– 131 Powerful Instructions – Most Single-clock Cycle Execution
– 32 x 8 General Purpose Working Registers
– Fully Static Operation
– Up to 16 MIPS Throughput at 16 MHz
– On-chip 2-cycle Multiplier
• High Endurance Non-volatile Memory segments
– 32Kbytes of In-System Self-programmable Flash program memory
– 1024Bytes EEPROM
– 2Kbyte Internal SRAM
– Write/Erase Cycles: 10,000 Flash/100,000 EEPROM
– Data retention: 20 years at 85°C/100 years at 25°C
– Optional Boot Code Section with Independent Lock Bits
In-System Programming by On-chip Boot Program
True Read-While-Write Operation
– Programming Lock for Software Security
• JTAG (IEEE std. 1149.1 Compliant) Interface
– Boundary-scan Capabilities According to the JTAG Standard
– Extensive On-chip Debug Support
– Programming of Flash, EEPROM, Fuses, and Lock Bits through the JTAG Interface
• Peripheral Features
– Two 8-bit Timer/Counters with Separate Prescalers and Compare Modes
– One 16-bit Timer/Counter with Separate Prescaler, Compare Mode, and Capture
Mode
– Real Time Counter with Separate Oscillator
– Four PWM Channels
– 8-channel, 10-bit ADC
8 Single-ended Channels
7 Differential Channels in TQFP Package Only
2 Differential Channels with Programmable Gain at 1x, 10x, or 200x
– Byte-oriented Two-wire Serial Interface
– Programmable Serial USART
– Master/Slave SPI Serial Interface
– Programmable Watchdog Timer with Separate On-chip Oscillator
– On-chip Analog Comparator
• Special Microcontroller Features
– Power-on Reset and Programmable Brown-out Detection
– Internal Calibrated RC Oscillator
– External and Internal Interrupt Sources
– Six Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, Standby
AVR® ATmega32 is a low-power CMOS 8-bit microcontroller based on the AVR
enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the
ATmega32 achieves throughputs approaching 1 MIPS per MHz allowing the system designer to
optimize power consumption versus processing speed.
Block DiagramFigure 2. Block Diagram
2503QS–AVR–02/11
3
ATmega32(L)
The Atmel® AVR® core combines a rich instruction set with 32 general purpose working registers. All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two
independent registers to be accessed in one single instruction executed in one clock cycle. The
resulting architecture is more code efficient while achieving throughputs up to ten times faster
than conventional CISC microcontrollers.
The ATmega32 provides the following features: 32Kbytes of In-System Programmable Flash
Program memory with Read-While-Write capabilities, 1024bytes EEPROM, 2Kbyte SRAM, 32
general purpose I/O lines, 32 general purpose working registers, a JTAG interface for Boundaryscan, On-chip Debugging support and programming, three flexible Timer/Counters with compare modes, Internal and External Interrupts, a serial programmable USART, a byte oriented
Two-wire Serial Interface, an 8-channel, 10-bit ADC with optional differential input stage with
programmable gain (TQFP package only), a programmable Watchdog Timer with Internal Oscillator, an SPI serial port, and six software selectable power saving modes. The Idle mode stops
the CPU while allowing the USART, Two-wire interface, A/D Converter, SRAM, Timer/Counters,
SPI port, and interrupt system to continue functioning. The Power-down mode saves the register
contents but freezes the Oscillator, disabling all other chip functions until the next External Interrupt or Hardware Reset. In Power-save mode, the Asynchronous Timer continues to run,
allowing the user to maintain a timer base while the rest of the device is sleeping. The ADC
Noise Reduction mode stops the CPU and all I/O modules except Asynchronous Timer and
ADC, to minimize switching noise during ADC conversions. In Standby mode, the crystal/resonator Oscillator is running while the rest of the device is sleeping. This allows very fast start-up
combined with low-power consumption. In Extended Standby mode, both the main Oscillator
and the Asynchronous Timer continue to run.
