No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium batter y adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com
AUSTRALIA ONLY
Our goods come with guarantees that cannot be excluded under the Australian Consumer
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failure does not amount to a major failure. If you require assistance please call ASRock Tel
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e terms HDMI® and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.
INTEL END USER SOFTWARE LICENSE AGREEMENT
IMPORTANT - READ BEFORE COPYING, INSTALLING OR USING.
LICENSE. Licensee has a license under Intel ’s copyrights to reproduce Intel’s Soware
only in its unmodied and binary form, (with the accompanying documentation, the
“Soware”) for Licensee’s personal use only, and not commercial use, in connection with
Intel-based products for which the Soware has been provided, subject to the following
conditions:
(a) Licensee may not disclose, distribute or transfer any part of the So ware, and You agree
to prevent unauthorized copying of the Soware.
(b) Licensee may not reverse engineer, decompile, or disassemble the Soware.
(c) Licensee may not sublicense the Soware.
(d) e Soware may contain the soware and other intellectual property of third party
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(e) Intel has no obligation to provide any support, technical assistance or updates for the
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OWNERSHIP OF SOFTWARE AND COPYRIGHTS. Title to all copies of the Soware
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DISCLAIMER OF WARRANTY. e Soware is provided “AS IS” without warranty of
any kind, EITHER EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION,
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ES OF ANY KIND WHETHER UNDER THIS AGREEMENT OR OTHERWISE, EVEN
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and suggestions.
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EXPORT LAWS. Licensee agrees that neither Licensee nor Licensee’s subsidiaries will
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Department of Commerce or any other agency or department of the U.S. Government
or the foreign government from where it is shipping requires an export license, or other
governmental approval, without rst obtaining any such required license or approval. In
the event the Soware is exported from the U.S.A. or re-exported from a foreign destination by Licensee, Licensee will ensure that the distribution and export/re-export or import
of the Soware complies with all laws, regulations, orders, or other restrictions of the U.S.
Export Administration Regulations and the appropriate foreign government.
APPLICABLE LAWS. is Agreement and any dispute arising out of or relating to it will
be governed by the laws of the U.S.A. and Delaware, without regard to conict of laws
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Parties.
Licensee’s specic rights may vary from country to country.
CE Warning
is device complies with directive 2014/53/EU issued by the Commision of the European
Community.
is equipment complies with EU radiation exposure limits set forth for an uncontrolled
environment.
is equipment should be installed and operated with minimum distance 20cm between
the radiator & your body.
Operations in the 5.15-5.35GHz band are restricted to indoor usage only.
Radio transmit power per transceiver type
FunctionFrequencyMaximum Output Power (EIRP)
2400-2483.5 MHz18.5 + / -1.5 dbm
5150-5250 MHz21.5 + / -1.5 dbm
WiFi
Bluetooth2400-2483.5 MHz8.5 + / -1.5 dbm
5250-5350 MHz
5470-5725 MHz
18.5 + / -1.5 dbm (no TPC)
21.5 + / -1.5 dbm (TPC)
25.5 + / -1.5 dbm (no TPC)
28.5 + / -1.5 dbm (TPC)
Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 7
1.4 I/O Panel 9
1.5 WiFi-802.11ac Module and ASRock WiFi 2.4/5 GHz
Antennas 10
Chapter 2 Installation 12
2.1 Installing the CPU 13
