Asrock B560M-HDV-A R2.0 Quick Installation Guide

Version 1.0

Published July 2021

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CALIFORNIA, USA ONLY

e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
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“Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/
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English

B560M-HDV-A R2.0

Motherboard Layout

20

Intel

B560

ATXP WR 1

HDLED RESET

PLED PWRBTN

PANEL1

1

RoHS

CPU_FAN1

PCIE1

1

SPK_CI1

1

PCIE2

DDR 4_B1 (6 4 bit, 28 8-pin m odule )

DDR 4_A1 (6 4 bit, 28 8-pin m odule )

ATX12V1

SATA3_1

SATA3_0

F_USB 3_1_2

CLRMOS1

1

1

HD_AUDIO1

M2_ 2

Top:

RJ-45

HDM I1

CPU_FAN2/WP

USB 2.0
T: USB1
B: USB2

CHA_FAN1/WP

PCIE3

Top:

LINE I N

Cent er:

FRON T

Bott om:

MIC IN

VGA 1

USB 3.2 G en1

T: USB3_1

B: USB3 _2

PS2

Keyb oard

/Mou se

1

SPI_TPM_J1

M2_ 1

DVI 1

USB 3.2 G en1

T: USB3_3

B: USB3 _4

BIOS
ROM

CHA_FAN2/WP

1

COM1

1

CMOS

Battery

SATA3_2

SATA3_3

14

11

LAN

AUDIO
CODEC

B5 6 0M - H DV- A

USB5

17

1

USB3_4

1

3

2

4

6

7

8

9

10

5

19

18

16

15

12

13

1

English

No. Description

1 ATX 12V Power Connector (ATX12V1)

2 CPU Fan Connector (CPU_FAN1)

3 2 x 288-pin DDR4 DIMM Slots (DDR4_ A1, DDR4_B1)

4 Chassis/Water Pump Fan Connector (CHA_FAN1/WP)

5 ATX Power Connector (ATXPWR1)

6 USB 3.2 Gen1 Header (F_USB3_1_2)

7 SATA3 Connector (SATA3_1)

8 SATA3 Connector (SATA3_0)

9 SATA3 Connector (SATA3_2)(Upper)

10 SATA3 Connector (SATA3_3)(Lower)

11 SPI TPM Header (SPI_TPM_J1)

12 System Panel Header (PANEL1)

13 Clear CMOS Jumper (CLRMOS1)

14 Chassis Intrusion and Speaker Header (SPK_CI1)

15 Chassis/Water Pump Fan Connector (CHA_FAN2/WP)

16 USB 2.0 Header (USB5)

17 USB 2.0 Header (USB3_4)

18 COM Port Header (COM1)

19 Front Panel Audio Header (HD_AUDIO1)

20 CPU/Water Pump Fan Connector (CPU_FAN2/WP)

2

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B560M-HDV-A R2.0

I/O Panel

4

1

2 3

5

11

No. Description No. Description

1 D-Sub Port 7 USB 3.2 Gen1 Ports (USB3_3_4)

2 PS/2 Mouse/Keyboard Port 8 USB 2.0 Ports (USB1_2)

3 LAN RJ-45 Port* 9 USB 3.2 Gen1 Ports (USB3_1_2)

4 Line In (Light Blue)** 10 DVI-D Port

5 Front Speaker (Lime)** 11 HDMI Port

6 Microphone (Pink)**

* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications .

ACT/LINK LED

SPEED LED

LAN Por t

Activity / Link LED Speed LED

Status Description Status Description

O No Link O 10Mbps connection
Blinking Data Activity Orange 100Mbps connection
On Link Green 1Gbps connection

10

8

679

3

English

** Function of the Audio Ports in 7.1-channel Conguration:

Port Function

Light Blue (Rear panel) Rear Speaker Out
Lime (Rear panel) Front Speaker Out
Pink (Rear panel) Central /Subwoofer Speaker Out
Lime (Front panel) Side Speaker Out

4

English

B560M-HDV-A R2.0

Chapter 1 Introduction

ank you for purchasing ASRock B560M-HDV-A R2.0 motherboard, a reliable

motherboard produced under ASRock’s consistently stringent quality control.

It delivers excellent performance with robust design conforming to ASRock’s

commitment to quality and endurance.

Becau se the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any
modications of this documentation occur, the updated version will be available on
ASRock’s website w ithout f urther notice. If you require technical support relate d to
this motherboard, please vi sit our website for s pecic information about the model
you are using. You may nd the l atest VGA cards and CPU suppor t list on ASRock’s
website a s well. ASRock website http://www.asrock.com.

1.1 Package Contents

ASRock B560M-HDV-A R2.0 Motherboard (Micro ATX Form Factor)

•

ASRock B560M-HDV-A R2.0 Quick Installation Guide

•

ASRock B560M-HDV-A R2.0 Support CD

•

2 x Serial ATA (SATA) Data Cables (Optional)

•

2 x Screws for M.2 Sockets (Option al)

•

1 x I/O Panel Shield

•

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English

1.2 Specications

Platform

CPU

Chipset

Memory

•

•

•

•

•

•

•

•

•

•

•

* 11th Gen Intel® CoreTM (i9/i7/i5) support DDR4 up to 2933;

CoreTM (i3), Pentium® and Celeron® support DDR4 up to 2666.

* 10th Gen Intel® CoreTM (i9/i7) support DDR4 up to 2933;

CoreTM (i5/i3), Pentium® and Celeron® support DDR4 up to 2666.

* Please refer to Memory Support List on ASRock's website for

more information. (http://www.asrock.com/)

•

•

•

Micro ATX Form Factor

Solid Capacitor design

th

Suppor ts 10

Intel® CoreTM Processors (LGA1200)

Digi Power design

6 Power Phase design

Supports Intel® Turbo Boost Max 3.0 Technology

Intel® B560

Dual Channel DDR4 Memory Technology

2 x DDR4 DIMM Slots

th

Gen Intel® CoreTM Processors support DDR4 non-ECC,

11

un-buered memory up to 5000+(OC)*

10th Gen Intel® CoreTM Processors support DDR4 non-ECC,

un-buered memory up to 4600+(OC)*

Supports ECC UDIMM memory modules (operate in non-

ECC mode)

Max. capacity of system memory: 64GB

Supports Intel® Extreme Memory Prole (XMP) 2.0

Gen Intel® CoreTM Processors and 11th Gen

6

Expansion
Slot

11th Gen Intel® CoreTM Processors

1 x PCI Express 4.0 x16 Slot*

•

10th Gen Intel® CoreTM Processors

1 x PCI Express 3.0 x16 Slot*

•

* Supports NVMe SSD as boot disks

2 x PCI Express 3.0 x1 Slots

•

1 x Vertical M.2 Socket (Key E), supports type 2230 WiFi/BT

•

module (Integrated WiFi/BT) (on the rear I/O)

