• TS68000/TS68008 Microprocessor Core Supporting a 16- or 8-bit TS68000 Family
• System Integration Block Including:
– Independent Direct Memory Access (IDMA) Controller
– Interrupt Controller with Two Modes of Operation
– Parallel Input/output (I/O) Ports, some with Interrupt Capability
– On-chip Usable 1152 bytes of Dual-port Random-access Memory (RAM)
– Three Timers, including a Watchdog Timer
– Four Programmable Chip-select Lines with Wait-state Logic
– Programmable Address Mapping of Dual-port RAM and IMP Registers
– On-chip Clock Generator with an Output Clock Signal
–System Control:
System Control Register
Bus Arbitration Logic with Low Interrupt Latency Support
Hardware Watchdog for Monitoring Bus Activity
Low Power (Standby) Modes
Disable CPU Logic (TS68000)
Freeze Control for Debugging Selected On-chip Peripherals
DRAM Refresh Controller
• Communications Processor Including:
– Main Controller (RISC Processor)
– Three Full-duplex Serial Communication Controllers (SCCs)
– Six Serial Direct Memory Access (SDMA) Channels Dedicated to the Three SCCs
– Flexible Physical Interface Accessible by SCCs for Interchip Digital Link (IDL)
General Circuit Interface (GCI, see note), Pulse Code Modulation (PCM), and
Nonmultiplexed Serial Interface (NMSI) Operation
– Serial Communication Port (SCP) for Synchronous Communication, Clock Rate up
to 4.096 MHz
– Serial Management Controllers (SMCs) for IDL and GCI Channels
• Frequency of Operation: 16.67 MHz
• Power Supply: 5 V
± 10%
DC
Integrated
Multiprotocol
Processor (IMP)
TS68302
Description
The IMP is a very large-scale integration (VLSI) device incorporating the main building
blocks needed for the design of a wide variety of controllers. The device is especially
suitable to applications in the communications industry. The IMP is the first device to
offer the benefits of a closely coupled, industry-standard, TS68000/TS68008 microprocessor core and a flexible communications architecture. This multichannel
communications device may be configured to support a number of popular industry
interfaces, including those for the integrated services digital network (ISDN) basic rate
and terminal adapter applications. Through a combination of architectural and programmable features, concurrent operation of different protocols is easily achieved
using the IMP. Data concentrators, line cards, bridges, and gateways are examples of
suitable applications for this versatile device.
The IMP is a high-density complementary metal-oxide semiconductor (HCMOS)
device consisting of a TS68000/TS68008 microprocessor core, a system integration
block (SIB), and a communications processor (CP). The TS68302 block diagram is
shown in Figure 1.
Note:GCI is sometimes referred to as IOM2.
Rev. 2117A–HIREL–11/02
1
Screening/Quality
This product is manufactured in full compliance with either:
•MIL-STD-883 (class B)
•DESC. Drawing 5962-93159
•Or according to Atmel standards
R suffix
PGA 132
(Ceramic Pin Grid Array)
(Ceramic Quad Flat Pack)
A suffix
CERQUAD 132
IntroductionThe TS68302 integrated multiprotocol processor (IMP) is a very large-scale integration
(VLSI) device incorporating the main building blocks needed for the design of a wide
variety of controllers. The device is especially suitable to applications in the communications industry. The IMP is the first device to offer the benefits of a closely coupled,
industry-standard TS68000 microprocessor core and a flexible communications architecture. The IMP may be configured to support a number of popular industry interfaces,
including those for the Integrated Services Digital Network (ISDN) basic rate and terminal adapter applications. Concurrent operation of different protocols is easily achieved
through a combination of architectural and programmable features. Data concentrators,
line cards, bridges, and gateways are examples of suitable applications for this device.
The IMP is a high-density complementary metal-oxide semiconductor (HCMOS) device
consisting of a TS68000 microprocessor core, a system integration block (SIB), and a
communications processor (CP).
