Atmel ATSAMW25-MR210PB User Manual

Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016

ATSAMW25-MR210PB

IEEE 802.11 b/g/n SmartConnect Wi-Fi Module

DATASHEET

Description

The Atmel® | SMART SAMW25 module is based on the industry-leading lowpower 2.4GHz IEEE® 802.11 b/g/n Wi-Fi® ATWINC1500 SoC (System on Chip) combined with the ARM® Cortex®-M0+ based microcontroller technology from Atmel.

This turnkey system provides an integrated software solution with application and security protocols such as TLS and integrated network services (TCP/IP stack) which are all available through Atmel Studio 6 integrated development environment (IDE). The Atmel SmartConnect modules offer the ideal solutions for designers seeking to add Wi-Fi connectivity with minimal previous experience in

802.11, IP Stack, or RF. Atmel SmartConnect Wi-Fi opens the door of the Internet of Things (IoT) to the vast array of battery-powered devices and applications requiring the integration of WLAN connectivity without compromising on cost or power consumption. While we compete with other Wi-Fi modules on size, RF performance, cost, and other characteristics, the Atmel SmartConnect product family has a distinctive advantage when it comes to power consumption and power saving modes. The ATSAMW25 device is a standalone end point, where a complete small application can be executed on the module by itself.

Features

Key features with SAMW25 Wireless connectivity solution:



Certified Wi-Fi ATWINC1500B-MU-T with SAMD21 MCU



IEEE 802.11 b/g/n 20MHz (1x1) solution



Single spatial stream in 2.4GHz ISM band



Compact footprint: 33.863 x 14.882mm



Radio:

–

Output power - 802.11b /11Mbps: 17dBm ±1dB

– 802.11g /54Mbps: 16dBm ±1dB @ EVM -28dB – 802.11n /72Mbps: 14dBm ±1dB @ EVM -30dB



Application processor:

–

Atmel SAM D21 ARM Cortex M0+ based microcontroller

–

256KB embedded Flash and 32KB SRAM

–

Full-Speed USB Device and embedded Host



CryptoAuthentication™ ATECC508 (optional) I/O operating voltage:

2.7 to 3.6V



Power Amplifier and On-board Switching Regulator operating voltage:

2.7 to 4.3V



Power states supported:

–

Provision (AP/Sniffer) IDLE LISTEN

• IDLE

• SUSPEND



Extreme low-power, on-chip low-power sleep oscillator



Serial Host Interface SPI or UART



Software Upgrade Over-the-Air (OTA)



FCC, CE, IC, and TELEC Certified; RoHS compliant



Security protocols; WPA/WPA2 Personal, TLS, and SSL



Network services; DHCP, DNS, TCP/IP (IPv4), UDP, HTTP, and HTTPS

Target Applications



IoT applications



Smart appliances



Multimedia streaming



Safety and security



Home automation



Consumer electronics



Industrial automation

Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

Table of Contents

1 Block Diagram ............................................................................................................... 4

2 Ordering Information and IC Marking ........................................................................... 4

3 Pinout and Package Information .................................................................................. 5

3.1

Pin Description ........................................................................................................................................ 5

3.2

Package Description ............................................................................................................................... 8

4 Electrical Specifications ................................................................................................ 9

4.1

Absolute Ratings ..................................................................................................................................... 9

4.2

Recommended Operating Conditions ................................................................................................... 10

4.3

DC Electrical Characteristics ................................................................................................................. 10

5 Application and Core Subsystems ............................................................................. 11

5.1

Host Processor ...................................................................................................................................... 11

5.1.1

Host MCU Description .............................................................................................................. 11

5.1.2

Host MCU Key Features ........................................................................................................... 11

5.2

Wi-Fi Core Processor ............................................................................................................................ 11

5.2.1

Memory Subsystem .................................................................................................................. 12

5.2.2

Non-volatile Memory (eFuse).................................................................................................... 12

6 WLAN Subsystem ........................................................................................................ 13

6.1

MAC ................................................................................................................................................. 13

6.1.1

Features ................................................................................................................................... 13

6.1.2

Description ................................................................................................................................ 13

6.2

PHY ................................................................................................................................................. 14

6.2.1

Features ................................................................................................................................... 14

6.2.2

Description ................................................................................................................................ 14

6.3

Radio ................................................................................................................................................. 14

6.3.1

Receiver Performance .............................................................................................................. 14

