AVAGO HCPL 0710 Datasheet

HCPL-7710/0710
8
7
6
1
3
SHIELD
5
2
4
**V
DD1
V
I
NC*
GND
1
V
DD2
**
V
O
GND
2
VI, INPUT LED1
H L
OFF
ON
TRUTH TABLE
(POSITIVE LOGIC)
NC*
I
O
LED1
VO, OUTPUT
H L
VI, INPUT LED1
H L
OFF
ON
TRUTH TABLE
(POSITIVE LOGIC)
VO, OUTPUT
H L
Lead (Pb) Free
RoHS 6 fully compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
40 ns Propagation Delay, CMOS Optocoupler
Data Sheet
Description
Available in either an 8-pin DIP or SO-8 package style respectively, the HCPL-7710 or HCPL-0710 optocouplers utilize the latest CMOS IC technology to achieve outstand­ing performance with very low power consumption. The HCPL-x710 require only two bypass capacitors for complete CMOS compatibility.
Basic building blocks of the HCPL-x710 are a CMOS LED driver IC, a high speed LED and a CMOS detector IC. A CMOS logic input signal controls the LED driver IC which supplies current to the LED. The detector IC incorporates an integrated photodiode, a high-speed transimped­ance amplier, and a voltage comparator with an output driver.
Functional Diagram
Features
+5 V CMOS compatibility
8 ns maximum pulse width distortion
20 ns maximum prop. delay skew
High speed: 12 Mbd
40 ns maximum prop. delay
10 kV/µs minimum common mode rejection
-40°C to 100°C temperature range
UL Recognized 3750 V rms for 1 min. per UL 1577 5000 V rms for 1 min. per UL 1577 (for HCPL-7710 option 020) CSA Component Acceptance Notice #5 IEC/EN/DIN EN 60747-5-2 – V – V
= 630 Vpeak for HCPL-7710 Option 060
IORM
= 560 Vpeak for HCPL-0710 Option 060
IORM
Applications
Digital eldbus isolation: DeviceNet, SDS, Probus
AC plasma display panel level shifting
Multiplexed data transmission
Computer peripheral interface
Microprocessor system interface
* Pin 3 is the anode of the internal LED and must be left
unconnected for guaranteed data sheet performance. Pin 7 is not connected internally.
** A 0.1 µF bypass capacitor must be connected
between pins 1 and 4, and 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
Selection Guide
8-Pin DIP Small Outline (300 Mil) SO-8
HCPL-7710 HCPL-0710
Ordering Information
HCPL-0710 and HCPL-7710 are UL Recognized with 3750 Vrms for 1 minute per UL1577.
Option
Part number
HCPL-7710
HCPL-0710
To order, choose a part number from the part number column and combine with the desired option from the option column to form an order entry.
Example 1:
RoHS
Compliant
-000E No option
-300E #300 X X 50 per tube
-500E #500 X X X 1000 per reel
-020E -020 X 50 per tube
-320E -320 X X X 50 per tube
-520E -520 X X X X 1000 per reel
-060E #060 X 50 per tube
-360E #360 X X X 50 per tube
-560E #560 X X X X 1000 per reel
-000E No option
-500E #500 X X 1500 per reel
-060E #060 X X 100 per tube
-560E #560 X X X 1500 per reel
Non RoHS
Compliant
Package
300mil
DIP-8
SO-8
Surface
Mount
X 100 per tube
Gull
Wing
Tape
& Reel
UL 5000
Vrms/ 1
Minute rating
IEC/EN/DIN
EN 60747-5-2 Quantity
50 per tube
HCPL-7710-560E to order product of Gull Wing Surface Mount package in Tape and Reel packaging with IEC/EN/
DIN EN 60747-5-2 Safety Approval in RoHS compliant.
Example 2:
HCPL-0710 to order product of Small Outline SO-8 package in tube packaging and non RoHS compliant.
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.
Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since 15th July 2001 and RoHS compliant option will use ‘-XXXE‘.
