No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium batter y adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com
Page 3
AUSTRALIA ONLY
Our goods come with guarantees that cannot be excluded under the Australian Consumer
Law. You are entitled to a replacement or refund for a major failure and compensation for
any other reasonably foreseeable loss or damage caused by our goods. You are also entitled
to have the goods repaired or replaced if the goods fail to be of acceptable quality and the
failure does not amount to a major failure. If you require assistance please call ASRock Tel
: +886-2-28965588 ext.123 (Standard International call charges apply)
e terms HDMI® and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.
INTEL END USER SOFTWARE LICENSE AGREEMENT
IMPORTANT - READ BEFORE COPYING, INSTALLING OR USING.
LICENSE. Licensee has a license under Intel ’s copyrights to reproduce Intel’s Soware
only in its unmodied and binary form, (with the accompanying documentation, the
“Soware”) for Licensee’s personal use only, and not commercial use, in connection with
Intel-based products for which the Soware has been provided, subject to the following
conditions:
(a) Licensee may not disclose, distribute or transfer any part of the So ware, and You agree
to prevent unauthorized copying of the Soware.
(b) Licensee may not reverse engineer, decompile, or disassemble the Soware.
(c) Licensee may not sublicense the Soware.
(d) e Soware may contain the soware and other intellectual property of third party
suppliers, some of which may be identied in, and licensed in accordance with, an enclosed
license.txt le or other text or le.
(e) Intel has no obligation to provide any support, technical assistance or updates for the
Soware.
OWNERSHIP OF SOFTWARE AND COPYRIGHTS. Title to all copies of the Soware
remains with Intel or its licensors or suppliers. e Soware is copyrighted and protected
by the laws of the United States and other countries, and international treaty provisions.
Licensee may not remove any copyright notices from the Soware. Except as otherwise
expressly provided above, Intel grants no express or implied right under Intel patents,
copyrights, trademarks, or other intellectual property rights. Transfer of the license terminates Licensee’s right to use the Soware.
DISCLAIMER OF WARRANTY. e Soware is provided “AS IS” without warranty of
any kind, EITHER EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION,
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.
LIMITATION OF LIABILITY. NEITHER INTEL NOR ITS LICENSORS OR SUPPLIERS
WILL BE LIABLE FOR ANY LOSS OF PROFITS, LOSS OF USE, INTERRUPTION OF
BUSINESS, OR INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAG-
Page 4
ES OF ANY KIND WHETHER UNDER THIS AGREEMENT OR OTHERWISE, EVEN
IF INTEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
LICENSE TO USE COMMENTS AND SUGGESTIONS. is Agreement does NOT
obligate Licensee to provide Intel with comments or suggestions regarding the Soware.
However, if Licensee provides Intel with comments or suggestions for the modication,
correction, improvement or enhancement of (a) the Soware or (b) Intel products or
processes that work with the Soware, Licensee grants to Intel a non-exclusive, worldwide,
perpetual, irrevocable, transferable, royalty-free license, with the right to sublicense, under
Licensee’s intellectual property rights, to incorporate or otherwise utilize those comments
and suggestions.
TERMINATION OF THIS LICENSE. Intel or the sublicensor may terminate this license
at any time if Licensee is in breach of any of its terms or conditions. Upon termination,
Licensee will immediately destroy or return to Intel all copies of the Soware.
THIRD PARTY BENEFICIARY. Intel is an intended beneciary of the End User License
Agreement and has the right to enforce all of its terms.
U.S. GOVERNMENT RESTRICTED RIGHTS. e Soware is a commercial item (as
dened in 48 C.F.R. 2.101) consisting of commercial computer so ware and commercial
computer soware documentation (as those terms are used in 48 C.F.R. 12.212), consistent
with 48 C.F.R. 12.212 and 48 C.F.R 227.7202-1 through 227.7202-4. You will not provide
the Soware to the U.S. Government. Contractor or Manufacturer is Intel Corporation,
2200 Mission College Blvd., Santa Clara, CA 95054.
EXPORT LAWS. Licensee agrees that neither Licensee nor Licensee’s subsidiaries will
export/re-export the Soware, directly or indirectly, to any country for which the U.S.
Department of Commerce or any other agency or department of the U.S. Government
or the foreign government from where it is shipping requires an export license, or other
governmental approval, without rst obtaining any such required license or approval. In
the event the Soware is exported from the U.S.A. or re-exported from a foreign destination by Licensee, Licensee will ensure that the distribution and export/re-export or import
of the Soware complies with all laws, regulations, orders, or other restrictions of the U.S.
Export Administration Regulations and the appropriate foreign government.
APPLICABLE LAWS. is Agreement and any dispute arising out of or relating to it will
be governed by the laws of the U.S.A. and Delaware, without regard to conict of laws
principles. e Parties to this Agreement exclude the application of the United Nations
Convention on Contracts for the International Sale of Goods (1980). e state and federal
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in those courts. A Party that obtains a judgment against the other Party in the courts identied in this section may enforce that judgment in any court that has jurisdiction over the
Parties.
Licensee’s specic rights may vary from country to country.
Page 5
CE Warning
is device complies with directive 2014/53/EU issued by the Commision of the European
Community.
is equipment complies with EU radiation exposure limits set forth for an uncontrolled
environment.
is equipment should be installed and operated with minimum distance 20cm between
the radiator & your body.
Operations in the 5.15-5.35GHz band are restricted to indoor usage only.
Radio transmit power per transceiver type
FunctionFrequencyMaximum Output Power (EIRP)
2400-2483.5 MHz18.5 + / -1.5 dbm
5150-5250 MHz21.5 + / -1.5 dbm
WiFi
Bluetooth2400-2483.5 MHz8.5 + / -1.5 dbm
5250-5350 MHz
5470-5725 MHz
18.5 + / -1.5 dbm (no TPC)
21.5 + / -1.5 dbm (TPC)
25.5 + / -1.5 dbm (no TPC)
28.5 + / -1.5 dbm (TPC)
Page 6
Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 7
1.4 I/O Panel 9
1.5 WiFi-802.11ac Module and ASRock WiFi 2.4/5 GHz
Antennas 10
Chapter 2 Installation 12
2.1 Installing the CPU 13
2.2 Installing the CPU Fan and Heatsink 16
2.3 Installing Memory Modules (DIMM) 17
2.4 Expansion Slots (PCI Express Slots) 19
2.5 Jumpers Setup 21
2.6 Onboard Headers and Connectors 22
2.7 CrossFireXTM and Quad CrossFireXTM Operation Guide 27
2.7.1 Installing Two CrossFireXTM-Ready Graphics Cards 27
3.2.2 Using ASRock Motherboard Utility (A-Tuning) 37
3.3 ASRock Live Update & APP Shop 40
3.3.1 UI Overview 40
3.3.2 Apps 41
3.3.3 BIOS & Drivers 44
3.3.4 Setting 45
3.4 Nahimic Audio 46
3.5 ASRock Polychrome SYNC 47
Chapter 4 UEFI SETUP UTILITY 50
4.1 Introduction 50
4.2 EZ Mode 51
4.3 Advanced Mode 52
4.3.1 UEFI Menu Bar 52
4.3.2 Navigation Keys 53
4.4 Main Screen 54
4.5 OC Tweaker Screen 55
4.6 Advanced Screen 67
4.6.1 CPU Conguration 68
4.6.2 Chipset Conguration 70
4.6.3 Storage Conguration 73
4.6.4 Intel® Thunderbolt 74
4.6.5 Super IO Conguration 75
4.6.6 ACPI Conguration 76
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4.6.7 USB Conguration 77
4.6.8 Trusted Computing 78
4.7 Tools 79
4.8 Hardware Health Event Monitoring Screen 81
4.9 Security Screen 84
4.10 Boot Screen 85
4.11 Exit Screen 88
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Chapter 1 Introduction
ank you for purchasing ASRock B560M Pro4/ac motherboard, a reliable
motherboard produced under ASRock ’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock ’s
commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
Becau se the motherboard specication s and the BIOS soware might be upd ated, the
content of this documentation will be subject to change without notice. In case any
modications of this documentation occur, the updated version w ill be available on
ASRock’s website without further notice. If you require technical support related to
this motherboard, plea se visit our webs ite for specic information about the model
you are using. You may nd the latest VGA cards and CPU support li st on ASRock’s
website a s well. ASRock website http://www.asrock.com.
