Asrock B560M-HDV-A R2.0 Quick Installation Guide

Version 1.0
Published July 2021
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Copyright Notice:
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infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for informational use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warranties or conditions of merchantability or tness for a particular purpose.
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is device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance controlled in Perchlorate Best Management Practices (BMP) regulations passed by the California Legislature. When you discard the Lithium battery in California, USA, please follow the related regulations in advance. “Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/ perchlorate”
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IMPORTANT - READ BEFORE COPYING, INSTALLING OR USING.
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English
B560M-HDV-A R2.0
Motherboard Layout
20
Intel
B560
ATXP WR 1
HDLED RESET
PLED PWRBTN
PANEL1
1
RoHS
CPU_FAN1
PCIE1
1
SPK_CI1
1
PCIE2
DDR 4_B1 (6 4 bit, 28 8-pin m odule )
DDR 4_A1 (6 4 bit, 28 8-pin m odule )
ATX12V1
SATA3_1
SATA3_0
F_USB 3_1_2
CLRMOS1
1
1
HD_AUDIO1
M2_ 2
Top:
RJ-45
HDM I1
CPU_FAN2/WP
USB 2.0 T: USB1 B: USB2
CHA_FAN1/WP
PCIE3
Top:
LINE I N
Cent er:
FRON T
Bott om:
MIC IN
VGA 1
USB 3.2 G en1
T: USB3_1
B: USB3 _2
PS2
Keyb oard
/Mou se
1
SPI_TPM_J1
M2_ 1
DVI 1
USB 3.2 G en1
T: USB3_3
B: USB3 _4
BIOS ROM
CHA_FAN2/WP
1
COM1
1
CMOS
Battery
SATA3_2
SATA3_3
14
11
LAN
AUDIO CODEC
B5 6 0M - H DV- A
USB5
17
1
USB3_4
1
3
2
4
6
7
8
9
10
5
19
18
16
15
12
13
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English
No. Description
1 ATX 12V Power Connector (ATX12V1)
2 CPU Fan Connector (CPU_FAN1)
3 2 x 288-pin DDR4 DIMM Slots (DDR4_ A1, DDR4_B1)
4 Chassis/Water Pump Fan Connector (CHA_FAN1/WP)
5 ATX Power Connector (ATXPWR1)
6 USB 3.2 Gen1 Header (F_USB3_1_2)
7 SATA3 Connector (SATA3_1)
8 SATA3 Connector (SATA3_0)
9 SATA3 Connector (SATA3_2)(Upper)
10 SATA3 Connector (SATA3_3)(Lower)
11 SPI TPM Header (SPI_TPM_J1)
12 System Panel Header (PANEL1)
13 Clear CMOS Jumper (CLRMOS1)
14 Chassis Intrusion and Speaker Header (SPK_CI1)
15 Chassis/Water Pump Fan Connector (CHA_FAN2/WP)
16 USB 2.0 Header (USB5)
17 USB 2.0 Header (USB3_4)
18 COM Port Header (COM1)
19 Front Panel Audio Header (HD_AUDIO1)
20 CPU/Water Pump Fan Connector (CPU_FAN2/WP)
2
English
B560M-HDV-A R2.0
I/O Panel
4
1
2 3
5
11
No. Description No. Description
1 D-Sub Port 7 USB 3.2 Gen1 Ports (USB3_3_4)
2 PS/2 Mouse/Keyboard Port 8 USB 2.0 Ports (USB1_2)
3 LAN RJ-45 Port* 9 USB 3.2 Gen1 Ports (USB3_1_2)
4 Line In (Light Blue)** 10 DVI-D Port
5 Front Speaker (Lime)** 11 HDMI Port
6 Microphone (Pink)**
* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications .
ACT/LINK LED
SPEED LED
LAN Por t
Activity / Link LED Speed LED
Status Description Status Description
O No Link O 10Mbps connection Blinking Data Activity Orange 100Mbps connection On Link Green 1Gbps connection
10
8
679
3
English
** Function of the Audio Ports in 7.1-channel Conguration:
Port Function
Light Blue (Rear panel) Rear Speaker Out Lime (Rear panel) Front Speaker Out Pink (Rear panel) Central /Subwoofer Speaker Out Lime (Front panel) Side Speaker Out
4
English
B560M-HDV-A R2.0
Chapter 1 Introduction
ank you for purchasing ASRock B560M-HDV-A R2.0 motherboard, a reliable
motherboard produced under ASRock’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock’s
commitment to quality and endurance.
