– 131 Powerful Instructions – Most Single-clock Cycle Execution
– 32 x 8 General Purpose Working Registers
– Fully Static Operation
– Up to 20 MIPS Throughput at 20 MHz
– On-chip 2-cycle Multiplier
• High Endurance Non-volat ile Memory segments
– 16/32/64K Bytes of In-System Self-programmable Flash program memory
– 512B/1K/2K Bytes EEPROM
– 1/2/4K Bytes Internal SRAM
– Write/Erase Cycles: 10,000 Flash/ 100,000 EEPROM
– Data retention: 20 years at 85°C/100 years at 25°C
– Optional Boot Code Section with Independent Lock Bits
• In-System Programming by On-chip Boot Program
• True Read-While-Write Operation
– Programming Lock for Software Security
• JTAG (IEEE std. 1149.1 Compliant) Interface
– Boundary-scan Capabilities According to the JTAG Standard
– Extensive On-chip Debug Support
– Programming of Flash, EEPROM, Fuses, and Lock Bits thr ough the JTAG Interface
• Peripheral Features
– Two 8-bit Timer/Counters with Separate Prescalers and Compare Modes
– One 16-bit Timer/Counter with Separate Prescaler, Compare Mode, and Capture Mode
– Real Time Counter with Separate Oscillator
– Six PWM Channels
– 8-channel, 10-bit ADC
• Differential mode with selectable gain at 1x, 10x or 200x
– Byte-oriented Two-wire Serial Interface
– Two Programmable Serial USART
– Master/Slave SPI Serial Interface
– Programmable Watchdog Timer with Separate On-chip Oscillator
– On-chip Analog Comparator
– Interrupt and Wake-up on Pin Change
• Special Microcontroller Features
– Power-on Reset and Programmable Brown-out Detection
– Internal Calibrated RC Oscillator
– External and Internal Interrupt Sources
– Six Sleep Modes: Idle, ADC Noise Reduction, Power -save, Power-down, Standby and
Note:The large center pad underneath the QFN/MLF package should be soldered to ground on the
board to ensure good mechanical stability.
2
8011GS–AVR–08/07
Page 3
2.Overview
PC5..0
PA7..0
TOSC1/PC6TOSC2/PC7
The ATmega164P/324P/644P is a low-power CMOS 8-bit microcontroller based on the AVR
enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the
ATmega164P/324P/644P achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus pr ocessing speed.
2.1Block Diagram
Figure 2-1.Block Diagram
ATmega164P/324P/644P
RESET
XTAL1
VCC
GND
XTAL2
Power
Supervision
POR / BOD &
RESET
Watchdog
Timer
Watchdog
Oscillator
Oscillator
Circuits /
Clock
Generation
EEPROM
JTAG/OCD
PORT A (8)
A/D
Converter
TWI
Internal
Bandgap reference
CPU
SRAMFLASH
PB7..0
PORT B (8)
Analog
Comparator
SPI
8bit T/C 0
16bit T/C 1
8bit T/C 2
USART 0
USART 1
8011GS–AVR–08/07
PORT C (8)
PORT D (8)
PD7..0
The AVR core combines a rich instruction set with 32 general purpose working registers. All the
32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent
registers to be accessed in one single instruction executed in one clock cycle. The resulting
3
Page 4
ATmega164P/324P/644P
architecture is more code efficient while achieving throughputs up to ten times faster than conventional CISC microcontrollers.
