Asrock B560M Pro4/ac User Manual

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Version 1.0
Published December 2020
Copyright©2020 ASRock INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc.
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for informational use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warranties or conditions of merchantability or tness for a particular purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of prots, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium batter y adopted on this motherboard contains Perchlorate, a toxic substance controlled in Perchlorate Best Management Practices (BMP) regulations passed by the California Legislature. When you discard the Lithium battery in California, USA, please follow the related regulations in advance. “Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/ perchlorate”
ASRock Website: http://www.asrock.com
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AUSTRALIA ONLY
Our goods come with guarantees that cannot be excluded under the Australian Consumer Law. You are entitled to a replacement or refund for a major failure and compensation for any other reasonably foreseeable loss or damage caused by our goods. You are also entitled to have the goods repaired or replaced if the goods fail to be of acceptable quality and the failure does not amount to a major failure. If you require assistance please call ASRock Tel
: +886-2-28965588 ext.123 (Standard International call charges apply)
e terms HDMI® and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United States and other countries.
INTEL END USER SOFTWARE LICENSE AGREEMENT
IMPORTANT - READ BEFORE COPYING, INSTALLING OR USING.
LICENSE. Licensee has a license under Intel ’s copyrights to reproduce Intel’s Soware only in its unmodied and binary form, (with the accompanying documentation, the “Soware”) for Licensee’s personal use only, and not commercial use, in connection with Intel-based products for which the Soware has been provided, subject to the following conditions:
(a) Licensee may not disclose, distribute or transfer any part of the So ware, and You agree to prevent unauthorized copying of the Soware.
(b) Licensee may not reverse engineer, decompile, or disassemble the Soware.
(c) Licensee may not sublicense the Soware.
(d) e Soware may contain the soware and other intellectual property of third party suppliers, some of which may be identied in, and licensed in accordance with, an enclosed license.txt le or other text or le.
(e) Intel has no obligation to provide any support, technical assistance or updates for the Soware.
OWNERSHIP OF SOFTWARE AND COPYRIGHTS. Title to all copies of the Soware remains with Intel or its licensors or suppliers. e Soware is copyrighted and protected by the laws of the United States and other countries, and international treaty provisions. Licensee may not remove any copyright notices from the Soware. Except as otherwise expressly provided above, Intel grants no express or implied right under Intel patents, copyrights, trademarks, or other intellectual property rights. Transfer of the license termi­nates Licensee’s right to use the Soware.
DISCLAIMER OF WARRANTY. e Soware is provided “AS IS” without warranty of any kind, EITHER EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION, WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PUR­POSE.
LIMITATION OF LIABILITY. NEITHER INTEL NOR ITS LICENSORS OR SUPPLIERS WILL BE LIABLE FOR ANY LOSS OF PROFITS, LOSS OF USE, INTERRUPTION OF BUSINESS, OR INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAG-
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ES OF ANY KIND WHETHER UNDER THIS AGREEMENT OR OTHERWISE, EVEN IF INTEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
LICENSE TO USE COMMENTS AND SUGGESTIONS. is Agreement does NOT obligate Licensee to provide Intel with comments or suggestions regarding the Soware. However, if Licensee provides Intel with comments or suggestions for the modication, correction, improvement or enhancement of (a) the Soware or (b) Intel products or processes that work with the Soware, Licensee grants to Intel a non-exclusive, worldwide, perpetual, irrevocable, transferable, royalty-free license, with the right to sublicense, under Licensee’s intellectual property rights, to incorporate or otherwise utilize those comments and suggestions.
TERMINATION OF THIS LICENSE. Intel or the sublicensor may terminate this license at any time if Licensee is in breach of any of its terms or conditions. Upon termination, Licensee will immediately destroy or return to Intel all copies of the Soware.
THIRD PARTY BENEFICIARY. Intel is an intended beneciary of the End User License Agreement and has the right to enforce all of its terms.
U.S. GOVERNMENT RESTRICTED RIGHTS. e Soware is a commercial item (as dened in 48 C.F.R. 2.101) consisting of commercial computer so ware and commercial computer soware documentation (as those terms are used in 48 C.F.R. 12.212), consistent with 48 C.F.R. 12.212 and 48 C.F.R 227.7202-1 through 227.7202-4. You will not provide the Soware to the U.S. Government. Contractor or Manufacturer is Intel Corporation, 2200 Mission College Blvd., Santa Clara, CA 95054.
EXPORT LAWS. Licensee agrees that neither Licensee nor Licensee’s subsidiaries will export/re-export the Soware, directly or indirectly, to any country for which the U.S. Department of Commerce or any other agency or department of the U.S. Government or the foreign government from where it is shipping requires an export license, or other governmental approval, without rst obtaining any such required license or approval. In the event the Soware is exported from the U.S.A. or re-exported from a foreign destina­tion by Licensee, Licensee will ensure that the distribution and export/re-export or import of the Soware complies with all laws, regulations, orders, or other restrictions of the U.S. Export Administration Regulations and the appropriate foreign government.
APPLICABLE LAWS. is Agreement and any dispute arising out of or relating to it will be governed by the laws of the U.S.A. and Delaware, without regard to conict of laws principles. e Parties to this Agreement exclude the application of the United Nations Convention on Contracts for the International Sale of Goods (1980). e state and federal courts sitting in Delaware, U.S.A. will have exclusive jurisdiction over any dispute arising out of or relating to this Agreement. e Parties consent to personal jurisdiction and venue in those courts. A Party that obtains a judgment against the other Party in the courts iden­tied in this section may enforce that judgment in any court that has jurisdiction over the Parties.
Licensee’s specic rights may vary from country to country.
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CE Warning
is device complies with directive 2014/53/EU issued by the Commision of the European Community.
is equipment complies with EU radiation exposure limits set forth for an uncontrolled environment. is equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
Operations in the 5.15-5.35GHz band are restricted to indoor usage only.
Radio transmit power per transceiver type
Function Frequency Maximum Output Power (EIRP)
2400-2483.5 MHz 18.5 + / -1.5 dbm
5150-5250 MHz 21.5 + / -1.5 dbm
WiFi
Bluetooth 2400-2483.5 MHz 8.5 + / -1.5 dbm
5250-5350 MHz
5470-5725 MHz
18.5 + / -1.5 dbm (no TPC)
21.5 + / -1.5 dbm (TPC)
25.5 + / -1.5 dbm (no TPC)
28.5 + / -1.5 dbm (TPC)
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Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 7
1.4 I/O Panel 9
1.5 WiFi-802.11ac Module and ASRock WiFi 2.4/5 GHz Antennas 10
Chapter 2 Installation 12
2.1 Installing the CPU 13
2.2 Installing the CPU Fan and Heatsink 16
2.3 Installing Memory Modules (DIMM) 17
2.4 Expansion Slots (PCI Express Slots) 19
2.5 Jumpers Setup 21
2.6 Onboard Headers and Connectors 22
2.7 CrossFireXTM and Quad CrossFireXTM Operation Guide 27
2.7.1 Installing Two CrossFireXTM-Ready Graphics Cards 27
2.7.2 Driver Installation and Setup 29
2.8 M.2_SSD (NGFF) Module Installation Guide (M2_1) 30
2.9 M.2_SSD (NGFF) Module Installation Guide (M2_2) 33
Chapter 3 Software and Utilities Operation 36
3.1 Installing Drivers 36
3.2 ASRock Motherboard Utility (A-Tuning) 37
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3.2.1 Installing ASRock Motherboard Utility (A-Tuning) 37
3.2.2 Using ASRock Motherboard Utility (A-Tuning) 37
3.3 ASRock Live Update & APP Shop 40
3.3.1 UI Overview 40
3.3.2 Apps 41
3.3.3 BIOS & Drivers 44
3.3.4 Setting 45
3.4 Nahimic Audio 46
3.5 ASRock Polychrome SYNC 47
Chapter 4 UEFI SETUP UTILITY 50
4.1 Introduction 50
4.2 EZ Mode 51
4.3 Advanced Mode 52
4.3.1 UEFI Menu Bar 52
4.3.2 Navigation Keys 53
4.4 Main Screen 54
4.5 OC Tweaker Screen 55
4.6 Advanced Screen 67
4.6.1 CPU Conguration 68
4.6.2 Chipset Conguration 70
4.6.3 Storage Conguration 73
4.6.4 Intel® Thunderbolt 74
4.6.5 Super IO Conguration 75
4.6.6 ACPI Conguration 76
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4.6.7 USB Conguration 77
4.6.8 Trusted Computing 78
4.7 Tools 79
4.8 Hardware Health Event Monitoring Screen 81
4.9 Security Screen 84
4.10 Boot Screen 85
4.11 Exit Screen 88
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Chapter 1 Introduction
ank you for purchasing ASRock B560M Pro4/ac motherboard, a reliable
motherboard produced under ASRock ’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock ’s
commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
Becau se the motherboard specication s and the BIOS soware might be upd ated, the content of this documentation will be subject to change without notice. In case any modications of this documentation occur, the updated version w ill be available on ASRock’s website without further notice. If you require technical support related to this motherboard, plea se visit our webs ite for specic information about the model you are using. You may nd the latest VGA cards and CPU support li st on ASRock’s website a s well. ASRock website http://www.asrock.com.
1.1 Package Contents
ASRock B560M Pro4/ac Motherboard (Micro ATX Form Factor)
•
ASRock B560M Pro4/ac Quick Installation Guide
•
ASRock B560M Pro4/ac Support CD
•
2 x Serial ATA (SATA) Data Cables (Optional)
•
2 x ASRock WiFi 2.4/5 GHz Antennas (Optional)
•
2 x Screws for M.2 Sockets (Optiona l)
•
1 x Stando for M.2 Socket (Optiona l)
•
1 x I/O Panel Shield
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B560M Pro4/ac
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1.2 Specications
Platform
CPU
Chipset
Memory
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* 11th Gen Intel® CoreTM (i9/i7/i5) support DDR4 up to 2933;
CoreTM (i3), Pentium® and Celeron® support DDR4 up to 2666.
* 10th Gen Intel® CoreTM (i9/i7) support DDR4 up to 2933;
CoreTM (i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
•
•
•
Micro ATX Form Factor
Solid Capacitor design
Suppor ts 10th Gen Intel® CoreTM Processors and 11th Gen
Intel® CoreTM Processors (LGA1200)
Digi Power design
8 Power Phase design
Supports Intel® Turbo Boost Max 3.0 Technology
Intel® B560
Dual Channel DDR4 Memory Technology
4 x DDR4 DIMM Slots
11th Gen Intel® CoreTM Processors support DDR4 non-ECC,
un-buered memory up to 4800+(OC)*
10th Gen Intel® CoreTM Processors support DDR4 non-ECC,
un-buered memory up to 4600+(OC)*
Supports ECC UDIMM memory modules (operate in non-
ECC mo de)
Max. capacity of system memor y: 128GB
Supports Intel® Extreme Memory Prole (XMP) 2.0
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Expansion Slot
11th Gen Intel® CoreTM Processors
2 x PCI Express x16 Slots (PCIE1/PCIE3: single at Gen4x16
•
(PCIE1); dual at Gen4x16 (PCIE1) / Gen3x4 (PCIE3))
10th Gen Intel® CoreTM Processors
2 x PCI Express x16 Slots (PCIE1/PCIE3: single at Gen3x16
•
(PCIE1); dual at Gen3x16 (PCIE1) / Gen3x4 (PCIE3))
* Supports NVMe SSD as boot disks
1 x PCI Express 3.0 x1 Slot
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Supports AMD Quad CrossFireXTM and CrossFireXTM
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1 x M.2 Socket (Key E), supports type 2230 WiFi/BT module
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and Intel® CNVi (Integrated WiFi/BT)
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Graphics
Intel® UHD Graphics Built-in Visuals and the VGA outputs
•
can be supported only with processors which are GPU
integrated.
