ATMEL AT27C2048 User Manual

BDTIC www.BDTIC.com/ATMEL

Features

Fast Read Access Time – 55 ns
Low Power CMOS Operation
– 100 µA Maximum Standby – 35 mA Maximum Active at 5 MHz
JEDEC Standard Packages
– 40-lead PDIP – 44-lead PLCC – 40-lead VSOP
Direct Upgrade from 512-Kbit and 1-Mbit (AT27C516 and AT27C1024) EPROMs
5V ± 10% Power Supply
High Reliability CMOS Technology
– 2,000V ESD Protection – 200 mA Latchup Immunity
Rapid
CMOS and TTL Compatible Inputs and Outputs
Integrated Product Identification Code
Industrial Temperature Range
Programming Algorithm – 50 µs/Word (Typical)
2-Megabit (128K x 16) OTP EPROM
AT27C2048

1. Description

The AT27C2048 is a low-power, high-performance 2,097,152-bit one-time program­mable read-only memory (OTP EPROM) organized 128K by 16 bits. It requires a single 5V power supply in normal read mode operation. Any word can be accessed in less than 55 ns, eliminating the need for speed-reducing WAIT states. The by-16 organization makes this part ideal for high-performance 16 and 32 bit microprocessor systems.
In read mode, the AT27C2048 typically consumes 15 mA. Standby mode supply cur­rent is typically less than 10 µA.
The AT27C2048 is available in industry-standard JEDEC-approved one-time pro­grammable (OTP) plastic PDIP, PLCC, and VSOP packages. The device features two-line control (CE
With high density 128K word storage capability, the AT27C2048 allows firmware to be stored reliably and to be accessed by the system without the delays of mass storage media.
Atmel’s AT27C2048 has additional features that ensure high quality and efficient pro­duction use. The Rapid the part and guarantees reliable programming. Programming time is typically only 50 µs/word. The Integrated Product Identification Code electronically identifies the device and manufacturer. This feature is used by industry-standard programming equipment to select the proper programming algorithms and voltages.
, OE) to eliminate bus contention in high-speed systems.
Programming Algorithm reduces the time required to program
0632F–EPROM–12/07

2. Pin Configurations

Pin Name Function
A0 - A16 Addresses
O0 - O15 Outputs
CE
OE
PGM
Chip Enable
Output Enable
Program Strobe
NC No Connect
DC Don’t Connect
Note: Both GND pins must be connected.

2.1 40-lead PDIP Top View

2.2 40-lead VSOP (Type 1) Top View

A10 A11 A12 A13 A14 A15 A16
PGM
VCC
VPP
CE O15 O14 O13 O12 O11 O10
O9
O8
1
A9
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
GND
40
A8
39
A7
38
A6
37
A5
36
A4
35
A3
34
A2
33
A1
32
A0
31
OE
30
O0
29
O1
28
O2
27
O3
26
O4
25
O5
24
O6
23
O7
22
GND
21

2.3 44-lead PLCC Top View

VPP
CE O15 O14 O13 O12 O11 O10
O9
O8
GND
O7
O6
O5
O4
O3
O2
O1
O0
OE
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
40
VCC
39
PGM
38
A16
37
A15
36
A14
35
A13
34
A12
33
A11
32
A10
31
A9
30
GND
29
A8
28
A7
27
A6
26
A5
25
A4
24
A3
23
A2
22
A1
21
A0
Note: Note: PLCC package pins 1 and 23 are Don’t Connect.
GND
O13
O14
O15CEVPPDCVCC
65432
7
O12
8
O11
9
O10
10
O9
11
O8
12 13
NC
14
O7
15
O6
16
O5
17
O4
1819202122232425262728
O3O2O1
O0
OE
1
DC
PGM
A16
A15
4443424140
A0A1A2A3A4
A14
39 38 37 36 35 34 33 32 31 30 29
A13 A12 A11 A10 A9 GND NC A8 A7 A6 A5
2
AT27C2048
0632F–EPROM–12/07

3. System Considerations

Switching between active and standby conditions via the Chip Enable pin may produce transient voltage excursions. Unless accommodated by the system design, these transients may exceed datasheet limits, resulting in device non-conformance. At a minimum, a 0.1 µF high frequency, low inherent inductance, ceramic capacitor should be utilized for each device. This capacitor should be connected between the V device as possible. Additionally, to stabilize the supply voltage level on printed circuit boards with large EPROM arrays, a 4.7 µF bulk electrolytic capacitor should be utilized, again con­nected between the V possible to the point where the power supply is connected to the array.

