PREVENTION OF ELECTRO STATIC DISCHARGE(ESD)TO ELECTROSTATICALLY
SENSITIVE(ES)DEVICES
CONTROL BUTTON LOCATIONS AND EXPLANATIONS
PREVERTION OF STATIC ELECTRICITY DISCHARGE
ASSEMBLING AND DISASSEMBLING THE MECHANISM UNIT
OPTICAL PICKUP UNIT EXPLOSED VIEW AND PART LIST
BRACKET EXPLOSED VIEW AND PART LIST
MISCELLANEOUS
ELECTRICAL CONFIRMATION
VI DEO OUTPUT (LUMINANCE SIGNAL) CONFIRMATION
VI DEO OUTPUT(CHROMINANCE SIGNAL) CONFIRMATION
1
1
2
3
4
4
6
7
8
8
9
MPEG BOARD CHECK WAVEFORM
FLI2300 DIGITAL VIDEO CONVERTER DATE SHEET
AM29LV160D
HY57V641620HG
SiI 164 PANELLINK TRANSMITTER
MT1389
SCHEMATIC & PCB WIRING DIAGRAM
SPARE PARTS LIST
10
11
19
24
27
41
44
60
Page 3
1.1 GENERAL GUIDELINES
1. SAFETY PREAUTIONS
2.PREVENTION OF ELECTRO STATIC DISCHARGE(ESD)TO
ELECTROSTATICALLY SENSITIVE(ES)DEVICES
1
1. When servicing, observe the original lead dress. if a short circuit is found, replace all parts which have
been overheated or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barrier, insulation papers
shields are properly installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed
to shock hazards.
Some semiconductor(solid state)devices can be damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive(ES)Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and semiconductor chip components. The following techniques
should be used to help reduce the incidence of component damage caused by electro static discharge(ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain
off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially
availabel discharging ESD wrist strap, which should be removed for potential shock reasons prior to
applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices,place the assembly on a conductive
surface such as alminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static
(ESD protected)can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are
ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by
conductive foam, alminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch
the protective material to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can
generate static electricity(ESD).
notice (1885x323x2 tiff)
Page 4
Front Panel Illustration
2
POWER switch
Disc tray
2
2
4
IR SENSOR
5
Display window
3
4
5
7
STOP button
6
7
3
OPEN/CLOSE button
6
PLAY/PAUSE button
Page 5
The laser diode in the traverse unit (optical pickup)may brake down due to static electricity of clothes or human
body. Use due caution to electrostatic breakdown when servicing and handling the laser diode.
Some devices such as the DVD player use the optical pickup(laser diode)and the optical pickup will be damaged
by static electricity in the working environment.Proceed servicing works under the working environment where
1. Put a conductive material(sheet)or iron sheet on the area where the optical pickup is placed,and ground the
3. The flexible cable may be cut off if an excessive force is applied to it.Use caution when handling the cable.
3
4.PREVENTION OF STATIC ELECTRICITY DISCHARGE
4.1.Grounding for electrostatic breakdown prevention
grounding works is completed.
4.1.1. Worktable grounding
sheet.
4.1.2.Human body grounding
1 Use the anti-static wrist strap to discharge the static electricity from your body.
safety_3 (1577x409x2 tiff)
4.1.3.Handling of optical pickup
1. To keep the good quality of the optical pickup maintenance parts during transportation and before
installation, the both ends of the laser diode are short-circuited.After replacing the parts with new ones,
remove the short circuit according to the correct procedure. (See this Technical Guide).
2. Do not use a tester to check the laser diode for the optical pickup .Failure to do so willdamage the laser
diode due to the power supply in the tester.
4.2. Handling precautions for Traverse Unit (Optical Pickup)
1. Do not give a considerable shock to the traverse unit(optical pickup)as it has an extremely high-precise
structure.
2. When replacing the optical pickup, install the flexible cable and cut is short land with a nipper. See the
optical pickup replacement procedure in this Technical Guide. Before replacing the traverse unit, remove
the short pin for preventingstatic electricity and install a new unit.Connect the connector as short times as
possible.
4. The half-fixed resistor for laser power adjustment cannot be adjusted. Do not turn the resistor.
Page 6
5.1Optical pickup Unit Explosed View and Part List
5. Assembling and disassembling the mechanism unit
4
Pic (1)
Page 7
Materials to Pic (1)
5
No. PARTS CODE PARTS NAME Qty
14692200 SF-HD60 1
1
1EA0311A06300 ASSY, CHASSIS, COMPLETE 1
2
Or
3
4
5
6
7
8
9
10
11
21
Or
31
32
1EA0M10A15500 ASSY, MOTOR, SLED 1
1EA0M10A15501 ASSY, MOTOR, SLED 1
1EA2451A24700 HOLDER, SHAFT 3
1EA2511A29100 GEAR, RACK 1
1EA2511A29200 GEAR, DRIVE 1
1EA2511A29300 GEAR, MIDDLE, A 1
1EA2511A29400 GEAR, MIDDLE, B 1
1EA2744A03000 SHAFT, SLIDE 1
1EA2744A03100 SHAFT, SLIDE, SUB 1
1EA2812A15300 SPRING, COMP, TYOUSEI 3
1EA2812A15400 SPRING, COMP, RACK 1
1EA0B10B20100 ASSY, PWB 1
1EA0B10B20200 ASSY, PWB 1
SEXEA25700--- SPECIAL SCREW BIN+-M2X11 3
SEXEA25900--- SPECIAL SCREW M1.7X2.2 2
33
34
35
Note : This parts list is not for service parts supply.
SFBPN204R0SE- SCR S-TPG PAN 2X4 2
SFSFN266R0SE- SCR S-TPG FLT 2.6X6 1
SWXEA15400--- SPECIAL WASHER 1.8X4 X0.25 2
Page 8
5.2 BracketExplosed View and Part List
6
Pic (2)
Materials to Pic(2)
1.bracket 14. front silicon rubber
2.belt 15. Back silicon rubber
3.screw 16. Pick-up
4.belt wheel 17. Pick-up
5.gearwheel 18. switch
6.iron chip 19. Five-pin flat plug
7. Immobility mechanism equipment 20. screw
8. Magnet 21. PCB
9. Platen 22. motor
10. Bridge bracket 23. Motor wheel
11. screw 24. screw
12. screw 25.tray
13. Big bracket
Before going process with disassembly and installation, please carefully both
peruse the chart and confirm the materials.
Page 9
5.3 MISCELLANEOUS
7
5.3.1 Protection of the LD(Laser diode)
Short the parts of LD circuit pattern by soldering.
5.3.2 Cautions on assembly and adjustment
Make sure that the workbenches,jigs,tips,tips of soldering irons and measuring instruments are
grounded,and that personnel wear wrist straps for ground.
Open the LD short lands quickly with a soldering iron after a circuit is connected.
Keep the power source of the pick-up protected from internal and external sources of electrical
noise.
Refrain from operation and storage in atmospheres containing corrosive gases (such as H2S,SO2,
NO2 and Cl2)or toxic gases or in locations containing substances(especially from the organic silicon,cyan,
formalin and phenol groups)which emit toxic gases.It is particularly important to ensure that none of the
above substances are present inside the unit.Otherwise,the motor may no longer run.
