Atmel SAM7X512 , SAM7X256 , SAM7X128 Datasheet

Description

ARM-based Flash MCU

SAM7X512 / SAM7X256 / SAM7X128

DATASHEET

The Atmel SAM7X512/256/128 is a highly-integrated Flash microcontroller based on the 32-bit ARM and 128/64/32 Kbytes of SRAM, a large set of peripherals, including an 802.3 Ethernet MAC, and a CAN controller. A complete set of system functions minimizes the number of external components.

The embedded Flash memory can be programmed in-system via the JTAG-ICE interface or via a parallel interface on a production programmer prior to mounting. Builtin lock bits and a security bit protect the firmware from accidental overwrite and preserve its confidentiality.

The SAM7X512/256/128 system controller includes a reset controller capable of managing the power-on sequence of the microcontroller and the complete system. Correct device operation can be monitored by a built-in brownout detector and a watchdog running off an integrated RC oscillator.

By combining the ARM7TDMI range of peripheral functions, including USART, SPI, CAN controller, Ethernet MAC, Timer Counter, RTT and analog-to-digital converters on a monolithic chip, the SAM7X512/256/128 is a powerful device that provides a flexible, cost-effective solution to many embedded control applications requiring communication over Ethernet, wired CAN and ZigBee

RISC processor. It features 512/256/128 Kbytes of high-speed Flash

processor with on-chip Flash and SRAM, and a wide

wireless networks.

6120K–ATARM–11-Feb-14

Features

 Incorporates the ARM7TDMI ARM Thumb

 High-performance 32-bit RISC Architecture  High-density 16-bit Instruction Set

 Leader in MIPS/Watt

 EmbeddedICE

™

In-circuit Emulation, Debug Communication Channel Support

Processor

 Internal High-speed Flash

 512 Kbytes (SAM7X512) Organized in Two Banks of 1024 Pages of

256 Bytes (Dual Plane)

 256 Kbytes (SAM7X256) Organized in 1024 Pages of 256 Bytes (Single Plane)  128 Kbytes (SAM7X128) Organized in 512 Pages of 256 Bytes (Single Plane)

 Single Cycle Access at Up to 30 MHz in Worst Case Conditions  Prefetch Buffer Optimizing Thumb Instruction Execution at Maximum Speed  Page Programming Time: 6 ms, Including Page Auto-erase,

Full Erase Time: 15 ms

 10,000 Write Cycles, 10-year Data Retention Capability,

Sector Lock Capabilities, Flash Security Bit

 Fast Flash Programming Interface for High Volume Production

 Internal High-speed SRAM, Single-cycle Access at Maximum Speed

 128 Kbytes (SAM7X512)  64 Kbytes (SAM7X256)  32 Kbytes (SAM7X128)

 Memory Controller (MC)

 Embedded Flash Controller, Abort Status and Misalignment Detection

 Reset Controller (RSTC)

 Based on Power-on Reset Cells and Low-power Factory-calibrated Brownout Detector  Provides External Reset Signal Shaping and Reset Source Status

 Clock Generator (CKGR)

 Low-power RC Oscillator, 3 to 20 MHz On-chip Oscillator and one PLL

 Power Management Controller (PMC)

 Power Optimization Capabilities, Including Slow Clock Mode (Down to 500 Hz) and Idle Mode  Four Programmable External Clock Signals

 Advanced Interrupt Controller (AIC)

 Individually Maskable, Eight-level Priority, Vectored Interrupt Sources  Two External Interrupt Sources and One Fast Interrupt Source, Spurious Interrupt Protected

 Debug Unit (DBGU)

 2-wire UART and Support for Debug Communication Channel interrupt, Programmable ICE Access Prevention  Mode for General Purpose 2-wire UART Serial Communication

 Periodic Interval Timer (PIT)

 20-bit Programmable Counter plus 12-bit Interval Counter

 Windowed Watchdog (WDT)

 12-bit key-protected Programmable Counter  Provides Reset or Interrupt Signals to the System  Counter May Be Stopped While the Processor is in Debug State or in Idle Mode

 Real-time Timer (RTT)

 32-bit Free-running Counter with Alarm  Runs Off the Internal RC Oscillator

 Two Parallel Input/Output Controllers (PIO)

 Sixty-two Programmable I/O Lines Multiplexed with up to Two Peripheral I/Os  Input Change Interrupt Capability on Each I/O Line

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 Individually Programmable Open-drain, Pull-up Resistor and Synchronous Output

 Thirteen Peripheral DMA Controller (PDC) Channels  One USB 2.0 Full Speed (12 Mbits per second) Device Port

 On-chip Transceiver, 1352-byte Configurable Integrated FIFOs

 One Ethernet MAC 10/100 base-T

 Media Independent Interface (MII) or Reduced Media Independent Interface (RMII)  Integrated 28-byte FIFOs and Dedicated DMA Channels for Transmit and Receive

 One Part 2.0A and Part 2.0B Compliant CAN Controller

 Eight Fully-programmable Message Object Mailboxes, 16-bit Time Stamp Counter

 One Synchronous Serial Controller (SSC)

 Independent Clock and Frame Sync Signals for Each Receiver and Transmitter  I²S Analog Interface Support, Time Division Multiplex Support  High-speed Continuous Data Stream Capabilities with 32-bit Data Transfer

 Two Universal Synchronous/Asynchronous Receiver Transmitters (USART)

 Individual Baud Rate Generator, IrDA  Support for ISO7816 T0/T1 Smart Card, Hardware Handshaking, RS485 Support  Full Modem Line Support on USART1

Infrared Modulation/Demodulation

 Two Master/Slave Serial Peripheral Interfaces (SPI)

 8- to 16-bit Programmable Data Length, Four External Peripheral Chip Selects

 One Three-channel 16-bit Timer/Counter (TC)

 Three External Clock Inputs, Two Multi-purpose I/O Pins per Channel  Double PWM Generation, Capture/Waveform Mode, Up/Down Capability

 One Four-channel 16-bit Power Width Modulation Controller (PWMC)  One Two-wire Interface (TWI)

 Master Mode Support Only, All Two-wire Atmel EEPROMs and I

C Compatible Devices Supported

 One 8-channel 10-bit Analog-to-Digital Converter, Four Channels Multiplexed with Digital I/Os  SAM-BA

 IEEE

Boot Assistance

 Default Boot program  Interface with SAM-BA Graphic User Interface

1149.1 JTAG Boundary Scan on All Digital Pins

 5V-tolerant I/Os, Including Four High-current Drive I/O lines, Up to 16 mA Each  Power Supplies

 Embedded 1.8V Regulator, Drawing up to 100 mA for the Core and External Components  3.3V VDDIO I/O Lines Power Supply, Independent 3.3V VDDFLASH Flash Power Supply  1.8V VDDCORE Core Power Supply with Brownout Detector

 Fully Static Operation: Up to 55 MHz at 1.65V and 85°C Worst Case Conditions  Available in 100-lead LQFP Green and 100-ball TFBGA Green Packages

SAM7X Series [DATASHEET]

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1. Configuration Summary of the SAM7X512/256/128

The SAM7X512, SAM7X256 and SAM7X128 differ only in memory sizes. Table 1-1 summarizes the configurations of the three devices.