The device is manufactured using Atmel’s high density nonvolatile memory technology. The Onchip ISP Flash allows the program memory to be reprogrammed in-system through an SPI serial
interface, by a conventional nonvolatile memory programmer, or by an On-chip Boot program
running on the AVR core. The boot program can use any interface to download the application
program in the Application Flash memory. Software in the Boot Flash section will continue to run
while the Application Flash section is updated, providing true Read-While-Write operation. By
combining an 8-bit RISC CPU with In-System Self-Programmable Flash on a monolithic chip,
the Atmel ATmega32 is a powerful microcontroller that provides a highly-flexible and cost-effective solution to many embedded control applications.
The Atmel AVR ATmega32 is supported with a full suite of program and system development
tools including: C compilers, macro assemblers, program debugger/simulators, in-circuit emulators, and evaluation kits.
Pin Descriptions
VCCDigital supply voltage.
GNDGround.
Port A (PA7..PA0)Port A serves as the analog inputs to the A/D Converter.
Port A also serves as an 8-bit bi-directional I/O port, if the A/D Converter is not used. Port pins
can provide internal pull-up resistors (selected for each bit). The Port A output buffers have symmetrical drive characteristics with both high sink and source capability. When pins PA0 to PA7
are used as inputs and are externally pulled low, they will source current if the internal pull-up
resistors are activated. The Port A pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
2503QS–AVR–02/11
4
ATmega32(L)
Port B (PB7..PB0)Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port B output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port B pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
Port B also serves the functions of various special features of the ATmega32 as listed on page
57.
Port C (PC7..PC0)Port C is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port C output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port C pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port C pins are tri-stated when a reset condition becomes active,
even if the clock is not running. If the JTAG interface is enabled, the pull-up resistors on pins
PC5(TDI), PC3(TMS) and PC2(TCK) will be activated even if a reset occurs.
The TD0 pin is tri-stated unless TAP states that shift out data are entered.
Port C also serves the functions of the JTAG interface and other special features of the
ATmega32 as listed on page 60.
Port D (PD7..PD0)Port D is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port D output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port D pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port D pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
Port D also serves the functions of various special features of the ATmega32 as listed on page
62.
RESET
Reset Input. A low level on this pin for longer than the minimum pulse length will generate a
reset, even if the clock is not running. The minimum pulse length is given in Table 15 on page
37. Shorter pulses are not guaranteed to generate a reset.
XTAL1Input to the inverting Oscillator amplifier and input to the internal clock operating circuit.
XTAL2Output from the inverting Oscillator amplifier.
AVCCAVCC is the supply voltage pin for Port A and the A/D Converter. It should be externally con-
nected to V
, even if the ADC is not used. If the ADC is used, it should be connected to V
CC
CC
through a low-pass filter.
AREFAREF is the analog reference pin for the A/D Converter.
2503QS–AVR–02/11
5
ATmega32(L)
Resources A comprehensive set of development tools, application notes and datasheets are available for
download on http://www.atmel.com/avr.
Note:1.
Data RetentionReliability Qualification results show that the projected data retention failure rate is much less
than 1 PPM over 20 years at 85°C or 100 years at 25°C.
About Code
Examples
This documentation contains simple code examples that briefly show how to use various parts of
the device. These code examples assume that the part specific header file is included before
compilation. Be aware that not all C Compiler vendors include bit definitions in the header files
and interrupt handling in C is compiler dependent. Please confirm with the C Compiler documentation for more details.
$00 ($20)TWBRTwo-wire Serial Interface Bit Rate Register177
TWS6TWS5TWS4TWS3
–
Notes:1. When the OCDEN Fuse is unprogrammed, the OSCCAL Register is always accessed on this address. Refer to the debug-
ger specific documentation for details on how to use the OCDR Register.
2. Refer to the USART description for details on how to access UBRRH and UCSRC.
3. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses
should never be written.
