ASRock B560 Pro4 Instruction manual

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Version 1.0

Published January 2021

No part of this documentation may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc.

Products and corporate names appearing in this documentation may or may not be registered trademarks or copyrights of their respective companies, and are used only for identication or explanation and to the owners’ benet, without intent to

infringe.

Disclaimer:

Specications and information contained in this documentation are furnished for informational use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this documentation.

With respect to the contents of this documentation, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warranties or conditions of merchantability or tness for a particular purpose.

In no event shall ASRock, its directors, ocers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of prots, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the documentation or product.

is device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that

may cause undesired operation.

CALIFORNIA, USA ONLY

e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance controlled in Perchlorate Best Management Practices (BMP) regulations passed by the California Legislature. When you discard the Lithium battery in California, USA, please follow the related regulations in advance. “Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/ perchlorate”

ASRock Website: http://www.asrock.com

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AUSTRALIA ONLY

Our goods come with guarantees that cannot be excluded under the Australian Consumer Law. You are entitled to a replacement or refund for a major failure and compensation for any other reasonably foreseeable loss or damage caused by our goods. You are also entitled to have the goods repaired or replaced if the goods fail to be of acceptable quality and the failure does not amount to a major failure. If you require assistance please call ASRock Tel

: +886-2-28965588 ext.123 (Standard International call charges apply)

e terms HDMI® and HDMI High-Denition Multimedia Interface, and the HDMI

logo are trademarks or registered trademarks of HDMI Licensing LLC in the United States and other countries.

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IMPORTANT - READ BEFORE COPYING, INSTALLING OR USING.

LICENSE. Licensee has a license under Intel’s copyrights to reproduce Intel’s Soware only in its unmodied and binar y form, (with the accompanying documentation, the “Soware”) for Licensee’s personal use only, and not commercial use, in connection with Intel-based products for which the Soware has been provided, subject to the following conditions:

(a) Licensee may not disclose, distribute or transfer any part of the Soware, and You agree to prevent unauthorized copying of the Soware.

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(d) e Soware may contain the soware and other intellectual property of third party suppliers, some of which may be identied in, and licensed in accordance with, an enclosed license.txt le or other text or le.

(e) Intel has no obligation to provide any support, technical assistance or updates for the Soware.

OWNERSHIP OF SOFTWARE AND COPYRIGHTS. Title to all copies of the Soware remains with Intel or its licensors or suppliers. e Soware is copyrighted and protected by the laws of the United States and other countries, and international treaty provisions. Licensee may not remove any copyright notices from the Soware. Except as other wise expressly provided above, Intel grants no express or implied right under Intel patents, copyrights, trademarks, or other intellectual property rights. Transfer of the license terminates Licensee’s right to use the Soware.

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ES OF ANY KIND WHETHER UNDER THIS AGREEMENT OR OTHERWISE, EVEN IF INTEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

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TERMINATION OF THIS LICENSE. Intel or the sublicensor may terminate this license at any time if Licensee is in breach of any of its terms or conditions. Upon termination, Licensee will immediately destroy or return to Intel all copies of the Soware.

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U.S. GOVERNMENT RESTRICTED RIGHTS. e Soware is a commercial item (as dened in 48 C.F.R. 2.101) consisting of commercial computer soware and commercial computer soware documentation (as those terms are used in 48 C.F.R. 12.212), consistent with 48 C.F.R. 12.212 and 48 C.F.R 227.7202-1 through 227.7202-4. You will not provide the Soware to the U.S. Government. Contractor or Manufacturer is Intel Corporation, 2200 Mission College Blvd., Santa Clara, CA 95054.

EXPORT LAWS. Licensee agrees that neither Licensee nor Licensee’s subsidiaries will export/re-export the Soware, directly or indirectly, to any country for which the U.S. Department of Commerce or any other agency or department of the U.S. Government or the foreign government from where it is shipping requires an export license, or other governmental approval, without rst obtaining any such required license or approval. In the event the Soware is exported from the U.S.A. or re-exported from a foreign destination by Licensee, Licensee will ensure that the distribution and export/re-export or import of the Soware complies with all laws, regulations, orders, or other restrictions of the U.S. Export Administration Regulations and the appropriate foreign government.

APPLICABLE LAWS. is Agreement and any dispute arising out of or relating to it will be governed by the laws of the U.S.A. and Delaware, without regard to conict of laws principles. e Parties to this Agreement exclude the application of the United Nations Convention on Contracts for the International Sale of Goods (1980). e state and federal courts sitting in Delaware, U.S.A. will have exclusive jurisdiction over any dispute arising out of or relating to this Agreement. e Parties consent to persona l jurisdiction and venue in those courts. A Party that obtains a judgment against the other Party in the courts identied in this section may enforce that judgment in any court that has jurisdiction over the Parties.

Licensee’s specic rights may vary from country to country.

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Contents

Chapter 1 Introduction 1

1.1 Package Contents 1

1.2 Specications 2

1.3 Motherboard Layout 7

1.4 I/O Panel 9

Chapter 2 Installation 10

2.1 Installing the CPU 11

2.2 Installing the CPU Fan and Heatsink 14

2.3 Installing Memory Modules (DIMM) 15

2.4 Expansion Slots (PCI Express Slots) 17

2.5 Jumpers Setup 18

2.6 Onboard Headers and Connectors 19

2.7 Post Status Checker 25

2.8 M.2 WiFi/BT Module and Intel® CNVi (Integrated WiFi/BT) Installation Guide 26

2.9 M.2_SSD (NGFF) Module Installation Guide (M2_1) 28

2.10 M.2_SSD (NGFF) Module Installation Guide (M2_2) 31

2.11 M.2_SSD (NGFF) Module Installation Guide (M2_3) 34

Chapter 3 Software and Utilities Operation 37

3.1 Installing Drivers 37

3.2 ASRock Motherboard Utility (A-Tuning) 38

3.3 ASRock Live Update & APP Shop 41

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3.3.1 UI Overview 41

3.3.2 Apps 42

3.3.3 BIOS & Drivers 45

3.3.4 Setting 46

3.4 Nahimic Audio 47

3.5 ASRock Polychrome SYNC 48

Chapter 4 UEFI SETUP UTILITY 51

4.1 Introduction 51

4.2 EZ Mode 52

4.3 Advanced Mode 53

4.3.1 UEFI Menu Bar 53

4.3.2 Navigation Keys 54

4.4 Main Screen 55

4.5 OC Tweaker Screen 56

4.6 Advanced Screen 68

4.6.1 CPU Conguration 69

4.6.2 Chipset Conguration 71

4.6.3 Storage Conguration 74

4.6.4 Super IO Conguration 75

4.6.5 ACPI Conguration 76

4.6.6 USB Conguration 77

4.6.7 Trusted Computing 78

4.7 Tools 79

4.8 Hardware Health Event Monitoring Screen 81

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4.9 Security Screen 85

4.10 Boot Screen 86

4.11 Exit Screen 89

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Chapter 1 Introduction

ank you for purchasing ASRock B560 Pro4 motherboard, a reliable motherboard

produced under ASRock ’s consistently stringent quality control. It delivers excellent

performance with robust design conforming to ASRock ’s commitment to quality

and endurance.

In this documentation, Chapter 1 and 2 contains the introduction of the

motherboard and step-by-step installation guides. Chapter 3 contains the operation

guide of the soware and utilities. Chapter 4 contains the conguration guide of

the BIOS setup.

Becau se the motherboard specications and the BIOS soware might be updated, the content of this documentation will be subject to change without notice. In case any modications of this documentation occur, the updated version will be available on ASRock’s website w ithout f urther notice. If you require technical support relate d to this motherboard, please vi sit our website for s pecic information about the model you are using. You may nd the l atest VGA cards and CPU suppor t list on ASRock’s website a s well. ASRock website http://www.asrock.com.