English

B560M-HDV-A R2.0

Graphics

Audio

Intel® UHD Graphics Built-in Visuals and the VGA outputs

•

can be supported only with processors which are GPU

integrated.

th

Gen Intel® CoreTM Processors support Intel® Xe Graphics

11

•

Architecture (Gen 12). 10th Gen Intel® CoreTM Processors

support Gen 9 Graphics

ree graphics output options: D-Sub, DVI-D and HDMI

•

Supports Triple Monitor

•

Supports HDMI 2.0 with ma x. resolution up to 4K x 2K

•

(4096x2160) @ 60Hz

Supports DVI-D with ma x. resolution up to 1920x1200 @

•

60Hz

Supports D-Sub with max. resolution up to 1920x1200 @

•

60Hz

Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and

•

HBR (High Bit Rate Audio) with HDMI 2.0 Port (Compliant

HDMI monitor is required)

Supports HDCP 2.3 with DVI-D and HDMI 2.0 Ports

•

Supports 4K Ultra HD (UHD) playback with HDMI 2.0 Port

•

* 11th Gen Intel® CoreTM Processors support HDMI 2.0. 10th Gen

Intel® CoreTM Processors support HDMI 1.4.

7.1 CH HD Audio (Realtek ALC897 Audio Codec)

•

Supports Surge Protection

•

LAN

Gigabit LAN 10/100/10 00 Mb/s

•

Giga PHY Intel® I219V

•

Supports Wake-On-LAN

•

Supports Lightning/ESD Protection

•

Supports Energy Ecient Ethernet 802.3az

•

Supports PXE

•

7

English

Rear Panel
I/O

Storage

Connector

1 x PS/2 Mouse/Keyboard Port

•

1 x D-Sub Port

•

1 x DVI-D Port

•

1 x HDMI Port

•

2 x USB 2.0 Ports (Supports ESD Protection)

•

4 x USB 3.2 Gen1 Ports (Supports ESD Protection)

•

1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED

•

LED)

HD Audio Jacks: Line in / Front Speaker / Microphone

•

4 x SATA3 6.0 Gb/s Connectors, support Intel Rapid Storage

•

Technology 18, NCQ, AHCI and Hot Plug

1 x Hyper M.2 Socket (M2_1), supports M Key ty pe

•

2260/2280 M.2 PCI Express module up to Gen4x4 (64 Gb/s)

(Only supported with 11

1 x Ultra M.2 Socket (M2_2), supports M Key type

•

2260/2280 M.2 SATA3 6.0 Gb/s module and M.2 PCI

Express module up to Gen3 x4 (32 Gb/s)*

* Supports Intel® OptaneTM Tech nolo gy (M 2_ 2)

* Supports NVMe SSD as boot disks

* Supports ASRock U.2 Kit

1 x COM Port Header

•

1 x SPI TPM Header

•

1 x Chassis Intrusion and Speaker Header

•

1 x CPU Fan Connector (4-pin)

•

* e CPU Fan Connector supports the CPU fan of ma ximum

1A (12W) fan power.

1 x CPU/Water Pump Fan Connector (4-pin) (Smart Fan

•

Speed Control)

* e CPU/Water Pump Fan supports the water cooler fan of

maximum 2A (24W) fan power.

2 x Chassis/Water Pump Fan Connectors (4-pin) (Smart Fan

•

Speed Control)

* e Chassis/Water Pump Fan supports the water cooler fan of

maximum 2A (24W) fan power.

* CPU_FAN2/WP, CHA_FAN1/WP and CHA_FAN2/WP can

auto detect if 3-pin or 4-pin fan is in use.

th

Gen Intel® Core™ Processors)*

8

English

B560M-HDV-A R2.0

BIOS
Feature

Hardware
Monitor

1 x 24 pin ATX Power Connector

•

1 x 8 pin 12V Power Connector

•

1 x Front Panel Audio Connector

•

2 x USB 2.0 Headers (Support 3 USB 2.0 ports) (Supports

•

ESD Protection)

1 x USB 3.2 Gen1 Header (Supports 2 USB 3.2 Gen1 ports)

•

(Supports ESD Protection)

AMI UEFI Legal BIOS with multilingual GUI support

•

ACPI 6.0 Compliant wake up events

•

SMBIOS 2.7 Support

•

CPU Core/Cache, GT, DRAM, VPPM, VCCIN_AUX,

•

VCCST, VCCSA Voltage Multi-adjustment

Fan Tachometer: CPU, CPU/Water Pump, Chassis/Water

•

Pump Fans

Quiet Fan (Auto adjust chassis fan speed by CPU tempera-

•

ture): CPU, CPU/Water Pump, Chassis/Water Pump Fans

Fan Multi-Speed Control: CPU, CPU/Water Pump, Chassis/

•

Water Pump Fans

CASE OPEN detection

•

Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore, DRAM,

•

VPPM, VCCIN_AUX, VCCSA, VCCST, ATX_5VSB

Microso® Windows® 10 64-bit

OS

Certica­tions

* For detailed product information, please visit our website: http://www.asrock .com

•

FCC, CE

•

ErP/EuP Ready (ErP/EuP ready power supply is required)

•

9

English

Please realize that the re is a certain r isk involved with overclo cking, including
adjusting the setting in the BIOS, applying Untied Overclocking Technol ogy, or using
third-party overclocking tool s. Overclocking may aect your system’s stability, or
even cause dam age to the components and devices of your system. It should be done
at your own risk and expense. We are not responsible for poss ible damage caused by
overclocking.

10

English

B560M-HDV-A R2.0

Chapter 2 Installation

is is a Micro ATX form factor motherboard. Before you install the motherboard,

study the conguration of your chassis to ensure that the motherboard ts into it.

Pre-installation Precautions

Take note of the following precautions before you install motherboard components

or change any motherboard settings.

Make sure to unplug the power cord before installing or removing the motherboard

•

components. Failure to do so may cause physical injuries and damages to motherboard

components.

In order to avoid damage from static electricity to the motherboard’s components,

•

NEVER place your motherboard directly on a carpet. Also remember to use a grounded

wrist strap or touch a safety grounded object before you handle the components.

Hold components by the edges and do not touch the ICs.

•

Whenever you uninstall any components, place them on a grounded anti-static pad or

•

in the bag that comes with the components.