4. Some of the Status Flags are cleared by writing a logical one to them. Note that the CBI and SBI instructions will operate on
all bits in the I/O Register, writing a one back into any flag read as set, thus clearing the flag. The CBI and SBI instructions
work with registers $00 to $1F only.
TWPS1TWPS0
178
2503QS–AVR–02/11
8
ATmega32(L)
Instruction Set Summary
MnemonicsOperandsDescriptionOperationFlags#Clocks
ARITHMETIC AND LOGIC INSTRUCTIONS
ADDRd, RrAdd two RegistersRd ← Rd + RrZ,C,N,V,H1
ADCRd, RrAdd with Carry two RegistersRd ← Rd + Rr + CZ,C,N,V,H1
ADIWRdl,KAdd Immediate to WordRdh:Rdl ← Rdh:Rdl + KZ,C,N,V,S2
SUBRd, RrSubtract two RegistersRd ← Rd - RrZ,C,N,V,H1
SUBIRd, KSubtract Constant from Register Rd ← Rd - KZ,C,N,V,H1
SBCRd, RrSubtract with Carry two RegistersRd ← Rd - Rr - CZ,C,N,V,H1
SBCIRd, KSubtract with Carry Constant from Reg.Rd ← Rd - K - CZ,C,N,V,H1
SBIWRdl,KSubtract Immediate from WordRdh:Rdl ← Rdh:Rdl - KZ,C,N,V,S2
ANDRd, RrLogical AND RegistersRd ← Rd • RrZ,N,V1
ANDIRd, KLogical AND Register and ConstantRd ← Rd • KZ,N,V1
ORRd, RrLogical OR RegistersRd ← Rd v RrZ,N,V1
ORIRd, KLogical OR Register and ConstantRd ← Rd v KZ,N,V1
EORRd, RrExclusive OR RegistersRd ← Rd ⊕ RrZ,N,V1
COMRdOne’s ComplementRd ← $FF − RdZ,C,N,V1
NEGRdTwo’s ComplementRd ← $00 − RdZ,C,N,V,H1
SBRRd,KSet Bit(s) in RegisterRd ← Rd v KZ,N,V1
CBRRd,KClear Bit(s) in RegisterRd ← Rd • ($FF - K)Z,N,V1
INCRdIncrementRd ← Rd + 1Z,N,V1
DECRdDecrementRd ← Rd − 1 Z,N,V1
TSTRdTest for Zero or MinusRd ← Rd • Rd Z,N,V1
CLRRdClear RegisterRd ← Rd ⊕ RdZ,N,V1
SERRdSet RegisterRd ← $FFNone1
MULRd, RrMultiply UnsignedR1:R0 ← Rd x RrZ,C2
MULSRd, RrMultiply SignedR1:R0 ← Rd x RrZ,C2
MULSURd, RrMultiply Signed with UnsignedR1:R0 ← Rd x RrZ,C2
FMULRd, RrFractional Multiply UnsignedR1:R0 ← (Rd x Rr) << 1Z,C2
FMULSRd, RrFractional Multiply SignedR1:R0 ← (Rd x Rr) << 1Z,C2
FMULSURd, RrFractional Multiply Signed with UnsignedR1:R0 ← (Rd x Rr) << 1Z,C2
BRANCH INSTRUCTIONS
RJMPkRelative JumpPC ← PC + k + 1None2
IJMPIndirect Jump to (Z)PC ← Z None2
JMPkDirect JumpPC ← kNone3
RCALLkRelative Subroutine Call PC ← PC + k + 1None3
ICALLIndirect Call to (Z)PC ← ZNone3
CALLkDirect Subroutine Call PC ← kNone4
RETSubroutine ReturnPC ← StackNone4
RETIInterrupt ReturnPC ← StackI4