2.2 Installing the CPU Fan and Heatsink 16
2.3 Installing Memory Modules (DIMM) 17
2.4 Expansion Slots (PCI Express Slots) 19
2.5 Jumpers Setup 21
2.6 Onboard Headers and Connectors 22
2.7 CrossFireXTM and Quad CrossFireXTM Operation Guide 27
2.7.1 Installing Two CrossFireXTM-Ready Graphics Cards 27
3.2.2 Using ASRock Motherboard Utility (A-Tuning) 37
3.3 ASRock Live Update & APP Shop 40
3.3.1 UI Overview 40
3.3.2 Apps 41
3.3.3 BIOS & Drivers 44
3.3.4 Setting 45
3.4 Nahimic Audio 46
3.5 ASRock Polychrome SYNC 47
Chapter 4 UEFI SETUP UTILITY 50
4.1 Introduction 50
4.2 EZ Mode 51
4.3 Advanced Mode 52
4.3.1 UEFI Menu Bar 52
4.3.2 Navigation Keys 53
4.4 Main Screen 54
4.5 OC Tweaker Screen 55
4.6 Advanced Screen 67
4.6.1 CPU Conguration 68
4.6.2 Chipset Conguration 70
4.6.3 Storage Conguration 73
4.6.4 Intel® Thunderbolt 74
4.6.5 Super IO Conguration 75
4.6.6 ACPI Conguration 76
4.6.7 USB Conguration 77
4.6.8 Trusted Computing 78
4.7 Tools 79
4.8 Hardware Health Event Monitoring Screen 81
4.9 Security Screen 84
4.10 Boot Screen 85
4.11 Exit Screen 88
Chapter 1 Introduction
ank you for purchasing ASRock B560M Pro4/ac motherboard, a reliable
motherboard produced under ASRock ’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock ’s
commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
Becau se the motherboard specication s and the BIOS soware might be upd ated, the
content of this documentation will be subject to change without notice. In case any
modications of this documentation occur, the updated version w ill be available on
ASRock’s website without further notice. If you require technical support related to
this motherboard, plea se visit our webs ite for specic information about the model
you are using. You may nd the latest VGA cards and CPU support li st on ASRock’s
website a s well. ASRock website http://www.asrock.com.
1.1 Package Contents
ASRock B560M Pro4/ac Motherboard (Micro ATX Form Factor)
•
ASRock B560M Pro4/ac Quick Installation Guide
•
ASRock B560M Pro4/ac Support CD
•
2 x Serial ATA (SATA) Data Cables (Optional)
•
2 x ASRock WiFi 2.4/5 GHz Antennas (Optional)
•
2 x Screws for M.2 Sockets (Optiona l)
•
1 x Stando for M.2 Socket (Optiona l)
•
1 x I/O Panel Shield
•
B560M Pro4/ac
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1.2 Specications
Platform
CPU
Chipset
Memory
•
•
•
•
•
•
•
•
•
•
•
* 11th Gen Intel® CoreTM (i9/i7/i5) support DDR4 up to 2933;
CoreTM (i3), Pentium® and Celeron® support DDR4 up to 2666.
* 10th Gen Intel® CoreTM (i9/i7) support DDR4 up to 2933;
CoreTM (i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
•
•
•
Micro ATX Form Factor
Solid Capacitor design
Suppor ts 10th Gen Intel® CoreTM Processors and 11th Gen
Intel® CoreTM Processors (LGA1200)
Digi Power design
8 Power Phase design
Supports Intel® Turbo Boost Max 3.0 Technology
Intel® B560
Dual Channel DDR4 Memory Technology
4 x DDR4 DIMM Slots
11th Gen Intel® CoreTM Processors support DDR4 non-ECC,
un-buered memory up to 4800+(OC)*
10th Gen Intel® CoreTM Processors support DDR4 non-ECC,
un-buered memory up to 4600+(OC)*
Supports ECC UDIMM memory modules (operate in non-
ECC mo de)
Max. capacity of system memor y: 128GB
Supports Intel® Extreme Memory Prole (XMP) 2.0
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2
Expansion
Slot
11th Gen Intel® CoreTM Processors
2 x PCI Express x16 Slots (PCIE1/PCIE3: single at Gen4x16
•
(PCIE1); dual at Gen4x16 (PCIE1) / Gen3x4 (PCIE3))
10th Gen Intel® CoreTM Processors
2 x PCI Express x16 Slots (PCIE1/PCIE3: single at Gen3x16
•
(PCIE1); dual at Gen3x16 (PCIE1) / Gen3x4 (PCIE3))
* Supports NVMe SSD as boot disks
1 x PCI Express 3.0 x1 Slot
•
Supports AMD Quad CrossFireXTM and CrossFireXTM
•
1 x M.2 Socket (Key E), supports type 2230 WiFi/BT module
•
and Intel® CNVi (Integrated WiFi/BT)
Graphics
Intel® UHD Graphics Built-in Visuals and the VGA outputs
•
can be supported only with processors which are GPU
integrated.
