1. Features
• Low-voltage and Standard-voltage Operation
– 1.8 (V
= 1.8V to 5.5V)
CC
• Internally Organized 2048 x 8 (16K)
• Two-wire Serial Interface
• Schmitt Trigger, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• 1 MHz (5V, 2.5V), 400 kHz (1.8V) Compatibility
• Write Protect Pin for Hardware Data Protection
• 16-byte Page (16K) Write Modes
• Partial Page Writes Allowed
• Self-timed Write Cycle (5 ms max)
• High-reliability
– Endurance: 1 Million Write Cycles
– Data Retention: 100 Years
• 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Ultra-Thin Mini-MAP (MLP 2x3), 5-lead SOT23,
8-lead Ultra Lead Frame Land Grid Array (ULA), 8-lead TSSOP and 8-ball dBGA2
Packages
• Lead-free/Halogen-free
• Die Sales: Wafer Form, Tape and Reel, and Bumped Wafers
2. Description
The AT24C16B provides 16384 bits of serial electrically erasable and programmable
read-only memory (EEPROM) organized as 2048 words of 8 bits each. The device is
optimized for use in many industrial and commercial applications where low-power
and low-voltage operation are essential. The AT24C16B is available in space-saving
8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2x3)
SOT23, 8-lead Ultra Lead Frame Land Grid Array (ULA), 8-lead TSSOP, and 8-ball
dBGA2 packages and is accessed via a Two-wire serial interface. In addition, the
AT24C16B is available in 1.8V (1.8V to 5.5V) version.
Table 2-1. Pin Configuration
Pin Name Function
A0 - A2 No Connect
SDA Serial Data
SCL Serial Clock Input
WP Write Protect
GND Ground
VCC Power Supply
8-lead Ultra Lead Frame
Land Grid Array (ULA)
VCC
WP
SCL
SDA
8
7
6
5
A0
1
A1
2
A2
3
GND
4
Bottom View
8-lead Ultra Thin
Mini-MAP (MLP 2x3)
VCC
WP
SCL
SDA
8
7
6
5
1
2
3
4
A0
A1
A2
GND
8-ball dBGA2
VCC
WP
SCL
SDA
Bottom View Bottom View
8-lead TSSOP
1
A0
2
A1
3
A2
GND
4
8
VCC
7
WP
6
SCL
5
SDA
8-lead SOIC
A0
A1
A2
GND
8-lead PDIP5-lead SOT23
SCL
GND
SDA
1
2
3
WP
5
VCC
4
A0
A1
A2
GND
8
7
6
5
1
2
3
4
1
2
3
4
1
A0
2
A1
3
A2
4
GND
8
7
6
5
8
7
6
5
, 5-lead
VCC
WP
SCL
SDA
VCC
WP
SCL
SDA
Two-wire
Serial EEPROM
16K (2048 x 8)
AT24C16B
5175C–SEEPR–11/07
Absolute Maximum Ratings
Operating Temperature..................................–55°C to +125°C
Storage Temperature .....................................–65°C to +150°C
Voltage on Any Pin
with Respect to Ground .................................... –1.0V to +7.0V
Maximum Operating Voltage .......................................... 6.25V
DC Output Current........................................................ 5.0 mA
Figure 2-1. Block Diagram
VCC
GND
WP
SCL
SDA
A
A
A
2
1
0
START
STOP
LOGIC
LOAD
DEVICE
ADDRESS
COMPARATOR
R/W
*NOTICE: Stresses beyond those listed under “Absolute
SERIAL
CONTROL
LOGIC
COMP
LOAD
DATA WORD
ADDR/COUNTER
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
EN
H.V. PUMP/TIMING
DATA RECOVERY
INC
EEPROM
X DEC
Y DEC
D
IN
D
OUT
SERIAL MUX
D
/ACK
OUT
LOGIC
2
AT24C16B
5175C–SEEPR–11/07
3. Pin Description
SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each EEPROM
device and negative edge clock data out of each device.
SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is opendrain driven and may be wire-ORed with any number of other open-drain or open-collector
devices.
DEVICE/PAGE ADDRESSES (A2, A1, A0): The AT24C16B does not use the device address
pins, which limits the number of devices on a single bus to one. The A0, A1, A2 are no connects
and can be connected to ground.
