Biostar H61MGC, H61MLC Owner's Manual
H61MGC / H61MLC Setup Manual
FCC Information and Copyright
This equipment has been tested and found to comply with the limits of a Class
B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may
cause harmful interference to radio communications. There is no guarantee
that interference will not occur in a particular installation.
The vendor makes no representations or warranties with respect to the
contents here and specially disclaims any implied warranties of merchantability
or fitness for any purpose. Further the vendor reserves the right to revise this
publication and to make changes to the contents here without obligation to
notify any party beforehand.
Duplication of this publication, in part or in whole, is not allowed without first
obtaining the vendor’s approval in writing.
The content of this user’s manual is subject to be changed without notice and
we will not be responsible for any mistakes found in this user’s manual. All the
brand and product names are trademarks of their respective companies.
Dichiar azione di co nform ità
sintetica
Ai sensi dell’art. 2 comma 3 del D.M.
275 del 30/10/2002
Si dichiara che questo prodotto è
conforme alle normative vigenti e
soddisfa i requisiti essenziali richiesti
dalle direttive
2004/108/CE, 2006/95/CE e
1999/05/CE
quando ad esso applicabili
Short De clar ation of c onfor mity
We declare this product is complying
with the laws in force and meeting all
the essential requirements as specified
by the directives
2004/108/CE, 2006/95/CE and
1999/05/CE
whenever these laws may be applied
Table of Contents
Chapter 1: Introduction ........................................ 1
1.1 Before You Start ................................................................................ 1
1.2 Package Checklist............................................................................. 1
1.3 Motherboard Features...................................................................... 2
1.4 Re ar Panel Connectors ..................................................................... 3
1.5 Motherboard Layout......................................................................... 3
Chapter 2: Hardware Installation .......................... 5
2.1 Installing Central Processing Unit (CPU) ....................................... 5
2.2 FAN Headers...................................................................................... 7
2.3 Installing System Memory ................................................................ 8
2.4 Connectors and Slots....................................................................... 10
Chapter 3: Headers & Jumpers Setup .................. 13
3.1 How to Setup Jumpers .................................................................... 13
3.2 Detail Settings.................................................................................. 13
Chapter 4: Useful Help ........................................ 17
4.1 Driver Installation Note.................................................................. 17
4.2 Software............................................................................................ 18
4.3 Extra Information............................................................................ 22
4.4 AMI BIOS Beep Code....................................................................... 23
4.5 Troubleshooting............................................................................... 24
Appendix: SPEC In Other Languages ................... 26
German.................................................................................................................. 26
French .................................................................................................................... 28
Italian ..................................................................................................................... 30
Spanish ................................................................................................................... 32
Portuguese ............................................................................................................ 34
Polish...................................................................................................................... 36
Russian ................................................................................................................... 38
Arabic..................................................................................................................... 40
Japane se ................................................................................................................ 42
CHAPTER 1: INTRODUCTION
H61MGC / H61MLC
1.1 B
EFORE YOU START
Thank you for choosing our product. Before you start installing the
motherboard, please make sure you follow the instructions below:
Prepare a dry and stable working environment with
sufficient lighting.
Always disconnect the computer from power outlet
before operation.
Before you take the motherboard out from anti-static
bag, ground yourself properly by touching any safely
grounded appliance, or use grounded wrist strap to
remove the static charge.
Avoid touching the components on motherboard or the
rear side of the board unless necessary. Hold the board
on the edge, do not try to bend or flex the board.
Do not leave any unfastened small parts inside the
case after installation. Loose parts will cause short
circuits which may damage the equipment.
Keep the computer from dangerous area, such as heat
source, humid air and water.
The operating temperatures of the computer should be
0 to 45 degrees Celsius.
1.2 PACKAGE CHECKLIST
Serial ATA Cable X 2
Rear I/O Panel for ATX Case X 1
User’s Manual X 1
Fully Setup Driver DVD X 1
USB 2.0 Cable X1 (optional)
Serial ATA Power Cable X 1 (optional)
Note : The package contents may be different due to area or your motherboard version.
1
Motherboard Manual
1.3 MOTHERBOARD FEATURES
H61 MGC H61 MLC
CPU
Chipset
Super I/O
Main Memory
SATA 2
LAN
Sound Codec
Slots
Socket 1155
Intel Core i7/i5/i3/Pentium/Celeron processor
Supports Execute Disable Bit / Enh anc ed Intel
SpeedStep® / Intel Ar chitecture-64 / Ext ended
Memory 64 Technology / Virtualization
Technology
Intel H61 Intel H61
ITE 8728
Prov ides the most common ly used leg acy Sup er
I/O functionality.