11th Gen Intel® CoreTM Processors support Intel® Xe Graphics
•
Architecture (Gen 12). 10th Gen Intel® CoreTM Processors
support Gen 9 Graphics
Graphics, Media & Compute: Microso Direct X 12, OpenGL
•
4.5, Intel® Built In Visuals, Intel® Quick Sync Video, Hybrid /
Switchable Graphics, OpenCL 2.1
Display & Content Security: Rec. 2020 (Wide Color Gamut),
•
Microso PlayReady 3.0, UHD/HDR Blu-ray Disc
Supports HDMI 2.0 with max. resolution up to 4K x 2K
•
(4096x2160) @ 60Hz
Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and
•
HBR (High Bit Rate Audio) with HDMI 2.0 Port (Compliant
HDMI monitor is required)
Supports HDCP 2.3 with HDMI 2.0 Port
•
Supports 4K Ultra HD (UHD) playback with HDMI 2.0 Port
•
* 11th Gen Intel® CoreTM Processors support HDMI 2.0. 10th Gen
Intel® CoreTM Processors support HDMI 1.4.
B560M Pro4/ac
Audio
LAN
Wireless
LAN
7.1 CH HD Audio (Realtek ALC897 Audio Codec)
•
Supports Surge Protection
•
Nahimic Audio
•
Gigabit LAN 10/100/100 0 Mb/s
•
Giga PHY Intel® I219V
•
Supports Wake-On-LAN
•
Supports Lightning/ESD Protection
•
Supports Energy Ecient Ethernet 802.3az
•
Supports PXE
•
Intel® 802.11ac WiFi Module
•
Supports IEEE 802.11a/b/g/n/ac
•
Supports Dual-Band (2.4/5 GHz)
•
Supports high speed wireless connections up to 433Mbps
•
Supports Bluetooth 5.1 + High speed class II
•
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English
Rear Panel
I/O
Storage
Connector
2 x Antenna Ports
•
1 x PS/2 Mouse/Keyboard Port
•
1 x HDMI Port
•
4 x USB 3.2 Gen1 Ports (Supports ESD Protection)
•
2 x USB 2.0 Ports (Supports ESD Protection)
•
1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
•
LED)
HD Audio Jacks: Line in / Front Speaker / Microphone
•
6 x SATA3 6.0 Gb/s Connectors, support Intel Rapid Storage
•
Technology 18, NCQ, AHCI and Hot Plug*
* If M2_2 is occupied by a SATA-type M.2 device, SATA3_1
will be disabled.
1 x Hyper M.2 Socket (M2_1), supports M Key type
•
2242/2260/2280 M.2 PCI Express module up to Gen4x4
(64 Gb/s) (Only supported with 11th Gen Intel® Core™ Proces-
sors) **
1 x Ultra M.2 Socket (M2_2), supports M Key type 2280 M.2
•
SATA3 6.0 Gb/s module and M.2 PCI Express module up to
Gen3 x4 (32 Gb/s)**
** Supports NVMe SSD as boot disks
** Supports ASRock U.2 Kit
1 x SPI TPM Header
•
1 x Chassis Intrusion and Speaker Header
•
2 x RGB LED Headers
•
* Support in total up to 12V/3A, 36W LED Strip
2 x Addressable LED Headers
•
* Support in total up to 5V/3A, 15W LED Strip
1 x CPU Fan Connector (4-pin)
•
* e CPU Fan Connector supports the CPU fan of maximum
1A (12W) fan power.
1 x CPU/Water Pump Fan Connector (4-pin) (Smart Fan
•
Speed Control)
* e CPU/Water Pump Fan supports the water cooler fan of
maximum 2A (24W) fan power.
4
BIOS
Feature
3 x Chassis/Water Pump Fan Connectors (4-pin) (Smart Fan
•
Speed Control)
* e Chassis/Water Pump Fan supports the water cooler fan of
maximum 2A (24W) fan power.
* CPU_FAN2/WP, CHA_FAN1/WP, CHA_FAN2/WP and
CHA_FAN3/WP can auto detect if 3-pin or 4-pin fan is in use.