The ATmega164P/324P/644P provides the following features: 16/32/64K bytes of In-System
Programmable Flash with Read-While-Write capabilities, 512B/1K/2K bytes EEPROM, 1/2/4K
bytes SRAM, 32 general purpose I/O lines, 32 general purpose working registers, Real Time
Counter (RTC), three flexible Timer/Counters with compare modes an d PWM, 2 USARTs, a byte
oriented 2-wire Serial Interface, a 8-channel, 10-bit ADC with optional differential input stage
with programmable gain, programmable Watchdog Timer with Internal Oscillator, an SPI serial
port, IEEE std. 1149.1 compliant JTAG test interface, also used for accessing the On-chip
Debug system and programming and six software selectable power saving modes. The Idle
mode stops the CPU while allowing the SRAM, Timer/Counters, SPI port, and interrupt system
to continue functioning. The Power-down mode saves the register contents but freezes the
Oscillator, disabling all other chip functions until the next interrupt or Hardware Reset. In Powersave mode, the asynchronous timer continues to run, allowing the user to maintain a timer base
while the rest of the device is sleeping. The ADC Noise Reduction mode stops the CPU and all
I/O modules except Asynchronous Timer and ADC, to minimize switching noise during ADC
conversions. In Standby mode, the Crystal/Resonator Oscillator is running while the rest of the
device is sleeping. This allows very fast start-up combined with low power consumption. In
Extended Standby mode, both the main Oscillator and the Asynchronous Timer continue to run.
The device is manufactured using Atmel’s high-density nonvolatile memory technology. The Onchip ISP Flash allows the program memory to be reprogrammed in-system through an SPI serial
interface, by a conventional nonvolatile memory programmer, or by an On-chip Boot program
running on the AVR core. The boot program can use any interface to download the application
program in the application Flash memory. Software in the Boot Flash section will continue to run
while the Application Flash section is updated, providing true Read-While-Write operation. By
combining an 8-bit RISC CPU with In-System Self-Programmable Flash on a monolithic chip,
the Atmel ATmega164P/324P/644P is a powerful microcontroller that provides a highly flexible
and cost effective solution to many embedded control app lications.
The ATmega164P/324P/644P AVR is supported with a full suite of program and system development tools including: C compilers, macro assemblers, program debugger/simulators, in-circuit
emulators, and evaluation kits.
2.2Comparison Between ATmega164P, ATmega324P and ATmega644P
Table 2-1.Differences between ATmega164P and AT meg a6 44 P
Port A serves as analog inputs to the Analog-to-digital Conver ter.
Port A also serves as an 8-bit bi-directional I/O port with internal pull-up resistors (selected for
each bit). The Port A output buffers have symmetrical drive characteristics with both high sink
and source capability. As inputs, Port A pins that are externally pulled low will source current if
the pull-up resistors are activated. The Port A pins are tri-st ated when a reset co ndition becomes
active, even if the clock is not running.
Port A also serves the functions of various special features of the ATmega164P/324P/644P as
listed on page 80.
2.3.4Port B (PB7:PB0)
Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port B output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port B pins are tri-stated when a reset co ndition becomes active,
even if the clock is not running.
ATmega164P/324P/644P
Port B also serves the functions of various special features of the ATmega164P/324P/644P as
listed on page 82.
2.3.5Port C (PC7:PC0)
Port C is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port C output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port C pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port C pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
Port C also serves the functions of the JTAG interface, along with special features of the
ATmega164P/324P/644P as listed on page 85.
2.3.6Port D (PD7:PD0)
Port D is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port D output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port D pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port D pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
Port D also serves the functions of various special features of the ATmega164P/324P/644P as
listed on page 87.
2.3.7
RESET
Reset input. A low level on this pin for longer than the minimum pulse length will generate a
reset, even if the clock is not running. The minimum pulse length is given in ”System and Reset
Characteristics” on page 331. Shorter pulses are not guaranteed to generate a rese t.
2.3.8XTAL1
8011GS–AVR–08/07
Input to the inverting Oscillator amplifier and input to the internal clock operating circuit.
5
Page 6
ATmega164P/324P/644P
2.3.9XTAL2
2.3.10AVCC
2.3.11AREF
3.Resources
4.Data Retention
Output from the inverting Oscillator amplifier.
AVCC is the supply voltage pin for Port F and the Analog-to-digital Convert er. It should be exte rnally connected to V
to V
through a low-pass filter.
CC
This is the analog reference pin for the Analog-to-digital Converter.
A comprehensive set of development tools, application notes and datasheetsare available for
download on http://www.atmel.com/avr.
Reliability Qualification results show that the projected data retention failure rate is much less
than 1 PPM over 20 years at 85°C or 100 years at 25°C.
, even if the ADC is not used. If the ADC is used, it should be connected
Notes: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses
should never be written.
