Asrock B560M Pro4/ac User Manual

Version 1.0
Published December 2020
Copyright©2020 ASRock INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc.
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for informational use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warranties or conditions of merchantability or tness for a particular purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of prots, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium batter y adopted on this motherboard contains Perchlorate, a toxic substance controlled in Perchlorate Best Management Practices (BMP) regulations passed by the California Legislature. When you discard the Lithium battery in California, USA, please follow the related regulations in advance. “Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/ perchlorate”
ASRock Website: http://www.asrock.com
AUSTRALIA ONLY
Our goods come with guarantees that cannot be excluded under the Australian Consumer Law. You are entitled to a replacement or refund for a major failure and compensation for any other reasonably foreseeable loss or damage caused by our goods. You are also entitled to have the goods repaired or replaced if the goods fail to be of acceptable quality and the failure does not amount to a major failure. If you require assistance please call ASRock Tel
: +886-2-28965588 ext.123 (Standard International call charges apply)
e terms HDMI® and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United States and other countries.
INTEL END USER SOFTWARE LICENSE AGREEMENT
IMPORTANT - READ BEFORE COPYING, INSTALLING OR USING.
LICENSE. Licensee has a license under Intel ’s copyrights to reproduce Intel’s Soware only in its unmodied and binary form, (with the accompanying documentation, the “Soware”) for Licensee’s personal use only, and not commercial use, in connection with Intel-based products for which the Soware has been provided, subject to the following conditions:
(a) Licensee may not disclose, distribute or transfer any part of the So ware, and You agree to prevent unauthorized copying of the Soware.
(b) Licensee may not reverse engineer, decompile, or disassemble the Soware.
(c) Licensee may not sublicense the Soware.
(d) e Soware may contain the soware and other intellectual property of third party suppliers, some of which may be identied in, and licensed in accordance with, an enclosed license.txt le or other text or le.
(e) Intel has no obligation to provide any support, technical assistance or updates for the Soware.
OWNERSHIP OF SOFTWARE AND COPYRIGHTS. Title to all copies of the Soware remains with Intel or its licensors or suppliers. e Soware is copyrighted and protected by the laws of the United States and other countries, and international treaty provisions. Licensee may not remove any copyright notices from the Soware. Except as otherwise expressly provided above, Intel grants no express or implied right under Intel patents, copyrights, trademarks, or other intellectual property rights. Transfer of the license termi­nates Licensee’s right to use the Soware.
DISCLAIMER OF WARRANTY. e Soware is provided “AS IS” without warranty of any kind, EITHER EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION, WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PUR­POSE.
LIMITATION OF LIABILITY. NEITHER INTEL NOR ITS LICENSORS OR SUPPLIERS WILL BE LIABLE FOR ANY LOSS OF PROFITS, LOSS OF USE, INTERRUPTION OF BUSINESS, OR INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAG-
ES OF ANY KIND WHETHER UNDER THIS AGREEMENT OR OTHERWISE, EVEN IF INTEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
LICENSE TO USE COMMENTS AND SUGGESTIONS. is Agreement does NOT obligate Licensee to provide Intel with comments or suggestions regarding the Soware. However, if Licensee provides Intel with comments or suggestions for the modication, correction, improvement or enhancement of (a) the Soware or (b) Intel products or processes that work with the Soware, Licensee grants to Intel a non-exclusive, worldwide, perpetual, irrevocable, transferable, royalty-free license, with the right to sublicense, under Licensee’s intellectual property rights, to incorporate or otherwise utilize those comments and suggestions.
TERMINATION OF THIS LICENSE. Intel or the sublicensor may terminate this license at any time if Licensee is in breach of any of its terms or conditions. Upon termination, Licensee will immediately destroy or return to Intel all copies of the Soware.
THIRD PARTY BENEFICIARY. Intel is an intended beneciary of the End User License Agreement and has the right to enforce all of its terms.
U.S. GOVERNMENT RESTRICTED RIGHTS. e Soware is a commercial item (as dened in 48 C.F.R. 2.101) consisting of commercial computer so ware and commercial computer soware documentation (as those terms are used in 48 C.F.R. 12.212), consistent with 48 C.F.R. 12.212 and 48 C.F.R 227.7202-1 through 227.7202-4. You will not provide the Soware to the U.S. Government. Contractor or Manufacturer is Intel Corporation, 2200 Mission College Blvd., Santa Clara, CA 95054.