WRITE PROTECT (WP): The AT24C16B has a write protect pin that provides hardware data
protection. The write protect pin allows normal read/write operations when connected to ground
(GND). When the write protect pin is connected to V
and operates as shown in Table 3-1.
Table 3-1. Write Protect
Part of the Array Protected
AT24C16B
, the write protection feature is enabled
CC
WP Pin
Status
At V
CC
At GND Normal Read/Write Operations
4. Memory Organization
AT24C16B, 16K SERIAL EEPROM: Internally organized with 128 pages of 16 bytes each, the
16K requires an 11-bit data word address for random word addressing.
24C16B
Full (16K) Array
5175C–SEEPR–11/07
3
Table 4-1. Pin Capacitance
(1)
Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +1.8V
Symbol Test Condition Max Units Conditions
C
I/O
C
IN
Input/Output Capacitance (SDA) 8 pF V
Input Capacitance (SCL) 6 pF VIN = 0V
I/O
= 0V
Note: 1. This parameter is characterized and is not 100% tested.
Table 4-2. DC Characteristics
Applicable over recommended operating range from: T
Symbol Parameter Test Condition Min Typ Max Units
V
I
I
I
I
CC1
CC1
CC2
SB1
LI
Supply Voltage 1.8 5.5 V
Supply Current VCC = 5.0V READ at 400 kHz 1.0 2.0 mA
Supply Current VCC = 5.0V WRITE at 400 kHz 2.0 3.0 mA
= 1.8V
V
Standby Current
(1.8V option)
Input Leakage
Current VCC = 5.0V
CC
= 5.0V 6.0
V
CC
VIN = V
CC or VSS
= −40°C to +85°C, VCC = +1.8V to +5.5V (unless otherwise noted)
AI
1.0 µA
= VCC or V
V
IN
SS
0.10 3.0 µA
I
LO
V
IL
V
IH
V
OL1
V
OL2
Output Leakage
Current VCC = 5.0V
Input Low Level
Input High Level
(1)
(1)
= V
V
OUT
CC or VSS
Output Low Level VCC = 1.8V IOL = 0.15 mA 0.2 V
Output Low Level VCC = 3.0V IOL = 2.1 mA 0.4 V
Notes: 1. VIL min and VIH max are reference only and are not tested.
0.05 3.0 µA
−0.6 VCC x 0.3 V
VCC x 0.7 VCC + 0.5 V
4
AT24C16B
5175C–SEEPR–11/07
Table 4-3. AC Characteristics (Industrial Temperature)
Applicable over recommended operating range from T
= −40°C to +85°C, VCC = +1.8V to +5.5V, CL = 100 pF (unless oth-
AI
erwise noted). Test conditions are listed in Note 2.
AT24C16B
1.8-volt 2.5, 5.0-volt
Symbol Parameter
f
SCL
t
LOW
t
HIGH
t
AA
t
BUF
t
HD.STA
t
SU.STA
t
HD.DAT
t
SU.DAT
t
R
t
F
t
SU.STO
t
DH
t
WR
Endurance
Clock Frequency, SCL 400 1000 kHz
Clock Pulse Width Low 1.3 0.4 µs
Clock Pulse Width High 0.6 0.4 µs
Clock Low to Data Out Valid 0.05 0.9 0.05 0.55 µs
Time the bus must be free before a new transmission
can start
(1)
Start Hold Time 0.6 0.25 µs
Start Set-up Time 0.6 0.25 µs
Data In Hold Time 0 0 µs
Data In Set-up Time 100 100 ns
Inputs Rise Time
Inputs Fall Time
(1)
(1)
Stop Set-up Time 0.6 0.25 µs
Data Out Hold Time 50 50 ns
Write Cycle Time 5 5 ms
(1)
25°C, Page Mode, 3.3V 1,000,000
Notes: 1. This parameter is characterized and is not 100% tested.