2. I/O registers within the address range $00 - $1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the value of single bits can be checked by using the SBIS and SBIC instructions.
3. Some of the status flags are cleared by writing a logical one to them. Note that the CBI and SBI instructions will operate on
all bits in the I/O register, writing a one back into any flag read as set, thus clearing the flag. The CBI and SBI instructions
work with registers 0x00 to 0x1F on ly.
4. When using the I/O specific commands IN and OUT, the I/O addresses $00 - $3F must be used. When addressing I/O registers as data space using LD and ST instructions, $20 must be added to these addresses. The A Tmega164P/324P/644P is a
complex microcontroller with more peripheral units than can be supported within the 64 location reserved in Opcode for the
IN and OUT instructions. For the Extended I/O space from $60 - $FF, only the ST/STS/STD and LD/LDS/LDD instructions
can be used.
10
8011GS–AVR–08/07
Page 11
ATmega164P/324P/644P
6.Instruction Set Summary
MnemonicsOperandsDescriptionOperationFlags#Clocks
ARITHMETIC AND LOGIC INSTRUCTIONS
ADDRd, RrAdd two RegistersRd ← Rd + RrZ,C,N,V,H1
ADCRd, RrAdd with Carry two RegistersRd ← Rd + Rr + CZ,C,N,V,H1
ADIWRdl,KAdd Immediate to WordRdh:Rdl ← Rdh:Rdl + KZ,C,N,V,S2
SUBRd, RrSubtract two RegistersRd ← Rd - RrZ,C,N,V,H1
SUBIRd, KSubtract Constant from Register Rd ← Rd - KZ,C,N,V,H1
SBCRd, RrSubtract with Carry two RegistersRd ← Rd - Rr - CZ,C,N,V,H1
SBCIRd, KSubtract with Carry Constant from Reg.Rd ← Rd - K - CZ,C,N,V,H1
SBIWRdl,KSubtract Immediate from WordRdh:Rdl ← Rdh:Rdl - KZ,C,N,V,S2
ANDRd, RrLogical AND RegistersRd ← Rd • RrZ,N,V1
ANDIRd, KLogical AND Register and ConstantRd ← Rd • KZ,N,V1
ORRd, RrLogical OR RegistersRd ← Rd v RrZ,N,V1
ORIRd, KLogical OR Register and ConstantRd ← Rd v KZ,N,V1
EORRd, RrExclusive OR RegistersRd ← Rd ⊕ RrZ,N,V1
COMRdOne’s ComplementRd ← 0xFF − RdZ,C,N,V1
NEGRdTwo’s ComplementRd ← 0x00 − RdZ,C,N,V,H1
SBRRd,KSet Bit(s) in RegisterRd ← Rd v KZ,N,V1
CBRRd,KClear Bit(s) in RegisterRd ← Rd • (0xFF - K)Z,N,V1
INCRdIncrementRd ← Rd + 1Z,N,V1
DECRdDecrementRd ← Rd − 1 Z,N,V1
TSTRdTest for Zero or MinusRd ← Rd • Rd Z,N,V1
CLRRdClear RegisterRd ← Rd ⊕ RdZ,N,V1
SERRdSet RegisterRd ← 0xFFNone1
MULRd, RrMultiply UnsignedR1:R0 ← Rd x RrZ,C2
MULSRd, RrMultiply SignedR1:R0 ← Rd x RrZ,C2
MULSURd, RrMultiply Signed with UnsignedR1:R0 ← Rd x RrZ,C2
FMULRd, RrFractional Multiply UnsignedR1:R0 ← (Rd x Rr) << 1Z,C2
FMULSRd, RrFractional Multiply SignedR1:R0 ← (Rd x Rr) << 1Z,C2
FMULSURd, RrFractional Multiply Signed with UnsignedR1:R0 ← (Rd x Rr) << 1Z,C2
BRANCH INSTRUCTIONS
RJMPkRelative JumpPC ← PC + k + 1None2
IJMPIndirect Jump to (Z)PC ← Z None2
JMPkDirect JumpPC ← kNone3
RCALLkRelative Subroutine Call PC ← PC + k + 1None4
ICALLIndirect Call to (Z)PC ← ZNone4