Page 10
6.1. Video Output (Luminance Signal) Confirmation
6.Electrical Confirmation
8
DO this confirmation after replacing a P.C.B.
Measurement point
Video output terminal
Measuring equipment,tools
200mV/dir,10sec/dir
Purpose:To maintain video signal output compatibility.
1.Connect the oscilloscope to the video output terminal and terminate at 75 ohms.
2.Confirm that luminance signal(Y+S)level is 1000mVp-p±30mV
PLAY(Title 46):DVDT-S15
PLAY(Title 12):DVDT-S01
ModeDisc
Color bar 75%
Confirmation value
1000mVp-p±30mV
DVDT-S15
or
DVDT-S01
Page 11
Do the confirmation after replacing P.C.B.
Screwdriver,Oscilloscope
6.2 Video Output(Chrominance Signal) Confirmation
9
Measurement point
Video output terminal
Measuring equipment,toolsConfirmation value
200mV/dir,10sec/dir
Purpose:To maintain video signal output compatibility.
1.Connect the oscilloscope to the video output terminal and terminate at 75 ohme.
2.Confirm that the chrominance signal(C)level is 621 mVp-p±30mV
PLAY(Title 46):DVDT-S15
PLAY(Title 12):DVDT-S01
ModeDisc
Color bar 75%
621mVp-p±30mV
DVDT-S15
or
DVDT-S01
Page 12
7.MPEG BOARD CHECK WAVEFORM
7.1 27MHz WAVEFORM
7.2 IC5L0380R PIN.2 WAVEFORM DIAGRAM
10
Page 13
FLI2300 Digital Video Converter Data Sheet
11
1 DESCRIPTION
The FLI2300 is a highly integrated digital video
format converter for CRT-TV applications using
patented deinterlacing and post processing algorithms
from Faroudja Laboratories, coupled with highly
flexible scaling, a wide variety of aspect ratio
conversions, and other special video enhancing
features to produce the highest quality image.
1.1 Inputs
• Input all industry standard and non-standard
video resolutions, including 480i (NTSC), 576i
(PAL/SECAM), 480p, 720p, 1080i, and VGA to
XGA
• Digital input, 8-bit Y/Cr/Cb (ITU-R BT656), 8-
bit Y/Pr/Pb, 16-bit Y Cr/Cb (ITU-R BT601), 24bit RGB, YCrCb, YPrPb
• Input pixel rate up to 75MHz maximum
1.2 Outputs
• Output resolutions include 480p, 576p, 720p,
1080i, 1080p, and VGA to SXGA
• Interlaced or Progressive output
• The output can be either analog YUV/RGB
through the integrated 10-bit Digital-To-Analog
Converter (DAC), or digital 24-bit RGB, YCrCb,
YPrPb (4:4:4), or digital 16/20-bit Y Cr/Cb
(4:2:2) Output pixel rate up to 150 MHz
maximum
color artifacts in composite video signals due to
poor Y/C separation in standard 2-D video
decoders, eliminating the need for expensive 3-D
video decoders.
1.6 Deinterlacing
• Per-pixel Motion Adaptive Deinterlacing
• Patented FilmMode Processing - Used for proper
de-interlacing of 3:2 and 2:2 pulldown material.
• Edit Correction - Film content is continuously
monitored for any break in sequence caused by
“bad edits” and quickly compensates for the
most effective reduction in artifacts.
• DCDi™ by Faroudja - Video is analyzed on a
single pixel granularity to detect presence or
absence of angled lines and edges, which are
then processed to produce a smooth and natural
looking image without visible artifacts or
“jaggies”.
1.7 Scaling
• High Quality Fully Programmable Two
Dimensional Scaler
• Aspect Ratio Conversion for “Anamorphic” or
“Panoramic” (non-linear)
• Display 4:3 images on 16:9 displays and vice
versa, including Letterbox to Fullscreen,
Pillarbox, and Subtitle Display Modes
• Pixel and line dropper to generate PIP windows
1.8 TrueLife™ Enhancer
• Two dimensional, non-linear, luma and chroma
video enhancer brings out details in the picture,
producing a more life-like image.
1.9 Memory
• 32-bit wide SDRAM (i.e. one 2M x 32-bit)
controller, up to 166 MHz operation, for external
SDRAM
Horizontal sync or reference -CTL1 of Port 1
Vertical sync or reference -CTL1 of Port 1
Odd/Even Field identification -CTL1 of Port 1
Data Clock input -CTL1 of Port 1
Horizontal sync or reference –CTL2 of Port 1
Vertical sync or reference –CTL2 of Port 1
Odd/Even Field identification –CTL2 of Port 1
Data Clock input –CTL2 of Port 1
Port 1 – Digital video input (Blue/Cb/D1)
Port 1 – Digital video input (Blue/Cb/D1)
Port 1 – Digital video input (Blue/Cb/D1)
Port 1 – Digital video input (Blue/Cb/D1)
Port 1 – Digital video input (Blue/Cb/D1)
Port 1 – Digital video input (Blue/Cb/D1)
Port 1 – Digital video input (Blue/Cb/D1)
Port 1 – Digital video input (Blue/Cb/D1)
Port 1 – Digital video input (Red/Cr/CrCb)
Port 1 – Digital video input (Red/Cr/CrCb)
Port 1 – Digital video input (Red/Cr/CrCb)
Port 1 – Digital video input (Red/Cr/CrCb)
Port 1 – Digital video input (Red/Cr/CrCb)
Port 1 – Digital video input (Red/Cr/CrCb)
Port 1 – Digital video input (Red/Cr/CrCb)
Port 1 – Digital video input (Red/Cr/CrCb)
Port 1 – Digital video input (Green/Y)
Port 1 – Digital video input (Green/Y)
Port 1 – Digital video input (Green/Y)
Port 1 – Digital video input (Green/Y)
Port 1 – Digital video input (Green/Y)
Port 1 – Digital video input (Green/Y)
Port 1 – Digital video input (Green/Y)
Port 1 – Digital video input (Green/Y)
Output to select external video mux
Connect to Ground
5v 8 mA 2-wire serial control bus clock
5v 8 mA 2-wire serial control bus data
5v PU Reset
3.3 V – Power pin for IO
Ground
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
3.3 V – Power pin for IO
Ground
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
1.8 V - Power pin for core
Ground
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
1.8 V – Power pin for core
Ground
5v 4 mA PD SDRAM data bus *
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
5v 4 mA PD
3.3 V – Power pin for IO
Drive
Internal
Pull up/
Pulldown
Device address setting 0
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
SDRAM data bus *
5v 8 mA SDRAM address bus *
5v 8 mA SDRAM address bus *
5v 8 mA SDRAM address bus *
5v 8 mA SDRAM address bus *
5v 8 mA SDRAM address bus *
1.8 V – Power pin for core
Ground
5v 8 mA SDRAM address bus *
5v 8 mA SDRAM address bus *
5v 8 mA SDRAM address bus *
5v 8 mA SDRAM address bus *
5v 8 mA SDRAM address bus *
5v 8 mA SDRAM address bus *
5v 8 mA SDRAM write enable *
5v 8 mA SDRAM row address select *
