ATMEL TS68302VR16, TS68302VA16, TS68302MRB-C16, TS68302MAB-C16, TS68302MA16 Datasheet

...

Features

• TS68000/TS68008 Microprocessor Core Supporting a 16- or 8-bit TS68000 Family

• System Integration Block Including:

– Independent Direct Memory Access (IDMA) Controller – Interrupt Controller with Two Modes of Operation – Parallel Input/output (I/O) Ports, some with Interrupt Capability – On-chip Usable 1152 bytes of Dual-port Random-access Memory (RAM) – Three Timers, including a Watchdog Timer – Four Programmable Chip-select Lines with Wait-state Logic – Programmable Address Mapping of Dual-port RAM and IMP Registers – On-chip Clock Generator with an Output Clock Signal –System Control:

System Control Register Bus Arbitration Logic with Low Interrupt Latency Support Hardware Watchdog for Monitoring Bus Activity Low Power (Standby) Modes Disable CPU Logic (TS68000) Freeze Control for Debugging Selected On-chip Peripherals DRAM Refresh Controller

• Communications Processor Including:

– Main Controller (RISC Processor) – Three Full-duplex Serial Communication Controllers (SCCs) – Six Serial Direct Memory Access (SDMA) Channels Dedicated to the Three SCCs – Flexible Physical Interface Accessible by SCCs for Interchip Digital Link (IDL)

General Circuit Interface (GCI, see note), Pulse Code Modulation (PCM), and Nonmultiplexed Serial Interface (NMSI) Operation

– Serial Communication Port (SCP) for Synchronous Communication, Clock Rate up

to 4.096 MHz

– Serial Management Controllers (SMCs) for IDL and GCI Channels

• Frequency of Operation: 16.67 MHz

• Power Supply: 5 V

± 10%

Integrated Multiprotocol Processor (IMP)

TS68302

Description

The IMP is a very large-scale integration (VLSI) device incorporating the main building blocks needed for the design of a wide variety of controllers. The device is especially suitable to applications in the communications industry. The IMP is the first device to offer the benefits of a closely coupled, industry-standard, TS68000/TS68008 microprocessor core and a flexible communications architecture. This multichannel communications device may be configured to support a number of popular industry interfaces, including those for the integrated services digital network (ISDN) basic rate and terminal adapter applications. Through a combination of architectural and programmable features, concurrent operation of different protocols is easily achieved using the IMP. Data concentrators, line cards, bridges, and gateways are examples of suitable applications for this versatile device.

The IMP is a high-density complementary metal-oxide semiconductor (HCMOS) device consisting of a TS68000/TS68008 microprocessor core, a system integration block (SIB), and a communications processor (CP). The TS68302 block diagram is shown in Figure 1.

Note: GCI is sometimes referred to as IOM2.

Rev. 2117A–HIREL–11/02

Screening/Quality

This product is manufactured in full compliance with either:

• MIL-STD-883 (class B)

• DESC. Drawing 5962-93159

• Or according to Atmel standards

R suffix

PGA 132

(Ceramic Pin Grid Array)

(Ceramic Quad Flat Pack)

A suffix

CERQUAD 132

Introduction The TS68302 integrated multiprotocol processor (IMP) is a very large-scale integration

(VLSI) device incorporating the main building blocks needed for the design of a wide variety of controllers. The device is especially suitable to applications in the communications industry. The IMP is the first device to offer the benefits of a closely coupled, industry-standard TS68000 microprocessor core and a flexible communications architecture. The IMP may be configured to support a number of popular industry interfaces, including those for the Integrated Services Digital Network (ISDN) basic rate and terminal adapter applications. Concurrent operation of different protocols is easily achieved through a combination of architectural and programmable features. Data concentrators, line cards, bridges, and gateways are examples of suitable applications for this device.

The IMP is a high-density complementary metal-oxide semiconductor (HCMOS) device consisting of a TS68000 microprocessor core, a system integration block (SIB), and a communications processor (CP).