Figure 1 is a block diagram of the TS68302. The processor can be divided into two main
sections: the bus controller and the micromachine. This division reflects the autonomy
with which the sections operate.
ScopeThis drawing describes the specific requirements for the processor TS68302, 16.67
MHz, in compliance either with MIL-STD-883 class B or with Atmel standards.
Applicable
Documents
MIL-STD-8831. MIL-STD-883: test methods and procedures for electronics.
2. MIL-M-38535: general specifications for microcircuits.
3. Desc Drawing: 5962-93159 (planned).
Requirements
GeneralThe microcircuits are in accordance with the applicable document and as specified
herein.
6
TS68302
2117A–HIREL–11/02
TS68302
Design and Construction
Terminal ConnectionsDepending on the package, the terminal connections shall be as shown in Figure 2 and
Figure 3.
Lead Material and FinishLead material and finish shall be any option of MIL-M-38535.
PackageThe macrocircuits are packaged in hermetically sealed ceramic packages, which con-
form to case outlines of MIL-M-38535 appendix A (when defined):
•132-pin Ceramic Pin Grid Array (PGA),
•132-pin Ceramic Quad Flat Pack (CERQUAD).
The precise case outlines are described in Figure 2 and Figure 3.
Electrical Characteristics
Table 2. Absolute Maximum Ratings
SymbolParameterMinMaxUnit
P
P
LP
LP
LP
D
D
D
D
D
Power Dissipation (typical at 16.67 MHz)
Power Dissipation (typical at 8 MHz)
Low Power Mode Dissipation (typical at 16.67 MHz)
Lowest Power Mode Dissipation (typical at 16.67 MHz)
Lowest Power Mode Dissipation (typical at 50 MHz)
Notes: 1. The values shown are typical. The typical value varies as shown, based on how many IMP on-chip peripherals are enabled
and the rate at which they are clocked.
2. LPREC = 0. Divider = 2.
3. LPREC = 1. Divider = 1024.
4. The stated frequency must be externally applied to EXTAL only after the IMP has been placed in the lowest power mode
with LPREC = 1. The 68000 core is not specified to operate at this frequency, but the rest of the IMP is. In this configuration,
the user does not divide the clock internally using the LPCD4-LPCD0 bits in the system control register.
(1)
(1)
(2)
(3)
(4)
5364mA
2631mA
36mA
32mA
1mA
Unless otherwise stated, all voltages are referenced to the reference terminal (see Table 1).
Table 3. Recommended Condition of Use
SymbolParameterMinMaxUnit
V
CC
V
IL
V
IH
T
case
t
(c)Clock Rise Time - See Figure 55ns
r
tf(c)Clock Fall Time Resistance - Figure 55ns
f
c
t
cyc
2117A–HIREL–11/02
Supply Voltage4.55.5V
Low Level Input Voltage-0.3+0.5V
High Level Input Voltage2.45.5V
Operating Temperature-55+125°C
Clock Frequency - See Figure 5816.67MHz
Cycle Time - See Figure 560125ns
7
This device contains protective circuitry to protect the inputs against damage due to high
static voltages or electrical fields; however, it is advised that normal precautions be
taken to avoid application of any voltages higher than maximum-rated voltages to this
high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to
an appropriate logic voltage level (e.g., either GND or V
DD
).
Figure 5. Clock Input Timing Diagram
t
cyc
2.0V
0.8V
tr (C)tf (C)
Note:Timing measurements are referenced to and from a low voltage of 0.8V and a voltage of 2.0V, unless otherwise noted. The volt-
age swing through this range should start outside, and pass through, the range such that the rise or fall will be linear between
0.8V and 2.0V.