Low Pin Count Interface
En vironm ent C ontro l in itiat ives ,
Hardware Monitor Controller
Fan Sp eed Controller
ITE's "S mart Guard ian " funct ion
DIMM Slots x 2, Each DIMM supports 512MB /
1GB / 2GB / 4GB / 8GB DDR3
Max Memory Capacity 16GB
Dual Cha nn el Mode DDR3 me mory mod u le
Supports DDR3 1066/1333/1600 (depending
on CPU)
Register ed D IMM and ECC D IMM is not
supported
Integrated Serial ATA Controller
Data transfer rates up to 3.0 Gb/s.
SATA Vers ion 2.0 sp ecification co mplian t
Realtek RTL8111E / RTL8111F
Atheros AR8151
10 / 100 Mb/s / 1Gb/s auto negotiation
VT1708B / ALC662
5.1 channels audio out
High Definition Audio
PCI-E Gen3x16 slot (depend ing on C PU) x 1 PC I-E Gen3x16 slot (d epending on CPU ) x1
PCI Express Gen2 x1 Slot x2 PCI Express Gen2 x1 Slot x2
Socket 1155
Intel Core i7/i5/i3/Pentium/Celeron processor
Supports Execute Disable Bit / Enh anc ed Intel
SpeedStep® / Intel Ar chitecture-64 / Ext ended
Memory 64 Technology / Virtualization
Technology
ITE 8728
Prov ides the most common ly used leg acy Sup er
I/O functionality.
Low Pin Count Interface
En vironm ent C ontro l in itiat ives ,
Hardware Monitor Controller
Fan Sp eed Controller
ITE's "S mart Guard ian " funct ion
DIMM Slots x 2, Each DIMM supports 512MB /
1GB / 2GB / 4GB / 8GB DDR3
Max Memory Capacity 16GB
Dual Cha nn el Mode DDR3 me mory mod u le
Supports DDR3 1066/1333/1600 (depending
on CPU)
Register ed D IMM and ECC D IMM is not
supported
Integrated Serial ATA Controller
Data transfer rates up to 3.0 Gb/s.
SATA Vers ion 2.0 sp ecification co mplian t
Realtek RTL8105E
Atheros AR8152
10 / 100 Mb/s auto negot iation
VT1708B / ALC662
5.1 channels audio out
High Definition Audio
2
H61 MGC H61 MLC
Printer Po rt Connector x1 Printer Port Connect or x1
Serial Port Connector x1 Serial Port Connector x1
SATA Connector x4 SATA Connector x4
Front Panel Connector x1 Front Panel Connector x1
On Board
Connectors
Back Panel
I/O
Board Size
OS Support
Front Audio Connector x1 Front Audio Connector x1
CPU Fan Header x1 CPU Fan Header x1
System Fan Header x1 System Fan Header x1
Clear CMOS Header x1 Clear CMOS Head er x1
USB 2.0 Connector x2 USB 2.0 Connector x2
Power Connector (24pin) x1 Power Connector (24pin) x1
Power Connector (4pin) x1 Power Connector (4pin) x1
PS/2 Keyboard x1
PS/2 Mouse x1
VGA Port x1
DVI-D Port x1
LAN Port x1
USB2.0 Port x4
Audio Jack x3
175 (W) x 226 (L) mm 175 (W) x 226 (L) mm
Windows XP / Vista / 7
Biostar reserves the right to add or remove
support for any OS with or without notice
PS/2 Keyboard x1
PS/2 Mouse x1
VGA Port x1
LAN Port x1
USB2.0 Port x4
Audio Jack x3
Windows XP / Vista / 7
Biostar reserves the right to add or remove
support for any OS with or without notice
1.4 REAR PANEL CONNECTORS
H61MGC / H61MLC
P S/2
Mouse
PS /2
Keyboard
(For H6 1MGC)
VGADVI-D
USB2.0X2
NOTE: DVI-D / VGA Output require an Intel Core family processor with Intel Graphics Technology.
LA N
USB2.0X2
Line I n/
Surround
Line Out
Mic I n 1/
Bass/ Center
NOTE: Maximum resolution:
DVI: 1920 x 1200 @60Hz
VGA: 2048 x 1536 @75Hz
1.5 M
OTHERBOARD LAYOUT
3
Motherboard Manual
KBMS1
DVI 1
VGA1
USB1
RJ45USB1
AUDIO1
(H61MGC)
F_AUDIO1
ATXPWR 2
BAT1
Socket 1155
CPU 1
PEX16_1
CPU_FAN1
DDR3 _A1
DDR3 _B1
ATXPWR 1
CODEC
Super
PEX1_1
PEX1_2
I/O
J_ PRINT1
Note: ■ represents the 1st pin.
4
LAN
J_COM1
H61
F_USB1
F_USB2 PAN EL1
SATA1
JCMOS 1
SATA 3 SATA4
SATA 2
SYS_FAN1
BIOS
H61MGC / H61MLC
CHAPTER 2: HARDWARE INSTALLATION
2.1 I
NSTALLING CENTRAL PROCESSING UNIT (CPU)
Notice:
1. Remove Pin Cap before installation, and make good preservation for future use.
When the CPU is removed, cover the Pin Cap on the empty socket to ensure pin
legs won’t be damaged.