Becau se the motherboard specications and the BIOS soware might be updated, the content of this documentation will be subject to change without notice. In case any modications of this documentation occur, the updated version will be available on ASRock’s website w ithout f urther notice. If you require technical support relate d to this motherboard, please vi sit our website for s pecic information about the model you are using. You may nd the l atest VGA cards and CPU suppor t list on ASRock’s website a s well. ASRock website http://www.asrock.com.
1.1 Package Contents
ASRock B560M-HDV-A R2.0 Motherboard (Micro ATX Form Factor)
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ASRock B560M-HDV-A R2.0 Quick Installation Guide
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ASRock B560M-HDV-A R2.0 Support CD
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2 x Serial ATA (SATA) Data Cables (Optional)
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2 x Screws for M.2 Sockets (Option al)
•
1 x I/O Panel Shield
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English
1.2 Specications
Platform
CPU
Chipset
Memory
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* 11th Gen Intel® CoreTM (i9/i7/i5) support DDR4 up to 2933;
CoreTM (i3), Pentium® and Celeron® support DDR4 up to 2666.
* 10th Gen Intel® CoreTM (i9/i7) support DDR4 up to 2933;
CoreTM (i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
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Micro ATX Form Factor
Solid Capacitor design
th
Suppor ts 10
Intel® CoreTM Processors (LGA1200)
Digi Power design
6 Power Phase design
Supports Intel® Turbo Boost Max 3.0 Technology
Intel® B560
Dual Channel DDR4 Memory Technology
2 x DDR4 DIMM Slots
th
Gen Intel® CoreTM Processors support DDR4 non-ECC,
11
un-buered memory up to 5000+(OC)*
10th Gen Intel® CoreTM Processors support DDR4 non-ECC,
un-buered memory up to 4600+(OC)*
Supports ECC UDIMM memory modules (operate in non-
ECC mode)
Max. capacity of system memory: 64GB
Supports Intel® Extreme Memory Prole (XMP) 2.0
Gen Intel® CoreTM Processors and 11th Gen
6
Expansion Slot
11th Gen Intel® CoreTM Processors
1 x PCI Express 4.0 x16 Slot*
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10th Gen Intel® CoreTM Processors
1 x PCI Express 3.0 x16 Slot*
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* Supports NVMe SSD as boot disks
2 x PCI Express 3.0 x1 Slots
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1 x Vertical M.2 Socket (Key E), supports type 2230 WiFi/BT
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module (Integrated WiFi/BT) (on the rear I/O)
English
B560M-HDV-A R2.0
Graphics
Audio
Intel® UHD Graphics Built-in Visuals and the VGA outputs
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can be supported only with processors which are GPU
integrated.
th
Gen Intel® CoreTM Processors support Intel® Xe Graphics
11
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Architecture (Gen 12). 10th Gen Intel® CoreTM Processors
support Gen 9 Graphics
ree graphics output options: D-Sub, DVI-D and HDMI
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Supports Triple Monitor
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Supports HDMI 2.0 with ma x. resolution up to 4K x 2K
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(4096x2160) @ 60Hz
Supports DVI-D with ma x. resolution up to 1920x1200 @
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60Hz
Supports D-Sub with max. resolution up to 1920x1200 @
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60Hz
Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and
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HBR (High Bit Rate Audio) with HDMI 2.0 Port (Compliant
HDMI monitor is required)
Supports HDCP 2.3 with DVI-D and HDMI 2.0 Ports
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Supports 4K Ultra HD (UHD) playback with HDMI 2.0 Port
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* 11th Gen Intel® CoreTM Processors support HDMI 2.0. 10th Gen
Intel® CoreTM Processors support HDMI 1.4.