Figure 1 is a block diagram of the TS68302. The processor can be divided into two main sections: the bus controller and the micromachine. This division reflects the autonomy with which the sections operate.

TS68302

2117A–HIREL–11/02

Figure 1. TS68302 Block Diagram

TS68000 BUS

TS68302

TS68000/TS68008 CORE

ON-CHIP PERIPHERALS BUS INTERFACE UNIT

INTERRUPT

CONTROLLER

(1 CHANNEL)

CONTROLLER

IDMA

DRAM

REFRESH

(6 CHANNELS)

MAIN

(RISC)

SDMA

BUS ARBITER

TIMERS (3)

PARALLEL I/O

PERIPHERAL BUS

SMC (2) SCC1 SCC2 SCC3 SCP

SERIAL CHANNELS PHYSICAL INTERFACE

1152 BYTES DUAL-PORT

STATIC RAM

CHIP-SELECT

AND WAIT-

STATE LOGIC

SYSTEM INTEGRATION BLOCK

SYSTEM

CONTROL

CLOCK

GENERATOR

2117A–HIREL–11/02

COMMUNICATIONS PROCESSOR

I/O PORTS AND PIN ASSIGNEMENTS

Pin Assignments Figure 2. PGA Terminal Designation

PB10 TIN1

CS3 TOUT2

CS2

CS0

FC2

FC0

GND

A10

A11

A14

PB11

RMC

CS1

VDD

GND

A13

A18

A21

IACK1

TIN2

GND

IAC

GND

FC1

A12

A17

A19

A22

GND

VDD

TOUT1

PB9

PB8

VDD

A15

GND

A20

GND

UDS

R/W VDDEXTAL

IACK7

AS CLK0

LDS

IACK6

WDOG

TS68302

BOTTOM VIEW

A16

D14

A23

D13

VDD

D12

D15

12345678910111213

Figure 3. CERQUAD Terminal Designation

GND

XTAL

D11

D10

GND

IPL1 IPL2 RESET HALTRCLK1

IPL0

VDD

BERR BR

AVEC

DTACK

RXD2

TXD2

CTS1

D4 D1

BGACK

NC1

BCLR CD3

VDD

TXD1 BUSW

BRG1

GND

FRZ

PA12

TXD3

CD2

TCLK2 VDD

CD1

GND

RTS3

TCLK1

RTS1

DISCPUNC3

DACK

DONE

GND

DREQ

TCLK3RCLK3

RXD3SDS2

GND

RCLK2

RTS2

CTS3

CTS2

RXD1

VDD

A16 A17 A18 A19

GND

A20 A21 A22

A23 VDD GND

D15

D14

D13

D12 GND

D11

D10

VDD

GND

CTS3

CD1

A15

A14

A13

A12

GND

A11

A10A9A8A7A6A5A4

D9 D8

D7 D6 D5 D4

D3 D2 D1 D0

GNDA3A2A1FC0

VDD

FC1

FC2

CS0

CS1

68302

CERQUAD132

(window frame down)

Top VIEW

GND

CS2

CS3

RMC

IAC

PB11

PB10

PB9

PB8

117

WDOG

GND TOUT2 TIN2 TOUT1 VDD TIN1 IACK1 IACK6 IACK7 GND UDS LDS AS R/W GND XTAL EXTAL VDD CLK0 IPL0 IPL1 IPL2 BERR AVEC RESET HALT BR NC1 BGACK BG BCLR DTACK GND