11th Gen Intel® CoreTM Processors support Intel® Xe Graphics
•
Architecture (Gen 12). 10th Gen Intel® CoreTM Processors
support Gen 9 Graphics
Graphics, Media & Compute: Microso Direct X 12, OpenGL
•
4.5, Intel® Built In Visuals, Intel® Quick Sync Video, Hybrid /
Switchable Graphics, OpenCL 2.1
Display & Content Security: Rec. 2020 (Wide Color Gamut),
•
Microso PlayReady 3.0, UHD/HDR Blu-ray Disc
Supports HDMI 2.0 with max. resolution up to 4K x 2K
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(4096x2160) @ 60Hz
Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and
•
HBR (High Bit Rate Audio) with HDMI 2.0 Port (Compliant
HDMI monitor is required)
Supports HDCP 2.3 with HDMI 2.0 Port
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Supports 4K Ultra HD (UHD) playback with HDMI 2.0 Port
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* 11th Gen Intel® CoreTM Processors support HDMI 2.0. 10th Gen
Intel® CoreTM Processors support HDMI 1.4.
B560M Pro4/ac
Audio
LAN
Wireless LAN
7.1 CH HD Audio (Realtek ALC897 Audio Codec)
•
Supports Surge Protection
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Nahimic Audio
•
Gigabit LAN 10/100/100 0 Mb/s
•
Giga PHY Intel® I219V
•
Supports Wake-On-LAN
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Supports Lightning/ESD Protection
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Supports Energy Ecient Ethernet 802.3az
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Supports PXE
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Intel® 802.11ac WiFi Module
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Supports IEEE 802.11a/b/g/n/ac
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Supports Dual-Band (2.4/5 GHz)
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Supports high speed wireless connections up to 433Mbps
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Supports Bluetooth 5.1 + High speed class II
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Rear Panel I/O
Storage
Connector
2 x Antenna Ports
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1 x PS/2 Mouse/Keyboard Port
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1 x HDMI Port
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4 x USB 3.2 Gen1 Ports (Supports ESD Protection)
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2 x USB 2.0 Ports (Supports ESD Protection)
•
1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
•
LED)
HD Audio Jacks: Line in / Front Speaker / Microphone
•
6 x SATA3 6.0 Gb/s Connectors, support Intel Rapid Storage
•
Technology 18, NCQ, AHCI and Hot Plug*
* If M2_2 is occupied by a SATA-type M.2 device, SATA3_1
will be disabled.
1 x Hyper M.2 Socket (M2_1), supports M Key type
•
2242/2260/2280 M.2 PCI Express module up to Gen4x4
(64 Gb/s) (Only supported with 11th Gen Intel® Core™ Proces-
sors) **
1 x Ultra M.2 Socket (M2_2), supports M Key type 2280 M.2
•
SATA3 6.0 Gb/s module and M.2 PCI Express module up to
Gen3 x4 (32 Gb/s)**
** Supports NVMe SSD as boot disks
** Supports ASRock U.2 Kit
1 x SPI TPM Header
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1 x Chassis Intrusion and Speaker Header
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2 x RGB LED Headers
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* Support in total up to 12V/3A, 36W LED Strip
2 x Addressable LED Headers
•
* Support in total up to 5V/3A, 15W LED Strip
1 x CPU Fan Connector (4-pin)
•
* e CPU Fan Connector supports the CPU fan of maximum
1A (12W) fan power.
1 x CPU/Water Pump Fan Connector (4-pin) (Smart Fan
•
Speed Control)
* e CPU/Water Pump Fan supports the water cooler fan of
maximum 2A (24W) fan power.
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BIOS Feature
3 x Chassis/Water Pump Fan Connectors (4-pin) (Smart Fan
•
Speed Control)
* e Chassis/Water Pump Fan supports the water cooler fan of
maximum 2A (24W) fan power.
* CPU_FAN2/WP, CHA_FAN1/WP, CHA_FAN2/WP and
CHA_FAN3/WP can auto detect if 3-pin or 4-pin fan is in use.
1 x 24 pin ATX Power Connector
•
1 x 8 pin 12V Power Connector (Hi-Density Power
•
Connec tor)
1 x Front Panel Audio Connector
•
1 x underbolt AIC Connector (5-pin) (Supports ASRock
•
underbolt 4 AIC Card)
2 x USB 2.0 Headers (Support 4 USB 2.0 ports) (Supports
•
ESD Protection)
1 x USB 3.2 Gen1 Header (Supports 2 USB 3.2 Gen1 ports)
•
(Supports ESD Protection)
1 x Front Panel Type C USB 3.2 Gen1 Header (Supports ESD
•
Protection)
AMI UEFI Legal BIOS with multilingual GUI support
•
ACPI 6.0 Compliant wake up events
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SMBIOS 2.7 Support
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CPU Core/Cache, GT, DRAM, VPPM, VCCIN AUX ,
•
VCCSA ,VCCIO Multi-adjustment
B560M Pro4/ac
Hardware Monitor
Fan Tachometer: CPU, CPU/Water Pump, Chassis/Water
•
Pump Fans
Quiet Fan (Auto adjust chassis fan speed by CPU tempera-
•
ture): CPU, CPU/Water Pump, Chassis/Water Pump Fans
Fan Multi-Speed Control: CPU, CPU/Water Pump, Chassis/
•
Water Pump Fans
CASE OPEN detection
•
Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore, DRAM,
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VPPM, VCCIN AUX, VCCSA, VCCIO, CPU PLL Voltage
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Microso® Windows® 10 64-bit
OS
Certica­tions
* For detailed product infor mation, please vis it our website: http://www.asrock .com
Please realize that there is a certain risk involved with overcl ocking, including adjusting the setting in th e BIOS, applying Untie d Overclocking Technology, or using third-party overclocking tools . Overclocking may aect your system’s stability, or even cause damage to the components and devices of your system. It should be done at your own risk and expense. We are not responsible for possible damage caused by overclocking.
•
FCC, CE
•
ErP/EuP Ready (ErP/EuP ready power supply is required)
•
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1.3 Motherboard Layout
Intel
B560
ATXP WR1
HDLED RESET
PLED PWRBTN
PANEL1
1
1
1
RoHS
2
CPU_FAN1
3
1
PCIE1
1
12
DDR4 _A2 (64 b it, 288 -pin mo dule)
DDR4 _A1 (64 b it, 288 -pin mo dule)
DDR4 _B2 (64 b it, 288 -pin mo dule)
DDR4 _B1 (64 b it, 288 -pin mo dule)
6
ATX12V1
USB3_5_ 6
11
CLRMOS1
1
1
HD_AUDIO1
Top: RJ-45
CHA_FAN1/WP
PCIE3
8
9
4
USB5_6
1
24
27
PCIE2
29
1
USB 3.2 Gen1 T: USB3_4 B: USB3_3
M2_W IFI
Top:
LINE I N
Cent er:
FRON T
Bott om:
MIC IN
USB2. 0
T: USB1
B: USB 2
PS2
Keybo ard
/Mous e
RGB_LED1
1
ADDR_LED1
7
1
SPI_TPM_J1
T B1
1
ADDR_LED2
1
RGB_LED2
1
CHA_FAN3/WP
23
26
USB3_4
CPU_FAN2/WP
13
14
SATA3_1
M2_2
USB 3.2 Gen1 T:
USB3_2
B:
USB3_1
15
16
20
19
18
28
M2_1
CMOS
Battery
5
SATA3_2
SATA3_3
SATA3_4
SATA3_5
F_USB 3_T C_1
10
SATA3_0
17
BIOS ROM
25
CHA_FAN2/WP
22
SPK_CI1
1
21
HDMI 1
LAN
AUDIO CODEC
WiFi-802.11ac
Module
PSC
DRAM
CPU VGA
BOOT
B560M Pro4/ac
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Page 16
No. Description
1 ATX 12V Power Connector (ATX12V1)
2 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
3 2 x 288-pin DDR4 DIMM Slots (DDR4_A2, DDR4_B2)
4 CPU/Water Pump Fan Connector (CPU_FAN2/WP)
5 CPU Fan Connector (CPU_FAN1)
6 RGB LED Header (RGB_LED1)
7 Addressable LED Header (ADDR_LED1)
8 ATX Power Connector (ATXPWR1)
9 USB 3.2 Gen1 Header (USB3_5_6)
10 Front Panel Type C USB 3.2 Gen1 Header (F_USB3_TC_1)
11 SATA3 Connector (SATA3_2)(Upper)
12 SATA3 Connector (SATA3_3)(Lower)
13 SATA3 Connector (SATA3_5)(Lower)
14 SATA3 C onnector (SATA 3_ 4)(Upper)
15 System Panel Header (PANEL1)
16 SATA3 Connector (SATA3_1)
17 SATA3 Connector (SATA3_0)
18 SPI TPM Header (SPI_TPM_J1)
19 USB 2.0 Header (USB5_6)
20 USB 2.0 Header (USB3_4)
21 Chassis Intrusion and Speaker Header (SPK_CI1)
22 Chassis/Water Pump Fan Connector (CHA _FAN2/WP)
23 Chassis/Water Pump Fan Connector (CHA _FAN3/WP)
24 underbolt AIC Connector (TB1)
25 Clear CMOS Jumper (CLRMOS1)
26 RGB LED Header (RGB_LED2)
27 Addressable LED Header (ADDR_LED2)
28 Front Panel Audio Header (HD_AUDIO1)
29 Chassis/Water Pump Fan Connector (CHA_FAN1/WP)
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1.4 I/O Panel
1
B560M Pro4/ac
3
42
10 568
9
7
No. Description No. Description
1 USB 2.0 Ports (USB12) 6 USB 3.2 Gen1 Ports (USB3_3_4)
2 LAN RJ-45 Port* 7 USB 3.2 Gen1 Ports (USB3_1_2)
3 Line In (Light Blue)** 8 Antenna Ports
4 Front Speaker (Lime)** 9 HDMI Port
5 Microphone (Pink)** 10 PS/2 Mouse/Keyboard Port
* ere are two LEDs on the LAN por t. Please refe r to the table belo w for the LA N port LED indications .