1.1 Package Contents
ASRock B560M Pro4/ac Motherboard (Micro ATX Form Factor)
•
ASRock B560M Pro4/ac Quick Installation Guide
•
ASRock B560M Pro4/ac Support CD
•
2 x Serial ATA (SATA) Data Cables (Optional)
•
2 x ASRock WiFi 2.4/5 GHz Antennas (Optional)
•
2 x Screws for M.2 Sockets (Optiona l)
•
1 x Stando for M.2 Socket (Optiona l)
•
1 x I/O Panel Shield
•
B560M Pro4/ac
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1.2 Specications
Platform
CPU
Chipset
Memory
•
•
•
•
•
•
•
•
•
•
•
* 11th Gen Intel® CoreTM (i9/i7/i5) support DDR4 up to 2933;
CoreTM (i3), Pentium® and Celeron® support DDR4 up to 2666.
* 10th Gen Intel® CoreTM (i9/i7) support DDR4 up to 2933;
CoreTM (i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
•
•
•
Micro ATX Form Factor
Solid Capacitor design
Suppor ts 10th Gen Intel® CoreTM Processors and 11th Gen
Intel® CoreTM Processors (LGA1200)
Digi Power design
8 Power Phase design
Supports Intel® Turbo Boost Max 3.0 Technology
Intel® B560
Dual Channel DDR4 Memory Technology
4 x DDR4 DIMM Slots
11th Gen Intel® CoreTM Processors support DDR4 non-ECC,
un-buered memory up to 4800+(OC)*
10th Gen Intel® CoreTM Processors support DDR4 non-ECC,
un-buered memory up to 4600+(OC)*
Supports ECC UDIMM memory modules (operate in non-
ECC mo de)
Max. capacity of system memor y: 128GB
Supports Intel® Extreme Memory Prole (XMP) 2.0
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2
Expansion
Slot
11th Gen Intel® CoreTM Processors
2 x PCI Express x16 Slots (PCIE1/PCIE3: single at Gen4x16
•
(PCIE1); dual at Gen4x16 (PCIE1) / Gen3x4 (PCIE3))
10th Gen Intel® CoreTM Processors
2 x PCI Express x16 Slots (PCIE1/PCIE3: single at Gen3x16
•
(PCIE1); dual at Gen3x16 (PCIE1) / Gen3x4 (PCIE3))
* Supports NVMe SSD as boot disks
1 x PCI Express 3.0 x1 Slot
•
Supports AMD Quad CrossFireXTM and CrossFireXTM
•
1 x M.2 Socket (Key E), supports type 2230 WiFi/BT module
•
and Intel® CNVi (Integrated WiFi/BT)
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Graphics
Intel® UHD Graphics Built-in Visuals and the VGA outputs
•
can be supported only with processors which are GPU
integrated.
11th Gen Intel® CoreTM Processors support Intel® Xe Graphics
•
Architecture (Gen 12). 10th Gen Intel® CoreTM Processors
support Gen 9 Graphics
Graphics, Media & Compute: Microso Direct X 12, OpenGL
•
4.5, Intel® Built In Visuals, Intel® Quick Sync Video, Hybrid /
Switchable Graphics, OpenCL 2.1
Display & Content Security: Rec. 2020 (Wide Color Gamut),
•
Microso PlayReady 3.0, UHD/HDR Blu-ray Disc
Supports HDMI 2.0 with max. resolution up to 4K x 2K
•
(4096x2160) @ 60Hz
Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and
•
HBR (High Bit Rate Audio) with HDMI 2.0 Port (Compliant
HDMI monitor is required)
Supports HDCP 2.3 with HDMI 2.0 Port
•
Supports 4K Ultra HD (UHD) playback with HDMI 2.0 Port
•
* 11th Gen Intel® CoreTM Processors support HDMI 2.0. 10th Gen
Intel® CoreTM Processors support HDMI 1.4.
B560M Pro4/ac
Audio
LAN
Wireless
LAN
7.1 CH HD Audio (Realtek ALC897 Audio Codec)
•
Supports Surge Protection
•
Nahimic Audio
•
Gigabit LAN 10/100/100 0 Mb/s
•
Giga PHY Intel® I219V
•
Supports Wake-On-LAN
•
Supports Lightning/ESD Protection
•
Supports Energy Ecient Ethernet 802.3az
•
Supports PXE
•
Intel® 802.11ac WiFi Module
•
Supports IEEE 802.11a/b/g/n/ac
•
Supports Dual-Band (2.4/5 GHz)
•
Supports high speed wireless connections up to 433Mbps
•
Supports Bluetooth 5.1 + High speed class II
•
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Rear Panel
I/O
Storage
Connector
2 x Antenna Ports
•
1 x PS/2 Mouse/Keyboard Port
•
1 x HDMI Port
•
4 x USB 3.2 Gen1 Ports (Supports ESD Protection)
•
2 x USB 2.0 Ports (Supports ESD Protection)
•
1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
•
LED)
HD Audio Jacks: Line in / Front Speaker / Microphone
•
6 x SATA3 6.0 Gb/s Connectors, support Intel Rapid Storage
•
Technology 18, NCQ, AHCI and Hot Plug*
* If M2_2 is occupied by a SATA-type M.2 device, SATA3_1
will be disabled.
1 x Hyper M.2 Socket (M2_1), supports M Key type
•
2242/2260/2280 M.2 PCI Express module up to Gen4x4
(64 Gb/s) (Only supported with 11th Gen Intel® Core™ Proces-
sors) **
1 x Ultra M.2 Socket (M2_2), supports M Key type 2280 M.2
•
SATA3 6.0 Gb/s module and M.2 PCI Express module up to
Gen3 x4 (32 Gb/s)**
** Supports NVMe SSD as boot disks
** Supports ASRock U.2 Kit
1 x SPI TPM Header
•
1 x Chassis Intrusion and Speaker Header
•
2 x RGB LED Headers
•
* Support in total up to 12V/3A, 36W LED Strip
2 x Addressable LED Headers
•
* Support in total up to 5V/3A, 15W LED Strip
1 x CPU Fan Connector (4-pin)
•
* e CPU Fan Connector supports the CPU fan of maximum
1A (12W) fan power.
1 x CPU/Water Pump Fan Connector (4-pin) (Smart Fan
•
Speed Control)
* e CPU/Water Pump Fan supports the water cooler fan of
maximum 2A (24W) fan power.
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BIOS
Feature
3 x Chassis/Water Pump Fan Connectors (4-pin) (Smart Fan
•
Speed Control)
* e Chassis/Water Pump Fan supports the water cooler fan of
maximum 2A (24W) fan power.