CALLkDirect Su broutine Call PC ← kNone5
RETSubroutine ReturnPC ← STACKNone5
RETIInterrupt ReturnPC ← STACKI5
CPSERd,RrCompare, Skip if Equalif (Rd = Rr) PC ← PC + 2 or 3None1/2/3
CPRd,RrCompareRd − RrZ, N,V,C,H1
CPCRd,RrCompare with CarryRd − Rr − CZ, N,V,C,H1
CPIRd,KCompare Register with ImmediateRd − KZ, N,V,C,H1
SBRCRr, bSkip if Bit in Register Clearedif (Rr(b)=0) PC ← PC + 2 or 3 None1/2/3
SBRSRr, bSkip if Bit in Registe r is Setif (Rr(b)=1) PC ← PC + 2 or 3None1/2/3
SBICP, bSkip if Bit in I/O Register Clearedif (P(b)=0) PC ← PC + 2 or 3 None1/ 2/3
SBISP, bSkip if Bit in I/O Register is Setif (P(b)=1) PC ← PC + 2 or 3None1/2/3
BRBSs, kBranch if Status Flag Setif (SREG(s) = 1) then PC←PC+k + 1None1/2
BRBCs, kBranch if Status Flag Cleare dif (SREG(s) = 0) then PC←PC+k + 1None1/2
BREQ kBranch if Equal if (Z = 1) then PC ← PC + k + 1None1/2
BRNE kBranch if Not Equalif (Z = 0) then PC ← PC + k + 1None1/2
BRCS kBranch if Carry Setif (C = 1) then PC ← PC + k + 1None1/2
BRCC kBranch if Carry Clearedif (C = 0) then PC ← PC + k + 1None1/2
BRSH kBranch if Same or Higher if (C = 0) then PC ← PC + k + 1None1/2
BRLO kBranch if Lowerif (C = 1) then PC ← PC + k + 1None1/2
BRMI kBranch if Minusif (N = 1) then PC ← PC + k + 1None1/2
BRPL kBranch if Plus if (N = 0) then PC ← PC + k + 1None1/2
BRGE kBranch if Greater or Equal, Signedif (N ⊕ V= 0) then PC ← PC + k + 1None1/2
BRLT kBranch if Less Than Zero, Signedif (N ⊕ V= 1) then PC ← PC + k + 1None1/2
BRHS kBranch if Half Carry Flag Setif (H = 1) then PC ← PC + k + 1None1/2
BRHC kBranch if Half Carry Flag Clearedif (H = 0) then PC ← PC + k + 1None1/2
BRTS kBranch if T Flag Setif (T = 1) then PC ← PC + k + 1None1/2
8011GS–AVR–08/07
11
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ATmega164P/324P/644P
MnemonicsOperandsDescriptionOperationFlags#Clocks
BRTC kBranch if T Flag Clearedif (T = 0) then PC ← PC + k + 1None1/2
BRVS kBranch if Overflow Flag is Setif (V = 1) then PC ← PC + k + 1None1/2
BRVC kBranch if Overflow Flag is Clearedif (V = 0) then PC ← PC + k + 1None1/2
BRIE kBranch if Interrupt Enabledif ( I = 1) then PC ← PC + k + 1None1/2
BRID kBranch if Interrupt Disabledif ( I = 0) then PC ← PC + k + 1None1/2
BIT AND BIT-TEST INSTRUCTIONS
SBIP,bSet Bit in I/O RegisterI/O(P,b) ← 1None2
CBIP,bClear Bit in I/O RegisterI/O(P,b) ← 0None2
LSLRdLogical Shift LeftRd(n+1) ← Rd(n), Rd(0) ← 0Z,C,N,V1
LSRRdLogical Shift RightRd(n) ← Rd(n+1), Rd(7) ← 0Z,C,N,V1
ROLRdRotate Left Through CarryRd(0)←C,Rd(n+1)← Rd(n),C←Rd(7)Z,C,N,V1
RORRdRotate Right Through CarryRd(7)←C,Rd(n)← Rd(n+1),C←Rd(0)Z,C,N,V1
ASRRdArithmetic Shift RightRd(n) ← Rd(n+1), n=0..6Z,C,N,V1
SWAPRdSwap NibblesRd(3..0)←Rd(7..4),Rd(7..4)←Rd(3..0)None1
BSETsFlag SetSREG(s) ← 1SREG(s)1
BCLRsFlag ClearSREG(s) ← 0 SREG(s)1
BSTRr, bBit Store from Register to TT ← Rr(b)T1
