2.PREVENTION OF ELECTRO STATIC DISCHARGE(ESD)TO
ELECTROSTATICALLY SENSITIVE(ES)DEVICES
1
1. When servicing, observe the original lead dress. if a short circuit is found, replace all parts which have
been overheated or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barrier, insulation papers
shields are properly installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed
to shock hazards.
Some semiconductor(solid state)devices can be damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive(ES)Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and semiconductor chip components. The following techniques
should be used to help reduce the incidence of component damage caused by electro static discharge(ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain
off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially
availabel discharging ESD wrist strap, which should be removed for potential shock reasons prior to
applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices,place the assembly on a conductive
surface such as alminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as anti-static
(ESD protected)can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are
ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by
conductive foam, alminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch
the protective material to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can
generate static electricity(ESD).
notice (1885x323x2 tiff)
2
Front Panel Illustration
POWER switch
2
Disc tray
2
3
4
6
PLAY/ buttonPAUSE
7
STOP button
5
6
7
8
9
3
IR SENSOR button
4
Display window
5
OPEN/CLOSE button
8
MIC VOLUME knob
9
MIC jack
The laser diode in the traverse unit (optical pickup)may brake down due to static electricity of clothes or human
body. Use due caution to electrostatic breakdown when servicing and handling the laser diode.
Some devices such as the DVD player use the optical pickup(laser diode)and the optical pickup will be damaged
by static electricity in the working environment.Proceed servicing works under the working environment where
1. Put a conductive material(sheet)or iron sheet on the area where the optical pickup is placed,and ground the
3. The flexible cable may be cut off if an excessive force is applied to it.Use caution when handling the cable.
3
4.PREVENTION OF STATIC ELECTRICITY DISCHARGE
4.1.Grounding for electrostatic breakdown prevention
grounding works is completed.
4.1.1. Worktable grounding
sheet.
4.1.2.Human body grounding
1 Use the anti-static wrist strap to discharge the static electricity from your body.
safety_3 (1577x409x2 tiff)
4.1.3.Handling of optical pickup
1. To keep the good quality of the optical pickup maintenance parts during transportation and before
installation, the both ends of the laser diode are short-circuited.After replacing the parts with new ones,
remove the short circuit according to the correct procedure. (See this Technical Guide).
2. Do not use a tester to check the laser diode for the optical pickup .Failure to do so willdamage the laser
diode due to the power supply in the tester.
4.2. Handling precautions for Traverse Unit (Optical Pickup)
1. Do not give a considerable shock to the traverse unit(optical pickup)as it has an extremely high-precise
structure.
2. When replacing the optical pickup, install the flexible cable and cut is short land with a nipper. See the
optical pickup replacement procedure in this Technical Guide. Before replacing the traverse unit, remove
the short pin for preventingstatic electricity and install a new unit.Connect the connector as short times as
possible.
4. The half-fixed resistor for laser power adjustment cannot be adjusted. Do not turn the resistor.
5.1Optical pickup Unit Explosed View and Part List
5. Assembling and disassembling the mechanism unit
4
Pic (1)
Materials to Pic (1)
5
No. PARTS CODE PARTS NAME Qty
14692200 SF-HD60 1
1
1EA0311A06300 ASSY, CHASSIS, COMPLETE 1
2
Or
3
4
5
6
7
8
9
10
11
21
Or
31
32
1EA0M10A15500 ASSY, MOTOR, SLED 1
1EA0M10A15501 ASSY, MOTOR, SLED 1
1EA2451A24700 HOLDER, SHAFT 3
1EA2511A29100 GEAR, RACK 1
1EA2511A29200 GEAR, DRIVE 1
1EA2511A29300 GEAR, MIDDLE, A 1
1EA2511A29400 GEAR, MIDDLE, B 1
1EA2744A03000 SHAFT, SLIDE 1
1EA2744A03100 SHAFT, SLIDE, SUB 1
1EA2812A15300 SPRING, COMP, TYOUSEI 3
1EA2812A15400 SPRING, COMP, RACK 1
1EA0B10B20100 ASSY, PWB 1
1EA0B10B20200 ASSY, PWB 1
SEXEA25700--- SPECIAL SCREW BIN+-M2X11 3
SEXEA25900--- SPECIAL SCREW M1.7X2.2 2
33
34
35
Note : This parts list is not for service parts supply.