CPSERd,RrCompare, Skip if Equalif (Rd = Rr) PC ← PC + 2 or 3None1 / 2 / 3
CPRd,RrCompareRd − RrZ, N,V,C,H1
CPCRd,RrCompare with CarryRd − Rr − CZ, N,V,C,H1
CPIRd,KCompare Register with ImmediateRd − KZ, N,V,C,H1
SBRCRr, bSkip if Bit in Register Clearedif (Rr(b)=0) PC ← PC + 2 or 3 None1 / 2 / 3
SBRSRr, bSkip if Bit in Register is Setif (Rr(b)=1) PC ← PC + 2 or 3None1 / 2 / 3
SBICP, bSkip if Bit in I/O Register Clearedif (P(b)=0) PC ← PC + 2 or 3 None1 / 2 / 3
SBISP, bSkip if Bit in I/O Register is Setif (P(b)=1) PC ← PC + 2 or 3None1 / 2 / 3
BRBSs, kBranch if Status Flag Setif (SREG(s) = 1) then PC←PC+k + 1None1 / 2
BRBCs, kBranch if Status Flag Clearedif (SREG(s) = 0) then PC←PC+k + 1None1 / 2
BREQ kBranch if Equal if (Z = 1) then PC ← PC + k + 1None1 / 2
BRNE kBranch if Not Equalif (Z = 0) then PC ← PC + k + 1None1 / 2
BRCS kBranch if Carry Setif (C = 1) then PC ← PC + k + 1None1 / 2
BRCC kBranch if Carry Clearedif (C = 0) then PC ← PC + k + 1None1 / 2
BRSH kBranch if Same or Higher if (C = 0) then PC ← PC + k + 1None1 / 2
BRLO kBranch if Lowerif (C = 1) then PC ← PC + k + 1None1 / 2
BRMI kBranch if Minusif (N = 1) then PC ← PC + k + 1None1 / 2
BRPL kBranch if Plus if (N = 0) then PC ← PC + k + 1None1 / 2
BRGE kBranch if Greater or Equal, Signedif (N ⊕ V= 0) then PC ← PC + k + 1None1 / 2
BRLT kBranch if Less Than Zero, Signedif (N ⊕ V= 1) then PC ← PC + k + 1None1 / 2
BRHS kBranch if Half Carry Flag Setif (H = 1) then PC ← PC + k + 1None1 / 2
BRHC kBranch if Half Carry Flag Clearedif (H = 0) then PC ← PC + k + 1None1 / 2
BRTS kBranch if T Flag Setif (T = 1) then PC ← PC + k + 1None1 / 2
BRTC kBranch if T Flag Clearedif (T = 0) then PC ← PC + k + 1None1 / 2
BRVS kBranch if Overflow Flag is Setif (V = 1) then PC ← PC + k + 1None1 / 2
BRVC kBranch if Overflow Flag is Clearedif (V = 0) then PC ← PC + k + 1None1 / 2
2503QS–AVR–02/11
9
ATmega32(L)
MnemonicsOperandsDescriptionOperationFlags#Clocks
BRIE kBranch if Interrupt Enabledif ( I = 1) then PC ← PC + k + 1None1 / 2
BRID kBranch if Interrupt Disabledif ( I = 0) then PC ← PC + k + 1None1 / 2
DATA TRANSFER INSTRUCTIONS
MOVRd, RrMove Between RegistersRd ← RrNone1
MOVWRd, RrCopy Register Word
LDIRd, KLoad ImmediateRd ← KNone1
LDRd, XLoad IndirectRd ← (X)None2
LDRd, X+Load Indirect and Post-Inc.Rd ← (X), X ← X + 1None2