Table 1-1. Configuration Summary

Device Flash Flash Organization SRAM

SAM7X512 512 Kbytes Dual-plane 128 Kbytes SAM7X256 256 Kbytes Single-plane 64 Kbytes SAM7X128 128 Kbytes Single-plane 32 Kbytes

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TDI TDO TMS TCK

NRST

FIQ

IRQ0-IRQ1

PCK0-PCK3

PMC

Peripheral Bridge

Peripheral DMA

Controller

AIC

PLL

RCOSC

SRAM

128/64/32 Kbytes

ARM7TDMI

Processor

ICE

JTAG

SCAN

JTAGSEL

PIOA

USART0

SSC

Timer Counter

RXD0

TXD0

SCK0

RTS0 CTS0

SPI0_NPCS0 SPI0_NPCS1 SPI0_NPCS2 SPI0_NPCS3

SPI0_MISO SPI0_MOSI

SPI0_SPCK

Flash

512/256/128

Kbytes

Reset

Controller

DRXD DTXD

TF TK TD RD RK RF TCLK0 TCLK1 TCLK2 TIOA0 TIOB0

TIOA1 TIOB1

TIOA2 TIOB2

Memory Controller

Abort

Status

Address Decoder

Misalignment

Detection

PIO

APB

POR

Embedded

Flash

Controllers

AD0 AD1 AD2 AD3

ADTRG

PLLRC

13 Channels

PDC

USART1

RXD1

TXD1

SCK1

RTS1

CTS1 DCD1 DSR1 DTR1

RI1

PDC

PDC PDC

PDC

SPI0

PDC

ADC

ADVREF

PDC

TC0

TC1 TC2

TWD TWCK

TWI

OSC

XIN

XOUT

VDDIN

PWMC

PWM0 PWM1 PWM2 PWM3

1.8 V

Voltage

Regulator

USB Device

FIFO

DDM DDP

Transceiver

GND VDDOUT

BOD

VDDCORE

VDDFLASH

AD4 AD5 AD6 AD7

VDDFLASH

Fast Flash

Programming

Interface

ERASE

PIO

PGMD0-PGMD15 PGMNCMD PGMEN0-PGMEN1

PGMRDY PGMNVALID PGMNOE PGMCK PGMM0-PGMM3

VDDIO

TST

DBGU

PDC PDC

PIT

WDT

RTT

System Controller

VDDCORE

CAN

CANRX CANTX

PIO

Ethernet MAC 10/100

ETXCK-ERXCK-EREFCK ETXEN-ETXER ECRS-ECOL, ECRSDV ERXER-ERXDV ERX0-ERX3 ETX0-ETX3 EMDC EMDIO

DMA FIFO

PIOB

SPI1_NPCS0 SPI1_NPCS1 SPI1_NPCS2 SPI1_NPCS3

SPI1_MISO SPI1_MOSI

SPI1_SPCK

PDC

SPI1

EF100

SAM-BA

ROM

VDDFLASH

2. SAM7X512/256/128 Block Diagram

Figure 2-1. SAM7X512/256/128 Block Diagram

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3. Signal Description

Table 3-1. Signal Description List

Active

Signal Name Function Type

Power

VDDIN

Voltage Regulator and ADC Power Supply Input

Power 3V to 3.6V

VDDOUT Voltage Regulator Output Power 1.85V VDDFLASH Flash and USB Power Supply Power 3V to 3.6V VDDIO I/O Lines Power Supply Power 3V to 3.6V VDDCORE Core Power Supply Power 1.65V to 1.95V VDDPLL PLL Power 1.65V to 1.95V GND Ground Ground

Clocks, Oscillators and PLLs

XIN Main Oscillator Input Input XOUT Main Oscillator Output Output PLLRC PLL Filter Input PCK0 - PCK3 Programmable Clock Output Output

ICE and JTAG

TCK Test Clock Input No pull-up resistor TDI Test Data In Input No pull-up resistor TDO Test Data Out Output TMS Test Mode Select Input No pull-up resistor JTAGSEL JTAG Selection Input Pull-down resistor

Flash Memory

ERASE

Flash and NVM Configuration Bits Erase Command

Input High Pull-down resistor

Reset/Test

NRST Microcontro ller Reset I/O Low TST Test Mode Select Input High Pull-down resistor

Debug Unit

DRXD Debug Receive Data Input DTXD Debug Transmit Data Output

AIC

IRQ0 - IRQ1 External Interrupt Inputs Input FIQ Fast Interrupt Input Input

PIO

PA0 - PA30 Parallel IO Controller A I/O Pulled-up input at reset PB0 - PB30 Parallel IO Controller B I/O Pulled-up input at reset

USB Device Port

DDM USB Device Port Data - Analog DDP USB Device Port Data + Analog

USART

SCK0 - SCK1 Serial Clock I/O TXD0 - TXD1 Transmit Data I/O RXD0 - RXD1 Receive Data Input RTS0 - RTS1 Request To Send Output CTS0 - CTS1 Clear To Send Input DCD1 Da ta Carrier Detect Input

Level Comments

(1)

Pull-up resistor, Open Drain Output

(1)

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Table 3-1. Signal Description List (Continued)

Active

Signal Name Function Type

Level Comments

DTR1 Data Terminal Ready Output DSR1 Data Set Ready Input RI1 Ring Indicator Input

Synchronous Serial Controller

TD Transmit Data Output RD Receive Data Input TK Transmit Clock I/O RK Receive Clock I/O TF Transmit Frame Sync I/O RF Receive Frame Sync I/O

Timer/Counter

TCLK0 - TCLK2 External Clock Inputs Input TIOA0 - TIOA2 I/O Line A I/O TIOB0 - TIOB2 I/O Line B I/O

PWM Controller

PWM0 - PWM3 PWM Channels Output

Serial Peripheral Interface - SPIx

SPIx_MISO Master In Slave Out I/O SPIx_MOSI Master Out Slave In I/O SPIx_SPCK SPI Serial Clock I/O SPIx_NPCS0 SPI Peripheral Chip Select 0 I/O Low SPIx_NPCS1-NPCS3 SPI Peripheral Chip Select 1 to 3 Output Low

Two-wire Interface

TWD Two-wire Serial Data I/O TWCK Two-wire Serial Clock I/O

Analog-to-Digital Converter

AD0-AD3 Analog Inputs Analog Digital pulled-up inputs at reset AD4-AD7 Analog Inputs Analog Analog Inputs ADTRG ADC Trigger Input ADVREF ADC Reference Analog

Fast Flash Programming Interface

PGMEN0-PGMEN1 Programming Enabling Input PGMM0-PGMM3 Programming Mode Input PGMD0-PGMD15 Programming Data I/O PGMRDY Programming Ready Output High PGMNVALID Data Direction Output Low PGMNOE Programming Read Input Low PGMCK Programming Clock Input PGMNCMD Programming Command Input Low

CAN Controller

CANRX CAN Input Input CANTX CAN Output Output

Ethernet MAC 10/100

EREFCK Reference Clock Input RMII only ETXCK Transmit Clock Input MII only ERXCK Receive Clock Input MII only ETXEN Transmit Enable Output ETX0 - ETX3 Transmit Data Output ETX0 - ETX1 only in RMII

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Table 3-1. Signal Description List (Continued)

Active

Signal Name Function Type

Level Comments

ETXER Transmit Coding Error Output MII only ERXDV Receive Data Valid Input MII only ECRSDV Carrier Sense and Data Valid Input RMII only ERX0 - ERX3 Receive Data Input ERX0 - ERX1 only in RMII ERXER Receive Error Input ECRS Carrier Sense Input MII only ECOL Collision Detected Input MII only EMDC Management Data Clock Output EMDIO Management Data Input/Output I/O EF100 Force 100 Mbits/sec. Output High RMII only

Note: 1. Refer to Section 6. ”I/O Lines Considerations”.