When placing screws to secure the motherboard to the chassis, please do not over-

•

tighten the screws! Doing so may damage the motherboard.

11

English

2.1 Installing the CPU

1

1. Before you insert the 1200-Pin CPU into the socke t, please check if the PnP cap is on the
socket, if the CPU surface is unclean, or if there are any bent pins in the socket. Do not
force to in sert the CPU into the socket if above situation is found. Otherwise, the CPU
will be seriously damaged.

2. Unplug all power c ables before in stalling the CPU.

A

B

2

12

English

B560M-HDV-A R2.0

3

5

4

13

English

Please save and replace the cover if the processor i s removed. e cover must be placed if
you wish to return the motherboard for aer service.

14

English

B560M-HDV-A R2.0

2.2 Installing the CPU Fan and Heatsink

1 2

CPU_FAN

15

English

2.3 Installing Memory Modules (DIMM)

is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots,

and supports Dual Channel Memory Technology.

1. For dual channel cong uration , you always need to in stall identical (the same

brand, speed , size and chip-type) DDR4 DIMM pairs.

2. It is unable to activate Du al Channel Memory Technology with only one memory

module installed.

3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4

slot; otherwise, this motherboard and DIMM may be damaged.

e DIMM only ts in one correct orientation. It will cause permanent dam age to
the mothe rboard and the DIMM if you force the DIMM into the slot at incor rect
orientation.

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English

B560M-HDV-A R2.0

1

2

3

17

English

2.4 Expansion Slots (PCI Express Slots)

ere are 3 PCI Express slots on the motherboard.

Before installing an ex pansion card, please make sure that the power supply is
switched o or the power cord is unplugged. Plea se read the documentation of the
expan sion card and mak e necessary hardware settings for the card before you start
the installation.

PCIe slots:

th

Gen Intel® CoreTM Processors:

11

PCIE1 (PCIe 4.0 x16 slot) is used for PCI Express x16 lane width graphics cards.

PCIE2 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

PCIE3 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

th

Gen Intel® CoreTM Processors:

10

PCIE1 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.

PCIE2 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

PCIE3 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

18

English

B560M-HDV-A R2.0

2.5 Jumpers Setup

e illustration shows how jumpers are setup. When the jumper cap is placed on

the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is

“O pen”.

Clear CMOS Jumper

(CLRMO S1)

(see p.1, No. 13)

CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system

parameters to default setup, please turn o the computer and unplug the power

cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to

short the pins on CLR MOS1 for 5 seconds. However, please do not clear the

CMOS right aer you update the BIOS. If you need to clear the CMOS when you

just nish updating the BIOS, you must boot up the system rst, and then shut it

down before you do the clear-CMOS action. Please be noted that the password,

date, time, and user default prole will be cleared only if the CMOS battery is

removed. Please remember toremove the jumper cap aer clearing the CMOS.

2-pin Jumper

If you clear the CMOS, the case open may be detec ted. Please adjust the BIOS option
“Clear Status” to clear the record of previou s chassis intrusion status.

19

English

2.6 Onboard Headers and Connectors

1

Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over
these header s and connectors. Placing jumper caps over the headers and connectors
will cause permanent damage to the motherboard.

System Panel Header

(9-pi n PANEL1)

(see p.1, No. 12)

PWRBTN (Power Switch):

Connec t to the power switch on the chassi s front panel. You may congure the way to
turn o your system using the power switch.

RESET (Reset Switch):
Connec t to the reset switch on the chassi s front panel. P ress the reset sw itch to restart
the computer if the compute r freezes and fails to perform a normal restart.

PLED (Syste m Power LED):
Connec t to the power status indicator on the chassis front panel. e LED i s on when
the system is ope rating. e LED keeps blinking when the system i s in S1/S3 sleep
state. e LED is o when the system is in S4 sleep state or powered o (S5).

HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive ac tivity LED on the chassis front panel. e LED is on
when the hard drive i s reading or writing data.

e front panel de sign may dier by chassis. A front pane l module mainly consists
of power switch , reset switch, power LED, hard dr ive activity LED, speak er and etc.
When connecting your chassis front panel module to this head er, make sure the wire
assig nments and the pin assig nments are matched correctly.

PLED+

PLED-

HDLED-

HDLED+

PWRBTN#

GND

RESET#

GND

GND

Connect the power

switch, reset switch and

system status indicator on

the chassis to this header

according to the pin

assignments below. Note

the positive and negative

pins before connecting

the cables.

20

English

B560M-HDV-A R2.0

Chassis Intrusion and

DUMMY

GND

GND

P+

P-

USB_PWR

P+

P-

USB_PWR

1

1

USB_PWR

P-

P+

GND

1

+5V

DUMMY

SIGNAL

GND

DUMMY

SPEAKER

DUMMY

Speaker Header

(7-pi n SPK _CI1)

(see p.1, No. 14)

Please connect the

chassis intrusion and the

chassis speaker to this

header.

Serial ATA3 Connectors

Ver ti c a l:

(SATA3_0:

see p.1, No. 8)

(SATA3_1:

see p.1, No. 7)

Right Angle:

(SATA3_ 2:

see p.1, No. 9)(Upper)

(SATA3_ 3:

see p.1, No. 10)(Lower)

USB 2.0 Headers

(9-pin USB3_4)

(see p.1, No. 17)

(9-pin USB5)

(see p.1, No. 16)

SATA3_1

SATA3_2

ese four SATA3

connectors support SATA

data cables for internal

SATA3_0

storage devices with up to

6.0 Gb/s data transfer rate.

SATA3_3

ere are two USB

2.0 headers on this

motherboard.

USB 3.2 Gen1 Header

(19-pin F_USB3_1_2)

(see p.1, No. 6)

IntA_PA_SSRX-

IntA_PA_SSRX+

IntA_PA_SSTX-

IntA_PA_SSTX+

IntA_PA_D-

IntA_PA_D+

Vbus

GND

GND

VbusVbus

IntA_PB_SSRX-

IntA_PB_SSRX+

GND

IntA_PB_SSTX-

IntA_PB_SSTX+

GND

IntA_PB_D-

IntA_PB_D+

Dummy

1

ere is one header on

this motherboard. is

USB 3.2 Gen1 header can

support two ports.

21

English

Front Panel Audio Header

J_SENSE

OUT2_L

1

MIC_RET

PRESENCE#

GND

OUT2_R

MIC2_R

MIC2_L

OUT_RET

GND

OL

FAN_SPEED_CONTROL

1 2 3 4

(9-pin HD_ AUDIO1)

(see p.1, No. 19)

1. High Denition Audio support s Jack Sensing , but the panel wire on the cha ssis

must support HDA to function correctly. Please follow the instructions in our
manual and chassis manual to install your system.