7.1 CH HD Audio (Realtek ALC897 Audio Codec)
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Supports Surge Protection
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LAN
Gigabit LAN 10/100/10 00 Mb/s
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Giga PHY Intel® I219V
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Supports Wake-On-LAN
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Supports Lightning/ESD Protection
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Supports Energy Ecient Ethernet 802.3az
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Supports PXE
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English
Rear Panel I/O
Storage
Connector
1 x PS/2 Mouse/Keyboard Port
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1 x D-Sub Port
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1 x DVI-D Port
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1 x HDMI Port
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2 x USB 2.0 Ports (Supports ESD Protection)
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4 x USB 3.2 Gen1 Ports (Supports ESD Protection)
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1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
•
LED)
HD Audio Jacks: Line in / Front Speaker / Microphone
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4 x SATA3 6.0 Gb/s Connectors, support Intel Rapid Storage
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Technology 18, NCQ, AHCI and Hot Plug
1 x Hyper M.2 Socket (M2_1), supports M Key ty pe
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2260/2280 M.2 PCI Express module up to Gen4x4 (64 Gb/s)
(Only supported with 11
1 x Ultra M.2 Socket (M2_2), supports M Key type
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2260/2280 M.2 SATA3 6.0 Gb/s module and M.2 PCI
Express module up to Gen3 x4 (32 Gb/s)*
* Supports Intel® OptaneTM Tech nolo gy (M 2_ 2)
* Supports NVMe SSD as boot disks
* Supports ASRock U.2 Kit
1 x COM Port Header
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1 x SPI TPM Header
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1 x Chassis Intrusion and Speaker Header
•
1 x CPU Fan Connector (4-pin)
•
* e CPU Fan Connector supports the CPU fan of ma ximum
1A (12W) fan power.
1 x CPU/Water Pump Fan Connector (4-pin) (Smart Fan
•
Speed Control)
* e CPU/Water Pump Fan supports the water cooler fan of
maximum 2A (24W) fan power.
2 x Chassis/Water Pump Fan Connectors (4-pin) (Smart Fan
•
Speed Control)
* e Chassis/Water Pump Fan supports the water cooler fan of
maximum 2A (24W) fan power.
* CPU_FAN2/WP, CHA_FAN1/WP and CHA_FAN2/WP can
auto detect if 3-pin or 4-pin fan is in use.
th
Gen Intel® Core™ Processors)*
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English
B560M-HDV-A R2.0
BIOS Feature
Hardware Monitor
1 x 24 pin ATX Power Connector
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1 x 8 pin 12V Power Connector
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1 x Front Panel Audio Connector
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2 x USB 2.0 Headers (Support 3 USB 2.0 ports) (Supports
•
ESD Protection)
1 x USB 3.2 Gen1 Header (Supports 2 USB 3.2 Gen1 ports)
•
(Supports ESD Protection)
AMI UEFI Legal BIOS with multilingual GUI support
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ACPI 6.0 Compliant wake up events
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SMBIOS 2.7 Support
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CPU Core/Cache, GT, DRAM, VPPM, VCCIN_AUX,
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VCCST, VCCSA Voltage Multi-adjustment
Fan Tachometer: CPU, CPU/Water Pump, Chassis/Water
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Pump Fans
Quiet Fan (Auto adjust chassis fan speed by CPU tempera-
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ture): CPU, CPU/Water Pump, Chassis/Water Pump Fans
Fan Multi-Speed Control: CPU, CPU/Water Pump, Chassis/
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Water Pump Fans
CASE OPEN detection
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Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore, DRAM,
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VPPM, VCCIN_AUX, VCCSA, VCCST, ATX_5VSB
Microso® Windows® 10 64-bit
OS
Certica­tions
* For detailed product information, please visit our website: http://www.asrock .com
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FCC, CE
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ErP/EuP Ready (ErP/EuP ready power supply is required)
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9
English
Please realize that the re is a certain r isk involved with overclo cking, including adjusting the setting in the BIOS, applying Untied Overclocking Technol ogy, or using third-party overclocking tool s. Overclocking may aect your system’s stability, or even cause dam age to the components and devices of your system. It should be done at your own risk and expense. We are not responsible for poss ible damage caused by overclocking.
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English
B560M-HDV-A R2.0
Chapter 2 Installation
is is a Micro ATX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
Make sure to unplug the power cord before installing or removing the motherboard
•
components. Failure to do so may cause physical injuries and damages to motherboard
components.
In order to avoid damage from static electricity to the motherboard’s components,
•
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
Hold components by the edges and do not touch the ICs.
•
Whenever you uninstall any components, place them on a grounded anti-static pad or
•
in the bag that comes with the components.
When placing screws to secure the motherboard to the chassis, please do not over-
•
tighten the screws! Doing so may damage the motherboard.
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English
2.1 Installing the CPU
1
1. Before you insert the 1200-Pin CPU into the socke t, please check if the PnP cap is on the socket, if the CPU surface is unclean, or if there are any bent pins in the socket. Do not force to in sert the CPU into the socket if above situation is found. Otherwise, the CPU will be seriously damaged.
2. Unplug all power c ables before in stalling the CPU.
A
B
2
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