5v 8 mA SDRAM column address select *
5v 8 mA SDRAM bank select 1*
5v 8 mA SDRAM bank select 0*
5v 4 mA SDRAM CS *
5v 8 mA SDRAM DQM *
5v 12 mA Clock out to SDRAM *
3.3 V - Power pin for IO
Ground
5v Trace delayed SDRAM Clock in
Test input – Connect to ground
12 mA Test output – leave open
8 mA Test output – leave open
5v 8 mA
5v 8 mA
5v 8 mA
5v 8 mA
5v 8 mA
1.8 V - Power pin for core
Ground
5v 12 mA Output data rate clock
5v 8 mA
5v 8 mA
3.3 V – Power pin for IO
Ground
Drive
Internal
Pull up/
Pulldown
Description
Control signal output selectable as HSync1/
CSync/HRef/Monitor coast
Control signal output selectable as
VSync1/CRef/VRef/Film Indicator
Control signal output selectable as Monitor
coast/HRef/VDD_en / HSync2
Control signal output selectable as Film
Indicator/VRef/backlight_en/VSync2
Control signal output selectable as CRef/Field
ID/CSync/Monitor coast
Digital video output – Blue/U/Pb
Digital video output – Blue/U/Pb
5v 8 mA Digital video output – Blue/U/Pb
5v 8 mA
5v 8 mA
5v 8 mA
5v 8 mA
5v 8 mA
5v 8 mA Digital video output – Red/V/Pr
5v 8 mA Digital video output – Red/V/Pr
1.8 V – Power pin for core
Ground
5v 8 mA
5v 8 mA
5v 8 mA
5v 8 mA
5v 8 mA
5v 8 mA
3.3 V – Power pin for IO
Ground
5v 8 mA Digital video output – Green/Y
5v 8 mA
5v 8 mA
5v 8 mA
5v 8 mA
5v 8 mA
5v 8 mA
5v 8 mA
5v Output data enable for Digital video output
1.8 V – Power pin for PLL pads
Ground for PLL pads
PLL Ground
1.8 V – Power pin for PLL
1.8 V – Power pin for PLL
PLL Ground
PLL Ground
1.8 V – Power pin for PLL
1.8 V – Power pin for PLL
PLL Ground
Ground for DAC pads
1.8 V – Digital power pin for DAC
DAC digital Ground
34 mA Analog B/U output
3.3 V – Analog power pin for B channel
Analog Ground for B channel
34 mA Analog G/Y output
3.3 V – Analog power pin for G channel
Drive
Internal
Pull up/
Pulldown
Description
Digital video output – Blue/U/Pb
Digital video output – Blue/U/Pb
Digital video output – Blue/U/Pb
Digital video output – Blue/U/Pb
Digital video output – Blue/U/Pb
Digital video output – Red/V/Pr
Digital video output – Red/V/Pr
Digital video output – Red/V/Pr
Digital video output – Red/V/Pr
Digital video output – Red/V/Pr
Digital video output – Red/V/Pr
Digital video output – Green/Y
Digital video output – Green/Y
Digital video output – Green/Y
Digital video output – Green/Y
Digital video output – Green/Y
Digital video output – Green/Y
Digital video output – Green/Y
182 DAC_VREFIN
183 DAC_AVDD
184 DAC_AVSS
185 DAC_GR_AVSS
186 DAC_GR_AVDD
187 DAC_PVDD
188 TEST0
189 TEST1
190 TEST2
191 XTAL IN
192 XTAL OUT
193 VDD9
194 VSS
195 IN_CLK_PORT 2
196 D1_IN_0
197 VDDcore8
198 VSScore Ground Ground
199 D1_IN_1 Input 5v 4 mA Port 2 - ITU-R BT656 digital data input
200 D1_IN_2 Input 5v 4 mA Port 2 - ITU-R BT656 digital data input
201 D1_IN_3 Input 5v 4 mA Port 2 - ITU-R BT656 digital data input
202 D1_IN_4 Input 5v 4 mA Port 2 - ITU-R BT656 digital data input
203 D1_IN_5 Input 5v 4 mA Port 2 - ITU-R BT656 digital data input
204 D1_IN_6 Input 5v 4 mA Port 2 - ITU-R BT656 digital data input
205 D1_IN_7 Input 5v 4 mA Port 2 - ITU-R BT656 digital data input
206 FIELD ID_PORT 2
207 VSYNC_ PORT 2
208 HSYNC_PORT 2
Note: 1) * - The connection of these pins depends on the type of external SDRAM used. See Appendix 3
Pin Name I/O Type
Ground
Output
Power
Ground
Output
Output
Output
Input
Power
Ground
Ground
Power
Power
Input
Input
Input
Input
Output
Power
Ground
Input
Input
Power
Input
Input
Input
2) For 16/20 bit Y and muxed C output modes see Appendix 2 for pin configuration
Voltage
Tolerance
Analog Ground for G channel
34 mA Analog R/V output
3.3 V – Analog power pin for R channel
Analog Ground for R channel
Compensation for video DACs
Current setting resistor for video DACs
External Voltage reference for video DACs
3.3 V – Analog power pin for DAC
Analog Ground for DAC
Ground for DAC Guard ring
3.3 V – Power pin for DAC Guard ring
3.3 V –Power pin for DAC pads
5v Test pin – connect to ground
5v Test pin – connect to ground
5v Test pin – connect to ground
any program or erase operations within that sector
Sectors can be locked in-system or via
programming equipment
Temporary Sector Unprotect f eature allows code
changes in previously locked sectors
■ Unlock Bypass Program Command
— Reduces overall pr ogramming time when issuing
multiple program command sequences
■ Top or bottom boot block configurations
available
■ Minimum 1,000,000 write cycle guarantee
per sector
■ 20-year data retention at 125°C
— Reliable operation for the life of the system
■ Package option
— 48-ball FBGA
— 48-pin TSOP
— 44-pin SO
■ CFI (Common Flash Interface) compliant
— Provides device-specific information to the
system, allowing host software to easily
reconfigure for different Flash devices
■ Compatibility with JEDEC standards
— Pinout and software compatible with single-
power supply Flash
— Superior inadvertent write protection
■ Data# Polling and toggle bits
— Provides a software method of detec ting program
or erase operation completion
■ Ready/Busy# pin (RY/BY#)
— Provides a hardware method of detecting
program or erase cycle completi on (not av ailable
on 44-pin SO)
■ Erase Suspend/Erase Resume
— Suspends an erase operation t o read data from,
or program data to, a sector that is not being
erased, then resumes the erase operation
■ Hardware reset pin (RESET#)
— Hardware method to reset the devic e to reading
array data
This Data Sheet states AMD’s current technical specifications regarding the Product described herein. This Data
Sheet may be revised by subsequent versions or modificat ions due to changes in technical specif ic ations.
Publication# 22358Rev: B Amendment/+3
Issue Date: November 10, 2000
Page 22
PRODUCT SELECTOR GUIDE
20
Family Part NumberAm29LV160D
Speed OptionVoltage Range: V
Max access time, ns (t
Max CE# access time, ns (t
Max OE# access time, ns (t
)7090120
ACC
)7090120
CE
)303550
OE
= 2.7–3.6 V-70-90-120
CC
Note: See “AC Characteristics” for full specifications.