1.1 Package Contents

ASRock B560 Pro4 Motherboard (ATX Form Factor)

•

ASRock B560 Pro4 Quick Installation Guide

•

ASRock B560 Pro4 Support CD

•

2 x Serial ATA (SATA) Data Cables (Optional)

•

4 x Screws for M.2 Sockets (Option al)

•

1 x Stando for M.2 Socket (Optional)

•

1 x I/O Panel Shield

•

B560 Pro4

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1.2 Specications

Platform

CPU

Chipset

Memory

* 11th Gen Intel® CoreTM (i9/i7/i5) support DDR4 up to 2933;

CoreTM (i3), Pentium® and Celeron® support DDR4 up to 2666.

* 10th Gen Intel® CoreTM (i9/i7) support DDR4 up to 2933; CoreTM

(i5/i3), Pentium® and Celeron® support DDR4 up to 2666.

* Please refer to Memory Support List on ASRock's website for

more information. (http://www.asrock.com/)

ATX Form Factor

•

Solid Capacitor design

•

Suppor ts 10th Gen Intel® CoreTM Processors and 11th Gen

•

Intel® CoreTM Processors (LGA1200)

Digi Power design

•

8 Power Phase design

•

Supports Intel® Turbo Boost Max 3.0 Technology

•

Intel® B560

•

Dual Channel DDR4 Memory Technology

•

4 x DDR4 DIMM Slots

•

11th Gen Intel® CoreTM Processors support DDR4 non-ECC,

•

un-buered memory up to 4800+(OC)*

10th Gen Intel® CoreTM Processors support DDR4 non-ECC,

•

un-buered memory up to 4600+(OC)*

Supports ECC UDIMM memory modules (operate in non-

•

ECC mode)

Max. capacity of system memory: 128GB

•

Supports Intel® Extreme Memory Prole (XMP) 2.0

•

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B560 Pro4

Expansion Slot

Graphics

11th Gen Intel® CoreTM Processors

2 x PCI Express x16 Slots (PCIE1/PCIE3: single at Gen4x16

•

(PCIE1); dual at Gen4x16 (PCIE1) / Gen3x2 (PCIE3))*

10th Gen Intel® CoreTM Processors

2 x PCI Express x16 Slots (PCIE1/PCIE3: single at Gen3x16

•

(PCIE1); dual at Gen3x16 (PCIE1) / Gen3x2 (PCIE3))*

* Supports NVMe SSD as boot disks

2 x PCI Express 3.0 x1 Slots

•

1 x M.2 Socket (Key E), supports ty pe 2230 WiFi/BT module

•

and Intel® CNVi (Integrated WiFi/BT)

* Intel® UHD Graphics Built-in Visuals and the VGA outputs can

be supported only with processors which are GPU integrated.

11th Gen Intel® CoreTM Processors support Intel® Xe Graphics

•

Architecture (Gen 12). 10th Gen Intel® CoreTM Processors

support Gen 9 Graphics

Graphics, Media & Compute: Microso DirectX 12, OpenGL

•

4.5, Intel® Built In Visuals, Intel® Quick Sync Video, Hybrid /

Switchable Graphics, OpenCL 2.1

Display & Content Security: Rec. 2020 (Wide Color Gamut),

•

Microso PlayReady 3.0, UHD/HDR Blu-ray Disc

Dual graphics output: support HDMI and DisplayPort 1.4

•

ports by independent display controllers

Supports HDMI 2.0 with ma x. resolution up to 4K x 2K

•

(4096x2160) @ 60Hz

Supports DisplayPort 1.4 with max. resolution up to 4K x 2K

•

(4096x2304) @ 60Hz

Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and

•

HBR (High Bit Rate Audio) with HDMI 2.0 Port

(Compliant HDMI monitor is required)

Supports HDCP 2.3 with HDMI 2.0 and DisplayPort 1.4

•

Ports

Supports 4K Ultra HD (UHD) playback with HDMI 2.0 and

•

DisplayPort 1.4 Ports

* 11th Gen Intel® CoreTM Processors support HDMI 2.0. 10th Gen

Intel® CoreTM Processors support HDMI 1.4.

Audio

7.1 CH HD Audio (Realtek ALC897 Audio Codec)

•

Supports Surge Protection

•

Nahimic Audio

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LAN

Rear Panel I/O

Storage

Gigabit LAN 10/100/10 00 Mb/s

•

Giga PHY Intel® I219V

•

Supports Wake-On-LAN

•

Supports Lightning/ESD Protection

•

Supports Energy Ecient Ethernet 802.3az

•

Supports PXE

•

3 x Antenna Mounting Points

•

1 x PS/2 Mouse/Keyboard Port

•

1 x HDMI Port

•

1 x DisplayPort 1.4

•

4 x USB 3.2 Gen1 Ports (Supports ESD Protection)

•

2 x USB 2.0 Ports (Supports ESD Protection)

•

1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED

•

LED)

HD Audio Jacks: Line in / Front Speaker / Microphone

•

6 x SATA3 6.0 Gb/s Connectors, support Intel Rapid Storage

•

Technology 18, NCQ, AHCI and Hot Plug*

* If M2_3 is occupied by a SATA-type M.2 device, SATA3_1 will

be disabled.

1 x Hyper M.2 Socket (M2_1), supports M Key ty pe

•

2242/2260/2280 M.2 PCI Express module up to Gen4x4

(64 Gb/s) (Only supported with 11th Gen Intel® CoreTM

Processors)**

1 x Ultra M.2 Socket (M2_2), supports M Key type

•

2242/2260/2280 M.2 PCI Express module up to Gen3 x4 (32

Gb/s)**

1 x M.2 Socket (M2_3), supports M Key ty pe 2280/22110 M.2

•

SATA3 6.0 Gb/s module and M.2 PCI Express module up to

Gen3 x2 (16 Gb/s)**

** Supports Intel® OptaneTM Tech nolo gy (M 2_ 2)

** Supports NVMe SSD as boot disks

** Supports ASRock U.2 Kit

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Connector

1 x COM Port Header

•

1 x SPI TPM Header

•

1 x Chassis Intrusion and Speaker Header

•

2 x RGB LED Headers

•

* Support in total up to 12V/3A, 36W LED Strip

2 x Addressable LED Headers

•

* Support in total up to 5V/3A, 15W LED Strip

1 x CPU Fan Connector (4-pin)

•

* e CPU Fan Connector supports the CPU fan of ma ximum

1A (12W) fan power.

1 x CPU/Water Pump Fan Connector (4-pin) (Smart Fan

•

Speed Control)

* e CPU/Water Pump Fan supports the water cooler fan of

maximum 2A (24W) fan power.

5 x Chassis/Water Pump Fan Connectors (4-pin) (Smart Fan

•

Speed Control)

* e Chassis/Water Pump Fan supports the water cooler fan of

maximum 2A (24W) fan power.

* CPU_FAN2/WP, CHA_FAN1/WP, CHA_FAN2/WP, CHA_

FAN3/WP, CHA_FAN4/WP and CHA_FAN5/WP can auto

detect if 3-pin or 4-pin fan is in use.

1 x 24 pin ATX Power Connector

•

1 x 8 pin 12V Power Connector (Hi-Density Power Connec-

•

tor)

1 x Front Panel Audio Connector

•

1 x USB 2.0 Header (Supports 2 USB 2.0 ports) (Supports

•

ESD Protection)

2 x USB 3.2 Gen1 Headers (Support 4 USB 3.2 Gen1 ports)

•

(ASMedia ASM1074 hub) (Supports ESD Protection)

1 x Front Panel Type C USB 3.2 Gen1 Header (Supports ESD

•

Protection)

B560 Pro4

BIOS Feature

AMI UEFI Legal BIOS with multilingual GUI support

•

ACPI 6.0 Compliant wake up events

•

SMBIOS 2.7 Support

•

CPU Core/Cache, GT, DRAM, VPPM, VCCIN AUX, VCCIO,

•

VCCST, VCCSA Voltage Multi-adjustment

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Temperature Sensing: CPU, CPU/Water Pump, Chassis/Wa-

Hardware Monitor

•

ter Pump Fans

Fan Tachometer: CPU, CPU/Water Pump, Chassis/Water

•

Pump Fans

Quiet Fan (Auto adjust chassis fan speed by CPU tempera-

•

ture): CPU, CPU/Water Pump, Chassis/Water Pump Fans

Fan Multi-Speed Control: CPU, CPU/Water Pump, Chassis/

•

Water Pump Fans

CASE OPEN detection

•

Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore, DRAM,

•

VPPM, VCCIN AUX, VCCSA, VCCPLL, VCCIO

Microso® Windows® 10 64-bit

Certications

* For detailed product information, please visit our website: http://www.asrock .com

Please realize that the re is a certain r isk involved with overclo cking, including adjusting the setting in the BIOS, applying Untied Overclocking Technol ogy, or using third-party overclocking tool s. Overclocking may aect your system’s stability, or even cause dam age to the components and devices of your system. It should be done at your own risk and expense. We are not responsible for poss ible damage caused by overclocking.

