Asrock B560M-HDV R2.0 User Manual

Version 1.0

Published July 2021

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Specications and information contained in this documentation are furnished for
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With respect to the contents of this documentation, ASRock does not provide
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In no event shall ASRock, its directors, ocers, employees, or agents be liable for
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(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that

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CALIFORNIA, USA ONLY

e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/
perchlorate”

ASRock Website: http://www.asrock.com

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Contents

Chapter 1 Introduction 1

1.1 Package Contents 1

1.2 Specications 2

1.3 Motherboard Layout 6

1.4 I/O Panel 8

Chapter 2 Installation 10

2.1 Installing the CPU 11

2.2 Installing the CPU Fan and Heatsink 14

2.3 Installing Memory Modules (DIMM) 15

2.4 Expansion Slots (PCI Express Slots) 17

2.5 Jumpers Setup 18

2.6 Onboard Headers and Connectors 19

2.7 M.2_SSD (NGFF) Module Installation Guide 24

Chapter 3 Software and Utilities Operation 29

3.1 Installing Drivers 29

3.2 ASRock Motherboard Utility (A-Tuning) 30

3.2.1 Installing ASRock Motherboard Utility (A-Tuning) 30

3.2.2 Using ASRock Motherboard Utility (A-Tuning) 30

3.3 ASRock Live Update & APP Shop 33

3.3.1 UI Overview 33

3.3.2 Apps 34

3.3.3 BIOS & Drivers 37

3.3.4 Setting 38

Chapter 4 UEFI SETUP UTILITY 39

4.1 Introduction 39

4.2 EZ Mode 40

4.3 Advanced Mode 41

4.3.1 UEFI Menu Bar 41

4.3.2 Navigation Keys 42

4.4 Main Screen 43

4.5 OC Tweaker Screen 44

4.6 Advanced Screen 55

4.6.1 CPU Conguration 56

4.6.2 Chipset Conguration 58

4.6.3 Storage Conguration 61

4.6.4 Super IO Conguration 62

4.6.5 ACPI Conguration 63

4.6.6 USB Conguration 64

4.6.7 Trusted Computing 65

4.7 Tools 66

4.8 Hardware Health Event Monitoring Screen 68

4.9 Security Screen 71

4.10 Boot Screen 72

4.11 Exit Screen 75

English

B560M-HDV R2.0

Chapter 1 Introduction

ank you for purchasing ASRock B560M-HDV R2.0 motherboard, a reliable

motherboard produced under ASRock’s consistently stringent quality control.

It delivers excellent performance with robust design conforming to ASRock’s

commitment to quality and endurance.

In this documentation, Chapter 1 and 2 contains the introduction of the

motherboard and step-by-step installation guides. Chapter 3 contains the operation

guide of the soware and utilities. Chapter 4 contains the conguration guide of

the BIOS setup.

Becau se the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any
modications of this documentation occur, the updated version will be available on
ASRock’s website w ithout f urther notice. If you require technical support relate d to
this motherboard, please vi sit our website for s pecic information about the model
you are using. You may nd the l atest VGA cards and CPU suppor t list on ASRock’s
website a s well. ASRock website http://www.asrock.com.

1.1 Package Contents

ASRock B560M-HDV R2.0 Motherboard (Micro ATX Form Factor)

•

ASRock B560M-HDV R2.0 Quick Installation Guide

•

ASRock B560M-HDV R2.0 Support CD

•

2 x Serial ATA (SATA) Data Cables (Optional)

•

2 x Screws for M.2 Sockets (Option al)

•

1 x I/O Panel Shield

•

1

English

1.2 Specications

Platform

CPU

Chipset

Memory

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•

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•

•

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* 11th Gen Intel® CoreTM (i9/i7/i5) support DDR4 up to 2933;

CoreTM (i3), Pentium® and Celeron® support DDR4 up to 2666.

* 10th Gen Intel® CoreTM (i9/i7) support DDR4 up to 2933;

CoreTM (i5/i3), Pentium® and Celeron® support DDR4 up to 2666.