Special handling is required for Flash Memory products
in FBGA packages.
BYTE#A16A15A14A12A13
DQ15/A-1V
SS
DQ13DQ6DQ14DQ7A11A10A8A9
V
CC
DQ4DQ12DQ5A19NCRESET#WE#
DQ11DQ3DQ10DQ2NCA18NCRY/BY#
DQ9DQ1DQ8DQ0A5A6A17A7
CE#A0A1A2A4A3
OE#V
SS
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150°C for prolonged periods of time.
A
Page 25
PIN CONFIGURATION
23
A0–A19= 20 addresses
DQ0–DQ14 = 15 data inputs/outputs
DQ15/A-1 = DQ15 (data input/output, word mode),
The Hyundai HY57V641620HG is a 67,108,864-bit CMOS Synchronous DRAM, ideally suited for the main memory applications which
require large memory density and high bandwidth. HY57V641620HG is organized as 4banks of 1,048,576x16.
HY57V641620HG is offering fully synchronous operation referenced to a positive edge of the clock. All inputs and outputs are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high bandwidth. All input and output
voltage levels are compatible with LVTTL.
Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutive read or write cycles initiated
by a single control command (Burst length of 1,2,4,8 or Full page), and the burst count sequence(sequential or interleave). A burst of
read or write cycles in progress can be terminated by a burst terminate command or can be interrupted and replaced by a new burst
read or write command on any cycle. (This pipelined design is not restricted by a `2N` rule.)
FEATURES
•Single 3.3±0.3V power supply
•All device pins are compatible with LVTTL interface
•JEDEC standard 400mil 54pin TSOP-II with 0.8mm
of pin pitch
•All inputs and outputs referenced to positive edge of
system clock
RAS, CAS and WE define the operation
Refer function truth table for details
Page 28
FUNCTIONAL BLOCK DIAGRAM
I/O Buffer & Logic
26
1Mbit x 4banks x 16 I/O Synchronous DRAM
HY57V641620HG
Self refresh logic
CLK
CKE
CS
RAS
CAS
WE
UDQM
LDQM
& timer
Row active
State Machine
refresh
Column
Active
Internal Row
counter
Row
Pre
Decoders
Column
Pre
Decoders
1Mx16 Bank 3
X decoders
1Mx16 Bank 2
X decoders
X decoders
1Mx16 Bank 1
1Mx16 Bank 0
X decoders
Memory
Y decoders
Cell
Array
Sense AMP & I/O Gate
DQ0
DQ1
DQ14
DQ15
Bank Select
A0
A1
A11
BA0
BA1
Address buffers
Address
Registers
Mode Registers
Column Add
Counter
Burst
Counter
CAS Latency
Data Out Control
Pipe Line Control
Page 29
SiI 164 PanelLink
27
PanelLink Transmitter September 2002
PanelLinkPanelLink
Data Sheet
General Description
The SiI 164 transmitter uses PanelLink
technology to support displays ranging from VGA to
UXGA resolutions (25 - 165Mpps) in a single link
interface.
®
Digital
Features
• Scaleable Bandwidth: 25 - 165MHz Flexible
• Graphics Controller Interface: 12-bit or 24-bit
• Flexible Input Clocking: Single clock single
The SiI 164 transmitter has a highly flexible interface
with either a 12-bit mode (½ pixel per clock edge) or
24-bit mode 1 pixel per clock edge input for true color
• I
• Low Voltage Interface: 3.3V with option for 1.0
(16.7 million) support. In 24-bit mode, the SiI 164
supports single or dual edge clocking. In 12-bit mode,
• Monitor Detection supported through hot plug
the SiI164 supports dual edge single clocking or
single edge dual clocking. The SiI 164 can be
programmed though an I
2
C interface. In addition the
SiI 164 also supports Receiver and Hot Plug
• De-skewing Option varies input clock to input
• Low Power: 3.3V operation (120mA max.) and
Detection.
PanelLink Digital technology simplifies PC design by
• Cable Distance Support: over 5m with twisted
resolving many of the system level issues associated
with high-speed mixed signal design, providing the
• Compliant with DVI 1.0 (DVI is backwards
system designer with a digital interface solution that is
quicker to market and lower in cost.
• Standard and Pb-free packages (see pg 29)
mode 1 pixel/clock inputs
edge (24-bit), Single clock dual edge (12-/24bit), Dual clock single edge (12-bit)
2
C Slave Programming Interface up to 100kHz
to 3.0V Low Voltage Signal Mode
and receiver detection
data timing
Power Down mode (1mA max.)
pair and fiber-optics ready
compliant with VESA
®
P&DTM and DFP)
SiI 164Pin Diagram
AGND
VCC
RESERVED
DKEN
D23
D22
D21
D20
D19
D18
D17
D16
D15
D14
D13
D12
GND
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
TX2+
31
50
TX2-
30
51
AVCC
29
52
TX1-
TX1+
27
28
64-Pin TQFP
54
53
TX0-
TX0+
AGND
24
25
26
SiI
164
(Top View)
55
56
57
AVCC
23
58
TXC+
22
59
TXC-
21
60
AGND
20
61
PVCC1
EXT_SWING
18
19
62
63
PGND
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
64
GND
BSEL/SCL
DSEL/SDA
ISEL/RST#
VCC
MSEN
PD#
EDGE/HTPLG
CTL1/A1/DK1
CTL2/A2/DK2
CTL3/A3/DK3
VSYNC
HSYNC
VREF
DE
VCC
D9
D8
D7
PVCC2
D11
D10
D6
IDCK-
IDCK+
D5
D4
D3
D2
D1
D0
GND
Figure 1. Pin Diagram for SiI 164
Page 30
SiI 164 PanelLink Transmitter
G
28
Data Sheet
Functional Description
The SiI 164 is a DVI 1.0 compliant PanelLink transmitter in a compact package. It provides 24 bits for data Input to
allow for panel support up to UXGA resolution. Figure 2 shows the functional blocks of the chip.
TX0+
TX1+
TX2+
EXT_SWIN
I2C
Slave
Machine
MSEN
Registers
&
Configuration
Logic Block
TXC+
PanelLink
PanelLink
PanelLinkPanelLink
Digital
core
SDA
SCL
A[3:1]
ISEL/RST
PD
DSEL/SDA
EDGE/HTPLG
DKEN
BSEL/SCL
CTL/A/DK[3:1]
Data Capture
Logic Block
DE
D[23:0]
VSYNC
HSYNC
IDCK+
VREF
IDCK-
Figure 2. Functional Block Diagram
PanelLink TMDS Digital Core
The PanelLink TMDS core encodes video information onto three TMDS differential data lines and the differential
clock. The video data is input by the Data Capture Logic Block, as a 12- or 24-bit bus, using one or two clocks with
one or two edges per clock. An attached monitor may be sensed using the HTPLG pin or internally with Receiver
Sense. This detected state may be output onto the MSEN pin. The device may be powered down using the PD#
pin or with an internal register. The SiI 164 is reset using the ISEL/RST# pin. A resistor tied to the EXT_SWING
pin is used to control the TMDS swing amplitude.
I2C Interface and Registers
The SiI 164 uses a slave I
the switching levels from the host are not 3.3V, then a voltage level shifter must be used. See Figure 16 and
Figure 17 on page 24 for a system diagram.