6.3.2

Transmitter Performance .......................................................................................................... 16

7 Recommended Reflow Profile .................................................................................... 17

8 Module Schematic ....................................................................................................... 18

9 Bill of Materials (BOM)................................................................................................. 20

10 Application Schematic ................................................................................................ 21

11 Design Guidelines ....................................................................................................... 22

12 Reference Documentation and Support ..................................................................... 23

12.1

Reference Documents ........................................................................................................................... 23

12.2

Related Documents ............................................................................................................................... 23

13 Revision History .......................................................................................................... 24

Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

Atmel ordering code

Package

ATSAMW25-MR210PB

ATWINC1500 + SAM D21 module. Tray Packing.

ATSAMW25-MR510PA

ATWINC1500 + SAM D21 + ATECC508 module. Tray Packing.

ATSAMW25-XPRO

Xplained board evaluation kit

1 Block Diagram

Figure 1-1. ATSAMW25 Block Diagram

2 Ordering Information and IC Marking

Table 2-1. Ordering Details

Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

3 Pinout and Package Information

3.1

Pin Description

Figure 3-1. Pin Assignment

Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

Pin #

Pin description

I/O type

Function (default)

Programmable

pull-up/-down

resistor

GND

N/A

Common ground

UART_TxD

ATWINC1500 output

Currently used only for Atmel debug. Not for customer use. Leave unconnected.

Yes – pull-up

UART_RxD

ATWINC1500 input

Currently used only for Atmel debug. Not for customer use. Leave unconnected.

Yes – pull-up

Wi-Fi Chip_En

ATWINC1500 input

Currently used only for Atmel debug. Not for customer use. Leave unconnected.

Wi-Fi GPIO_1/RTC

ATWINC1500 I/O

ATWINC1500 General purpose I/O. Can also be used to input a

32.768KHz Real Time Clock for accurate timing of Wi-Fi sleep intervals

Yes – pull-up

Wi-Fi GPIO_3

ATWINC1500 General purpose I/O

Yes – pull-up

VBAT

Power

Supply for Wi-Fi RF Power Amplifier and Internal 1.3V Switching Regulator

PA16

See SAM D21G datasheet

Yes

PA17

See SAM D21G datasheet

Yes

GND

Power

Ground

PA18

See SAM D21G datasheet

Yes

PA19

See SAM D21G datasheet

Yes

PA20

See SAM D21G datasheet

Yes

PA21

See SAM D21G datasheet

Yes

PA22

See SAM D21G datasheet

Yes

PA23

See SAM D21G datasheet

Yes

GND

Power

Ground

PA24/USB_DM

See SAM D21G datasheet

Host Interface USB Data minus pin

Yes

PA25/USB_DP

See SAM D21G datasheet

Host Interface USB Data Plus pin

Yes

GND

Power

Ground

VCC

Power

Power supply for I/O

PB22

See SAM D21G datasheet

Yes

PB23

See SAM D21G datasheet

Yes

RESET_N

Input see SAM D21G

datasheet

System Reset. Low level on this pin resets the entire module.

Yes

PA30/SWCLK

See SAM D21G datasheet

Cortex Serial Wire Debug Interface CLK

Yes

Table 3-1. Pin Description

Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

Pin #

Pin description

I/O type

Function (default)

Programmable

pull-up/-down

resistor

PA31/SWDIO

See SAM D21G datasheet

Cortex Serial Wire Debug Interface Data I/O

Yes 27

PB02

See SAM D21G datasheet

Yes

PB03

See SAM D21G datasheet

Yes

PA00/GPIO/XIN32

See SAM D21G datasheet

Yes

PA01/GPIO/XOUT32

See SAM D21G datasheet

Yes

PA02

I/O

See SAM D21G datasheet

Yes

GND

Power

Ground

Yes

PA03

See SAM D21G datasheet

Yes

PA04

See SAM D21G datasheet

Yes

PA05

See SAM D21G datasheet

Yes

PA06

See SAM D21G datasheet

Yes

PA07

See SAM D21G datasheet

Yes

PA08

See SAM D21G datasheet

Yes

PA09

See SAM D21G datasheet

Yes

PA10

See SAM D21G datasheet

Yes

PA11

See SAM D21G datasheet

Yes

GND

Power

Ground

PB10

See SAM D21G datasheet

Yes

PB11

See SAM D21G datasheet

Yes

Wi-Fi GPIO_4

ATWINC1500 I/O

ATWINC1500 General purpose I/O

Yes – pull-up

Wi-Fi GPIO_5

ATWINC1500 I/O

ATWINC1500 General purpose I/O

Yes – pull-up

Wi-Fi GPIO_6

ATWINC1500 I/O

ATWINC1500 General purpose I/O

Yes – pull-up

Wi-Fi I2C_SCL

ATWINC1500 I/O

Currently used only for Atmel debug. Not for customer use. Leave unconnected.