Table 4. Thermal Characteristics at 25°C
PackageSymbolParameterValueUnit
PGA 132θ
CERQUAD 132θ
JA
θ
JC
JA
θ
JC
Thermal Resistance - Ceramic Junction To Ambient
Thermal Resistance - Ceramic Junction To Case
Thermal Resistance - Ceramic Junction To Ambient
Thermal Resistance - Ceramic Junction To Case
Power ConsiderationsThe average chip-junction temperature, T
Note:For TA = 70°C and PD = 0.5 W at 12.5 MHz Tj = 88°C.
For most applications P
An approximate relationship between P
Solving equations (1) and (2) for K gives:
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring P
values of P
value of T
+ P
INT
I/O
= ICC ⋅ VCC, Watts - Chip Internal Power
= Power Dissipation on Input and Output pins - user determined
< 0,30 P
I/O
= K ÷ (TJ + 273) (2)
P
D
K = P
⋅ (TA + 273) + θJA ⋅ PD2 (3)
D
(at equilibrium) for a known TA. Using this value of K, the
and TJ can be obtained by solving equations (1) and (2) iteratively for any
D
.
A
D
and can be neglected.
INT
D
33
5
46
2
, in °C can be obtained from:
J
and TJ (if P
is neglected) is:
I/O
°C/W
°C/W
°C/W
°C/W
8
TS68302
2117A–HIREL–11/02
TS68302
The total thermal resistance of a package (θJA) can be separated into two components,
θ
and θCA, representing the barrier to heat flow from the semiconductor junction to the
JC
package (case), surface (
terms are related by the equation:
θ
= θJC + θCA (4)
JA
θ
is device-related and cannot be influenced by the user. However, θCA is user-depen-
JC
dent and can be minimized by such thermal management techniques as heat sinks,
ambient air cooling and thermal convection. Thus, good thermal management on the
part of the user can significantly reduce
θ
tution of
temperature.
for θJA in equation (1) will result in a lower semiconductor junction
JC
θ
) and from the case to the outside ambient (θCA). These
JC
θ
so that θJA approximately equals θJC. Substi-
CA
Mechanical and
Environment
The microcircuits shall meet all mechanical environmental requirements of either MILSTD-883 for class B devices or Atmel standards.
MarkingThe document that defines the marking is identified in the related reference documents.
Each microcircuit is legible and permanently marked with the following information as
minimum:
•Atmel Logo
•Manufacturer’s part number
•Class B identification
•Date-code of inspection lot
•ESD identifier if available
•Country of manufacturing
Quality Conformance
Inspection
DESC/MIL-STD-883Those quality levels are in accordance with MIL-M-38535 and method 5005 of MIL-
STD-883. Groups A and B inspections are performed on each production lot. Groups C
and D inspection are performed on a periodical basis.
Electrical
Characteristics
General RequirementsAll static and dynamic electrical characteristics specified. For inspection purposes, refer
to relevant specification:
•DESC see “DESC/MIL-STD-883” on page 9
Table 5 and Table 6: Static Electrical Characteristics for all electrical variants. Test
methods refer to IEC 748-2 method number, where existing.
Table 7 and Table 8: Dynamic Electrical Characteristics. Test methods refer to this
specification.
Table 6. DC Electrical Characteristics - NMSI1 in IDL mode
SymbolParameterConditionMinNomMaxUnit
V
V
Power4.55.05.5V
DD
Common000V
SS
TTemperatureOperating range-5525+125°C
Input Pin Characteristics: L1CLK, L1SY1, L1R x D, L1GR
V
V
I
IH
I
IH
Input Low Level Voltage(% of VDD)-10%+20%V
IL
Input High Level VoltageVDD - 20%VDD + 10%V
IH
Input Low Level CurrentVin = V
Input High Level CurrentVin = V
SS
DD
±10µA
±10µA
Output Pin Characteristics: L1T x D, SDS1-SDS2, L1RQ
V
OL
V
OH
Output Low Level VoltageIOL = 2.0 mA00.50V
Output High Level VoltageIOH = 2.0 mAVDD - 0.5V
DD
V
2117A–HIREL–11/02
11
Dynamic (Switching)
Characteristics
Figure 6. Clock Timing Diagram
V
= 4V
CIH
EXTAL
V
= 0.6V
CIL
The limits and values given in this section apply over the full case temperature range 55°C to +125°C or -40°C to +85°C depending on selection see “Ordering Information”
on page Reference 2 and VCC in the range 4.5V to 5.5V V
= 0.5V and VIH = 2.4V.