1 x 24 pin ATX Power Connector
•
1 x 8 pin 12V Power Connector (Hi-Density Power
•
Connec tor)
1 x Front Panel Audio Connector
•
1 x underbolt AIC Connector (5-pin) (Supports ASRock
•
underbolt 4 AIC Card)
2 x USB 2.0 Headers (Support 4 USB 2.0 ports) (Supports
•
ESD Protection)
1 x USB 3.2 Gen1 Header (Supports 2 USB 3.2 Gen1 ports)
•
(Supports ESD Protection)
1 x Front Panel Type C USB 3.2 Gen1 Header (Supports ESD
•
Protection)
AMI UEFI Legal BIOS with multilingual GUI support
•
ACPI 6.0 Compliant wake up events
•
SMBIOS 2.7 Support
•
CPU Core/Cache, GT, DRAM, VPPM, VCCIN AUX ,
•
VCCSA ,VCCIO Multi-adjustment
B560M Pro4/ac
Hardware
Monitor
Fan Tachometer: CPU, CPU/Water Pump, Chassis/Water
•
Pump Fans
Quiet Fan (Auto adjust chassis fan speed by CPU tempera-
Fan Multi-Speed Control: CPU, CPU/Water Pump, Chassis/
•
Water Pump Fans
CASE OPEN detection
•
Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore, DRAM,
•
VPPM, VCCIN AUX, VCCSA, VCCIO, CPU PLL Voltage
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5
Microso® Windows® 10 64-bit
OS
Certications
* For detailed product infor mation, please vis it our website: http://www.asrock .com
Please realize that there is a certain risk involved with overcl ocking, including
adjusting the setting in th e BIOS, applying Untie d Overclocking Technology, or using
third-party overclocking tools . Overclocking may aect your system’s stability, or
even cause damage to the components and devices of your system. It should be done
at your own risk and expense. We are not responsible for possible damage caused by
overclocking.
•
FCC, CE
•
ErP/EuP Ready (ErP/EuP ready power supply is required)
•
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1.3 Motherboard Layout
Intel
B560
ATXP WR1
HDLED RESET
PLED PWRBTN
PANEL1
1
1
1
RoHS
2
CPU_FAN1
3
1
PCIE1
1
12
DDR4 _A2 (64 b it, 288 -pin mo dule)
DDR4 _A1 (64 b it, 288 -pin mo dule)
DDR4 _B2 (64 b it, 288 -pin mo dule)
DDR4 _B1 (64 b it, 288 -pin mo dule)
6
ATX12V1
USB3_5_ 6
11
CLRMOS1
1
1
HD_AUDIO1
Top:
RJ-45
CHA_FAN1/WP
PCIE3
8
9
4
USB5_6
1
24
27
PCIE2
29
1
USB 3.2 Gen1
T: USB3_4
B: USB3_3
M2_W IFI
Top:
LINE I N
Cent er:
FRON T
Bott om:
MIC IN
USB2. 0
T: USB1
B: USB 2
PS2
Keybo ard
/Mous e
RGB_LED1
1
ADDR_LED1
7
1
SPI_TPM_J1
T B1
1
ADDR_LED2
1
RGB_LED2
1
CHA_FAN3/WP
23
26
USB3_4
CPU_FAN2/WP
13
14
SATA3_1
M2_2
USB 3.2 Gen1
T:
USB3_2
B:
USB3_1
15
16
20
19
18
28
M2_1
CMOS
Battery
5
SATA3_2
SATA3_3
SATA3_4
SATA3_5
F_USB 3_T C_1
10
SATA3_0
17
BIOS
ROM
25
CHA_FAN2/WP
22
SPK_CI1
1
21
HDMI 1
LAN
AUDIO
CODEC
WiFi-802.11ac
Module
PSC
DRAM
CPU
VGA
BOOT
B560M Pro4/ac
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7
No. Description
1ATX 12V Power Connector (ATX12V1)
22 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
32 x 288-pin DDR4 DIMM Slots (DDR4_A2, DDR4_B2)
4CPU/Water Pump Fan Connector (CPU_FAN2/WP)
5CPU Fan Connector (CPU_FAN1)
6RGB LED Header (RGB_LED1)
7Addressable LED Header (ADDR_LED1)
8ATX Power Connector (ATXPWR1)
9USB 3.2 Gen1 Header (USB3_5_6)
10 Front Panel Type C USB 3.2 Gen1 Header (F_USB3_TC_1)
11 SATA3 Connector (SATA3_2)(Upper)
12 SATA3 Connector (SATA3_3)(Lower)
13 SATA3 Connector (SATA3_5)(Lower)
14 SATA3 C onnector (SATA 3_ 4)(Upper)
15 System Panel Header (PANEL1)
16 SATA3 Connector (SATA3_1)
17 SATA3 Connector (SATA3_0)
18 SPI TPM Header (SPI_TPM_J1)
19 USB 2.0 Header (USB5_6)
20 USB 2.0 Header (USB3_4)
21 Chassis Intrusion and Speaker Header (SPK_CI1)
22 Chassis/Water Pump Fan Connector (CHA _FAN2/WP)
23 Chassis/Water Pump Fan Connector (CHA _FAN3/WP)