•

FCC, CE

•

ErP/EuP ready (ErP/EuP ready power supply is required)

•

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1.3 Motherboard Layout

Intel

B560

DDR 4_A2 (6 4 bit, 28 8-pin m odule )

DDR 4_A1 (6 4 bit, 28 8-pin m odule )

DDR 4_B2 (6 4 bit, 28 8-pin m odule )

DDR 4_B1 (6 4 bit, 28 8-pin m odule )

USB 2. 0

T: USB1

B: USB 2

ATXP WR 1

PCIE1

Top: RJ-45

USB 3.2 Gen1 T: USB3_1 B: USB3_2

PCIE3

HDLED RESET

PLED PWRBTN

HD_AUDIO1

PS2

Keybo ard

/Mous e

CMOS

Battery

PCIE2

M2_ 1

C 10

C 9

Top:

LINE I N

Cent er:

FRON T

Bott om:

MIC IN

M2_ WIFI1

M2_WIFI_CT1

M2_ 3

C 23

C 24

HDM I1

PCIE4

AUDIO

CODEC

CHA_FAN 5/WP

CHA_FAN1/WP

CHA_FAN2/WP

CPU_FAN2/WP

CPU_FAN1

CHA_FAN4/ WP

SUPER

I/O

USB3_5 _6

USB31_ TC_1

RGB_LE D2

ADDR_L ED2

RoHS

C 7

ADDR_LED1

RGB_LED1

USB3_4

SATA3_0 SATA3_1

CLRMOS1

PANEL1

ATX12V1

SPI_TPM_J1

SATA3_4

SATA3_5

D 1 P

USB3_7 _8

SATA3_2

SATA3_3

C 8

M2_ 2

C 12

C 13

C 14

C 11

SPK_CI1

CHA_FAN3/WP

COM1

DRAM

BOOT

VGA

CPU

USB 3.2 Gen1 T: USB3_3 B: USB3_4

B560 Pro4

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English

No. Description

1 ATX 12V Power Connector (ATX12V1)

2 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)

3 2 x 288-pin DDR4 DIMM Slots (DDR4_A2, DDR4_B2)

4 CPU Fan Connector (CPU_FAN1)

5 CPU/Water Pump Fan Connector (CPU_FAN2/WP)

6 Addressable LED Header (ADDR_LED2)

7 RGB LED Header (RGB_LED2)

8 Chassis/Water Pump Fan Connector (CHA_FAN5/WP)

9 ATX Power Connector (ATXPWR1)

10 Front Panel Type C USB 3.2 Gen1 Header (USB31_TC_1)

11 USB 3.2 Gen1 Header (USB3_7_8)

12 USB 3.2 Gen1 Header (USB3_5_6)

13 SATA3 Connector (SATA3_2)

14 SATA3 Connector (SATA3_3)

15 SATA3 Connec tor (SATA3_4)

16 SATA3 Connector (SATA3_5)

17 Chassis/Water Pump Fan Connector (CHA_FAN4/WP)

18 Post Status Checker (PSC)

19 SPI TPM Header (SPI_TPM_J1)

20 SATA3 Connector (SATA3_1)

21 SATA3 Connector (SATA3_0)

22 System Panel Header (PANEL1)

23 Clear CMOS Jumper (CLRMOS1)

24 USB 2.0 Header (USB3_4)

25 Chassis Intrusion and Speaker Header (SPK_CI1)

26 Chassis/Water Pump Fan Connector (CHA_FAN2/WP)

27 Chassis/Water Pump Fan Connector (CHA_FAN3/WP)

28 Addressable LED Header (ADDR_LED1)

29 RGB LED Header (RGB_LED1)

30 COM Port Header (COM1)

31 Front Panel Audio Header (HD_AUDIO1)

32 Chassis/Water Pump Fan Connector (CHA_FAN1/WP)

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1.4 I/O Panel

B560 Pro4

No. Description No. Description

1 USB 2.0 Ports (USB1_2) 6 USB 3.2 Gen1 Ports (USB3_1_2)

2 LAN RJ-45 Port* 7 USB 3.2 Gen1 Ports (USB3_3_4)

3 Line In (Light Blue)** 8 DisplayPort 1.4

4 Front Speaker (Lime)** 9 HDMI Port

5 Microphone (Pink)** 10 PS/2 Mouse/Keyboard Port

* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications .

ACT/LINK LED

SPEED LED

LAN Por t

Activity / Link LED Speed LED

Status Description Status Description

O No Link O 10Mbps connection Blinking Data Activity Orange 100Mbps connection On Link Green 1Gbps connection

** Function of the Audio Ports in 7.1-channel Conguration:

Port Function

Light Blue (Rear panel) Rear Speaker Out Lime (Rear panel) Front Speaker Out Pink (Rear panel) Central /Subwoofer Speaker Out Lime (Front panel) Side Speaker Out

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Chapter 2 Installation

is is an ATX form factor motherboard. Before you install the motherboard, study

the conguration of your chassis to ensure that the motherboard ts into it.

Pre-installation Precautions

Take note of the following precautions before you install motherboard components

or change any motherboard settings.

Make sure to unplug the power cord before installing or removing the motherboard

•

components. Failure to do so may cause physical injuries and damages to motherboard

components.

In order to avoid damage from static electricity to the motherboard’s components,

•

NEVER place your motherboard directly on a carpet. Also remember to use a grounded

wrist strap or touch a safety grounded object before you handle the components.

Hold components by the edges and do not touch the ICs.

•

Whenever you uninstall any components, place them on a grounded anti-static pad or

•

in the bag that comes with the components.

When placing screws to secure the motherboard to the chassis, please do not over-

•

tighten the screws! Doing so may damage the motherboard.

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2.1 Installing the CPU

1. Before you insert the 1200-Pin CPU into the socke t, please check if the PnP cap is on the socket, if the CPU surface is unclean, or if there are any bent pins in the socket. Do not force to in sert the CPU into the socket if above situation is found. Otherwise, the CPU will be seriously damaged.

2. Unplug all power c ables before in stalling the CPU.

B560 Pro4

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English

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Please save and replace the cover if the processor i s removed. e cover must be placed if you wish to return the motherboard for aer service.

B560 Pro4

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2.2 Installing the CPU Fan and Heatsink

1 2

English

CPU_FAN

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2.3 Installing Memory Modules (DIMM)

is motherboard provides four 288-pin DDR4 (Double Data Rate 4) DIMM slots,

and supports Dual Channel Memory Technology.

1. For dual channe l conguration, you always need to in stall identical (the same

brand, speed , size and chip-type) DDR4 DIMM pairs.

2. It is unable to activate Dual Channel Memor y Te chnology with only one or three

memory module installed.

3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4

slot; otherwise, this motherboard and DIMM may be damaged.

Dual Channel Memory Conguration

Priority DDR4_A1 DDR4_A2 DDR4_B1 DDR4_B2

1 Populated Populated 2 Populated Populated Populated Populated

e DIMM only ts in one correct orientation. It will cause permanent dam age to the mothe rboard and the DIMM if you force the DIMM into the slot at incor rect orientation.