Yes – pull-up

Wi-Fi I2C_SDA

ATWINC1500 I/O

Currently used only for Atmel debug. Not for customer use. Leave unconnected.

Yes – pull-up

Wi-Fi Reset_n

ATWINC1500 Input

Currently used only for Atmel debug. Not for customer use. Leave unconnected.

GND

Power

Ground

Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

BOTTOM VIEW

P51

GND

SIDE VIEW

TOP VIEW

SHIELD

SOLDER PADS FOOTPRINT - TOP VIEW

SHIELD

NOTE: GND PADS MUST

BE SOLDERED TO

SYSTEM GND.

NOTE: GND PADS MUST BE

SOLDERED TO GND.

ATSAMW25-MR210

Untoleranced

Dimensions

3.2

Package Description

The ATSAMW25-MR210PB package information.

Figure 3-2. SAMW25 MR210PB Package

Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

Parameters

Minimum

Maximum

Unit

VBAT power supply voltage

5.0

VCC power supply voltage

3.63

Pin voltage with respect to GND and VCC

GND-0.3

VCC+0.3

Storage temperature range

-40

+125

°C

Parameters

Minimum

Typical

Maximum

Unit

VBATT

3.0

3.6

4.3

°C

VCC

2.7

3.30

3.6

Operating temperature range

-40

Parameters

Value

Comments

Size

33.863 x 14.882mm

Connector pins pitch

See module footprint

Characteristic

Minimum

Typical

Maximum

Unit

Input Low Voltage V

-0.30

0.65

Input High Voltage V

VCC-0.60

VCC+0.30

Output Low Voltage V

0.45

Output High Voltage V

VCC-0.50

Output Loading

Digital Input Load

Pull-up Resistor

76K

90K

104K

Ω

4 Electrical Specifications

4.1

Absolute Ratings

All typical values are measured at T = 25°C unless otherwise specified. All minimum and maximum values are valid across operating temperature and voltage unless otherwise specified.

Table 4-1. Absolute Maximum Ratings

Table 4-2. General Operating Ratings

Table 4-3. Physical Characteristics

Table 4-4. I/O Pins Characteristics

I/O pin characteristics for pins 5, 45, 46, and 47 (for all other I/O, see the SAM D21G datasheet).

Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

Characteristic

Symbol

Minimum

Typical

Maximum

Unit

I/O supply voltage

VCC

2.7

3.3

3.6

Battery supply voltage

VBATT

3.0

3.6

4.3

Operating temperature

-40 85

ºC

Characteristic

Minimum

Maximum

Unit

Input Low Voltage V

-0.30

0.65

Input High Voltage V

VCC-0.60

VCC+0.30

Output Low Voltage V

0.45

Output High Voltage V

VCC-0.50

Output Loading 20

Digital Input Load

Pad Drive Strength (regular pads1)

13.5

Pad Drive Strength (high-drive pads1)

4.2

Recommended Operating Conditions

Table 4-5. Recommended Operating Conditions

Notes: 1. I/O supply voltage is applied to the following pins: VDDIO_A and VDDIO.

2. Battery supply voltage is applied to following pins: VDD_BATT_PPA, VDD_BATT_PA, and VBATT_BUCK.

4.3

DC Electrical Characteristics

Table 4-6 provides the DC characteristics for the ATSAMW25 digital pads.

Table 4-6. DC Electrical Characteristics

Note: 1. The following are high-drive pads: I2C_SCL, I2C_SDA; all other pads are regular.

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ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

5 Application and Core Subsystems

5.1

5.1.1

5.1.2

5.2

Host Processor

The Atmel | SMART SAM D ARM Cortex-M0+ based microcontroller (MCU) series builds on decades of innovation and experience in embedded Flash microcontroller technology. It not only sets a new benchmark for flexibility and ease-of-use but also combines the performance and energy efficiency of an ARM Cortex-M0+ based MCU with an optimized architecture and peripheral set. The Atmel | SMART SAM D gives you a truly differentiated general-purpose microcontroller that is ideal for many low-power, cost-sensitive industrial, and consumer applications.