CD2

CTS2

RTS2

VDD

SDS2

TXD3

RXD3

TCLK3

RCLK3

GND

TXD2

RXD2

TCLK2

RCLK2

GND

CTS1

RXD1

TS68302

PA12

DACK

DREQ

FRZ

DONE

NC3

BUSW

DISCPU

CD3

BRG1

RTS3

RTS1

TXD1

TCLK1

RCLK1

VDD

2117A–HIREL–11/02

Figure 4. Functional Signal Groups

NMSI1/ISDN I/F

RXD1/L1RXD

TXD1/L1TXD

RCLK1/L1CLK

TCLK1/L1SY0/SDS1

CD1/L1SY1

CTS1/L1RG

RTS1/L1RQ/GCIDCL

BRG2/SDS2/PA7

BRG1

RXD2/PA0

TXD2/PA1

RCLK2/PA2

TCLK2/PA3

CTS2/PA4

RTS2/PA5

CD2/PA6

RXD3/PA8

TXD3/PA9

RCLK3/PA10

TCLK3/PA11

CTS3/SPRXD

RTS3/SPTXD

CD3/SPCLK

BRG3/PA12

DREQ/PA13

DACK/PA14

DONE/PA15

IACK7/PB0

IACK6/PB1

IACK1/PB2

TIN/PB3

TOUT1/PB4

TIN2/PB5

TOUT2/ PB6

WDOG/PB7

PBIO (INTERRUPT)

PB8

PB9

PB10

PB11

NMSI2/PIO

NMSI3/SCP/PIO

IDMA/PAIO

IACK/PBIO

TIMER/PBIO

TS68302

IMP

CLOCKS

ADDRESS BUS

DATA BUS

BUS CONTROL

BUS ARBITRATON

SYSTEM CONTROL

INTERRUPT CONTROL

CHIP SELECT

TESTING

EXTAL

XTAL

CLKO

A23-A1

D15-D0

R/W

UDS/A0

LDS/DS

DTACK

RMC/IOUT1

IAC

BCLR

BR BG

BGACK

RESET

HALT

BERR BUSW DISCPU

IPL0/IRQ1

IPL1/IRQ6

IPL2/IRQ7

FC0

FC1

FC2

AVEC

CS0/IOUT2

CS3-CS1

FRZ

NC(2)

GND(13)

VDD(8)

TS68302

/ IOUT0

2117A–HIREL–11/02

Signal Descriptions The input and output signals of the TS68302 are organized into functional groups as

shown in Table 1. Refer to TS68302 Integrated Multiprotocol Processor User’s Manual, for detailed information on the TS68302 signals.

Table 1. Signal Definitions

Functional Group Signals Number

Clocks XTAL, EXTAL, CLKO 3

System Control RESET

Address Bus A23-A1 23

Data Bus D15-D0 16

Bus Control AS

Bus Control RMC

Bus Arbitration BR

Interrupt Control IPL2-IPL0, FC2-FC0, AVEC 7

NMSI1/ISDN I/F RXD, TXD, RCLK, TCLK, CD

NMSI2/PIO RXD, TXD, RCLK, TCLK, CD

NMSI3/SCP/PIO RXD, TXD, RCLK, TCLK, CD, CTS, RTS, PA12 8

IDMA/PAIO DREQ

IACK/PBIO IACK7

Timer/PBIO TIN2, TIN1, TOUT2, TOUT1, WDOG 5

PBIO PB11-PB8 4

Chip Select CS3

Te st i n g F RZ (2 Spare) 3

GND Ground connection 13

, HALT, BERR, BUSW, DISCPU 5

, R/W, UDS/A0, LDS/DS, DTACK 5

, IAC, BCLR 3

, BG, BGACK 3

, CTS, RTS, BRG1 8

, CTS, RTS, SDS2 8

, DACK, DONE 3

, IACK6, IACK1 3

-CS0 4

Power supply 8

Scope This drawing describes the specific requirements for the processor TS68302, 16.67

MHz, in compliance either with MIL-STD-883 class B or with Atmel standards.

Applicable Documents

MIL-STD-883 1. MIL-STD-883: test methods and procedures for electronics.

2. MIL-M-38535: general specifications for microcircuits.

3. Desc Drawing: 5962-93159 (planned).

Requirements

General The microcircuits are in accordance with the applicable document and as specified

herein.

TS68302

2117A–HIREL–11/02

TS68302

Design and Construction

Terminal Connections Depending on the package, the terminal connections shall be as shown in Figure 2 and

Figure 3.

Lead Material and Finish Lead material and finish shall be any option of MIL-M-38535.

