No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com
Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 5
1.4 I/O Panel 7
Chapter 2 Installation 9
2.1 Installing the CPU 10
2.2 Installing the CPU Fan and Heatsink 13
2.3 Installing Memory Modules (DIMM) 14
2.4 Expansion Slots (PCI Express Slots) 16
2.5 Onboard Headers and Connectors 17
Chapter 3 Software and Utilities Operation 21
3.1 Installing Drivers 21
3.2 ASRock Live Update & APP Shop 22
3.2.1 UI Overview 22
3.2.2 Apps 23
3.2.3 BIOS & Drivers 26
3.2.4 Setting 27
3.3 Enabling USB Ports for Windows® 7 Installation 28
Chapter 4 UEFI SETUP UTILITY 31
4.1 Introduction 31
4.2 EZ Mode 32
4.3 Advanced Mode 33
4.3.1 UEFI Menu Bar 33
4.3.2 Navigation Keys 34
4.4 Main Screen 35
4.5 OC Tweaker Screen 36
4.6 Advanced Screen 44
4.6.1 CPU Conguration 45
4.6.2 Chipset Conguration 47
4.6.3 Storage Conguration 49
4.6.4 ACPI Conguration 50
4.6.5 USB Conguration 52
4.6.6 Trusted Computing 53
4.7 Tools 54
4.8 Hardware Health Event Monitoring Screen 57
4.9 Security Screen 59
4.10 Boot Screen 60
4.11 Exit Screen 63
H110M-DGS
Chapter 1 Introduction
ank you for purchasing ASRock H110M-DGS motherboard, a reliable
motherboard produced under ASRock’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock’s
commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
Becau se the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any modications of this documentation occur, the updated version will be available on ASRock’s
website w ithout further notice. If you require technical support relate d to this motherboard, please visit our website for specic information about the model you are using. You
may nd the l atest VGA cards and CPU support list on ASRock ’s website a s well. ASRock
website http://www.asrock.com.
1.1 Package Contents
• ASRock H110M-DGS Motherboard (Micro ATX Form Factor)
Please realize that the re is a certain r isk involved with overclo cking, including adju sting
English
the setting in the BIOS, applying Untied Overclocking Technolog y, or using third-party
overclocking to ols. O verclocking may aect your system’s stability, or even cause damage to
the components and devices of your system. It should be done at your ow n risk and expense.
We are not responsibl e for possible damage caused by overclo cking.
45
Intel
H110
DDR 4_B1 (6 4 bit,2 88-pi n modul e)
DDR 4_A1 (6 4 bit, 28 8-pin m odule )
CMOS
Battery
ATXPWR1
Top:
RJ-45
USB 2.0
T: USB0
B: USB1
USB_4_5
1
HD_AUDIO1
H110M-DGS
RoHS
2
CPU_FAN1
3
5
6
1
BIOS
ROM
Audio
CODEC
PCIE2
TPMS1
1
1
USB3_3_4
PCIE1
USB 2.0
T: USB2
B: USB3
Top:
LINE IN
Cente r:
FRONT
Botto m:
MIC IN
1
ATX12V1
P 2
Mous e
16
DVI 1
SATA3_3
CHA_FAN1
SATA3_2
SATA3_1
SATA3_0
4
7
8
10
1314
15
CLRMOS1
9
USB 3.0
T: USB1
B: USB2
P 2
Keyb oard
S
S
HDLED RESET
PLED PWRBTN
PANEL1
SPK_CI1
1
11
12
1.3 Motherboard Layout
H110M-DGS
English
No. Description
1ATX 12V Power Connector (ATX12V1)
2CPU Fan Connector (CPU_FAN1)
32 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
4Chassis Fan Connector (CHA_FAN1)
5ATX Power Connector (ATXPWR1)
6USB 3.0 Header (USB3_3_4)
7SATA3 Connector (SATA3_0)
8TPM Header (TPMS1)
9USB 2.0 Header (USB_4_ 5)
10 Clear CMOS Pad (CLRMOS1)
11 System Panel Header (PANEL1)
12 Chassis Intrusion and Speaker Header (SPK_CI1)
13 SATA3 Connector (SATA3_1)
14 SATA3 Connector (SATA3_2)
15 SATA3 Connector (SATA3_3)
16 Front Panel Audio Header (HD_AUDIO1)
English
67
1.4 I/O Panel
2
3
1
H110M-DGS
4
10
9
8
7
6
No. DescriptionNo. Description
1PS/2 Mouse Port (Green)***6USB 2.0 Ports (USB23)***
2LAN RJ-45 Port*7USB 2.0 Ports (USB01)
3Line In (Light Blue)**8USB 3.0 Ports (USB3_12)
4Front Speaker (Lime)** 9DVI-D Port
5Microphone (Pink)**10PS/2 Keyboard Port (Purple)***
* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications
** To congure 7.1 CH HD Audio, it i s required to use an HD front panel audio module and enable the multichannel audio feature through the audio driver.