BLDRd, bBit load from T to RegisterRd(b) ← TNone1
SECSet CarryC ← 1C1
CLCClear CarryC ← 0 C1
SENSet Negative FlagN ← 1N1
CLNClear Negative FlagN ← 0 N1
SEZSet Zero FlagZ ← 1Z1
CLZClear Zero FlagZ ← 0 Z1
SEIGlobal Interrupt EnableI ← 1I1
CLIGlobal Interrupt DisableI ← 0 I1
SESSet Signed Test FlagS ← 1S1
CLSClear Signed Test FlagS ← 0 S1
SEVSet Twos Complement Overflow.V ← 1V1
CLVClear Twos Complement OverflowV ← 0 V1
SETSet T in SREGT ← 1T1
CLTClear T in SREGT ← 0 T1
SEHSet Half Carry Flag in SREGH ← 1H1
CLHClear Half Carry Flag in SREGH ← 0 H1
DATA TRANSFER INSTRUCTIONS
MOVRd, RrMove Between RegistersRd ← RrNone1
MOVWRd, RrCopy Register Word
LDIRd, KLoad ImmediateRd ← KNone1
LDRd, XLoad IndirectRd ← (X)None2
LDRd, X+Load Indirect and Post-Inc.Rd ← (X), X ← X + 1None2
LDRd, - XLoad Indirect and Pre-Dec.X ← X - 1, Rd ← (X)None2
LDRd, YLoad IndirectRd ← (Y)None2
LDRd, Y+Load Indirect and Post-Inc.Rd ← (Y), Y ← Y + 1None2
LDRd, - YLoad Indirect and Pre-Dec.Y ← Y - 1, Rd ← (Y)None2
LDDRd,Y+qLoad Indirect with DisplacementRd ← (Y + q)None2
LDRd, ZLoad Indirect Rd ← (Z)None2
LDRd, Z+Load Indirect and Post-Inc.Rd ← (Z), Z ← Z+1None2
LDRd, -ZLoad Indirect and Pre-Dec.Z ← Z - 1, Rd ← (Z)None2
LDDRd, Z+qLoad Indirect with DisplacementRd ← (Z + q)None2
LDSRd, kLoad Direct from SRAMRd ← (k)None2
STX, RrStore Indirect(X) ← RrNone2
STX+, RrStore Indirect and Post-Inc.(X) ← Rr, X ← X + 1None2
ST- X, RrStore Indirect and Pre-Dec.X ← X - 1, (X) ← RrNone2
STY, RrStore Indirect(Y) ← RrNone2
STY+, RrStore Indirect and Post-Inc.(Y) ← Rr, Y ← Y + 1None2
ST- Y, RrStore Indirect and Pre-Dec.Y ← Y - 1, (Y) ← RrNone2
STDY+q,RrStore Indirect with Displacement(Y + q) ← RrNone2
STZ, RrStore Indirect(Z) ← RrNone2
STZ+, RrStore Indirect and Post-Inc.(Z) ← Rr, Z ← Z + 1None2
ST-Z, RrStore Indirect and Pre-Dec.Z ← Z - 1, (Z) ← RrNone2
STDZ+q,RrStore Indirect with Displacement(Z + q) ← RrNone2
STSk, RrStore Direct to SRAM(k) ← RrNone2
LPMLoad Program MemoryR0 ← (Z)None3
LPMRd, ZLoad Program MemoryRd ← (Z)None3
LPMRd, Z+Load Program Memory and Post-IncRd ← (Z), Z ← Z+1None3
ELPMExtended Load Program MemoryR0 ← (RAMPZ:Z)None3
Rd+1:Rd ← Rr+1:Rr
None1
12
8011GS–AVR–08/07
Page 13
ATmega164P/324P/644P
MnemonicsOperandsDescriptionOperationFlags#Clocks
ELPMRd, ZExtended Load Program MemoryRd ← (Z)None3
ELPMRd, Z+Extended Load Program MemoryRd ← (RAMPZ:Z), RAMPZ:Z ←RAMPZ:Z+1None3
SPMStore Program Memory(Z) ← R1:R0NoneINRd, PIn PortRd ← PNone1
OUTP, RrOut PortP ← RrNone1
PUSHRrPush Register on StackSTACK ← RrNone2
POPRdPop Register from StackRd ← STACKNone2
MCU CONTROL INSTRUCTIONS
NOPNo OperationNone1
SLEEPSleep(see specific descr. for Sleep function)None1
WDRWatchdog Reset(see specific descr. for WDR/timer)None1
BREAKBreakFor On-chip Debug OnlyNoneN/A
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information
and minimum quantities.
