Version 1.1
Published September 2015
Copyright©2015 ASRock INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidenta l, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com
e terms HDMI™ and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.
Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 6
1.4 I/O Panel 8
Chapter 2 Installation 10
2.1 Installing the CPU 11
2.2 Installing the CPU Fan and Heatsink 14
2.3 Installing Memory Modules (DIMM) 15
2.4 Expansion Slots (PCI Express Slots) 17
2.5 Jumpers Setup 18
2.6 Onboard Headers and Connectors 19
2.7 CrossFireXTM and Quad CrossFireXTM Operation Guide 23
2.7.1 Installing Two CrossFireXTM-Ready Graphics Cards 23
2.7.2 Driver Installation and Setup 25
Chapter 3 Software and Utilities Operation 26
3.1 Installing Drivers 26
3.2 ASRock Live Update & APP Shop 27
3.2.1 UI Overview 27
3.2.2 Apps 28
3.2.3 BIOS & Drivers 31
3.2.4 Setting 32
3.3 Enabling USB Ports for Windows® 7 Installation 33
Chapter 4 UEFI SETUP UTILITY 36
4.1 Introduction 36
4.1.1 UEFI Menu Bar 36
4.1.2 Navigation Keys 37
4.2 Main Screen 38
4.3 OC Tweaker Screen 39
4.4 Advanced Screen 47
4.4.1 CPU Conguration 48
4.4.2 Chipset Conguration 50
4.4.3 Storage Conguration 52
4.4.4 Super IO Conguration 53
4.4.5 ACPI Conguration 54
4.4.6 USB Conguration 56
4.4.7 Trusted Computing 57
4.5 Tools 58
4.6 Hardware Health Event Monitoring Screen 61
4.7 Security Screen 63
4.8 Boot Screen 64
4.9 Exit Screen 67
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H110M Combo-G
Chapter 1 Introduction
ank you for purchasing ASRock H110M Combo-G motherboard, a reliable
motherboard produced under ASRock ’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock ’s
commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
1.1 Package Contents
•ASRock H110M Combo-G Motherboard (Micro ATX Form Factor)
•ASRock H110M Combo-G Quick Installation Guide
•ASRock H110M Combo-G Support CD
•2 x Serial ATA (SATA) Data Cables (Optional)
•1 x I/O Panel Shield
Becau se the motherboard specication s and the BIOS soware might be updated, the
content of this doc umentation will be subject to change without notice. In case any modications of this d ocumentation occur, the updated version will be available on ASRock’s
website w ithout further notice . If you require technical support rel ated to this mothe rboard, please v isit our website for specic information about the model you are using. You
may nd the l atest VGA cards and CPU suppor t list on ASRock’s website as well. ASRock
website http://www.asrock.com.
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1.2 Specications
Platform
•Micro ATX Form Factor
•Solid Capacitor design
CPU
•Supports 6
th
Generation Intel® CoreTM i7/i5/i3/Pentium®/
Celeron® Processors (Socket 1151)
•Digi Power design
•6 Power Phase design
•Supports Intel® Turbo Boost 2.0 Technology
Chipset
•Intel® H110
Memory
•Dual Channel DDR4/DDR3/DDR3L Memory Technolog y
•2 x DDR4 DIMM Slots
•Supports DDR4 2133 non-ECC, un-buered memory
•Max. capacity of system memory: 32GB
•Supports Intel® Extreme Memory Prole (XMP) 2.0
•15 Gold Contact in DDR4 DIMM Slots
•2 x DDR3/DDR3L DIMM Slots
•Supports DDR3/DDR3L 1866(OC)/1600/1333/1066 non-
ECC, un-buered memory
•Max. capacity of system memory: 32GB
•Supports Intel® Extreme Memory Prole (XMP) 1.3 / 1.2
* DDR4 and DDR3/DDR3L memor y can not be used
si multa neou sly.
