Avago ADNS-3050 User Manual

ADNS-3050

Entry-level Gaming Optical Navigation Sensor

Data Sheet

Description

The Avago Technologies ADNS-3050 is a small form factor entry-level gaming optical navigation sensor. It is housed in an 8-pin staggered dual in-line package (DIP). It is capable of high-speed motion detection typically at 60ips and acceleration up to 20g; suitable for both wired and wireless gaming navigation system. The low power management in wireless mode can be customized to suit user preferences. In addition, it has an on-chip oscillator and LED driver to minimize external components.

The ADNS-3050 sensor along with the ADNS-5110-001 lens, ADNS-5200 clip, and HLMP-EG3E red LED forms a complete and compact mouse tracking system. There are no moving parts, which translates to high reliability and less maintenance for the end user. Precision optical alignment is not required, thus facilitating high volume assembly.

Theory of Operation

The ADNS-3050 is based on Optical Navigation Technology, which measures changes in position by optically acquiring sequential surface images (frames) and mathematically determining the direction and magnitude of movement. The ADNS-3050 contains an Image Acquisition System (IAS), a Digital Signal Processor (DSP), and a four wire serial port. The IAS acquires microscopic surface images via the lens and illumination system. These images are processed by the DSP to determine the direction and distance of motion. The DSP calculates the ΔX and Δy relative displacement values. An external microcontroller reads and translates the ΔX and Δy information from the sensor serial port into PS2, USB, or RF signals before sending them to the host PC.

Features

Small Form Factor Package - 8-pin DIP

Operating Voltage: 2.8V-3.0V

High Speed Motion Detection at typical of 60ips and acceleration up to 20g.

Selectable Resolutions up to 2000cpi

Four wire Serial Port Interface

External Interrupt Output for Motion Detection

Internal Oscillator — no clock input needed

On-chip LED driver

Minimal number of passive components

Programmable power-saving modes for selectable wired or wireless application

Customizable response time and downshift time for rest modes

Configurable LED operating modes and drive current

Applications

Wired and Wireless Optical gaming mice and trackballs

Integrated input devices

Battery-powered input devices

NOTE: The ADNS-3050 sensor is not designed for use with blue LED navigation system.

Pinout of ADNS-3050 Optical Mouse Sensor

Input/

Pin

Name

Output

Description

1

MISO

O

Serial Data Output

(Master In/Slave Out)

2

LED

I

LED Illumination Control Input

3

MOTION

O

Motion Interrupt Output

(Active low,)

4

NCS

I

Chip Select

(Active low)

5

SCLK

I

Serial Clock Input

6

GND

I

Ground

7

VDD

I

Supply Voltage

8

MOSI

I

Serial Data Input

(Master Out/Slave In)

Figure 2. Package Outline Drawing

			XYYWWZ
	5	SCLK
	6	GND
			A3050
	7	VDD
	8	MOSI

Pin 1

Figure 1. Package Outline Drawing (Top View)

4 NCS

3 MOTION

2 LED

1 MISO

CAUTION: It is advised that normal static precautions be taken in handling and assembling of this component to prevent damage and/or degradation which may be induced by ESD.

2

Overview of Optical Mouse Sensor Assembly

Avago Technologies provides an IGES file drawing describing the base plate molding features for lens and PCB alignment. The ADNS-3050 sensor is designed for mounting on a through-hole PCB. There is an aperture stop and features on the package that align to the lens. The ADNS-5110-001 lens provides optics for the imaging of the surface as well as illumination of the surface at the optimum angle. Features on the lens align it to the sensor, base plate, and clip with the LED. The ADNS-5200 clip holds the LED in relation to the lens. The LED must be inserted into the clip and the LED‘s leads formed prior to loading on the PCB.

The HLMP-EG3E red LED is recommended for illumination.