2. AC measurement conditions:
RL (connects to VCC): 1.3 kΩ (2.5V, 5.0V), 10 kΩ (1.8V)
Input pulse voltages: 0.3 VCC to 0.7 V
CC
Input rise and fall times: ≤ 50 ns
Input and output timing reference voltages: 0.5 V
CC
UnitsMin Max Min Max
1.3 0.5 µs
0.3 0.3 µs
300 100 ns
Write
Cycles
5175C–SEEPR–11/07
5
5. Device Operation
CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an external
device. Data on the SDA pin may change only during SCL low time periods (see Figure 7-2 on
page 8). Data changes during SCL high periods will indicate a start or stop condition as defined
below.
START CONDITION: A high-to-low transition of SDA with SCL high is a start condition which
must precede any other command (see Figure 7-3 on page 8).
STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition. After a
read sequence, the stop command will place the EEPROM in a standby power mode (see Fig-
ure 7-3 on page 8).
ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the
EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has received each
word. This happens during the ninth clock cycle.
STANDBY MODE: The AT24C16B features a low-power standby mode which is enabled: (a)
upon power-up and (b) after the receipt of the STOP bit and the completion of any internal
operations.
2-WIRE SOFTWARE RESET: After an interruption in protocol, power loss or system reset, any
2-wire part can be protocol reset by following these steps:
1. Create a start bit condition.
2. Clock 9 cycles.
3. Create another start bit followed by stop bit condition as shown below.
SCL
SDA
Start bit
Stop bitStart bitDummy Clock Cycles
123 89
6
AT24C16B
5175C–SEEPR–11/07
6. Bus Timing
S
S
Figure 6-1. SCL: Serial Clock, SDA: Serial Data I/O®
t
HIGH
SCL
t
F
t
LOW
AT24C16B
t
R
t
LOW
t
SU.STA
t
HD.STA
SDA IN
t
AA
SDA OUT
7. Write Cycle Timing
Figure 7-1. SCL: Serial Clock, SDA: Serial Data I/O
CL
DA
8th BIT
ACK
t
HD.DAT
t
SU.DAT
t
DH
t
SU.STO
t
BUF
WORDn
(1)
t
wr
STOP
CONDITION
START
CONDITION
Note: 1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle.
7
5175C–SEEPR–11/07
Figure 7-2. Data Validity
SDA
SCL
Figure 7-3. Start and Stop Definition
SDA
SCL
DATA STABLE DATA STABLE
DATA
CHANGE
Figure 7-4. Output Acknowledge
SCL
DATA IN
DATA OUT
START STOP
1
START ACKNOWLEDGE
8
9
8
AT24C16B
5175C–SEEPR–11/07
8. Device Addressing
The 16K EEPROM device requires an 8-bit device address word following a start condition to
enable the chip for a read or write operation (refer to Figure 10-1).
The device address word consists of a mandatory one, zero sequence for the first four most significant bits as shown. This is common to all the EEPROM devices.
The next 3 bits used for memory page addressing and are the most significant bits of the data
word address which follows.
The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if this bit is high and a write operation is initiated if this bit is low.
Upon a compare of the device address, the EEPROM will output a zero. If a compare is not
made, the chip will return to a standby state.
9. Write Operations
BYTE WRITE: A write operation requires an 8-bit data word address following the device
address word and acknowledgment. Upon receipt of this address, the EEPROM will again
respond with a zero and then clock in the first 8-bit data word. Following receipt of the 8-bit data
word, the EEPROM will output a zero and the addressing device, such as a microcontroller,
must terminate the write sequence with a stop condition. At this time the EEPROM enters an
internally timed write cycle, t
write cycle and the EEPROM will not respond until the write is complete (see Figure 10-2 on
page 11).
AT24C16B
, to the nonvolatile memory. All inputs are disabled during this
WR
PAGE WRITE: The 16K EEPROM is capable of an 16-byte page write.
A page write is initiated the same as a byte write, but the microcontroller does not send a stop
condition after the first data word is clocked in. Instead, after the EEPROM acknowledges
receipt of the first data word, the microcontroller can transmit up to fifteen data words. The
EEPROM will respond with a zero after each data word received. The microcontroller must terminate the page write sequence with a stop condition (see Figure 10-3 on page 11).
The data word address lower three bits are internally incremented following the receipt of each
data word. The higher data word address bits are not incremented, retaining the memory page
row location. When the word address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. If more than sixteen data words are
transmitted to the EEPROM, the data word address will “roll over” and previous data will be
overwritten.