SFBPN204R0SE- SCR S-TPG PAN 2X4 2
SFSFN266R0SE- SCR S-TPG FLT 2.6X6 1
SWXEA15400--- SPECIAL WASHER 1.8X4 X0.25 2
5.2 BracketExplosed View and Part List
6
Pic (2)
Materials to Pic(2)
1.bracket 14. front silicon rubber
2.belt 15. Back silicon rubber
3.screw 16. Pick-up
4.belt wheel 17. Pick-up
5.gearwheel 18. switch
6.iron chip 19. Five-pin flat plug
7. Immobility mechanism equipment 20. screw
8. Magnet 21. PCB
9. Platen 22. motor
10. Bridge bracket 23. Motor wheel
11. screw 24. screw
12. screw 25.tray
13. Big bracket
Before going process with disassembly and installation, please carefully both
peruse the chart and confirm the materials.
5.3 MISCELLANEOUS
7
5.3.1 Protection of the LD(Laser diode)
Short the parts of LD circuit pattern by soldering.
5.3.2 Cautions on assembly and adjustment
Make sure that the workbenches,jigs,tips,tips of soldering irons and measuring instruments are
grounded,and that personnel wear wrist straps for ground.
Open the LD short lands quickly with a soldering iron after a circuit is connected.
Keep the power source of the pick-up protected from internal and external sources of electrical
noise.
Refrain from operation and storage in atmospheres containing corrosive gases (such as H2S,SO2,
NO2 and Cl2)or toxic gases or in locations containing substances(especially from the organic silicon,cyan,
formalin and phenol groups)which emit toxic gases.It is particularly important to ensure that none of the
above substances are present inside the unit.Otherwise,the motor may no longer run.
6.1. Video Output (Luminance Signal) Confirmation
6.Electrical Confirmation
8
DO this confirmation after replacing a P.C.B.
Measurement point
Video output terminal
Measuring equipment,tools
200mV/dir,10sec/dir
Purpose:To maintain video signal output compatibility.
1.Connect the oscilloscope to the video output terminal and terminate at 75 ohms.
2.Confirm that luminance signal(Y+S)level is 1000mVp-p±30mV
PLAY(Title 46):DVDT-S15
PLAY(Title 12):DVDT-S01
ModeDisc
Color bar 75%
Confirmation value
1000mVp-p±30mV
DVDT-S15
or
DVDT-S01
Do the confirmation after replacing P.C.B.
Screwdriver,Oscilloscope
6.2 Video Output(Chrominance Signal) Confirmation
9
Measurement point
Video output terminal
Measuring equipment,toolsConfirmation value
200mV/dir,10sec/dir
Purpose:To maintain video signal output compatibility.
1.Connect the oscilloscope to the video output terminal and terminate at 75 ohme.