Notes:

1.Dimensions in millimeter/inches

2.View from component side of PCB (or top view of mouse)

Figure 3. Recommended PCB Mechanical Cutouts and Spacing

3

TOP VIEW

CROSS SECTION SIDEVIEW

Important Note: Pin 1 of sensor should be located nearest to the LED Figure 4. 2D Assembly drawing of ADNS-3050 (Top and Side View)

Note:

A – Distance from object surface to lens reference plane B – Distance from object surface to sensor reference plane

Figure 5. Distance from lens reference plane to tracking surface (Z)

4

HLMP-EG3E LED

ADNS-5200 LED Clip

ADNS-3050 (Sensor)

Customer supplied PCB

ADNS-5110-001

Customer supplied base plate with recommended alignment features per IGES drawing

Important Note: IR LED is recommended for lower power consumption.

Figure 6. Exploded View of Assembly

PCB Assembly Considerations

1.Insert the sensor and all other electrical components into PCB.

2.Insert the LED into the assembly clip and bend the leads 90 degrees.

3.Insert the LED clip assembly into PCB.

4.This sensor package is only qualified for wave-solder process.

5.Wave solder the entire assembly in a no-wash solder

process utilizing solder fixture. The solder fixture is needed to protect the sensor during the solder process. It also sets the correct sensor-to-PCB distance as the lead shoulders do not normally rest on the PCB surface. The fixture should be designed to expose the sensor leads to solder while shielding the optical aperture from direct solder contact.

6.Place the lens onto the base plate.

7.Remove the protective Kapton tape from optical aperture of the sensor. Care must be taken to keep contaminants from entering the aperture. Recommend not to place the PCB facing up during the entire mouse assembly process. Recommend to hold the PCB first vertically for the Kapton removal process.

8.Insert PCB assembly over the lens onto the base plate aligning post to retain PCB assembly. The sensor aperture ring should self-align to the lens.

5

9.The optical position reference for the PCB is set by the base plate and lens. Note that the PCB motion due to button presses must be minimized to maintain optical alignment.

10.Install mouse top case. There MUST be a feature in the top case to press down onto the PCB assembly to ensure all components are interlocked to the correct vertical height.

ADNS-3050

VDD

CONTROLAND

REGISTERS

NCS

POWER

ANDPORT

SCLK

GND

IMAGE ARRAY

MOSI

MISO

DSP

SERIAL

LED

DRIVE

MOTION

LED

OSCILLATOR

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Figure 8. Schematic diagram for interface between ADNS-3050 and microcontroller with HLMP-EG3E Red LED on a corded solution NOTE: The ADNS-3050 Optical Mouse Sensor is not designed for use with blue LED navigation system.

6

Notes:

Pads for current

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measurement.

Short by default.

P1

PAD2

SW1

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NOTE:

R1= R2 x {(Vo/Vfb) -1}

R1 = 215K x {(Vo/500mV) -1}

L1

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PCB Notes: pin

9,24,34,25,26,28,11,17,18, 19, need to short track if need to connect to GND plane.

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Notes:

Notes:

1. 50 ohm trace

(highlighted trace)

10uF input cap

E1

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9		VDD1: MCU Supply
		VDD2: RF Supply
		VDD3: Sensor Supply

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Figure 9. Schematic diagram for interface between ADNS-3050 and microcontroller with HLMP-EG3E Red LED on a wireless solution NOTE: The ADNS-3050 Optical Mouse Sensor is not designed for use with blue LED navigation system.

7

Design Considerations for Improved ESD Performance

For improved electrostatic discharge performance, typical creepage and clearance distance are shown in the table below. Assumption: base plate construction is as per the Avago Technologies’ supplied IGES file and ADNS-5110- 001 lens. Note that the lens material is polycarbonate or polystyrene HH30. Therefore, cyanoacrylate based adhesives or other adhesives that may damage the lens should NOT be used.

ADNS-5110-001 Lens	Typical Distance (mm)
Creepage	15.43
Clearance	7.77

Table 1. Absolute Maximum Ratings

Regulatory Requirements

Passes FCC B and worldwide analogous emission limits when assembled into a mouse with shielded cable and following Avago’s recommendations.

Passes IEC-1000-4-3 radiated susceptibility level when assembled into a mouse with shielded cable and following Avago’s recommendations.