Package The macrocircuits are packaged in hermetically sealed ceramic packages, which con-

form to case outlines of MIL-M-38535 appendix A (when defined):

• 132-pin Ceramic Pin Grid Array (PGA),

• 132-pin Ceramic Quad Flat Pack (CERQUAD).

The precise case outlines are described in Figure 2 and Figure 3.

Electrical Characteristics

Table 2. Absolute Maximum Ratings

Symbol Parameter Min Max Unit

Power Dissipation (typical at 16.67 MHz)

Power Dissipation (typical at 8 MHz)

Low Power Mode Dissipation (typical at 16.67 MHz)

Lowest Power Mode Dissipation (typical at 16.67 MHz)

Lowest Power Mode Dissipation (typical at 50 MHz)

Notes: 1. The values shown are typical. The typical value varies as shown, based on how many IMP on-chip peripherals are enabled

and the rate at which they are clocked.

2. LPREC = 0. Divider = 2.

3. LPREC = 1. Divider = 1024.

4. The stated frequency must be externally applied to EXTAL only after the IMP has been placed in the lowest power mode with LPREC = 1. The 68000 core is not specified to operate at this frequency, but the rest of the IMP is. In this configuration, the user does not divide the clock internally using the LPCD4-LPCD0 bits in the system control register.

(1)

(2)

(3)

(4)

53 64 mA

26 31 mA

36 mA

32 mA

1mA

Unless otherwise stated, all voltages are referenced to the reference terminal (see Table 1).

Table 3. Recommended Condition of Use

Symbol Parameter Min Max Unit

case

tf(c) Clock Fall Time Resistance - Figure 5 5 ns

cyc

2117A–HIREL–11/02

Supply Voltage 4.5 5.5 V

Low Level Input Voltage -0.3 +0.5 V

High Level Input Voltage 2.4 5.5 V

Operating Temperature -55 +125 °C

Clock Frequency - See Figure 5 8 16.67 MHz

Cycle Time - See Figure 5 60 125 ns

This device contains protective circuitry to protect the inputs against damage due to high static voltages or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (e.g., either GND or V

Figure 5. Clock Input Timing Diagram

cyc

2.0V

0.8V

tr (C) tf (C)

Note: Timing measurements are referenced to and from a low voltage of 0.8V and a voltage of 2.0V, unless otherwise noted. The volt-

age swing through this range should start outside, and pass through, the range such that the rise or fall will be linear between

0.8V and 2.0V.

Table 4. Thermal Characteristics at 25°C

Package Symbol Parameter Value Unit

PGA 132 θ

CERQUAD 132 θ

Thermal Resistance - Ceramic Junction To Ambient Thermal Resistance - Ceramic Junction To Case

Power Considerations The average chip-junction temperature, T

= TA + (PD ⋅ θJA) (1)

= Ambient Temperature, °C

= Package Thermal Resistance, Junction-to-Ambient, °C/W

= P

INT

I/O

Note: For TA = 70°C and PD = 0.5 W at 12.5 MHz Tj = 88°C.

For most applications P

An approximate relationship between P

Solving equations (1) and (2) for K gives:

where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring P values of P value of T

+ P

INT

I/O

= ICC ⋅ VCC, Watts - Chip Internal Power

= Power Dissipation on Input and Output pins - user determined

< 0,30 P

I/O

= K ÷ (TJ + 273) (2)

K = P

⋅ (TA + 273) + θJA ⋅ PD2 (3)

(at equilibrium) for a known TA. Using this value of K, the

and TJ can be obtained by solving equations (1) and (2) iteratively for any

and can be neglected.