4. Block Diagram

AT27C2048
and Ground terminals of the device, as close to the
CC
and Ground terminals. This capacitor should be positioned as close as
CC
VCC GND VPP
OE
CE
A0 - A17
OE, CE AND
PROGRAM LOGIC
Y DECODER
ADDRESS
INPUTS
X DECODER

5. Absolute Maximum Ratings*

Temperature Under Bias............................... -55° C to +125° C
Storage Temperature .................................... -65°C to +150° C
Voltage on Any Pin with
Respect to Ground .........................................-2.0V to +7.0V
Voltage on A9 with
Respect to Ground ......................................-2.0V to +14.0V
VPP Supply Voltage with
Respect to Ground .......................................-2.0V to +14.0V
DATA OUTPUTS
O0 - O15
OUTPUT
BUFFERS
Y-GATING
CELL MATRIX
IDENTIFICATION
*NOTICE: Stresses beyond those listed under “Absolute Maxi-
mum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other condi-
(1)
(1)
(1)
tions beyond those indicated in the operational sec­tions of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Note: 1. Maximum voltage is -0.6V DC which may undershoot to -2.0V for pulses of less than 20 ns. Maximum output pin voltage is
V
+ 0.75V DC which may overshoot to +7.0V for pulses of less than 20 ns.
CC
0632F–EPROM–12/07
3

6. Operating Modes

Mode/Pin CE OE PGM Ai V
Read V
IL
Output Disable X V
Standby V
Rapid Program
(2)
PGM Verify V
PGM Inhibit V
Product Identification
(4)
IH
V
IL
IL
IH
V
IL
V
IL
IH
XX X X
V
IH
V
IL
XX X V
V
IL
(1)
X
Ai X
X X X High Z
V
IL
V
IH
X
Ai V
Ai V
A9 = V
(3)
H
A0 = VIH or VIL A1 - A16 = V
IL
V
PP
(1)
(5)
PP
PP
PP
CC
Outputs
High Z
High Z
Identification Code
Notes: 1. X can be VIL or VIH.
2. Refer to the Programming characteristics.
3. V
= 12.0 ± 0.5V.
H
4. Two identifier words may be selected. All Ai inputs are held low (VIL), except A9, which is set to VH, and A0, which is toggled low (VIL) to select the Manufacturer’s Identification word and high (VIH) to select the Device Code word.
5. Standby V
current (ISB) is specified with VPP = VCC. VCC > VPP will cause a slight increase in ISB.
CC

7. DC and AC Operating Conditions for Read Operation

AT27C2048
-55 -90
Industrial Operating Temperature (Case) -40° C - 85° C-40° C - 85° C
D
OUT
D
IN
D
OUT
Power Supply 5V ± 10% 5V ± 10%
V
CC

8. DC and Operating Characteristics for Read Operation

Symbol Parameter Condition Min Max Units
I
LI
I
LO
(2)
I
PP1
I
SB
I
CC
V
IL
V
IH
V
OL
V
OH
Notes: 1. V
2. V
Input Load Current VIN = 0V to V
Output Leakage Current V
(1)
V
Read/Standby Current VPP = V
PP
(1)
V
Standby Current
CC
= 0V to V
OUT
(CMOS)
I
SB1
= V
CE
(TTL)
I
SB2
= 2.0 to V
CE
VCC Active Current f = 5 MHz, I
CC
CC
CC
CC
± 0.3V
+ 0.5V
CC
= 0 mA, CE = V
OUT
IL
Input Low Voltage -0.6 0.8 V
Input High Voltage 2.0 VCC + 0.5 V
Output Low Voltage IOL = 2.1 mA 0.4 V
Output High Voltage I
must be applied simultaneously or before VPP, and removed simultaneously or after VPP.
CC
may be connected directly to VCC, except during programming. The supply current would then be the sum of ICC and IPP.
PP
= -400 µA 2.4 V
OH
± A
± A
10 µA
100 µA
1mA
35 mA
4
AT27C2048
0632F–EPROM–12/07

9. AC Characteristics for Read Operation

AT27C2048
AT27C2048
-55 -90
Symbol Parameter Condition
= OE
t
t
t
t
t
ACC
CE
OE
DF
OH
(3)
(2)
(2)(3)
(4)(5)
(4)
Address to Output Delay
CE to Output Delay OE = V
OE to Output Delay CE = V
OE or CE High to Output Float, Whichever Occurred First 20 20 ns
Output Hold from Address, CE or OE, Whichever Occurred First
CE = V
IL
IL
IL
Note: 2, 3, 4, 5. See the AC Waveforms for Read Operation diagram.
10. AC Waveforms for Read Operation
(1)
Min Max Min Max
Units
55 90 ns
55 90 ns
20 35 ns
70 ns
Notes: 1. Timing measurement references are 0.8V and 2.0V. Input AC drive levels are 0.45V and 2.4V, unless otherwise specified.
2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE.
3. OE
may be delayed up to t
- tOE after the address is valid without impact on t
ACC
ACC
.
4. This parameter is only sampled and is not 100% tested.
5. Output float is defined as the point when data is no longer driven.
0632F–EPROM–12/07
5