ACKNOWLEDGE POLLING: Once the internally timed write cycle has started and the
EEPROM inputs are disabled, acknowledge polling can be initiated. This involves sending a
start condition followed by the device address word. The read/write bit is representative of the
operation desired. Only if the internal write cycle has completed will the EEPROM respond with
a zero allowing the read or write sequence to continue.
5175C–SEEPR–11/07
9
10. Read Operations
Read operations are initiated the same way as write operations with the exception that the
read/write select bit in the device address word is set to one. There are three read operations:
current address read, random address read and sequential read.
CURRENT ADDRESS READ: The internal data word address counter maintains the last
address accessed during the last read or write operation, incremented by one. This address
stays valid between operations as long as the chip power is maintained. The address “roll over”
during read is from the last byte of the last memory page to the first byte of the first page. The
address “roll over” during write is from the last byte of the current page to the first byte of the
same page.
Once the device address with the read/write select bit set to one is clocked in and acknowledged
by the EEPROM, the current address data word is serially clocked out. The microcontroller does
not respond with an input zero but does generate a following stop condition (see Figure 10-4 on
page 11).
RANDOM READ: A random read requires a “dummy” byte write sequence to load in the data
word address. Once the device address word and data word address are clocked in and
acknowledged by the EEPROM, the microcontroller must generate another start condition. The
microcontroller now initiates a current address read by sending a device address with the
read/write select bit high. The EEPROM acknowledges the device address and serially clocks
out the data word. The microcontroller does not respond with a zero but does generate a following stop condition (see Figure 10-5 on page 12).
SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a random address read. After the microcontroller receives a data word, it responds with an
acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment
the data word address and serially clock out sequential data words. When the memory address
limit is reached, the data word address will “roll over” and the sequential read will continue. The
sequential read operation is terminated when the microcontroller does not respond with a zero
but does generate a following stop condition (see Figure 10-6 on page 12).
Figure 10-1. Device Address
16
MSB
PPP
10
2
10
AT24C16B
5175C–SEEPR–11/07
Figure 10-2. Byte Write
Figure 10-3. Page Write
AT24C16B
Figure 10-4. Current Address Read
5175C–SEEPR–11/07
11
Figure 10-5. Random Read
Figure 10-6. Sequential Read
12
AT24C16B
5175C–SEEPR–11/07
AT24C16B
AT24C16B Ordering Information
Ordering Codes Voltage Package Operating Range
AT24C16B-PU (Bulk Form Only) 1.8 8P3
AT24C16BN-SH-B
AT24C16BN-SH-T
AT24C16B-TH-B
AT24C16B-TH-T
AT24C16BY6-YH-T
AT24C16BD3-DH-T
AT24C16BTSU-T
AT24C16BU3-UU-T
AT24C16B-W-11
Notes: 1. “-B” denotes bulk.
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini MAP, SOT23, dBGA2 = 5K per reel.
3. Available in tape and reel, and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request.
Please contact Serial Interface Marketing.