2.Confirm that the chrominance signal(C)level is 621 mVp-p±30mV
PLAY(Title 46):DVDT-S15
PLAY(Title 12):DVDT-S01
ModeDisc
Color bar 75%
621mVp-p±30mV
DVDT-S15
or
DVDT-S01
7.MPEG BOARD CHECK WAVEFORM
7.1 27MHz WAVEFORM
7.2 IC VIPER22 PIN.5 WAVEFORM DIAGRAM
10
16 Megabit (2 M x 8-Bit/1 M x 16-Bit)
11
8. Am29LV160D
CMOS 3.0 Volt-only Boot Sector Flash Memory
DISTINCTIVE CHARACTERISTICS
■ Single power supply operation
— Full voltage range: 2.7 to 3.6 volt read and write
operations for battery-powered applications
— Regulated voltage range: 3. 0 to 3.6 volt read and
write operations and for compatibility with high
performance 3.3 volt microprocessors
■ Embedded Algorithms
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Embedded Program algorithm automatically
writes and verifies data at specified addresses
■ Manufactured on 0.23 µm process technology
— Fully compatible with 0.32 µm Am29L V160B device
■ High performance
— Access times as fast as 70 ns
■ Ultra low power consumption (typical values at
5MHz)
— 200 nA Automatic Sleep mode current
— 200 nA standby mode current
— 9 mA read current
— 20 mA program/erase current
any program or erase operations within that sector
Sectors can be locked in-system or via
programming equipment
Temporary Sector Unprotect f eature allows code
changes in previously locked sectors
■ Unlock Bypass Program Command
— Reduces overall pr ogramming time when issuing
multiple program command sequences
■ Top or bottom boot block configurations
available
■ Minimum 1,000,000 write cycle guarantee
per sector
■ 20-year data retention at 125°C
— Reliable operation for the life of the system
■ Package option
— 48-ball FBGA
— 48-pin TSOP
— 44-pin SO
■ CFI (Common Flash Interface) compliant
— Provides device-specific information to the
system, allowing host software to easily
reconfigure for different Flash devices
■ Compatibility with JEDEC standards
— Pinout and software compatible with single-
power supply Flash
— Superior inadvertent write protection
■ Data# Polling and toggle bits
— Provides a software method of detec ting program
or erase operation completion
■ Ready/Busy# pin (RY/ BY#)
— Provides a hardware method of detecting
program or erase cycle completi on (not av ailable
on 44-pin SO)
■ Erase Suspend/Erase Resume
— Suspends an erase operation t o read data from,
or program data to, a sector that is not being
erased, then resumes the erase operation
■ Hardware reset pin (RESET#)
— Hardware method to reset the devic e to reading
array data
This Data Sheet states AMD’s current technical specifications regarding the Product described herein. This Data
Sheet may be revised by subsequent versions or modificat ions due to changes in technical specif ic ations.
Publication# 22358Rev: B Amendment/+3
Issue Date: November 10, 2000
PRODUCT SELECTOR GUIDE
12
Family Part NumberAm29LV160D
Speed OptionVoltage Range: V
Max access time, ns (t
Max CE# access time, ns (t
Max OE# access time, ns (t
)7090120
ACC
)7090120
CE
)303550
OE
= 2.7–3.6 V-70-90-120
CC
Note: See “AC Characteristics” for full specifications.
Special handling is required for Flash Memory products
in FBGA packages.
BYTE#A16A15A14A12A13
DQ15/A-1V
SS
DQ13DQ6DQ14DQ7A11A10A8A9
V
CC
DQ4DQ12DQ5A19NCRESET#WE#
DQ11DQ3DQ10DQ2NCA18NCRY/BY#
DQ9DQ1DQ8DQ0A5A6A17A7
CE#A0A1A2A4A3
OE#V
SS
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150°C for prolonged periods of time.
A
PIN CONFIGURATION
15
A0–A19= 20 addresses
DQ0–DQ14 = 15 data inputs/outputs
DQ15/A-1 = DQ15 (data input/output, word mode),
• All inputs are sampled at the positive going edge of the system clock
Burst Read Single-bit Write operation
•
DQM for masking
•
Auto & self refresh
•
• 32ms refresh period (2K cycle)
GENERAL DESCRIPTION
The K4S161622H is 16,777,216 bits synchronous high data rate Dynamic RAM organized as 2 x 524,288 words by 16 bits, fabricated
with SAMSUNG′s high performance CMOS technology. Synchronous design allows precise cycle control with the use of system clock I/
O transactions are possible on every clock cycle. Range of operating frequencies, programmable burst length and programmable latencies allow the same device to be useful for a variety of high bandwidth, high performance memory system applications.
CLKSystem ClockActive on the positive going edge to sample all inputs.