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4. Package

125

5175

100

The SAM7X512/256/128 is available in 100-lead LQFP Green and 100-ball TFBGA RoHS-compliant packages.

4.1 100-lead LQFP Package Outline

Figure 4-1 shows the orientation of the 100-lead LQFP package. A detailed mechanical description is given in the

Mechanical Characteristics section.

Figure 4-1. 100-lead LQFP Package Outline (Top View)

4.2 100-lead LQFP Pinout

T able 4-1. Pinout in 100-lead LQFP Package

1 ADVREF 26 PA18/PGMD6 51 TDI 76 TDO 2 GND 27 PB9 52 GND 77 JTAGSEL 3 AD4 28 PB8 53 PB16 78 TMS 4 AD5 29 PB14 54 PB4 79 TCK 5 AD6 30 PB13 55 PA23/PGMD11 80 PA30 6 AD7 31 PB6 56 PA24/PGMD12 81 PA0/PGMEN0 7 VDDOUT 32 GND 57 NRST 82 PA1/PGMEN1 8 VDDIN 33 VDDIO 58 TST 83 GND

9 PB27/AD0 34 PB5 59 PA25/PGMD13 84 VDDIO 10 PB28/AD1 35 PB15 60 PA26/PGMD14 85 PA3 11 PB29/AD2 36 PB17 61 VDDIO 86 PA2 12 PB30/AD3 37 VDDCORE 62 VDDCORE 87 VDDCORE 13 PA8/PGMM0 38 PB7 63 PB18 88 PA4/PGMNCMD 14 PA9/PGMM1 39 PB12 64 PB19 89 PA5/PGMRDY 15 VDDCORE 40 PB0 65 PB20 90 PA6/PGMNOE 16 GND 41 PB1 66 PB21 91 PA7/PGMNVALID 17 VDDIO 42 PB2 67 PB22 92 ERASE 18 PA10/PGMM2 43 PB3 68 GND 93 DDM 19 PA11/PGMM3 44 PB10 69 PB23 94 DDP 20 PA12/PGMD0 45 PB11 70 PB24 95 VDDFLASH 21 PA13/PGMD1 46 PA19/PGMD7 71 PB25 96 GND 22 PA14/PGMD2 47 PA20/PGMD8 72 PB26 97 XIN/PGMCK 23 PA15/PGMD3 48 VDDIO 73 PA27/PGMD15 98 XOUT 24 PA16/PGMD4 49 PA 21/PGMD9 74 PA28 99 PLLRC 25 PA17/PGMD5 50 PA22/PGMD10 75 PA29 100 VDDPLL

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4.3 100-ball TFBGA Package Outline

ABCDEFGHJK

TOP VIEW

BALL A1

Figure 4-2 shows the orientation of the 100-ball TFBGA package. A detailed mechanical description is given in the

Mechanical Characteristics section of the full datasheet.

Figure 4-2. 100-ball TFBGA Package Outline (Top View)

4.4 100-ball TFBGA Pinout

Pinout in 100-ball TFBGA Package

Pin Signal Name Pi n Signal Name Pin Signal Name Pin Signal Name

A1 PA22/PGMD10 C6 PB17 F1 PB21 H6 PA7/PGMNVALID A2 PA21/PGMD9 C7 PB13 F2 PB23 H7 PA9/PGMM1 A3 PA20/PGMD8 C8 PA13/PGMD1 F3 PB25 H8 PA8/PGMM0 A4 PB1 C9 PA12/PGMD0 F4 PB26 H9 PB29/AD2 A5 PB7 C10 PA15/PGMD3 F5 TCK H10 PLLRC A6 PB5 D1 PA23/PGMD11 F6 PA6/PGMNOE J1 PA29 A7 PB8 D2 PA24/PGMD12 F7 ERASE J2 PA30 A8 PB9 D3 NRST F8 VDDCORE J3 PA0/PGMEN0 A9 PA18/PGMD6 D4 TST F9 GND J4 PA1/PGMEN1

A10 VDDIO D5 PB19 F10 VDDIN J5 VDDFLASH

B1 TDI D6 PB6 G1 PB22 J6 GND B2 PA19/PGMD7 D7 PA10/PGMM2 G2 PB24 J7 XIN/PGMCK B3 PB11 D8 VDDIO G3 PA27/PGMD15 J8 XOUT B4 PB2 D9 PB27/AD0 G4 TDO J9 GND B5 PB12 D10 PA11/PGMM3 G5 PA2 J10 VDDPLL B6 PB15 E1 PA25/PGMD13 G6 PA5/PGMRDY K1 VDDCORE B7 PB14 E2 PA26/PGMD14 G7 VDDCORE K2 VDDCORE B8 PA14/PGMD2 E3 PB18 G8 GND K3 DDP B9 PA16/PGMD4 E4 PB20 G9 PB30/AD3 K4 DDM

B10 PA17/PGMD5 E5 TMS G10 VDDOUT K5 GND

C1 PB16 E6 GND H1 VDDCORE K6 AD7 C2 PB4 E7 VDDIO H2 PA28 K7 AD6

C3 PB10 E8 PB28/AD1 H3 JTAGSEL K8 AD5 C4 PB3 E9 VDDIO H4 PA3 K9 AD4 C5 PB0 E10 GND H5 PA4/PGMNCMD K10 ADVREF

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5. Power Considerations

5.1 Power Supplies

The SAM7X512/256/128 has six types of power supply pins and integrates a voltage regulator, allowing the device to be supplied with only one voltage. The six power supply pin types are:

 VDDIN pin. It powers the voltage regulator and the ADC; voltage ranges from 3.0V to 3.6V, 3.3V nominal. In order

to decrease current consumption, if the voltage regulator and the ADC are not used, VDDIN, ADVREF, AD4, AD5, AD6 and AD7 should be connected to GND. In this case, VDDOUT should be left unconnected.

 VDDOUT pin. It is the output of the 1.8V voltage regulator.  VDDIO pin. It powers the I/O lines; voltage ranges from 3.0V to 3.6V, 3.3V nominal.  VDDFLASH pin. It powers the USB transceivers and a part of the Flash and is required for the Flash to operate

correctly; voltage ranges from 3.0V to 3.6V, 3.3V nominal.

 VDDCORE pins. They power the logic of the device; voltage ranges from 1.65V to 1.95V, 1.8V typical. It can be

connected to the VDDOUT pin with decoupling capacitor. VDDCORE is required for the device, including its embedded Flash, to operate correctly.

 VDDPLL pin. It powers the oscillator and the PLL. It can be connected directly to the VDDOUT pin.

No separate ground pins are provided for the different power supplies. Only GND pins are provided and should be connected as shortly as possible to the system ground plane.

5.2 Power Consumption

The SAM7X512/256/128 has a static current of less than 60 µA on VDDCORE at 25°C, including the RC oscillator, the voltage regulator and the power-on reset when the brownout detector is deactivated. Activating the brownout detector adds 28 µA static current.

