H110M-DGS/D3
Version 1.0
Published October 2015
Copyright©2015 ASRock INC. All rights reser ved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com
Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 5
1.4 I/O Panel 7
Chapter 2 Installation 9
2.1 Installing the CPU 10
2.2 Installing the CPU Fan and Heatsink 13
2.3 Installing Memory Modules (DIMM) 14
2.4 Expansion Slots (PCI Express Slots) 16
2.5 Onboard Headers and Connectors 17
Chapter 3 Software and Utilities Operation 21
3.1 Installing Drivers 21
3.2 ASRock Live Update & APP Shop 22
3.2.1 UI Overview 22
3.2.2 Apps 23
3.2.3 BIOS & Drivers 26
3.2.4 Setting 27
3.3 Enabling USB Ports for Windows® 7 Installation 28
Chapter 4 UEFI SETUP UTILITY 31
4.1 Introduction 31
4.2 EZ Mode 32
4.3 Advanced Mode 33
4.3.1 UEFI Menu Bar 33
4.3.2 Navigation Keys 34
4.4 Main Screen 35
4.5 OC Tweaker Screen 36
4.6 Advanced Screen 44
4.6.1 CPU Conguration 45
4.6.2 Chipset Conguration 47
4.6.3 Storage Conguration 49
4.6.4 Super IO Conguration 50
4.6.5 ACPI Conguration 51
4.6.6 USB Conguration 53
4.6.7 Trusted Computing 54
4.7 Tools 55
4.8 Hardware Health Event Monitoring Screen 58
4.9 Security Screen 60
4.10 Boot Screen 61
4.11 Exit Screen 64
H110M-DGS/D3
Chapter 1 Introduction
ank you for purchasing ASRock H110M-DGS/D3 motherboard, a reliable
motherboard produced under ASRock’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock’s
commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
Becau se the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any modications of this documentation occur, the updated version will be available on ASRock’s
website w ithout further notice. If you require technical support relate d to this motherboard, please visit our website for specic information about the model you are using. You
may nd the l atest VGA cards and CPU support list on ASRock ’s website a s well. ASRock
website http://www.asrock.com.
1.1 Package Contents
• ASRock H110M-DGS/D3 Motherboard (Micro ATX Form Factor)
• ASRock H110M-DGS/D3 Quick Installation Guide
• ASRock H110M-DGS/D3 Support CD
• 2 x Serial ATA (SATA) Data Cables (Optional)
• 1 x I/O Panel Shield
English
1.2 Specications
Platform
CPU
Chipset
Memory
Expansion
Slot
• Micro ATX Form Factor: 7.5-in x 6.7-in, 19.1 cm x 17.0 cm
• Solid Capacitor design
• Supports 6th Generation Intel® CoreTM i7/i5/i3/Pentium®/
Celeron® Processors (Socket 1151)
• Supports CPU up to 65W
• Supports Intel® Turbo Boost 2.0 Technology
• Intel® H110
• Dual Channel DDR3/DDR3L Memory Technology
• 2 x DDR3/DDR3L DIMM Slots
• Supports DDR3/DDR3L 1866(OC)/1600/1333/1066 non-
ECC, un-buered memory
• Supports ECC UDIMM memory modules (operate in non-
ECC mode)
• Max. capacity of system memory: 32GB
• Supports Intel® Extreme Memory Prole (XMP) 1.3 / 1.2
• 1 x PCI Express 3.0 x16 Slot (PCIE2: x16 mode)*|
* Supports NVMe SSD as boot disks
• 1 x PCI Express 2.0 x1 Slot
Graphics
English
* Intel® HD Graphics Built-in Visuals and the VGA outputs can
be supported only with processors which are GPU integrated.
• Supports Intel® HD Graphics Built-in Visuals : Intel® Quick
Sync Video with AVC, MVC (S3D) and MPEG-2 Full
HW Encode1, Intel® InTruTM 3D, Intel® Clear Video HD
Technology, Intel® InsiderTM, Intel® HD Graphics 510/530
• Pixel Shader 5.0, DirectX 12
• Max. shared memory 1792MB
• Supports DVI-D with max. resolution up to 1920x1200 @
60Hz
• Supports Accelerated Media Codecs: HEVC, VP8, VP9
• Supports HDCP with DVI-D Port
• Supports Full HD 1080p Blu-ray (BD) playback with DVI-D
Port
2 3
H110M-DGS/D3
Audio
LAN
Rear Panel
I/O
• 7.1 CH HD Audio (Realtek ALC887 Audio Codec)
* To congure 7.1 CH HD Audio, it is required to use an HD
front panel audio module and enable the multi-channel audio
feature through the audio driver.
