®
3 PCM1716
PIN NAME I/O DESCRIPTION
1 LRCIN IN Left and Right Clock Input. This clock is equal to
the sampling rate - fS.
(1)
2 DIN IN Serial Audio Data Input
(1)
3 BCKIN IN Bit Clock Input for Serial Audio Data.
(1)
4 CLKO OUT Buffered Output of Oscillator. Equivalent to
System Clock.
5 XTI IN Oscillator Input (External Clock Input)
6 XTO OUT Oscillator Output
7 DGND — Digital Ground
8V
DD
— Digital Power +5V
9V
CC
2R — Analog Power +5V
10 AGND2R — Analog Ground
11 EXTR OUT Rch, Common Pin of Analog Output Amp
12 NC — No Connection
13 V
OUT
R OUT Rch, Analog Voltage Output of Audio Signal
14 AGND1 — Analog Ground
15 V
CC
1 — Analog Power +5V
16 V
OUT
L OUT Lch, Analog Voltage Output of Audio Signal
17 NC — No Connection
18 EXTL OUT Lch, Common Pin of Analog Output Amp
19 AGND2L — Analog Ground
20 V
CC
2L — Analog Power +5V
21 ZERO OUT Zero Data Flag
22 RST IN Reset. When this pin is low, the DF and
modulators are held in reset.
(2)
23 CS/IWO IN Chip Select/Input Format Selection. When this
pin is low, the Mode Control is effective.
(3)
24 MODE IN
Mode Control Select. (H: Software, L: Hardware)
(2)
25 MUTE IN Mute Control
26 MD/DM0 IN Mode Control, DATA/De-emphasis Selection 1
(2)
27 MC/DM1 IN Mode Control, BCK/De-emphasis Selection 2
(2)
28 ML/I2S IN Mode Control, WDCK/Input Format Selection
(2)
NOTES: (1) Pins 1, 2, 3; Schmitt Trigger input. (2) Pins 22, 24, 25, 26, 27,
28; Schmitt Trigger input with pull-up resister. (3) Pin 23; Schmitt Trigger
input with pull-down resister.
PIN ASSIGNMENTSPIN CONFIGURATION
LRCIN
DIN
BCKIN
CLKO
XTI
XTO
DGND
V
DD
VCC2R
AGND2R
EXTR
NC
V
OUT
R
AGND1
ML/IIS
MC/DM1
MD/DM0
MUTE
MODE
CS/IWO
RST
ZERO
V
CC
2L
AGND2L
EXTL
NC
V
OUT
L
V
CC
1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
PCM1716E
PACKAGE DRAWING
PRODUCT PACKAGE NUMBER
(1)
PCM1716E 28-Pin SSOP 324
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
PACKAGE INFORMATION
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
Power Supply Voltage ...................................................................... +6.5V
+V
CC
to +VDD Difference ................................................................... ±0.1V
Input Logic Voltage .................................................. –0.3V to (V
DD
+ 0.3V)
Input Current (except power supply)............................................... ±10mA
Power Dissipation .......................................................................... 400mW
Operating Temperature Range ......................................... –25°C to +85°C
Storage Temperature...................................................... –55°C to +125°C
Lead Temperature (soldering, 5s)................................................. +260°C
ABSOLUTE MAXIMUM RATINGS
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.