11. Input Test Waveforms and Measurement Levels

For -55 devices only:
t
, tF < 5 ns (10% to 90%)
R
For -90 devices:
, tF < 20 ns (10% to 90%)
t
R

12. Output Test Load

Note: CL = 100 pF including jig capacitance, except for the -55 devices, where CL = 30 pF.

13. Pin Capacitance

Symbol Typ Max Units Conditions
C
C
Note: Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested.
IN
OUT
410pFV
812pFV
IN
OUT
= 0V
= 0V
6
AT27C2048
0632F–EPROM–12/07
AT27C2048
14. Programming Waveforms
(1)
Notes: 1. The Input Timing Reference is 0.8V for VIL and 2.0V for VIH.
2. tOE and t
are characteristics of the device but must be accommodated by the programmer.
DFP
3. When programming the AT27C2048, a 0.1 µF capacitor is required across V transients.

15. DC Programming Characteristics

TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V
Symbol Parameter Test Conditions
I
V
V
V
V
I
I
V
LI
IL
IH
OL
OH
CC2
PP2
ID
Input Load Current VIN = VIL, V
IH
Input Low Level -0.6 0.8 V
Input High Level 2.0 V
Output Low Voltage IOL = 2.1 mA 0.4 V
Output High Voltage IOH = -400 µA 2.4 V
VCC Supply Current (Program and Verify) 50 mA
VPP Supply Current CE = V
IL
A9 Product Identification Voltage 11.5 12.5 V
and ground to suppress spurious voltage
PP
Limits
UnitsMin Max
±10 µA
+ 0.5 V
CC
30 mA
0632F–EPROM–12/07
7

16. AC Programming Characteristics

TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V
Symbol Parameter Test Conditions
Limits
(1)
UnitsMin Max
t
AS
t
OES
t
DS
t
AH
t
DH
t
DFP
t
VPS
t
VCS
t
PW
t
OE
t
PRT
Notes: 1. V
Address Setup Time
OE Setup Time 2 µs
Data Setup Time 2 µs
Input Rise and Fall Times
(10% to 90%) 20 ns
Address Hold Time 0 µs
Data Hold Time 2 µs
OE High to Output Float Delay
(2)
VPP Setup Time 2 µs
VCC Setup Time 2 µs
PGM Program Pulse Width
(3)
Data Valid from OE 150 ns
Input Pulse Levels
0.45V to 2.4V
Input Timing Reference Level
0.8V to 2.0V
Output Timing Reference Level
0.8V to 2.0V VPP Pulse Rise Time During Programming
must be applied simultaneously or before VPP and removed simultaneously or after VPP.
CC
s
0130ns
47.5 52.5 µs
50 ns
2. This parameter is only sampled and is not 100% tested. Output Float is defined as the point where data is no longer driven – see timing diagram.
3. Program Pulse width tolerance is 50 µsec ± 5%.

17. Atmel’s 27C2048 Intergrated Product Identification Code

Pins
Codes
Manufacturer 0 0 00011110 001E
Hex DataA0 O15-O8 O7 O6 O5 O4 O3 O2 O1 O0
Device Type 1 0 11110111 00F7
8
AT27C2048
0632F–EPROM–12/07

18. Rapid Programming Algorithm

A 50 µs CE pulse width is used to program. The address is set to the first location. VCC is raised to 6.5V and V without verification. Then a verification/reprogramming loop is executed for each address. In the event a word fails to pass verification, up to 10 successive 50 µs pulses are applied with a verifi­cation after each pulse. If the word fails to verify after 10 pulses have been applied, the part is considered failed. After the word verifies properly, the next address is selected until all have been checked. V pared with the original data to determine if the device passes or fails.
is raised to 13.0V. Each address is first programmed with one 50 µs CE pulse
PP
is then lowered to 5.0V and VCC to 5.0V. All words are read again and com-
PP
AT27C2048
0632F–EPROM–12/07
9

19. Ordering Information

19.1 Standard Package

I
(mA)
t
ACC
(ns)
CC
Ordering Code Package Operation RangeActive Standby
55 35 0.1 AT27C2048-55JI
AT27C2048-55PI AT27C2048-55VI
90 35 0.1 AT27C2048-90JI
AT27C2048-90PI AT27C2048-90VI
Note:
Not recommended for new designs. Use Green package option.