B560 Pro4

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Page 25

2.4 Expansion Slots (PCI Express Slots)

ere are 4 PCI Express slots on the motherboard.

Before installing an ex pansion card, please make sure that the power supply is switched o or the power cord is unplugged. Plea se read the documentation of the expan sion card and mak e necessary hardware settings for the card before you start the installation.

PCIe slots:

11th Gen Intel® CoreTM Processors:

PCIE1 (PCIe 4.0 x16 slot) is used for PCI Express x16 lane width graphics cards.

PCIE2 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

PCIE3 (PCIe 3.0 x16 slot) is used for PCI Express x2 lane width graphics cards.

PCIE4 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

10th Gen Intel® CoreTM Processors:

PCIE1 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.

PCIE2 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

PCIE3 (PCIe 3.0 x16 slot) is used for PCI Express x2 lane width graphics cards.

PCIE4 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

B560 Pro4

PCIe Slot Congurations

PCIE1 PCIE3

11th Gen Intel® CoreTM Processors Gen4x16 Gen3x 2

10th Gen Intel® CoreTM Processors Gen3x16 Gen3x2

For a better ther mal environment, ple ase connect a ch assi s fan to the motherboard’s chassis fan connector (CHA_ FAN1/WP, CHA_ FAN2/WP, CHA_FAN3/WP, CHA_ FAN4/WP or CHA_ FAN5/WP) when u sing multiple graphics cards.

English

Page 26

2.5 Jumpers Setup

e illustration shows how jumpers are setup. When the jumper cap is placed on

the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is

“O pen”.

Clear CMOS Jumper

(CLRMO S1)

(see p.7, No. 23)

CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system

parameters to default setup, please turn o the computer and unplug the power

cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to

short the pins on CLR MOS1 for 5 seconds. However, please do not clear the

CMOS right aer you update the BIOS. If you need to clear the CMOS when you

just nish updating the BIOS, you must boot up the system rst, and then shut it

down before you do the clear-CMOS action. Please be noted that the password,

date, time, and user default prole will be cleared only if the CMOS battery is

removed. Please remember toremove the jumper cap aer clearing the CMOS.

2-pin Jumper

English

If you clear the CMOS, the case open may be detec ted. Please adjust the BIOS option “Clear Status” to clear the record of previous chassis intrusion status.

Page 27

2.6 Onboard Headers and Connectors

Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over these header s and connectors. Placing jumper caps over the headers and connectors will cause permanent damage to the motherboard.

B560 Pro4

System Panel Header

(9-pi n PANEL1)

(see p.7, No. 22)

PWRBTN (Power Button):

Connec t to the power button on the chassi s front panel. You may congure the way to turn o your system using the power button.

RESET (Reset Button): Connec t to the reset button on the chassi s front panel. Press the reset button to restar t the computer if the computer freezes and fails to perform a nor mal restart.

PLED (Syste m Power LED): Connec t to the power status indicator on the chassis front panel. e LED i s on when the system is ope rating. e LED keeps blinking when the system i s in S1/S3 sleep state. e LED is o when the system is in S4 sleep state or powered o (S5).

HDLED (Ha rd Drive Activity LED): Connec t to the hard drive ac tivity LED on the chassis front panel. e LED is on when the hard drive i s reading or writing data.

e front panel de sign may dier by chassis. A front pane l module mainly consists of power button , reset button, power LED, hard dr ive activity LED, speaker and etc. When connecting your chassis front panel module to this head er, make sure the wire assig nments and the pin assig nments are matched correctly.

PLED+

PLED-

HDLED-

HDLED+

PWRBTN#

GND

RESET#

GND

Connect the power button,

reset button and system

status indicator on the

chassis to this header

according to the pin

assignments below. Note

the positive and negative

pins before connecting the

cables.

English

Page 28

Chassis Intrusion and

SPEAKER

Speaker Header

(7-pi n SPK _CI1)

(see p.7, No. 25)

DUMMY +5V

SIGNAL

DUMMY

GND

DUMMY

Please connect the

chassis intrusion and the

chassis speaker to this

header.

Serial ATA3 Connectors

Ver ti c a l:

(SATA3_0:

see p.7, No. 21)

(SATA3_1:

see p.7, No. 20)

Right-A ng le:

(SATA3_ 2:

see p.7, No. 13)

(SATA3_ 3:

see p.7, No. 14)

(SATA3_4:

see p.7, No. 15)

(SATA3_ 5:

see p.7, No. 16)

USB 2.0 Header

(9-pin USB3_4)

(see p.7, No. 24)

SATA3_0

USB_PWR

P-

USB_PWR

SATA3_2

SATA3_3

SATA3_4

SATA3_5

P+

SATA3_1

GND

DUMMY

GND

ese six SATA3

connectors support SATA

data cables for internal

storage devices with up to

6.0 Gb/s data transfer rate.

* If M2_3 is occupied by

a SATA-type M.2 device,

SATA3_1 will be disabled.

ere is one USB 2.0 header

on this motherboard.

is USB 2.0 header can

support two ports.

English

Page 29

B560 Pro4

USB 3.2 Gen1 Headers

Ver ti c a l:

(19-pin USB3_5_6)

(see p.7, No. 12)

Right-A ng le:

(19-pin USB3_7_8)

(see p.7, No. 11)

Front Panel Audio Header

(9-pin HD_ AUDIO1)

(see p.7, No. 31)

1. High De nition Audio sup ports Jack Sen sing, but the pan el wire on the chassis

must support HDA to function correctly. Please follow the instructions in our manual and chassis manual to install your system.

2. If you use an AC’97 audio panel , please install it to the front panel audio header by

the steps below: A. Connect Mic_IN (MIC) to MIC2_ L. B. Conne ct Audio_R (RIN) to OUT2_R and Audio_ L (LIN) to OUT2_ L. C. Connect Ground (GND) to Ground (GND). D. MIC_ RET and OUT_RET are for the HD audio panel only. You don’t need to connec t them for the AC’97 audio panel. E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel and adjust “Recording Volume”.

Vbus

IntA_PA_SSRX-

IntA_PA_SSRX+

IntA_PA_SSTX-

IntA_PA_SSTX+

IntA_PA_D-

IntA_PA_D+

Dummy

IntA_PB_D+

IntA_PB_D-

IntA_PB_SSTX+

IntA_PB_SSTX-

GND

IntA_PB_SSRX+

IntA_PB_SSRX-

VbusV

GND

MIC2_L

GND

PRESENCE#

MIC_RET

OUT2_R

MIC2_R

VbusVbus

IntA_PB_SSRX-

IntA_PB_SSRX+

GND

IntA_PB_SSTX-

IntA_PB_SSTX+

GND

IntA_PB_D-

IntA_PB_D+

Dummy

IntA_PA_D+

IntA_PA_D-

GND

IntA_PA_SSTX+

IntA_PA_SSTX-

GND

IntA_PA_SSRX+

IntA_PA_SSRX-

Vbus

OUT_RET

OUT2_L

J_SENSE

ere are two headers on

this motherboard. Each

USB 3.2 Gen1 header can

support two ports.

is header is for

connecting audio devices

to the front audio panel.

English

Page 30

Chassis/Water Pump Fan

FAN_SPEED_CONTROL

Connectors

(4-pin CHA_FAN1/WP)

(see p.7, No. 32)

(4-pin CHA_FAN2/WP)

(see p.7, No. 26)

(4-pin CHA_FAN3/WP)

(see p.7, No. 27)

FAN_SPEED_CONTROL

FAN_SPEED

FAN_VOLTAGE

GND

4 3 2 1

GND

FAN_VOLTAGE

FAN_SPEED

FAN_SPEED_CONTROL

is motherboard provides

ve 4-Pin water cooling

chassis fan connectors. If

you plan to connect a 3-Pin

chassis water cooler fan,

please connect it to Pin 1-3.