2
Package Outline Drawing
9.65 ± 0.25
(0.380 ± 0.010)
1.78 (0.070) MAX.
1.19 (0.047) MAX.
A XXXX
YYWW
DATE CODE
1.080 ± 0.320
(0.043 ± 0.013)
2.54 ± 0.25
(0.100 ± 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
5678
4321
5° TYP.
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
TYPE NUMBER
*MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION 020 "V" = OPTION 060 OPTION NUMBERS 300 AND 500 NOT MARKED.
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
9.65 ± 0.25
(0.380 ± 0.010)
0.635 ± 0.130
(0.025 ± 0.005)
7.62 ± 0.25
(0.300 ± 0.010)
Outline (8-pin DIP - Option 300)
5
6
7
8
4
3
2
1
9.65 ± 0.25
(0.380 ± 0.010)
6.350 ± 0.25
(0.250 ± 0.010)
1.016 (0.040)
1.194 (0.047)
1.194 (0.047)
1.778 (0.070)
9.398 (0.370)
9.906 (0.390)
4.826
(0.190)
TYP.
0.381 (0.015)
0.635 (0.025)
PAD LOCATION (FOR REFERENCE ONLY)
1.080 ± 0.320
(0.043 ± 0.013)
4.19
(0.165)
MAX.
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
2.54
(0.100)
BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
HCPL-7710 8-Pin DIP Package
Package Outline Drawing
HCPL-7710 Package with Gull Wing Surface Mount Option 300
3
Package Outline Drawing
XXXV YWW
8 7 6 5
4321
5.994 ± 0.203
(0.236 ± 0.008)
3.937 ± 0.127
(0.155 ± 0.005)
0.406 ± 0.076
(0.016 ± 0.003)
1.270
(0.050)
BSC
5.080 ± 0.127
(0.200 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005)
1.524
(0.060)
45° X
0.432
(0.017)
0.228 ± 0.025
(0.009 ± 0.001)
TYPE NUMBER (LAST 3 DIGITS)
DATE CODE
0.305
(0.012)
MIN.
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
OPTION NUMBER 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
0.203 ± 0.102
(0.008 ± 0.004)
PIN ONE
0 ~ 7°
*
*
7.49 (0.295)
1.9 (0.075)
0.64 (0.025)
LAND PATTERN RECOMMENDATION
0
TIME (SECONDS)
TEMPERATURE ( °C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160°C
140°C
150°C
PEAK
TEMP.
245°C
PEAK TEMP. 240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
PREHEATING TIME 150°C, 90 + 30 SEC.
2.5°C ± 0.5°C/SEC.
3°C + 1°C/- 0.5°C
TIGHT TYPICAL LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3°C + 1°C/- 0.5°C/SEC. REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
HCPL-0710 Outline Drawing (Small Outline SO-8 Package)
Solder Reow Thermal Prole
4
Note: Non-halide ux should be used.
Recommended Pb-Free IR Prole
217 °C
RAMP-DOWN 6 °C/SEC. MAX.
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
260 +0/-5 °C
t 25 °C to PEAK
60 to 150 SEC.
20-40 SEC.
TIME WITHIN 5 °C of ACTUAL PEAK TEMPERATURE
t
p
t
s
PREHEAT
60 to 180 SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME
TEMPERATURE
NOTES: THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX. T
smax
= 200 °C, T
smin
= 150 °C
Note: Non-halide ux should be used.
Regulatory Information
The HCPL-x710 have been approved by the following organizations:
UL
Recognized under UL 1577, component recognition program, File E55361.
IEC/EN/DIN EN 60747-5-2
Approved under: IEC 60747-5-2:1997 + A1:2002 EN 60747-5-2:2001 + A1:2002
CSA
Approved under CSA Component Acceptance Notice #5, File CA 88324.
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01. (Option 060 only)
Insulation and Safety Related Specications
Value
Parameter Symbol 7710 0710 Units Conditions
Minimum External Air L(I01) 7.1 4.9 mm Measured from input terminals to output Gap (Clearance) terminals, shortest distance through air.