ACT/LINK LED
SPEED LED
LAN Por t
Activity / Link LED Speed LED
Status Description Status Description
O No Link O 10Mbps connection Blinking Data Activity Orange 100Mbps connection On Link Green 1Gbps connection
** Function of the Audio Ports in 7.1-channel Conguration:
Port Function
Light Blue (Rear panel) Rear Speaker Out Lime (Rear panel) Front Speaker Out Pink (Rear panel) Central /Subwoofer Speaker Out Lime (Front panel) Side Speaker Out
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1.5 WiFi-802.11ac Module and ASRock WiFi 2.4/5 GHz Antennas
WiFi-802.11ac + BT Module
is motherboard comes with an exclusive WiFi 802.11 a/b/g/n/ac + BT v5.1 module
that oers support for WiFi 802.11 a/b/g/n/ac connectivity standards and Bluetooth
v5.1. WiFi + BT module is an easy-to-use wireless loca l area network (WLAN) adapter
to support WiFi + BT. Bluetooth v5.1 standard features Smart Ready technology that
adds a whole new class of functionality into the mobile devices. BT 5.1 also includes
Low Energy Technology and ensures extraordinary low power consumption for PCs.
* e transmission speed may vary according to the environment.
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WiFi Antennas Installation Guide
B560M Pro4/ac
Step 1
Prepare the WiFi 2.4/5 GHz Antennas that come
with the package.
Step 2
Connect the two WiFi 2.4/5 GHz Antennas to
the antenna connectors. Turn the antenna clock-
wise until it is securely connected.
Step 3
Set the WiFi 2.4/5 GHz Antenna as shown in the
illustration.
*You may need to adjust the direction of
the antenna for a stronger signal.
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Chapter 2 Installation
is is a Micro ATX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
Make sure to unplug the power cord before installing or removing the motherboard
•
components. Failure to do so may cause physical injuries and damages to motherboard
components.
In order to avoid damage from static electricity to the motherboard’s components,
•
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
Hold components by the edges and do not touch the ICs.
•
Whenever you uninstall any components, place them on a grounded anti-static pad or
•
in the bag that comes with the components.
When placing screws to secure the motherboard to the chassis, please do not over-
•
tighten the screws! Doing so may damage the motherboard.
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Page 21
2.1 Installing the CPU
1
1. Before you insert the 1200-Pin CPU into the socket, please check if the P nP cap is on the socket, if the CPU surface is unclean, or if the re are any bent pins in the socket. Do not force to in sert the CPU into the socket if above situation is found. Otherwise, the CPU will be seriously damaged.
2. Unplug all power c ables before installing the CPU.
B560M Pro4/ac
A
B
2
13
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Page 22
3
5
4
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Please save and replace the cover if the processor is removed. e cover must be placed if you wish to return the motherboard for aer service.
B560M Pro4/ac
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Page 24
2.2 Installing the CPU Fan and Heatsink
1 2
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16
CPU_FAN
Page 25
2.3 Installing Memory Modules (DIMM)
is motherboard provides four 288-pin DDR4 (Double Data Rate 4) DIMM slots,
and supports Dual Channel Memory Technology.
1. For dual channe l conguration, you always nee d to insta ll identical (the same
brand, speed, size and chip-ty pe) DDR4 DIMM pairs.
2. It is unable to activate Dual Channel Me mory Technology with only one or three
memory module installed.
3. It is not allowed to in stall a DDR, DDR2 or DDR3 memory module into a DDR4
slot; otherwise, thi s motherboard and DIMM may be damaged.
Dual Channel Memory Conguration
Priority DDR4_A1 DDR4_A2 DDR4_B1 DDR4_B2
1 Populated Populated 2 Populated Populated Populated Populated
e DIMM only ts in one correct orientation. It will cause permanent damage to the motherboard and the DIMM if you force the DIMM into the slot at incorrect orientation.
B560M Pro4/ac
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Page 26
1
2
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18
3
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2.4 Expansion Slots (PCI Express Slots)
ere are 3 PCI Express slots on the motherboard.
Before installing an expansion c ard, please mak e sure that the powe r supply is switched o or the power cord i s unplug ged. Please read the documentation of the expan sion card and mak e necessary hardware settings for the card before you star t the installation.
PCIe slots:
11th Gen Intel® CoreTM Processors:
PCIE1 (PCIe 4.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
PCIE2 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE3 (PCIe 3.0 x16 slot) is used for PCI Express x4 lane width graphics cards.
PCIe slots:
10th Gen Intel® CoreTM Processors:
PCIE1 (PCIe 3 .0 x16 slot) is used for PCI Express x16 lane width graphics cards.
PCIE2 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE3 (PCIe 3.0 x16 slot) is used for PCI Express x4 lane width graphics cards.
B560M Pro4/ac
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Page 28
PCIe Slot Congurations
11th Gen Intel® CoreTM Processors:
PCIE1 PCIE3
Single Graphics Card Gen4x16 N/A
Two Graphics Cards in
CrossFireXTM Mode
Gen4x16 Gen3x4
10th Gen Intel® CoreTM Processors:
PCIE1 PCIE3
Single Graphics Card Gen3x16 N/A
Two Graphics Cards in
CrossFireXTM Mode
For a better ther mal environment , please conne ct a chassis fan to the motherboard’s chassis fan connector (CHA_FAN1/W P, CHA_FAN2/WP or CHA_FAN3/WP) when using multiple graphics cards.
Gen3x16 Gen3x4
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2.5 Jumpers Setup
e illustration shows how jumpers are setup. When the jumper cap is placed on
the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is
“O pen”.
Clear CMOS Jumper
(CLR MOS1)
(see p.7, No. 25)
CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system
parameters to default setup, please turn o the computer and unplug the power
cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to
short the pins on CLRMOS1 for 5 seconds. However, please do not clear the
CMOS right aer you update the BIOS. If you need to clear the CMOS when you
just nish updating the BIOS, you must boot up the system rst, and then shut it
down before you do the clear-CMOS action. Please be noted that the password,
date, time, and user default prole will be cleared only if the CMOS battery is
removed. Please remember toremove the jumper cap aer clearing the CMOS.
2-pin Jumper
B560M Pro4/ac
If you clear the CMOS, the case open may be detected. Please adjus t the BIOS option “Clear Status” to cl ear the record of prev ious chassis intru sion status.
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2.6 Onboard Headers and Connectors
1
1
+5V
DUMMY
SIGNAL
GND
DUMMY
SPEAKER
DUMMY
Onboard headers and connectors are NOT jumpers. Do NOT pla ce jumper caps over these headers and connectors. Placing jumper caps over the headers and connectors will cause permanent damage to the motherboard.
System Panel Header
(9-p in PA NE L1)
(see p.7, No. 15)
PWRBTN (Power Swi tch):
Connec t to the power switch on the chassis f ront panel. You may congure the way to turn o your system using the power sw itch.
RESET (Reset Sw itch): Connec t to the reset switch on the chassis f ront panel. Pre ss the reset switch to restart the computer if the computer f reezes and fails to per form a normal restart.
PLED (Syste m Power LED): Connec t to the power status indicator on the chassi s front panel. e LED is on when the system is operating. e LED keeps blinking whe n the system is in S1/S3 sle ep state. e LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Ha rd Drive Activity LED): Connec t to the hard drive ac tivity LED on the chassis f ront panel. e LED is on when the hard drive is reading or writing data.
e front panel design may dier by chassis . A front panel module mainly consists of power s witch, reset switch, power LED, hard drive ac tivity LED, speaker and etc. When connecting your cha ssis front panel modul e to this header, make sure the wire assig nments and the pin assignments are matched correc tly.
PLED+
PLED-
HDLED-
HDLED+
PWRBTN#
GND
RESET#
GND
GND
Connect the power
switch, reset switch and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
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Chassis Intrusion and
Speaker Header
(7-pi n SPK_C I1)
(see p.7, No. 21)
Please connect the
chassis intrusion and the
chassis speaker to this
header.
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B560M Pro4/ac
ype-C Cable
DUMMY
GND
GND
P+
P-
USB_PWR
P+
P-
USB_PWR
1
Serial ATA3 Connectors
Ver ti ca l:
(SATA3_0:
see p.7, No. 17)
(SATA3_1:
see p.7, No. 16)
Right Angle:
(SATA3_2:
see p.7, No. 11)(Upper)
(SATA3_3:
see p.7, No. 12)(Lower)
(SATA3_4:
see p.7, No. 14)(Upper)
(SATA3_5:
see p.7, No. 13)(Lower)
USB 2.0 Headers
(9-pin USB3_4)
(see p.7, No. 20)
(9-pin USB5_6)
(see p.7, No. 19)
USB 3.2 Gen1 Header
(19-pin USB3_5_6)
(see p.7, No. 9)
SATA3_2
SATA3_4
SATA3_0 SATA3_1
VbusVbus
IntA_PB_SSRX-
Vbus
IntA_PA_SSRX-
IntA_PA_SSRX+
IntA_PA_SSTX-
IntA_PA_SSTX+
IntA_PA_D-
IntA_PA_D+
IntA_PB_SSRX+
GND
IntA_PB_SSTX-
GND
IntA_PB_SSTX+
GND
IntA_PB_D-
GND
IntA_PB_D+
Dummy
1
ese six SATA3
connectors support SATA
SATA3_3
data cables for interna l
storage devices with up to
6.0 Gb/s data transfer rate.
SATA3_5
*If M2_ 2 is occupied by
a SATA-type M.2 device,
SATA3_1 will be disabled.
ere are two USB
2.0 headers on this
motherboard.Each USB
2.0 header can support
two ports.
ere is one USB 3.2
Gen1 header on this
motherboard. is USB
3.2 Gen1 header can
support two ports.
Front Panel Type C USB
3.2 Gen1 Header
(20-pin F_USB3_TC_1)
(see p.7, No. 10)
USB T
ere is one Front
Panel Type C USB 3.2
Gen1 Header on this
motherboard. is header
is used for connecting a
USB 3.2 Gen1 module for
additional USB 3.2 Gen1
ports.
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Front Panel Audio Header
J_SENSE
OUT2_L
1
MIC_RET
PRESENCE#
GND
OUT2_R
MIC2_R
MIC2_L
OUT_RET
D
F
4 3 2 1
GND
1
FAN_SPEED_CONTROL
1 2 3 4
(9-pin HD_AUDIO1)
(see p.7, No. 28)
1. High De nition Audio supports Ja ck Sensing, but the panel wire on the chassi s must support HDA to function corre ctly. Plea se follow the instructions in our manual and chas sis manual to install your system.
2. If you use an AC’97 audio panel, please install it to the front panel audio header by the steps below: A. Connect Mic_ IN (MIC) to MIC2_ L. B. Conne ct Audio_R (RIN) to OUT2 _R and Audio_ L (LIN) to OUT2_ L. C. Connect Ground (GND) to Ground (GND). D. MIC_ RET and OUT_RET are for the HD audio panel only. You don’t need to connec t them for the AC’97 audio panel . E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel and adjust “Recording Volume”.
is header is for
connecting audio devices
to the front audio panel.