EXPORT LAWS. Licensee agrees that neither Licensee nor Licensee’s subsidiaries will export/re-export the Soware, directly or indirectly, to any country for which the U.S. Department of Commerce or any other agency or department of the U.S. Government or the foreign government from where it is shipping requires an export license, or other governmental approval, without rst obtaining any such required license or approval. In the event the Soware is exported from the U.S.A. or re-exported from a foreign destina­tion by Licensee, Licensee will ensure that the distribution and export/re-export or import of the Soware complies with all laws, regulations, orders, or other restrictions of the U.S. Export Administration Regulations and the appropriate foreign government.
APPLICABLE LAWS. is Agreement and any dispute arising out of or relating to it will be governed by the laws of the U.S.A. and Delaware, without regard to conict of laws principles. e Parties to this Agreement exclude the application of the United Nations Convention on Contracts for the International Sale of Goods (1980). e state and federal courts sitting in Delaware, U.S.A. will have exclusive jurisdiction over any dispute arising out of or relating to this Agreement. e Parties consent to personal jurisdiction and venue in those courts. A Party that obtains a judgment against the other Party in the courts iden­tied in this section may enforce that judgment in any court that has jurisdiction over the Parties.
Licensee’s specic rights may vary from country to country.
CE Warning
is device complies with directive 2014/53/EU issued by the Commision of the European Community.
is equipment complies with EU radiation exposure limits set forth for an uncontrolled environment. is equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
Operations in the 5.15-5.35GHz band are restricted to indoor usage only.
Radio transmit power per transceiver type
Function Frequency Maximum Output Power (EIRP)
2400-2483.5 MHz 18.5 + / -1.5 dbm
5150-5250 MHz 21.5 + / -1.5 dbm
WiFi
Bluetooth 2400-2483.5 MHz 8.5 + / -1.5 dbm
5250-5350 MHz
5470-5725 MHz
18.5 + / -1.5 dbm (no TPC)
21.5 + / -1.5 dbm (TPC)
25.5 + / -1.5 dbm (no TPC)
28.5 + / -1.5 dbm (TPC)
Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 7
1.4 I/O Panel 9
1.5 WiFi-802.11ac Module and ASRock WiFi 2.4/5 GHz Antennas 10
Chapter 2 Installation 12
2.1 Installing the CPU 13
2.2 Installing the CPU Fan and Heatsink 16
2.3 Installing Memory Modules (DIMM) 17
2.4 Expansion Slots (PCI Express Slots) 19
2.5 Jumpers Setup 21
2.6 Onboard Headers and Connectors 22
2.7 CrossFireXTM and Quad CrossFireXTM Operation Guide 27
2.7.1 Installing Two CrossFireXTM-Ready Graphics Cards 27
2.7.2 Driver Installation and Setup 29
2.8 M.2_SSD (NGFF) Module Installation Guide (M2_1) 30
2.9 M.2_SSD (NGFF) Module Installation Guide (M2_2) 33
Chapter 3 Software and Utilities Operation 36
3.1 Installing Drivers 36
3.2 ASRock Motherboard Utility (A-Tuning) 37
3.2.1 Installing ASRock Motherboard Utility (A-Tuning) 37
3.2.2 Using ASRock Motherboard Utility (A-Tuning) 37
3.3 ASRock Live Update & APP Shop 40
3.3.1 UI Overview 40
3.3.2 Apps 41
3.3.3 BIOS & Drivers 44
3.3.4 Setting 45
3.4 Nahimic Audio 46
3.5 ASRock Polychrome SYNC 47
Chapter 4 UEFI SETUP UTILITY 50
4.1 Introduction 50
4.2 EZ Mode 51
4.3 Advanced Mode 52
4.3.1 UEFI Menu Bar 52
4.3.2 Navigation Keys 53
4.4 Main Screen 54
4.5 OC Tweaker Screen 55
4.6 Advanced Screen 67
4.6.1 CPU Conguration 68
4.6.2 Chipset Conguration 70
4.6.3 Storage Conguration 73
4.6.4 Intel® Thunderbolt 74
4.6.5 Super IO Conguration 75
4.6.6 ACPI Conguration 76
4.6.7 USB Conguration 77
4.6.8 Trusted Computing 78
4.7 Tools 79
4.8 Hardware Health Event Monitoring Screen 81
4.9 Security Screen 84
4.10 Boot Screen 85
4.11 Exit Screen 88
Chapter 1 Introduction
ank you for purchasing ASRock B560M Pro4/ac motherboard, a reliable
motherboard produced under ASRock ’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock ’s
commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
Becau se the motherboard specication s and the BIOS soware might be upd ated, the content of this documentation will be subject to change without notice. In case any modications of this documentation occur, the updated version w ill be available on ASRock’s website without further notice. If you require technical support related to this motherboard, plea se visit our webs ite for specic information about the model you are using. You may nd the latest VGA cards and CPU support li st on ASRock’s website a s well. ASRock website http://www.asrock.com.