2
C interface, capable of running at 100kHz. The slave I2C interface is not 5V tolerant. If
A connected display may be detected using the DVI Hot Plug signal, attached to the HTPLG pin; or with the
Receiver Sense logic internal to the SiI 164. The state of the detection, or an interrupt signal indicating a change of
state, may be sent to the MSEN pin. This is useful to the host controller monitoring the SiI 164.
Page 31
SiI 164 PanelLink Transmitter
29
Data Sheet
Data Capture Logic
Video data is input to the SiI 164 by way of a 12-bit or 24-bit interface. The functionality of this interface is affected
by several of the configuration register settings, as follows.
• BSEL selects between 12-bit and 24-bit input bus widths.
• DSEL selects between single-edge and dual-edge modes for the input clocks.
• EDGE selects between rising and falling edge on the input clocks.
• CLK+ and CLK- provide the one or two clocks required for latching the input data bus.
• The PD# input selects the chip power down mode and allows for disabling of the TMDS outputs.
The ISEL/RST# input resets the HDCP engine and internal registers and is asserted after power up and receipt of
a stable input pixel clock.
Page 32
SiI 164 PanelLink Transmitter
30
Data Sheet
Electrical Specifications
Absolute Maximum Conditions
Absolute Maximum Conditions are defined as the worst case conditions the part will tolerate without sustaining
damage. Permanent device damage may occur if absolute maximum conditions are exceeded. Proper operation
under these conditions is not guaranteed. Functional operation should be restricted to the conditions described
under Normal Operating Conditions.
Symbol Parameter Min Typ Max Units
VCC Supply Voltage 3.3V -0.3 4.0 V
VI Input Voltage -0.3 VCC+ 0.3 V
VO Output Voltage -0.3 VCC+ 0.3 V
TJ Junction Temperature (with power applied) 125
T
Storage Temperature -65 150
STG
Normal Operating Conditions
Symbol Parameter Min Typ Max Units
VCC Supply Voltage 3.0 3.3 3.6 V
V
Supply Voltage Noise 100 mV
CCN
TA Ambient Temperature (with power applied) 0 25 70
θ
Note
1. Airflow at 0m/s.
JA
Thermal Resistance (Junction to Ambient)1 64
P-P
°C
°C/W
°C
°C
Digital I/O Specifications
Under normal operating conditions unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Units
VIH High Swing High-level Input
V
REF = VCC
Voltage
VIL High Swing Low-level Input
V
REF = VCC
Voltage
2
V
Low Swing Voltage 1 3.0 V
DDQ
VSH Low Swing High-level Input
V
REF = VDDQ
Voltage
VSL Low Swing Low-level Input
V
REF = VDDQ
Voltage
V
Input Clamp Voltage1 I
CINL
V
Input Clamp Voltage1 I
CIPL
= -18mA GND -0.8 V
CL
= 18mA VCC + 0.8 V
CL
IIL Input Leakage Current -10 10
VIH High Swing High-level Input
V
REF = VCC
Voltage
Notes
1. Guaranteed by design. Voltage undershoot or overshoot cannot exceed absolute maximum conditions
2. VDDQ defines the maximum voltage level of Low Swing input. It is not an actual input voltage. Chip characterization for
Low Swing operation is performed at 1.5V only. Voltage level of Low Swing input should never exceed absolute
maximum rating.
2.0 V
0.8 V
/2 V
/2 V
2.0 V
/2 +
DDQ
300mV
V
DDQ
/2 –
V
100mV
µA
Page 33
SiI 164 PanelLink Transmitter
31
Data Sheet
DC Specifications
Under normal operating conditions unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Units
VOD Differential Voltage Single ended
R
LOAD
= 50Ω, R
EXT_SWING
peak to peak amplitude
V
Differential High-level Output AVCC V
DOH
Voltage1
I
Differential Output Short Circuit
DOS
I
Power-down Current2 0.2 1.0 mA
PD#
I
Transmitter Supply Current IDCK= 165 MHz, 1-pixel/clock
CCT
Current
1
= 0 V 5
V
OUT
mode, R
EXT_SWING
= 510Ω,
IVCC = VCC,
Worst Case Pattern
Notes
1. Guaranteed by design.
2. Assumes all inputs to the transmitter are not toggling.
3. Black and white checkerboard pattern, each checker is one pixel wide.
3
= 510Ω
510 550 590 mV
µA
85
120
mA
Page 34
SiI 164 PanelLink Transmitter
32
Data Sheet
AC Specifications
Under normal operating conditions unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Units Figure
T
IDCK Period, 1-pixel/clock 6 40 ns
CIP
F
IDCK Frequency, 1-pixel/clock 25 165 MHz
CIP
T
IDCK High Time at 165MHz 2.0 ns
CIH
T
IDCK Low Time at 165MHz 2.0 ns
CIL
T
Worst Case IDCK Clock Jitter
IJIT
T
Data, DE, VSYNC, HSYNC
SIDF
Setup Time to IDCK falling edge
(Default De-skew Setting)
T
Data, DE, VSYNC, HSYNC
HIDF
Hold Time from IDCK falling edge
(Default De-skew Setting)
T
Data, DE, VSYNC, HSYNC
SIDR
Setup Time to IDCK rising edge
(Default De-skew Setting)
T
Data, DE, VSYNC, HSYNC
HIDR
Hold Time from IDCK rising edge
(Default De-skew Setting)
T
Data, DE, VSYNC, HSYNC
SID
Setup Time to IDCK falling/rising edge
(Default De-skew Setting)
T
Data, DE, VSYNC, HSYNC
HID
Hold Time from IDCK falling/rising edge
(Default De-skew Setting)
T
VSYNC, HSYNC Delay from DE falling
DDF
T
VSYNC, HSYNC Delay to DE rising edge1 1T
DDR
T
DE high time1 8191T
HDE
T
DE low time1 128T
LDE
T
De-skew step size increment DKEN = 1 260 ps
STEP
T
Duration of RESET signal Low required for
RESET
edge
1
2,3
2 ns
Single Edge
1.0 ns
(DSEL = 0,
EDGE = 0)
Single Edge
0.9 ns
(DSEL = 0,
EDGE = 0)
1
Single Edge
(DSEL = 0,
1.0 ns
EDGE = 1)
1
Single Edge
(DSEL = 0,
0.9 ns
EDGE = 1)
1
Dual Edge
(DSEL = 1,
0.6 ns
BSEL = 0)
1
Dual Edge
(DSEL = 1,
1.3 ns
BSEL = 0)
1T
ns
CIP
ns
CIP
ns
CIP
ns
CIP
10 µs
valid Reset
I2CDVD
S
HLT
SDA Data Valid Delay from SCL high
to low transition
3
Differential Swing High-to-Low Transition
Time
CL = 10pf 700 ns T
C
= 400pf 2000 ns
L
R
LOAD
R
EXT_SWING
= 50Ω,
=
170 200 230 ps
510Ω
S
Differential Swing Low-to-High Transition
LHT
Time
R
LOAD
R
EXT_SWING
= 50Ω,
=
170 200 230 ps
510Ω
Notes
1. Guaranteed by design.
2. Actual jitter tolerance may be higher depending on the frequency of the jitter.
3. All Standard mode I2C (100kHz) timing requirements are guaranteed by design. Fast mode I2C (400kHz) timing
requirements are guaranteed at 10pf loading.