English

(4-pin CHA_FAN4/WP)

(see p.7, No. 17)

(4-pin CHA_FAN5/WP)

(see p.7, No. 8)

CPU Fan Connector

(4-pin CPU_FAN1)

(see p.7, No. 4)

CPU/Water Pump Fan

Connector

(4-pin CPU_FAN2/WP)

(see p.7, No. 5)

ATX Power Connector

(24-p i n ATX PWR1)

(see p.7, No. 9)

FAN_SPEED_CONTROL

FAN_SPEED

FAN_VOLTAGE

CPU_FAN_SPEED

+12V

GND

1234

FAN_VOLTAGE

CPU_FAN_SPEED

GND

FAN_SPEED_CONTROL

GND

FAN_VOLTAGE

FAN_SPEED

GND

is motherboard provides

a 4-Pin CPU fan (Quiet

Fan) connector. If you plan

to connect a 3-Pin CPU

fan, please connect it to Pin

1-3.

is motherboard provides

a 4-Pin water cooling CPU

fan connector. If you plan

to connect a 3-Pin CPU

water cooler fan, please

connect it to Pin 1-3.

is motherboard provides

a 24-pin ATX power con-

nector. To use a 20-pin

ATX power supply, please

plug it along Pin 1 and Pin

13.

Page 31

B560 Pro4

SPI_DQ3

8 5

ATX 12V Power

Connector

(8-pin ATX12V1)

(see p.7, No. 1)

Front Panel Type C USB

3.2 Gen1 Header

(20-pin USB31_TC_1)

(see p.7, No. 10)

Serial Port Header

(9-p in CO M1)

(see p.7, No. 30)

RRXD1

DDTR#1

TTXD1

DDCD#1

USB Type-C Cable

DDSR#1

CCTS#1

RRI#1

RRTS#1

GND

is motherboard provides

an 8-pin ATX 12V power

connector. To use a 4-pin

ATX power supply, please

plug it along Pin 1 and Pin

*Warning: Please make

sure that the power cable

connected is for the CPU

and not the graphics card.

Do not plug the PCIe pow-

er cable to this connector.

ere is one Front

Panel Type C USB 3.2

Gen1 Header on this

motherboard. is header

is used for connecting a

USB 3.2 Gen1 module for

additional USB 3.2 Gen1

ports.

is COM1 header

supports a serial port

module.

SPI TPM Header

(13 -pi n SPI_T PM _J1)

(see p.7, No. 19)

SPI_DQ2

+3.3V

TPM_Present

SPI_MISO

SPI_CS0

CLK

SPI_MOSI

GND

RSMRST#

RST#

TPM_PIRQ

SPI_TPM_CS#

is connector supports SPI

Trusted Platform Module (TPM)

system, which can securely

store keys, digital certicates,

passwords, and data. A TPM

system also helps enhance

network securit y, protects digital

identities, and ensures platform

integrity.

English

Page 32

RGB LED Headers

(4-p i n RGB_ LED1)

(see p.7, No. 29)

(4-pi n RGB _LED2)

(see p.7, No. 7)

12V GR B

12V

RGB headers are used to connect

RGB LED extension cables which

allow users to choose from

various LED lighting eects.

Caution: Never install the

RGB LED cable in the wrong

orientation; otherwise, the cable

may be damaged.

*Please refer to page 46 for further

instructions on this header.

English

Addressable LED Headers

(3-pin A DDR _LED1)

(see p.7, No. 28)

(3-pin A DDR _LED2)

(see p.7, No.6)

VOUT

DO_ADDR

GND

ese headers are used to connect

Addressable

LED extension cables

which allow users to choose from

various LED lighting

eects.

Caution: Never install the Ad-

dressable LED cable in the wrong

orientation; otherwise, the cable

may be damaged.

*Please refer to page 47 for

further instructions on this

header.

Page 33

2.7 Post Status Checker

Post Status Checker (PSC) diagnoses the computer when users power on the

machine. It emits a red light to indicate whether the CPU, memory, VGA or stor-

age is dysfunctional. e lights go o if the four mentioned above are functioning

normally.

B560 Pro4

English

Page 34

2.8 M.2 WiFi/BT Module and Intel® CNVi (Integrated WiFi/BT) Installation Guide

e M.2, also known as the Next Generation Form Factor (NGFF), is a small size and

versatile card edge connector that aims to replace mPCIe and mSATA. e M.2 Socket (Key

E) supports type 2230 WiFi/BT module and Intel® CNVi (Integrated WiFi/BT).

* e M.2 socket does not support SATA M.2 SSDs.

Before you install Intel® Integrated Connectivity (CNVi) module, be sure to turn o the AC power.

Installing the WiFi/BT module

Step 1

Prepare a type 2230 WiFi/BT module

or Intel® CNVi (Integrated WiFi/BT)

and the screw.

Step 2

Find the nut location to be used.

English

PCB Length: 3cm Module Type: Type2230

Page 35

B560 Pro4

Step 3

Gently insert the WiFi/BT module

or Intel® CNVi (Integrated WiFi/

BT) into the M.2 slot. Please be

aware that the module only ts in one

orientation.

Step 4

Tighten the screw with a screwdriver

to secure the module into place.

Please do not overtighten the screw as

this might damage the module.

English

Page 36

2.9 M.2_SSD (NGFF) Module Installation Guide (M2_1)

e M.2, also known as the Next Generation Form Factor (NGFF), is a small size and

versatile card edge connector that aims to replace mPCIe and mSATA. e Hyper M.2

Socket (M2_1) supports M Key type 2242/2260/2280 M.2 PCI Express module up to

Gen4x4 (64 Gb/s) (Only supported with 11th Gen Intel® CoreTM Processors).

Installing the M.2_SSD (NGFF) Module

Step 1

Prepare a M.2_SSD (NGFF) module

and the screw.

English

Step 2

Before installing a M.2 (NGFF)

SSD module, please loosen

the screws to remove the M.2

heatsink.

*Please remove the protective

lms on the bottom side of the

M.2 heatsink before you install

a M.2 SSD module.

Step 3

Depending on the PCB type and

length of your M.2_SSD (NGFF)

module, nd the corresponding nut

location to be used.

ABC

No. 1 2 3

Nut Location A B C

PCB Length 4.2cm 6cm 8cm

Module Type Typ e2242 Type 226 0 Ty pe2280

Page 37

B560 Pro4

Step 4

Prepare the M.2 stando that comes

with the package. en hand tighten

the stando into the desired nut

ABC

location on the motherboard. Align

and gently insert the M.2 (NGFF)

SSD module into the M.2 slot. Please

be aware that the M.2 (NGFF) SSD

module only ts in one orientation.

ABC

Step 5

Tighten the screw that comes with

the package with a screwdriver to

NUT1NUT2

secure the module into place.

Step 6

Tighten the screw with a screwdriver

to secure the module and M.2

heatsink into place. Please do

not overtighten the screw as this

might damage the module and M.2

heatsink.