Expansion
Slot
•1 x PCI Express 3.0 x16 Slot (PCIE1: x16 mode)
•1 x PCI Express 2.0 x16 Slot (PCIE3: x4 mode)
•1 x PCI Express 2.0 x1 Slot
•Supports AMD Quad CrossFireX
TM
and CrossFireXTM
•15 Gold Contact in VGA PCIe Slot (PCIE1)
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H110M Combo-G
Graphics
* Intel® HD Graphics Built-in Visuals and the VGA outputs can
be supported only with processors which are GPU integrated.
•Supports Intel® HD Graphics Built-in Visuals : Intel® Quick
Sync Video with AVC, MVC (S3D) and MPEG-2 Full
HW Encode1, Intel® InTruTM 3D, Intel® Clear Video HD
Technology, Intel® InsiderTM , Intel® HD Graphics 510/530
•Pixel Shader 5.0, DirectX 12
•Max. shared memory 1792MB
•ree graphics output options: D-Sub, DVI-D and HDMI
•Supports HDMI with max. resolution up to 4K x 2K
(4096x2304) @ 24Hz
•Supports DVI-D with max. resolution up to 1920x1200 @
60Hz
•Supports D-Sub with max. resolution up to 1920x1200 @
60Hz
•Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and
HBR (High Bit Rate Audio) with HDMI Port
(Compliant HDMI monitor is required)
•Supports Accelerated Media Codecs: HEVC, VP8, VP9
•Supports HDCP with DVI-D and HDMI Ports
•Supports Full HD 1080p Blu-ray (BD) playback with DVI-D
and HDMI Ports
Audio
•7.1 CH HD Audio (Realtek ALC887 Audio Codec)
* To congure 7.1 CH HD Audio, it is required to use an HD
front panel audio module and enable the multi-channel audio
feature through the audio driver.
•Supports Surge Protection (ASRock Full Spike Protection)
•ELNA Audio Caps
LAN
•Giga bit LAN 10/10 0/10 00 Mb/s
•Giga PHY Intel® I219V
•Supports Wake-On-LAN
•Supports Lightning/ESD Protection (ASRock Full Spike
Protection)
•Supports Energy Ecient Ethernet 802.3az
•Supports PXE
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Rear Panel
I/O
•1 x PS/2 Mouse/Keyboard Port
•1 x D-Sub Port
•1 x DVI-D Port
•1 x HDMI Port
•4 x USB 2.0 Ports (Supports ESD Protection (ASRock Full
Spike Protection))
•2 x USB 3.0 Ports (Supports ESD Protection (ASRock Full
Spike Protection))
•1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
LE D)
•HD Audio Jacks: Line in / Front Speaker / Microphone
Storage
•4 x SATA3 6.0 Gb/s Connectors, support NCQ, AHCI and
Hot Plug
Connector
•1 x COM Port Header
•1 x TPM Header
•1 x Chassis Intrusion Header
•1 x Power LED and Spea ker Header
•1 x CPU Fan Connector (4-pin) (Smart Fan Speed Control)
•2 x Chassis Fan Connectors (4-pin) (Smart Fan Speed Con-
trol)
•1 x 24 pin ATX Power Connector
•1 x 8 pin 12V Power Connector
•1 x Front Panel Audio Connector
•2 x USB 2.0 Headers (Support 4 USB 2.0 ports) (Supports
ESD Protection (ASRock Full Spike Protection))
•1 x USB 3.0 Header (Supports 2 USB 3.0 ports) (Supports
ESD Protection (ASRock Full Spike Protection))
*USB9_10 is shared with USB3_1_2.
BIOS
Feature
•AMI UEFI Legal BIOS with multilingual GUI support
•ACPI 1.1 Compliant wake up events
•SMBIOS 2.3.1 Support
•CPU, DRAM, PCH 1.0V, VCCSA Voltage Multi-adjustment
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H110M Combo-G
Please realize that there is a certain risk involved with overcl ocking, including adjusting
the setting in the BIOS, applying Untied Overclocking Technology, or using third-party
overclocking tools. Overclocking may aect your system’s stability, or even cause damage to
the components an d devices of your system. It should be done at your own risk and expense.