LDRd, - XLoad Indirect and Pre-Dec.X ← X - 1, Rd ← (X)None2
LDRd, YLoad IndirectRd ← (Y)None2
LDRd, Y+Load Indirect and Post-Inc.Rd ← (Y), Y ← Y + 1None2
LDRd, - YLoad Indirect and Pre-Dec.Y ← Y - 1, Rd ← (Y)None2
LDDRd,Y+qLoad Indirect with DisplacementRd ← (Y + q)None2
LDRd, ZLoad Indirect Rd ← (Z)None2
LDRd, Z+Load Indirect and Post-Inc.Rd ← (Z), Z ← Z+1None2
LDRd, -ZLoad Indirect and Pre-Dec.Z ← Z - 1, Rd ← (Z)None2
LDDRd, Z+qLoad Indirect with DisplacementRd ← (Z + q)None2
LDSRd, kLoad Direct from SRAMRd ← (k)None2
STX, RrStore Indirect(X) ← RrNone2
STX+, RrStore Indirect and Post-Inc.(X) ← Rr, X ← X + 1None2
ST- X, RrStore Indirect and Pre-Dec.X ← X - 1, (X) ← RrNone2
STY, RrStore Indirect(Y) ← RrNone2
STY+, RrStore Indirect and Post-Inc.(Y) ← Rr, Y ← Y + 1None2
ST- Y, RrStore Indirect and Pre-Dec.Y ← Y - 1, (Y) ← RrNone2
STDY+q,RrStore Indirect with Displacement(Y + q) ← RrNone2
STZ, RrStore Indirect(Z) ← RrNone2
STZ+, RrStore Indirect and Post-Inc.(Z) ← Rr, Z ← Z + 1None2
ST-Z, RrStore Indirect and Pre-Dec.Z ← Z - 1, (Z) ← RrNone2
STDZ+q,RrStore Indirect with Displacement(Z + q) ← RrNone2
STSk, RrStore Direct to SRAM(k) ← RrNone2
LPMLoad Program MemoryR0 ← (Z)None3
LPMRd, ZLoad Program MemoryRd ← (Z)None3
LPMRd, Z+Load Program Memory and Post-IncRd ← (Z), Z ← Z+1None3
CLVClear Twos Complement OverflowV ← 0 V1
SETSet T in SREGT ← 1T1
CLTClear T in SREGT ← 0 T1
SEHSet Half Carry Flag in SREGH ← 1H1
Rd+1:Rd ← Rr+1:Rr
None1
2503QS–AVR–02/11
10
ATmega32(L)
MnemonicsOperandsDescriptionOperationFlags#Clocks
CLHClear Half Carry Flag in SREGH ← 0H1
MCU CONTROL INSTRUCTIONS
NOPNo OperationNone1
SLEEPSleep(see specific descr. for Sleep function)None1
WDRWatchdog Reset(see specific descr. for WDR/timer)None1
BREAKBreakFor On-Chip Debug OnlyNoneN/A
2503QS–AVR–02/11
11
ATmega32(L)
Ordering Information
Speed (MHz)Power SupplyOrdering Code
ATmega32L-8AU
ATmega32L-8AUR
82.7V - 5.5V
ATmega32L-8PU
ATmega32L-8MU
ATmega32L-8MUR
ATmega32-16AU
ATmega32-16AUR
164.5V - 5.5V
ATmega32-16PU
ATmega32-16MU
ATmega32-16MUR
(2)
(3)
(3)
(3)
(3)
Package
44A
44A
40P6
44M1
44M1
44A
44A
40P6
44M1
44M1
Notes:1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information
and minimum quantities.
2. Pb-free packaging complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also
Halide free and fully Green.
