configured
for DVO mode. DVO mode enables the DVO ports to be accessed by the ADD2/ADD2+ card. An
22
Product Description
ADD2/ADD2+ card can either be configured to support simultaneous display with the primary
VGA display or can be configured to support dual independent display as an extended desktop
configuration with different color depths and resolutions. ADD2/ADD2+ cards can be designed to
support the following configurations:
• TV-Out (composite video)
• Transition Minimized Differential Signaling (TMDS) for DVI 1.0
• Low Voltage Differential Signaling (LVDS)
• Single device operating in dual channel mode
• VGA output
• HDTV output
1.6.1.4 Configuration Modes
A list of supported modes for the Intel GMA950 graphics controller is available as a downloadable
document.
For information about Refer to
Supported video modes for the board Section 1.3, page 15
1.6.2 USB
The board supports up to eight USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and
EHCI-compatible drivers.
The ICH7 provides the USB controller for all ports. The port arrangement is as follows:
• Four ports are implemented with dual stacked back panel connectors adjacent to the audio
connectors
• Four ports are routed to two separate front panel USB connectors
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet FCC
Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the
requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 19, page 55
The location of the front panel USB connectors Figure 20, page 56
23
Intel Desktop Board D945GCZ Technical Product Specification
1.6.3 IDE Support
The board provides five IDE interface connectors:
• One parallel ATA IDE connector that supports two devices
• Four serial ATA IDE connectors that support one device per connector
1.6.3.1 Parallel ATE IDE Interface
The ICH7’s Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The
Parallel ATA IDE interface supports the following modes:
• Programmed I/O (PIO): processor controls data transfer.
• 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec.
• Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates
of up to 33 MB/sec.
• ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of
up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.
• ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH7’s ATA-100
logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec.
NOTE
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections,
noise, and inductive coupling.
The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives) and ATA
devices using the transfer modes.
The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS)
translation modes. The drive reports the transfer rate and translation mode to the BIOS.
For information about Refer to
The location of the Parallel ATA IDE connector Figure 20, page 56
1.6.3.2 Serial ATA Interfaces
The ICH7’s Serial ATA controller offers four independent Serial ATA ports with a theoretical
maximum transfer rate of 3 Gbits/sec per port. One device can be installed on each port for a
maximum of four Serial ATA devices. A point-to-point interface is used for host to device
connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices
per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the operating system.
The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard
IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for configurations
using the Windows* XP and Windows 2000 operating systems.
24
Product Description
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adaptors or power
supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the Serial ATA IDE connectors Figure 20, page 56
1.6.3.3 Serial ATA RAID (Optional)
The optional ICH7-R supports the following RAID (Redundant Array of Independent Drives)
levels:
• RAID 0 - data striping. Multiple physical drives can be teamed together to create one logical
drive. As data is written or retrieved from the logical drive, both drives operate in parallel, thus
increasing the throughput. The ICH7-R allows for more than two drives to be used in a
RAID 0 configuration.
• RAID 1 - data mirroring. Multiple physical drives maintain duplicate sets of all data on
separate disk drives. Level 1 provides the highest data reliability because two complete copies
of all information are maintained. The ICH7-R allows for two or four drives to be used in a
RAID 1 configuration.
• RAID 0+1 (or RAID 10) - data striping and mirroring. RAID 0+1 combines multiple mirrored
drives (RAID 1) with data striping (RAID 0) into a single array. This provides the highest
performance with data protection. Data is striped across all mirrored sets. RAID 0+1 utilizes
several drives to stripe data (increased performance) and then makes a copy of the striped
drives to provide redundancy. The mirrored disks eliminate the overhead and delay of parity.
• RAID 5 - distributed parity. RAID Level 5 stripes data at a block level across several drives
and distributes parity among the drives; no single disk is devoted to parity. Because parity data
is distributed on each drive, read performance tends to be lower than other RAID types.
RAID 5 requires the use of three or four drives.
1.6.4 Real-Time Clock, CMOS SRAM, and Battery
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer
is not plugged into a wall socket, the battery has an estimated life of three years. When the
computer is plugged in, the standby current from the power supply extends the life of the battery.
The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS
RAM at power-on.