English

Page 38

English

M.2_SSD (NGFF) Module Support List (M2_1)

Vendor Interface P/N

ADATA PCIe3 x4 ASX7000NP-128GT-C ADATA PCIe3 x4 ASX8000NP-256GM-C ADATA PCIe3 x4 ASX7000NP-256GT-C ADATA PCIe3 x4 ASX8000NP-512GM-C ADATA PCIe3 x4 ASX7000NP-512GT-C Apacer PCIe3 x4 AP240GZ280 Corsair PCIe3 x4 CSSD-F240GBMP500 Intel PCIe3 x4 SSDPEKKF256G7 Intel PCIe3 x4 SSDPEKK F512G7 Kingston PCIe3 x4 SKC1000/480G Kingston PCIe2 x4 SH2280S3/480G OCZ PCIe3 x4 RVD400 -M2280-512G (NVME) PAT R IOT PCIe3 x4 PH240GPM280SSDR NVME Plextor PCIe3 x4 PX-128M8PeG Plextor PCIe3 x4 P X-1TM8Pe G Plextor PCIe3 x4 PX-256M8PeG Plextor PCIe3 x4 PX-512 M8PeG Plextor PCIe PX-G25 6M6e Plextor PCIe PX-G512M6e Samsung PCIe3 x4 SM961 MZVPW128HEGM (NVM) Samsung PCIe3 x4 PM961 MZVLW128HEGR (NVME) Samsung PCIe3 x4 960 EVO (MZ-V6E250) (NVME) Samsung PCIe3 x4 960 EVO (MZ-V6E250BW) (NVME) Samsung PCIe3 x4 SM951 (NVME) Samsung PCIe3 x4 SM951 (MZHPV256HDGL) Samsung PCIe3 x4 SM951 (MZHPV512HDGL) Samsung PCIe3 x4 SM951 (NVME) Samsung PCIe x4 XP941-512G (MZHPU512HCGL) SanDisk PCIe SD6PP4M-12 8G SanDisk PCIe SD6PP4M-256G TEAM PCIe3 x4 TM8FP2240G0C101 TEAM PCIe3 x4 TM8FP2480GC110 WD PCIe3 x4 WDS256G1X0C-00ENX0 (NVME) WD PCIe3 x4 WDS512G1X0C-00EN X0 (NVM E)

For the latest updates of M.2_SSD (NFGG) module support list, please visit our website for

details: http://www.asrock.com

Page 39

B560 Pro4

2.10 M.2_SSD (NGFF) Module Installation Guide (M2_2)

e M.2, also known as the Next Generation Form Factor (NGFF), is a small size and

versatile card edge connector that aims to replace mPCIe and mSATA. e Ultra M.2

Socket (M2_2) supports M Key type 2242/2260/2280 M.2 PCI Express module up to Gen3

x4 (32 Gb/s).

Installing the M.2_SSD (NGFF) Module

Step 1

Prepare a M.2_SSD (NGFF) module

and the screw.

Step 2

Depending on the PCB type and

length of your M.2_SSD (NGFF)

module, nd the corresponding nut

location to be used.

ABC

No. 1 2 3

Nut Location A B C

PCB Length 4.2cm 6cm 8cm

Module Type Ty pe 2242 Ty p e 2260 Typ e22 80

English

Page 40

Step 3

Move the stando based on the

module type and length .

e stando is placed at the nut

ABC

location C by default. Skip Step 3

and 4 and go straight to Step 5 if you

are going to use the default nut.

Otherwise, release the stando by

hand.

Step 4

Peel o the yellow protective lm on

ABC

the nut to be used. Hand tighten the

stando into the desired nut location

on the motherboard.

Step 5

Gently insert the M.2 (NGFF) SSD

module into the M.2 slot. Please

be aware that the M.2 (NGFF) SSD

ABC

module only ts in one orientation.

English

ABC

Step 6

Tighten the screw with a screwdriver

to secure the module into place.

Please do not overtighten the screw

NUT1NUT2

as this might damage the module.

Page 41

B560 Pro4

M.2_SSD (NGFF) Module Support List (M2_2)

Vendor Interface P/N

For the latest updates of M.2_SSD (NFGG) module support list, please visit our website for

details: http://www.asrock.com

English

Page 42

2.11 M.2_SSD (NGFF) Module Installation Guide (M2_3)

e M.2, also known as the Next Generation Form Factor (NGFF), is a small size and

versatile card edge connector that aims to replace mPCIe and mSATA. e M.2 Socket

(M2_3) supportsM Key type 2280/22110 M.2 SATA3 6.0 Gb/s module and M.2 PCI

Express module up to Gen3 x2 (16 Gb/s).

* If M2_3 is occupied by a SATA-type M.2 device, SATA3_1 will be disabled.

Installing the M.2_SSD (NGFF) Module

Step 1

Prepare a M.2_SSD (NGFF) module

and the screw.

English

No. 1 2

Nut Location A B

PCB Length 8cm 11cm

Module Type Ty pe 2280 Ty p e 22110

Step 2

Depending on the PCB type

and length of your M.2_ SSD

(NGFF) module, nd the

corresponding nut location to

be used.

Page 43

B560 Pro4

Step 3

Move the stando based on the

module type and length.

e stando is placed at the nut

location A by default. Skip Step 3

and 4 and go straight to Step 5 if you

are going to use the default nut.

Otherwise, release the stando by

hand.

Step 4

Peel o the yellow protective lm on

the nut to be used. Hand tighten the

stando into the desired nut location

on the motherboard.

Step 5

Gently insert the M.2 (NGFF) SSD

module into the M.2 slot. Please

be aware that the M.2 (NGFF) SSD

module only ts in one orientation.

Step 6

Tighten the screw with a screwdriver

to secure the module into place.

Please do not overtighten the screw

NUT1NUT2

as this might damage the module.

English

Page 44

M.2_SSD (NGFF) Module Support List (M2_3)

Vendor Interface P/N

ADATA SATA3 AXNS330E-32GM-B ADATA SATA3 AXNS381E-128GM-B ADATA SATA3 AXNS381E -25 6G M-B ADATA SATA3 ASU800NS38-256GT-C ADATA SATA3 ASU800NS38-512GT-C Crucial SATA3 CT120M500SSD4 Crucial SATA3 CT240M500SSD4 Intel SATA3 Intel SSDSCKGW080A401/80G Kingston SATA3 SM2280S3 Plextor PCIe PX-G25 6M6e Plextor PCIe PX-G512M6e SanDisk PCIe SD 6PP4M-128G SanDisk PCIe SD6PP4M-256G

Team SATA3 TM4PS4128GMC105 Team SATA3 TM4PS4256GMC105 Team SATA3 TM8PS4128GMC105 Team SATA3 TM8PS4 25 6GMC105 Tra nscend SATA 3 TS256GMTS400 Tra nscend SATA 3 TS512GMTS600 Tra nscend SATA 3 TS512GMTS800 V-Col or SATA3 VLM100-120G-2280B-RD V-Col or SATA3 V LM100 -240G-2280RGB V-Col or SATA3 VSM100 -240G-2 28 0 V-Col or SATA3 V LM100 -240G-2280B-RD WD SATA3 WDS100T1B0B-00AS40 WD SATA3 WDS240G1G0B-00RC30

English

For the latest updates of M.2_SSD (NFGG) module support list, please visit our website for

details: http://www.asrock.com

Page 45

Chapter 3 Software and Utilities Operation

3.1 Installing Drivers

e Support CD that comes with the motherboard contains necessary drivers and

useful utilities that enhance the motherboard’s features.

Running The Support CD

To begin using the support CD, insert the CD into your CD-ROM drive. e CD

automatically displays the Main Menu if “AUTORUN” is enabled in your computer.

If the Main Menu does not appear automatically, locate and double click on the le

“ASRSETUP.EXE” in the Support CD to display the menu.

Drivers Menu

e drivers compatible to your system will be auto-detected and listed on the

support CD driver page. Please click Install All or follow the order from top to

bottom to install those required drivers. erefore, the drivers you install can work

properly.

Utilities Menu

e Utilities Menu shows the application soware that the motherboard supports.

Click on a specic item then follow the installation wizard to insta ll it.

B560 Pro4

English

Page 46

3.2 ASRock Motherboard Utility (A-Tuning)

ASRock Motherboard Utilit y (A-Tuning) is ASRock’s multi purpose soware suite

with a new interface, more new features and improved utilities.

3.2.1 Installing ASRock Motherboard Utility (A-Tuning)

ASRock Motherboard Utilit y (A-Tuning) can be downloaded from ASRock Live

Update & APP Shop. Aer the installation, you will nd the icon “ASRock Mother-

board Utility (A-Tuning)“ on your desktop. Double-click the “ASRock Motherboard

Ut il it y (A -Tu ni ng)“ icon, ASRock Motherboard Utility (A-Tuning) main menu

will pop up.

3.2.2 Using ASRock Motherboard Utility (A-Tuning)

ere are ve sections in ASRock Motherboard Utility (A-Tuning) main menu:

Operation Mode, OC Tweaker, System Info, FAN-Tastic Tuning and Settings.