* Please refer to Memory Support List on ASRock's website for

more information. (http://www.asrock.com/)

•

•

•

Micro ATX Form Factor

Solid Capacitor design

th

Suppor ts 10

Intel® CoreTM Processors (LGA1200)

Digi Power design

6 Power Phase design

Supports Intel® Turbo Boost Max 3.0 Technology

Intel® B560

Dual Channel DDR4 Memory Technology

2 x DDR4 DIMM Slots

th

Gen Intel® CoreTM Processors support DDR4 non-ECC,

11

un-buered memory up to 5000+(OC)*

10th Gen Intel® CoreTM Processors support DDR4 non-ECC,

un-buered memory up to 4600+(OC)*

Supports ECC UDIMM memory modules (operate in non-

ECC mode)

Max. capacity of system memory: 64GB

Supports Intel® Extreme Memory Prole (XMP) 2.0

Gen Intel® CoreTM Processors and 11th Gen

2

Expansion
Slot

11th Gen Intel® CoreTM Processors

1 x PCI Express 4.0 x16 Slot*

•

10th Gen Intel® CoreTM Processors

1 x PCI Express 3.0 x16 Slot*

•

* Supports NVMe SSD as boot disks

2 x PCI Express 3.0 x1 Slots

•

English

B560M-HDV R2.0

Graphics

Audio

Intel® UHD Graphics Built-in Visuals and the VGA outputs

•

can be supported only with processors which are GPU

integrated.

th

Gen Intel® CoreTM Processors support Intel® Xe Graphics

11

•

Architecture (Gen 12). 10th Gen Intel® CoreTM Processors

support Gen 9 Graphics

ree graphics output options: D-Sub, DVI-D and HDMI

•

Supports Triple Monitor

•

Supports HDMI 2.0 with ma x. resolution up to 4K x 2K

•

(4096x2160) @ 60Hz

Supports DVI-D with ma x. resolution up to 1920x1200 @

•

60Hz

Supports D-Sub with max. resolution up to 1920x1200 @

•

60Hz

Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and

•

HBR (High Bit Rate Audio) with HDMI 2.0 Port (Compliant

HDMI monitor is required)

Supports HDCP 2.3 with DVI-D and HDMI 2.0 Ports

•

Supports 4K Ultra HD (UHD) playback with HDMI 2.0 Port

•

* 11th Gen Intel® CoreTM Processors support HDMI 2.0. 10th Gen

Intel® CoreTM Processors support HDMI 1.4.

7.1 CH HD Audio (Realtek ALC897 Audio Codec)

•

Supports Surge Protection

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LAN

Gigabit LAN 10/100/10 00 Mb/s

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Giga PHY Intel® I219V

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Supports Wake-On-LAN

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Supports Lightning/ESD Protection

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Supports Energy Ecient Ethernet 802.3az

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Supports PXE

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3

English

Rear Panel
I/O

Storage

Connector

1 x PS/2 Mouse/Keyboard Port

•

1 x D-Sub Port

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1 x DVI-D Port

•

1 x HDMI Port

•

2 x USB 2.0 Ports (Supports ESD Protection)

•

4 x USB 3.2 Gen1 Ports (Supports ESD Protection)

•

1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED

•

LED)

HD Audio Jacks: Line in / Front Speaker / Microphone

•

4 x SATA3 6.0 Gb/s Connectors, support Intel Rapid Storage

•

Technology 18, NCQ, AHCI and Hot Plug

1 x Hyper M.2 Socket (M2_1), supports M Key ty pe

•

2260/2280 M.2 PCI Express module up to Gen4x4 (64 Gb/s)

(Only supported with 11

1 x Ultra M.2 Socket (M2_2), supports M Key type

•

2260/2280 M.2 SATA3 6.0 Gb/s module and M.2 PCI

Express module up to Gen3 x4 (32 Gb/s)*

* Supports Intel® OptaneTM Tech nolo gy (M 2_ 2)

* Supports NVMe SSD as boot disks

* Supports ASRock U.2 Kit

1 x COM Port Header

•

1 x SPI TPM Header

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1 x Chassis Intrusion and Speaker Header

•

1 x CPU Fan Connector (4-pin)

•

* e CPU Fan Connector supports the CPU fan of ma ximum

1A (12W) fan power.