** Function of the Audio Ports in 7.1-channel Conguration:
PortFunction
Light Blue (Rear panel)Rear Speaker Out
Lime (Rear panel)Front Speaker Out
Pink (Rear panel)Central /Subwoofer Speaker Out
Lime (Front panel)Side Speaker Out
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1.5 WiFi-802.11ac Module and ASRock WiFi 2.4/5 GHz
Antennas
WiFi-802.11ac + BT Module
is motherboard comes with an exclusive WiFi 802.11 a/b/g/n/ac + BT v5.1 module
that oers support for WiFi 802.11 a/b/g/n/ac connectivity standards and Bluetooth
v5.1. WiFi + BT module is an easy-to-use wireless loca l area network (WLAN) adapter
to support WiFi + BT. Bluetooth v5.1 standard features Smart Ready technology that
adds a whole new class of functionality into the mobile devices. BT 5.1 also includes
Low Energy Technology and ensures extraordinary low power consumption for PCs.
* e transmission speed may vary according to the environment.
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10
WiFi Antennas Installation Guide
B560M Pro4/ac
Step 1
Prepare the WiFi 2.4/5 GHz Antennas that come
with the package.
Step 2
Connect the two WiFi 2.4/5 GHz Antennas to
the antenna connectors. Turn the antenna clock-
wise until it is securely connected.
Step 3
Set the WiFi 2.4/5 GHz Antenna as shown in the
illustration.
*You may need to adjust the direction of
the antenna for a stronger signal.
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11
Chapter 2 Installation
is is a Micro ATX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
Make sure to unplug the power cord before installing or removing the motherboard
•
components. Failure to do so may cause physical injuries and damages to motherboard
components.
In order to avoid damage from static electricity to the motherboard’s components,
•
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
Hold components by the edges and do not touch the ICs.
•
Whenever you uninstall any components, place them on a grounded anti-static pad or
•
in the bag that comes with the components.
When placing screws to secure the motherboard to the chassis, please do not over-
•
tighten the screws! Doing so may damage the motherboard.
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12
2.1 Installing the CPU
1
1. Before you insert the 1200-Pin CPU into the socket, please check if the P nP cap is on the
socket, if the CPU surface is unclean, or if the re are any bent pins in the socket. Do not
force to in sert the CPU into the socket if above situation is found. Otherwise, the CPU
will be seriously damaged.
2. Unplug all power c ables before installing the CPU.
B560M Pro4/ac
A
B
2
13
English
3
5
4
English
14
Please save and replace the cover if the processor is removed. e cover must be placed if
you wish to return the motherboard for aer service.
B560M Pro4/ac
15
English
2.2 Installing the CPU Fan and Heatsink
12
English
16
CPU_FAN
2.3 Installing Memory Modules (DIMM)
is motherboard provides four 288-pin DDR4 (Double Data Rate 4) DIMM slots,
and supports Dual Channel Memory Technology.
1. For dual channe l conguration, you always nee d to insta ll identical (the same
brand, speed, size and chip-ty pe) DDR4 DIMM pairs.
2. It is unable to activate Dual Channel Me mory Technology with only one or three
memory module installed.
3. It is not allowed to in stall a DDR, DDR2 or DDR3 memory module into a DDR4
slot; otherwise, thi s motherboard and DIMM may be damaged.
e DIMM only ts in one correct orientation. It will cause permanent damage to
the motherboard and the DIMM if you force the DIMM into the slot at incorrect
orientation.