Operation Mode

Choose an operation mode for your computer.

English

Page 47

OC Tw eaker

Congurations for overclocking the system.

B560 Pro4

System Info

View information about the system.

*e System Browser tab may not appear for certain models.

English

Page 48

FAN-Tastic Tuning

Congure up to ve dierent fan speeds using the graph. e fans will automatically shi

to the next speed level when the assigned temperature is met.

Settings

Congure ASRock Motherboard Utility (A-Tuning). Click to select "Auto run

at Windows Startup" if you want ASRock Motherboard Utility (A-Tuning) to be

launched when you start up the Windows operating system.

English

Page 49

3.3 ASRock Live Update & APP Shop

e ASRock Live Update & APP Shop is an online store for purchasing and

downloading soware applications for your ASRock computer. You can quick ly and

easily insta ll various apps and support utilities. With ASRock Live Update & APP

Shop, you can optimize your system and keep your motherboard up to date simply

with a few clicks.

Double-click on your desktop to access ASRock Live Update & APP Shop utility.

*You need to be connected to the Internet to download apps f rom the ASRock Live Update & APP Shop.

3.3.1 UI Overview

Category Panel

Hot News

B560 Pro4

Information Panel

Category Panel: e category panel contains several category tabs or buttons that

when selected the information panel below displays the relative information.

Information Panel: e information panel in the center displays data about the

currently selected category and allows users to perform job-related tasks.

Hot News: e hot news section displays the various latest news. Click on the image

to visit the website of the selected news and know more.

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3.3.2 Apps

When the "Apps" tab is selected, you will see all the available apps on screen for you

to download.

Installing an App

Step 1

Find the app you want to install.

e most recommended app appears on the le side of the screen. e other various

apps are shown on the right. Please scroll up and down to see more apps listed.

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You can check the price of the app and whether you have already intalled it or not.

- e red icon displays the price or "Free" if the app is free of charge.

- e green "Installed" icon means the app is installed on your computer.

Step 2

Click on the app icon to see more details about the selected app.

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Step 3

If you want to install the app, click on the red icon to start downloading.

Step 4

When installation completes, you can nd the green "Installed " icon appears on the

upper right corner.

B560 Pro4

To uninstall it, simply click on the trash can icon . *e trash icon may not appear for certain apps.

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Upgrading an App

You can only upgrade the apps you have already installed. When there is an

available new version for your app, you will nd the mark of "New Version"

appears below the installed app icon.

Step 1

Click on the app icon to see more details.

Step 2

Click on the yellow icon to start upgrading.

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3.3.3 BIOS & Drivers

Installing BIOS or Drivers

When the "BIOS & Drivers" tab is selected, you will see a list of recommended or

critical updates for the BIOS or drivers. Please update them all soon.

B560 Pro4

Step 1

Please check the item information before update. Click on to see more details.

Step 2

Click to select one or more items you want to update.

Step 3

Click Update to start the update process.

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3.3.4 Setting

In the "Setting" page, you can change the language, select the server location, and

determine if you want to automatically run the ASRock Live Update & APP Shop

on Windows startup.

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3.4 Nahimic Audio

Nahimic audio soware provides an incredible high denition sound technology which

boosts the audio and voice performance of your system. Nahimic Audio interface is

composed of four tabs: Audio, Microphone, Sound Tracker and Settings.

ere are four functions in Nahimic audio :

B560 Pro4

No. Function Description

From this tab, you can mute the current audio device, choose

Microphone

Audio

Sound

Tracker

Settings

between four factory audio proles, turn all audio eects on/o, restores the current prole to its default settings and access Surround Sound and various features.

From this tab, you can mute the current mic device, choose between two factory mic proles, turn/o all microphone eects, restore the current prole to its default settings, and access Static Noise Suppression and various features.

e Sound Tracker provides a visual indication localizing the sources of the sounds while in a game. ese are represented by dynamic segments pointing the direction of the sounds: the more opaque they are, the stronger the sounds are.

From this tab, you can access all settings and information of the soware.

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3.5 ASRock Polychrome SYNC

12V GRB

ASRock Polychrome SYNC is a lighting control utility specically designed for unique indi-

viduals with sophisticated tastes to build their own stylish colorful lighting system. Simply by

connecting the LED strip, you can customize various lighting schemes and patterns, including

Static, Breathing, Strobe, Cycling, Music, Wave and more.

Connecting the LED Strip

Connect your RGB LED strips to the

motherboard.

RGB LED Headers (RGB_LED1 / RGB_LED2)

RGB_LED2

RGB_LED1

on the

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1. Never install the RGB LED cable in the wrong orientation; otherwise, the cabl e may be damaged.

2. Before installing or removing your RGB LED cable, please power o your system and unplug the powe r cord from the powe r supply. Failure to do so may cause damages to motherboard components.

1. Plea se note that the RGB LED strips do not come with the package.

2. e RGB LED header suppor ts standard 5050 RGB LED str ip (12V/G/R/B), with a maximum power rating of 3A (12V) and length within 2 meters.

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Connecting the Addressable RGB LED Strip

Connect your

ADDR _LED2)

Addressable RGB LED

on the motherboard.

strips to the

Addressable LED Headers (ADDR_LED1 /

ADDR_LED2

ADDR_LED1

GND

DO_ADDR

VOUT

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1. Never install the RGB LED cable in the wrong orientation; otherwise, the cabl e may be damaged.

2. Before installing or removing your RGB LED cable, please power o your system and unplug the power cord from the power supply. Failure to do so may cause damages to motherboard components.

1. Plea se note that the RGB LED strips do not come with the package.

2. e RGB LED header suppor ts WS2812B addressable RGB LED strip (5V/Data/

GND), with a ma ximum power rating of 3A (5V) and length w ithin 2 meters.

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ASRock Polychrome SYNC Utility

Now you can adjust the RGB LED color through the ASRock Polychrome SYNC Utility.

Download this utility from the ASRock Live Update & APP Shop and start coloring your

PC style your way!

Drag the tab to customize your

preference.

Toggle on/o the

RGB LED switch

Sync RGB LED eects

for all LED regions of

the motherboard

Select a RGB LED light eect

from the drop-down menu.

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Chapter 4 UEFI SETUP UTILITY

4.1 Introduction

is section explains how to use the UEFI SETUP UTILITY to congure your

system. You may run the UEFI SETUP UTILITY by pressing <F2> or <Del> right

aer you power on the computer, other wise, the Power-On-Self-Test (POST) will

continue with its test routines. If you wish to enter the UEFI SETUP UTILITY aer

POST, restart the system by pressing <Ctl> + <Alt> + <Delete>, or by pressing the

reset button on the system chassis. You may also restart by turning the system o

and then back on.

Becau se the UEFI soware is constantly being upd ated, the following UEFI setup screens and descriptions are for reference purpose only, and they may not ex actly match what you see on your screen .

B560 Pro4

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4.2 EZ Mode

e EZ Mode screen appears when you enter the BIOS setup program by default. EZ

mode is a dashboard which contains multiple readings of the system’s current status.

You can check the most crucial information of your system, such as CPU speed,

DRAM frequency, SATA information, fan speed, etc.

Press <F6> or click the "Advanced Mode" button at the upper right corner of the

screen to switch to "Advanced Mode" for more options.

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No. Function

Help

Load UEFI Defaults

Save Changes and Exit

Discard Changes

Change Language

Switch to Advanced Mode

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4.3 Advanced Mode

e Advanced Mode provides more options to congure the BIOS settings. Refer to

the following sections for the detailed congurations.

To access the EZ Mode, press <F6> or click the "EZ Mode" button at the upper right

corner of the screen.

4.3.1 UEFI Menu Bar

e top of the screen has a menu bar with the following selections:

B560 Pro4

Main

OC Tweaker

Advanced

Tool

H/W Monitor

Security

Boot

Exit

For setting system time/date information

For overclocking congurations

For advanced system congurations

Useful tools

Displays current hardware status

For security settings

For conguring boot settings and boot priority

Exit the current screen or the UEFI Setup Utility

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4.3.2 Navigation Keys

Use < > key or < > key to choose among the selections on the menu bar, and

use < > key or < > key to move the cursor up or down to select items, then

press <Enter> to get into the sub screen. You can also use the mouse to click your

required item.