Please set Speaker Conguration to “7.1 Speaker”in the Realtek HD Audio Manager.
Function of the Audio Ports in 7.1-channel Conguration:
PortFunction
Light Blue (Rear panel)Rear Speaker Out
Lime (Rear panel)Front Speaker Out
Pink (Rear panel)Central /Subwoofer Speaker Out
Lime (Front panel)Side Speaker Out
*** Suppor ts ACPI wake-up func tion
English
89
H110M-DGS
Chapter 2 Installation
is is a Micro ATX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
• Make sure to unplug the power cord before installing or removing the motherboard
components. Failure to do so may cause physical injuries and damages to motherboard
components.
• In order to avoid damage from static electricity to the motherboard’s components,
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
• Hold components by the edges and do not touch the ICs.
• Whenever you uninstall any components, place them on a grounded anti-static pad or
in the bag that comes with the components.
• When placing screws to secure the motherboard to the chassis, please do not over-
tighten the screws! Doing so may damage the motherboard.
English
2.1 Installing the CPU
1. Before you insert the 1151-Pin CPU into the socket, please check if the PnP cap is on the
socket, if the CPU surface is unclean, or if there are any bent pins in the socket. Do not
force to in sert the CPU into the socket if above situation is found. Otherwise, the CPU
will be seriously damaged.
2. Unplug all power c ables before in stalling the CPU.
1
2
A
B
English
1011
H110M-DGS
3
4
5
English
Please save and replace the cover if the processor i s removed. e cover must be placed if
you wish to return the motherboard for aer service.
English
1213
2.2 Installing the CPU Fan and Heatsink
12
H110M-DGS
FAN
CPU_
English
2.3 Installing Memory Modules (DIMM)
is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots,
and supports Dual Channel Memory Technology.
1. For dual channel cong uration , you always need to in stall identical (the same b rand,
speed , size and chip-type) DDR4 DIMM pairs.
2. It is unable to activate Du al Channel Memory Technology with only one memory module
installed.
3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4 sl ot;
otherwise , this motherboard and DIM M may be damaged..
e DIMM only ts in one correct orientation. It will cause permanent dam age to the
motherboard and the DIMM if you force the DIMM into the slot at incorrect orientation.
English
1415
H110M-DGS
1
2
3
English
2.4 Expansion Slots (PCI Express Slots)
ere are 2 PCI Express slots on the motherboard.
Before installing an ex pansion card, please make sure that the power supply is switched o
or the power cord is unplug ged. Pl ease read the documentation of the expansion card and
make necessary hardware settings for the card before you start the installation.
PCIe slots:
PCIE1 (PCIe 2.0 x1 slot) is used for PCI Express x1 lane width cards
PCIE2 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
English
1617
2.5 Onboard Headers and Connectors
Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over these
heade rs and connectors. Placing jumper caps over the headers and connectors will cause
permanent damage to the motherboard.
H110M-DGS
System Panel Header
(9-pi n PANEL1)
(see p.5, No. 11)
PWRBTN (Power Switch):
Connec t to the power switch on the chassi s front panel. You may congure the way to tur n
o your system using the power switch.
RESET (Reset Switch):
Connec t to the reset switch on the chassi s front panel. P ress the reset sw itch to restart the
computer if the computer f reezes and fails to perform a normal restar t.
PLED (Syste m Power LED):
Connec t to the power status indicator on the chassis front panel. e LED i s on when the
system is operating. e LED keeps blinking when the system is in S1/S3 sleep state. e
LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive ac tivity LED on the chassis front panel. e LED is on when the
hard drive is reading or wr iting data.
e front panel de sign may dier by chassis. A front pane l module mainly consists of power
switch, reset switch , power LED, hard dr ive activity LED, speaker and etc. When connecting your ch assi s front panel module to thi s header, make sure the wire a ssignments and the
pin assignments are matched correctly.
GND
PWRBTN#
PLED-
PLED+
GND
RESET#
GND
HDLED-
HDLED+
1
Connect the power
switch, reset switch and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
English
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