25
Intel Desktop Board D945GCZ Technical Product Specification
1.7 PCI Express* Connectors
The board provides the following PCI Express connectors:
• One PCI Express x16 connector supporting simultaneous transfer speeds up to 8 GBytes/sec
• One PCI Express x1 connector. The x1 interface supports simultaneous transfer speeds up to
500 MBytes/sec
The PCI Express interface supports the PCI Conventional bus configuration mechanism so that the
underlying PCI Express architecture is compatible with PCI Conventional compliant operating
systems. Additional features of the PCI Express interface include the following:
• Support for the PCI Express enhanced configuration mechanism
• Automatic discovery, link training, and initialization
• Support for Active State Power Management (ASPM)
• SMBus 2.0 support
• Wake# signal supporting wake events from ACPI S1, S3, S4, or S5
• Software compatible with the PCI Power Management Event (PME) mechanism defined in the
PCI Power Management Specification Rev. 1.1
1.8 IEEE-1394a Connectors (Optional)
The optional IEEE-1394a interface addresses interconnection of both computer peripherals and
consumer electronics. The IEEE-1394a interface provides a throughput ranging from
100 Mbits/sec to 400 Mbits/sec. As a manufacturing option, the board includes three IEEE-1394a
connectors as follows:
• One IEEE-1394a connector located on the back panel.
• Two IEEE-1394a front-panel connectors located on the component side.
For information about Refer to
The location of the back panel IEEE-1394a connector Figure 18, page 54
The location of the front panel IEEE-1394a connectors Figure 20, page 56
The signal names of the front panel IEEE-1394a connectors Section 2.8.2.6, page 63
26
Product Description
1.9 Legacy I/O Controller
The legacy I/O controller provides the following features:
• One serial port
• One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support
• Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems
• PS/2-style mouse and keyboard interfaces
• Interface for one 1.44 MB or 2.88 MB diskette drive
• Intelligent power management, including a programmable wake-up event interface
• PCI Conventional bus power management support
The BIOS Setup program provides configuration options for the legacy I/O controller.
1.9.1 Serial Port
The Serial port A connector is located on the back panel. The serial port supports data transfers at
speeds up to 115.2 kbits/sec with BIOS support.
For information about Refer to
The location of the serial port A connector Figure 19, page 55
1.9.2 Parallel Port
The 25-pin D-Sub parallel port connector is located on the back panel. Use the BIOS Setup
program to set the parallel port mode.
For information about Refer to
The location of the parallel port connector Figure 19, page 55
1.9.3 Diskette Drive Controller
The legacy I/O controller supports one diskette drive. Use the BIOS Setup program to configure
the diskette drive interface.
For information about Refer to
The location of the diskette drive connector Figure 20, page 56
1.9.4 Keyboard and Mouse Interface
PS/2 keyboard and mouse connectors are located on the back panel.
NOTE
The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2
connector. Power to the computer should be turned off before a keyboard or mouse is connected or
disconnected.
For information about Refer to
The location of the keyboard and mouse connectors Figure 19, page 55
27
Intel Desktop Board D945GCZ Technical Product Specification
1.10 Audio Subsystem
The board supports the Intel High Definition audio subsystem based on the Sigmatel 9223 or the
Sigmatel 9220 audio codec. The audio subsystem supports the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize
the device that is connected to an audio port. The back panel audio jacks are capable of
retasking according to user’s definition, or can be automatically switched depending on the
recognized device type.
• Stereo input and output for all back panel jacks
• Line out and Mic in functions for front panel audio jacks
• A signal-to-noise (S/N) ratio of 95 dB
1.10.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.3, page 15
1.10.2 Audio Connectors
The board contains audio connectors on both the back panel and the component side of the board.
The front panel audio connector (located on the component side) provides mic in and line out
signals for front panel audio connectors.
The functions of the back panel audio connectors are dependent on which subsystem is present.
The 8-channel (7.1) audio subsystem is described in Section 1.10.3; the 6-channel (5.1) audio
subsystem is described in Section 1.10.4.
For information about Refer to
The location of the front panel audio connector Figure 20, page 56
The signal names of the front panel audio connector Table 19, page 58
The back panel audio connectors Section 2.8.1, page 53
1.10.3 8-Channel (7.1) Audio Subsystem
The 8-channel (7.1) audio subsystem includes the following:
• Intel 82801G I/O Controller Hub (ICH7)
• Sigmatel 9223 audio codec
• Microphone input that supports a single dynamic, condenser, or electret microphone
The back panel audio connectors are configurable through the audio device drivers. The available
configurable audio ports are shown in Figure 9.
28
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