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Chassis/Water Pump Fan
Connectors
(4-pin CHA_FAN1/WP)
(see p.7, No. 29)
(4-pin CHA_FAN2/WP)
(see p.7, No. 22)
(4-pin CHA_FAN3/WP)
(see p.7, No. 23)
CPU Fan Connector
(4-pin CPU_FAN1)
(see p.7, No. 5)
FAN_VOLTAGE
2
CHA_FAN_SPEED
3
FAN_SPEED_CONTROL
4
AN_SPEED_CONTROL
CHA_FAN_SPEED
CPU_FAN_SPEED
FAN_VOLTAGE
+12V
GND
is motherboard
provides three 4-Pin water
cooling
chassis
connectors. If you plan to
connect a 3-Pin
water cooler fan, please
connect it to Pin 1-3.
GN
is motherboard pro-
vides a 4-Pin CPU fan
(Quiet Fan) connector.
If you plan to connect a
3-Pin CPU fan, please
connect it to Pin 1-3.
fan
chassis
Page 33
B560M Pro4/ac
FAN_SPEED_CONTROL
1 2 3 4
4
1
8 5
1
SPI_DQ3
CPU/Water Pump Fan
Connector
(4-pin CPU_FAN2/WP)
(see p.7, No. 4)
ATX Power Connector
(24-pin AT XPWR 1)
(see p.7, No. 8)
ATX 12V Power
Connector
(8-pin ATX12V1)
(see p.7, No. 1)
CPU_FAN_SPEED
FAN_VOLTAGE
GND
12
1
is motherboard
provides a 4-Pin water
cooling CPU fan
connector. If you plan
to connect a 3-Pin CPU
water cooler fan, please
connect it to Pin 1-3.
24
is motherboard pro-
vides a 24-pin ATX power
connector. To use a 20-pin
ATX power supply, please
plug it along Pin 1 and Pin
13
13.
is motherboard pro-
vides a 8-pin ATX 12V
power connector. To use a
4-pin ATX power supply,
please plug it along Pin 1
and Pin 5.
*Warning: Please make
sure that the power cable
connected is for the CPU
and not the graphics
card. Do not plug the
PCIe power cable to this
connec tor.
SPI TPM Header
(13 -pi n SPI_TPM _ J1)
(see p.7, No. 18)
+3.3V
SPI_CS0
SPI_DQ2
Dummy
CLK
RSMRST#
SPI_MISO
SPI_MOSI
RST#
TPM_PIRQ
SPI_TPM_CS#
GND
is connector supports SPI
Trusted Platform Module (TPM)
system, which can securely
store keys, digital certicates,
passwords, and data. A TPM
system also helps enhance
network security, protects digital
identities, and ensures platform
integr it y.
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Page 34
underbolt AIC
1
DO_ADDR
D
1
1
B
DRAM
CPU
VGA
BOOT
Connector
(5-pin TB1)
(see p.7, No. 24)
Please connect a underbolt™
add-in card (AIC) to this
connector via the GPIO cable.
*Please install the underbolt™
AIC card to PCIE3 (default slot).
RGB LED Headers
(4-pin RGB _LED1)
(see p.7, No. 6)
(4-pi n RGB _LE D2)
(see p.7, No. 26)
Addressable LED Headers
(3-pin ADDR _LED1)
(see p.7, No. 7)
(3-pin ADDR _LED2)
(see p.7, No. 27)
R
G
+12V
1
+12V GRB
GND
VOUT
1
DO_ADDR
VOUT
ese two RGB LED headers are
used to connect RGB LED
extension cables which allow
users to choose from various LED
lighting eects.
Caution: Never install the RGB
LED cable in the wrong orienta-
tion; otherwise, the cable may
be damaged.
*Please refer to page 47 for for
further instructions on this
header.
ese two headers are used to
connect
Addressable
LED
extension cables which allow
users to choose from various LED
lighting eects.
Caution: Never install the
GN
Addressable LED cable in the
wrong orientation; otherwise,
the cable may be damaged.
*Please refer to page 48 for
further instructions on this
header.
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26
Post Status Checker
(see p.1)
Post Status Checker (PSC)
diagnoses the computer when
users power on the machine.
It emits a red light to indicate
whether the CPU, memory, VGA
or storage is dysfunctional. e
lights go o if the four mentioned
above are functioning normally.
Page 35
2.7 CrossFireXTM and Quad CrossFireXTM Operation Guide
is motherboard supports CrossFireXTM and Quad CrossFireXTM that allows you
to install up to three identical PCI Express x16 graphics cards.
1. You should only use identical CrossFireXTM-ready g raphics cards that are AMD certied.
2. Make sure that your g raphics c ard driver supports AMD CrossFireXTM technology. Download the dr ivers from the AMD’s website: www.amd.com
3. Make sure that your power supply unit (PSU) can provide at leas t the minimum power your system requires. It is recommended to use a AM D certied PSU. Plea se refer to the AMD’s website for details.
4. If you pair a 12-pipe CrossFireXTM Edition card with a 16-pipe card , both cards will operate a s 12-pipe cards while in CrossFireXTM mode.
5. Dierent CrossFireXTM cards may require dierent methods to enable CrossFi­reXTM. Please refer to A MD graphics card manuals for detailed installation guide.
2.7.1 Installing Two CrossFireXTM-Ready Graphics Cards
Step 1
Insert one graphics card into PCIE1 slot
and the other graphics card to PCIE3 slot.
Make sure that the cards are properly
seated on the slots.
B560M Pro4/ac
CrossFire Bridge
Step 2
Connect two graphics cards by installing
a CrossFire Bridge on the CrossFire Bridge
Interconnects on the top of the graphics
cards. (e CrossFire Bridge is provided
with the graphics card you purchase, not
bundled with this motherboard. Please
refer to your graphics card vendor for
deta ils.)
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Page 36
Step 3
Connect a VGA/DVI/DP/HDMI cable
from the monitor to the corresponding
port on the graphics card installed to the
PCIE1 slot.
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Page 37
2.7.2 Driver Installation and Setup
Step 1
Power on your computer and boot into OS.
Step 2
Remove the AMD drivers if you have any VGA drivers installed in your system.
e Catalyst Uninstaller i s an optional dow nload . We re commend using this utilit y to uninstall any previously installed Catalyst dr ivers prior to in stallation. Please check A MD’s website for AMD dr iver updates.
Step 3
Install the required drivers and CATALYST Control Center then restart your
computer. Please check AMD’s website for details.
Step 4
Double-click the AMD Catalyst Control
AMD Catalyst Control Center
Center icon in the Windows® sy st em tr ay.
B560M Pro4/ac
Step 5
In the le pane, click Performance and
then AMD CrossFireXTM. en select
Enable AMD CrossFireX and click Apply.
Select the GPU number according to your
graphics card and click Apply.
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Page 38
2.8 M.2_SSD (NGFF) Module Installation Guide (M2_1)
3
1
e M.2, also known as the Next Generation Form Factor (NGFF), is a small size and
versatile card edge connector that aims to replace mPCIe and mSATA. e Hyper M.2
Socket (M2_1) supports M Key type 2242/2260/2280 M.2 PCI Express module up to
Gen4x4 (64 Gb/s) (Only supported with 11th Gen Intel® Core™ Processors).
Installing the M.2_SSD (NGFF) Module
Step 1
Prepare a M.2_ SSD (NGFF) module
and the screw.
Step 2
Before installing a M.2 (NGFF)
1
2
SSD module, please loosen
the screws to remove the M.2
heatsink.
*Please remove the protective
lms on the bottom side of the
M.2 heatsink before you install
a M.2 SSD module.
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30
2
Depending on the PCB t ype and
length of your M.2 _SSD (NGFF)
module, nd the corresponding nut
Step 3
1
ABC
location to be used.
No. 1 2 3
Nut Location A B C
PCB Length 4.2cm 6cm 8cm
Module Type Typ e224 2 Type2 260 Ty pe 22 80
Page 39
B560M Pro4/ac
2
Step 4
Prepare the M.2 stando that comes
with the package. en hand tighten
the stando into the desired nut
ABC
location on the motherboard. Align
and gently insert the M.2 (NGFF)
SSD module into the M.2 slot. Please
be aware that the M.2 (NGFF) SSD
module only ts in one orientation.
ABC
o
20
Step 5
Tighten the screw that come with the
package with a screwdriver to secure
the module into place.
NUT1NUT2C
Step 6
Tighten the screw with a screwdriver
to secure the module and M.2
heatsink into place. Please do
2
1
not overtighten the screw as this
might damage the module and M.2
heatsink.
31
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Page 40
English
M.2_SSD (NGFF) Module Support List (M2_1)
Vendor Interface P/N
ADATA PCIe3 x4 ASX7000NP-128GT-C ADATA PCIe3 x4 ASX8000NP-256GM-C ADATA PCIe3 x4 ASX7000NP-256GT-C ADATA PCIe3 x4 ASX8000NP-512GM-C ADATA PCIe3 x4 ASX7000NP-512GT-C Apacer PCIe3 x4 AP240GZ280 Corsair PCIe3 x4 CSSD-F240GBMP500 Intel PCIe3 x4 SSDPEKKF256G7 Intel PCIe3 x4 SSDPEKK F512G7 Kingston PCIe3 x4 SKC1000/480G Kingston PCIe2 x4 SH2280S3/480G OCZ PCIe3 x4 RVD400 -M2280-512G (NVME) PAT R IOT PCIe3 x4 PH240GPM280SSDR NVME Plextor PCIe3 x4 PX-128M8PeG Plextor PCIe3 x4 PX-1TM8PeG Plextor PCIe3 x4 PX-256M8PeG Plextor PCIe3 x4 PX-512M8Pe G Plextor PCIe PX-G256M6e Plextor PCIe PX-G512M6e Samsung PCIe3 x4 SM961 MZVPW128HEGM (NVM) Samsung PCIe3 x4 PM961 MZVLW128HEGR (NVME) Samsung PCIe3 x4 960 EVO (MZ-V6E250) (NVME) Samsung PCIe3 x4 960 EVO (MZ-V6E250BW) (NVME) Samsung PCIe3 x4 SM951 (N VM E) Samsung PCIe3 x4 SM951 (MZHPV256HDGL) Samsung PCIe3 x4 SM951 (MZHPV512HDGL) Samsung PCIe3 x4 SM951 (N VM E) Samsung PCIe x4 XP941-512G (MZHPU512HCGL) SanDisk PCIe SD6PP4M-12 8G SanDisk PCIe SD6PP4M-256G TEAM PCIe3 x4 TM8FP2240G0C101 TEAM PCIe3 x4 TM8FP2480GC110 WD PCIe3 x4 WDS256G1X0C-00ENX0 (NVME) WD PCIe3 x4 WDS512G1X0C-00EN X0 ( NVME)
For the latest updates of M.2_SSD (NFGG) module support list, please visit our website for
details: http://www.asrock.com
32
Page 41
2.9 M.2_SSD (NGFF) Module Installation Guide (M2_2)
e M.2, also known as the Next Generation Form Factor (NGFF), is a small size and
versatile card edge connector that aims to replace mPCIe and mSATA. e Ultra M.2
Socket (M2_2) supports M Key type 2280 M.2 SATA3 6.0 Gb/s module and M.2 PCI
Express module up to Gen3 x4 (32 Gb/s).
* If M2_2 is occupied by a SATA-type M.2 device, SATA3_1 will be disabled.
Installing the M.2_SSD (NGFF) Module
Step 1
Prepare a M.2_ SSD (NGFF) module
and the screw.