INT

, in °C can be obtained from:

and TJ (if P

is neglected) is:

I/O

°C/W °C/W

TS68302

2117A–HIREL–11/02

TS68302

The total thermal resistance of a package (θJA) can be separated into two components,

and θCA, representing the barrier to heat flow from the semiconductor junction to the

package (case), surface ( terms are related by the equation:

= θJC + θCA (4)

is device-related and cannot be influenced by the user. However, θCA is user-depen-

dent and can be minimized by such thermal management techniques as heat sinks, ambient air cooling and thermal convection. Thus, good thermal management on the part of the user can significantly reduce

tution of temperature.

for θJA in equation (1) will result in a lower semiconductor junction

) and from the case to the outside ambient (θCA). These

so that θJA approximately equals θJC. Substi-

Mechanical and Environment

The microcircuits shall meet all mechanical environmental requirements of either MILSTD-883 for class B devices or Atmel standards.

Marking The document that defines the marking is identified in the related reference documents.

Each microcircuit is legible and permanently marked with the following information as minimum:

• Atmel Logo

• Manufacturer’s part number

• Class B identification

• Date-code of inspection lot

• ESD identifier if available

• Country of manufacturing

Quality Conformance Inspection

DESC/MIL-STD-883 Those quality levels are in accordance with MIL-M-38535 and method 5005 of MIL-

STD-883. Groups A and B inspections are performed on each production lot. Groups C and D inspection are performed on a periodical basis.

Electrical Characteristics

General Requirements All static and dynamic electrical characteristics specified. For inspection purposes, refer

to relevant specification:

• DESC see “DESC/MIL-STD-883” on page 9

Table 5 and Table 6: Static Electrical Characteristics for all electrical variants. Test methods refer to IEC 748-2 method number, where existing.

Table 7 and Table 8: Dynamic Electrical Characteristics. Test methods refer to this specification.

2117A–HIREL–11/02

Table 5. DC Electrical Characteristics

= 5.0 Vdc ± 10%; GND = 0 Vdc; Tc = -55°C/+125°C or -40°C/+85°C

Symbol Parameter Min Max Unit

CIH

CIL

TSI

Input High Voltage (except EXTAL) 2.0 V

Input Low Voltage (except EXTAL) VSS - 0.3 0.8 V

Input High Voltage (EXTAL) 4.0 V

Input Low Voltage (EXTAL) VSS - 0.3 0.6 V

Input Leakage Current 20 µA

Input Capacitance All Pins 15 pF

Three-state Leakage Current (2.4V/0.5V) 20 µA

Open Drain Leakage Current (2.4V) 20 µA

Output High Voltage (IOH = 400 µA) VDD - 1.0 V

Output Low Voltage

(IOL = 3.2 mA) A1-A23, PB0-PB11, FC0-FC3, CS0-CS3, IAC, AVEC, BG, RCLK1,

RCLK2, RCLK3, TCLK1, TCLK2, TCLK3, RTS1 SDS2, PA12, RXD2, RXD3, CTS2

= 5.3 mA) AS, UDS, LDS, R/W, BERR, BGACK, BCLR, DTACK, DACK, RMC,

, D0-D15, RESET

RMC

, CD2, CD3, DREQ

, RTS2, RTS3,

0.5 V

(IOL = 7.0 mA) TXD1, TXD2, TXD3 0.5 V

(IOL = 8.9 mA) BR, DONE, HALT, (BR as output) 0.5 V

= 3.2 mA) CLKO 0.4 V

CLK

GCI

ALL

Output Drive CLKO 50 pF

Output Drive ISDN I/F (GCI mode) 150 pF

Output Drive All Other Pins 130 pF

TS68302

2117A–HIREL–11/02

TS68302

Table 6. DC Electrical Characteristics - NMSI1 in IDL mode

Symbol Parameter Condition Min Nom Max Unit

Power 4.5 5.0 5.5 V

Common 0 0 0 V

T Temperature Operating range -55 25 +125 °C

Input Pin Characteristics: L1CLK, L1SY1, L1R x D, L1GR

Input Low Level Voltage (% of VDD) -10% +20% V

Input High Level Voltage VDD - 20% VDD + 10% V

Input Low Level Current Vin = V

Input High Level Current Vin = V

±10 µA

Output Pin Characteristics: L1T x D, SDS1-SDS2, L1RQ

Output Low Level Voltage IOL = 2.0 mA 0 0.50 V

Output High Level Voltage IOH = 2.0 mA VDD - 0.5 V

2117A–HIREL–11/02

Dynamic (Switching) Characteristics

Figure 6. Clock Timing Diagram

= 4V

CIH

EXTAL

= 0.6V

CIL

The limits and values given in this section apply over the full case temperature range 55°C to +125°C or -40°C to +85°C depending on selection see “Ordering Information” on page Reference 2 and VCC in the range 4.5V to 5.5V V

= 0.5V and VIH = 2.4V.