19.2 Green Package (Pb/Halide-free)

I
(mA)
t
ACC
(ns)
55 35 0.1 AT27C2048-55JU
90 35 0.1 AT27C2048-90JU
Note: 1. The 40-lead VSOP package is not recommended for new designs.
CC
Ordering Code Package Operation RangeActive Standby
AT27C2048-55PU
AT27C2048-90PU
44J 40P6 40V
44J 40P6 40V
44J 40P6
44J 40P6
Industrial
(-40° C to 85° C)
(1)
Industrial
(-40° C to 85° C)
(1)
Industrial
(-40° C to 85° C)
Industrial
(-40° C to 85° C)
Package Type
44J 44-lead, Plastic J-leaded Chip Carrier (PLCC)
40P6 40-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)
40V 40-lead, Plastic Thin Small Outline Package (VSOP)
10
AT27C2048
0632F–EPROM–12/07

20. Packaging Information

20.1 44J – PLCC
AT27C2048
1.14(0.045) X 45˚
B
e
0.51(0.020)MAX
45˚ MAX (3X)
Notes: 1. This package conforms to JEDEC reference MS-018, Variation AC.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is .010"(0.254 mm) per side. Dimension D1 and E1 include mold mismatch and are measured at the extreme material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.102 mm) maximum.
PIN NO. 1
IDENTIFIER
D1
D
1.14(0.045) X 45˚
E1 E
0.318(0.0125)
0.191(0.0075)
NOM
D2/E2
MAX
B1
A2
A1
A
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A 4.191 4.572
A1 2.286 3.048
A2 0.508
D 17.399 17.653
D1 16.510 16.662 Note 2
E 17.399 17.653
E1 16.510 16.662 Note 2
D2/E2 14.986 16.002
B 0.660 0.813
B1 0.330 0.533
e 1.270 TYP
MIN
NOTE
2325 Orchard Parkway
R
San Jose, CA 95131
0632F–EPROM–12/07
TITLE
44J, 44-lead, Plastic J-leaded Chip Carrier (PLCC)
DRAWING NO.
44J
10/04/01
REV.
B
11
20.2 40P6 – PDIP
PIN
1
E1
A1
B
REF
E
B1
C
L
SEATING PLANE
A
e
D
0º ~ 15º
eB
Notes: 1. This package conforms to JEDEC reference MS-011, Variation AC.
2. Dimensions D and E1 do not include mold Flash or Protrusion. Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").
TITLE
2325 Orchard Parkway
R
San Jose, CA 95131
40P6, 40-lead (0.600"/15.24 mm Wide) Plastic Dual Inline Package (PDIP)
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A 4.826
A1 0.381
D 52.070 52.578 Note 2
E 15.240 15.875
E1 13.462 13.970 Note 2
B 0.356 0.559
B1 1.041 1.651
L 3.048 3.556
C 0.203 0.381
eB 15.494 17.526
e 2.540 TYP
MIN
NOM
MAX
DRAWING NO.
40P6
NOTE
09/28/01
REV.
B
12
AT27C2048
0632F–EPROM–12/07
20.3 40V – VSOP
AT27C2048
PIN 1
Pin 1 Identifier
D1
D
e
E
b
A2
A
SEATING PLANE
A1
Notes: 1. This package conforms to JEDEC reference MO-142, Variation CA.
2. Dimensions D1 and E do not include mold protrusion. Allowable protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side.
3. Lead coplanarity is 0.10 mm maximum.
0º ~ 8º
L
COMMON DIMENSIONS
SYMBOL
A 1.20
A1 0.05 0.15
A2 0.95 1.00 1.05
D 13.80 14.00 14.20
D1 12.30 12.40 12.50 Note 2
E 9.90 10.00 10.10 Note 2
L 0.50 0.60 0.70
L1 0.25 BASIC
b 0.17 0.22 0.27
c 0.10 0.21
e 0.50 BASIC
c
L1
GAGE PLANE
(Unit of Measure = mm)
MIN
NOM
MAX
NOTE
2325 Orchard Parkway
R
San Jose, CA 95131
0632F–EPROM–12/07
TITLE
40V, 40-lead (10 x 14 mm Package) Plastic Thin Small Outline
Package, Type I (VSOP)
DRAWING NO.
40V
10/18/01
REV.
B
13
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