2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also
Halide free and fully Green.
3. For Speed vs. V
see ”Speed Grades” on page 329.
CC
(1)
Operational Range
Industrial
o
C to 85oC)
(-40
Industrial
o
C to 85oC)
(-40
44A44-lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP)
40P640-pin, 0.600” Wide, Plastic Dual Inline Package (PDIP)
44M144-pad, 7 x 7 x 1.0 mm body, lead pitch 0.50 mm, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF)
16
Package Type
8011GS–AVR–08/07
Page 17
8.Packaging Information
8.144A
PIN 1
PIN 1 IDENTIFIER
ATmega164P/324P/644P
B
e
E1E
D1
D
C
0˚~7˚
A1
L
Notes:1. This package conforms to JEDEC reference MS-026, Variation ACB.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
3. Lead coplanarity is 0.10 mm maximum.
A2A
SYMBOL
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
A––1.20
A10.05–0.15
A2 0.951.001.05
D11.7512.0012.25
D19.9010.0010.10Note 2
E11.7512.0012.25
E19.9010.0010.10Note 2
B 0.30–0.45
C0.09–0.20
L0.45– 0.75
e0.80 TYP
NOM
MAX
NOTE
2325 Orchard Parkway
R
San Jose, CA 95131
8011GS–AVR–08/07
TITLE
44A, 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness,
0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
10/5/2001
DRAWING NO.
44A
REV.
B
17
Page 18
ATmega164P/324P/644P
8.240P6
PIN
1
E1
A1
B
REF
E
B1
C
L
SEATING PLANE
A
D
e
0º ~ 15º
eB
Notes:1. This package conforms to JEDEC reference MS-011, Variation AC.
2. Dimensions D and E1 do not include mold Flash or Protrusion.
Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").
2325 Orchard Parkway
R
San Jose, CA 95131
TITLE
40P6, 40-lead (0.600"/15.24 mm Wide) Plastic Dual
Inline Package (PDIP)
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A––4.826
A10.381––
D52.070–52.578 Note 2
E15.240–15.875
E113.462–13.970 Note 2
B0.356–0.559
B11.041–1.651
L3.048–3.556
C0.203– 0.381
eB15.494–17.526
e2.540 TYP
MIN
NOM
MAX
DRAWING NO.
40P6
NOTE
09/28/01
REV.
B
18
8011GS–AVR–08/07
Page 19
8.344M1
ATmega164P/324P/644P
D
Marked Pin# 1 ID
E
SEATING PLANE
TOP VIEW
K
L
D2
Pin #1 Corner
1
2
3
Option A
E2
Option B
K
b
e
Option C
BOTTOM VIEW
Note: JEDEC Standard MO-220, Fig. 1 (SAW Singulation) VKKD-3.