The INTERVAL numbers (NUM) refer to the timing diagrams. See Figure 6 to Figure 25.

The AC specifications presented consist of output delays, input setup and hold times, and signal skew times. All signals are specified relative to an appropriate edge of the clock (CLKO pin) and possibly to one or more other signals.

CLKO

Table 7. AC Electrical Specifications - Clock Timing (see Figure 7)

Num. Symbol Parameter Min Max Unit

f Frequency of Operation 8 16.67 MHz

2, 3 t

4, 5 t

5a t

Notes: 1. CLKO loading is 50 pF max.

2. CLKO skew from the rising and falling edges of EXTAL will not differ from each other more than 1 ns, if the EXTAL rise time

cyc

, t

equals the EXTAL fall time.

Clock Period (EXTAL) 60 125 ns

Clock Pulse Width (EXTAL) 25 62.5 ns

Clock Rise and Fall Times (EXTAL) 5 ns

EXTAL to CLKO delay

(1)(2)

211ns

TS68302

2117A–HIREL–11/02

TS68302

Table 8. AC Electrical Specifications

IMP Bus Master Cycles (see Figure 7, Figure 8 and Figure 9) f = 16.67 MHz

Num. Symbol Parameter Min Max Unit

11 t

12 t

13 t

14 t

14A t

15 t

16 t

17 t

18 t

20 t

20A t

21 t

22 t

23 t

25 t

26 t

27 t

28 t

29 t

30 t

31 t

32 t

33 t

34 t

35 t

36 t

37 t

37A t

38 t

39 t

CHFCADV

CHADZ

CHAFI

CHSL

AFCVSL

CLSH

SHAFI

DSL

CHCZ

SHRH

CHRH

CHRL

ASRV

AFCVRL

RLSL

CLDO

SHDOI

DOSL

DICL

SHDAH

SHDII

SHBEH

DALD I

, t

RHr

RHf

CHGL

CHGH

BRLGL

BRHGH

GALGH

GALBRH

GLZ

Clock high to FC, address valid 45 ns

Clock high to address, data bus high impedance (maximum) 50 ns

Clock high to address, FC invalid (minimum) 0 ns

Clock high to AS, DS asserted

Address, FC valid to AS, DS asserted (read)/AS asserted

(2)

(write)

Clock low to AS, DS negated

AS, DS negated to address, FC invalid

AS (and DS read) width asserted

DS width asserted, write

AS, DS width negated

(2)

(1)

330ns

15 ns

(1)

(2)

15 ns

120 ns

60 ns

30 ns

60 ns

Clock high to control bus high impedance 50 ns

AS, DS negated to R/W invalid

Clock high to R/W high

Clock high to R/W low

(1)

AS asserted to R/W low (write)

Address FC valid to R/W low (write)

R/W low to DS asserted (write)

(2)

(2)(3)

(2)

15 ns

30 ns

10 ns

(2)

15 ns

30 ns

Clock low to data-out valid 30 ns

AS, DS, negated to data-out invalid (write)

Data-out valid to DS asserted (write)

Data-in valid to clock low (Setup time on read)

AS, DS negated to DTACK negated (asynchronous hold)

(2)

(4)

(2)

15 ns

7ns

0 110 ns

AS, DS negated to data-in invalid (hold time on read) 0 ns

AS, DS negated to BEER negated 0 ns

DTACK asserted to data-in valid (setup time)

(2)(4)