IL
The INTERVAL numbers (NUM) refer to the timing diagrams. See Figure 6 to Figure 25.
The AC specifications presented consist of output delays, input setup and hold times,
and signal skew times. All signals are specified relative to an appropriate edge of the
clock (CLKO pin) and possibly to one or more other signals.
1
2
3
5
4
5a
CLKO
5a
Table 7. AC Electrical Specifications - Clock Timing (see Figure 7)
Num.SymbolParameterMinMaxUnit
fFrequency of Operation816.67MHz
1t
2, 3t
4, 5t
5at
Notes: 1. CLKO loading is 50 pF max.
2. CLKO skew from the rising and falling edges of EXTAL will not differ from each other more than 1 ns, if the EXTAL rise time
cyc
, t
CL
CH
, t
Cr
Cf
CD
equals the EXTAL fall time.
Clock Period (EXTAL)60125ns
Clock Pulse Width (EXTAL)2562.5ns
Clock Rise and Fall Times (EXTAL)5ns
EXTAL to CLKO delay
(1)(2)
211ns
12
TS68302
2117A–HIREL–11/02
TS68302
Table 8. AC Electrical Specifications
IMP Bus Master Cycles (see Figure 7, Figure 8 and Figure 9) f = 16.67 MHz
Num.SymbolParameterMinMaxUnit
6t
7t
8t
9t
11t
12t
13t
14t
14At
15t
16t
17t
18t
20t
20At
21t
22t
23t
25t
26t
27t
28t
29t
30t
31t
32t
33t
34t
35t
36t
37t
37At
38t
39t
CHFCADV
CHADZ
CHAFI
CHSL
AFCVSL
CLSH
SHAFI
SL
DSL
SH
CHCZ
SHRH
CHRH
CHRL
ASRV
AFCVRL
RLSL
CLDO
SHDOI
DOSL
DICL
SHDAH
SHDII
SHBEH
DALD I
, t
RHr
RHf
CHGL
CHGH
BRLGL
BRHGH
GALGH
GALBRH
GLZ
GH
Clock high to FC, address valid 45ns
Clock high to address, data bus high impedance (maximum)50ns
Clock high to address, FC invalid (minimum)0ns
Clock high to AS, DS asserted
Address, FC valid to AS, DS asserted (read)/AS asserted
(2)
(write)
Clock low to AS, DS negated
AS, DS negated to address, FC invalid
AS (and DS read) width asserted
DS width asserted, write
AS, DS width negated
(2)
(1)
330ns
15ns
(1)
(2)
(2)
(2)
15ns
120ns
60ns
30ns
60ns
Clock high to control bus high impedance50ns
AS, DS negated to R/W invalid
Clock high to R/W high
Clock high to R/W low
(1)
(1)
AS asserted to R/W low (write)
Address FC valid to R/W low (write)
R/W low to DS asserted (write)
(2)
(2)(3)
(2)
15ns
30ns
30ns
10ns
(2)
15ns
30ns
Clock low to data-out valid30ns
AS, DS, negated to data-out invalid (write)
Data-out valid to DS asserted (write)
Data-in valid to clock low (Setup time on read)
AS, DS negated to DTACK negated (asynchronous hold)
(2)
(2)
(4)
(2)
15ns
15ns
7ns
0110ns
AS, DS negated to data-in invalid (hold time on read)0ns
AS, DS negated to BEER negated0ns
DTACK asserted to data-in valid (setup time)
(2)(4)
50ns
HALT and RESET input transition time150ns
Clock high to BG asserted30ns
Clock high to BG negated30ns
BR asserted to BG asserted2.54.5clks
BR negated to BG negated
(5)
1.52.5clks
BGACK asserted to BG negated2.54.5clks
BGACK asserted to BG negated
BG asserted to control, address, data bus high impedance
negated)
(AS
(6)
101.5ns/clks
50ns
BG width negated 1.5clks
2117A–HIREL–11/02
13
Table 8. AC Electrical Specifications
IMP Bus Master Cycles (see Figure 7, Figure 8 and Figure 9) f = 16.67 MHz (Continued)