We are not responsible for possible damage cause d by overclocking.
* For detailed product infor mation, please visit our website: http://www.asrock .com
Hardware
Monitor
•CPU/Chassis temperature sensing
•CPU/Chassis Fan Tachometer
•CPU/Chassis Quiet Fan (Auto adjust chassis fan speed by
CPU temperature)
•CPU/Chassis Fan multi-speed control
•CASE OPEN detection
•Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore, DRAM,
PCH 1.0V, VCCIO, VCCSA
OS
•Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-
bit
* To install Windows® 7 OS, a modied installation disk with
xHCI drivers packed into the ISO le is required. Please refer to
page 33 for more detailed instructions.
* For the updated Windows® 10 driver, please visit ASRock’s
website for details: http://www.asrock.com
Certications
•FCC, CE, WHQL
•ErP/EuP ready (ErP/EuP ready power supply is required)
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Intel
H110
DDR 3_B1 (6 4 bit, 24 0-pin m odule )
DDR 4_B1 (6 4 bit, 28 8-pin m odule )
CMOS
Battery
ATXPWR 1
Top:
RJ-45
USB 2.0
T: USB7
B: USB8
CLRCMOS1
HDLED RESET
PLED PWRBTN
PANEL1
1
USB1_2
COM1
1
1
H110M Combo-G
CHA_FAN2
RoHS
10
12
15
19
2
CPU_FAN1
4
5
9
1
BIOS
ROM
HDM I1
PCIE1
PCI Express 3.0
TPMS1
1
1
USB3_1_2
SATA3_0 SATA3 _2
SATA3_1 SATA3 _3
USB 2.0
T: USB5
B: USB6
Top:
LINE IN
Cente r:
FRONT
Botto m:
MIC IN
1
ATX12V1
USB 3. 0
T: USB3
B: USB 4
PS2
Keyb oard
/Mous e
SPK_PLED
1
PCIE2
Front USB 3.0
11
13
14
16
21
Sup er
I/O
Audio
CODEC
VGA1
DVI 1
DDR 3_A1 (6 4 bit, 24 0-pin m odule )
DDR 4_A1 (6 4 bit, 28 8-pin m odule )
CHA_FA N1
SPEAKER
PLED
C 1I
PCIE3
1
1
HD_AUDIO1
3
6
8
1718
20
1
USB9_10
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1.3 Motherboard Layout
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H110M Combo-G
No. Description
1 ATX 12V Power Connector (ATX12V1)
2 CPU Fan Connector (CPU_FAN1)
3 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
4 2 x 240-pin DDR3/DDR3L DIMM Slots (DDR3_A1, DDR3_B1)
5 ATX Power Connector (ATXPWR1)
6 USB 3.0 Header (USB3_1_2)
7 USB 2.0 Header (USB9_10)
8 Chassis Fan Connector (CHA_FAN1)
9 SATA3 Connector (SATA3_2)
10 SATA3 Connector (SATA3_3)
11 SATA3 Connector (SATA3_1)
12 SATA3 Connector (SATA3_0)
13 System Panel Header (PANEL1)
14 Power LED and Speaker Header (SPK_PLED)
15 USB 2.0 Header (USB1_2)
16 TPM Header (TPMS1)
17 Clear CMOS Jumper (CLRMOS1)
18 Chassis Intrusion Header (CI1)
19 COM Port Header (COM1)
20 Front Panel Audio Header (HD_AUDIO1)
21 Chassis Fan Connector (CHA_FAN2)
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1.4 I/O Panel
No. Description No. Description
1 PS/2 Mouse/Keyboard Port 7 USB 2.0 Ports (USB78)
2 D-Sub Port 8 USB 2.0 Ports (USB56)
3 LAN RJ-45 Port* 9 HDMI Port
4 Line In (Light Blue)** 10 DVI-D Port
5 Front Speaker (Lime)** 11 USB 3.0 Ports (USB3_34)
6 Microphone (Pink)**
6
7
8
9
3
5
4
1011
1
2
* ere are two LEDs on ea ch LAN port. Pl ease refer to the table below for the LA N port LED indic ations .