50 ns

HALT and RESET input transition time 150 ns

Clock high to BG asserted 30 ns

Clock high to BG negated 30 ns

BR asserted to BG asserted 2.5 4.5 clks

BR negated to BG negated

(5)

1.5 2.5 clks

BGACK asserted to BG negated 2.5 4.5 clks

BGACK asserted to BG negated

BG asserted to control, address, data bus high impedance

negated)

(AS

(6)

10 1.5 ns/clks

50 ns

BG width negated 1.5 clks

2117A–HIREL–11/02

Table 8. AC Electrical Specifications

IMP Bus Master Cycles (see Figure 7, Figure 8 and Figure 9) f = 16.67 MHz (Continued)

Num. Symbol Parameter Min Max Unit

44 t

46 t

47 t

48 t

53 t

55 t

56 t

57 t

57A t

58 f

58A t

60 t

61 t

62 t

63 t

64 t

SHVPH

GAL

ASI

BELDAL

CHDOI

RLDBD

HRPW

GASD

GAFD

RHSD

RHFD

CHBCL

CHBCH

CLRML

CHRMH

RMHGL

AS, DS negated to AVEC negated 0 50 ns

BGACK width low 1.5 clks

Asynchronous input setup time

BERR asserted to DTACK asserted

(4)

(2)(7)

10 ns

Data-out hold from clock high 0 ns

R/W asserted to data bus impedance change 0 ns

HALT/RESET pulse width

(8)

10 clks

BGACK negated to AS, DS, R/W driven 1.5 clks

BGACK negated to FC 1 clks

BR negated to AS, DS, R/W driven

BR negated to FC

(5)

1.5 clks

1clks

Clock high to BCLR asserted 30 ns

Clock high to BCLR negated

(9)

30 ns

Clock low (S0 falling edge during read) to RMC asserted 30 ns

Clock high (S7 rising edge during write) to RMC negated 30 ns

RMC negated to BG asserted

(10)

30 ns

Notes: 1. For loading capacitance of less than or equal to 50 pF, subtract 4 ns from the value given in the maximum columns.

2. Actual value depends on clock period.

3. When AS and R/W are equally loaded (±20%), subtract 5 ns from the values given in these columns.

4. If the asynchronous input setup (#47) requirement is satisfied for DTACK

, the DTACK asserted to data setup time (#31)

requirement can be ignored. The data must only satisfy the data-in to clock low setup time (#27) for the following clock cycle.

5. The TS68302 will negate BG and begin driving the bus if external arbitration logic negates BR before asserting BGACK.

6. The minimum value must be met to guarantee proper operation. If the maximum value is exceeded, BG may be reasserted.

7. If #47 is satisfied for both DTACK

and BERR, #48 may be ignored. In the absence of DTACK, BERR is a synchronous input

using the asynchronous input setup time (#47).

8. For power-up, the TS68302 must be held in the reset state for 100 ms to allow stabilization of on-chip circuit. After the system is powered up #56 refers to the minimum pulse width required to reset the processor.

9. Occurs on S0 of SDMA read/write access when the SDMA becomes bus master.

10. This specification is valid only when the RMCST bit is set in the SCR register.

TS68302

2117A–HIREL–11/02

Figure 7. Read Cycle Timing Diagram

CLKO

FC2-FC0

A23-A1

S0 S1 S2 S3 S4 S5 S6

TS68302

LDS-UDS

R/W

DTACK

DATA IN

BERR/BR

(Note 2)

HALT / RESET

47 47

ASYNCHRONOUS

INPUTS (Note 1)

Notes: 1. Setup time for asynchronous inputs IPL2-IPL0 guarantees their recognition at the next falling edge of the clock.

needs to fall at this time only to ensure being recognized at the end of the bus cycle.

2. BR

3. Timing measurements are reinforced to and from a low voltage of 0.8V and a high voltage of 2.0V, unless otherwise noted. The voltage swing through this range should start outside and pass through the range such that the rise or fall is linear between 0.8V and 2.0V.

2117A–HIREL–11/02

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