• Supports Surge Protection (ASRock Full Spike Protection)
• ELNA Audio Caps
• PCIE x1 Gigabit LAN 10/100/1000 Mb/s
• Realtek RTL 8111GR
• S upports Wa ke - On-WA N
• Supports Wake-On-LAN
• Supports Lightning/ESD Protection (ASRock Full Spike
Protection)
• Supports LAN Cable Detection
• Supports Energy Ecient Ethernet 802.3az
• Supports PXE
• 1 x PS/2 Mouse/Keyboard Port
• 1 x DVI-D Port
• 4 x USB 2.0 Ports (Supports ESD Protection (ASRock Full
Spike Protection))*
* ACPI wake-up function is supported on USB01 ports only.
• 2 x USB 3.0 Ports (Supports ESD Protection (ASRock Full
Spike Protection))
• 1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
LED)
• HD Audio Jacks: Line in / Front Speaker / Microphone
Storage
Connector
• 4 x SATA3 6.0 Gb/s Connectors, support NCQ, AHCI and
Hot Plug
• 1 x TPM Header
• 1 x Chassis Intrusion and Speaker Header
• 1 x CPU Fan Connector (4-pin)
• 1 x Chassis Fan Connector (4-pin)
* e CPU Fan Connector supports the CPU fan of maxi-
mum 1A (12W) fan power.
• 1 x 24 pin ATX Power Connector
• 1 x 4 pin 12V Power Connector
• 1 x Front Panel Audio Connector
English
• 1 x USB 2.0 Header (Supports 2 USB 2.0 ports) (Supports
ESD Protection (ASRock Full Spike Protection))
• 1 x USB 3.0 Header (Supports 2 USB 3.0 ports) (Supports
ESD Protection (ASRock Full Spike Protection))
BIOS
Feature
Hardware
Monitor
OS
Certications
• AMI UEFI Legal BIOS with multilingual GUI support
• ACPI 5.0 Compliant wake up events
• SMBIOS 2.7 Support
• CPU, GT_CPU, DRAM, PCH 1.0V, VCCIO, VCCSA Voltage
Multi-adjustment
• CPU/Chassis temperature sensing
• CPU/Chassis Fan Tachometer
• CPU/Chassis Quiet Fan (Auto adjust chassis fan speed by
CPU temperature)
• CPU/Chassis Fan multi-speed control
• CASE OPEN detection
• Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore
• Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-
bit
* To install Windows® 7 OS, a modied installation disk with
xHCI drivers packed into the ISO le is required. Please refer to
page 28 for more detailed instructions.
* For the updated Windows® 10 driver, please visit ASRock ’s
website for details: http://ww w.asrock.com
• FCC, CE, WHQL
• ErP/EuP ready (ErP/EuP ready power supply is required)
* For detailed product information, please visit our website: http://www.asrock .com
English
Please realize that the re is a certain r isk involved with overclo cking, including adju sting
the setting in the BIOS, applying Untied Overclocking Technolog y, or using third-party
overclocking to ols. O verclocking may aect your system’s stability, or even cause damage to
the components and devices of your system. It should be done at your ow n risk and expense.
We are not responsibl e for possible damage caused by overclo cking.
4 5
Intel
H110
DDR 3_B1 (6 4 bit, 24 0-pin m odule )
DDR 3_A1 (6 4 bit, 24 0-pin m odule )
CMOS
Battery
ATXPWR1
Top:
RJ-45
USB 2.0
T: USB2
B: USB3
HDLED RESET
PLED PWRBTN
PANEL1
1
USB4_5
1
HD_AUDIO1
H110M-DGS/D3
RoHS
2
CPU_FAN1
3
5
6
1
BIOS
ROM
Audio
CODEC
PCIE2
TPMS1
1
1
USB3_3_4
PCIE1
USB 3.0
T: USB1
B: USB2
Top:
LINE IN
Cente r:
FRONT
Botto m:
MIC IN
1
ATX12V1
USB 2. 0
T: USB0
B: USB 1
PS2
Keyb oard
/Mous e
SPK_CI1
1
16
DVI 1
SATA3_3
CHA_FAN1
SATA3_2
SATA3_1
SATA3_0
4
7
8
10
11
12
1314
15
CLRMOS1
9
1.3 Motherboard Layout
H110M-DGS/D3
English
No. Description
1 ATX 12V Power Connector (ATX12V1)
2 CPU Fan Connector (CPU_FAN1)
3 2 x 240-pin DDR3/DDR3L DIMM Slots (DDR3_A1, DDR3_B1)