* CPU_FAN2/WP, CHA_FAN1/WP, CHA_FAN2/WP and
CHA_FAN3/WP can auto detect if 3-pin or 4-pin fan is in use.
1 x 24 pin ATX Power Connector
•
1 x 8 pin 12V Power Connector (Hi-Density Power
•
Connec tor)
1 x Front Panel Audio Connector
•
1 x underbolt AIC Connector (5-pin) (Supports ASRock
•
underbolt 4 AIC Card)
2 x USB 2.0 Headers (Support 4 USB 2.0 ports) (Supports
•
ESD Protection)
1 x USB 3.2 Gen1 Header (Supports 2 USB 3.2 Gen1 ports)
•
(Supports ESD Protection)
1 x Front Panel Type C USB 3.2 Gen1 Header (Supports ESD
•
Protection)
AMI UEFI Legal BIOS with multilingual GUI support
•
ACPI 6.0 Compliant wake up events
•
SMBIOS 2.7 Support
•
CPU Core/Cache, GT, DRAM, VPPM, VCCIN AUX ,
•
VCCSA ,VCCIO Multi-adjustment
B560M Pro4/ac
Hardware
Monitor
Fan Tachometer: CPU, CPU/Water Pump, Chassis/Water
•
Pump Fans
Quiet Fan (Auto adjust chassis fan speed by CPU tempera-
Fan Multi-Speed Control: CPU, CPU/Water Pump, Chassis/
•
Water Pump Fans
CASE OPEN detection
•
Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore, DRAM,
•
VPPM, VCCIN AUX, VCCSA, VCCIO, CPU PLL Voltage
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Page 14
Microso® Windows® 10 64-bit
OS
Certications
* For detailed product infor mation, please vis it our website: http://www.asrock .com
Please realize that there is a certain risk involved with overcl ocking, including
adjusting the setting in th e BIOS, applying Untie d Overclocking Technology, or using
third-party overclocking tools . Overclocking may aect your system’s stability, or
even cause damage to the components and devices of your system. It should be done
at your own risk and expense. We are not responsible for possible damage caused by
overclocking.
•
FCC, CE
•
ErP/EuP Ready (ErP/EuP ready power supply is required)
•
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1.3 Motherboard Layout
Intel
B560
ATXP WR1
HDLED RESET
PLED PWRBTN
PANEL1
1
1
1
RoHS
2
CPU_FAN1
3
1
PCIE1
1
12
DDR4 _A2 (64 b it, 288 -pin mo dule)
DDR4 _A1 (64 b it, 288 -pin mo dule)
DDR4 _B2 (64 b it, 288 -pin mo dule)
DDR4 _B1 (64 b it, 288 -pin mo dule)
6
ATX12V1
USB3_5_ 6
11
CLRMOS1
1
1
HD_AUDIO1
Top:
RJ-45
CHA_FAN1/WP
PCIE3
8
9
4
USB5_6
1
24
27
PCIE2
29
1
USB 3.2 Gen1
T: USB3_4
B: USB3_3
M2_W IFI
Top:
LINE I N
Cent er:
FRON T
Bott om:
MIC IN
USB2. 0
T: USB1
B: USB 2
PS2
Keybo ard
/Mous e
RGB_LED1
1
ADDR_LED1
7
1
SPI_TPM_J1
T B1
1
ADDR_LED2
1
RGB_LED2
1
CHA_FAN3/WP
23
26
USB3_4
CPU_FAN2/WP
13
14
SATA3_1
M2_2
USB 3.2 Gen1
T:
USB3_2
B:
USB3_1
15
16
20
19
18
28
M2_1
CMOS
Battery
5
SATA3_2
SATA3_3
SATA3_4
SATA3_5
F_USB 3_T C_1
10
SATA3_0
17
BIOS
ROM
25
CHA_FAN2/WP
22
SPK_CI1
1
21
HDMI 1
LAN
AUDIO
CODEC
WiFi-802.11ac
Module
PSC
DRAM
CPU
VGA
BOOT
B560M Pro4/ac
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Page 16
No. Description
1ATX 12V Power Connector (ATX12V1)
22 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
32 x 288-pin DDR4 DIMM Slots (DDR4_A2, DDR4_B2)
4CPU/Water Pump Fan Connector (CPU_FAN2/WP)
5CPU Fan Connector (CPU_FAN1)
6RGB LED Header (RGB_LED1)
7Addressable LED Header (ADDR_LED1)
8ATX Power Connector (ATXPWR1)
9USB 3.2 Gen1 Header (USB3_5_6)
10 Front Panel Type C USB 3.2 Gen1 Header (F_USB3_TC_1)
11 SATA3 Connector (SATA3_2)(Upper)
12 SATA3 Connector (SATA3_3)(Lower)
13 SATA3 Connector (SATA3_5)(Lower)
14 SATA3 C onnector (SATA 3_ 4)(Upper)
15 System Panel Header (PANEL1)
16 SATA3 Connector (SATA3_1)
17 SATA3 Connector (SATA3_0)
18 SPI TPM Header (SPI_TPM_J1)
19 USB 2.0 Header (USB5_6)
20 USB 2.0 Header (USB3_4)
21 Chassis Intrusion and Speaker Header (SPK_CI1)
22 Chassis/Water Pump Fan Connector (CHA _FAN2/WP)
23 Chassis/Water Pump Fan Connector (CHA _FAN3/WP)
** Function of the Audio Ports in 7.1-channel Conguration:
PortFunction
Light Blue (Rear panel)Rear Speaker Out
Lime (Rear panel)Front Speaker Out
Pink (Rear panel)Central /Subwoofer Speaker Out
Lime (Front panel)Side Speaker Out
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1.5 WiFi-802.11ac Module and ASRock WiFi 2.4/5 GHz
Antennas
WiFi-802.11ac + BT Module
is motherboard comes with an exclusive WiFi 802.11 a/b/g/n/ac + BT v5.1 module
that oers support for WiFi 802.11 a/b/g/n/ac connectivity standards and Bluetooth
v5.1. WiFi + BT module is an easy-to-use wireless loca l area network (WLAN) adapter
to support WiFi + BT. Bluetooth v5.1 standard features Smart Ready technology that
adds a whole new class of functionality into the mobile devices. BT 5.1 also includes
Low Energy Technology and ensures extraordinary low power consumption for PCs.
* e transmission speed may vary according to the environment.
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WiFi Antennas Installation Guide
B560M Pro4/ac
Step 1
Prepare the WiFi 2.4/5 GHz Antennas that come
with the package.
Step 2
Connect the two WiFi 2.4/5 GHz Antennas to
the antenna connectors. Turn the antenna clock-
wise until it is securely connected.
Step 3
Set the WiFi 2.4/5 GHz Antenna as shown in the
illustration.
*You may need to adjust the direction of
the antenna for a stronger signal.
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Chapter 2 Installation
is is a Micro ATX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
Make sure to unplug the power cord before installing or removing the motherboard
•
components. Failure to do so may cause physical injuries and damages to motherboard
components.
In order to avoid damage from static electricity to the motherboard’s components,
•
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
Hold components by the edges and do not touch the ICs.
•
Whenever you uninstall any components, place them on a grounded anti-static pad or
•
in the bag that comes with the components.
When placing screws to secure the motherboard to the chassis, please do not over-
•
tighten the screws! Doing so may damage the motherboard.
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2.1 Installing the CPU
1
1. Before you insert the 1200-Pin CPU into the socket, please check if the P nP cap is on the
socket, if the CPU surface is unclean, or if the re are any bent pins in the socket. Do not
force to in sert the CPU into the socket if above situation is found. Otherwise, the CPU
will be seriously damaged.