Num.SymbolParameterMinMaxUnit
44t
46t
47t
48t
53t
55t
56t
57t
57At
58f
58At
60t
61t
62t
63t
64t
SHVPH
GAL
ASI
BELDAL
CHDOI
RLDBD
HRPW
GASD
GAFD
RHSD
RHFD
CHBCL
CHBCH
CLRML
CHRMH
RMHGL
AS, DS negated to AVEC negated 050ns
BGACK width low1.5clks
Asynchronous input setup time
BERR asserted to DTACK asserted
(4)
(2)(7)
10ns
10ns
Data-out hold from clock high0ns
R/W asserted to data bus impedance change0ns
HALT/RESET pulse width
(8)
10clks
BGACK negated to AS, DS, R/W driven1.5clks
BGACK negated to FC1clks
BR negated to AS, DS, R/W driven
BR negated to FC
(5)
(5)
1.5clks
1clks
Clock high to BCLR asserted 30ns
Clock high to BCLR negated
(9)
30ns
Clock low (S0 falling edge during read) to RMC asserted30ns
Clock high (S7 rising edge during write) to RMC negated 30ns
RMC negated to BG asserted
(10)
30ns
Notes: 1. For loading capacitance of less than or equal to 50 pF, subtract 4 ns from the value given in the maximum columns.
2. Actual value depends on clock period.
3. When AS and R/W are equally loaded (±20%), subtract 5 ns from the values given in these columns.
4. If the asynchronous input setup (#47) requirement is satisfied for DTACK
, the DTACK asserted to data setup time (#31)
requirement can be ignored. The data must only satisfy the data-in to clock low setup time (#27) for the following clock cycle.
5. The TS68302 will negate BG and begin driving the bus if external arbitration logic negates BR before asserting BGACK.
6. The minimum value must be met to guarantee proper operation. If the maximum value is exceeded, BG may be reasserted.
7. If #47 is satisfied for both DTACK
and BERR, #48 may be ignored. In the absence of DTACK, BERR is a synchronous input
using the asynchronous input setup time (#47).
8. For power-up, the TS68302 must be held in the reset state for 100 ms to allow stabilization of on-chip circuit. After the system is powered up #56 refers to the minimum pulse width required to reset the processor.
9. Occurs on S0 of SDMA read/write access when the SDMA becomes bus master.
10. This specification is valid only when the RMCST bit is set in the SCR register.
14
TS68302
2117A–HIREL–11/02
Figure 7. Read Cycle Timing Diagram
CLKO
FC2-FC0
A23-A1
S0S1S2S3S4S5S6
8
6
TS68302
S7
AS
LDS-UDS
R/W
DTACK
DATA IN
BERR/BR
(Note 2)
HALT / RESET
7
13
15
9
11
17
18
48
4747
32
32
14
47
27
31
47
12
28
29
30
56
ASYNCHRONOUS
INPUTS (Note 1)
47
Notes: 1. Setup time for asynchronous inputs IPL2-IPL0 guarantees their recognition at the next falling edge of the clock.
needs to fall at this time only to ensure being recognized at the end of the bus cycle.
2. BR
3. Timing measurements are reinforced to and from a low voltage of 0.8V and a high voltage of 2.0V, unless otherwise noted.
The voltage swing through this range should start outside and pass through the range such that the rise or fall is linear
between 0.8V and 2.0V.
2117A–HIREL–11/02
15
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