(1)
(NiPdAu Lead Finish) 1.8 8S1
(2)
(NiPdAu Lead Finish) 1.8 8S1
(1)
(NiPdAu Lead Finish) 1.8 8A2
(2)
(NiPdAu Lead Finish) 1.8 8A2
(2)
(NiPdAu Lead Finish) 1.8 8Y6
(2)
(NiPdAu Lead Finish) 1.8 8D3
(2)
(2)
(3)
1.8 5TS1
1.8 8U3-1
1.8 Die Sales
Lead-Free/Halogen-Free
Industrial Temperature
(-40°C to 85°C)
Industrial Temperature
°C to 85°C)
(-40
Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8Y6 8-lead, 2.0 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
5TS1 5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8U3-1 8-ball, die Ball Grid Array Package (dBGA2)
8D3 8-lead, 1.80 mm x 2.20 mm Body, Ultra Lead Frame Land Grid Array (ULA)
Options
–1.8 Low-voltage (1.8V to 5.5V)
5175C–SEEPR–11/07
13
11. Part Marking
11.1 8-PDIP
Seal Year
TOP MARK | Seal Week
| | |
|---|---|---|---|---|---|---|---|
A T M L U Y W W
|---|---|---|---|---|---|---|---|
1 6 B 1
|---|---|---|---|---|---|---|---|
* Lot Number
|---|---|---|---|---|---|---|---|
|
Pin 1 Indicator (Dot)
Y = SEAL YEAR WW = SEAL WEEK
6: 2006 0: 2010 02 = Week 2
7: 2007 1: 2011 04 = Week 4
8: 2008 2: 2012 :: : :::: :
9: 2009 3: 2013 :: : :::: ::
50 = Week 50
52 = Week 52
Lot Number to Use ALL Characters in Marking
BOTTOM MARK
No Bottom Mark
14
AT24C16B
5175C–SEEPR–11/07
11.2 8-SOIC
AT24C16B
Seal Year
TOP MARK | Seal Week
| | |
|---|---|---|---|---|---|---|---|
A T M L H Y W W
|---|---|---|---|---|---|---|---|
1 6 B 1
|---|---|---|---|---|---|---|---|
* Lot Number
|---|---|---|---|---|---|---|---|
|
Pin 1 Indicator (Dot)
Y = SEAL YEAR WW = SEAL WEEK
6: 2006 0: 2010 02 = Week 2
7: 2007 1: 2011 04 = Week 4
8: 2008 2: 2012 :: : :::: :
9: 2009 3: 2013 :: : :::: ::
50 = Week 50
52 = Week 52
Lot Number to Use ALL Characters in Marking
BOTTOM MARK
No Bottom Mark
5175C–SEEPR–11/07
15
11.3 8-TSSOP
TOP MARK
Pin 1 Indicator (Dot)
|
|---|---|---|---|
* H Y W W
|---|---|---|---|---|
1 6 B 1
|---|---|---|---|---|
BOTTOM MARK
|---|---|---|---|---|---|---|
P H
|---|---|---|---|---|---|---|
A A A A A A A
|---|---|---|---|---|---|---|
<- Pin 1 Indicator
Y = SEAL YEAR WW = SEAL WEEK
6: 2006 0: 2010 02 = Week 2
7: 2007 1: 2011 04 = Week 4
8: 2008 2: 2012 :: : :::: :
9: 2009 3: 2013 :: : :::: ::
50 = Week 50
52 = Week 52
16
AT24C16B
5175C–SEEPR–11/07
11.4 8-Ultra Thin Mini-Map
TOP MARK
|---|---|---|
1 6 B
|---|---|---|
H 1
|---|---|---|
Y X X
|---|---|---|
*
|
Pin 1 Indicator (Dot)
Y = YEAR OF ASSEMBLY
XX = ATMEL LOT NUMBER TO COORESPOND WITH
NSEB TRACE CODE LOG BOOK.
(e.g. XX = AA, AB, AC,...AX, AY, AZ)
AT24C16B
11.5 8-ULA
Y = SEAL YEAR
6: 2006 0: 2010
7: 2007 1: 2011
8: 2008 2: 2012
9: 2009 3: 2013
TOP MARK
|---|---|---|
1 6 B
|---|---|---|
Y X X
|---|---|---|
*
|
Pin 1 Indicator (Dot)
Y = BUILD YEAR
2006 = 6 2008 = 8
2007 = 7 Etc. . .
XX = ATMEL LOT NUMBER TO COORESPOND WITH
NSEB TRACE CODE LOG BOOK.