The dynamic power consumption on VDDCORE is less than 90 mA at full speed when running out of the Flash. Under the same conditions, the power consumption on VDDFLASH does not exceed 10 mA.

5.3 Voltage Regulator

The SAM7X512/256/128 embeds a voltage regulator that is managed by the System Controller. In Normal Mode, the voltage regulator consumes less than 100 µA static current and draws 100 mA of output current. The voltage regulator also has a Low-power Mode. In this mode, it consumes less than 25 µA static current and draws 1

mA of output current. Adequate output supply decoupling is mandatory for VDDOUT to reduce ripple and avoid oscillations. The best way to

achieve this is to use two capacitors in parallel: one external 470 pF (or 1 nF) NPO capacitor should be connected between VDDOUT and GND as close to the chip as possible. One external 2.2 µF (or 3.3 µF) X7R capacitor should be connected between VDDOUT and GND.

Adequate input supply decoupling is mandatory for VDDIN in order to improve startup stability and reduce source voltage drop. The input decoupling capacitor should be placed close to the chip. For example, two capacitors can be used in parallel: 100 nF NPO and 4.7 µF X7R.

5.4 Typical Powering Schematics

The SAM7X512/256/128 supports a 3.3V single supply mode. The internal regulator input connected to the 3.3V source and its output feeds VDDCORE and the VDDPLL. Figure 5-1 shows the power schematics to be used for USB buspowered systems.

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Figure 5-1. 3.3V System Single Power Supply Schematic

Power Source

ranges

from 4.5V (USB)

to 18V

3.3V

VDDIN

Voltage

Regulator

VDDOUT

VDDIO

DC/DC Converter

VDDCORE

VDDFLASH

VDDPLL

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6. I/O Lines Considerations

6.1 JTAG Port Pins

TMS, TDI and TCK are schmitt trigger inputs and are not 5-V tolerant. TMS, TDI and TCK do not integrate a pull-up resistor.

TDO is an output, driven at up to VDDIO, and has no pull-up resistor. The JTAGSEL pin is used to select the JTAG boundary scan when asserted at a high level. The JTAGSEL pin integrates

a permanent pull-down resistor of about 15 kΩ to GND. To eliminate any risk of spuriously entering the JTAG boundary scan mode due to noise on JTAGSEL, it should be tied

externally to GND if boundary scan is not used, or pulled down with an external low-value resistor (such as 1 kΩ) .

6.2 Test Pin

The TST pin is used for manufacturing test or fast programming mode of the SAM7X512/256/128 when asserted high. The TST pin integrates a permanent pull-down resistor of about 15 kΩ to GND.

To eliminate any risk of entering the test mode due to noise on the TST pin, it should be tied to GND if the FFPI is not used, or pulled down with an external low-value resistor (such as 1 kΩ)

To enter fast programming mode, the TST pin and the PA0 and PA1 pins should be tied high and PA2 tied to low. Driving the TST pin at a high level while PA0 or PA1 is driven at 0 leads to unpredictable results.

6.3 Reset Pin

The NRST pin is bidirectional with an open drain output buffer. It is handled by the on-chip reset controller and can be driven low to provide a reset signal to the external components or asserted low externally to reset the microcontroller. There is no constraint on the length of the reset pulse, and the reset controller can guarantee a minimum pulse length. This allows connection of a simple push-button on the NRST pin as system user reset, and the use of the signal NRST to reset all the components of the system.

The NRST pin integrates a permanent pull-up resistor to VDDIO.

6.4 ERASE Pin

The ERASE pin is used to re-initialize the Flash content and some of its NVM bits. It integrates a permanent pull-down resistor of about 15 kΩ to GND.

To eliminate any risk of erasing the Flash due to noise on the ERASE pin, it shoul be tied externally to GND, which prevents erasing the Flash from the applicatiion, or pulled down with an external low-value resistor (such as 1 kΩ) .

This pin is debounced by the RC oscillator to improve the glitch tolerance. When the pin is tied to high during less than 100 ms, ERASE pin is not taken into account. The pin must be tied high during more than 220 ms to perform the reinitialization of the Flash.

6.5 PIO Controller Lines

All the I/O lines, PA0 to PA30 and PB0 to PB30, are 5V-tolerant and all integrate a programmable pull-up resistor. Programming of this pull-up resistor is performed independently for each I/O line through the PIO controllers.

5V-tolerant means that the I/O lines can drive voltage level according to VDDIO, but can be driven with a voltage of up to

5.5V. However, driving an I/O line with a voltage over VDDIO while the programmable pull-up resistor is enabled will create a current path through the pull-up resistor from the I/O line to VDDIO. Care should be taken, in particular at reset, as all the I/O lines default to input with pull-up resistor enabled at reset.

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6.6 I/O Lines Current Drawing

The PIO lines PA0 to PA3 are high-drive current capable. Each of these I/O lines can drive up to 16 mA permanently. The remaining I/O lines can draw only 8 mA. However, the total current drawn by all the I/O lines cannot exceed 200 mA.

SAM7X Series [DATASHEET]

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7. Processor and Architecture

7.1 ARM7TDMI Processor

 RISC processor based on ARMv4T Von Neumann architecture

 Runs at up to 55 MHz, providing 0.9 MIPS/MHz

 Two instruction sets

 ARM high-performance 32-bit instruction set  Thumb high code density 16-bit instruction set

 Three-stage pipeline architecture

 Instruction Fetch (F)  Instruction Decode (D)  Execute (E)

7.2 Debug and Test Features

 Integrated embedded in-circuit emulator

 Two watchpoint units  Test access port accessible through a JTAG protocol  Debug communication channel

 Debug Unit

 Two-pin UART  Debug communication channel interrupt handling  Chip ID Register

 IEEE1149.1 JTAG Boundary-scan on all digital pins

7.3 Memory Controller

 Programmable Bus Arbiter

 Handles requests from the ARM7TDMI, the Ethernet MAC and the Peripheral DMA Controller

 Address decoder provides selection signals for

 Three internal 1 Mbyte memory areas  One 256 Mbyte embedded peripheral area

 Abort Status Registers

 Source, Type and all parameters of the access leading to an abort are saved  Facilitates debug by detection of bad pointers

 Misalignment Detector

 Alignment checking of all data accesses  Abort generation in case of misalignment

 Remap Command

 Remaps the SRAM in place of the embedded non-volatile memory  Allows handling of dynamic exception vectors

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 Embedded Flash Controller

 Embedded Flash interface, up to three programmable wait states  Prefetch buffer, buffering and anticipating the 16-bit requests, reducing the required wait states  Key-protected program, erase and lock/unlock sequencer  Single command for erasing, programming and locking operations  Interrupt generation in case of forbidden operation

7.4 Peripheral DMA Controller

 Handles data transfer between peripherals and memories  Thirteen channels

 Two for each USART  Two for the Debug Unit  Two for the Serial Synchronous Controller  Two for each Serial Peripheral Interface  One for the Analog-to-digital Converter

 Low bus arbitration overhead

 One Master Clock cycle needed for a transfer from memory to peripheral  Two Master Clock cycles needed for a transfer from peripheral to memory

 Next Pointer management for reducing interrupt latency requirements  Peripheral DMA Controller (PDC) priority is as follows (from the highest priority to the lowest):