2. If you use an AC’97 audio panel , please install it to th e front panel audio header by

the steps below:
A. Connect Mic_IN (MIC) to MIC2_ L.
B. Conne ct Audio_R (RIN) to OUT2_R and Audio_ L (LIN) to OUT2_ L.
C. Connect Ground (GND) to Ground (GND).
D. MIC_ RET and OUT_RET are for the HD audio panel only. You don’t need to
connec t them for the AC’97 audio panel.
E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel
and adjust “Recording Volume”.

is header is for

connecting audio devices

to the front audio panel.

22

Chassis/Water Pump Fan

Connectors

(4-pin CHA_FAN1/WP)

(see p.1, No. 4)

(4-pin CHA_FAN2/WP)

(see p.1, No. 15)

CPU Fan Connector

(4-pin CPU_FAN1)

(see p.1, No. 2)

FAN_VOLTAGE

FAN_SPEED

1 2 3 4

CPU_FAN_SPEED

FAN_SPEED_CONTR

+12V

GND

is motherboard

provides three 4-Pin water

cooling

chassis

fan

connectors. If you plan to

connect a 3-Pin

chassis

water cooler fan, please

connect it to Pin 1-3.

is motherboard pro-

vides a 4-Pin CPU fan

(Quiet Fan) connector.

If you plan to connect a

3-Pin CPU fan, please

connect it to Pin 1-3.

English

B560M-HDV-A R2.0

CPU/Water Pump Fan

FA

1

2

3

4

4

1

8 5

1

SPI_DQ3

Connector

(4-pin CPU_FAN2/WP)

(see p.1, No. 20)

N_SPEED_CONTROL

FAN_SPEED

FAN_VOLTAGE

GND

is motherboard

provides a 4-Pin water

cooling CPU fan

connector. If you plan

to connect a 3-Pin CPU

water cooler fan, please

connect it to Pin 1-3.

ATX Power Connector

(24-p i n ATX PWR1)

(see p.1, No. 5)

ATX 12V Power

Connector

(8-pin ATX12V1)

(see p.1, No. 1)

SPI TPM Header

(13 -pi n SPI_T PM _J1)

(see p.1, No. 11)

12

1

+3.3V

SPI_CS0

SPI_DQ2

Dummy

CLK

RSMRST#

SPI_MISO

24

13

SPI_MOSI

RST#

TPM_PIRQ

SPI_TPM_CS#

GND

is motherboard pro-

vides a 24-pin ATX power

connector. To use a 20-pin

ATX power supply, please

plug it along Pin 1 and Pin

13.

is motherboard pro-

vides a 8-pin ATX 12V

power connector. To use a

4-pin ATX power supply,

please plug it along Pin 1

and Pin 5.

*Warning: Please make

sure that the power cable

connected is for the CPU

and not the graphics

card. Do not plug the

PCIe power cable to this

connector.

is connector supports SPI

Trusted Platform Module (TPM)

system, which can securely

store keys, digital certicates,

passwords, and data. A TPM

system also helps enhance

network securit y, protects digital

identities, and ensures platform

integrity.

23

English

Serial Port Header

1

(9-p in CO M1)

(see p.1, No. 18)

RRXD1

DDTR#1

TTXD1

DDCD#1

DDSR#1

CCTS#1

RRTS#1

GND

is COM1 header

supports a serial port

module.

RRI#1

24

English

B560M-HDV-A R2.0

2.7 M.2_SSD (NGFF) Module Installation Guide

2

The M.2, a lso known as the Next Generation Form Factor (NGFF), is a small size and

versatile card edge connector that aims to replace mPCIe and mSATA. e Hy per M.2

Socket (M2_1) supports M Key type 2260/2280 M.2 PCI Express module up to Gen4x4 (64

Gb/s) (Only supported with 11th Gen Intel® Core™ Processors). e Ultra M.2 Socket (M2_2),

supports M Key type 2260/2280 M.2 SATA3 6.0 Gb/s module and M.2 PCI Express module

up to Gen3 x4 (32 Gb/s).

Installing the M.2_SSD (NGFF) Module

Step 1

Prepare a M.2_SSD (NGFF) module

and the screw.

Step 2

1

Depending on the PCB type and

length of your M.2_SSD (NGFF)

module, nd the corresponding nut

location to be used.

AB

No. 1 2

Nut Location A B

PCB Length 6cm 8cm

Module Type Type2260 Ty pe 2 280

25

English

Step 3

Move the stando based on the

module type and length.

B

A

e stando is placed at the nut

location B by default. Skip Step 3 and

4 and go straight to Step 5 if you are

going to use the default nut.

Otherwise, release the stando by

hand.

Step 4

Peel o the yellow protective lm on

the nut to be used. Hand tighten the

B

A

stando into the desired nut location

on the motherboard.

Step 5

Align and gently insert the M.2

(NGFF) SSD module into the M.2

slot. Please be aware that the M.2

(NGFF) SSD module only ts in one

AB

o

20

orientation.

26

AB

Step 6

Tighten the screw with a screwdriver

to secure the module into place.

Please do not overtighten the screw as

NUT1NUT2B

this might damage the module.

English

B560M-HDV-A R2.0

M.2_SSD (NGFF) Module Support List (M2_1)

Vendor Interface P/N

ADATA PCIe3 x4 ASX7000NP-128GT-C
ADATA PCIe3 x4 ASX8000NP-256GM-C
ADATA PCIe3 x4 ASX7000NP-256GT-C
ADATA PCIe3 x4 ASX8000NP-512GM-C
ADATA PCIe3 x4 ASX7000NP-512GT-C
Apacer PCIe3 x4 AP240GZ280
Corsair PCIe3 x4 CSSD-F240GBMP500
Intel PCIe3 x4 SSDPEKKF256G7
Intel PCIe3 x4 SSDPEKK F512G7
Kingston PCIe3 x4 SKC1000/480G
Kingston PCIe2 x4 SH2280S3/480G
OCZ PCIe3 x4 RVD400-M2280-512G (NVME)
PAT R IOT PCIe3 x4 PH240GPM280SSDR NVME
Plextor PCIe3 x4 PX-128M8PeG
Plextor PCIe3 x4 PX-1TM8PeG
Plextor PCIe3 x4 PX-256M8PeG
Plextor PCIe3 x4 PX-512M8Pe G
Plextor PCIe PX-G25 6M6e
Plextor PCIe PX-G512M6e
Samsung PCIe3 x4 SM961 MZVPW128HEGM (NVM)
Samsung PCIe3 x4 PM961 MZVLW128HEGR (NVME)
Samsung PCIe3 x4 960 EVO (MZ-V6E250) (NVME)
Samsung PCIe3 x4 960 EVO (MZ-V6E250BW) (NVME)
Samsung PCIe3 x4 SM951 (N VME)
Samsung PCIe3 x4 SM951 (MZHPV256HDGL)
Samsung PCIe3 x4 SM951 (MZHPV512HDGL)
Samsung PCIe3 x4 SM951 (N VME)
Samsung PCIe x4 XP941-512G (MZHPU512HCGL)
SanDisk PCIe SD6PP4M-12 8G
SanDisk PCIe SD6PP4M-256G
TEAM PCIe3 x4 TM8FP2240G 0C101
TEAM PCIe3 x4 TM8FP2480GC110
WD PCIe3 x4 WDS256G1X0C-00ENX0 (NVME)
WD PCIe3 x4 WDS512G1X0C- 00ENX0 (NVME)