2. Unplug all power c ables before installing the CPU.
B560M Pro4/ac
A
B
2
13
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3
5
4
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Please save and replace the cover if the processor is removed. e cover must be placed if
you wish to return the motherboard for aer service.
B560M Pro4/ac
15
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Page 24
2.2 Installing the CPU Fan and Heatsink
12
English
16
CPU_FAN
Page 25
2.3 Installing Memory Modules (DIMM)
is motherboard provides four 288-pin DDR4 (Double Data Rate 4) DIMM slots,
and supports Dual Channel Memory Technology.
1. For dual channe l conguration, you always nee d to insta ll identical (the same
brand, speed, size and chip-ty pe) DDR4 DIMM pairs.
2. It is unable to activate Dual Channel Me mory Technology with only one or three
memory module installed.
3. It is not allowed to in stall a DDR, DDR2 or DDR3 memory module into a DDR4
slot; otherwise, thi s motherboard and DIMM may be damaged.
e DIMM only ts in one correct orientation. It will cause permanent damage to
the motherboard and the DIMM if you force the DIMM into the slot at incorrect
orientation.
B560M Pro4/ac
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1
2
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18
3
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2.4 Expansion Slots (PCI Express Slots)
ere are 3 PCI Express slots on the motherboard.
Before installing an expansion c ard, please mak e sure that the powe r supply is
switched o or the power cord i s unplug ged. Please read the documentation of the
expan sion card and mak e necessary hardware settings for the card before you star t
the installation.
PCIe slots:
11th Gen Intel® CoreTM Processors:
PCIE1 (PCIe 4.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
PCIE2 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE3 (PCIe 3.0 x16 slot) is used for PCI Express x4 lane width graphics cards.
PCIe slots:
10th Gen Intel® CoreTM Processors:
PCIE1 (PCIe 3 .0 x16 slot) is used for PCI Express x16 lane width graphics cards.
PCIE2 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE3 (PCIe 3.0 x16 slot) is used for PCI Express x4 lane width graphics cards.
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Page 28
PCIe Slot Congurations
11th Gen Intel® CoreTM Processors:
PCIE1PCIE3
Single Graphics CardGen4x16N/A
Two Graphics Cards in
CrossFireXTM Mode
Gen4x16Gen3x4
10th Gen Intel® CoreTM Processors:
PCIE1PCIE3
Single Graphics CardGen3x16N/A
Two Graphics Cards in
CrossFireXTM Mode
For a better ther mal environment , please conne ct a chassis fan to the motherboard’s
chassis fan connector (CHA_FAN1/W P, CHA_FAN2/WP or CHA_FAN3/WP) when
using multiple graphics cards.
Gen3x16Gen3x4
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2.5 Jumpers Setup
e illustration shows how jumpers are setup. When the jumper cap is placed on
the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is
“O pen”.
Clear CMOS Jumper
(CLR MOS1)
(see p.7, No. 25)
CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system
parameters to default setup, please turn o the computer and unplug the power
cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to
short the pins on CLRMOS1 for 5 seconds. However, please do not clear the
CMOS right aer you update the BIOS. If you need to clear the CMOS when you
just nish updating the BIOS, you must boot up the system rst, and then shut it
down before you do the clear-CMOS action. Please be noted that the password,
date, time, and user default prole will be cleared only if the CMOS battery is
removed. Please remember toremove the jumper cap aer clearing the CMOS.
2-pin Jumper
B560M Pro4/ac
If you clear the CMOS, the case open may be detected. Please adjus t the BIOS option
“Clear Status” to cl ear the record of prev ious chassis intru sion status.
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Page 30
2.6 Onboard Headers and Connectors
1
1
+5V
DUMMY
SIGNAL
GND
DUMMY
SPEAKER
DUMMY
Onboard headers and connectors are NOT jumpers. Do NOT pla ce jumper caps over
these headers and connectors. Placing jumper caps over the headers and connectors
will cause permanent damage to the motherboard.
System Panel Header
(9-p in PA NE L1)
(see p.7, No. 15)
PWRBTN (Power Swi tch):
Connec t to the power switch on the chassis f ront panel. You may congure the way to
turn o your system using the power sw itch.
RESET (Reset Sw itch):
Connec t to the reset switch on the chassis f ront panel. Pre ss the reset switch to restart
the computer if the computer f reezes and fails to per form a normal restart.
PLED (Syste m Power LED):
Connec t to the power status indicator on the chassi s front panel. e LED is on when
the system is operating. e LED keeps blinking whe n the system is in S1/S3 sle ep
state. e LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive ac tivity LED on the chassis f ront panel. e LED is on
when the hard drive is reading or writing data.
e front panel design may dier by chassis . A front panel module mainly consists
of power s witch, reset switch, power LED, hard drive ac tivity LED, speaker and etc.
When connecting your cha ssis front panel modul e to this header, make sure the wire
assig nments and the pin assignments are matched correc tly.
PLED+
PLED-
HDLED-
HDLED+
PWRBTN#
GND
RESET#
GND
GND
Connect the power
switch, reset switch and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
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22
Chassis Intrusion and
Speaker Header
(7-pi n SPK_C I1)
(see p.7, No. 21)
Please connect the
chassis intrusion and the
chassis speaker to this
header.
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B560M Pro4/ac
ype-C Cable
DUMMY
GND
GND
P+
P-
USB_PWR
P+
P-
USB_PWR
1
Serial ATA3 Connectors
Ver ti ca l:
(SATA3_0:
see p.7, No. 17)
(SATA3_1:
see p.7, No. 16)
Right Angle:
(SATA3_2:
see p.7, No. 11)(Upper)
(SATA3_3:
see p.7, No. 12)(Lower)
(SATA3_4:
see p.7, No. 14)(Upper)
(SATA3_5:
see p.7, No. 13)(Lower)
USB 2.0 Headers
(9-pin USB3_4)
(see p.7, No. 20)
(9-pin USB5_6)
(see p.7, No. 19)
USB 3.2 Gen1 Header
(19-pin USB3_5_6)
(see p.7, No. 9)
SATA3_2
SATA3_4
SATA3_0 SATA3_1
VbusVbus
IntA_PB_SSRX-
Vbus
IntA_PA_SSRX-
IntA_PA_SSRX+
IntA_PA_SSTX-
IntA_PA_SSTX+
IntA_PA_D-
IntA_PA_D+
IntA_PB_SSRX+
GND
IntA_PB_SSTX-
GND
IntA_PB_SSTX+
GND
IntA_PB_D-
GND
IntA_PB_D+
Dummy
1
ese six SATA3
connectors support SATA
SATA3_3
data cables for interna l
storage devices with up to
6.0 Gb/s data transfer rate.
SATA3_5
*If M2_ 2 is occupied by
a SATA-type M.2 device,
SATA3_1 will be disabled.
ere are two USB
2.0 headers on this
motherboard.Each USB
2.0 header can support
two ports.
ere is one USB 3.2
Gen1 header on this
motherboard. is USB
3.2 Gen1 header can
support two ports.
Front Panel Type C USB
3.2 Gen1 Header
(20-pin F_USB3_TC_1)
(see p.7, No. 10)
USB T
ere is one Front
Panel Type C USB 3.2
Gen1 Header on this
motherboard. is header
is used for connecting a
USB 3.2 Gen1 module for
additional USB 3.2 Gen1
ports.