1.1 Package Contents
ASRock B560M Pro4/ac Motherboard (Micro ATX Form Factor)
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ASRock B560M Pro4/ac Quick Installation Guide
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ASRock B560M Pro4/ac Support CD
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2 x Serial ATA (SATA) Data Cables (Optional)
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2 x ASRock WiFi 2.4/5 GHz Antennas (Optional)
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2 x Screws for M.2 Sockets (Optiona l)
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1 x Stando for M.2 Socket (Optiona l)
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1 x I/O Panel Shield
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B560M Pro4/ac
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1.2 Specications
Platform
CPU
Chipset
Memory
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* 11th Gen Intel® CoreTM (i9/i7/i5) support DDR4 up to 2933;
CoreTM (i3), Pentium® and Celeron® support DDR4 up to 2666.
* 10th Gen Intel® CoreTM (i9/i7) support DDR4 up to 2933;
CoreTM (i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
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Micro ATX Form Factor
Solid Capacitor design
Suppor ts 10th Gen Intel® CoreTM Processors and 11th Gen
Intel® CoreTM Processors (LGA1200)
Digi Power design
8 Power Phase design
Supports Intel® Turbo Boost Max 3.0 Technology
Intel® B560
Dual Channel DDR4 Memory Technology
4 x DDR4 DIMM Slots
11th Gen Intel® CoreTM Processors support DDR4 non-ECC,
un-buered memory up to 4800+(OC)*
10th Gen Intel® CoreTM Processors support DDR4 non-ECC,
un-buered memory up to 4600+(OC)*
Supports ECC UDIMM memory modules (operate in non-
ECC mo de)
Max. capacity of system memor y: 128GB
Supports Intel® Extreme Memory Prole (XMP) 2.0
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Expansion Slot
11th Gen Intel® CoreTM Processors
2 x PCI Express x16 Slots (PCIE1/PCIE3: single at Gen4x16
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(PCIE1); dual at Gen4x16 (PCIE1) / Gen3x4 (PCIE3))
10th Gen Intel® CoreTM Processors
2 x PCI Express x16 Slots (PCIE1/PCIE3: single at Gen3x16
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(PCIE1); dual at Gen3x16 (PCIE1) / Gen3x4 (PCIE3))
* Supports NVMe SSD as boot disks
1 x PCI Express 3.0 x1 Slot
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Supports AMD Quad CrossFireXTM and CrossFireXTM
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1 x M.2 Socket (Key E), supports type 2230 WiFi/BT module
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and Intel® CNVi (Integrated WiFi/BT)
Graphics
Intel® UHD Graphics Built-in Visuals and the VGA outputs
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can be supported only with processors which are GPU
integrated.
11th Gen Intel® CoreTM Processors support Intel® Xe Graphics
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Architecture (Gen 12). 10th Gen Intel® CoreTM Processors
support Gen 9 Graphics
Graphics, Media & Compute: Microso Direct X 12, OpenGL
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4.5, Intel® Built In Visuals, Intel® Quick Sync Video, Hybrid /
Switchable Graphics, OpenCL 2.1
Display & Content Security: Rec. 2020 (Wide Color Gamut),
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Microso PlayReady 3.0, UHD/HDR Blu-ray Disc
Supports HDMI 2.0 with max. resolution up to 4K x 2K
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(4096x2160) @ 60Hz
Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and
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HBR (High Bit Rate Audio) with HDMI 2.0 Port (Compliant
HDMI monitor is required)
Supports HDCP 2.3 with HDMI 2.0 Port
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Supports 4K Ultra HD (UHD) playback with HDMI 2.0 Port
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* 11th Gen Intel® CoreTM Processors support HDMI 2.0. 10th Gen
Intel® CoreTM Processors support HDMI 1.4.