For the latest updates of M.2_SSD (NFGG) module support list, please visit our website for

details: http://www.asrock.com

27

English

28

M.2_SSD (NGFF) Module Support List (M2_2)

Vendor Interface P/N

ADATA SATA3 AXNS330E-32GM-B
ADATA SATA3 AXNS381E-128GM-B
ADATA SATA3 AXNS3 81E-256GM-B
ADATA SATA3 ASU800NS38-256GT-C
ADATA SATA3 ASU800NS38-512GT-C
ADATA PCIe3 x4 ASX7000NP-128GT-C
ADATA PCIe3 x4 ASX8000NP-256GM-C
ADATA PCIe3 x4 ASX7000NP-256GT-C
ADATA PCIe3 x4 ASX8000NP-512GM-C
ADATA PCIe3 x4 ASX7000NP-512GT-C
Apacer PCIe3 x4 AP240GZ280
Corsair PCIe3 x4 CSSD-F240GBMP500
Crucial SATA3 CT120M500SSD4
Crucial SATA3 CT240M500SSD4
Intel SATA3 Intel SSDSCKGW080A401/80G
Intel PCIe3 x4 SSDPEKKF256G7
Intel PCIe3 x4 SSDPEKK F512G7
Kingston SATA3 SM2280S3
Kingston PCIe3 x4 SKC1000/480G
Kingston PCIe2 x4 SH2280S3/480G
OCZ PCIe3 x4 RVD400-M2280-512G (NVME)
PAT R IOT PCIe3 x4 PH240GPM280SSDR NVME
Plextor PCIe3 x4 PX-128M8PeG
Plextor PCIe3 x4 PX-1TM8PeG
Plextor PCIe3 x4 PX-256M8PeG
Plextor PCIe3 x4 PX-512M8Pe G
Plextor PCIe PX-G25 6M6e
Plextor PCIe PX-G512M6e
Samsung PCIe3 x4 SM961 MZVPW128HEGM (NVM)
Samsung PCIe3 x4 PM961 MZVLW128HEGR (NVME)
Samsung PCIe3 x4 960 EVO (MZ-V6E250) (NVME)
Samsung PCIe3 x4 960 EVO (MZ-V6E250BW) (NVME)
Samsung PCIe3 x4 SM951 (N VME)
Samsung PCIe3 x4 SM951 (MZHPV256HDGL)
Samsung PCIe3 x4 SM951 (MZHPV512HDGL)
Samsung PCIe3 x4 SM951 (N VME)
Samsung PCIe x4 XP941-512G (MZHPU512HCGL)
SanDisk PCIe SD 6PP4 M-128 G
SanDisk PCIe SD6PP4M-256G
Team SATA3 TM4PS4128GMC105
Team SATA3 TM4PS4256GMC105
Team SATA3 TM8PS4128GMC105
Team SATA3 TM8PS4256GMC105

English

B560M-HDV-A R2.0

TEAM PCIe3 x4 TM8FP2240G 0C101
TEAM PCIe3 x4 TM8FP2480GC110
Tra nscend SATA3 TS256GMTS400
Tra nscend SATA3 TS512GMTS600
Tra nscend SATA3 TS512GMTS800
V-Col or SATA3 VLM100-120G-2280B-RD
V-Col or SATA3 VL M10 0-240G-2280RGB
V-Col or SATA3 VSM100 -240G-2280
V-Col or SATA3 VL M10 0-240G-2280B -R D
WD SATA3 WDS100T1B0B-00AS40
WD SATA3 WDS240G1G0B-00RC30
WD PCIe3 x4 WDS256G1X0C-00ENX0 (NVME)
WD PCIe3 x4 WDS512G1X0C- 00ENX0 (NVME)

For the latest updates of M.2_SSD (NFGG) module support list, please visit our website for

details: http://www.asrock.com

29

簡体中文

1 简介

感谢您购买华擎 B560M-HDV-A R2.0 主板，这是按照华擎一贯严格质量控制标准生
产的性能可靠的主板。它提供符合华擎质量和耐久性承诺的精良设计和卓越性能。

由于主板规格和 BIOS 软件可能已更新，因此，本文档的内容可能会随时更改，恕不另
行通知。如果本文档有任何修改，则更新的版本将发布在华擎网站上，我们不会另外进
行通知。如果您需要与此主板相关的技术支持，请访问我们的网站以具体了解所用型
号的信息。您也可以在华擎网站上找到最新 VGA 卡和 CPU 支持列表。华擎网站
http://www.asrock.com。

1.1 包装清单

•华擎 B560M-HDV-A R2.0 主板（Micro ATX 规格尺寸）

•华擎 B560M-HDV-A R2.0 快速安装指南

•华擎 B560M-HDV-A R2.0 支持光盘

•2 x 串行 ATA (SATA) 数据线（选购）

•2 x 螺丝（供 M.2 插座使用）（选购）

•1 x I/O 面板

30

B560M-HDV-A R2.0

簡体中文

1.2 规格

平台

CPU

芯片集

内存

•Micro ATX 规格尺寸

•稳固的电容器设计

•支持第 10 代 Intel® CoreTM处理器及 11 代 Intel® CoreTM 处理
器 (LGA1200)