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Front Panel Audio Header
J_SENSE
OUT2_L
1
MIC_RET
PRESENCE#
GND
OUT2_R
MIC2_R
MIC2_L
OUT_RET
D
F
4 3 2 1
GND
1
FAN_SPEED_CONTROL
1 2 3 4
(9-pin HD_AUDIO1)
(see p.7, No. 28)
1. High De nition Audio supports Ja ck Sensing, but the panel wire on the chassi s
must support HDA to function corre ctly. Plea se follow the instructions in our
manual and chas sis manual to install your system.
2. If you use an AC’97 audio panel, please install it to the front panel audio header by
the steps below:
A. Connect Mic_ IN (MIC) to MIC2_ L.
B. Conne ct Audio_R (RIN) to OUT2 _R and Audio_ L (LIN) to OUT2_ L.
C. Connect Ground (GND) to Ground (GND).
D. MIC_ RET and OUT_RET are for the HD audio panel only. You don’t need to
connec t them for the AC’97 audio panel .
E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel
and adjust “Recording Volume”.
is header is for
connecting audio devices
to the front audio panel.
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Chassis/Water Pump Fan
Connectors
(4-pin CHA_FAN1/WP)
(see p.7, No. 29)
(4-pin CHA_FAN2/WP)
(see p.7, No. 22)
(4-pin CHA_FAN3/WP)
(see p.7, No. 23)
CPU Fan Connector
(4-pin CPU_FAN1)
(see p.7, No. 5)
FAN_VOLTAGE
2
CHA_FAN_SPEED
3
FAN_SPEED_CONTROL
4
AN_SPEED_CONTROL
CHA_FAN_SPEED
CPU_FAN_SPEED
FAN_VOLTAGE
+12V
GND
is motherboard
provides three 4-Pin water
cooling
chassis
connectors. If you plan to
connect a 3-Pin
water cooler fan, please
connect it to Pin 1-3.
GN
is motherboard pro-
vides a 4-Pin CPU fan
(Quiet Fan) connector.
If you plan to connect a
3-Pin CPU fan, please
connect it to Pin 1-3.
fan
chassis
Page 33
B560M Pro4/ac
FAN_SPEED_CONTROL
1 2 3 4
4
1
8 5
1
SPI_DQ3
CPU/Water Pump Fan
Connector
(4-pin CPU_FAN2/WP)
(see p.7, No. 4)
ATX Power Connector
(24-pin AT XPWR 1)
(see p.7, No. 8)
ATX 12V Power
Connector
(8-pin ATX12V1)
(see p.7, No. 1)
CPU_FAN_SPEED
FAN_VOLTAGE
GND
12
1
is motherboard
provides a 4-Pin water
cooling CPU fan
connector. If you plan
to connect a 3-Pin CPU
water cooler fan, please
connect it to Pin 1-3.
24
is motherboard pro-
vides a 24-pin ATX power
connector. To use a 20-pin
ATX power supply, please
plug it along Pin 1 and Pin
13
13.
is motherboard pro-
vides a 8-pin ATX 12V
power connector. To use a
4-pin ATX power supply,
please plug it along Pin 1
and Pin 5.
*Warning: Please make
sure that the power cable
connected is for the CPU
and not the graphics
card. Do not plug the
PCIe power cable to this
connec tor.
SPI TPM Header
(13 -pi n SPI_TPM _ J1)
(see p.7, No. 18)
+3.3V
SPI_CS0
SPI_DQ2
Dummy
CLK
RSMRST#
SPI_MISO
SPI_MOSI
RST#
TPM_PIRQ
SPI_TPM_CS#
GND
is connector supports SPI
Trusted Platform Module (TPM)
system, which can securely
store keys, digital certicates,
passwords, and data. A TPM
system also helps enhance
network security, protects digital
identities, and ensures platform
integr it y.
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25
Page 34
underbolt AIC
1
DO_ADDR
D
1
1
B
DRAM
CPU
VGA
BOOT
Connector
(5-pin TB1)
(see p.7, No. 24)
Please connect a underbolt™
add-in card (AIC) to this
connector via the GPIO cable.
*Please install the underbolt™
AIC card to PCIE3 (default slot).
RGB LED Headers
(4-pin RGB _LED1)
(see p.7, No. 6)
(4-pi n RGB _LE D2)
(see p.7, No. 26)
Addressable LED Headers
(3-pin ADDR _LED1)
(see p.7, No. 7)
(3-pin ADDR _LED2)
(see p.7, No. 27)
R
G
+12V
1
+12V GRB
GND
VOUT
1
DO_ADDR
VOUT
ese two RGB LED headers are
used to connect RGB LED
extension cables which allow
users to choose from various LED
lighting eects.
Caution: Never install the RGB
LED cable in the wrong orienta-
tion; otherwise, the cable may
be damaged.
*Please refer to page 47 for for
further instructions on this
header.
ese two headers are used to
connect
Addressable
LED
extension cables which allow
users to choose from various LED
lighting eects.
Caution:Never install the
GN
Addressable LED cable in the
wrong orientation; otherwise,
the cable may be damaged.
*Please refer to page 48 for
further instructions on this
header.
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26
Post Status Checker
(see p.1)
Post Status Checker (PSC)
diagnoses the computer when
users power on the machine.
It emits a red light to indicate
whether the CPU, memory, VGA
or storage is dysfunctional. e
lights go o if the four mentioned
above are functioning normally.
Page 35
2.7 CrossFireXTM and Quad CrossFireXTM Operation Guide
is motherboard supports CrossFireXTM and Quad CrossFireXTM that allows you
to install up to three identical PCI Express x16 graphics cards.
1. You should only use identical CrossFireXTM-ready g raphics cards that are AMD
certied.
2. Make sure that your g raphics c ard driver supports AMD CrossFireXTM technology.
Download the dr ivers from the AMD’s website: www.amd.com
3. Make sure that your power supply unit (PSU) can provide at leas t the minimum
power your system requires. It is recommended to use a AM D certied PSU. Plea se
refer to the AMD’s website for details.
4. If you pair a 12-pipe CrossFireXTM Edition card with a 16-pipe card , both cards will
operate a s 12-pipe cards while in CrossFireXTM mode.
5. Dierent CrossFireXTM cards may require dierent methods to enable CrossFireXTM. Please refer to A MD graphics card manuals for detailed installation guide.
2.7.1 Installing Two CrossFireXTM-Ready Graphics Cards
Step 1
Insert one graphics card into PCIE1 slot
and the other graphics card to PCIE3 slot.
Make sure that the cards are properly
seated on the slots.
B560M Pro4/ac
CrossFire Bridge
Step 2
Connect two graphics cards by installing
a CrossFire Bridge on the CrossFire Bridge
Interconnects on the top of the graphics
cards. (e CrossFire Bridge is provided
with the graphics card you purchase, not
bundled with this motherboard. Please
refer to your graphics card vendor for
deta ils.)
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Page 36
Step 3
Connect a VGA/DVI/DP/HDMI cable
from the monitor to the corresponding
port on the graphics card installed to the
PCIE1 slot.
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28
Page 37
2.7.2 Driver Installation and Setup
Step 1
Power on your computer and boot into OS.
Step 2
Remove the AMD drivers if you have any VGA drivers installed in your system.
e Catalyst Uninstaller i s an optional dow nload . We re commend using this utilit y
to uninstall any previously installed Catalyst dr ivers prior to in stallation. Please
check A MD’s website for AMD dr iver updates.