Figure 3
Figure 3
Figure 3
Figure 6
Figure 6
Figure 6
Figure 6
Figure 7
Figure 7
Figure 8
Figure 8
Figure 5
Figure 9
Figure 4
Figure 4
Page 35
SiI 164 PanelLink Transmitter
33
Data Sheet
Input Timing Diagrams
T
CIP
T
CIH
2.0 V
2.0 V2.0 V
0.8 V
T
CIL
0.8 V
Figure 3. Clock Cycle High/Low Times
S
LHT
80% V
OD
20% V
OD
S
HLT
VCC
ISEL/RST#
Figure 4. Low Swing Differential Times
T
RESET
Figure 5. ISEL/RST# Minimum Timing
Page 36
SiI 164 PanelLink Transmitter
34
Data Sheet
IDCK
D[23:0], DE,
HSYNC,VSYNC
DE
VSYNC, HSYNC,
CTL[3:1]
50 %
T
SIDF
50 %50 %
T
SIDR
T
HIDF
50 %
T
HIDR
Figure 6. Input Data Setup/Hold Time to IDCK
0.8 V
T
DDF
0.8 V
DE
VSYNC, HSYNC,
CTL[3:1]
0.8 V
Figure 7. VSYNC, HSYNC and CTL[3:1] Delay Time from DE
T
0.8 V
DDR
DE
SDA
SCL
2.0 V
Figure 9. I
T
HDE
2.0 V
0.8 V
Figure 8. DE High and Low Times
TI2
I2CDVD
2
C Data Valid Delay (driving Read Cycle data)
T
LDE
0.8 V
Page 37
SiI 164 PanelLink Transmitter
35
Data Sheet
Pin Descriptions
Input Pins
Pin Name Pin # Type Description
D[23:12] 36-47 In
D[11:0]
IDCK+ 57 In Input Data Clock +.
IDCK- 56 In
DE 2 In
HSYNC 4 In
VSYNC 5 In
CTL1/A1/DK1
CTL2/A2/DK2
CTL3/A3/DK3
5055,
58-63
8
7
6
Top half of 24-bit pixel bus.
BSEL = HIGH
When
this bus inputs the top half of the 24-bit pixel bus.
When BSEL = LOW,
these bits are not used to input pixel data. In this mode, the state of D[23:16] is input to the
2
C register CFG. This allows 8-bits of user configuration data to be read by the graphics
I
controller through the I
should be tied to ground. D[15:12] are reserved for SiI use only and should be tied to GND.
Bottom half of 24-bit pixel bus / 12-bit pixel bus input.
In
In
BSEL = HIGH
When
this bus inputs the bottom half of the 24-bit pixel bus.
When BSEL = LOW,
this bus inputs ½ a pixel (12-bits) at every latch edge (both falling and/or rising) of the clock.
Input Data Clock –. This clock is only used in 12-bit mode when dual edge clocking is turned
off (DSEL = LOW). It is used to provide the ODD latching edges for dual clock single edge.
If BSEL = HIGH or DSEL = HIGH,
this pin is unused and should be tied to GND.
Input Data Enable. This signal qualifies the active data area. DE is always required by the
transmitter and must be high during active display time and low during blanking time.
Horizontal Sync input control Signal
Vertical Sync input control signal.
The use of these multi-function inputs depends on the settings of ISEL/RST# and DKEN.
These inputs are regular high-swing 3.3V CMOS level inputs. These pins contain weak pulldown resistors so that if left unconnected, they will be LOW.
When ISEL/RST# = LOW, DKEN = LOW
General Purpose Input CTL[3:1] pins are active, for backward compatibility. These pins
must be used to send DC signals only during the blanking time.
When ISEL/RST# = LOW, DKEN = HIGH
DK[3:1] are active, these inputs are used to select the De-skewing setting for the input bus.
When ISEL/RST# = HIGH, DKEN = HIGH
A[3:1] are active, these bits are used to set the lower 3 bits of the I
,
2
C interface (see I2C register definition). When not used D[23:16]
,
This clock is used for all input modes.
2
C device address.
Page 38
Pin Descriptions (cont’d)
36
Configuration Pins
Pin Name Pin # Type Description
MSEN 11 Out
ISEL/RST# 13 In
BSEL/SCL 15 In
DSEL/SDA 14 In/Out
EDGE/
9 In
HTPLG
DKEN 35 In
Monitor Sense. This pin is an open collector output. The behavior of this output depends on
whether I
2
I
C bus inactive (ISEL/RST# = LOW)
2
C interface active:
HIGH level indicates a powered on receiver is detected at the differential outputs.
A LOW level indicates a powered on receiver is not detected.
2
C bus is enabled (ISEL/RST# = HIGH)
I
The output is programmable through the I2C interface (see I2C Register Definitions).
An external 5K pull-up resistor to VDDQ is required on this pin.
2
I
C Interface Select.
ISEL/RST#=HIGH,
2
I
C interface is active.
ISEL/RST#=LOW,
2
I
C is inactive and the chip configuration is read from the configuration strapping pins. This pin
also acts as an asynchronous reset to the I
input is held LOW.
Note
: When the I
Input bus select / I
(ISEL/RST# = HIGH), then this pin is the I
LOW), then this pin selects the input bus width.
Input Bus Select:
HIGH selects 24-bit input mode
LOW selects 12-bit input mode
Dual edge clock select / I
enabled (ISEL/RST# = HIGH), then this pin is the I
(ISEL/RST# = LOW), then this pin selects whether single clock dual edge is used.
Dual Edge clock select:
When HIGH, IDCK+ latches input data on both falling and
When LOW, IDCK+/IDCK- latches input data on only falling or rising clock edges.
In 24-/12-bit mode:
If HIGH (dual edge), IDCK+ is used to latch data on both falling and rising edges.
If LOW (single edge), IDCK+ latches 1
Edge select / Hot Plug input. If the I
used to monitor the “Hot Plug” detect signal (Please refer to the DVI
DFP standards). This Input is ONLY 3.3V tolerant and has no internal de-bouncer circuit.
2
If I
C bus is disabled (ISEL/RST# = LOW), then this pin selects the clock edge that will latch
the data. How the EDGE setting works depends on whether dual or single edge latching is
selected:
Dual Edge Mode (DSEL = HIGH)
EDGE = LOW, the primary edge (first latch edge after DE is asserted) is the falling edge.
EDGE = HIGH, the primary edge (first latch edge after DE is asserted) is the rising edge.
Note: In 24-bit Single Clock Dual Edge mode, EDGE is ignored.
Single Edge Mode (DSEL = LOW)
EDGE = LOW, the falling edge of the clock is used to latch data.
EDGE = HIGH, the rising edge of the clock is used to latch data.
De-skewing enable.
2
I
C mode (ISEL/RST# = HIGH)
DKEN pin must be set to HIGH. DK[3:1] pins are ignored and the De-skewing increments are
selected through the I
2
Non I
C mode (ISEL/RST# = LOW)
DKEN = LOW, then default De-skewing setting is used.