Host MCU Description A rich set of peripherals, flexibility, and ease-of-use combined with low power consumption make the Atmel

SAM D21 ideal for a wide range of home automation, consumer, metering, and industrial applications.



ARM Cortex-M0+ based MCU running up to 48MHz



256KB embedded Flash and 32KB SRAM



DMA and Event system



Six flexible serial communication modules (SERCOM)



Full-speed USB device and embedded Host



12-bit ADC (SAM D21G: 14 channels); 10-bit DAC



Hardware touch support

Host MCU Key Features



Low power consumption, down to 70µA/MHz



Enhanced Analog Performance

–

ADC with offset and gain correction

–

Averaging, oversampling, and decimation

–

Flexible DAC

–

New low-power internal oscillators

–

±2% accuracy over operating range



Digital Innovations

–

Programmable Event System

–

Enhanced TC for Control Applications

–

Programmable SERCOM module

–

I2C / SPI / USART / LIN2 / IrDA

–

Full Speed USB Device and Host

–

No external components needed

–

6-12 channel DMA with CRC module

–

PTC Hardware touch module

–

I2S module with PDM support

Wi-Fi Core Processor

ATWINC1500B has a Cortus APS3 32-bit processor. This processor performs many of the MAC functions, including but not limited to association, authentication, power management, security key management, and MSDU aggregation/de-aggregation. In addition, the processor provides flexibility for various modes of operation, such as STA and AP modes.

Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

Used

Invalid

Reserved

MAC ADDR

Used

TX Gain

Correcti

Used

Freq.

Offset

F MAC Addr G

Version

Flags

Bank 0

Bank 1

Bank 2

Bank 3

Bank 4

Bank 5

128 Bits

5.2.1

Memory Subsystem

The APS3 core uses a 128KB instruction/boot ROM along with a 128KB instruction RAM and a 64KB data RAM. ATWINC1500B also has 8Mb of flash memory, which can be used for system software. In addition, the device uses a 128KB shared RAM, accessible by the processor and MAC, which allows the APS3 core to perform various data management tasks on the TX and RX data packets.

5.2.2

Non-volatile Memory (eFuse)

ATWINC1500B has 768 bits of non-volatile eFuse memory that can be read by the CPU after device reset. This non-volatile one-time-programmable (OTP) memory can be used to store customer-specific parameters, such as MAC address; various calibration information, such as TX power, crystal frequency offset, etc.; and other software-specific configuration parameters. The eFuse is partitioned into six 128-bit banks. Each bank has the same bit map, which is shown in Figure 5-1. The purpose of the first 80 bits in each bank is fixed, and the remaining 48 bits are general-purpose software dependent bits, or reserved for future use. Since each bank can be programmed independently, this allows for several updates of the device parameters following the initial programming, e.g. updating MAC address. Refer to ATWINC1500B Programming Guide for the eFuse programming instructions.

Figure 5-1. eFuse Bit Map

Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

6 WLAN Subsystem

The WLAN subsystem is composed of the Media Access Controller (MAC) and the Physical Layer (PHY). The following two subsections describe the MAC and PHY in detail.

6.1

6.1.1

6.1.2

MAC

Features

The ATWINC1500B IEEE802.11 MAC supports the following functions:



IEEE 802.11b/g/n



IEEE 802.11e WMM® QoS EDCA/PCF multiple access categories traffic scheduling



Advanced IEEE 802.11n features:

–

Transmission and reception of aggregated MPDUs (A-MPDU)

–

Transmission and reception of aggregated MSDUs (A-MSDU)

–

Immediate Block Acknowledgement

–

Reduced Interframe Spacing (RIFS)



Support for IEEE802.11i and WFA security with key management

–

WEP 64/128

–

WPA-TKIP

–

128-bit WPA2 CCMP (AES)



Support for WAPI security



Advanced power management

–

Standard 802.11 Power Save Mode

–

Wi-Fi Alliance WMM-PS (U-APSD)



RTS-CTS and CTS-self support



Supports either STA or AP mode in the infrastructure basic service set mode



Supports independent basic service set (IBSS)

Description The ATWINC1500B MAC is designed to operate at low power while providing high data throughput. The IEEE