Please check the following table for the descriptions of each navigation key.

Navigation Key(s) Description

+ / -

<Tab>

<PGUP>

<PGDN>

<HOME>

<END>

<F1>

<F5>

<F7>

<F9>

<F10>

<F12>

<ESC>

To change option for the selected items

Switch to next function

Go to the previous page

Go to the next page

Go to the top of the screen

Go to the bottom of the screen

To display the General Help Screen

Add / Remove Favorite

Discard changes and exit the SETUP UTILITY

Load optimal default values for all the settings

Save changes and exit the SETUP UTILITY

Print screen

Jump to the Exit Screen or exit the current screen

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4.4 Main Screen

When you enter the UEFI SETUP UTILITY, the Main screen will appear and

display the system overview.

e availability and location of BIOS settings can be dierent for dierent models and BIOS versions .

B560 Pro4

My Favorite

Display your collection of BIOS items. Press F5 to add/remove your favorite items.

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4.5 OC Tweaker Screen

In the OC Tweaker screen, you can set up overclocking features.

Becau se the UEFI soware is constantly being upd ated, the following UEFI setup screens and de scriptions are for reference purpose only, and they may not exactly match what you see on your scre en.

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CPU Conguration

CPU Ratio

e CPU speed is determined by the CPU Ratio multiplied with the BCLK.

Increasing the CPU Ratio will increase the internal CPU clock speed without

aecting the clock speed of other components.

AVX2 Ratio Oset

AVX2 Ratio Oset species a negative oset from the CPU Ratio for AVX

workloads. AVX is a more stressful workload that lower the AVX ratio to ensure

maximum possible ratio for SSE workloads.

AVX-512 Ratio Oset

AVX-512 Ratio Oset species a negative oset from the CPU Ratio for AVX-512

workloads. AVX-512 is a more stressful workload that lower the AVX ratio to ensure

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maximum possible ratio for SSE workloads.

CPU Cache Ratio

e CPU Interna l Bus Speed Ratio. e maximum should be the same as the CPU

Ratio.

BCLK Spread Spectrum Mode

Enable Spread Spectrum to reduce electromagnetic interference for passing EMI

tests. Disable to achieve higher clock speeds when overclocking.

BCLK Aware Adaptive Voltage

BCLK Aware Adaptive Voltage enable/disable. When enabled, pcode will be aware

of the BCLK frequency when calculating the CPU V/F curves. is is ideal for

BCLK OC to avoid high voltage overrides.

Boot Performance Mode

Select the performance state that the BIOS will set before OS hando.

FCLK Frequency

Congure the FCLK Frequency.

B560 Pro4

Ring to Core Ratio Oset

Disable Ring to Core Ratio Oset so the ring and core can run at the same fre-

quency.

Intel SpeedStep Technology

Intel SpeedStep technology allows processors to switch between multiple frequen-

cies and voltage points for better power saving and heat dissipation.

Intel Turbo Boost Technology

Intel Turbo Boost Technology enables the processor to run above its base operating

frequency when the operating system requests the highest performance state.

Intel Speed Shift Technology

Enable/Disable Intel Speed Shi Technology support. Enabling will expose the

CPPC v2 interface to allow for hardware controlled P-sates.

Intel Turbo Boost Max Technology 3.0

Intel Turbo Boost Technology enables the processor to run above its base operating

frequency when the operating system requests the highest performance state.

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Intel Thermal Velocity Boost Voltage Optimizations

is service controls thermal based voltage optimizations for processors that

implment the Intel ermal Velocity Boost (TVB) feature.

Dual Tau Boost

Enable Dual Tau Boost feature. is is only applicable for CMLS 35W/65W/125W

skus. is item is only supported with processors with Cong TDP support.

Long Duration Power Limit

Congure Package Power Limit 1 in watts. When the limit is exceeded, the CPU

ratio will be lowered aer a period of time. A lower limit can protect the CPU and

save power, while a higher limit may improve performance.

Long Duration Maintained

Congure the period of time until the CPU ratio is lowered when the Long

Duration Power Limit is exceeded.

Short Duration Power Limit

Congure Package Power Limit 2 in watts. When the limit is exceeded, the CPU

ratio will be lowered immediately. A lower limit can protect the CPU and save

power, while a higher limit may improve performance.

CPU Core Current Limit

Congure the current limit of the CPU core. A lower limit can protect the CPU and

save power, while a higher limit may improve performance.

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System Agent Current Limit

Congure the current limit of the system agent. A lower limit can protect the CPU

and save power, while a higher limit may improve performance.

GT Current Limit

Congure the current limit of the GT slice. A lower limit can protect the CPU and

save power, while a higher limit may improve performance.

DRAM Conguration

Memory Information

Allows users to browse the serial presence detect (SPD) and Intel extreme memory prole

(XMP) for DDR4 modules.

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DRAM Timing Conguration

DRAM Frequency

If [Auto] is selected, the motherboard will detect the memory module(s) inserted

and assign the appropriate frequency automatically.

Primary Timing

CAS# Latency (tCL)

e time between sending a column address to the memory and the beginning of the data

in response.

RAS# to CAS# Delay and Row Precharge (tRCDtRP)

RAS# to CAS# Delay : e number of clock cycles required between the opening of a row

of memory and accessing columns within it.

Row Precharge: e number of clock cycles required between the issuing of the precharge

command and opening the next row.

RAS# Active Time (tRAS)

e number of clock cycles required between a bank active command and issuing the

precharge command.

B560 Pro4

Command Rate (CR)

e delay between when a memor y chip is selected and when the rst active command can

be issued.

Secondary Timing

Write Recovery Time (tWR)

e amount of delay that must elapse aer the completion of a valid write operation,

before an active bank can be precharged.

Refresh Cycle Time (tRFC)

e number of clocks from a Refresh command until the rst Activate command to

the same rank.

RAS to RAS Delay (tRRD_L)

e number of clocks between two rows activated in dierent banks of the same

rank.

RAS to RAS Delay (tRRD_S)

e number of clocks between two rows activated in dierent banks of the same

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rank.

Write to Read Delay (tWTR_L)

e number of clocks between the last valid write operation and the next read command to

the same interna l bank.

Write to Read Delay (tWTR_S)

e number of clocks between the last valid write operation and the next read command to

the same interna l bank.

Read to Precharge (tRTP)

e number of clocks that are inserted between a read command to a row pre-

charge command to the same rank.

Four Activate Window (tFAW)

e time window in which four activates are allowed the same rank.

CAS Write Latency (tCWL)

Congure CAS Write Latency.

Third Timing

tREFI

Congure refresh cycles at an average periodic interval.

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tCKE

Congure the period of time the DDR4 initiates a minimum of one refresh

command internally once it enters Self-Refresh mode.

Turn Around Timing

tRDRD_sg

Congure between module read to read delay.

tRDRD_dg

Congure between module read to read delay.

tRDRD_dr

Congure between module read to read delay.

tRDRD_dd

Congure between module read to read delay.

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tRDWR_sg

Congure between module read to write delay.

tRDWR_dg

Congure between module read to write delay.

tRDWR_dr

Congure between module read to write delay.

tRDWR_dd

Congure between module read to write delay.

tWRRD_sg

Congure between module write to read delay.

tWRRD_dg

Congure between module write to read delay.

tWRRD_dr

Congure between module write to read delay.

B560 Pro4

tWRRD_dd

Congure between module write to read delay.

tWRWR_sg

Congure between module write to write delay.

tWRWR_dg

Congure between module write to write delay.

tWRWR_dr

Congure between module write to write delay.

tWRWR_dd

Congure between module write to write delay.

Round Trip Timing

Round Trip Timing Optimization

Auto is enabled in general case.

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