44A, 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness,
0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
C
44A
2010-10-20
PIN 1 IDENTIFIER
0°~7°
PIN 1
L
C
A1
A2A
D1
D
e
E1E
B
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Notes:
1. This package conforms to JEDEC reference MS-026, Variation ACB.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
3. Lead coplanarity is 0.10 mm maximum.
A – – 1.20
A1 0.05 – 0.15
A2 0.95 1.00 1.05
D 11.75 12.00 12.25
D1 9.90 10.00 10.10 Note 2
E 11.75 12.00 12.25
E1 9.90 10.00 10.10 Note 2
B 0.30 – 0.45
C 0.09 – 0.20
L 0.45 – 0.75
e 0.80 TYP
44A
ATmega32(L)
2503QS–AVR–02/11
13
40P6
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
40P6, 40-lead (0.600"/15.24 mm Wide) Plastic Dual
Inline Package (PDIP)
B
40P6
09/28/01
PIN
1
E1
A1
B
REF
E
B1
C
L
SEATING PLANE
A
0º ~ 15º
D
e
eB
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A––4.826
A10.381––
D52.070–52.578 Note 2
E15.240–15.875
E113.462–13.970 Note 2
B0.356–0.559
B11.041–1.651
L3.048–3.556
C0.203– 0.381
eB15.494–17.526
e2.540 TYP
Notes:1. This package conforms to JEDEC reference MS-011, Variation AC.
2. Dimensions D and E1 do not include mold Flash or Protrusion.
Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").
44M1, 44-pad, 7 x 7 x 1.0 mm Body, Lead
Pitch 0.50 mm, 5.20 mm Exposed Pad, Thermally
Enhanced Plastic Very Thin Quad Flat No
Lead Package (VQFN)
9/26/08
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A 0.80 0.90 1.00
A1 – 0.02 0.05
A3 0.20 REF
b 0.180.230.30
D
D2 5.005.205.40
6.907.007.10
6.907.007.10
E
E2 5.005.205.40
e 0.50 BSC
L 0.59 0.64 0.69
K0.200.260.41
Note: JEDEC Standard MO-220, Fig. 1 (SAW Singulation) VKKD-3.
TOP VIEW
SIDE VIEW
BOTTOM VIEW
D
E
Marked Pin# 1 ID
E2
D2
b
e
Pin #1 Corner
L
A1
A3
A
SEATING PLANE
Pin #1
Triangle
Pin #1
Chamfer
(C 0.30)
Option A
Option B
Pin #1
Notch
(0.20 R)
Option C
K
K
1
2
3
ATmega32(L)
2503QS–AVR–02/11
15
Errata
ATmega32(L)
ATmega32, rev. A
to F
• First Analog Comparator conversion may be delayed
• Interrupts may be lost when writing the timer registers in the asynchronous timer
• IDCODE masks data from TDI input
• Reading EEPROM by using ST or STS to set EERE bit triggers unexpected interrupt request.
1. First Analog Comparator conversion may be delayed
If the device is powered by a slow rising V
take longer than expected on some devices.
Problem Fix/Workaround
When the device has been powered or reset, disable then enable theAnalog Comparator
before the first conversion.
2. Interrupts may be lost when writing the timer registers in the asynchronous timer
The interrupt will be lost if a timer register that is synchronous timer clock is written when the
asynchronous Timer/Counter register (TCNTx) is 0x00.
Problem Fix/Workaround
Always check that the asynchronous Timer/Counter register neither have the value 0xFF nor
0x00 before writing to the asynchronous Timer Control Register (TCCRx), asynchronousTimer Counter Register (TCNTx), or asynchronous Output Compare Register (OCRx).
3. IDCODE masks data from TDI input
The JTAG instruction IDCODE is not working correctly. Data to succeeding devices are
replaced by all-ones during Update-DR.
Problem Fix / Workaround
–If ATmega32 is the only device in the scan chain, the problem is not visible.
–Select the Device ID Register of the ATmega32 by issuing the IDCODE instruction or
by entering the Test-Logic-Reset state of the TAP controller to read out the contents
of its Device ID Register and possibly data from succeeding devices of the scan
chain. Issue the BYPASS instruction to the ATmega32 while reading the Device ID
Registers of preceding devices of the boundary scan chain.
–If the Device IDs of all devices in the boundary scan chain must be captured
simultaneously, the ATmega32 must be the fist device in the chain.