Step 3
Install the required drivers and CATALYST Control Center then restart your
ere are ve sections in ASRock Motherboard Utility (A-Tuning) main menu:
Operation Mode, OC Tweaker, System Info, FAN-Tastic Tuning and Settings.
Operation Mode
Choose an operation mode for your computer.
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Page 46
OC Tweaker
Congurations for overclocking the system.
System Info
View information about the system.
*e System Browser tab may not appear for certain models.
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38
Page 47
B560M Pro4/ac
FAN-Tastic Tuning
Congure up to ve dierent fan speeds using the graph. e fans will automatically shi
to the next speed level when the assigned temperature is met.
Settings
Congure ASRock ASRock Motherboard Utility (A-Tuning). Click to select "Auto
run at Windows Startup" if you want ASRock Motherboard Utility (A-Tuning) to
be launched when you start up the Windows operating system.
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Page 48
3.3 ASRock Live Update & APP Shop
e ASRock Live Update & APP Shop is an online store for purchasing and
downloading soware applications for your ASRock computer. You can quickly and
easily install various apps and support utilities. With ASRock Live Update & APP
Shop, you can optimize your system and keep your motherboard up to date simply
with a few clicks.
Double-click on your desktop to access ASRock Live Update & APP Shop
utility.
*You need to be connected to the Internet to dow nload apps from the ASRock Live Update & APP Shop.
3.3.1 UI Overview
Category Panel
Hot News
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40
Information Panel
Category Panel: e category panel contains several category tabs or buttons that
when selected the information panel below displays the relative information.
Information Panel: e information panel in the center displays data about the
currently selected category and allows users to perform job-related tasks.
Hot News: e hot news section displays the various latest news. Click on the image
to visit the website of the selected news and know more.
Page 49
3.3.2 Apps
When the "Apps" tab is selected, you will see all the available apps on screen for you
to download.
Installing an App
Step 1
Find the app you want to install.
B560M Pro4/ac
e most recommended app appears on the le side of the screen. e other various
apps are shown on the right. Please scroll up and down to see more apps listed.
You can check the price of the app and whether you have already intalled it or not.
- e red icon displays the price or "Free" if the app is free of charge.
- e green "Installed" icon means the app is installed on your computer.
Step 2
Click on the app icon to see more details about the selected app.
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Page 50
Step 3
If you want to install the app, click on the red icon to start downloading.
Step 4
When installation completes, you can nd the green "Installed" icon appears on the
upper right corner.
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42
To uninstall it, simply click on the trash can icon .
*e trash icon may not appear for certain apps.
Page 51
Upgrading an App
You can only upgrade the apps you have already installed. When there is an
available new version for your app, you will nd the mark of "New Version"
appears below the installed app icon.
Step 1
Click on the app icon to see more details.
B560M Pro4/ac
Step 2
Click on the yellow icon to start upgrading.
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43
Page 52
3.3.3 BIOS & Drivers
Installing BIOS or Drivers
When the "BIOS & Drivers" tab is selected, you will see a list of recommended or
critical updates for the BIOS or drivers. Please update them all soon.
Step 1
Please check the item information before update. Click on to see more details.
Step 2
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44
Click to select one or more items you want to update.
Step 3
Click Update to start the update process.
Page 53
3.3.4 Setting
In the "Setting" page, you can change the language, select the server location, and
determine if you want to automatically run the ASRock Live Update & APP Shop
on Windows startup.
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45
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Page 54
3.4 Nahimic Audio
Nahimic audio soware provides an incredible high denition sound technology which
boosts the audio and voice performance of your system. Nahimic Audio interface is
composed of four tabs: Audio, Microphone, Sound Tracker and Settings.
ere are four functions in Nahimic audio :
No. Function Description
From this tab, you can mute the current audio device, choose
Audio
1
between four factory audio proles, turn all audio eects
on/o, restores the current prole to its default settings and
access Surround Sound and various features.
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46
Microphone
2
3
4
Sound
Tracker
Settings
From this tab, you can mute the current mic device, choose
between two factory mic proles, turn/o all microphone
eects, restore the current prole to its default settings, and
access Static Noise Suppression and various features.
e Sound Tracker provides a visual indication localizing
the sources of the sounds while in a game. ese are
represented by dynamic segments pointing the direction
of the sounds: the more opaque they are, the stronger the
sounds are.
From this tab, you can access all settings and information of
the soware.
Page 55
B560M Pro4/ac
1
B
3.5 ASRock Polychrome SYNC
ASRock Polychrome SYNC is a lighting control utility specically designed for unique indi-
viduals with sophisticated tastes to build their own stylish colorful lighting system. Simply by
connecting the LED strip, you can customize various lighting schemes and patterns, including
Static, Breathing, Strobe, Cycling, Music, Wave and more.
Connecting the LED Strip
Connect your RGB LED strips to the
motherboard.
RGB LED Headers (RGB_LED1 / RGB_LED2)
RGB_LED1
R
G
+12V
1
RGB_LED2
+12V GRB
on the
1
B
R
G
V
2
1
1. Never install the RGB LED cable in the w rong orientation; other wise, the cable
may be damaged.
2. Before installing or removing your RGB LED cable, plea se power o your system
and unplug the power cord from the power supply. Failure to do so may cause damages to motherboard components.
1. Plea se note that the RGB LED strips do not come with the package.
2. e RGB LED header support s standard 5050 RGB LED strip (12V/G/R/B), with a
maximum power rating of 3A (12V) and leng th within 2 meters.
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Connecting the Addressable RGB LED Strip
DO_ADDR
1
Connect your
ADDR _LED2)
Addressable RGB LED
on the motherboard.
strips to the
Addressable LED Headers (ADDR_LED1 /
ADDR_LED1
GND
VOUT
1
ADDR_LED2
GND
DO_ADDR
VOUT
1
1. Never install the RGB LED cable in the w rong orientation; other wise, the cable may be
damaged.
2. Before installing or removing your RGB LED cable, plea se power o your system and
unplug the power cord from the power supply. Failure to do so may cause damages to
motherboard components.
1. Plea se note that the RGB LED strips do not come with the package.
2. e RGB LED header support s WS2812B addressable RGB LED strip (5V/Data/
GND), with a ma ximum power rating of 3A (5V) and length within 2 meters.
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Page 57
ASRock Polychrome SYNC Utility
Now you can adjust the RGB LED color through the ASRock Polychrome SYNC Utility.
Download this utility from the ASRock Live Update & APP Shop and start coloring your
PC style your way!
Drag the tab to customize your
preference.
Toggle on/o the
RGB LED switch
Sync RGB LED eects
for all LED regions of
the motherboard
Select a RGB LED light eect
from the drop-down menu.
B560M Pro4/ac
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Page 58
Chapter 4 UEFI SETUP UTILITY
4.1 Introduction
is section explains how to use the UEFI SETUP UTILITY to congure your
system. You may run the UEFI SETUP UTILITY by pressing <F2> or <Del> right
aer you power on the computer, otherwise, the Power-On-Self-Test (POST) will
continue with its test routines. If you wish to enter the UEFI SETUP UTILITY aer
POST, restart the system by pressing <Ctl> + <Alt> + <Delete>, or by pressing the
reset button on the system chassis. You may also restart by turning the system o
and then back on.
Becau se the UEFI soware is cons tantly being updated, the following UEFI setup
screens and descriptions are for reference purpose only, and they may not e xactly
match what you see on your screen.
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Page 59
4.2 EZ Mode
e EZ Mode screen appears when you enter the BIOS setup program by default. EZ
mode is a dashboard which contains multiple readings of the system’s current status.