Receive DBGU Receive USART0 Receive USART1 Receive SSC Receive ADC Receive SPI0 Receive SPI1 Transmit DBGU Transmit USART0 Transmit USART Transmit SSC Transmit SPI0 Transmit SPI1

SAM7X Series [DATASHEET]

6120K–ATARM–11-Feb-14

8. Memories

8.1 SAM7X512

 512 Kbytes of dual-plane Flash Memory

 2 contiguous banks of 1024 pages of 256 bytes  Fast access time, 30 MHz single-cycle access in Worst Case conditions  Page programming time: 6 ms, including page auto-erase  Page programming without auto-erase: 3 ms  Full chip erase time: 15 ms  10,000 write cycles, 10-year data retention capability  32 lock bits, protecting 32 sectors of 64 pages  Protection Mode to secure contents of the Flash

 128 Kbytes of Fast SRAM

 Single-cycle access at full speed

8.2 SAM7X256

 256 Kbytes of Flash Memory

 1024 pages of 256 bytes  Fast access time, 30 MHz single-cycle access in Worst Case conditions  Page programming time: 6 ms, including page auto-erase  Page programming without auto-erase: 3 ms  Full chip erase time: 15 ms  10,000 write cycles, 10-year data retention capability  16 lock bits, each protecting 16 sectors of 64 pages  Protection Mode to secure contents of the Flash

 64 Kbytes of Fast SRAM

 Single-cycle access at full speed

8.3 SAM7X128

 128 Kbytes of Flash Memory

 512 pages of 256 bytes  Fast access time, 30 MHz single-cycle access in Worst Case conditions  Page programming time: 6 ms, including page auto-erase  Page programming without auto-erase: 3 ms  Full chip erase time: 15 ms  10,000 write cycles, 10-year data retention capability  8 lock bits, each protecting 8 sectors of 64 pages  Protection Mode to secure contents of the Flash

 32 Kbytes of Fast SRAM

 Single-cycle access at full speed

SAM7X Series [DATASHEET]

6120K–ATARM–11-Feb-14

Figure 8-1. SAM7X512/256/128 Memory Mapping

0x1000 0000

0x0000 0000

0x0FFF FFFF

0xF000 0000

0xEFFF FFFF

0xFFFF FFFF

256 MBytes

14 x 256 MBytes 3,584 MBytes

0x000F FFF

0x0010 0000

0x001F FFF

0x0020 0000

0x002F FFF

0x0030 0000

0x003F FFF

0x0040 0000

0x0000 0000

1 MBytes

252 MBytes

0xFFFA 0000

0xFFFA 3FFF

0xFFFA 4000

0xF000 0000

0xFFFB 8000

0xFFFC 0000

0xFFFC 3FFF

0xFFFC 4000

0xFFFC 7FFF

0xFFFD 4000

0xFFFD 7FFF

0xFFFD 3FFF

0xFFFD FFFF

0xFFFE 0000

0xFFFE 3FFF

0xFFFF EFFF

0xFFFF FFFF

0xFFFF F000

0xFFFE 4000

0xFFFE 8000

0xFFFE 7FFF

0xFFFB 4000

0xFFFB 7FFF

0xFFF9 FFFF

0xFFFC FFFF

0xFFFD 8000

0xFFFD BFFF

0xFFFC BFFF

0xFFFC C000

0xFFFB FFFF

0xFFFB C000

0xFFFB BFFF

0xFFFA FFFF

0xFFFB 0000

0xFFFB 3FFF

0xFFFD 0000

0xFFFD C000

0xFFFC 8000

16 Kbytes

0x0FFF FFFF

512 Bytes/128 registers

256 Bytes/64 registers

16 Bytes/4 registers

16 Bytes/4 registers 16 Bytes/4 registers

256 Bytes/64 registers

4 Bytes/1 register

512 Bytes/128 registers

0xFFFF F000

0xFFFF F200

0xFFFF F1FF

0xFFFF F3FF

0xFFFF FBFF

0xFFFF FCFF

0xFFFF FEFF

0xFFFF FFFF

0xFFFF F400

0xFFFF FC00

0xFFFF FD0F

0xFFFF FC2F

0xFFFF FC3F

0xFFFF FD4F

0xFFFF FC6F

0xFFFF F5FF

0xFFFF F600

0xFFFF F7FF

0xFFFF F800

0xFFFF FD00

0xFFFF FF00

0xFFFF FD20

0xFFFF FD30

0xFFFF FD40

0xFFFF FD60

0xFFFF FD70

Internal Memories

Undefined

(Abort)

(1) Can be ROM, Flash or SRAM depending on GPNVM2 and REMAP

Flash before Remap

SRAM after Remap

Internal Flash

Internal SRAM

Internal ROM

Reserved

Boot Memory (1)

Address Memory Space

Internal Memory Mapping

Note:

TC0, TC1, TC2

USART0

USART1

PWMC

Reserved

CAN

EMAC

Reserved

TWI

SSC

SPI0

SPI1

UDP

ADC

AIC

DBGU

PIOA

Reserved

PMC

WDT

PIT

RTT

RSTC

VREG

PIOB

Peripheral Mapping

System Controller Mapping

Internal Peripherals

Reserved

SYSC

SAM7X Series [DATASHEET]

6120K–ATARM–11-Feb-14

8.4 Memory Mapping

256M Bytes

ROM Before Remap

SRAM After Remap

Undefined Areas

(Abort)

0x000F FFFF

0x001F FFFF

0x002F FFFF

0x0FFF FFFF

1 M Bytes

252 M Bytes

Internal FLASH

Internal SRAM

0x0000 0000

0x0010 0000

0x0020 0000

0x0030 0000

Internal ROM

0x003F FFFF 0x0040 0000

1 M Bytes

8.4.1 Internal SRAM

 The SAM7X512 embeds a high-speed 128-Kbyte SRAM bank.  The SAM7X256 embeds a high-speed 64-Kbyte SRAM bank.  The SAM7X128 embeds a high-speed 32-Kbyte SRAM bank.

After reset and until the Remap Command is performed, the SRAM is only accessible at address 0x0020 0000. After Remap, the SRAM also becomes available at address 0x0.

8.4.2 Internal ROM

The SAM7X512/256/128 embeds an Internal ROM. At any time, the ROM is mapped at address 0x30 0000. The ROM contains the FFPI and the SAM-BA program.

8.4.3 Internal Flash

 The SAM7X512 features two banks (dual plane) of 256 Kbytes of Flash.  The SAM7X256 features one bank (single plane) of 256 Kbytes of Flash.  The SAM7X128 features one bank (single plane) of 128 Kbytes of Flash.

At any time, the Flash is mapped to address 0x0010 0000. It is also accessible at address 0x0 after the reset, if GPNVM bit 2 is set and before the Remap Command.

A general purpose NVM (GPNVM) bit is used to boot either on the ROM (default) or from the Flash. This GPNVM bit can be cleared or set respectively through the commands “Clear General-purpose NVM Bit” and “Set

General-purpose NVM Bit” of the EFC User Interface. Setting the GPNVM Bit 2 selects the boot from the Flash. Asserting ERASE clears the GPNVM Bit 2 and thus selects the

boot from the ROM by default.