Step 2
Depending on the PCB t ype and
length of your M.2 _SSD (NGFF)
module, nd the corresponding nut
location to be used.
B560M Pro4/ac
No. 1
Nut Location A
PCB Length 8cm
Module Type Type2 280
English
33
Page 42
Step 4
Align and gently insert the M.2
(NGFF) SSD module into the M.2
slot. Please be aware that the M.2
(NGFF) SSD module only ts in one
orientation.
o
20
Step 5
Tighten the screw with a screwdriver
to secure the module into place.
Please do not overtighten the screw
NUT1NUT2
as this might damage the module.
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34
Page 43
M.2_SSD (NGFF) Module Support List (M2_2)
Vendor Interface P/N
ADATA PCIe3 x4 ASX7000NP-128GT-C ADATA PCIe3 x4 ASX8000NP-256GM-C ADATA PCIe3 x4 ASX7000NP-256GT-C ADATA PCIe3 x4 ASX8000NP-512GM-C ADATA PCIe3 x4 ASX7000NP-512GT-C Apacer PCIe3 x4 AP240GZ280 Corsair PCIe3 x4 CSSD-F240GBMP500 Intel PCIe3 x4 SSDPEKKF256G7 Intel PCIe3 x4 SSDPEKK F512G7 Kingston PCIe3 x4 SKC1000/480G Kingston PCIe2 x4 SH2280S3/480G OCZ PCIe3 x4 RVD400-M2280-512G (NVME) PAT R IOT PCIe3 x4 PH240GPM280SSDR NVME Plextor PCIe3 x4 PX-128M8PeG Plextor PCIe3 x4 PX-1TM8PeG Plextor PCIe3 x4 PX-256M8PeG Plextor PCIe3 x4 PX-512M8Pe G Plextor PCIe PX-G256M6e Plextor PCIe PX-G512M6e Samsung PCIe3 x4 SM961 MZVPW128HEGM (NVM) Samsung PCIe3 x4 PM961 MZVLW128HEGR (NVME) Samsung PCIe3 x4 960 EVO (MZ-V6E250) (NVME) Samsung PCIe3 x4 960 EVO (MZ-V6E250BW) (NVME) Samsung PCIe3 x4 SM951 (N VM E) Samsung PCIe3 x4 SM951 (MZHPV256HDGL) Samsung PCIe3 x4 SM951 (MZHPV512HDGL) Samsung PCIe3 x4 SM951 (N VM E) Samsung PCIe x4 XP941-512G (MZHPU512HCGL) SanDisk PCIe SD6PP4M-12 8G SanDisk PCIe SD6PP4M-256G TEAM PCIe3 x4 TM8FP2240G0C101 TEAM PCIe3 x4 TM8FP2480GC110 WD PCIe3 x4 WDS256G1X0C-00ENX0 (NVME) WD PCIe3 x4 WDS512G1X0C-00EN X0 ( NVME)
B560M Pro4/ac
For the latest updates of M.2_SSD (NFGG) module support list, please visit our website for
details: http://www.asrock.com
English
35
Page 44
Chapter 3 Software and Utilities Operation
3.1 Installing Drivers
e Support CD that comes with the motherboard contains necessary drivers and
useful utilities that enhance the motherboard ’s features.
Running The Support CD
To begin using the support CD, insert the CD into your CD-ROM drive. e CD
automatically displays the Main Menu if “AUTORUN” is enabled in your computer.
If the Main Menu does not appear automatically, locate and double click on the le
“ASRSETUP.EXE” in the Support CD to display the menu.
Drivers Menu
e drivers compatible to your system will be auto-detected and listed on the
support CD driver page. Please click Install All or follow the order from top to
bottom to install those required drivers. erefore, the drivers you install can work
properly.
Utilities Menu
e Utilities Menu shows the application soware that the motherboard supports.
Click on a specic item then follow the installation wizard to install it.
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3.2 ASRock Motherboard Utility (A-Tuning)
ASRock Motherboard Utility (A-Tuning) is ASRock ’s multi purpose soware suite
with a new interface, more new features and improved utilities.
3.2.1 Installing ASRock Motherboard Utility (A-Tuning)
ASRock Motherboard Utility (A-Tuning) can be downloaded from ASRock Live
Update & APP Shop. Aer the installation, you will nd the icon “ASRock Mother-
board Utility (A-Tuning)“ on your desktop. Double-click the
“ASRock Motherboard Utility (A-Tuning)“ icon, ASRock Motherboard Utility
(A-Tuning) main menu will pop up.
3.2.2 Using ASRock Motherboard Utility (A-Tuning)
ere are ve sections in ASRock Motherboard Utility (A-Tuning) main menu:
Operation Mode, OC Tweaker, System Info, FAN-Tastic Tuning and Settings.
Operation Mode
Choose an operation mode for your computer.
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OC Tweaker
Congurations for overclocking the system.
System Info
View information about the system.
*e System Browser tab may not appear for certain models.
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FAN-Tastic Tuning
Congure up to ve dierent fan speeds using the graph. e fans will automatically shi
to the next speed level when the assigned temperature is met.
Settings
Congure ASRock ASRock Motherboard Utility (A-Tuning). Click to select "Auto
run at Windows Startup" if you want ASRock Motherboard Utility (A-Tuning) to
be launched when you start up the Windows operating system.
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3.3 ASRock Live Update & APP Shop
e ASRock Live Update & APP Shop is an online store for purchasing and
downloading soware applications for your ASRock computer. You can quickly and
easily install various apps and support utilities. With ASRock Live Update & APP
Shop, you can optimize your system and keep your motherboard up to date simply
with a few clicks.
Double-click on your desktop to access ASRock Live Update & APP Shop utility.
*You need to be connected to the Internet to dow nload apps from the ASRock Live Update & APP Shop.
3.3.1 UI Overview
Category Panel
Hot News
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Information Panel
Category Panel: e category panel contains several category tabs or buttons that
when selected the information panel below displays the relative information.
Information Panel: e information panel in the center displays data about the
currently selected category and allows users to perform job-related tasks.
Hot News: e hot news section displays the various latest news. Click on the image
to visit the website of the selected news and know more.
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3.3.2 Apps
When the "Apps" tab is selected, you will see all the available apps on screen for you
to download.
Installing an App
Step 1
Find the app you want to install.
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e most recommended app appears on the le side of the screen. e other various
apps are shown on the right. Please scroll up and down to see more apps listed.
You can check the price of the app and whether you have already intalled it or not.
- e red icon displays the price or "Free" if the app is free of charge.
- e green "Installed" icon means the app is installed on your computer.
Step 2
Click on the app icon to see more details about the selected app.
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Step 3
If you want to install the app, click on the red icon to start downloading.
Step 4
When installation completes, you can nd the green "Installed" icon appears on the
upper right corner.
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To uninstall it, simply click on the trash can icon . *e trash icon may not appear for certain apps.
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Upgrading an App
You can only upgrade the apps you have already installed. When there is an
available new version for your app, you will nd the mark of "New Version"
appears below the installed app icon.
Step 1
Click on the app icon to see more details.
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Step 2
Click on the yellow icon to start upgrading.
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3.3.3 BIOS & Drivers
Installing BIOS or Drivers
When the "BIOS & Drivers" tab is selected, you will see a list of recommended or
critical updates for the BIOS or drivers. Please update them all soon.
Step 1
Please check the item information before update. Click on to see more details.
Step 2
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Click to select one or more items you want to update.
Step 3
Click Update to start the update process.
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3.3.4 Setting
In the "Setting" page, you can change the language, select the server location, and
determine if you want to automatically run the ASRock Live Update & APP Shop
on Windows startup.
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3.4 Nahimic Audio
Nahimic audio soware provides an incredible high denition sound technology which
boosts the audio and voice performance of your system. Nahimic Audio interface is
composed of four tabs: Audio, Microphone, Sound Tracker and Settings.
ere are four functions in Nahimic audio :
No. Function Description
From this tab, you can mute the current audio device, choose
Audio
1
between four factory audio proles, turn all audio eects on/o, restores the current prole to its default settings and access Surround Sound and various features.
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Microphone
2
3
4
Sound
Tracker
Settings
From this tab, you can mute the current mic device, choose between two factory mic proles, turn/o all microphone eects, restore the current prole to its default settings, and access Static Noise Suppression and various features.
e Sound Tracker provides a visual indication localizing the sources of the sounds while in a game. ese are represented by dynamic segments pointing the direction of the sounds: the more opaque they are, the stronger the sounds are.
From this tab, you can access all settings and information of the soware.
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B560M Pro4/ac
1
B
3.5 ASRock Polychrome SYNC
ASRock Polychrome SYNC is a lighting control utility specically designed for unique indi-
viduals with sophisticated tastes to build their own stylish colorful lighting system. Simply by
connecting the LED strip, you can customize various lighting schemes and patterns, including
Static, Breathing, Strobe, Cycling, Music, Wave and more.
Connecting the LED Strip
Connect your RGB LED strips to the
motherboard.
RGB LED Headers (RGB_LED1 / RGB_LED2)
RGB_LED1
R
G
+12V
1
RGB_LED2
+12V GRB
on the
1
B
R
G
V
2
1
1. Never install the RGB LED cable in the w rong orientation; other wise, the cable may be damaged.
2. Before installing or removing your RGB LED cable, plea se power o your system and unplug the power cord from the power supply. Failure to do so may cause dam­ages to motherboard components.
1. Plea se note that the RGB LED strips do not come with the package.
2. e RGB LED header support s standard 5050 RGB LED strip (12V/G/R/B), with a maximum power rating of 3A (12V) and leng th within 2 meters.
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Connecting the Addressable RGB LED Strip
DO_ADDR
1
Connect your
ADDR _LED2)
Addressable RGB LED
on the motherboard.
strips to the
Addressable LED Headers (ADDR_LED1 /
ADDR_LED1
GND
VOUT
1
ADDR_LED2
GND
DO_ADDR
VOUT
1
1. Never install the RGB LED cable in the w rong orientation; other wise, the cable may be damaged.
2. Before installing or removing your RGB LED cable, plea se power o your system and unplug the power cord from the power supply. Failure to do so may cause damages to motherboard components.
1. Plea se note that the RGB LED strips do not come with the package.
2. e RGB LED header support s WS2812B addressable RGB LED strip (5V/Data/
GND), with a ma ximum power rating of 3A (5V) and length within 2 meters.
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ASRock Polychrome SYNC Utility
Now you can adjust the RGB LED color through the ASRock Polychrome SYNC Utility.
Download this utility from the ASRock Live Update & APP Shop and start coloring your
PC style your way!
Drag the tab to customize your
preference.
Toggle on/o the
RGB LED switch
Sync RGB LED eects
for all LED regions of
the motherboard
Select a RGB LED light eect
from the drop-down menu.
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Chapter 4 UEFI SETUP UTILITY
4.1 Introduction
is section explains how to use the UEFI SETUP UTILITY to congure your
system. You may run the UEFI SETUP UTILITY by pressing <F2> or <Del> right
aer you power on the computer, otherwise, the Power-On-Self-Test (POST) will
continue with its test routines. If you wish to enter the UEFI SETUP UTILITY aer
POST, restart the system by pressing <Ctl> + <Alt> + <Delete>, or by pressing the
reset button on the system chassis. You may also restart by turning the system o
and then back on.