, the first Analog Comparator conversion will
CC
2503QS–AVR–02/11
4. Reading EEPROM by using ST or STS to set EERE bit triggers unexpected interrupt
request.
Reading EEPROM by using the ST or STS command to set the EERE bit in the EECR register triggers an unexpected EEPROM interrupt request.
Problem Fix / Workaround
Always use OUT or SBI to set EERE in EECR.
16
ATmega32(L)
Datasheet
Revision
History
Changes from Rev.
2503P-07/09 to
Rev. 2503Q-02/11
Changes from Rev.
2503O-07/09 to
Rev. 2503P-07/10
Changes from Rev.
2503N-06/08 to
Rev.
2503O-07/09
Please note that the referring page numbers in this section are referred to this document. The
referring revision in this section are referring to the document revision.
1. Updated “Packaging Information” on page 333, by replacing the package 44A by a
correct one.
2. Updated the datasheet according to the Atmel new Brand Style Guide.
3. Updated “Ordering Information” on page 332 to include Tape & Reel devices.
1. Inserted Note in “Performing Page Erase by SPM” on page 251.
2. Note 6 and Note 7 in Table 119 on page 290 have been removed.
3. Updated “Performing Page Erase by SPM” on page 251.
1. Updated “Errata” on page 336 .
2. Updated the TOC with new template (version 5.10)
Changes from Rev.
2503M-05/08 to
Rev.
2503N-06/08
Changes from Rev.
2503L-05/08 to
Rev.
2503M-05/08
Changes from Rev.
2503K-08/07 to
Rev.
2503L-05/08
Changes from Rev.
2503J-10/06 to
Rev.
2503K-08/07
1. Added the note “Not recommended for new designs” on “Features” on page 1.
1. Updated “Ordering Information” on page 12:
- Commercial ordering codes removed.
- Non Pb-free package option removed.
2. Removed note from Feature list in “Analog to Digital Converter” on page 201.
3. Removed note from Table 84 on page 215.
1. Updated “Fast PWM Mode” on page 75 in “8-bit Timer/Counter0 with PWM” on page
69:
– Removed the last section describing how to achieve a frequency with 50% duty
cycle waveform output in fast PWM mode.
1. Renamed “Input Capture Trigger Source” to “Input Capture Pin Source” on page 94.
2. Updated “Features” on page 1.
3. Added “Data Retention” on page 6.
2503QS–AVR–02/11
4. Updated “Errata” on page 336.
17
5. Updated “Slave Mode” on page 136.
ATmega32(L)
Changes from Rev.
2503I-04/06 to Rev.
2503J-10/06
Changes from Rev.
2503H-03/05 to
Rev. 2503I-04/06
Changes from Rev.
2503G-11/04 to
Rev. 2503H-03/05
1. Updated “Fast PWM Mode” on page 99.
2. Updated Table 38 on page 80, Table 40 on page 81, Table 45 on page 108, Table 47 on
page 109, Table 50 on page 125 and Table 52 on page 126.
3. Updated typo in table note 6 in “DC Characteristics” on page 287.
4. Updated “Errata” on page 336.
1. Updated Figure 1 on page 2.
2. Added “Resources” on page 6.
3. Added note to “Timer/Counter Oscillator” on page 31.
4. Updated “Serial Peripheral Interface – SPI” on page 132.
5.Updated note in “Bit Rate Generator Unit” on page 175.
6. Updated Table 86 on page 218.
7. Updated “DC Characteristics” on page 287.
1. MLF-package alternative changed to “Quad Flat No-Lead/Micro Lead Frame Package
QFN/MLF”.
2. Updated “Electrical Characteristics” on page 287
2. Updated Table 7 on page 29, Table 15 on page 37, Table 81 on page 206, Table 114 on
page 272, Table 115 on page 273, and Table 118 on page 289.