Minimum External L(I02) 7.4 4.8 mm Measured from input terminals to output Tracking (Creepage) terminals, shortest distance path along body.
Minimum Internal Plastic 0.08 0.08 mm Insulation thickness between emitter and Gap (Internal Clearance) detector; also known as distance through insulation.
Tracking Resistance CTI ≥175 ≥175 Volts DIN IEC 112/VDE 0303 Part 1 (Comparative Tracking Index)
Isolation Group IIIa IIIa Material Group (DIN VDE 0110, 1/89, Table 1)
All Avago data sheets report the creepage and clearance inherent to the optocoupler component itself. These dimensions are needed as a starting point for the equip­ment designer when determining the circuit insulation requirements. However, once mounted on a printed circuit board, minimum creepage and clearance requirements must be met as specied for individual equipment stan­dards. For creepage, the shortest distance path along the
5
surface of a printed circuit board between the solder llets of the input and output leads must be considered. There are recommended techniques such as grooves and ribs which may be used on a printed circuit board to achieve desired creepage and clearances. Creepage and clearance distances will also change depending on factors such as pollution degree and insulation level.
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (Option 060)
HCPL-7710 HCPL-0710 Description Symbol Option 060 Option 060 Units
Installation classication per DIN VDE 0110/1.89, Table 1 for rated mains voltage ≤150 V rms I-IV I-IV for rated mains voltage ≤300 V rms I-IV I-III for rated mains voltage ≤450 V rms I-III
Climatic Classication 55/100/21 55/100/21 Pollution Degree (DIN VDE 0110/1.89) 2 2 Maximum Working Insulation Voltage V
630 560 V peak
IORM
Input to Output Test Voltage, Method b† VPR 1181 1050 V peak V
x 1.875 = VPR, 100% Production
IORM
Test with tm = 1 sec, Partial Discharge < 5 pC Input to Output Test Voltage, Method a† VPR 945 840 V peak
V
x 1.5 = VPR, Type and Sample Test,
IORM
tm = 60 sec, Partial Discharge < 5 pC Highest Allowable Overvoltage† V
(Transient Overvoltage, t
= 10 sec)
ini
6000 4000 V peak
IOTM
Safety Limiting Values (Maximum values allowed in the event of a failure, also see Thermal Derating curve, Figure 11.) Case Temperature TS 175 150 °C Input Current I Output Power P
Insulation Resistance at TS, V10 = 500 V RIO ≥10
230 150 mA
S,INPUT
600 600 mW
S,OUTPUT
9
≥109 Ω
†Refer to the front of the optocoupler section of the Isolation and Control Component Designer’s Catalog, under Product Safety Regulations sec­tion IEC/EN/DIN EN 60747-5-2, for a detailed description. Note: These optocouplers are suitable for “safe electrical isolation” only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits.
Note: The surface mount classication is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
Parameter Symbol Min. Max. Units
Storage Temperature TS –55 125 °C
Ambient Operating Temperature TA –40 +100 °C
Supply Voltages V
Input Voltage VI –0.5 V
Output Voltage VO –0.5 V
DD1
, V
0 6.0 Volts
DD2
+0.5 Volts
DD1
+0.5 Volts
DD2
Input Current II –10 +10 mA
Average Output Current IO 10 mA
Lead Solder Temperature 260°C for 10 sec., 1.6 mm below seating plane
Solder Reow Temperature Prole See Solder Reow Temperature Prole Section
Recommended Operating Conditions
Parameter Symbol Min. Max. Units
Ambient Operating Temperature TA –40 +100 °C
Supply Voltages V
Logic High Input Voltage VIH 2.0 V
DD1
, V
4.5 5.5 V
DD2
DD1
V
Logic Low Input Voltage VIL 0.0 0.8 V
Input Signal Rise and Fall Times tr, tf 1.0 ms
6
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