Figure 8-2. Internal Memory Mapping with GPNVM Bit 2 = 0 (default)

SAM7X Series [DATASHEET]

6120K–ATARM–11-Feb-14

Figure 8-3. Internal Memory Mapping with GPNVM Bit 2 = 1

256M Bytes

Flash Before Remap

SRAM After Remap

Undefined Areas

(Abort)

0x000F FFFF

0x001F FFFF

0x002F FFFF

0x0FFF FFFF

1 M Bytes

252 M Bytes

Internal FLASH

Internal SRAM

0x0000 0000

0x0010 0000

0x0020 0000

0x0030 0000

Internal ROM

0x003F FFFF 0x0040 0000

1 M Bytes

8.5 Embedded Flash

8.5.1 Flash Overview

 The Flash of the SAM7X512 is organized in two banks (dual plane) of 1024 pages of 256 bytes. The 524,288 bytes

are organized in 32-bit words.

 The Flash of the SAM7X256 is organized in 1024 pages of 256 bytes (single plane). It reads as 65,536 32-bit

words.

 The Flash of the SAM7X128 is organized in 512 pages of 256 bytes (single plane). It reads as 32,768 32-bit words.

The Flash contains a 256-byte write buffer, accessible through a 32-bit interface. The Flash benefits from the integration of a power reset cell and from the brownout detector. This prevents code

corruption during power supply changes, even in the worst conditions. When Flash is not used (read or write access), it is automatically placed into standby mode.

8.5.2 Embedded Flash Controller

The Embedded Flash Controller (EFC) manages accesses performed by the masters of the system. It enables reading the Flash and writing the write buffer. It also contains a User Interface, mapped within the Memory Controller on the APB. The User Interface allows:

 programming of the access parameters of the Flash (number of wait states, timings, etc.)  starting commands such as full erase, page erase, page program, NVM bit set, NVM bit clear, etc.  getting the end status of the last command  getting error status  programming interrupts on the end of the last commands or on errors

The Embedded Flash Controller also provides a dual 32-bit Prefetch Buffer that optimizes 16-bit access to the Flash. This is particularly efficient when the processor is running in Thumb mode.

Two EFCs are embedded in the SAM7X512 to control each bank of 256 KBytes. Dual-plane organization allows concurrent read and program functionality. Read from one memory plane may be performed even while program or erase functions are being executed in the other memory plane.

One EFC is embedded in the SAM7X256/128 to control the single plane of 256/128 KBytes.

SAM7X Series [DATASHEET]

6120K–ATARM–11-Feb-14

8.5.3 Lock Regions

8.5.3.1 SAM7X512

Two Embedded Flash Controllers each manage 16 lock bits to protect 16 regions of the flash against inadvertent flash erasing or programming commands. The SAM7X512 contains 32 lock regions and each lock region contains 64 pages of 256 bytes. Each lock region has a size of 16 Kbytes.

If a locked-region’s erase or program command occurs, the command is aborted and the EFC trigs an interrupt. The 32 NVM bits are software programmable through both of the EFC User Interfaces. The command “Set Lock Bit”

enables the protection. The command “Clear Lock Bit” unlocks the lock region. Asserting the ERASE pin clears the lock bits, thus unlocking the entire Flash.

8.5.3.2 SAM7X256

The Embedded Flash Controller manages 16 lock bits to protect 16 regions of the flash against inadvertent flash erasing or programming commands. The SAM7X256 contains 16 lock regions and each lock region contains 64 pages of 256 bytes. Each lock region has a size of 16 Kbytes.

If a locked-region’s erase or program command occurs, the command is aborted and the EFC trigs an interrupt. The 16 NVM bits are software programmable through the EFC User Interface. The command “Set Lock Bit” enables the

protection. The command “Clear Lock Bit” unlocks the lock region. Asserting the ERASE pin clears the lock bits, thus unlocking the entire Flash.

8.5.3.3 SAM7X128

The Embedded Flash Controller manages 8 lock bits to protect 8 regions of the flash against inadvertent flash erasing or programming commands. The SAM7X128 contains 8 lock regions and each lock region contains 64 pages of 256 bytes. Each lock region has a size of 16 Kbytes.

If a locked-region’s erase or program command occurs, the command is aborted and the EFC trigs an interrupt. The 8 NVM bits are software programmable through the EFC User Interface. The command “Set Lock Bit” enables the

protection. The command “Clear Lock Bit” unlocks the lock region. Asserting the ERASE pin clears the lock bits, thus unlocking the entire Flash.

8.5.4 Security Bit Feature

The SAM7X512/256/128 features a security bit, based on a specific NVM-Bit. When the security is enabled, any access to the Flash, either through the ICE interface or through the Fast Flash Programming Interface, is forbidden. This ensures the confidentiality of the code programmed in the Flash.

This security bit can only be enabled, through the Command “Set Security Bit” of the EFC User Interface. Disabling the security bit can only be achieved by asserting the ERASE pin at 1, and after a full flash erase is performed. When the security bit is deactivated, all accesses to the flash are permitted.

It is important to note that the assertion of the ERASE pin should always be longer than 220 ms. As the ERASE pin integrates a permanent pull-down, it can be left unconnected during normal operation. However, it is

safer to connect it directly to GND for the final application.

8.5.5 Non-volatile Brownout Detector Control

Two general purpose NVM (GPNVM) bits are used for controlling the brownout detector (BOD), so that even after a power loss, the brownout detector operations remain in their state.

These two GPNVM bits can be cleared or set respectively through the commands “Clear General-purpose NVM Bit” and “Set General-purpose NVM Bit” of the EFC User Interface.

 GPNVM Bit 0 is used as a brownout detector enable bit. Setting the GPNVM Bit 0 enables the BOD, clearing it

disables the BOD. Asserting ERASE clears the GPNVM Bit 0 and thus disables the brownout detector by default.

SAM7X Series [DATASHEET]

6120K–ATARM–11-Feb-14

 The GPNVM Bit 1 is used as a brownout reset enable signal for the reset controller. Setting the GPNVM Bit 1

enables the brownout reset when a brownout is detected, Clearing the GPNVM Bit 1 disables the brownout reset. Asserting ERASE disables the brownout reset by default.

8.5.6 Calibration Bits

Eight NVM bits are used to calibrate the brownout detector and the voltage regulator. These bits are factory configured and cannot be changed by the user. The ERASE pin has no effect on the calibration bits.

8.6 Fast Flash Programming Interface

The Fast Flash Programming Interface allows programming the device through either a serial JTAG interface or through a multiplexed fully-handshaked parallel port. It allows gang-programming with market-standard industrial programmers.

The FFPI supports read, page program, page erase, full erase, lock, unlock and protect commands. The Fast Flash Programming Interface is enabled and the Fast Programming Mode is entered when the TST pin and the

PA0 and PA1 pins are all tied high.

8.7 SAM-BA Boot Assistant

The SAM-BA Boot Assistant is a default Boot Program that provides an easy way to program in-situ the on-chip Flash memory.

The SAM-BA Boot Assistant supports serial communication via the DBGU or the USB Device Port.

 Communication via the DBGU supports a wide range of crystals from 3 to 20 MHz via software auto-detection.  Communication via the USB Device Port is limited to an 18.432 MHz crystal.

The SAM-BA Boot provides an interface with SAM-BA Graphic User Interface (GUI). The SAM-BA Boot is in ROM and is mapped at address 0x0 when the GPNVM Bit 2 is set to 0. When GPNVM bit 2 is set to 1, the device boots from the Flash. When GPNVM bit 2 is set to 0, the device boots from ROM (SAM-BA).