802.11 logic, and a low-power, high-efficiency microprocessor. The combination of dedicated logic with a programmable processor provides optimal power efficiency and real-time response while providing the flexibility to accommodate evolving standards and future feature enhancements. Dedicated data path engines are used to implement data path functions with heavy computational. For example, an FCS engine checks the CRC of the transmitting and receiving packets, and a cipher engine performs all the required encryption and decryption operations for the WEP, WPA-TKIP, WPA2 CCMP-AES, and WAPI security requirements. Control functions, which have real-time requirements, are implemented using hardwired control logic modules. These logic modules offer real-time response while maintaining configurability via the processor. Examples of hardwired control logic modules are the channel access control module (implements EDCA/HCCA, Beacon TX control, inter-frame spacing, etc.), protocol timer module (responsible for the Network Access Vector, back-off timing, timing synchronization function, and slot management), MPDU handling module, aggregation/deaggregation module, block ACK controller (implements the protocol requirements for burst block communication), and TX/RX control FSMs (coordinate data movement between PHY-MAC interface, cipher engine, and the DMA interface to the TX/RX FIFOs).ø

The MAC functions implemented solely in software on the microprocessor have the following characteristics:

Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

MAC functions are implemented with a combination of dedicated data path engines, hardwired control



Functions with high memory requirements or complex data structures. Examples are association table management and power save queuing.

Parameter

Description

Minimum

Typical

Maximum

Unit

Frequency

2,412

2,484

MHz

Sensitivity

802.11b 1Mbps DSS

-98

dBm

2Mbps DSS

-94

dBm

5.5Mbps DSS

-92

dBm

11Mbps DSS

-88

dBm



Functions with low computational load or without critical real-time requirements. Examples are authentication and association.



Functions which need flexibility and upgradeability. Examples are beacon frame processing and QoS scheduling.

6.2

PHY

6.2.1

6.2.2

Features

The ATWINC1500B IEEE802.11 PHY supports the following functions:



Single antenna 1x1 stream in 20MHz channels



Supports IEEE 802.11b DSSS-CCK modulation: 1, 2, 5.5, and 11Mbps



Supports IEEE 802.11g OFDM modulation: 6, 9, 12,18, 24, 36, 48, and 54Mbps



Supports IEEE 802.11n HT modulations MCS0-7, 20MHz, 800 and 400ns guard interval: 6.5, 7.2, 13.0,

14.4, 19.5, 21.7, 26.0, 28.9, 39.0, 43.3, 52.0, 57.8, 58.5, 65.0, and 72.2Mbps



IEEE 802.11n mixed mode operation



Per packet TX power control



Advanced channel estimation/equalization, automatic gain control, CCA, carrier/symbol recovery, and frame detection

Description The ATWINC1500B WLAN PHY is designed to achieve reliable and power-efficient physical layer

communication specified by IEEE 802.11 b/g/n in single stream mode with 20MHz bandwidth. Advanced algorithms have been employed to achieve maximum throughput in a real world communication environment with impairments and interference. The PHY implements all the required functions such as FFT, filtering, FEC (Viterbi decoder), frequency and timing acquisition and tracking, channel estimation and equalization, carrier sensing, and clear channel assessment, as well as the automatic gain control.

6.3

Radio

6.3.1

Receiver Performance

Radio performance under typical conditions: VBAT = 3.3V; VDDIO = 3.3V; Temp.: 25°C @ RF pins

Table 6-1. Receiver Performance

Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

Parameter

Description

Minimum

Typical

Maximum

Unit

Sensitivity

802.11g

6Mbps OFDM

-90

dBm

9Mbps OFDM

-89

dBm

12Mbps OFDM

-88

dBm

18Mbps OFDM

-85

dBm

24Mbps OFDM

-83

dBm

36Mbps OFDM

-80

dBm

48Mbps OFDM

-76

dBm

54Mbps OFDM

-74

dBm

Sensitivity

802.11n (BW=20MHz)

MCS 0 -89

dBm

MCS 1 -87

dBm

MCS 2 -85

dBm

MCS 3 -82

dBm

MCS 4 -77

dBm

MCS 5 -74

dBm

MCS 6 -72

dBm

MCS 7 -70.5

dBm

Maximum Receive Signal Level 1-11Mbps DSS

dBm

6-54Mbps OFDM

dBm

MCS 0 – 7

dBm

Adjacent Channel Rejection

1Mbps DSS (30MHz offset)

50 dB

11Mbps DSS (25MHz offset)