DKEN = HIGH, then DK[3:1] is used as the De-skewing setting. The De-skewing increments
are T
. Please see Data De-skew Feature for an illustration.
STEP
SiI 164 PanelLink Transmitter
2
C interface controller. The reset is active when this
2
C interface is active, DKEN must be set HIGH.
2
C clock. This pin is an open collector input. If I2C bus is enabled
2
C Data. This pin is an open collector input/output. If I2C bus is
2
C interface (see the I2C register definitions).
2
C clock input. If the I2C is disabled (ISEL/RST# =
2
C data line. If the I2C bus is disabled
rising clock edges.
st
half data and IDCK- latches 2nd half data.
2
C bus is enabled (ISEL/RST# = HIGH), then this pin is
TM
or VESA® P&DTM and
Data Sheet
Page 39
SiI 164 PanelLink Transmitter
37
Data Sheet
Pin Descriptions (cont’d)
Input Voltage Reference Pin
Pin Name Pin # Type Description
VREF 3 Analog In Input Reference Voltage. Selects the Swing range of the digital inputs, which include only
D[23:0], IDCK+, IDCK-, DE, VSYNC, and HSYNC. Input pins SCL and SDA, RST, BSEL,
DSEL, EDGE and PD# require 3.3V high swing signals and are not changed by the VREF
input.
To set the digital inputs to 3.3V High Voltage Swing, VREF must be set to 3.3V.
To set the digital inputs to Low Voltage Swing, VREF must be set to ½ of VDDQ where
VDDQ is swing level of input signal. Thus for DVO mode(1.5V Low Voltage Swing) VREF
should be set to 0.75V and BSEL=LOW.
Power Management Pins
Pin Name Pin # Type Description
PD# 10 In
Differential Signal Data Pins
Pin Name Pin # Type Description
TX0+
TX0TX1+
TX1TX2+
TX2-
TXC+
TXC-
EXT_SWING 19 Analog Voltage Swing Adjust. A resistor should tie this pin to AVCC. This resistor sets the
25
24
28
27
31
30
22
21
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Power Down (active LOW). A HIGH level indicates normal operation. A LOW level
indicates Power Down mode. In Power Down mode the Analog core is disabled and Output
buffers/pins are tri-stated however the Input buffer/pins and I
active. PD# pin is disabled during I
TMDS Low Voltage Differential Signal input data pairs.
These pins are tri-stated when PD# is pulled low.
TMDS Low Voltage Differential Signal input clock pair.
These pins are tri-stated when PD# is pulled low.
amplitude of the voltage swing. A smaller resistor value sets a larger voltage swing and
vice versa. For remote display applications a 510Ω resistor is recommended. While for
notebook computers 680Ω is recommended to ensure voltage swing is not overdriven
over a short cable distance.
2
C mode. PD# should be tied low during I2C mode.
2
C Block for read and write are
Reserved Pins
Pin Name Pin # Type Description
RESERVED 34 In
Must be tied LOW for normal operation.
Power and Ground Pins
Pin Name Pin # Type Description
VCC 1,12,33 Power Digital VCC, must be set to 3.3V nominal.
GND 16,48,64 Ground Digital GND.
AVCC 23,29 Power Analog VCC, must be set to 3.3V nominal.
AGND 20,26,32 Ground Analog GND.
PVCC1 18 Power Primary PLL Analog VCC, must be set to 3.3V nominal.
PVCC2 49 Power Filter PLL Analog VCC, must be set to 3.3V nominal.
PGND 17 Ground PLL Analog GND.
Page 40
SiI 164 PanelLink Transmitter
38
Data Sheet
I2C Registers
2
I
C Register Mapping
Addr. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x00
0x01
0x02
0x03
0x04
0x05
0x06
0x07
0x08
0x09
0x0A
0x0B
0x0C7
0x0D
0x0E
0x0F
Notes
1. All values are Bit 7(MSB) and Bit 0(LSB).
2. Registers that can be written and read from are listed as (R/W) while registers that can be read only are listed with (RO).
3. Actual jitter tolerance may be higher depending on the frequency of the jitter.
4. Contents of this register are dependent on the status of pins D[23:16].
5. After the RESET signal is deasserted in I
programmed value set before the reset. All other registers do not have a default value or retain their value after a reset.
As such all required registers other than PD and MSEL must reinitialized in I
6. Registers listed as RSVD are reserved and for Silicon Image, Inc use only.
Register. Default setting for the VDJK register 0x0C is 89h, which is optimum for most
DKEN (RW)
2
C mode, only PD and MSEL have a default value or can retain their
VND_IDL (RO)
VND_IDH (RO)
DEV_IDL (RO)
DEV_IDH (RO)
DEV_REV (RO)
RSVD[7:0]
FRQ_LOW (RO)
FRQ_HIGH (RO)
HEN
(R/W)
CFG[7:0]4 (RO)
RSVD[7:0]
RSVD[7:0]
DSEL (RW) BSEL (RW ) EDGE (RW) PD (RW)
MDI (RW)
(RO)
CTL[3:1] (RW) RSVD
PLLF[3:1]
(RW)
2
C mode after being powered up or reset.
PFEN
(RW)
Page 41
SiI 164 PanelLink Transmitter
39
Data Sheet
2
I
C Register Definitions
Register Name Access Description
VND_IDL RO Vendor ID Low byte (01h)
VND_IDH RO Vendor ID High byte (00h)
DEV_IDL RO Device ID Low byte (06h)
DEV_IDH RO Device ID High byte (00h)
DEV_REV RO Device Revision (00h)
FRQ_LOW RO Low frequency limit at 1-pixel/clock mode (MHz) (19h)
FRQ_HIGH RO High frequency limit at 1-pixel/clock mode Max frequency minus 65MHz (MHz) (64h)
PD RW Power Down mode (same function as PD# pin)
0 – Power Down (Default after RESET)
1 – Normal operation
EDGE RW Edge Select (same function as EDGE pin)
0 – Input data is falling edge latched (falling edge latched first in dual edge
mode)
1 – Input data is rising edge latched (rising edge latched first in dual edge
mode)
BSEL RW Input Bus Select (same function as BSEL pin)
0 – Input data bus is 12-bits wide
1 – Input data bus is 24-bits wide
DSEL RW Dual Edge Clock Select (same function as DSEL pin)
0 – Input data is single edge latched
1 – Input data is dual edge latched
HEN RW Horizontal Sync Enable:
0 – HSYNC input is transmitted as fixed LOW
1 – HSYNC input is transmitted as is
VEN RW Vertical Sync Enable:
0 – VSYNC input is transmitted as fixed LOW
1 – VSYNC input is transmitted as is
MDI RW Monitor Detect Interrupt
0 – Detection signal has changed logic level (write one to this bit to clear)
1 – Detection signal has not changed state
HTPLG RO Hot Plug Detect input, the state of HTPLG pin can be read from this bit
RSEN RO Receiver Sense (only available for use in DC coupled systems)
0 – Interrupt bit (MDI) is generated by monitoring RSEN
1 – Interrupt bit (MDI) is generated by monitoring HTPLG
MSEL[2:0] RW Select source of the MSEN output pin
000 – Force MSEN outputs high (disabled – default after RESET)
001 – Outputs the MDI bit (interrupt)
010 – Output the RSEN bit (receiver detect)
011 – Outputs the HTPLG bit (hot plug detect)
1xx – RESERVED
CTL[3:1] RW General purpose inputs (same as CTL[3:1] pins)
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SiI 164 PanelLink Transmitter
40
I2C Register Definitions (cont’d)
Register Name Access Description
CFG[7:0] RO Contains state of inputs D[23:16]. These pins can be used to provide user selectable
configuration data through the I
PFEN RW PLL Filter Enable in the VDJK Register.