SAM7X Series [DATASHEET]

6120K–ATARM–11-Feb-14

9. System Controller

The System Controller manages all vital blocks of the microcontroller: interrupts, clocks, power, time, debug and reset. The System Controller peripherals are all mapped to the highest 4 Kbytes of address space, between addresses 0xFFFF

F000 and 0xFFFF FFFF.

Figure 9-1 on page 24 shows the System Controller Block Diagram. Figure 8-1 on page 18 shows the mapping of the User Interface of the System Controller peripherals. Note that the

Memory Controller configuration user interface is also mapped within this address space.

SAM7X Series [DATASHEET]

6120K–ATARM–11-Feb-14

Figure 9-1. System Controller Block Diagram

NRST

irq0-irq1

periph_irq[2..19]

pit_irq

rtt_irq

wdt_irq

dbgu_irq

pmc_irq

rstc_irq

efc_irq

periph_nreset

dbgu_rxd

debug

periph_nreset

power_on_reset

debug

proc_nreset

cal gpnvm[0]

BOD

POR

SLCK

fiq

MCK

SLCK

idle

gpnvm[1]

flash_wrdis

power_on_reset

jtag_nreset flash_poe

System Controller

Advanced

Interrupt

Controller

Debug

Unit

Periodic

Interval

Timer

Real-Time

Timer

Watchdog

Timer

wdt_fault WDRPROC

bod_rst_en

Reset

Controller

int

dbgu_irq force_ntrst

dbgu_txd

pit_irq

rtt_irq

wdt_irq

periph_nreset proc_nreset

rstc_irq

Voltage

Regulator

Mode

Controller

jtag_nreset

nirq nfiq

proc_nreset

PCK

debug

power_on_reset

force_ntrst

security_bit

flash_poe

flash_wrdis

cal

gpnvm[0..2]

efc_irq

MCK

proc_nreset

standby

cal

Boundary Scan

TAP Controller

ARM7TDMI

Embedded

Flash

Memory

Controller

Voltage

Regulator

XIN

XOUT

PLLRC

PA0-PA30

PB0-PB30

RCOSC

OSC

PLL

periph_nreset usb_suspend

periph_clk[2-3]

MAINCK

PLLCK

dbgu_rxd

SLCK

int

Power

Management

Controller

PIO

Controller

periph_clk[2..18] pck[0-3]

PCK UDPCK MCK

pmc_irq

idle

periph_irq{2-3]periph_nreset irq0-irq1 fiq dbgu_txd

UDPCK

periph_clk[11]

periph_nreset periph_irq[11] usb_suspend

periph_clk[4..19]

periph_nreset

periph_irq[4..19]

in out enable

USB Device

Port

Embedded Peripherals

SAM7X Series [DATASHEET]

6120K–ATARM–11-Feb-14

9.1 Reset Controller

 Based on one power-on reset cell and one brownout detector  Status of the last reset, either Power-up Reset, Software Reset, User Reset, Watchdog Reset, Brownout Reset  Controls the internal resets and the NRST pin output  Allows to shape a signal on the NRST line, guaranteeing that the length of the pulse meets any requirement.

9.1.1 Brownout Detector and Power-on Reset

The SAM7X512/256/128 embeds one brownout detection circuit and a power-on reset cell. The power-on reset is supplied with and monitors VDDCORE.

Both signals are provided to the Flash to prevent any code corruption during power-up or power-down sequences or if brownouts occur on the power supplies.

The power-on reset cell has a limited-accuracy threshold at around 1.5V. Its output remains low during power-up until VDDCORE goes over this voltage level. This signal goes to the reset controller and allows a full re-initialization of the device.

The brownout detector monitors the VDDCORE and VDDFLASH levels during operation by comparing them to a fixed trigger level. It secures system operations in the most difficult environments and prevents code corruption in case of brownout on the VDDCORE or VDDFLASH.

When the brownout detector is enabled and VDDCORE decreases to a value below the trigger level (Vbot18-, defined as Vbot18 - hyst/2), the brownout output is immediately activated.

When VDDCORE increases above the trigger level (Vbot18+, defined as Vbot18 + hyst/2), the reset is released. The brownout detector only detects a drop if the voltage on VDDCORE stays below the threshold voltage for longer than about 1µs.

The VDDCORE threshold voltage has a hysteresis of about 50 mV, to ensure spike free brownout detection. The typical value of the brownout detector threshold is 1.68V with an accuracy of ± 2% and is factory calibrated.

When the brownout detector is enabled and VDDFLASH decreases to a value below the trigger level (Vbot33-, defined as Vbot33 - hyst/2), the brownout output is immediately activated.

When VDDFLASH increases above the trigger level (Vbot33+, defined as Vbot33 + hyst/2), the reset is released. The brownout detector only detects a drop if the voltage on VDDCORE stays below the threshold voltage for longer than about 1µs.

The VDDFLASH threshold voltage has a hysteresis of about 50 mV, to ensure spike free brownout detection. The typical value of the brownout detector threshold is 2.80V with an accuracy of ± 3.5% and is factory calibrated.

The brownout detector is low-power, as it consumes less than 28 µA static current. However, it can be deactivated to save its static current. In this case, it consumes less than 1µA. The deactivation is configured through the GPNVM bit 0 of the Flash.

SAM7X Series [DATASHEET]

6120K–ATARM–11-Feb-14

9.2 Clock Generator

Embedded

Oscillator

Main

Oscillator

PLL and

Divider

Clock Generator

Power

Management

Controller

XIN

XOUT

PLLRC

Slow Clock SLCK

Main Clock MAINCK

PLL Clock PLLCK

Control

Status

The Clock Generator embeds one low-power RC Oscillator, one Main Oscillator and one PLL with the following characteristics:

 RC Oscillator ranges between 22 KHz and 42 KHz  Main Oscillator frequency ranges between 3 and 20 MHz  Main Oscillator can be bypassed  PLL output ranges between 80 and 200 MHz

It provides SLCK, MAINCK and PLLCK.

Figure 9-2. Clock Generator Block Diagram

SAM7X Series [DATASHEET]

6120K–ATARM–11-Feb-14

9.3 Power Management Controller

MCK

periph_clk[2..18]

int

UDPCK

SLCK

MAINCK

PLLCK

Prescaler

/1,/2,/4,...,/64

PCK

Processor

Clock

Controller

Idle Mode

Master Clock Controller

Peripherals

Clock Controller

ON/OFF

USB Clock Controller

ON/OFF

SLCK

MAINCK

PLLCK

Prescaler

/1,/2,/4,...,/64

Programmable Clock Controller

PLLCK

Divider /1,/2,/4

pck[0..3]

The Power Management Controller uses the Clock Generator outputs to provide:

 the Processor Clock PCK  the Master Clock MCK  the USB Clock UDPCK  all the peripheral clocks, independently controllable  four programmable clock outputs

The Master Clock (MCK) is programmable from a few hundred Hz to the maximum operating frequency of the device. The Processor Clock (PCK) switches off when entering processor idle mode, thus allowing reduced power consumption

while waiting for an interrupt.