You can check the most crucial information of your system, such as CPU speed,
DRAM frequency, SATA information, fan speed, etc.
Press <F6> or click the "Advanced Mode" button at the upper right corner of the
screen to switch to "Advanced Mode" for more options.
B560M Pro4/ac
No.Function
Help
1
Load UEFI Defaults
2
Save Changes and Exit
3
Discard Changes
4
Change Language
5
Switch to Advanced Mode
6
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51
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4.3 Advanced Mode
e Advanced Mode provides more options to congure the BIOS settings. Refer to
the following sections for the detailed congurations.
To access the EZ Mode, press <F6> or click the "EZ Mode" button at the upper right
corner of the screen.
4.3.1 UEFI Menu Bar
e top of the screen has a menu bar with the following selections:
Main
OC Tweaker
Advanced
Tool
H/W Monitor
Security
Boot
Exit
For setting system time/date information
For overclocking congurations
For advanced system congurations
Useful tools
Displays current hardware status
For security settings
For conguring boot settings and boot priority
Exit the current screen or the UEFI Setup Utility
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52
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4.3.2 Navigation Keys
Use < > key or < > key to choose among the selections on the menu bar, and
use < > key or < > key to move the cursor up or down to select items, then
press <Enter> to get into the sub screen. You can also use the mouse to click your
required item.
Please check the following table for the descriptions of each navigation key.
Navigation Key(s) Description
B560M Pro4/ac
+ / -
<Tab>
<PGUP>
<PGDN>
<HOME>
<END>
<F1>
<F5>
<F7>
<F9>
<F10>
<F12>
<ESC>
To change option for the selected items
Switch to next function
Go to the previous page
Go to the next page
Go to the top of the screen
Go to the bottom of the screen
To display the General Help Screen
Add / Remove Favorite
Discard changes and exit the SETUP UTILITY
Load optimal default values for all the settings
Save changes and exit the SETUP UTILITY
Print screen
Jump to the Exit Screen or exit the current screen
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English
Page 62
4.4 Main Screen
When you enter the UEFI SETUP UTILITY, the Main screen will appear and
display the system overview.
e availability and location of BIOS set tings can be dierent for di erent models
and BIOS versions.
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54
My Favorite
Display your collection of BIOS items. Press F5 to add/remove your favorite items.
Page 63
4.5 OC Tweaker Screen
In the OC Tweaker screen, you can set up overclocking features.
B560M Pro4/ac
Becau se the UEFI soware is cons tantly being updated, the following UEFI setup
screens and descriptions are for reference purpose only, and they may not e xactly
match what you see on your screen.
CPU Conguration
CPU Ratio
e CPU speed is determined by the CPU Ratio multiplied with the BCLK.
Increasing the CPU Ratio will increase the internal CPU clock speed without
aecting the clock speed of other components.
AVX2 Ratio Oset
AVX2 Ratio Oset species a negative oset from the CPU Ratio for AVX
workloads. AVX is a more stressful workload that lower the AVX ratio to ensure
maximum possible ratio for SSE workloads.
AVX-512 Ratio Oset
AVX-512 Ratio Oset species a negative oset from the CPU Ratio for AVX-512
workloads. AVX-512 is a more stressful workload that lower the AVX ratio to ensure
maximum possible ratio for SSE workloads.
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Page 64
CPU Cache Ratio
e CPU Internal Bus Speed Ratio. e ma ximum should be the same as the CPU
Ratio.
GT Frequency
Congure the integrated GPU Frequency.
BCLK Spread Spectrum Mode
Enable Spread Spectrum to reduce electromagnetic interference for passing EMI
tests. Disable to achieve higher clock speeds when overclocking.
BCLK Aware Adaptive Voltage
BCLK Aware Adaptive Voltage enable/disable. When enabled, pcode will be aware
of the BCLK frequency when calculating the CPU V/F cur ves. is is ideal for
BCLK OC to avoid high voltage overrides.
Boot Performance Mode
Select the performance state that the BIOS will set before OS hando.
Ring to Core Ratio Oset
Disable Ring to Core Ratio Oset so the ring and core can run at the same fre-
quenc y.
PVD Ratio Threshold
Select PVD Ratio reshold Value from Range 1 to 40.
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Intel SpeedStep Technology
Intel SpeedStep technology allows processors to switch between multiple frequen-
cies and voltage points for better power saving and heat dissipation.
Intel Turbo Boost Technology
Intel Turbo Boost Technolog y enables the processor to run above its base operating
frequency when the operating system requests the highest performance state.
Intel Speed Shift Technology
Enable/Disable Intel Speed Shi Technology support. Enabling will expose the
CPPC v2 interface to allow for hardware controlled P-sates.
Intel Turbo Boost Max Technology 3.0
Intel Turbo Boost Technolog y enables the processor to run above its base operating
frequency when the operating system requests the highest performance state.
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Intel Thermal Velocity Boost Voltage Optimizations
is service controls thermal based voltage optimizations for processors that
implment the Intel ermal Velocity Boost (TVB) feature.
Dual Tau Boost
Enable Dual Tau Boost feature. is is only applicable for CMLS 35W/65W/125W
skus. is item is only supported with processors with Cong TDP support.
Long Duration Power Limit
Congure Package Power Limit 1 in watts. When the limit is exceeded, the CPU
ratio will be lowered aer a period of time. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
Long Duration Maintained
Congure the period of time until the CPU ratio is lowered when the Long
Duration Power Limit is exceeded.
Short Duration Power Limit
Congure Package Power Limit 2 in watts. When the limit is exceeded, the CPU
ratio will be lowered immediately. A lower limit can protect the CPU and save
power, while a higher limit may improve performance.
B560M Pro4/ac
CPU Core Current Limit
Congure the current limit of the CPU core. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
System Agent Current Limit
Congure the current limit of the system agent. A lower limit can protect the CPU
and save power, while a higher limit may improve performance.
GT Current Limit
Congure the current limit of the GT slice. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
DRAM Conguration
Memory Information
Allows users to browse the seria l presence detect (SPD) and Intel extreme memory prole
(XMP) for DDR4 modules.
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DRAM Timing Conguration
DRAM Frequency
If [Auto] is selected, the motherboard will detect the memory module(s) inserted
and assign the appropriate frequency automatically.
Primary Timing
CAS# Latency (tCL)
e time between sending a column address to the memory and the beginning of the data
in response.
RAS# to CAS# Delay and Row Precharge (tRCDtRP)
RAS# to CAS# Delay : e number of clock cycles required between the opening of a row
of memory and accessing columns within it.
Row Precharge: e number of clock cycles required between the issuing of the precharge
command and opening the next row.
RAS# Active Time (tRAS)
e number of clock cycles required between a bank active command and issuing the
precharge command.
Command Rate (CR)
e delay between when a memory chip is selected and when the rst active command can
be issued.
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Secondary Timing
Write Recovery Time (tWR)
e amount of delay that must elapse aer the completion of a valid write operation,
before an active bank can be precharged.
Refresh Cycle Time (tRFC)
e number of clocks from a Refresh command until the rst Activate command to
the same rank.
RAS to RAS Delay (tRRD_L)
e number of clocks between two rows activated in dierent banks of the same
rank.
RAS to RAS Delay (tRRD_S)
e number of clocks between two rows activated in dierent banks of the same
rank.
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B560M Pro4/ac
Write to Read Delay (tWTR_L)
e number of clocks between the last valid write operation and the next read command to
the same internal bank.
Write to Read Delay (tWTR_S)
e number of clocks between the last valid write operation and the next read command to
the same internal bank.