3. Updated Figure 1 on page 2, Figure 46 on page 100.
4. Updated “Version” on page 226.
5. Updated “Calibration Byte” on page 258.
6. Added section “Page Size” on page 258.
7. Updated “ATmega32 Typical Characteristics” on page 296.
8. Updated “Ordering Information” on page 332.
1. Updated “Calibrated Internal RC Oscillator” on page 29.
2503QS–AVR–02/11
18
ATmega32(L)
Changes from Rev.
2503D-02/03 to
Rev. 2503E-09/03
Changes from Rev.
2503C-10/02 to
Rev. 2503D-02/03
1. Updated and changed “On-chip Debug System” to “JTAG Interface and On-chip
Debug System” on page 35.
2. Updated Table 15 on page 37.
3. Updated “Test Access Port – TAP” on page 219 regarding the JTAGEN fuse.
4. Updated description for Bit 7 – JTD: JTAG Interface Disable on page 228.
5. Added a note regarding JTAGEN fuse to Table 104 on page 257.
6. Updated Absolute Maximum Ratings* , DC Characteristics and ADC Characteristics in
“Electrical Characteristics” on page 287.
7. Added a proposal for solving problems regarding the JTAG instruction IDCODE in
“Errata” on page 336.
1. Added EEAR9 in EEARH in “Register Summary” on page 327.
2. Added Chip Erase as a first step in“Programming the Flash” on page 284 and “Pro-
gramming the EEPROM” on page 285.
3. Removed reference to “Multi-purpose Oscillator” application note and “32 kHz Crystal Oscillator” application note, which do not exist.
Changes from Rev.
2503B-10/02 to
Rev. 2503C-10/02
Changes from Rev.
2503A-03/02 to
Rev. 2503B-10/02
4. Added information about PWM symmetry for Timer0 and Timer2.
5. Added note in “Filling the Temporary Buffer (Page Loading)” on page 251 about writing to the EEPROM during an SPM Page Load.
6. Added “Power Consumption” data in “Features” on page 1.
7. Added section “EEPROM Write During Power-down Sleep Mode” on page 22.
8. Added note about Differential Mode with Auto Triggering in “Prescaling and Conver-
sion Timing” on page 204.
9. Updated Table 89 on page 232.
10.Added updated “Packaging Information” on page 333.
1. Updated the “DC Characteristics” on page 287.
1. Canged the endurance on the Flash to 10,000 Write/Erase Cycles.
2. Bit nr.4 – ADHSM – in SFIOR Register removed.
2503QS–AVR–02/11
3. Added the section “Default Clock Source” on page 25.
4. When using External Clock there are some limitations regards to change of frequency. This is described in “External Clock” on page 31 and Table 117 on page 289.
19
ATmega32(L)
5. Added a sub section regarding OCD-system and power consumption in the section
“Minimizing Power Consumption” on page 34.
6. Corrected typo (WGM-bit setting) for:
– “Fast PWM Mode” on page 75 (Timer/Counter0)
– “Phase Correct PWM Mode” on page 76 (Timer/Counter0)
– “Fast PWM Mode” on page 120 (Timer/Counter2)
– “Phase Correct PWM Mode” on page 121 (Timer/Counter2)
7. Corrected Table 67 on page 164 (USART).
8. Updated V
, IIL, and IIH parameter in “DC Characteristics” on page 287.
IL
9. Updated Description of OSCCAL Calibration Byte.
In the datasheet, it was not explained how to take advantage of the calibration bytes for 2, 4,
and 8 MHz Oscillator selections. This is now added in the following sections:
Improved description of “Oscillator Calibration Register – OSCCAL” on page 30 and “Cali-
bration Byte” on page 258.
10. Corrected typo in Table 42.
11. Corrected description in Table 45 and Table 46.
12. Updated Table 118, Table 120, and Table 121.
13. Added “Errata” on page 336.
2503QS–AVR–02/11
20
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2503QS–AVR–02/11
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