Pin #1
Triangle
Pin #1
Chamfer
(C 0.30)
Pin #1
Notch
(0.20 R)
A1
A3
A
SIDE VIEW
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A 0.80 0.90 1.00
A1 – 0.02 0.05
A3 0.25 REF
b 0.180.230.30
D
D2 5.005.205.40
E
E2 5.005.205.40
e 0.50 BSC
L 0.59 0.64 0.69
K0.200.260.41
MIN
6.907.007.10
6.907.007.10
NOM
MAX
NOTE
2325 Orchard Parkway
R
San Jose, CA 95131
8011GS–AVR–08/07
TITLE
44M1, 44-pad, 7 x 7 x 1.0 mm Body, Lead Pitch 0.50 mm,
5.20 mm Exposed Pad, Micro Lead Frame Package (MLF)
DRAWING NO.
44M1
5/27/06
REV.
G
19
Page 20
ATmega164P/324P/644P
9.Errata
9.1ATmega164P Rev. A
No known Errata.
9.2ATmega324P Rev. A
No known Errata.
9.3ATmega644P Rev. A
No known Errata.
20
8011GS–AVR–08/07
Page 21
10. Datasheet Revision History
Please note that the referring page numbers in this section are referred to this document. The
referring revision in this section are referring to the document revision.
10.1Rev. 8011G- 08/07
1.Updated ”Features” on page 1
2.Added ”Data Retention” on page 8.
3.Updated ”SPH and SPL – Stack Pointer High and Stack pointer Low” on page 14.
4.LCD reference removed from table note in ”Sleep Modes” on page 42.
5.Updated code example in ”Bit 0 – IVCE: Interrupt Vector Change Enable” on page 65.
6.Removed reference to External Memory Interface in ”Alternate Functions of Port A” on
page 80.
7.Updated ”Data Reception – The USART Receiver” on page 180.
8.Updated ”ADCSRB – ADC Control and Status Register B” on page 238.
9.Updated overview in ”ADC - Analog-to-digital Converter” on page 240.
10.Added ”ATmega644P Typical Characteristic” on page 388.
11.Updated Figure 28-31 on page 354, Figure 28-32 on page 355,Figure 28-33 on page
355
12.Updated notes in Table 8-3 on page 32.Table 8 -8 on page 35, Table 8-9 on page 36,
and Table 8-11 on page 37.
13.Updated Table 13-7 on page 84 , Table 13-8 on page 84, Table 13-10 on page 86,
Table 13-11 on page 87, Table 13-14 on page 90, Table 27-1 on page 327,Table 27-2
on page 327,Table 27-5 on page 330, Table 27-9 on page 332, and Table 27-12 on
page 336
14.Updated ”ATmega324P DC Characteristics” on page 3 27 an d ”A Tmega644P DC Char-
acteristics” on page 328.
15.Updated Table 27-7 on page 331 and Table 8-13 on page 37.
ATmega164P/324P/644P
10.2Rev. 8011F- 04/07
1.Updated ”Watchdog Timer Configuration” on page 59.
10.3Rev. 8011E - 04/07
1.Updated ”GTCCR – General Timer/Counter Control Register” on page 159.
2.Updated ”EECR – The EEPROM Control Register” on page 23.
8011GS–AVR–08/07
21
Page 22
ATmega164P/324P/644P
10.4Rev. 8011D - 02/07
1.Updated “Pinout ATmega164P/324P/644P” on page 2.
2.Updated ”Power-down Mode” on page 44.
3.Updated note in Table 11-1 on page 68.
4.Updated Table 23-1 on page 272.
5.Updated ”Boot Size Configuration
6.Updated V
7.Updated note 3 and 4 in ”DC Characteristics” on page 325.
8.Added note to ”ATmega164P DC Characteristics” on page 32 7.
9.Added note to ”ATmega324P DC Characteristics” on page 32 7.
10.Updated Figure 27-13 on page 345 and Figure 27-60 on page 370.
10.5Rev. 8011C - 10/06
1.Updated ”DC Characteristics” on page 325.
10.6Rev. 8011B - 09/06
1.Updated ”DC Characteristics” on page 325.
(1)
” on page 289.
limits in ”DC Characteristics” on page 325.
OL
10.7Rev. 8011A - 08/06
1.Initial revision.
22
8011GS–AVR–08/07
Page 23
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