43 dB

6Mbps OFDM (25MHz offset)

40 dB

54Mbps OFDM (25MHz offset)

25 dB

MCS 0 – 20MHz BW (25MHz offset)

40 dB

MCS 7 – 20MHz BW (25MHz offset)

20 dB

Cellular Blocker Immunity

776-794MHz CDMA

-14

dBm

824-849MHz GSM

-10

dBm

880-915MHz GSM

-10

dBm

1710-1785MHz GSM

-15

dBm

1850-1910MHz GSM

-15

dBm

1850-1910MHz WCDMA

-24

dBm

1920-1980MHz WCDMA

-24

dBm

Measured at RF pin assuming 50Ω differential; RF performance guaranteed for temperature range -30 to 85ºC. 1dB derating in performance at -40ºC.

Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

Parameter

Description

Minimum

Typical

Maximum

Unit

Frequency

2,412

2,484

MHz

Output Power1, ON_Transmit_High_Power Mode

802.11b 1Mbps

18.5 dBm

802.11b 11Mbps

19.5 dBm

802.11g 6Mbps

18.5 dBm

802.11g 54Mbps

16.5 dBm

802.11n MCS 0

17.0 dBm

802.11n MCS 7

14.5 dBm

Output Power1, ON_Transmit_Low_Power Mode

802.11b 1Mbps

17.0 dBm

802.11b 11Mbps

17.5 dBm

802.11g 6-18Mbps

16.0 dBm

802.11g >18Mbps

N/A dBm

802.11n MCS 0-3

14.5 dBm

802.11n >MCS 3

N/A dBm

TX Power Accuracy

±1.5

Carrier Suppression

30.0 dBc

Out of Band Transmit Power

76-108

-125

dBm/Hz

776-794

-125

dBm/Hz

869-960

-125

dBm/Hz

925-960

-125

dBm/Hz

1570-1580

-125

dBm/Hz

1805-1880

-125

dBm/Hz

1930-1990

-125

dBm/Hz

2110-2170

-125

dBm/Hz

Harmonic Output Power 2

-41

dBm/MHz

-41

dBm/MHz

6.3.2

Transmitter Performance

Radio performance under typical conditions: VBAT = 3.3V; VDDIO = 3.3V; Temp.: 25°C @ RF pins

Table 6-2. Transmitter Performance

Notes: 1. Measured at 802.11 spec compliant EVM/Spectral Mask.

2. Measured after RF matching network. See reference design.

Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

7 Recommended Reflow Profile

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ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

8 Module Schematic

The ATSAMW25-MR210PB/MR510PB Module schematic is shown in Figure 8-1.

Figure 8-1. ATSAMW25-MR210PB/MR510 Module Schematic

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ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

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ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

9 Bill of Materials (BOM)

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ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

10 Application Schematic

Figure 10-1. Connections for the ATSAMW25

The basic power supply connections for the ATSAMW25 module are shown in Figure 10-1. The test points shown (TP1 – TP6) should be added in case Atmel is required to debug the design.

The Wi-Fi chip can use its own internal oscillator for a Real Time Clock (RTC) or it can use an external

32.768KHz clock provided on the RTC pin. Using an external clock derived from a crystal oscillator can be used as a more accurate sleep timer for the Wi-Fi chip than its own internal oscillator. This in turn can reduce sleep current. If power consumption during sleep is a priority then a 32.768KHz crystal can be added to the SAM D21 module as shown in the reference design. The design shown above displays a connection from pin 15 (PA22) to pin 5 (GPIO_1).

GPIO_1 is the input pin for the Wi-Fi’s Real Time Clock. PA22 can be configured to output a 32.768KHz RTC clock – derived from the 32.768KHz crystal - to be used as the source for the Wi-Fi’s RTC. If cost is a priority versus power consumption, then the 32.768KHz crystal can be left off of the design and the PA22 – GPIO_1 connection can be deleted.

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ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

11 Design Guidelines

It is critical to follow the recommendations listed below to achieve the best RF performance:



When the module is placed on the motherboard, a provision for the antenna must be made. There should be nothing under the portion of the module which contains the antenna. This means the antenna should not be placed directly on top of the motherboard PCB. This can be accomplished by, for example, placing the module at the edge of the board such that the module edge with the antenna extends beyond the main board edge by 6.5mm. Alternatively, a cutout in the motherboard can be provided under the antenna. The cutout should be at least 22 x 6.5mm. Ground vias spaced 2.5mm apart should be placed all around the perimeter of the cutout. No large components should be placed near the antenna.