Becau se the UEFI soware is cons tantly being updated, the following UEFI setup screens and descriptions are for reference purpose only, and they may not e xactly match what you see on your screen.
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4.2 EZ Mode
e EZ Mode screen appears when you enter the BIOS setup program by default. EZ
mode is a dashboard which contains multiple readings of the system’s current status.
You can check the most crucial information of your system, such as CPU speed,
DRAM frequency, SATA information, fan speed, etc.
Press <F6> or click the "Advanced Mode" button at the upper right corner of the
screen to switch to "Advanced Mode" for more options.
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No. Function
Help
1
Load UEFI Defaults
2
Save Changes and Exit
3
Discard Changes
4
Change Language
5
Switch to Advanced Mode
6
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4.3 Advanced Mode
e Advanced Mode provides more options to congure the BIOS settings. Refer to
the following sections for the detailed congurations.
To access the EZ Mode, press <F6> or click the "EZ Mode" button at the upper right
corner of the screen.
4.3.1 UEFI Menu Bar
e top of the screen has a menu bar with the following selections:
Main
OC Tweaker
Advanced
Tool
H/W Monitor
Security
Boot
Exit
For setting system time/date information
For overclocking congurations
For advanced system congurations
Useful tools
Displays current hardware status
For security settings
For conguring boot settings and boot priority
Exit the current screen or the UEFI Setup Utility
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4.3.2 Navigation Keys
Use < > key or < > key to choose among the selections on the menu bar, and
use < > key or < > key to move the cursor up or down to select items, then
press <Enter> to get into the sub screen. You can also use the mouse to click your
required item.
Please check the following table for the descriptions of each navigation key.
Navigation Key(s) Description
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+ / -
<Tab>
<PGUP>
<PGDN>
<HOME>
<END>
<F1>
<F5>
<F7>
<F9>
<F10>
<F12>
<ESC>
To change option for the selected items
Switch to next function
Go to the previous page
Go to the next page
Go to the top of the screen
Go to the bottom of the screen
To display the General Help Screen
Add / Remove Favorite
Discard changes and exit the SETUP UTILITY
Load optimal default values for all the settings
Save changes and exit the SETUP UTILITY
Print screen
Jump to the Exit Screen or exit the current screen
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4.4 Main Screen
When you enter the UEFI SETUP UTILITY, the Main screen will appear and
display the system overview.
e availability and location of BIOS set tings can be dierent for di erent models and BIOS versions.
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My Favorite
Display your collection of BIOS items. Press F5 to add/remove your favorite items.
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4.5 OC Tweaker Screen
In the OC Tweaker screen, you can set up overclocking features.
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Becau se the UEFI soware is cons tantly being updated, the following UEFI setup screens and descriptions are for reference purpose only, and they may not e xactly match what you see on your screen.
CPU Conguration
CPU Ratio
e CPU speed is determined by the CPU Ratio multiplied with the BCLK.
Increasing the CPU Ratio will increase the internal CPU clock speed without
aecting the clock speed of other components.
AVX2 Ratio Oset
AVX2 Ratio Oset species a negative oset from the CPU Ratio for AVX
workloads. AVX is a more stressful workload that lower the AVX ratio to ensure
maximum possible ratio for SSE workloads.
AVX-512 Ratio Oset
AVX-512 Ratio Oset species a negative oset from the CPU Ratio for AVX-512
workloads. AVX-512 is a more stressful workload that lower the AVX ratio to ensure
maximum possible ratio for SSE workloads.
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CPU Cache Ratio
e CPU Internal Bus Speed Ratio. e ma ximum should be the same as the CPU
Ratio.
GT Frequency
Congure the integrated GPU Frequency.
BCLK Spread Spectrum Mode
Enable Spread Spectrum to reduce electromagnetic interference for passing EMI
tests. Disable to achieve higher clock speeds when overclocking.
BCLK Aware Adaptive Voltage
BCLK Aware Adaptive Voltage enable/disable. When enabled, pcode will be aware
of the BCLK frequency when calculating the CPU V/F cur ves. is is ideal for
BCLK OC to avoid high voltage overrides.
Boot Performance Mode
Select the performance state that the BIOS will set before OS hando.
Ring to Core Ratio Oset
Disable Ring to Core Ratio Oset so the ring and core can run at the same fre-
quenc y.
PVD Ratio Threshold
Select PVD Ratio reshold Value from Range 1 to 40.
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Intel SpeedStep Technology
Intel SpeedStep technology allows processors to switch between multiple frequen-
cies and voltage points for better power saving and heat dissipation.
Intel Turbo Boost Technology
Intel Turbo Boost Technolog y enables the processor to run above its base operating
frequency when the operating system requests the highest performance state.
Intel Speed Shift Technology
Enable/Disable Intel Speed Shi Technology support. Enabling will expose the
CPPC v2 interface to allow for hardware controlled P-sates.
Intel Turbo Boost Max Technology 3.0
Intel Turbo Boost Technolog y enables the processor to run above its base operating
frequency when the operating system requests the highest performance state.
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Intel Thermal Velocity Boost Voltage Optimizations
is service controls thermal based voltage optimizations for processors that
implment the Intel ermal Velocity Boost (TVB) feature.
Dual Tau Boost
Enable Dual Tau Boost feature. is is only applicable for CMLS 35W/65W/125W
skus. is item is only supported with processors with Cong TDP support.
Long Duration Power Limit
Congure Package Power Limit 1 in watts. When the limit is exceeded, the CPU
ratio will be lowered aer a period of time. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
Long Duration Maintained
Congure the period of time until the CPU ratio is lowered when the Long
Duration Power Limit is exceeded.
Short Duration Power Limit
Congure Package Power Limit 2 in watts. When the limit is exceeded, the CPU
ratio will be lowered immediately. A lower limit can protect the CPU and save
power, while a higher limit may improve performance.
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CPU Core Current Limit
Congure the current limit of the CPU core. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
System Agent Current Limit
Congure the current limit of the system agent. A lower limit can protect the CPU
and save power, while a higher limit may improve performance.
GT Current Limit
Congure the current limit of the GT slice. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
DRAM Conguration
Memory Information
Allows users to browse the seria l presence detect (SPD) and Intel extreme memory prole
(XMP) for DDR4 modules.
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DRAM Timing Conguration
DRAM Frequency
If [Auto] is selected, the motherboard will detect the memory module(s) inserted
and assign the appropriate frequency automatically.
Primary Timing
CAS# Latency (tCL)
e time between sending a column address to the memory and the beginning of the data
in response.
RAS# to CAS# Delay and Row Precharge (tRCDtRP)
RAS# to CAS# Delay : e number of clock cycles required between the opening of a row
of memory and accessing columns within it.
Row Precharge: e number of clock cycles required between the issuing of the precharge
command and opening the next row.
RAS# Active Time (tRAS)
e number of clock cycles required between a bank active command and issuing the
precharge command.
Command Rate (CR)
e delay between when a memory chip is selected and when the rst active command can
be issued.
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Secondary Timing
Write Recovery Time (tWR)
e amount of delay that must elapse aer the completion of a valid write operation,
before an active bank can be precharged.
Refresh Cycle Time (tRFC)
e number of clocks from a Refresh command until the rst Activate command to
the same rank.
RAS to RAS Delay (tRRD_L)
e number of clocks between two rows activated in dierent banks of the same
rank.
RAS to RAS Delay (tRRD_S)
e number of clocks between two rows activated in dierent banks of the same
rank.
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Write to Read Delay (tWTR_L)
e number of clocks between the last valid write operation and the next read command to
the same internal bank.
Write to Read Delay (tWTR_S)
e number of clocks between the last valid write operation and the next read command to
the same internal bank.
Read to Precharge (tRTP)
e number of clocks that are inserted between a read command to a row pre-
charge command to the same rank.
Four Activate Window (tFAW)
e time window in which four activates are allowed the same rank.
CAS Write Latency (tCWL)
Congure CAS Write Latency.
Third Timing
tREFI
Congure refresh cycles at an average periodic interval.
tCKE
Congure the period of time the DDR4 initiates a minimum of one refresh
command internally once it enters Self-Refresh mode.
Turn Around Timing
tRDRD_sg
Congure between module read to read delay.
tRDRD_dg
Congure between module read to read delay.
tRDRD_dr
Congure between module read to read delay.
tRDRD_dd
Congure between module read to read delay.
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tRDWR_sg
Congure between module read to write delay.
tRDWR_dg
Congure between module read to write delay.
tRDWR_dr
Congure between module read to write delay.
tRDWR_dd
Congure between module read to write delay.
tWRRD_sg
Congure between module write to read delay.
tWRRD_dg
Congure between module write to read delay.
tWRRD_dr
Congure between module write to read delay.
tWRRD_dd
Congure between module write to read delay.
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tWRWR_sg
Congure between module write to write delay.
tWRWR_dg
Congure between module write to write delay.
tWRWR_dr
Congure between module write to write delay.
tWRWR_dd
Congure between module write to write delay.
Round Trip Timing
Round Trip Timing Optimization
Auto is enabled in general case.
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Initial RTL (A1 Rank1)
Congure round trip latency initial value.
Initial RTL (A1 Rank2)
Congure round trip latency initial value.
Initial RTL (A2 Rank1)
Congure round trip latency initial value.
Initial RTL (A2 Rank2)
Congure round trip latency initial value.
Initial RTL (B1 Rank1)
Congure round trip latency initial value.
Initial RTL (B1 Rank2)
Congure round trip latency initial value.
Initial RTL (B2 Rank1)
Congure round trip latency initial value.
B560M Pro4/ac
Initial RTL (B2 Rank2)
Congure round trip latency initial value.
RTL (A1 Rank1)
Congure round trip latency.
RTL (A1 Rank2)
Congure round trip latency.
RTL (A2 Rank1)
Congure round trip latency.
RTL (A2 Rank2)
Congure round trip latency.
RTL (B1 Rank1)
Congure round trip latency.
RTL (B1 Rank2)
Congure round trip latency.
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RTL (B2 Rank1)
Congure round trip latency.
RTL (B2 Rank2)
Congure round trip latency.
IOL Init Value
Congure IO latency init value for IO latency training.
IOL (A1 Rank1)
Congure IO latency.
IOL (A1 Rank2)
Congure IO latency.
IOL (A2 Rank1)
Congure IO latency.
IOL (A2 Rank2)
Congure IO latency.
IOL (B1 Rank1)
Congure IO latency.
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IOL (B1 Rank2)
Congure IO latency.
IOL (B2 Rank1)
Congure IO latency.
IOL (B2 Rank2)
Congure IO latency.
IOL Oset (CH A)
Congure IO latency oset for channel A.
IOL Oset (CH B)
Congure IO latency oset for channel B.
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ODT Setting
Dimm ODT Training
ODT values will be optimized by Dimm On-Die Termination Training.
ODT WR (A1)
Congure the memory on die termination resistors' WR for channel A1.