•Digi Power design

•6 电源相设计

•支持 Intel® Turbo Boost Max Technology 3.0

•

Intel® B560

•双通道 DDR4 内存技术

•2 x DDR4 DIMM 槽

•第 11 代 Intel® CoreTM 处理器支持 DDR4 非 ECC、非缓冲内
存，最高支持 5000+(OC)*

•第 10 代 Intel® CoreTM 处理器支持 DDR4 非 ECC、非缓冲内
存，最高支持 4600+(OC)*

* 第 11 代 Intel® CoreTM (i9/i7/i5) 可支持的 DDR4 的最高频率为
2933；CoreTM (i3)、Pentium® 和 Celeron® 可支持的 DDR4 的最
高频率为 2666。
* 第 10 代 Intel® CoreTM (i9/i7) 可支持的 DDR4 的最高频率为
2933；CoreTM (i5/i3)、Pentium® 和 Celeron®可支持的 DDR4
的最高频率为 2666。
* 请参阅华擎网站上的 Memory Support List（内存支持列表）了
解详情。(http://www.asrock.com/)

•支持 ECC UDIMM 内存模块（非 ECC 模式操作）

•支持系统内存最大容量：64GB

•支持 Intel® Extreme Memory Profile (XMP) 2.0

扩充槽

第 11 代 Intel® CoreTM 处理器

•1 x PCI Express 4.0 x16 槽 *

第 10 代 Intel® CoreTM 处理器

•1 x PCI Express 3.0 x16 槽 *

* 支持 NVMe SSD 用作启动盘

•2 x PCI Express 3.0 x1 槽

•1 x 垂直 M.2 Socket (Key E)，支持类型 2230 WiFi/BT 模块
( 集成 WiFi/BT)（在后 I/O 上）

31

簡体中文

图形

•只有 GPU 集成的处理器才支持 Intel® UHD Graphics 内置视
效和 VGA 输出。

•第 11 代 Intel® CoreTM 处理器支持 Intel® Xe 图形架构 (Gen

12) 第 10 代 Intel® CoreTM 处理器支持 Gen 9 图形

•3 个图形输出选项：D-Sub、DVI-D 和 HDMI

•支持三台显示器

•支持 HDMI 2.0，60Hz 时最大分辨率达 4K x 2K (4096x2160)

•支持 DVI-D，60Hz 时最大分辨率达 1920x1200

•支持 D-Sub，60Hz 时最大分辨率达 1920x1200

•通过 HDMI 2.0 端口（需要兼容的 HDMI 显示器）支持 Auto
Lip Sync、Deep Color (12bpc)、xvYCC和 HBR（高位速率音频）

•通过 DVI-D 和 HDMI 2.0 端口支持 HDCP 2.3

•通过 HDMI 2.0 端口支持 4K 超高清 (UHD) 播放

* 第 11 代 Intel® CoreTM 处理器支持 HDMI 2.0。第 10 代 Intel®
CoreTM 处理器支持 HDMI 1.4。

音频

LAN

后面板 I/O

•7.1 CH 高清音频（Realtek ALC897 音频编解码器）

•支持电涌保护

•Gigabit LAN 10/100/1000 Mb/s

•Giga PHY Intel® I219V

•支持 Wake-On-LAN（网上唤醒）

•支持雷电 /ESD 保护

•支持高能效以太网 802.3az

•支持 PXE

•1 x PS/2 鼠标 / 键盘端口

•1 x D-Sub 端口

•1 x DVI-D 端口

•1 x HDMI 端口

•2 x USB 2.0 端口（支持 ESD 保护）

•4 x USB 3.2 Gen1 端口（支持 ESD 保护）

•1 x RJ-45 LAN 端口，带 LED（ACT/LINK LED 和 SPEED
LED）

•高清音频插孔： 线路输入 / 前扬声器 / 麦克风

32

B560M-HDV-A R2.0

簡体中文

存储

•4 x SATA3 6.0 Gb/s 接口，支持 Intel Rapid Storage Technology
18、NCQ、AHCI 和热插拔

•1 x Hyper M.2 接口 (M2_1)，最高支持 Gen4x4 (64 Gb/s) M
Key 类型 2260/2280 M.2 PCI Express 模块（仅 11 代 Intel®
Core ™ 处理器可支持）*

•1 x 超级 M.2 接口 (M2_2)，支持 M Key 类型 2260/2280 M.2
SATA3 6.0 Gb/s 模块和 M.2 PCI Express 模块（最高 Gen3
x4 (32 Gb/s)）*

* 支持 Intel® OptaneTM Technology (M2_2)
* 支持 NVMe SSD 用作启动盘
* 支持华擎 U.2 套件

接口

•1 x COM 端口接脚

•1 x SPI TPM 接脚

•1 x 机箱侵入和扬声器接脚

•1 x CPU 风扇接口（4 针）

* CPU 风扇接口支持最高 1A (12W) 功率的 CPU 风扇。

•1 x CPU/ 水泵风扇接口（4 针）（智能风扇速度控制）

* CPU/ 水泵风扇支持最高 2A (24W) 功率的水冷风扇。

•2 x 机箱 / 水泵风扇接口（4 针）（智能风扇速度控制）

* 机箱 / 水泵风扇支持最高 2A (24W) 功率的水冷风扇。
* CPU_FAN2/WP、CHA_FAN1/WP 和 CHA_FAN2/WP 可以自
动检测 3 针脚或 4 针脚风扇是否在使用。

•1 x 24 针 ATX 电源接口

•1 x 8 针 12V 电源接口

•1 x 前面板音频接口

•2 x USB 2.0 接脚（支持 3 个 USB 2.0 端口，支持 ESD 保护）

•1 x USB 3.2 Gen1 接脚（支持 2 个 USB 3.2 Gen1 端口，支
持 ESD 保护）

•AMI UEFI Legal BIOS，支持多语言 GUI

•ACPI 6.0 兼容唤醒事件

•支持 SMBIOS 2.7

•CPU 内核 / 缓存、GT、DRAM、VPPM、VCCIN_AUX、
VCCST、VCCSA 电压多次调整

33

簡体中文

BIOS 功能
特点

•AMI UEFI Legal BIOS，支持多语言 GUI

•ACPI 6.0 兼容唤醒事件

•支持 SMBIOS 2.7

•CPU 内核/ 缓存、GT、DRAM、VPPM、VCCIN_AUX、VCCST、
VCCSA 电压多次调整

硬件监控

•风扇转速计：CPU、CPU/ 水泵、机箱 / 水泵风扇

•静音风扇（根据 CPU 温度自动调整机箱风扇速度）：CPU、
CPU/ 水泵、机箱 / 水泵风扇

•风扇多种速度控制：CPU、CPU/ 水泵、机箱 / 水泵风扇

•CASE OPEN（机箱打开）检测

•电压监控：+12V、+5V、+3.3V、CPU Vcore、DRAM、VPPM、
VCCIN_AUX、VCCSA、VCCST、ATX_5VSB

操作系统

认证

•Microsoft® Windows® 10 64-bit

•FCC、CE

•ErP/EuP 支持（需要支持 ErP/EuP 的电源）

* 有关详细产品信息，请访问我们的网站：http://www.asrock.com

须认识到超频会有一定风险，包括调整 BIOS 设置，应用“自由超频技术”，或使用第三
方超频工具。超频可能会影响到系统的稳定性，甚至对系统的组件和设备造成损坏。执
行这项工作您应自担风险和费用。我们对由于超频而造成的损坏概不负责。