1 x CPU/Water Pump Fan Connector (4-pin) (Smart Fan

•

Speed Control)

* e CPU/Water Pump Fan supports the water cooler fan of

maximum 2A (24W) fan power.

2 x Chassis/Water Pump Fan Connectors (4-pin) (Smart Fan

•

Speed Control)

* e Chassis/Water Pump Fan supports the water cooler fan of

maximum 2A (24W) fan power.

* CPU_FAN2/WP, CHA_FAN1/WP and CHA_FAN2/WP can

auto detect if 3-pin or 4-pin fan is in use.

th

Gen Intel® Core™ Processors)*

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English

B560M-HDV R2.0

BIOS
Feature

Hardware
Monitor

1 x 24 pin ATX Power Connector

•

1 x 8 pin 12V Power Connector

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1 x Front Panel Audio Connector

•

2 x USB 2.0 Headers (Support 4 USB 2.0 ports) (Supports

•

ESD Protection)

1 x USB 3.2 Gen1 Header (Supports 2 USB 3.2 Gen1 ports)

•

(Supports ESD Protection)

AMI UEFI Legal BIOS with multilingual GUI support

•

ACPI 6.0 Compliant wake up events

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SMBIOS 2.7 Support

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CPU Core/Cache, GT, DRAM, VPPM, VCCIN_AUX,

•

VCCST, VCCSA Voltage Multi-adjustment

Fan Tachometer: CPU, CPU/Water Pump, Chassis/Water

•

Pump Fans

Quiet Fan (Auto adjust chassis fan speed by CPU tempera-

•

ture): CPU, CPU/Water Pump, Chassis/Water Pump Fans

Fan Multi-Speed Control: CPU, CPU/Water Pump, Chassis/

•

Water Pump Fans

CASE OPEN detection

•

Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore, DRAM,

•

VPPM, VCCIN_AUX, VCCSA, VCCST, ATX_5VSB

Microso® Windows® 10 64-bit

OS

Certica­tions

* For detailed product information, please visit our website: http://www.asrock .com

Please realize that the re is a certain r isk involved with overclo cking, including
adjusting the setting in the BIOS, applying Untied Overclocking Technol ogy, or using
third-party overclocking tool s. Overclocking may aect your system’s stability, or
even cause dam age to the components and devices of your system. It should be done
at your own risk and expense. We are not responsible for poss ible damage caused by
overclocking.

•

FCC, CE

•

ErP/EuP Ready (ErP/EuP ready power supply is required)

•

5

English

1.3 Motherboard Layout

20

Intel

B560

ATXP WR 1

HDLED RESET

PLED PWRBTN

PANEL1

1

RoHS

CPU_FAN1

PCIE1

1

SPK_CI1

1

PCIE2

DDR 4_B1 (6 4 bit, 28 8-pin m odule )

DDR 4_A1 (6 4 bit, 28 8-pin m odule )

ATX12V1

SATA3_1

SATA3_0

F_USB 3_1_2

CLRMOS1

1

1

HD_AUDIO1

M2_ 2

Top:

RJ-45

HDM I1

CPU_FAN2/WP

USB 2.0
T: USB1
B: USB2

CHA_FAN1/WP

PCIE3

Top:

LINE I N

Cent er:

FRON T

Bott om:

MIC IN

VGA 1

USB 3.2 G en1

T: USB3_1

B: USB3 _2

PS2

Keyb oard

/Mou se

1

SPI_TPM_J1

1

USB3_4

M2_ 1

DVI 1

USB 3.2 G en1

T: USB3_3

B: USB3 _4

BIOS
ROM

CHA_FAN2/WP

1

USB5_6

COM1

1

CMOS

Battery

SATA3_2

SATA3_3

14

11

LAN

AUDIO
CODEC

B5 6 0M - H DV

1

3

2

4

6

5

6

7

8

9

10

19

18

17

16

15

12

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English

B560M-HDV R2.0

No. Description

1 ATX 12V Power Connector (ATX12V1)

2 CPU Fan Connector (CPU_FAN1)

3 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)

4 Chassis/Water Pump Fan Connector (CHA_FAN1/WP)

5 ATX Power Connector (ATXPWR1)

6 USB 3.2 Gen1 Header (F_USB3_1_2)

7 SATA3 Connector (SATA3_1)

8 SATA3 Connector (SATA3_0)

9 SATA3 Connector (SATA3_2)(Upper)

10 SATA3 Connector (SATA3_3)(Lower)

11 SPI TPM Header (SPI_TPM_J1)

12 System Panel Header (PANEL1)

13 Clear CMOS Jumper (CLRMOS1)

14 Chassis Intrusion and Speaker Header (SPK_CI1)

15 Chassis/Water Pump Fan Connector (CHA_FAN2/WP)

16 USB 2.0 Header (USB5_6)

17 USB 2.0 Header (USB3_4)

18 COM Port Header (COM1)

19 Front Panel Audio Header (HD_ AUDIO1)

20 CPU/Water Pump Fan Connector (CPU_FAN2/WP)

7

English

1.4 I/O Panel

4

1

2 3

5

11

10

8

No. Description No. Description

1 D-Sub Port 7 USB 3.2 Gen1 Ports (USB3_3_4)

2 PS/2 Mouse/Keyboard Port 8 USB 2.0 Ports (USB1_2)

3 LAN RJ-45 Port* 9 USB 3.2 Gen1 Ports (USB3_1_2)

4 Line In (Light Blue)** 10 DVI-D Port

5 Front Speaker (Lime)** 11 HDMI Port

6 Microphone (Pink)**

* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications .

ACT/LINK LED

SPEED LED

LAN Por t

Activity / Link LED Speed LED

Status Description Status Description

O No Link O 10Mbps connection
Blinking Data Activity Orange 100Mbps connection
On Link Green 1Gbps connection

679

8

English

B560M-HDV R2.0

** Function of the Audio Ports in 7.1-channel Conguration:

Port Function

Light Blue (Rear panel) Rear Speaker Out
Lime (Rear panel) Front Speaker Out
Pink (Rear panel) Central /Subwoofer Speaker Out
Lime (Front panel) Side Speaker Out

9

English

Chapter 2 Installation

is is a Micro ATX form factor motherboard. Before you install the motherboard,

study the conguration of your chassis to ensure that the motherboard ts into it.

Pre-installation Precautions

Take note of the following precautions before you install motherboard components

or change any motherboard settings.

Make sure to unplug the power cord before installing or removing the motherboard

•

components. Failure to do so may cause physical injuries and damages to motherboard

components.

In order to avoid damage from static electricity to the motherboard’s components,

•

NEVER place your motherboard directly on a carpet. Also remember to use a grounded

wrist strap or touch a safety grounded object before you handle the components.

Hold components by the edges and do not touch the ICs.

•

Whenever you uninstall any components, place them on a grounded anti-static pad or

•

in the bag that comes with the components.

When placing screws to secure the motherboard to the chassis, please do not over-

•

tighten the screws! Doing so may damage the motherboard.

10

English

B560M-HDV R2.0

2.1 Installing the CPU

1

1. Before you insert the 1200-Pin CPU into the socke t, please check if the PnP cap is on the
socket, if the CPU surface is unclean, or if there are any bent pins in the socket. Do not
force to in sert the CPU into the socket if above situation is found. Otherwise, the CPU
will be seriously damaged.