ODT WR (A2)
Congure the memory on die termination resistors' WR for channel A2.
ODT WR (B1)
Congure the memory on die termination resistors' WR for channel B1.
ODT WR (B2)
Congure the memory on die termination resistors' WR for channel B2.
ODT NOM (A1)
Use this to change ODT (CH A1) Auto/Manual settings. e default is [Auto].
ODT NOM (A2)
Use this to change ODT (CH A2) Auto/Manual settings. e default is [Auto].
B560M Pro4/ac
ODT NOM (B1)
Use this to change ODT (CH B1) Auto/Manual settings. e default is [Auto].
ODT NOM (B2)
Use this to change ODT (CH B2) Auto/Manual settings. e default is [Auto].
ODT PARK (A1)
Congure the memory on die termination resistors' PARK for channel A1.
ODT PARK (A2)
Congure the memory on die termination resistors' PARK for channel A2.
ODT PARK (B1)
Congure the memory on die termination resistors' PARK for channel B1.
ODT PARK (B2)
Congure the memory on die termination resistors' PARK for channel B2.
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COMP Setting
Dll Bandwidth 0
Congure Dll Bandwidth 0 (1067 MHz) to maximize the performance of
intergrated memory controller.
Dll Bandwidth 1
Congure Dll Bandwidth 1 (1333 MHz) to maximize the performance of intergrated
memory controller.
Dll Bandwidth 2
Congure Dll Bandwidth 2 (1600 MHz) to maximize the performance of
intergrated memory controller.
Dll Bandwidth 3
Congure Dll Bandwidth 3 (1867 MHz) to maximize the performance of intergrated
memory controller.
Advanced Setting
ASRock Timing Optimization
Congure the fast path through the MRC.
ASRock Second Timing Optimization
Congure the second fast path through the MRC.
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Memory Training Mode
Congure the Training Memory Mode.
Realtime Memory Timing
Congure the realtime memory timings.
[Enabled] e system will allow performing realtime memory timing changes aer
MRC_DONE.
Reset for MRC Failed
Reset system aer MRC training is failed.
Train on Warm Boot
When enabled, memory training will be executed when warm boot.
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MRC Fast Boot
Enable Memory Fast Boot to skip DRAM memory training for booting faster.
Voltage Conguration
Voltage Mode
[OC]: Larger range voltage for overclocking.
[STABLE]: Smaller range voltage for stable system.
CPU Core/Cache Voltage
Input voltage for the processor by the external voltage regulator.
CPU Core/Cache Load-Line Calibration
CPU Core/Cache Load-Line Calibration helps prevent CPU Core/Cache voltage
droop when the system is under heav y loading.
CPU GT Voltage
Congure the voltage for the integrated GPU.
CPU GT Load-Line Calibration
GT Load-Line Calibration helps prevent integrated GPU voltage droop when the
system is under heavy load.
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VCCSA Voltage
Congure the voltage for the VCCSA.
CPU Standby Voltage
Congure the voltage for the CPU Standby.
VCCIN AUX Voltage
Congure the voltage for the VCCIN AUX.
DRAM Voltage
Use this to congure DRAM Voltage. e default va lue is [Auto].
DRAM Activating Power Supply
Congure the voltage for the DRAM Activating Power Supply.
VCCIO Voltage
Congure the voltage for the VCCIO.
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AVX Conguration
AVX2 Voltage Guardband Scale Factor
AVX2 Voltage Guardband Scale Factor controls the voltage guardband applied to
AVX2 workloads. A value > 1.00 will increase the voltage guardband, and < 1.00
will decrease the voltage guardband.
AVX-512 Voltage Guardband Scale Factor
AVX-512 Voltage Guardband Scale Factor controls the voltage guardband applied
to AVX-512 workloads. A value > 1.00 will increase the voltage guardband, and < 1.00
will decrease the voltage guardband.
Save User Default
Type a prole name and press enter to save your settings as user default.
Load User Default
Load previously saved user defaults.
Save User UEFI Setup Prole to Disk
It helps you to save current UEFI settings as an user prole to disk.
Load User UEFI Setup Prole from Disk
You can load previous saved prole from the disk.
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4.6 Advanced Screen
In this section, you may set the congurations for the following items: CPU
Conguration, Chipset Conguration, Storage Conguration, Intel(R) underbolt,
Super IO Conguration, ACPI Conguration, USB Conguration and Trusted
Computing.
B560M Pro4/ac
Setting wrong values in this section may cause the system to malf unction.
UEFI Conguration
UEFI Setup Style
Select the default mode when entering the UEFI setup utility.
Active Page on Entry
Select the default page when entering the UEFI setup utility.
Full HD UEFI
When [Auto] is selected, the resolution will be set to 1920 x 1080 if the monitor
supports Full HD resolution. If the monitor does not support Full HD resolution,
then the resolution will be set to 1024 x 768. When [Disable] is selected, the
resolution will be set to 1024 x 768 directly.
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4.6.1 CPU Conguration
Intel Hyper Threading Technology
Intel Hyper reading Technology allows multiple threads to run on each core, so
that the overall performance on threaded soware is improved.
Active Processor Cores
Select the number of cores to enable in each processor package.
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CPU C States Support
Enable CPU C States Support for power saving. It is recommended to keep C6 and
C7 all enabled for better power saving.
Enhanced Halt State (C1E)
Enable Enhanced Ha lt State (C1E) for lower power consumption.
CPU C6 State Support
Enable C6 deep sleep state for lower power consumption.
CPU C7 State Support
Enable C7 deep sleep state for lower power consumption.
Package C State Support
Enable CPU, PCIe, Memor y, Graphics C State Support for power saving.
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CFG Lock
is item allows you to disable or enable the CFG Lock.
C6DRAM
Enable/Disable moving of DRAM contents to PRM memory when CPU is in C6
state.
CPU Thermal Throttling
Enable CPU internal thermal control mechanisms to keep the CPU from overheat-
ing.
Intel AVX/AVX2
Enable/Disable the Intel AVX and AVX2 Instructions. is is applicable for Big
Core only.
Intel AVX-512
Enable/Disable the Intel AVX-512 (a.k.a. AVX3) Instructions. is is applicable for
Big Core only.
Intel Virtualization Technology
Intel Virtualization Technology allows a platform to run multiple operating systems
and applications in independent partitions, so that one computer system can
function as multiple virtual systems.
B560M Pro4/ac
Hardware Prefetcher
Automatically prefetch data and code for the processor. Enable for better
performance.
Adjacent Cache Line Prefetch
Automatically prefetch the subsequent cache line while retrieving the currently
requested cache line. Enable for better performance.
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4.6.2 Chipset Conguration
Primary Graphics Adapter
Select a primary VGA.
Above 4G Decoding
Enable or disable 64bit capable Devices to be decoded in Above 4G Address Space
(only if the system supports 64 bit PCI decoding).
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VT-d
Intel® Virtualization Technology for Directed I/O helps your virtual machine
monitor better utilize hardware by improving application compatibility and
reliability, and providing additional levels of manageability, security, isolation, and
I/O performance.
SR-IOV Support
If system has SR-IOV capable PCIe Devices, this option Enables or Disables Single
Root IO Virtualization Support.
DMI Link Speed
Congure DMI Slot Link Speed. Auto mode is optimizing for overclock ing.
PCIE1 Link Speed
Select the link speed for PCIE1.
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PCIE2 Link Speed
Select the link speed for PCIE2.
PCIE3 Link Speed
Select the link speed for PCIE3.
PCI Express Native Control
Select Enable for enhanced PCI Express power saving in OS.
PCIE ASPM Support
is option enables/disables the ASPM support for all CPU downstream devices.
PCH PCIE ASPM Support
is option enables/disables the ASPM support for all PCH PCIE devices.
DMI ASPM Support
is option enables/disables the control of ASPM on CPU side of the DMI Link.
PCH DMI ASPM Support
is option enables/disables the ASPM support for all PCH DMI devices.
B560M Pro4/ac
Share Memory
Congure the size of memory that is allocated to the integrated graphics processor when
the system boots up.
IGPU Multi-Monitor
Select disable to disable the integrated graphics when an external graphics card is installed.
Select enable to keep the integrated graphics enabled at all times.
Inte(R) Ethernet Connection I219-V
Enable or disable the onboard network interface controller (Intel® I219V).
Onboard HD Audio
Enable/disable onboard HD audio. Set to Auto to enable onboard HD audio and
automatically disable it when a sound card is installed.
Front Panel
Enable/disable front panel HD audio.
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Onboard HDMI HD Audio
Enable audio for the onboard digital outputs.
Onboard WAN Device
Use this item to enable or disable the onboard WAN device.
WAN Radio
Enable/disable the WiFi module's connectivity.
Bluetooth
Enable/disable the Bluetooth connectivity.
Deep Sleep
Congure deep sleep mode for power sav ing when the computer is shut down.
Restore on AC/Power Loss
Select the power state aer a power failure. If [Power O] is selected, the power will
remain o when the power recovers. If [Power On] is selected, the system will start
to boot up when the power recovers.
Turn On Onboard LED in S5
Turn on Onboard LED in the ACPI S5 state.
Restore Onboard LED Default
Restore Onboard LED default value.
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RGB LED
is option enables/disables the RGB LED.
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4.6.3 Storage Conguration
SATA Controller(s)
Enable/disable the SATA controllers.
B560M Pro4/ac
SATA Mode Selection
AHCI: Supports new features that improve performance.
SATA Aggressive Link Power Management
SATA Aggressive Link Power Management allows SATA devices to enter a low
power state during periods of inactivity to save power. It is only supported by AHCI
mode.
Hard Disk S.M.A.R.T.
S.M.A.R.T stands for Self-Monitoring, Analysis, and Reporting Technolog y. It is a
monitoring system for computer hard disk drives to detect and report on various
indicators of reliability.
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4.6.4 Intel® Thunderbolt
Discrete Thunderbolt(TM) Support
Enable or disable the Discrete underbolt(TM) Support.
Thunderbolt Boot Support
Enabled to allow booting from Bootable devices which are present behind
underbolt.
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Thunderbolt Usb Support
Enabled to allow booting from Usb devices which are present behind underbolt.
Titan Ridge Workaround for OSUP
Enable or disable Titan Ridge Workaround for OSUP.
Windows 10 Thunderbolt support
Specif y Windows 10 underbolt support level.
Disabled: No OS native support.
Enabled: OS Native support only. no RTD3.
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4.6.5 Super IO Conguration
PS2 Y-Cable
Enable the PS2 Y-Cable or set this option to Auto.
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4.6.6 ACPI Conguration
Suspend to RAM
Select disable for ACPI suspend type S1. It is recommended to select auto for ACPI
S3 power saving.
PS/2 Keyboard S4/S5 Wakeup Support
Allow the system to be waked up by a PS/2 Keyboard in S4/S5.
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PCIE Devices Power On
Allow the system to be waked up by a PCIE device and enable wake on LAN.
I219 LAN Power On
Allow the system to be waked up by the Onboard Intel LAN.
RTC Alarm Power On
Allow the system to be waked up by the real time clock alarm. Set it to By OS to let
it be handled by your operating system.