B560M Pro4/ac
Audio
LAN
Wireless LAN
7.1 CH HD Audio (Realtek ALC897 Audio Codec)
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Supports Surge Protection
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Nahimic Audio
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Gigabit LAN 10/100/100 0 Mb/s
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Giga PHY Intel® I219V
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Supports Wake-On-LAN
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Supports Lightning/ESD Protection
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Supports Energy Ecient Ethernet 802.3az
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Supports PXE
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Intel® 802.11ac WiFi Module
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Supports IEEE 802.11a/b/g/n/ac
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Supports Dual-Band (2.4/5 GHz)
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Supports high speed wireless connections up to 433Mbps
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Supports Bluetooth 5.1 + High speed class II
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English
Rear Panel I/O
Storage
Connector
2 x Antenna Ports
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1 x PS/2 Mouse/Keyboard Port
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1 x HDMI Port
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4 x USB 3.2 Gen1 Ports (Supports ESD Protection)
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2 x USB 2.0 Ports (Supports ESD Protection)
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1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
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LED)
HD Audio Jacks: Line in / Front Speaker / Microphone
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6 x SATA3 6.0 Gb/s Connectors, support Intel Rapid Storage
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Technology 18, NCQ, AHCI and Hot Plug*
* If M2_2 is occupied by a SATA-type M.2 device, SATA3_1
will be disabled.
1 x Hyper M.2 Socket (M2_1), supports M Key type
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2242/2260/2280 M.2 PCI Express module up to Gen4x4
(64 Gb/s) (Only supported with 11th Gen Intel® Core™ Proces-
sors) **
1 x Ultra M.2 Socket (M2_2), supports M Key type 2280 M.2
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SATA3 6.0 Gb/s module and M.2 PCI Express module up to
Gen3 x4 (32 Gb/s)**
** Supports NVMe SSD as boot disks
** Supports ASRock U.2 Kit
1 x SPI TPM Header
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1 x Chassis Intrusion and Speaker Header
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2 x RGB LED Headers
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* Support in total up to 12V/3A, 36W LED Strip
2 x Addressable LED Headers
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* Support in total up to 5V/3A, 15W LED Strip
1 x CPU Fan Connector (4-pin)
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* e CPU Fan Connector supports the CPU fan of maximum
1A (12W) fan power.
1 x CPU/Water Pump Fan Connector (4-pin) (Smart Fan
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Speed Control)
* e CPU/Water Pump Fan supports the water cooler fan of
maximum 2A (24W) fan power.
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BIOS Feature
3 x Chassis/Water Pump Fan Connectors (4-pin) (Smart Fan
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Speed Control)
* e Chassis/Water Pump Fan supports the water cooler fan of
maximum 2A (24W) fan power.
* CPU_FAN2/WP, CHA_FAN1/WP, CHA_FAN2/WP and
CHA_FAN3/WP can auto detect if 3-pin or 4-pin fan is in use.
1 x 24 pin ATX Power Connector
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1 x 8 pin 12V Power Connector (Hi-Density Power
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Connec tor)
1 x Front Panel Audio Connector
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1 x underbolt AIC Connector (5-pin) (Supports ASRock
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underbolt 4 AIC Card)
2 x USB 2.0 Headers (Support 4 USB 2.0 ports) (Supports
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ESD Protection)
1 x USB 3.2 Gen1 Header (Supports 2 USB 3.2 Gen1 ports)
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(Supports ESD Protection)
1 x Front Panel Type C USB 3.2 Gen1 Header (Supports ESD
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Protection)
AMI UEFI Legal BIOS with multilingual GUI support
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ACPI 6.0 Compliant wake up events
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SMBIOS 2.7 Support
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CPU Core/Cache, GT, DRAM, VPPM, VCCIN AUX ,
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VCCSA ,VCCIO Multi-adjustment
B560M Pro4/ac
Hardware Monitor
Fan Tachometer: CPU, CPU/Water Pump, Chassis/Water
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Pump Fans
Quiet Fan (Auto adjust chassis fan speed by CPU tempera-
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ture): CPU, CPU/Water Pump, Chassis/Water Pump Fans
Fan Multi-Speed Control: CPU, CPU/Water Pump, Chassis/
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Water Pump Fans
CASE OPEN detection
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Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore, DRAM,
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VPPM, VCCIN AUX, VCCSA, VCCIO, CPU PLL Voltage
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Microso® Windows® 10 64-bit
OS
Certica­tions
* For detailed product infor mation, please vis it our website: http://www.asrock .com
Please realize that there is a certain risk involved with overcl ocking, including adjusting the setting in th e BIOS, applying Untie d Overclocking Technology, or using third-party overclocking tools . Overclocking may aect your system’s stability, or even cause damage to the components and devices of your system. It should be done at your own risk and expense. We are not responsible for possible damage caused by overclocking.