2. Unplug all power c ables before in stalling the CPU.

A

B

2

11

English

3

5

4

12

English

B560M-HDV R2.0

Please save and replace the cover if the processor i s removed. e cover must be placed if
you wish to return the motherboard for aer service.

13

English

2.2 Installing the CPU Fan and Heatsink

1 2

14

CPU_FAN

English

B560M-HDV R2.0

2.3 Installing Memory Modules (DIMM)

is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots,

and supports Dual Channel Memory Technology.

1. For dual channel cong uration , you always need to in stall identical (the same

brand, speed , size and chip-type) DDR4 DIMM pairs.

2. It is unable to activate Du al Channel Memory Technology with only one memory

module installed.

3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4

slot; otherwise, this motherboard and DIMM may be damaged.

e DIMM only ts in one correct orientation. It will cause permanent dam age to
the mothe rboard and the DIMM if you force the DIMM into the slot at incor rect
orientation.

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English

1

2

16

3

English

B560M-HDV R2.0

2.4 Expansion Slots (PCI Express Slots)

ere are 3 PCI Express slots on the motherboard.

Before installing an ex pansion card, please make sure that the power supply is
switched o or the power cord is unplugged. Plea se read the documentation of the
expan sion card and mak e necessary hardware settings for the card before you start
the installation.

PCIe slots:

th

Gen Intel® CoreTM Processors:

11

PCIE1 (PCIe 4.0 x16 slot) is used for PCI Express x16 lane width graphics cards.

PCIE2 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

PCIE3 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

th

Gen Intel® CoreTM Processors:

10

PCIE1 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.

PCIE2 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

PCIE3 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

17

English

2.5 Jumpers Setup

e illustration shows how jumpers are setup. When the jumper cap is placed on

the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is

“O pen”.

Clear CMOS Jumper

(CLRMO S1)

(see p.6, No. 13)

CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system

parameters to default setup, please turn o the computer and unplug the power

cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to

short the pins on CLR MOS1 for 5 seconds. However, please do not clear the

CMOS right aer you update the BIOS. If you need to clear the CMOS when you

just nish updating the BIOS, you must boot up the system rst, and then shut it

down before you do the clear-CMOS action. Please be noted that the password,

date, time, and user default prole will be cleared only if the CMOS battery is

removed. Please remember toremove the jumper cap aer clearing the CMOS.

2-pin Jumper

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If you clear the CMOS, the case open may be detec ted. Please adjust the BIOS option
“Clear Status” to clear the record of previou s chassis intrusion status.

English

B560M-HDV R2.0

2.6 Onboard Headers and Connectors

Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over
these header s and connectors. Placing jumper caps over the headers and connectors
will cause permanent damage to the motherboard.

System Panel Header

(9-pi n PANEL1)

(see p.6, No. 12)

PWRBTN (Power Switch):

Connec t to the power switch on the chassi s front panel. You may congure the way to
turn o your system using the power switch.

RESET (Reset Switch):
Connec t to the reset switch on the chassi s front panel. P ress the reset sw itch to restart
the computer if the compute r freezes and fails to perform a normal restart.

PLED (Syste m Power LED):
Connec t to the power status indicator on the chassis front panel. e LED i s on when
the system is ope rating. e LED keeps blinking when the system i s in S1/S3 sleep
state. e LED is o when the system is in S4 sleep state or powered o (S5).

HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive ac tivity LED on the chassis front panel. e LED is on
when the hard drive i s reading or writing data.

e front panel de sign may dier by chassis. A front pane l module mainly consists
of power switch , reset switch, power LED, hard dr ive activity LED, speak er and etc.
When connecting your chassis front panel module to this head er, make sure the wire
assig nments and the pin assig nments are matched correctly.

1

PLED+

PLED-

HDLED-

HDLED+

PWRBTN#

GND

RESET#

GND

GND

Connect the power

switch, reset switch and

system status indicator on

the chassis to this header

according to the pin

assignments below. Note

the positive and negative

pins before connecting

the cables.

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