CS
Chip Select
Disables or enables device operation by masking or enabling all inputs except
CLK, CKE and L(U)DQM
Masks system clock to freeze operation from the next clock cycle.
CKEClock Enable
CKE should be enabled at least one cycle prior to new command.
Disable input buffers for power down in standby.
A
0 ~ A10/APAddress
BABank Select Address
RAS
CAS
WE
Row Address Strobe
Column Address Strobe
Write Enable
L(U)DQMData Input/Output Mask
DQ
0 ~ 15Data Input/OutputData inputs/outputs are multiplexed on the same pins.
DD/VSSPower Supply/GroundPower and ground for the input buffers and the core logic.
V
V
DDQ/VSSQData Output Power/Ground
N.C/RFU
No Connection/
Reserved for Future Use
Row / column addresses are multiplexed on the same pins.
Row address : RA
0 ~ RA10, column address : CA0 ~ CA7
Selects bank to be activated during row address latch time.
Selects bank for read/write during column address latch time.
Latches row addresses on the positive going edge of the CLK with RAS
Enables row access & precharge.
Latches column addresses on the positive going edge of the CLK with CAS
Enables column access.
Enables write operation and row precharge.
Latches data in starting from CAS
Makes data output Hi-Z, t
SHZ after the clock and masks the output.
, WE active.
Blocks data input when L(U)DQM active.
Isolated power supply and ground for the output buffers to provide improved noise
immunity.
This pin is recommended to be left No Connection on the device.
low.
low.
Rev. 1.4 May 2004
SDRAM 16Mb H-die(x16)CMOS SDRAM
18
FUNCTIONAL BLOCK DIAGRAM
LWE
Data Input Register
Bank Select
LDQM
Refresh Counter
Row Buffer
Address Register
CLK
ADD
LRAS
LCBR
LCKE
LRASLCBRLWELDQM
CLKCKECS
* Samsung Electronics reserves the right to change products or specification without notice.
Row DecoderCol. Buffer
512K x 16
512K x 16
Column Decoder
Latency & Burst Length
Programming Register
LCASLWCBR
Timing Register
RASCASWEL(U)DQM
Sense AMP
Output BufferI/O Control
DQi
Rev. 1.4 May 2004
8.2 MT1389
19
MT1389
Specifications are subject to change without notice
Progressive-Scan DVD Player SOC
MediaTek MT1389 is a DVD player system-on-chip (SOC) which incorporates advanced features like high
quality TV encoder and state-of-art de-interlace processing. The MT1389 enables consumer electronics
manufacturers to build high quality, cost-effective DVD players, portable DVD players or any other home
entertainment audio/video devices.
rd
Based on MediaTek’s world-leading DVD player SOC architecture, the MT1389 is the 3
player SOC. It integrates the MediaTek 2
decoder.
The progressive scan of the MT1389 utilized a proprietary advanced motion-adaptive de-interlace algorithm to
achieve the best movie/video playback. It can easily detect 3:2/2:2 pull down source and restore the correct
original pictures. It also supports a patent-pending edge-preserving algorithm to remove the saw-tooth effect.
