Thermal Shock
Chambers
Automatic Transfer
Automatic Transfer
Designed primarily to meet the requirements of MIL-STD 888, method
1010 temperature cycling, and MIL-STD 202, method 107 thermal
shock, these chambers test the resistance of electronic components and
assemblies to sudden and severe temperature changes.
3
In addition to the popularly-sized 2 ft
chambers, Tenney offers the T-Shock Jr., a benchtop thermal
shock chamber with ¼ ft
accommodate pilot runs and the smaller production quantities
of sophisticated discrete components, the T-Shock Jr is an
efficient, cost-effective alternate to large capacity thermal
shock chambers. Also, because the cold-zone is a fullrange Tenney Jr. unit, the T-Shock Jr. doubles as a
high-low temperature test chamber.
3
carriage capacity. Designed to
and 8 ft3 thermal shock
Specifications
Two Zone
-65
-65
to
to
200
200
Two Zone
-73
200
Horizontal or Vertical
Three Zone
-73
to
200
40
to
to
200
40
to
Amb.
200
Carriage Capacity Product Load Refrigeration
3
Ft
W x H x D LBS HP KW
Heat Dimensions W x H x D
Horizontal
Model
Vertical
Model
Model
WT
LBS
TSJR MODEL (Air Cooled)
.25 102 x 6 x 6c 3
2 + 2 + LN
2
2.5/.5
63 x 41 x 22
Not Avail TSJR 700
TS2 MODELS - TWO ZONE: HOT/COLD (WATER COOLED)
2 15 4 + LN
15 x 15 x 15
2 11 10 TS2.02.10 4000
25 x 23 x 25 (V)
8 35 6 + LN
8 35 30 Call TS2.08.30 4700
TS3 MODELS - THREE ZONE: COLD/AMBIENT/HOT (WATER COOLED)
2 16 4 + LN
2 10 11 140 x 88 x 53 TS3.02.10 4200
8 40 6 + LN
8 35 30 Call TS3.08.30 4900
or
23 x 25 x 25 (H)
15 x 15 x 15 9/2
25 x 23 x 25 (V)
or
23 x 25 x 25 (H)
2
9/2
110 x 88 x 33
2
2
2
127 x 88 x 72 TS2.08.06B 4200
21/4 97 x 89 x 75
129 x 88 x 53 TS3.02.04B 3900
156 x 88 x 72 TS3.08.06B 4400
21/4
89 x 72 x 58
Not
Available
TS2.02.04B 3700
TSD MODELS - DUAL LOAD: HOT/COLD/HOT (WATER COOLED)
Dual Load
40
-73
to
to
200
40
Horizontal or Vertical
Notes:Notes:
Notes:
Notes:Notes:
40
to
200
2 28 4 + LN
15 x 15 x 15 18/2
2 18 10 140 x 88 x 53 TSD.02.10 4500
25 x 23 x 25 (V)
8 60 6 + LN2 156 x 88 x 72
8 56 30 Call
or
23 x 25 x 25 (H)
Add “V” or “H” suffix to model number to designate
vertical or horizontal configuration.(Ex: TS2.02.10H)
Custom configurations, capacities, and basket and tray
designs available. Please call us.
Performance evaluation was made with a distributed
product load of 16 pin dip devices. Low temperature
-65ºC; high temperature +150ºC. Sensors embedded in
load samples achieved a 15 minute recovery per
MIL-STD-883C Notice 5, Method 1010.7 and air
temperature recovery was 5 minutes per MIL-STD-202F,
Method 107G. Performance data are based on 24ºC
ambient at sea level. Standard operating voltages 208,
230, or 460V; 3Ø; 60 Hz. On 50 Hz, performance may
be reduced.
TSD model capacities are for total load divided into two
compartments.
2
One of the most compact thermal shock chambers in the world, Tenney’s
T-Shock Jr. takes up fewer than 10-square feet of bench area but provides
complete thermal shock testing while doubling as a standard test chamber.
129 x 88 x 53 TSD.02.04B 4200
42/4
78 x 91 x 53
84 x 115 x 72
94 x 115 x 72
TSD.08.06B 4700
TSD.08.30 5200