Activity / Link LED Speed LED
Status Description Status Description
O No Link O 10Mbps connection
Blinking Data Activity Orange 100Mbps connection
On Link Green 1Gbps connection
ACT/LINK LED
SPEED LED
LAN Por t
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H110M Combo-G
** To congure 7.1 CH HD Audio, it i s required to use an HD front panel audio module and enable the multichannel audio feature through the audio driver.
Please set Speaker Conguration to “7.1 Speaker” in the Realtek HD Audio Man ager.
Function of the Audio Ports in 7.1-channel Conguration:
Port Function
Light Blue (Rear panel) Rear Speaker Out
Lime (Rear panel) Front Speaker Out
Pink (Rear panel) Central /Subwoofer Speaker Out
Lime (Front panel) Side Speaker Out
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is is a Micro ATX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
•Make sure to unplug the power cord before installing or removing the motherboard
components. Failure to do so may cause physical injuries and damages to motherboard
components.
•In order to avoid damage from static electricity to the motherboard’s components,
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
•Hold components by the edges and do not touch the ICs.
•Whenever you uninstall any components, place them on a grounded anti-static pad or
in the bag that comes with the components.
•When placing screws to secure the motherboard to the chassis, please do not over-
tighten the screws! Doing so may damage the motherboard.
Chapter 2 Installation
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H110M Combo-G
2.1 Installing the CPU
1. Before you insert the 1151-Pin CPU into the socket, please check if the PnP cap is on the
socket, if the CPU surface is unclean, or if there are any bent pins in the socket. Do not
force to in sert the CPU into the socket if above situation is found. Otherwise, the CPU
will be seriously damaged.
2. Unplug all power c ables before ins talling the CPU.
1
2
A
B
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4
5
3
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H110M Combo-G
Please save and replace the cover if the processor is removed. e cover mus t be placed if
you wish to return the motherboard for a er service.
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2.2 Installing the CPU Fan and Heatsink
1 2
CPU_
FAN
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H110M Combo-G
2.3 Installing Memory Modules (DIMM)
is motherboard provides two 288-pin DDR4 (Double Data Rate 4) and two 240-
pin DDR3/DDR3L (Double Data Rate 3) DIMM slots, and supports Dual Channel
Memory Technology.
Dual Channel Memory Conguration
e DIMM only ts in one correct orientation. It will cause permanent dam age to the
motherboard and the DIMM if you force the DIM M into the slot at incorrect orientation.
Priority DDR4_A1 DDR3_A1 DDR4_B1 DDR3_B1
1 Populated Populated
2 Populated Populated
1. For dual channel conguration, you always need to install identical (the same brand,
speed , size and chip-type) DDR4 or DDR3/DDR 3L DIMM pairs.
2. It is unable to activate Dual Channel Memory Technology with only one or three memor y
module installed.
3. It is not allowed to install a DDR or DDR2 memory module into a DDR3 slot, or a DDR,
DDR2 or DDR3 m emory module into a DDR4 slot; otherwise, this motherboard and
DIMM may be damaged.
Warning! It is NOT allowed to install a memor y module into a DDR4 slot and a DDR3 slot
simultaneously; other wise, this motherboard and DIMM m ay be damaged.
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2
3
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H110M Combo-G
2.4 Expansion Slots (PCI Express Slots)
ere are 3 PCI Express slots on the motherboard.
PCIe slots:
PCIE1 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
PCIE2 (PCIe 2.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE3 (PCIe 2.0 x16 slot) is used for PCI Express x4 lane width graphics cards.
Before installing an expansion c ard, ple ase make sure that the power supply is switched o
or the power cord is unplugged. Please read the documentation of the expansion card and
make necessary hardware settings for the card before you start the installation.
For a better ther mal environment , please connect a chass is fan to the motherboard’s cha ssis
fan connector (CHA_FAN1 or CHA _FAN2) when using multiple g raphics cards.
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