2. The motherboard might equip with two different types of pin cap. Please refer
below instruction to remove the pin cap.
Step 1: Pull the socket locking lever out from the socket then raise the
lever and load plate to the fully open position.
Step 2: Remove the Pin Cap.
5
Motherboard Manual
Step 3: Hold processor with your thumb and index fingers, oriented as
shown. Align the notches with the socket. Lower the processor
straight down without tilting or sliding the processor in the socket.
Step 4: Close the load plate. Pressing down on the load plate, close and
engage the socket lever.
Step 5: Put the CPU Fan and heatsink assembly on the CPU and buckle it
on the retention frame. Connect the CPU FAN power cable into
the CPU_FAN1 to complete the installation.
6
H61MGC / H61MLC
2.2 FAN HEADERS
These fan headers support cooling-fans built in the computer. The fan
cable and connector may be different according to the fan manufacturer.
Connect the fan cable to the connector while matching the black wire to
pin#1.
CPU_FAN1: CPU Fan Header
Pin
Assignment
1 Ground
41
2 +12V
3
FAN RPM r ate
sense
4 Smart Fan
Control
SYS_FAN1: System Fan Header
Pin
Assignment
1 Ground
2 +12V
3 FAN RPM rate
sense
3
1
Note:
The SYS_FAN1 support 3-pin head connectors; the CPU_FAN1 supports 4-pin head
connector. When connecting with wires onto connectors, please note that the red wire is
the positive and should be connected to pin#2, and the black wire is Ground and should
be connected to GND.
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Motherboard Manual
2.3 INSTALLING SYSTEM MEMORY
A. Memory Modules
DDR3_A1
DDR3_B1
1. Unlock a DIMM slot by pressing the retaining clips outward. Align a
DIMM on the slot such that the notch on the DIMM matches the
break on the Slot.
8
H61MGC / H61MLC
2. Insert the DIMM vertically and firmly into the slot until the retaining
chip snap back in place and the DIMM is properly seated.
Note:
If the DIMM does not go in smoothly, do not force it. Pull it all the way out
and try again.
B. Memory Capacity
DIMM Socket
Location
DDR3_A1 512MB/1GB/2GB/4GB/8GB
DDR3_B1 512MB/1GB/2GB/4GB/8GB
DDR3 Module
C. Dual Channel Memory Installation
Please refer to the following requirements to activate Dual Channel function:
Install memory module of the same density in pairs, shown in the table.
Dual Channel Status
Disabled O X
Disabled X O
Enabled O O
(O means memory installed; X, not installed.)
The DRAM bus width of the memory module must be the same(x8 or
x16)
DDR3_A1
Total Mem o ry
Size
Max is 16GB.
DDR3_B1
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Motherboard Manual
2.4 CONNECTORS AND SLOTS
SATA1~SATA4: Serial ATA Connectors
The motherboard has a PCI to SATA Controller with 4 channels SATA2 interface,
it satisfies the SATA 2.0 spec and with transfer rate of 3.0Gb/s.
ATXP W R2: ATX Power Source Connector
This connector provides +12V to CPU power circuit.
SATA1
SATA2
SATA3 SATA4
7
14
34
12
Pin
1 +12V
2 +12V
3 Ground
4 Ground
Pin
Assignment
1 Ground
2 TX+
3 TX4 Ground
5 RX6 RX+
7 Ground
Assignment
10
ATXP W R1: ATX Power Source Connector
This connector allows user to connect 24-pin power connector on the ATX
power supply.
H61MGC / H61MLC
12
1
Pin Assignment Pin Assignment
13 +3.3V 1 +3.3V
14 -12V 2 +3.3V
15 Ground 3 Ground
16 PS_ON 4 +5V
17 Ground 5 Ground
18 Ground 6 +5V
19 Ground 7 Ground
20 NC 8 PW_OK
21 +5V 9 Standby Voltage+5V
22 +5V 10 +12V
23 +5V 11 +12V
24 Ground 12 +3.3V
24
13
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Motherboard Manual
PEX16_1: PCI-Express Gen3 x16 Slot
- PCI-Express 3.0 compliant.
- Maximum theoretical realized bandwidth of 16GB/s simultaneously per
direction, for an aggregate of 32GB/s totally.
- PCI-E 3.0 is supported by Core i7-3xxx / i5-3xxx CPU.
PEX1_1: PCI-Express Gen2 x1 Slot
- PCI-Express 2.0 compliant.
- Data transfer bandwidth up to 500MB/s per direction; 1GB/s in total.
- PCI-Express supports a raw bit-rate of 2.5Gb/s on the data pins.
PEX16_1
PEX1_1
12
PEX1_2
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