1 – To enable PLL Filter (recommended setting)
0 – To disable PLL Filter
PLLF[3:1] RW Set characteristics of PLL filter in the VDJK register
100 – Recommended value
SCNT RW SYNC Continuous
1 – To enable (recommended setting)
0 – To disable
DK[3:1] RW De-skewing Setting. Increment 260psec.
000 – 1 step -> minimum setup / maximum hold
001 – 2 step
010 – 3 step
011 – 4 step
100 – 5 step -> default (recommended setting)
101 – 6 step
110 – 7 step
111 – 8 step -> maximum setup / minimum hold
Please see Data De-Skew Feature for an illustration
DKEN RW De-skewing Enable through DK[3:1] bits. When DKEN pin is HIGH via pin or set to 1,
then De-skew is enabled. When set to 0 De-skew is disabled. Please see Data Deskew Feature for an illustration.
2
C bus. Only available in 12-bit mode
Data Sheet
Page 43
8.2 MT1389
41
MT1389
Specifications are subject to change without notice
Progressive-Scan DVD Player SOC
MediaTek MT1389 is a DVD player system-on-chip (SOC) which incorporates advanced features like high
quality TV encoder and state-of-art de-interlace processing. The MT1389 enables consumer electronics
manufacturers to build high quality, cost-effective DVD players, portable DVD players or any other home
entertainment audio/video devices.
rd
Based on MediaTek’s world-leading DVD player SOC architecture, the MT1389 is the 3
player SOC. It integrates the MediaTek 2
decoder.
The progressive scan of the MT1389 utilized a proprietary advanced motion-adaptive de-interlace algorithm to
achieve the best movie/video playback. It can easily detect 3:2/2:2 pull down source and restore the correct
original pictures. It also supports a patent-pending edge-preserving algorithm to remove the saw-tooth effect.
nd
generation front-end analog RF amplifier and the Servo/MPEG AV
generation of the DVD
Key Features
RF/Servo/MPEG Integration
High Performance Audio Processor
Motion-Adaptive, Edge-Preserving De-interlace
108MHz/12-bit, 6 CH TV Encoder
DVD
PUH
Module
CVBS, Y/C,
Component
SDPIF
MT1389L
Applications
FLASH
Front-panel
Remote
DRAM
Audio DAC
Standard DVD Players
Portable DVD Players
DVD Player System Diagram Using MT1389
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42
PRELIMINARY, SUBJECT TO CHANGE WITHOUT NOTICE MTK CONFIDENTIAL, NO DISCLOSURE
MT1389
General Feature List
1024-bytes on-chip RAM
Super Integration DVD player single chip
High performance analog RF amplifier
Servo controller and data channel processing
MPEG-1/MPEG-2/JPEG video
Dolby AC-3/DTS/DVD-Audio
Unified memory architecture
Versatile video scaling & quality
enhancement
OSD & Sub-picture
2-D graphic engine
Built-in clock generator
Built-in high quality TV encoder
Built-in progressive video processor
Audio effect post-processor
Audio input port
Up to 4M bytes FLASH-programming
interface
Supports 5/3.3-Volt. FLASH interface
Supports power-down mode
Supports additional serial port
DVD-ROM/CD-ROM Decoding Logic
High-speed ECC logic capable of correcting
one error per each P-codeword or
Q-codeword
Automatic sector Mode and Form detection
Automatic sector Header verification
Decoder Error Notification Interrupt that
signals various decoder errors
Provide error correction acceleration
High Performance Analog RF Amplifier
Programmable fc
Dual automatic laser power control
Defect and blank detection
RF level signal generator
Speed Performance on Servo/Channel Decoding
DVD-ROM up to 4XS
CD-ROM up to 24XS
Channel Data Processor
Digital data slicer for small jitter capability
Built-in high performance data PLL for
channel data demodulation
EFM/EFM+ data demodulation
Enhanced channel data frame sync protection
& DVD-ROM sector sync protection
Servo Control and Spindle Motor Control
Programmable frequency error gain and
phase error gain of spindle PLL to control
spindle motor on CLV and CAV mode
Built-in ADCs and DACs for digital servo
control
Provide 2 general PWM
Tray control can be PWM output or digital
Supports 16Mb/32Mb/64Mb/128Mb SDRAM
Supports 16-bit SDRAM data bus
Provide the self-refresh mode SDRAM
Block-based sector addressing
Support 3.3 Volt. DRAM Interface
Video Decode
Decodes MPEG1 video and MPEG2 main level,
main profile video (720/480 and 720x576)
Smooth digest view function with I, P and B
picture decoding
Baseline, extended-sequential and
progressive JPEG image decoding
Support CD-G titles
Video/OSD/SPU/HLI Processor
Arbitrary ratio vertical/horizontal scaling of
video, from 0.25X to 256X
65535/256/16/4/2-color bitmap format OSD,
256/16 color RLC format OSD
Automatic scrolling of OSD image
Slide show transition as DVD-Audio
Specification
2-D Graphic Engine
Support decode Text and Bitmap
Support line, rectangle and gradient fill
Support bitblt
Chroma key copy operation
Clip mask
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43
PRELIMINARY, SUBJECT TO CHANGE WITHOUT NOTICE MTK CONFIDENTIAL, NO DISCLOSURE
MT1389
Audio Effect Processing
Dolby Digital (AC-3)/EX decoding
DTS/DTS-ES decoding
MLP decoding for DVD-Audio
MPEG-1 layer 1/layer 2 audio decoding
MPEG-2 layer1/layer2 2-channel audio
High Definition Compatible Digital (HDCD)
Windows Media Audio (WMA)
Advanced Audio Coding (AAC)
Dolby ProLogic II
Concurrent multi-channel and downmix out
IEC 60958/61937 output
- PCM / bit stream / mute mode
- Custom IEC latency up to 2 frames
Pink noise and white noise generator
Karaoke functions
- Microphone echo
- Microphone tone control
- Vocal mute/vocal assistant
- Key shift up to +/- 8 keys
- Chorus/Flanger/Harmony/Reverb
Channel equalizer
3D surround processing include virtual
surround and speaker separation
TV Encoder
Six 108MHz/12bit DACs
Support NTSC, PAL-BDGHINM, PAL-60
Support 525p, 625p progressive TV format
Automatically turn off unconnected channels
Support PC monitor (VGA)
Support Macrovision 7.1 L1, Macrovision
525P and 625P
CGMS-A/WSS
Closed Caption
Progressive Output
Automatic detect film or video source
3:2 pull down source detection
Advanced Motion adaptive de-interlace
Edge Preserving
Minimum external memory requirement
Audio Input
Line-in/SPDIF-in for versatile audio