Figure 9-3. Power Management Controller Block Diagram

9.4 Advanced Interrupt Controller

 Controls the interrupt lines (nIRQ and nFIQ) of an ARM Processor  Individually maskable and vectored interrupt sources

 Source 0 is reserved for the Fast Interrupt Input (FIQ)  Source 1 is reserved for system peripherals (RTT, PIT, EFC, PMC, DBGU, etc.)  Other sources control the peripheral interrupts or external interrupts  Programmable edge-triggered or level-sensitive internal sources  Programmable positive/negative edge-triggered or high/low level-sensitive external sources

 8-level Priority Controller

 Drives the normal interrupt nIRQ of the processor  Handles priority of the interrupt sources  Higher priority interrupts can be served during service of lower priority interrupt

 Vectoring

 Optimizes interrupt service routine branch and execution  One 32-bit vector register per interrupt source  Interrupt vector register reads the corresponding current interrupt vector

SAM7X Series [DATASHEET]

6120K–ATARM–11-Feb-14

 Protect Mode

 Easy debugging by preventing automatic operations

 Fast Forcing

 Permits redirecting any interrupt source on the fast interrupt

 General Interrupt Mask

 Provides processor synchronization on events without triggering an interrupt

9.5 Debug Unit

 Comprises:

 One two-pin UART  One Interface for the Debug Communication Channel (DCC) support  One set of Chip ID Registers  One Interface providing ICE Access Prevention

 Two-pin UART

 USART-compatible User Interface  Programmable Baud Rate Generator  Parity, Framing and Overrun Error  Automatic Echo, Local Loopback and Remote Loopback Channel Modes

 Debug Communication Channel Support

 Offers visibility of COMMRX and COMMTX signals from the ARM Processor

 Chip ID Registers

 Identification of the device revision, sizes of the embedded memories, set of peripherals  Chip ID is 0x275C 0A40 (MRL A) for SAM7X512  Chip ID is 0x275B 0940 (MRL A or B) for SAM7X256  Chip ID is 0x275B 0942 (MRL C) for SAM7X256  Chip ID is 0x275A 0740 (MRL A or B) for SAM7X128  Chip ID is 0x275A 0742 (MRL C) for SAM7X128

9.6 Periodic Interval Timer

 20-bit programmable counter plus 12-bit interval counter

9.7 Watchdog Timer

 12-bit key-protected Programmable Counter running on prescaled SLCK  Provides reset or interrupt signals to the system  Counter may be stopped while the processor is in debug state or in idle mode

9.8 Real-time Timer

 32-bit free-running counter with alarm running on prescaled SLCK  Programmable 16-bit prescaler for SLCK accuracy compensation

9.9 PIO Controllers

 Two PIO Controllers, each controlling 31 I/O lines  Fully programmable through set/clear registers  Multiplexing of two peripheral functions per I/O line  For each I/O line (whether assigned to a peripheral or used as general-purpose I/O)

 Input change interrupt

SAM7X Series [DATASHEET]

6120K–ATARM–11-Feb-14

 Half a clock period glitch filter  Multi-drive option enables driving in open drain  Programmable pull-up on each I/O line  Pin data status register, supplies visibility of the level on the pin at any time

 Synchronous output, provides Set and Clear of several I/O lines in a single write

9.10 Voltage Regulator Controller

The purpose of this controller is to select the Power Mode of the Voltage Regulator between Normal Mode (bit 0 is cleared) or Standby Mode (bit 0 is set).

SAM7X Series [DATASHEET]

6120K–ATARM–11-Feb-14

10. Peripherals

10.1 User Interface

The User Peripherals are mapped in the 256 Mbytes of address space between 0xF000 0000 and 0xFFFF EFFF. Each peripheral is allocated 16 Kbytes of address space.

A complete memory map is provided in Figure 8-1 on page 18.

10.2 Peripheral Identifiers

The SAM7X512/256/128 embeds a wide range of peripherals. Table 10-1 defines the Peripheral Identifiers of the SAM7X512/256/128. Unique peripheral identifiers are defined for both the Advanced Interrupt Controller and the Power Management Controller.

Table 10-1. Peripheral Identifiers

Peripheral ID Peripheral Mnemonic Peripheral Name

0 AIC Advanced Interrupt Controller FIQ 1 SYSC 2 PIOA Parallel I/O Controller A 3 PIOB Parallel I/O Controller B 4 SPI0 Serial Peripheral Interface 0 5 SPI1 Serial Peripheral Interface 1 6 US0 USART 0 7 US1 USART 1 8 SSC Synchronous Serial Controller 9 TWI Two-wire Interface 10 PWMC Pulse Width Modulation Contro ller 11 UDP USB Device Port 12 TC0 Timer/Counter 0 13 TC1 Timer/Counter 1 14 TC2 Timer/Counter 2 15 CAN CAN Controller 16 EMAC Ethernet MAC 17 ADC 18 - 29 Reserved 30 AIC Advanced Interrupt Controller IRQ0 31 AIC Advanced Interrupt Controller IRQ1

(1)

External Interrupt

System Controller

Analog-to Digital Converter

Note: 1. Setting SYSC and ADC bits in the clock set/clear registers of the PMC has no effect. The System Controller

and ADC are continuously clocked.

SAM7X Series [DATASHEET]

6120K–ATARM–11-Feb-14

+ 632 hidden pages

Atmel SAM7X512 , SAM7X256 , SAM7X128 Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual

Description

Features

1. Configuration Summary of the SAM7X512/256/128

2. SAM7X512/256/128 Block Diagram

3. Signal Description

4. Package

4.1 100-lead LQFP Package Outline

4.2 100-lead LQFP Pinout

4.3 100-ball TFBGA Package Outline

4.4 100-ball TFBGA Pinout

5. Power Considerations

5.1 Power Supplies

5.2 Power Consumption

5.3 Voltage Regulator

5.4 Typical Powering Schematics

6. I/O Lines Considerations

6.1 JTAG Port Pins

6.2 Test Pin

6.3 Reset Pin

6.4 ERASE Pin

6.5 PIO Controller Lines

6.6 I/O Lines Current Drawing

7. Processor and Architecture

7.1 ARM7TDMI Processor

7.2 Debug and Test Features

7.3 Memory Controller

7.4 Peripheral DMA Controller

8. Memories

8.1 SAM7X512

8.2 SAM7X256

8.3 SAM7X128

8.4 Memory Mapping

8.4.1 Internal SRAM

8.4.2 Internal ROM

8.4.3 Internal Flash

8.5 Embedded Flash

8.5.1 Flash Overview

8.5.2 Embedded Flash Controller

8.5.3 Lock Regions

8.5.3.1 SAM7X512

8.5.3.2 SAM7X256

8.5.3.3 SAM7X128

8.5.4 Security Bit Feature

8.5.5 Non-volatile Brownout Detector Control

8.5.6 Calibration Bits

8.6 Fast Flash Programming Interface

8.7 SAM-BA Boot Assistant

9. System Controller

9.1 Reset Controller

9.1.1 Brownout Detector and Power-on Reset

9.2 Clock Generator

9.3 Power Management Controller

9.4 Advanced Interrupt Controller

9.5 Debug Unit

9.6 Periodic Interval Timer

9.7 Watchdog Timer

9.8 Real-time Timer

9.9 PIO Controllers

9.10 Voltage Regulator Controller

10. Peripherals

10.1 User Interface

10.2 Peripheral Identifiers