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FCC, CE
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ErP/EuP Ready (ErP/EuP ready power supply is required)
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1.3 Motherboard Layout
Intel
B560
ATXP WR1
HDLED RESET
PLED PWRBTN
PANEL1
1
1
1
RoHS
2
CPU_FAN1
3
1
PCIE1
1
12
DDR4 _A2 (64 b it, 288 -pin mo dule)
DDR4 _A1 (64 b it, 288 -pin mo dule)
DDR4 _B2 (64 b it, 288 -pin mo dule)
DDR4 _B1 (64 b it, 288 -pin mo dule)
6
ATX12V1
USB3_5_ 6
11
CLRMOS1
1
1
HD_AUDIO1
Top: RJ-45
CHA_FAN1/WP
PCIE3
8
9
4
USB5_6
1
24
27
PCIE2
29
1
USB 3.2 Gen1 T: USB3_4 B: USB3_3
M2_W IFI
Top:
LINE I N
Cent er:
FRON T
Bott om:
MIC IN
USB2. 0
T: USB1
B: USB 2
PS2
Keybo ard
/Mous e
RGB_LED1
1
ADDR_LED1
7
1
SPI_TPM_J1
T B1
1
ADDR_LED2
1
RGB_LED2
1
CHA_FAN3/WP
23
26
USB3_4
CPU_FAN2/WP
13
14
SATA3_1
M2_2
USB 3.2 Gen1 T:
USB3_2
B:
USB3_1
15
16
20
19
18
28
M2_1
CMOS
Battery
5
SATA3_2
SATA3_3
SATA3_4
SATA3_5
F_USB 3_T C_1
10
SATA3_0
17
BIOS ROM
25
CHA_FAN2/WP
22
SPK_CI1
1
21
HDMI 1
LAN
AUDIO CODEC
WiFi-802.11ac
Module
PSC
DRAM
CPU VGA
BOOT
B560M Pro4/ac
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No. Description
1 ATX 12V Power Connector (ATX12V1)
2 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
3 2 x 288-pin DDR4 DIMM Slots (DDR4_A2, DDR4_B2)
4 CPU/Water Pump Fan Connector (CPU_FAN2/WP)
5 CPU Fan Connector (CPU_FAN1)
6 RGB LED Header (RGB_LED1)
7 Addressable LED Header (ADDR_LED1)
8 ATX Power Connector (ATXPWR1)
9 USB 3.2 Gen1 Header (USB3_5_6)
10 Front Panel Type C USB 3.2 Gen1 Header (F_USB3_TC_1)
11 SATA3 Connector (SATA3_2)(Upper)
12 SATA3 Connector (SATA3_3)(Lower)
13 SATA3 Connector (SATA3_5)(Lower)
14 SATA3 C onnector (SATA 3_ 4)(Upper)
15 System Panel Header (PANEL1)
16 SATA3 Connector (SATA3_1)
17 SATA3 Connector (SATA3_0)
18 SPI TPM Header (SPI_TPM_J1)
19 USB 2.0 Header (USB5_6)
20 USB 2.0 Header (USB3_4)
21 Chassis Intrusion and Speaker Header (SPK_CI1)
22 Chassis/Water Pump Fan Connector (CHA _FAN2/WP)
23 Chassis/Water Pump Fan Connector (CHA _FAN3/WP)
24 underbolt AIC Connector (TB1)
25 Clear CMOS Jumper (CLRMOS1)
26 RGB LED Header (RGB_LED2)
27 Addressable LED Header (ADDR_LED2)
28 Front Panel Audio Header (HD_AUDIO1)
29 Chassis/Water Pump Fan Connector (CHA_FAN1/WP)
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1.4 I/O Panel
1
B560M Pro4/ac
3
42
10 568
9
7
No. Description No. Description
1 USB 2.0 Ports (USB12) 6 USB 3.2 Gen1 Ports (USB3_3_4)
2 LAN RJ-45 Port* 7 USB 3.2 Gen1 Ports (USB3_1_2)
3 Line In (Light Blue)** 8 Antenna Ports
4 Front Speaker (Lime)** 9 HDMI Port
5 Microphone (Pink)** 10 PS/2 Mouse/Keyboard Port
* ere are two LEDs on the LAN por t. Please refe r to the table belo w for the LA N port LED indications .