(e.g. XX = AA, AB, AC,...AX, AY, AZ)
5175C–SEEPR–11/07
17
11.6 dBGA2
11.7 SOT23
TOP MARK
LINE 1-------> 16BU
LINE 2-------> PYMTC
|<-- Pin 1 This Corner
P = COUNTRY OF ORIGIN
Y = ONE DIGIT YEAR CODE
4: 2004 7: 2007
5: 2005 8: 2008
6: 2006 9: 2009
M = SEAL MONTH (USE ALPHA DESIGNATOR A-L)
A = JANUARY
B = FEBRUARY
" " """""""
J = OCTOBER
K = NOVEMBER
L = DECEMBER
TC = TRACE CODE (ATMEL LOT
NUMBERS TO CORRESPOND
WITH ATK TRACE CODE LOG BOOK)
TOP MARK
|---|---|---|---|---|
Line 1 -----------> 1 6 B 1 U
|---|---|---|---|---|
*
|
XXX = Device
V = Voltage Indicator
U = Material Set
Pin 1 Indicator (Dot)
BOTTOM MARK
|---|---|---|---|
Y M T C
|---|---|---|---|
Y = One Digit Year Code
M = Seal Month
(Use Alpha Designator A-L)
TC = Trace Code
18
AT24C16B
5175C–SEEPR–11/07
12. Packaging Information
12.1 8P3 – PDIP
AT24C16B
D1
b3
4 PLCS
Top View
D
e
Side View
1
E
E1
N
c
eA
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
b
b2
A2 A
SYMBOL
A
A2 0.115 0.130 0.195
b 0.014 0.018 0.022 5
b2 0.045 0.060 0.070 6
b3 0.030 0.039 0.045 6
c 0.008 0.010 0.014
D 0.355 0.365 0.400 3
L
D1 0.005
E 0.300 0.310 0.325 4
E1 0.240 0.250 0.280 3
e 0.100 BSC
eA 0.300 BSC 4
L 0.115 0.130 0.150 2
MIN
NOM
–
MAX
–
0.210 2
–
–
3
NOTE
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
2325 Orchard Parkway
R
San Jose, CA 95131
5175C–SEEPR–11/07
TITLE
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
DRAWING NO.
8P3
01/09/02
REV.
B
19
12.2 8S1 – JEDEC SOIC
C
1
E
N
∅
E1
L
Top View
End View
e
D
Side View
B
A
SYMBOL
A1
A 1.35 – 1.75
A1 0.10 – 0.25
b 0.31 – 0.51
C 0.17 – 0.25
D 4.80 – 5.00
E1 3.81 – 3.99
E 5.79 – 6.20
e 1.27 BSC
L 0.40 – 1.27
∅ 0˚ – 8˚
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
NOM
MAX
NOTE
20
Note:
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
R
TITLE
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
DRAWING NO.
AT24C16B
10/7/03
REV.
8S1 B
5175C–SEEPR–11/07
12.3 8A2 – TSSOP
Pin 1 indicator
this corner
AT24C16B
123
N
Top View
b
e
D
Side View
A2
E1
E
L1
L
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A
D 2.90 3.00 3.10 2, 5
E 6.40 BSC
E1 4.30 4.40 4.50 3, 5
A – – 1.20
A2 0.80 1.00 1.05
b 0.19 – 0.304
e 0.65 BSC
L 0.45 0.60 0.75
L1 1.00 REF
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
5175C–SEEPR–11/07
datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions s
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Dat
um Plane H.
TITLE
2325 Orchard Parkway
R
San Jose, CA 95131
8A2, 8-lead, 4.4 mm Body, Plastic
Thin Shrink Small Outline Package (TSSOP)
hall not exceed 0.25 mm
DRAWING NO.
8A2
5/30/02
REV.
B
21
12.4 8Y6 - Mini Map
A2
(8X)
Pin 1 ID
Pin 1
Index
Area
A1
A3
L (8X)
e (6X)
1.50 REF.
D2
E2
A
Pin 1
Index
Area
E
E2
D
A2
A3
A1
SYMBOL
D2
e (6X)
1.50 REF.
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
NOM
MAX
b
(8X)
Pin 1 ID
L (8X)
NOTE
D 2.00 BSC
E 3.00 BSC
D2 1.40 1.50 1.60
E2 - - 1.40
A - - 0.60
A1 0.0 0.02 0.05
A2 - - 0.55
A3 0.20 REF
L 0.20 0.30 0.40
e 0.50 BSC
b 0.20 0.25 0.30 2
22
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions,
tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the
terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.
3. Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the
device through this pad, so if soldered it should be tied to ground
2325 Orchard Parkway
R
San Jose, CA 95131
TITLE
8Y6, 8-lead 2.0 x 3.0 mm Body, 0.50 mm Pitch, Utlra Thin Mini-Map,
Dual No Lead Package (DFN) ,(MLP 2x3)
DRAWING NO.
8Y6
AT24C16B
10/16/07
REV.