USB Keyboard/Remote Power On
Allow the system to be waked up by an USB keyboard or remote controller.
USB Mouse Power On
Allow the system to be waked up by an USB mouse.
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4.6.7 USB Conguration
Legacy USB Support
Enable or disable Legacy OS Support for USB 2.0 devices. If you encounter USB
compatibility issues it is recommended to disable legacy USB support. Select UEFI
Setup Only to support USB devices under the UEFI setup and Windows/Linux
operating systems only.
B560M Pro4/ac
XHCI Hand-o
is is a workaround for OSes without XHCI hand-o support. e XHCI
ownership change should be claimed by XHCI driver.
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4.6.8 Trusted Computing
Security Device Support
Enable or disable BIOS support for security device.
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4.7 Tools
ASRock Polychrome RGB
Select LED lighting color.
B560M Pro4/ac
UEFI Tech Service
Contact ASRock Tech Service if you are having trouble with your PC. Please setup
network conguration before using UEFI Tech Service.
SSD Secure Erase Tool
All the SSD's listed that supports Secure Erase function.
NVME Sanitization Tool
Aer you Sanitize SSD, all user data will be permanently destroyed on the SSD and
cannot be recovered.
Instant Flash
Save UEFI les in your USB storage device and run Instant Flash to update your
UEFI.
Internet Flash - DHCP (Auto IP), Auto
ASRock Internet Flash downloads and updates the latest UEFI rmware version
from our servers for you. Please setup network conguration before using Internet
Flash.
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*For BIOS backup and recovery purpose, it is recommended to plug in your USB
pen drive before using this function.
Network Conguration
Use this to congure internet connection settings for Internet Flash.
Internet Setting
Enable or disable sound eects in the setup utility.
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UEFI Download Server
Select a server to download the UEFI rmware.
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4.8 Hardware Health Event Monitoring Screen
is section allows you to monitor the status of the hardware on your system,
including the parameters of the CPU temperature, motherboard temperature, fan
speed and voltage.
B560M Pro4/ac
Fan Tuning
Measure Fan Min Dut y Cycle.
Fan-Tastic Tuning
Select a fan mode for CPU Fan, or choose Customize to set 5 CPU temperatures and
assign a respective fan speed for each temperature.
CPU Fan 1 Setting
Select a fan mode for CPU Fan 1, or choose Customize to set 5 CPU temperatures
and assign a respective fan speed for each temperature.
CPU Fan 1 Step Up
Set the value of CPU Fan 1 Step Up.
CPU Fan 1 Step Down
Set the value of CPU Fan 1 Step Down.
CPU_FAN2 / W_PUMP Switch
Switch CPU_FAN2 / W_PUMP header function.
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CPU Fan 2 Control Mode
Select DC/PWM mode for CPU Fan 2.
CPU Fan 2 Setting
Select a fan mode for CPU Fan 2, or choose Customize to set 5 CPU temperatures and
assign a respective fan speed for each temperature.
CPU Fan 2 Temp Source
Select a fan temperature source for CPU Fan 2.
CPU Fan 2 Step Up
Set the value of CPU Fan 2 Step Up.
CPU Fan 2 Step Down
Set the value of CPU Fan 2 Step Down.
CHA_FAN1 / W_PUMP Switch
Select Chassis Fan 1 or Water Pump mode.
Chassis Fan 1 Control Mode
Select PWM mode or DC mode for Chassis Fan 1.
Chassis Fan 1 Setting
Select a fan mode for Chassis Fan 1, or choose Customize to set 5 CPU temperatures
and assign a respective fan speed for each temperature.
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Chassis Fan 1 Temp Source
Select a fan temperature source for Chassis Fan 1.
Chassis Fan 1 Step Up
Set the value of Chassis Fan 1 Step Up.
Chassis Fan 1 Step Down
Set the value of Chassis Fan 1 Step Down.
CHA_FAN2 / W_PUMP Switch
Select Chassis Fan 2 or Water Pump mode.
Chassis Fan 2 Control Mode
Select PWM mode or DC mode for Chassis Fan 2.
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Chassis Fan 2 Setting
Select a fan mode for Chassis Fan 2, or choose Customize to set 5 CPU temperatures
and assign a respective fan speed for each temperature.
Chassis Fan 2 Temp Source
Select a fan temperature source for Chassis Fan 2.
Chassis Fan 2 Step Up
Set the value of Chassis Fan 2 Step Up.
Chassis Fan 2 Step Down
Set the value of Chassis Fan 2 Step Down.
CHA_FAN3 / W_PUMP Switch
Select Chassis Fan 3 or Water Pump mode.
Chassis Fan 3 Control Mode
Select PWM mode or DC mode for Chassis Fan 3.
Chassis Fan 3 Setting
Select a fan mode for Chassis Fan 3, or choose Customize to set 5 CPU temperatures
and assign a respective fan speed for each temperature.
B560M Pro4/ac
Chassis Fan 3 Temp Source
Select a fan temperature source for Chassis Fan 3.
Chassis Fan 3 Step Up
Set the value of Chassis Fan 3 Step Up.
Chassis Fan 3 Step Down
Set the value of Chassis Fan 3 Step Down.
Case Open Feature
Enable or disable the feature of Case Open.
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4.9 Security Screen
In this section you may set or change the super visor/user password for the system.
You may also clear the user password.
Supervisor Password
Set or change the password for the administrator account. Only the administrator
has authority to change the settings in the UEFI Setup Utility. Leave it blank and
press enter to remove the password.
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User Password
Set or change the password for the user account. Users are unable to change the
settings in the UEFI Setup Utility. Leave it blank and press enter to remove the
password.
Secure Boot
Use this item to enable or disable support for Secure Boot.
Intel(R) Platform Trust Technology
Enable/disable Intel PTT in ME. Disable this option to use discrete TPM Module.
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4.10 Boot Screen
is section displays the available devices on your system for you to congure the
boot settings and the boot priority.
Fast Boot
Fast Boot minimizes your computer's boot time. In fast mode you may not boot
from an USB storage device. e VBIOS must support UEFI GOP if you are using
an external graphics card. Please notice that Ultra Fast mode will boot so fast that
the only way to enter this UEFI Setup Utility is to Clear CMOS or run the Restart to
UEFI utility in Windows.
B560M Pro4/ac
Boot From Onboard LAN
Allow the system to be waked up by the onboard LAN.
Setup Prompt Timeout
Congure the number of seconds to wait for the setup hot key.
Bootup Num-Lock
Select whether Num Lock should be turned on or o when the system boots up.
Boot Beep
Select whether the Boot Beep should be turned on or o when the system boots up. Please
note that a buzzer is needed.
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Full Screen Logo
Enable to display the boot logo or disable to show normal POST messages.
AddOn ROM Display
Enable AddOn ROM Display to see the AddOn ROM messages or congure the
AddOn ROM if you've enabled Full Screen Logo. Disable for faster boot speed.
Boot Failure Guard Message
If the computer fails to boot for a number of times the system automatically restores
the default settings.
CSM (Compatibility Support Module)
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CSM
Enable to launch the Compatibility Support Module. Please do not disable unless
you’re running a WHCK test.
Launch PXE OpROM Policy
Select UEFI only to run those that support UEFI option ROM only. Select Legacy
only to run those that support legacy option ROM only. Select Do not launch to not
execute both legacy and UEFI option ROM.
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Launch Storage OpROM Policy
Select UEFI only to run those that support UEFI option ROM only. Select Legacy
only to run those that support legacy option ROM only. Select Do not launch to not
execute both legacy and UEFI option ROM.
Other PCI Device ROM Priority
For PCI devices other than Network. Mass storage or Video denes which OpROM
to launch.
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4.11 Exit Screen
Save Changes and Exit
When you select this option the following message, “Save conguration changes
and exit setup?” will pop out. Select [OK] to save changes and exit the UEFI SETUP
UTILITY.
Discard Changes and Exit
When you select this option the following message, “Discard changes and exit
setup?” will pop out. Select [OK] to exit the UEFI SETUP UTILITY without saving
any changes.
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Discard Changes
When you select this option the following message, “Discard changes?” will pop
out. Select [OK] to discard all changes.
Load UEFI Defaults
Load UEFI default values for all options. e F9 key can be used for this operation.
Launch EFI Shell from lesystem device
Copy shellx64.e to the root directory to launch EFI Shell.
Page 97
Contact Information
If you need to contact ASRock or want to know more about ASRock, you’re welcome
to visit ASRock’s website at http://www.asrock.com; or you may contact your dealer
for further information. For technical questions, please submit a support request
form at https://event.asrock.com/tsd.asp
ASRock Incorporation
2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District,
Taipei City 112, Taiwan (R.O.C.)
ASRock EUROPE B.V.
Bijsterhuizen 11-11
6546 AR Nijmegen
e Netherlands
Phone: +31-24-345-44-33
Fax: +31-24-345-44-38
ASRock America, Inc.
13848 Magnolia Ave, Chino, CA91710
U.S.A.
Phone: +1-909-590-8308
Fax: +1-909-590-1026
Page 98
DECLARATION OF CONFORMITY
Per FCC Part 2 Section 2.1077(a)
Responsible Party Name: ASRock Incorporation
Address:
Phone/FaxNo:
hereby declares that the product
Product Name : Motherboard
13848 Magnolia Ave, Chino, CA91710
+1-909-590-8308/+1-909-590-1026
Model Number :
Conforms to the following specications:
FCC Part 15, Subpart B, Unintentional Radiators
Supplementary Information:
B560M Pro4/ac
is device complies with part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) is device may not cause harmful interference,
and (2) this device must accept any interference received, including interference
that may cause undesired operation.
James
Representative Person’s Name:
Signature :
Date :
May 12, 2017
Page 99
EU Declaration of Conformity
EMC —Directive 2014/30/EU (from April 20th, 2016)
ڛ
(EU conformity marking)
For the following equipment:
Motherboard
(Product Name)
B560M Pro4/ac/ ASRock
(Model Designation / Trade Name)
ASRock Incorporation
(Manufacturer Name)
2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District, Taipei City 112, Taiwan (R.O.C.)
(Manufacturer Address)
☐ EN 55022:2010/AC:2011 Class B EN 55024:2010/A1:2015
ڛ EN 55032:2012+AC:2013 Class B ڛ ڛ EN 61000-3-2:2014
ڛ RED
ڛ RoHS — Directive 2011/65/EU ڛ CE marking
Directive 2014/53/EU
EN 300 328 V2.1.1 EN 301 489-17 V3.1.1
☐ ☐
EN 301 893 V2.1.1 EN 301 489-3 V2.1.1
☐ EN 300 220 V3.1.1
LVD —Directive 2014/35/EU (from April 20th, 2016)
EN 60950-1 : 2011+ A2: 2013 EN 60950-1 : 2006/A12: 2011
ASRock EUROPE B.V.
(Company Name)
Bijsterhuizen 1111 6546 AR Nijmegen e Netherlands
(Company Address)
Person responsible for making this declaration:
(Name, Surname)
A.V.P
(Position / Title)
January 22, 2021
(Date)
P/N: 15G062264000AK V1.0
ڛ
EN 61000-3-3:2013
ڛ
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