4 Chassis Fan Connector (CHA_FAN1)
5 ATX Power Connector (ATXPWR1)
6 USB 3.0 Header (USB3_3_4)
7 TPM Header (TPMS1)
8 USB 2.0 Header (USB4_5)
9 Clear CMOS Pad (CLR MOS1)
10 System Panel Header (PANEL1)
11 Chassis Intrusion and Speaker Header (SPK_CI1)
12 SATA3 Connector (SATA3_0)
13 SATA3 Connector (SATA3_1)
14 SATA3 Connector (SATA3_2)
15 SATA3 Connector (SATA3_3)
16 Front Panel Audio Header (HD_AUDIO1)
English
6 7
1.4 I/O Panel
2
3
1
H110M-DGS/D3
4
9
8
7
6
No. Description No. Description
1 USB 2.0 Ports (USB01)* 6 USB 2.0 Ports (USB23)
2 LAN RJ-45 Port** 7 USB 3.0 Ports (USB3_12)
3 Line In (Light Blue)*** 8 DVI-D Port
4 Front Speaker (Lime)*** 9 PS/2 Mouse/Keyboard Port*
5 Microphone (Pink)***
* Suppor t ACPI wake-up function
** ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications.
ACT/LINK LED
SPEED LED
LAN Por t
Activity / Link LED Speed LED
Status Description Status Description
O No Link O 10Mbps connection
Blinking Data Activity Orange 100Mbps connection
On Link Green 1Gbps connection
5
English
*** To congure 7.1 CH HD Audio, it i s required to use an HD front panel audio modul e and enable the multichannel audio feature through the audio driver.
Please set Speaker Conguration to “7.1 Speaker”in the Realtek HD Audio Manager.
Function of the Audio Ports in 7.1-channel Conguration:
Port Function
Light Blue (Rear panel) Rear Speaker Out
Lime (Rear panel) Front Speaker Out
Pink (Rear panel) Central /Subwoofer Speaker Out
Lime (Front panel) Side Speaker Out
English
8 9
H110M-DGS/D3
Chapter 2 Installation
is is a Micro ATX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
• Make sure to unplug the power cord before installing or removing the motherboard
components. Failure to do so may cause physical injuries and damages to motherboard
components.
• In order to avoid damage from static electricity to the motherboard’s components,
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
• Hold components by the edges and do not touch the ICs.
• Whenever you uninstall any components, place them on a grounded anti-static pad or
in the bag that comes with the components.
• When placing screws to secure the motherboard to the chassis, please do not over-
tighten the screws! Doing so may damage the motherboard.
English
2.1 Installing the CPU
1. Before you insert the 1151-Pin CPU into the socket, please check if the PnP cap is on the
socket, if the CPU surface is unclean, or if there are any bent pins in the socket. Do not
force to in sert the CPU into the socket if above situation is found. Otherwise, the CPU
will be seriously damaged.
2. Unplug all power c ables before in stalling the CPU.
1
2
A
B
English
10 11
H110M-DGS/D3
3
4
5
English
Please save and replace the cover if the processor i s removed. e cover must be placed if
you wish to return the motherboard for aer service.
English
12 13
2.2 Installing the CPU Fan and Heatsink
1 2
H110M-DGS/D3
FAN
CPU_
English
2.3 Installing Memory Modules (DIMM)
is motherboard provides two 240-pin DDR3/DDR3L (Double Data Rate 3)
DIMM slots, and supports Dual Channel Memory Technology.
1. For dual channel cong uration , you always need to in stall identical (the same b rand,
speed , size and chip-type) DDR3/DDR3L DIMM pairs.
2. It is unable to activate Du al Channel Memory Technology with only one memory module
installed.
3. It is not allowed to install a DDR or DDR2 memory module into a DDR3/DDR3L slot;
otherwise , this motherboard and DIM M may be damaged..
e DIMM only ts in one correct orientation. It will cause permanent dam age to the
motherboard and the DIMM if you force the DIMM into the slot at incorrect orientation.
English
14 15
H110M-DGS/D3
1
2
3
English
2.4 Expansion Slots (PCI Express Slots)
ere are 2 PCI Express slots on the motherboard.
Before installing an ex pansion card, please make sure that the power supply is switched o
or the power cord is unplug ged. Pl ease read the documentation of the expansion card and
make necessary hardware settings for the card before you start the installation.
PCIe slots:
PCIE1 (PCIe 2.0 x1 slot) is used for PCI Express x1 lane width cards
PCIE2 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
English
16 17
2.5 Onboard Headers and Connectors
Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over these
heade rs and connectors. Placing jumper caps over the headers and connectors will cause
permanent damage to the motherboard.
H110M-DGS/D3
System Panel Header
(9-pi n PANEL1)
(see p.5, No. 10)
PWRBTN (Power Switch):
Connec t to the power switch on the chassi s front panel. You may congure the way to tur n
o your system using the power switch.
RESET (Reset Switch):
Connec t to the reset switch on the chassi s front panel. P ress the reset sw itch to restart the
computer if the computer f reezes and fails to perform a normal restar t.
PLED (Syste m Power LED):
Connec t to the power status indicator on the chassis front panel. e LED i s on when the
system is operating. e LED keeps blinking when the system is in S1/S3 sleep state. e
LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive ac tivity LED on the chassis front panel. e LED is on when the
hard drive is reading or wr iting data.
e front panel de sign may dier by chassis. A front pane l module mainly consists of power
switch, reset switch , power LED, hard dr ive activity LED, speaker and etc. When connecting your ch assi s front panel module to thi s header, make sure the wire a ssignments and the
pin assignments are matched correctly.
GND
PWRBTN#
PLED-
PLED+
GND
RESET#
GND
HDLED-
HDLED+
1
Connect the power
switch, reset switch and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
English
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