D
5175C–SEEPR–11/07
12.5 5TS1 – SOT23
AT24C16B
e1
E1
5
4
E
C
C
L
L1
1
2
Top View
3
End View
b
A2
A
Seating
Plane
e
D
Side View
NOTES: 1. This drawing is for general information only. Refer to JEDEC Drawing
MO-193, Variation AB, for additional information.
2. Dimension D does not include mold flash, protrusions, or gate burrs.
Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per end.
Dimension E1 does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.15 mm per side.
3. The package top may be smaller than the package bottom. Dimensions
D and E1 are determined at the outermost extremes of the plastic body
exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but
including any mismatch between the top and bottom of the plastic body.
4. These dimensions apply to the flat section of the lead between 0.08 mm
and 0.15 mm from the lead tip.
5. Dimension "b" does not include Dambar protrusion. Allowable Dambar
protrusion shall be 0.08 mm total in excess of the "b" dimension at
maximum material condition. The Dambar cannot be located on the lower
radius of the foot. Minimum space between protrusion and an adjacent lead
shall not be less than 0.07 mm.
1150 E. Cheyenne Mtn. Blvd.
R
Colorado Springs, CO 80906
TITLE
5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink
Small Outline Package (SHRINK SOT)
A1
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A – – 1.10
A1 0.00 – 0.10
A2 0.70 0.90 1.00
c 0.08 – 0.20 4
D 2.90 BSC 2, 3
E 2.80 BSC 2, 3
E1 1.60 BSC 2, 3
L1 0.60 REF
e 0.95 BSC
e1 1.90 BSC
b 0.30 – 0.50 4, 5
MIN
NOM
MAX
DRAWING NO.
PO5TS1 A
NOTE
6/25/03
REV.
5175C–SEEPR–11/07
23
12.6 8U3-1 – dBGA2
E
D
PIN 1 BALL PAD CORNER
Top View
PIN 1 BALL PAD CORNER
2
31
4
(d1)
d
8
67
5
e
(e1)
Bottom View
8 SOLDER BALLS
1. Dimension “b” is measured at the maximum solder ball diameter.
This drawing is for general information only.
A
2
A
Side View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A 0.71 0.81 0.91
A1 0.10 0.15 0.20
A2 0.40 0.45 0.50
b 0.20 0.25 0.30
D 1.50 BSC
E 2.00 BSC
e 0.50 BSC
e1 0.25 REF
d 1.00 BSC
d1 0.25 REF
MIN
NOM
1.
b
A
1
MAX
NOTE
24
1150 E. Cheyenne Mtn. Blvd.
R
Colorado Springs, CO 80906
AT24C16B
TITLE
8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch,
Small Die Ball Grid Array Package (dBGA2)
DRAWING NO.
PO8U3-1 A
5175C–SEEPR–11/07
6/24/03
REV.
12.7 8D3 - ULA
AT24C16B
PIN #1 ID
D
8
2
1
TOP VIEW
e1
57
6
b
L
E
PIN #1 ID
0.10
0.15
4
3
A1
b
e
A
SIDE VIEW
COMMON DIMENSIONS
(Unit of Measure = mm)
BOTTOM VIEW
1150 E. Cheyenne Mtn. Blvd.
R
Colorado Springs, CO 80906
SYMBOL
A – – 0.40
A1 0.00 – 0.05
D 1.70 1.80 1.90
E 2.10 2.20 2.30
b 0.15 0.20 0.25
e 0.40 TYP
e1 1.20 REF
L 0.25 0.30 0.35
TITLE
8D3, 8-lead (1.80 x 2.20 mm Body) Ultra Leadframe
Land Grid Array (ULLGA) D3
MIN
NOM
MAX
NOTE
DRAWING NO.
8D3
11/15/05
REV.
0
5175C–SEEPR–11/07
25
13. Revision History
Lit No. Date Comment
5175C 11/2007
5175B 4/2007
5175A 3/2007 Initial document release
AT24C16B product with date code 742 or later supports 5Vcc operation
Added ULA package information
Removed reference to Waffle Pack
Corrected Note 3 on Page 13
Added lines to Ordering Code table
26
AT24C16B
5175C–SEEPR–11/07
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5175C–SEEPR–11/07
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