Keep away from antenna, as far as possible, large metal objects to avoid electromagnetic field blocking



Do not enclose the antenna within a metal shield



Keep any components which may radiate noise or signals within the 2.4 – 2.5GHz frequency band far away from the antenna, or better yet, shield those components. Any noise radiated from the main board in this frequency band will degrade the sensitivity of the module.



The main board should have a solid ground plane. Each ground pin of the module (including each of the center ground pads) should have a via placed either in the pad or right next to the pad going down to the ground plane.



Place a 10µF decoupling capacitor from VBAT to ground right next to pin 7. Place another 10µF capacitor from VCC to ground right next to pin 21.



Contact Atmel for assistance if any other placement is required

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Title

Content

Datasheet

This document

Design Files

User Guide, Schematic, PCB layout, Gerber, BOM, and System notes on: RF/Radio Full Test Report, radiation pattern, design guidelines, temperature performance, ESD.

Package

How to use package: Out of the Box starting guide, HW limitations and notes, SW Quick start guidelines.

Platform Getting started Guide

Best practices and recommendations to design a board with the product, including: Antenna Design for Wi-Fi (layout recommendations, types of antennas, impedance matching, using a power amplifier etc.), SPI/UART protocol between Wi-Fi SoC and the Host MCU.

HW Design Guide

Integration guide with clear description of: High level Arch, overview on how to write a networking application, list all API, parameters and structures. Features of the device, SPI/handshake protocol between device and host MCU, with flow/sequence/state diagram, timing.

SW Design Guide

Explain in details the flow chart and how to use each API to implement all generic use cases (e.g. start AP, start STA, provisioning, UDP, TCP, http, TLS, p2p, errors management, connection/transfer recovery mechanism/state diagram) - usage and sample application note.

12 Reference Documentation and Support

12.1

Reference Documents

Atmel offers a set of collateral documentation to ease integration and device ramp. The following list of documents available on Atmel web or integrated into development tools.

Table 12-1. Reference Documents

For a complete listing of development-support tools and documentation, visit http://www.atmel.com/ or contact the nearest Atmel field representative.

12.2

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13 Revision History

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Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 │ www.atmel.com

© 2016 Atmel Corporation. / Rev.: Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016. Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation in U.S. and

other countries. ARM®, ARM Connected® logo, Cortex®, and others are the registered trademarks or trademarks of ARM Ltd. Other terms and product names may be trademarks of others.

DISCLAIMER: The information in this document is provided in connection with Atmel products. No license , express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND COND ITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LI MITATION, DAMAGES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life.

SAFETY-CRITICAL, MILITARY, AND AUTOMOTIVE APPLICATIONS DISCLAIMER: Atmel products are not designed for and will not be used in connection with any applications where the fail ure of such products woul d reasonably be expecte d to result in significant personal injury or death (“Sa fety -Criti cal Applications”) without an Atme l officer's specific written con sent. Safety-Critical Applications include, without limitation, life support devices and systems, equipment or systems for the operation of nuclear facilities and weapons systems. Atmel products are not designed nor intended for use in military or aerospace applications or environments unless specifically designated by Atmel as military-grade. Atmel products are not designed nor intended for use in automotive applications unless specifically designated by Atmel as automotive-grade.

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ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

Atmel ATSAMW25-MR210PB User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1 Block Diagram

2 Ordering Information and IC Marking

3 Pinout and Package Information

Pin Description

Package Description

4 Electrical Specifications

Absolute Ratings

Recommended Operating Conditions

DC Electrical Characteristics

5 Application and Core Subsystems

Host Processor

Host MCU Description A rich set of peripherals, flexibility, and ease-of-use combined with low power consumption make the Atmel

Host MCU Key Features

Wi-Fi Core Processor

Memory Subsystem

Non-volatile Memory (eFuse)

6 WLAN Subsystem

MAC

Features

Description The ATWINC1500B MAC is designed to operate at low power while providing high data throughput. The IEEE

Description

PHY

Features

Radio

Receiver Performance

Transmitter Performance

7 Recommended Reflow Profile

8 Module Schematic

9 Bill of Materials (BOM)

10 Application Schematic

11 Design Guidelines

12 Reference Documentation and Support

Reference Documents

Related Documents

13 Revision History