Read to Precharge (tRTP)
e number of clocks that are inserted between a read command to a row pre-
charge command to the same rank.
Four Activate Window (tFAW)
e time window in which four activates are allowed the same rank.
CAS Write Latency (tCWL)
Congure CAS Write Latency.
Third Timing
tREFI
Congure refresh cycles at an average periodic interval.
tCKE
Congure the period of time the DDR4 initiates a minimum of one refresh
command internally once it enters Self-Refresh mode.
Turn Around Timing
tRDRD_sg
Congure between module read to read delay.
tRDRD_dg
Congure between module read to read delay.
tRDRD_dr
Congure between module read to read delay.
tRDRD_dd
Congure between module read to read delay.
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tRDWR_sg
Congure between module read to write delay.
tRDWR_dg
Congure between module read to write delay.
tRDWR_dr
Congure between module read to write delay.
tRDWR_dd
Congure between module read to write delay.
tWRRD_sg
Congure between module write to read delay.
tWRRD_dg
Congure between module write to read delay.
tWRRD_dr
Congure between module write to read delay.
tWRRD_dd
Congure between module write to read delay.
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tWRWR_sg
Congure between module write to write delay.
tWRWR_dg
Congure between module write to write delay.
tWRWR_dr
Congure between module write to write delay.
tWRWR_dd
Congure between module write to write delay.
Round Trip Timing
Round Trip Timing Optimization
Auto is enabled in general case.
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Initial RTL (A1 Rank1)
Congure round trip latency initial value.
Initial RTL (A1 Rank2)
Congure round trip latency initial value.
Initial RTL (A2 Rank1)
Congure round trip latency initial value.
Initial RTL (A2 Rank2)
Congure round trip latency initial value.
Initial RTL (B1 Rank1)
Congure round trip latency initial value.
Initial RTL (B1 Rank2)
Congure round trip latency initial value.
Initial RTL (B2 Rank1)
Congure round trip latency initial value.
B560M Pro4/ac
Initial RTL (B2 Rank2)
Congure round trip latency initial value.
RTL (A1 Rank1)
Congure round trip latency.
RTL (A1 Rank2)
Congure round trip latency.
RTL (A2 Rank1)
Congure round trip latency.
RTL (A2 Rank2)
Congure round trip latency.
RTL (B1 Rank1)
Congure round trip latency.
RTL (B1 Rank2)
Congure round trip latency.
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RTL (B2 Rank1)
Congure round trip latency.
RTL (B2 Rank2)
Congure round trip latency.
IOL Init Value
Congure IO latency init value for IO latency training.
IOL (A1 Rank1)
Congure IO latency.
IOL (A1 Rank2)
Congure IO latency.
IOL (A2 Rank1)
Congure IO latency.
IOL (A2 Rank2)
Congure IO latency.
IOL (B1 Rank1)
Congure IO latency.
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IOL (B1 Rank2)
Congure IO latency.
IOL (B2 Rank1)
Congure IO latency.
IOL (B2 Rank2)
Congure IO latency.
IOL Oset (CH A)
Congure IO latency oset for channel A.
IOL Oset (CH B)
Congure IO latency oset for channel B.
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ODT Setting
Dimm ODT Training
ODT values will be optimized by Dimm On-Die Termination Training.
ODT WR (A1)
Congure the memory on die termination resistors' WR for channel A1.
ODT WR (A2)
Congure the memory on die termination resistors' WR for channel A2.
ODT WR (B1)
Congure the memory on die termination resistors' WR for channel B1.
ODT WR (B2)
Congure the memory on die termination resistors' WR for channel B2.
ODT NOM (A1)
Use this to change ODT (CH A1) Auto/Manual settings. e default is [Auto].
ODT NOM (A2)
Use this to change ODT (CH A2) Auto/Manual settings. e default is [Auto].
B560M Pro4/ac
ODT NOM (B1)
Use this to change ODT (CH B1) Auto/Manual settings. e default is [Auto].
ODT NOM (B2)
Use this to change ODT (CH B2) Auto/Manual settings. e default is [Auto].
ODT PARK (A1)
Congure the memory on die termination resistors' PARK for channel A1.
ODT PARK (A2)
Congure the memory on die termination resistors' PARK for channel A2.
ODT PARK (B1)
Congure the memory on die termination resistors' PARK for channel B1.
ODT PARK (B2)
Congure the memory on die termination resistors' PARK for channel B2.
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COMP Setting
Dll Bandwidth 0
Congure Dll Bandwidth 0 (1067 MHz) to maximize the performance of
intergrated memory controller.
Dll Bandwidth 1
Congure Dll Bandwidth 1 (1333 MHz) to maximize the performance of intergrated
memory controller.
Dll Bandwidth 2
Congure Dll Bandwidth 2 (1600 MHz) to maximize the performance of
intergrated memory controller.
Dll Bandwidth 3
Congure Dll Bandwidth 3 (1867 MHz) to maximize the performance of intergrated
memory controller.
Advanced Setting
ASRock Timing Optimization
Congure the fast path through the MRC.
ASRock Second Timing Optimization
Congure the second fast path through the MRC.
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Memory Training Mode
Congure the Training Memory Mode.
Realtime Memory Timing
Congure the realtime memory timings.
[Enabled] e system will allow performing realtime memory timing changes aer
MRC_DONE.
Reset for MRC Failed
Reset system aer MRC training is failed.
Train on Warm Boot
When enabled, memory training will be executed when warm boot.
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MRC Fast Boot
Enable Memory Fast Boot to skip DRAM memory training for booting faster.
Voltage Conguration
Voltage Mode
[OC]: Larger range voltage for overclocking.
[STABLE]: Smaller range voltage for stable system.
CPU Core/Cache Voltage
Input voltage for the processor by the external voltage regulator.
CPU Core/Cache Load-Line Calibration
CPU Core/Cache Load-Line Calibration helps prevent CPU Core/Cache voltage
droop when the system is under heav y loading.
CPU GT Voltage
Congure the voltage for the integrated GPU.
CPU GT Load-Line Calibration
GT Load-Line Calibration helps prevent integrated GPU voltage droop when the
system is under heavy load.
B560M Pro4/ac
VCCSA Voltage
Congure the voltage for the VCCSA.
CPU Standby Voltage
Congure the voltage for the CPU Standby.
VCCIN AUX Voltage
Congure the voltage for the VCCIN AUX.
DRAM Voltage
Use this to congure DRAM Voltage. e default va lue is [Auto].
DRAM Activating Power Supply
Congure the voltage for the DRAM Activating Power Supply.
VCCIO Voltage
Congure the voltage for the VCCIO.
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AVX Conguration
AVX2 Voltage Guardband Scale Factor
AVX2 Voltage Guardband Scale Factor controls the voltage guardband applied to
AVX2 workloads. A value > 1.00 will increase the voltage guardband, and < 1.00
will decrease the voltage guardband.
AVX-512 Voltage Guardband Scale Factor
AVX-512 Voltage Guardband Scale Factor controls the voltage guardband applied
to AVX-512 workloads. A value > 1.00 will increase the voltage guardband, and < 1.00
will decrease the voltage guardband.
Save User Default
Type a prole name and press enter to save your settings as user default.
Load User Default
Load previously saved user defaults.
Save User UEFI Setup Prole to Disk
It helps you to save current UEFI settings as an user prole to disk.
Load User UEFI Setup Prole from Disk
You can load previous saved prole from the disk.
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4.6 Advanced Screen
In this section, you may set the congurations for the following items: CPU