ACT/LINK LED
SPEED LED
LAN Por t
Activity / Link LED Speed LED
Status Description Status Description
O No Link O 10Mbps connection Blinking Data Activity Orange 100Mbps connection On Link Green 1Gbps connection
** Function of the Audio Ports in 7.1-channel Conguration:
Port Function
Light Blue (Rear panel) Rear Speaker Out Lime (Rear panel) Front Speaker Out Pink (Rear panel) Central /Subwoofer Speaker Out Lime (Front panel) Side Speaker Out
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1.5 WiFi-802.11ac Module and ASRock WiFi 2.4/5 GHz Antennas
WiFi-802.11ac + BT Module
is motherboard comes with an exclusive WiFi 802.11 a/b/g/n/ac + BT v5.1 module
that oers support for WiFi 802.11 a/b/g/n/ac connectivity standards and Bluetooth
v5.1. WiFi + BT module is an easy-to-use wireless loca l area network (WLAN) adapter
to support WiFi + BT. Bluetooth v5.1 standard features Smart Ready technology that
adds a whole new class of functionality into the mobile devices. BT 5.1 also includes
Low Energy Technology and ensures extraordinary low power consumption for PCs.
* e transmission speed may vary according to the environment.
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WiFi Antennas Installation Guide
B560M Pro4/ac
Step 1
Prepare the WiFi 2.4/5 GHz Antennas that come
with the package.
Step 2
Connect the two WiFi 2.4/5 GHz Antennas to
the antenna connectors. Turn the antenna clock-
wise until it is securely connected.
Step 3
Set the WiFi 2.4/5 GHz Antenna as shown in the
illustration.
*You may need to adjust the direction of
the antenna for a stronger signal.
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Chapter 2 Installation
is is a Micro ATX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
Make sure to unplug the power cord before installing or removing the motherboard
•
components. Failure to do so may cause physical injuries and damages to motherboard
components.
In order to avoid damage from static electricity to the motherboard’s components,
•
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
Hold components by the edges and do not touch the ICs.
•
Whenever you uninstall any components, place them on a grounded anti-static pad or
•
in the bag that comes with the components.
When placing screws to secure the motherboard to the chassis, please do not over-
•
tighten the screws! Doing so may damage the motherboard.
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2.1 Installing the CPU
1
1. Before you insert the 1200-Pin CPU into the socket, please check if the P nP cap is on the socket, if the CPU surface is unclean, or if the re are any bent pins in the socket. Do not force to in sert the CPU into the socket if above situation is found. Otherwise, the CPU will be seriously damaged.
2. Unplug all power c ables before installing the CPU.
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B
2
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5
4
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Please save and replace the cover if the processor is removed. e cover must be placed if you wish to return the motherboard for aer service.
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2.2 Installing the CPU Fan and Heatsink
1 2
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CPU_FAN
2.3 Installing Memory Modules (DIMM)
is motherboard provides four 288-pin DDR4 (Double Data Rate 4) DIMM slots,
and supports Dual Channel Memory Technology.
1. For dual channe l conguration, you always nee d to insta ll identical (the same
brand, speed, size and chip-ty pe) DDR4 DIMM pairs.
2. It is unable to activate Dual Channel Me mory Technology with only one or three
memory module installed.
3. It is not allowed to in stall a DDR, DDR2 or DDR3 memory module into a DDR4
slot; otherwise, thi s motherboard and DIMM may be damaged.