Passes EN61000-4-4/IEC801-4 EFT tests when assembled into a mouse with shielded cable and following Avago recommendations.

Provides sufficient ESD creepage/clearance distance to withstand discharge up to 15KV when assembled into a mouse according to usage instructions above.

Parameter	Symbol	Minimum	Maximum	Units	Notes
Storage Temperature	TS	-40	85	C
Operating Temperature	TA	-15	55	C
Lead Solder Temperature	TSOLDER		260	C	For 7 seconds, 1.6mm below seating plane.
Supply Voltage	VDD	-0.5	3.7	V
ESD (Human Body Model)			2	kV	All pins
Input Voltage	VIN	-0.5	VDD + 0.5	V	All I/O pins
Output Current	Iout		7	mA	MISO pin

Table 2. Recommended Operating Condition

Parameter	Symbol	Min	Typ.	Max	Units	Notes
Operating Temperature	TA	0		40	C
Power Supply Voltage	VDD	2.8		3.0	V
Power Supply Rise Time	tRT	0.005		100	ms	0 to VDD min
Supply Noise (Sinusoidal)	VNA			100	mVp-p	10kHz —50MHz
Serial Port Clock Frequency	fSCLK			1	MHz	50% duty cycle
Distance from Lens Reference	Z	2.3	2.4	2.5	mm
Plane to Tracking Surface
Speed	S		60		ips
Acceleration	A			20	g	In run mode
Load Capacitance	Cout			100	pF	MISO

8

Table 3. AC Electrical Specifications

Electrical characteristics over recommended operating conditions. Typical values at 25 °C, VDD = 2.8 V.

Parameter	Symbol	Min.	Typ.	Max.	Units	Notes
Motion Delay after Reset	tMOT-RST			50	ms	From RESET register write to valid motion
Power Down	tPD			50	ms	From PD active to low current (when bit 1
						of register 0x0d is set)
Wake from Power Down	tWAKEUP	50		55	ms	From PD inactive to valid motion (when
						write 0x5a to register 0x3a)
MISO Rise Time	tr-MISO		40	200	ns	CL = 100 pF
MISO Fall Time	tf-MISO		40	200	ns	CL = 100 pF
MISO Delay after SCLK	tDLY-MISO			120	ns	From SCLK falling edge to MISO data valid,
						no load condition
MISO Hold Time	thold-MISO	500		1/fSCLK	ns	Data held until next falling SCLK edge
MOSI Hold Time	thold-MOSI	200			ns	Amount of time data is valid after SCLK
						rising edge
MOSI Setup Time	tsetup-MOSI	120			ns	From data valid to SCLK rising edge
SPI Time between	tSWW	30			μs	From rising SCLK for last bit of the first data
Write Commands						byte, Commands to rising SCLK for last bit
						of the second data byte
SPI Time between	tSWR	20			μs	From rising SCLK f or last bit of the first
Write and Read Command						data byte, to rising SCLK for last bit of the
						second address byte
SPI Time between Read and	tSRW	250			ns	From rising SCLK for last bit of the first data
Subsequent Commands	tSRR					byte, to falling SCLK for the first bit of the
						next address
SPI Read Address-Data Delay	tSRAD	4			μs	From rising SCLK for last bit of the address
						byte, to falling SCLK for first bit of data
						being read
NCS to SCLK Active	tNCS-SCLK	120			ns	From NCS falling edge to first SCLK falling
						edge
SCLK to NCS Inactive	tSCLK-NCS	120			ns	From last SCLK rising edge to NCS rising
(for Read Operation)						edge, for valid MISO data transfer
SCLK to NCS Inactive	tSCLK-NCS	20			μs	From last SCLK rising edge to NCS rising
(for Write Operation)						edge, for valid MOSI data transfer
NCS to MISO high-Z	tNCS-MISO			250	ns	From NCS rising edge to MISO high-Z state
Transient Supply Current	IDDT			60	mA	Max supply current during a VDD ramp
						from 0 to VDD

9