nd
generation front-end analog RF amplifier and the Servo/MPEG AV
generation of the DVD
Key Features
RF/Servo/MPEG Integration
High Performance Audio Processor
Motion-Adaptive, Edge-Preserving De-interlace
108MHz/12-bit, 6 CH TV Encoder
DVD
PUH
Module
CVBS, Y/C,
Component
SDPIF
MT1389L
Applications
FLASH
Front-panel
Remote
DRAM
Audio DAC
Standard DVD Players
Portable DVD Players
DVD Player System Diagram Using MT1389
20
PRELIMINARY, SUBJECT TO CHANGE WITHOUT NOTICE MTK CONFIDENTIAL, NO DISCLOSURE
MT1389
General Feature List
1024-bytes on-chip RAM
Super Integration DVD player single chip
High performance analog RF amplifier
Servo controller and data channel processing
MPEG-1/MPEG-2/JPEG video
Dolby AC-3/DTS/DVD-Audio
Unified memory architecture
Versatile video scaling & quality
enhancement
OSD & Sub-picture
2-D graphic engine
Built-in clock generator
Built-in high quality TV encoder
Built-in progressive video processor
Audio effect post-processor
Audio input port
Up to 4M bytes FLASH-programming
interface
Supports 5/3.3-Volt. FLASH interface
Supports power-down mode
Supports additional serial port
DVD-ROM/CD-ROM Decoding Logic
High-speed ECC logic capable of correcting
one error per each P-codeword or
Q-codeword
Automatic sector Mode and Form detection
Automatic sector Header verification
Decoder Error Notification Interrupt that
signals various decoder errors
Provide error correction acceleration
High Performance Analog RF Amplifier
Programmable fc
Dual automatic laser power control
Defect and blank detection
RF level signal generator
Speed Performance on Servo/Channel Decoding
DVD-ROM up to 4XS
CD-ROM up to 24XS
Channel Data Processor
Digital data slicer for small jitter capability
Built-in high performance data PLL for
channel data demodulation
EFM/EFM+ data demodulation
Enhanced channel data frame sync protection
& DVD-ROM sector sync protection
Servo Control and Spindle Motor Control
Programmable frequency error gain and
phase error gain of spindle PLL to control
spindle motor on CLV and CAV mode
Built-in ADCs and DACs for digital servo
control
Provide 2 general PWM
Tray control can be PWM output or digital
Supports 16Mb/32Mb/64Mb/128Mb SDRAM
Supports 16-bit SDRAM data bus
Provide the self-refresh mode SDRAM
Block-based sector addressing
Support 3.3 Volt. DRAM Interface
Video Decode
Decodes MPEG1 video and MPEG2 main level,
main profile video (720/480 and 720x576)
Smooth digest view function with I, P and B
picture decoding
Baseline, extended-sequential and
progressive JPEG image decoding
Support CD-G titles
Video/OSD/SPU/HLI Processor
Arbitrary ratio vertical/horizontal scaling of
video, from 0.25X to 256X
65535/256/16/4/2-color bitmap format OSD,
256/16 color RLC format OSD
Automatic scrolling of OSD image
Slide show transition as DVD-Audio
Specification
2-D Graphic Engine
Support decode Text and Bitmap
Support line, rectangle and gradient fill
Support bitblt
Chroma key copy operation
Clip mask
21
PRELIMINARY, SUBJECT TO CHANGE WITHOUT NOTICE MTK CONFIDENTIAL, NO DISCLOSURE
MT1389
Audio Effect Processing
Dolby Digital (AC-3)/EX decoding
DTS/DTS-ES decoding
MLP decoding for DVD-Audio
MPEG-1 layer 1/layer 2 audio decoding
MPEG-2 layer1/layer2 2-channel audio
High Definition Compatible Digital (HDCD)
Windows Media Audio (WMA)
Advanced Audio Coding (AAC)
Dolby ProLogic II
Concurrent multi-channel and downmix out
IEC 60958/61937 output
- PCM / bit stream / mute mode
- Custom IEC latency up to 2 frames
Pink noise and white noise generator
Karaoke functions
- Microphone echo
- Microphone tone control
- Vocal mute/vocal assistant
- Key shift up to +/- 8 keys
- Chorus/Flanger/Harmony/Reverb
Channel equalizer
3D surround processing include virtual
surround and speaker separation
TV Encoder
Six 108MHz/12bit DACs
Support NTSC, PAL-BDGHINM, PAL-60
Support 525p, 625p progressive TV format
Automatically turn off unconnected channels
Support PC monitor (VGA)
Support Macrovision 7.1 L1, Macrovision
525P and 625P
CGMS-A/WSS
Closed Caption
Progressive Output
Automatic detect film or video source
3:2 pull down source detection
Advanced Motion adaptive de-interlace
Edge Preserving
Minimum external memory requirement
Audio Input
Line-in/SPDIF-in for versatile audio