Dual Channel Memory Conguration
Priority DDR4_A1 DDR4_A2 DDR4_B1 DDR4_B2
1 Populated Populated 2 Populated Populated Populated Populated
e DIMM only ts in one correct orientation. It will cause permanent damage to the motherboard and the DIMM if you force the DIMM into the slot at incorrect orientation.
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2.4 Expansion Slots (PCI Express Slots)
ere are 3 PCI Express slots on the motherboard.
Before installing an expansion c ard, please mak e sure that the powe r supply is switched o or the power cord i s unplug ged. Please read the documentation of the expan sion card and mak e necessary hardware settings for the card before you star t the installation.
PCIe slots:
11th Gen Intel® CoreTM Processors:
PCIE1 (PCIe 4.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
PCIE2 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE3 (PCIe 3.0 x16 slot) is used for PCI Express x4 lane width graphics cards.
PCIe slots:
10th Gen Intel® CoreTM Processors:
PCIE1 (PCIe 3 .0 x16 slot) is used for PCI Express x16 lane width graphics cards.
PCIE2 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE3 (PCIe 3.0 x16 slot) is used for PCI Express x4 lane width graphics cards.
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PCIe Slot Congurations
11th Gen Intel® CoreTM Processors:
PCIE1 PCIE3
Single Graphics Card Gen4x16 N/A
Two Graphics Cards in
CrossFireXTM Mode
Gen4x16 Gen3x4
10th Gen Intel® CoreTM Processors:
PCIE1 PCIE3
Single Graphics Card Gen3x16 N/A
Two Graphics Cards in
CrossFireXTM Mode
For a better ther mal environment , please conne ct a chassis fan to the motherboard’s chassis fan connector (CHA_FAN1/W P, CHA_FAN2/WP or CHA_FAN3/WP) when using multiple graphics cards.
Gen3x16 Gen3x4
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2.5 Jumpers Setup
e illustration shows how jumpers are setup. When the jumper cap is placed on
the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is
“O pen”.
Clear CMOS Jumper
(CLR MOS1)
(see p.7, No. 25)
CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system
parameters to default setup, please turn o the computer and unplug the power
cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to
short the pins on CLRMOS1 for 5 seconds. However, please do not clear the
CMOS right aer you update the BIOS. If you need to clear the CMOS when you
just nish updating the BIOS, you must boot up the system rst, and then shut it
down before you do the clear-CMOS action. Please be noted that the password,
date, time, and user default prole will be cleared only if the CMOS battery is
removed. Please remember toremove the jumper cap aer clearing the CMOS.
2-pin Jumper
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If you clear the CMOS, the case open may be detected. Please adjus t the BIOS option “Clear Status” to cl ear the record of prev ious chassis intru sion status.
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2.6 Onboard Headers and Connectors
1
1
+5V
DUMMY
SIGNAL
GND
DUMMY
SPEAKER
DUMMY
Onboard headers and connectors are NOT jumpers. Do NOT pla ce jumper caps over these headers and connectors. Placing jumper caps over the headers and connectors will cause permanent damage to the motherboard.
System Panel Header
(9-p in PA NE L1)
(see p.7, No. 15)
PWRBTN (Power Swi tch):
Connec t to the power switch on the chassis f ront panel. You may congure the way to turn o your system using the power sw itch.
RESET (Reset Sw itch): Connec t to the reset switch on the chassis f ront panel. Pre ss the reset switch to restart the computer if the computer f reezes and fails to per form a normal restart.
PLED (Syste m Power LED): Connec t to the power status indicator on the chassi s front panel. e LED is on when the system is operating. e LED keeps blinking whe n the system is in S1/S3 sle ep state. e LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Ha rd Drive Activity LED): Connec t to the hard drive ac tivity LED on the chassis f ront panel. e LED is on when the hard drive is reading or writing data.
e front panel design may dier by chassis . A front panel module mainly consists of power s witch, reset switch, power LED, hard drive ac tivity LED, speaker and etc. When connecting your cha ssis front panel modul e to this header, make sure the wire assig nments and the pin assignments are matched correc tly.
PLED+
PLED-
HDLED-
HDLED+
PWRBTN#
GND
RESET#
GND
GND
Connect the power
switch, reset switch and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
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Chassis Intrusion and
Speaker Header
(7-pi n SPK_C I1)
(see p.7, No. 21)
Please connect the
chassis intrusion and the
chassis speaker to this
header.
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