34

B560M-HDV-A R2.0

簡体中文

1.3 跳线设置

此图显示如何设置跳线。将跳线帽装到这些针脚上时，跳线 “短接”。如果这些
针脚上没有装跳线帽，跳线 “开路”。

清除 CMOS 跳线
(CLRMOS1)
（见第 1 页，第 13 个）

CLRMOS1 允许您清除CMOS 中的数据。要清除和重置系统参数到默认设置，请关
闭计算机，从电源上拔下电源线插头。等候 15秒后，使用跳线帽将 CLRMOS1上的
针脚短接 5 秒。但是，请勿在更新 BIOS 后立即清除 CMOS。如果您需要在刚完成
BIOS 更新后清除 CMOS，则必须先启动系统，并在关闭后再执行清除 CMOS 操作。
请注意，密码、日期、时间和用户默认配置文件只在卸下 CMOS 电池后才会被清除。
请记住在清除 CMOS 后取下跳线帽。

2 针跳线

如果您清除 CMOS，机箱打开会被检测到。请将 BIOS 选项“Clear Status”（清除状态）调
整为清除前一个机箱侵入状态的记录。

35

簡体中文

1.4 板载接脚和接口

1

板载接脚和接口不是跳线。不要将跳线帽装到这些接脚和接口上。将跳线帽装到这些
接脚和接口上将会对主板造成永久性损坏。

系统面板接头
（9 针 PANEL1）
（见第 1 页， 第 12 个）

PWRBTN（电源开关）:

连接到机箱前面板上的电源开关。您可以配置使用电源开关关闭系统的方式。

RESET（重置开关）:
连接到机箱前面板上的重置开关。如果计算机死机，无法执行正常重新启动，按重置开
关重新启动计算机。

PLED（系统电源 LED）:
连接到机箱前面板上的电源状态指示灯。系统操作操作时，此 LED 亮起。系统处在 S1/
S3 睡眠状态时，此 LED 闪烁。系统处在 S4 睡眠状态或关机 (S5) 时，此 LED 熄灭。

HDLED（硬盘活动 LED）:
连接到机箱前面板上的硬盘活动 LED 指示灯。硬盘正在读取或写入数据时，此 LED 亮
起。

前面板设计根据机箱不同而有所差异。前面板模块主要包括电源开关、重置开关、电源
LED、硬盘活动 LED 指示灯、扬声器等。将机箱前面板模块连接到此接头时，确保连线
分配和针脚分配正确匹配。

PLED+

PLED-

HDLED-

HDLED+

PWRBTN#

GND

RESET#

GND

GND

按照下面的针脚分配，将机箱上
的电源开关、重置开关和系统状
态指示灯连接到此接脚。在连接
线缆前请记下正负针脚。

36

B560M-HDV-A R2.0

簡体中文

1

+5V

DUMMY

SIGNAL

GND

DUMMY

SPEAKER

DUMMY

机箱侵入和扬声器接脚

DUMMY

GND

GND

P+

P-

USB_PWR

P+

P-

USB_PWR

1

1

1

USB_PWR

P-

P+

GND

（7 针 SPK_CI1）
（见第 1 页，第 14 个）

请将机箱侵入和机箱扬声器连
接到到此接脚。

串行 ATA3 接口
垂直：
（SATA3_0:
见第 1 页， 第 8 个）
（SATA3_1:
见第 1 页， 第 7 个）
直角 :
（SATA3_2:
见第1 页，第 9 个）（上）
（SATA3_3:
见第1 页，第 10 个）（下）

USB 2.0 接脚
（9- 针 USB3_4）
（见第 1 页，第 17 个）

（9- 针 USB5）
（见第 1 页，第 16 个）

SATA3_1

SATA3_2

SATA3_0

SATA3_3

这四个 SATA3 接口支持最高

6.0 Gb/s 数据传输速率的内部存
储设备的 SATA 数据线。

此主板上有 2 个 USB 2.0 接脚。
每个 USB 2.0 接头可以支持两个
端口。

USB 3.2 Gen1 接脚
（19 针 F_USB3_1_2）
（见第 1 页，第 6 个）

IntA_PA_SSRX-

IntA_PA_SSRX+

IntA_PA_SSTX-

IntA_PA_SSTX+

IntA_PA_D-

IntA_PA_D+

Vbus

GND

GND

VbusVbus

IntA_PB_SSRX-

IntA_PB_SSRX+

GND

IntA_PB_SSTX-

IntA_PB_SSTX+

GND

IntA_PB_D-

IntA_PB_D+

Dummy

此主板上有一个接脚。此 USB

3.2 Gen1 接脚可以支持两个端
口。

37

簡体中文

前面板音频接头

J_SENSE

OUT2_L

1

MIC_RET

PRESENCE#

GND

OUT2_R

MIC2_R

MIC2_L

OUT_RET

GND

OL

FAN_SPEED_CONTROL

1 2 3 4

（9 针 HD_AUDIO1）
（见第 1 页，第 19 个）

1.

高清音频支持插孔感测，但机箱上的面板连线必须支持 HDA 才能正常工作。请按照
我们的手册和机箱手册的说明安装系统。

2.