B560M Pro4/ac
17
English
1
2
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18
3
2.4 Expansion Slots (PCI Express Slots)
ere are 3 PCI Express slots on the motherboard.
Before installing an expansion c ard, please mak e sure that the powe r supply is
switched o or the power cord i s unplug ged. Please read the documentation of the
expan sion card and mak e necessary hardware settings for the card before you star t
the installation.
PCIe slots:
11th Gen Intel® CoreTM Processors:
PCIE1 (PCIe 4.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
PCIE2 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE3 (PCIe 3.0 x16 slot) is used for PCI Express x4 lane width graphics cards.
PCIe slots:
10th Gen Intel® CoreTM Processors:
PCIE1 (PCIe 3 .0 x16 slot) is used for PCI Express x16 lane width graphics cards.
PCIE2 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE3 (PCIe 3.0 x16 slot) is used for PCI Express x4 lane width graphics cards.
B560M Pro4/ac
19
English
PCIe Slot Congurations
11th Gen Intel® CoreTM Processors:
PCIE1PCIE3
Single Graphics CardGen4x16N/A
Two Graphics Cards in
CrossFireXTM Mode
Gen4x16Gen3x4
10th Gen Intel® CoreTM Processors:
PCIE1PCIE3
Single Graphics CardGen3x16N/A
Two Graphics Cards in
CrossFireXTM Mode
For a better ther mal environment , please conne ct a chassis fan to the motherboard’s
chassis fan connector (CHA_FAN1/W P, CHA_FAN2/WP or CHA_FAN3/WP) when
using multiple graphics cards.
Gen3x16Gen3x4
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20
2.5 Jumpers Setup
e illustration shows how jumpers are setup. When the jumper cap is placed on
the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is
“O pen”.
Clear CMOS Jumper
(CLR MOS1)
(see p.7, No. 25)
CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system
parameters to default setup, please turn o the computer and unplug the power
cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to
short the pins on CLRMOS1 for 5 seconds. However, please do not clear the
CMOS right aer you update the BIOS. If you need to clear the CMOS when you
just nish updating the BIOS, you must boot up the system rst, and then shut it
down before you do the clear-CMOS action. Please be noted that the password,
date, time, and user default prole will be cleared only if the CMOS battery is
removed. Please remember toremove the jumper cap aer clearing the CMOS.
2-pin Jumper
B560M Pro4/ac
If you clear the CMOS, the case open may be detected. Please adjus t the BIOS option
“Clear Status” to cl ear the record of prev ious chassis intru sion status.
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21
2.6 Onboard Headers and Connectors
1
1
+5V
DUMMY
SIGNAL
GND
DUMMY
SPEAKER
DUMMY
Onboard headers and connectors are NOT jumpers. Do NOT pla ce jumper caps over
these headers and connectors. Placing jumper caps over the headers and connectors
will cause permanent damage to the motherboard.
System Panel Header
(9-p in PA NE L1)
(see p.7, No. 15)
PWRBTN (Power Swi tch):
Connec t to the power switch on the chassis f ront panel. You may congure the way to
turn o your system using the power sw itch.
RESET (Reset Sw itch):
Connec t to the reset switch on the chassis f ront panel. Pre ss the reset switch to restart
the computer if the computer f reezes and fails to per form a normal restart.
PLED (Syste m Power LED):
Connec t to the power status indicator on the chassi s front panel. e LED is on when
the system is operating. e LED keeps blinking whe n the system is in S1/S3 sle ep
state. e LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive ac tivity LED on the chassis f ront panel. e LED is on
when the hard drive is reading or writing data.
e front panel design may dier by chassis . A front panel module mainly consists
of power s witch, reset switch, power LED, hard drive ac tivity LED, speaker and etc.
When connecting your cha ssis front panel modul e to this header, make sure the wire
assig nments and the pin assignments are matched correc tly.
PLED+
PLED-
HDLED-
HDLED+
PWRBTN#
GND
RESET#
GND
GND
Connect the power
switch, reset switch and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
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22
Chassis Intrusion and
Speaker Header
(7-pi n SPK_C I1)
(see p.7, No. 21)
Please connect the
chassis intrusion and the
chassis speaker to this
header.
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