如果您使用
A. 将 Mic_IN (MIC) 连接到 MIC2_L。
B. 将 Audio_R (RIN) 连接到 OUT2_R，将 Audio_L (LIN) 连接到 OUT2_L。
C. 将接地端 (GND) 连接到接地端 (GND)。
D. MIC_RET 和 OUT_RET 只用于高清音频面板。您不需要针对
它们。
E. 要启用前麦克风，请转到 Realtek 控制面板上的“FrontMic”（前麦克风）选项卡，
调整 “Recording Volume”（录音音量）。

此接头用于将音频设备连接到
前音频面板。

AC’97

音频面板，请按照以下步骤将它安装到前面板音频接脚：

AC’97

音频面板连接

38

机箱 / 水泵风扇接口
（4 针 CHA_FAN1/WP）
（见第 1 页， 第 4 个）
（4 针 CHA_FAN2/WP）
（见第 1 页， 第 15 个）

CPU 风扇接口
（4 针 CPU_FAN1）
（见第 1 页， 第 2 个）

FAN_VOLTAGE

FAN_SPEED

1 2 3 4

CPU_FAN_SPEED

FAN_SPEED_CONTR

+12V

GND

此主板提供兩个 4 针水冷

机箱
风扇接口。如果您打算连接 3
针机箱水冷风扇，请将它连接
到针脚 1-3。

此主板提供 4 针 CPU 风扇（静
音风扇）接口。如果您打算连接
3 针 CPU 风扇，请将它连接到针
脚 1-3。

B560M-HDV-A R2.0

簡体中文

CPU/ 水泵风扇接口

FA

1

2

3

4

4

1

8 5

1

SPI_DQ3

（4 针 CPU_FAN2/WP）
（见第 1 页， 第 20 个）

N_SPEED_CONTROL

FAN_SPEED

FAN_VOLTAGE

GND

此主板提供 4 针水冷风扇接口。
如果您打算连接 3 针 CPU 水冷
风扇，请将它连接到针脚 1-3。

ATX 电源接口
（24 针 ATXPWR1）
（见第 1 页，第 5 个）

ATX 12V 电源接口
（8 针 ATX12V1）
（见第 1 页，第 1 个）

SPI TPM 接脚
（13 针 SPI_TPM_J1）
（见第 1 页，第 11 个）

1 2 124

+3.3V

Dummy

SPI_MISO

SPI_CS0

SPI_DQ2

CLK

SPI_MOSI

GND

RSMRST#

13

RST#

TPM_PIRQ

SPI_TPM_CS#

此主板提供 24 针 ATX 电源接
口。要使用 20 针 ATX 电源，请
沿针脚 1 和针脚 13 插接它。

此主板提供 8 针 ATX 12V 电源
接口。要使用 4 针 ATX 电源，请
沿针脚 1 和针脚 5 插接它。

* 警告 : 请确保连接的电源线
用于 CPU，而非图形卡。不要将
PCIe 电源线插接到此接口。

此接口支持 SPI Trusted Platform
Module（信任平台模块，TPM）
系统，可以安全地存储密钥、数
字证书、密码和数据。TPM 系统
也可以帮助增强网络安全，保护
数字身份和确保平台完整性。

39

簡体中文

串行端口接头

1

（9 针 COM1）
（见第 1 页，第 18 个）

RRXD1

DDTR#1

TTXD1

DDCD#1

DDSR#1

CCTS#1

RRTS#1

GND

此 COM1 接头支持串行端口模
块。

RRI#1

40

B560M-HDV-A R2.0

簡体中文

电子信息产品污染控制标示

依据中国发布的「电子信息产品污染控制管理办法」及 SJ/T 11364-2006「电子信息
产品污染控制标示要求」，电子信息产品应进行标示，藉以向消费者揭露产品中含
有的有毒有害物质或元素不致发生外泄或突变从而对环境造成污染或对人身、财产
造成严重损害的期限。依上述规定，您可于本产品之印刷电路板上看见图一之标
示。图一中之数字为产品之环保使用期限。由此可知此主板之环保使用期限为 10
年。

图一

有毒有害物质或元素的名称及含量说明

若您欲了解此产品的有毒有害物质或元素的名称及含量说明，请参照以下表格及说
明。

有害物质或元素

部件名称

铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr(VI)) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
印刷电路板
及电子组件

外部信号连
接头及线材

X O O O O O

X O O O O O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在 SJ/T 11363-2006 标准规定
的限量要求以下。
X: 表示该有毒有害物质至少在该部件的某一均质材料中的含量超出 SJ/T 11363-2006 标准
规定的限量要求，然该部件仍符合欧盟指令 2002/95/EC 的规范。
备注 : 此产品所标示之环保使用年限，系指在一般正常使用状况下。

41

Contact Information

If you need to contact ASRock or want to know more about ASRock, you’re welcome

to visit ASRock’s website at http://ww w.asrock.com; or you may contact your dealer

for further information. For technical questions, please submit a support request

form at https://event.asrock.com/tsd.asp

ASRock Incorporation

2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District,

Taipei City 112, Taiwan (R.O.C.)

ASRock EUROPE B.V.

Bijsterhuizen 11-11

6546 AR Nijmegen

e Netherlands

Phone: [phone]

Fax: [phone]

ASRock America, Inc.

13848 Magnolia Ave, Chino, CA91710

U.S.A.

Phone: [phone]

Fax: [phone]

DECLARATION OF CONFORMITY

Per FCC Part 2 Section 2.1077(a)

Responsible Party Name: ASRock Incorporation

Address:

Phone/FaxNo:

hereby declares that the product

Product Name : Motherboard

13848 Magnolia Ave, Chino, CA91710

[phone]/[phone]

Model Number :

Conforms to the following specications:

FCC Part 15, Subpart B, Unintentional Radiators

Supplementary Information:

B560M-HDV-A R2.0

is device complies with part 15 of the FCC Rules. Operation is subject to the

following two conditions: (1) is device may not cause harmful interference,

and (2) this device must accept any interference received, including interference

that may cause undesired operation.

James

Representative Person’s Name:

Signature :

Date :

May 12, 2017

EU Declaration of Conformity

EMC —Directive 2014/30/EU (from April 20th, 2016)

ڛ

☐

For the following equipment:

Motherboard

(Product Name)

B560M-HDV-A R2.0 / ASRock

(Model Designation / Trade Name)

ASRock Incorporation

(Manufacturer Name)

2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District, Taipei City 112, Taiwan (R.O.C.)

(Manufacturer Address)

☐ EN 55022:2010/AC:2011 Class B EN 55024:2010/A1:2015

ڛ EN 55032:2012+AC:2013 Class B ڛڛ EN 61000-3-3:2013
ڛ EN 61000-3-2:2014

☐

LVD —Directive 2014/35/EU (from April 20th, 2016)

EN 60950-1 : 2011+ A2: 2013 ☐

ڛ RoHS — Directive 2011/65/EU
ڛ CE marking

EN 60950-1 : 2006/A12: 2011

(EU conformity marking)

ASRock EUROPE B.V.

(Company Name)

Bijsterhuizen 1111 6546 AR Nijmegen e Netherlands

(Company Address)

Person responsible for making this declaration:

(Name, Surname)

A.V.P

(Position / Title)

July 29, 2021

(Date)

P/N: 15G062311000AK V1.0