No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com
Page 3
AUSTRALIA ONLY
Our goods come with guarantees that cannot be excluded under the Australian Consumer
Law. You are entitled to a replacement or refund for a major failure and compensation for
any other reasonably foreseeable loss or damage caused by our goods. You are also entitled
to have the goods repaired or replaced if the goods fail to be of acceptable quality and the
failure does not amount to a major failure. If you require assistance please call ASRock Tel
: +886-2-28965588 ext.123 (Standard International call charges apply)
e terms HDMI™ and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.
Page 4
CE Warning
is device complies with directive 2014/53/EU issued by the Commision of the European
Community.
is equipment complies with EU radiation exposure limits set forth for an uncontrolled
environment.
is equipment should be installed and operated with minimum distance 20cm between
the radiator & your body.
Operations in the 5.15-5.35GHz band are restricted to indoor usage only.
Radio transmit power per transceiver ty pe
FunctionFrequencyMaximum Output Power (EIRP)
2400-2483.5 MHz18.5 + / -1.5 dbm
5150-5250 MHz21.5 + / -1.5 dbm
WiFi
Bluetooth2400-2483.5 MHz8.5 + / -1.5 dbm
5250-5350 MHz
5470-5725 MHz
18.5 + / -1.5 dbm (no TPC)
21.5 + / -1.5 dbm (TPC)
25.5 + / -1.5 dbm (no TPC)
28.5 + / -1.5 dbm (TPC)
Page 5
Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 6
1.4 I/O Panel 8
1.5 WiFi-802.11ac Module and ASRock WiFi 2.4/5 GHz Antenna 10
ank you for purchasing ASRock B360M-ITX/ac motherboard, a reliable
motherboard produced under ASRock’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock’s
commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
Becau se the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any modications of this documentation occur, the updated version will be available on ASRock’s
website w ithout further notice. If you require technical support relate d to this motherboard, please visit our website for specic information about the model you are using. You
may nd the l atest VGA cards and CPU support list on ASRock ’s website a s well. ASRock
website http://www.asrock.com.
1.1 Package Contents
ASRock B360M-ITX/ac Motherboard (Mini-ITX Form Factor)
Please realize that the re is a certain r isk involved with overclo cking, including adju sting
the setting in the BIOS, applying Untied Overclocking Technolog y, or using third-party
overclocking to ols. O verclocking may aect your system’s stability, or even cause damage to
the components and devices of your system. It should be done at your ow n risk and expense.
We are not responsibl e for possible damage caused by overclo cking.
Microso® Windows® 10 64-bit
FCC, CE
•
ErP/EuP ready (ErP/EuP ready power supply is required)
•
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PCIE1
DDR4_ A1 ( 64 b it , 28 8- pi n mo dule)
DDR4_ B1 ( 64 b it , 28 8- pi n mo dule)
CPU_FAN1
CHA_FAN1/WP
RoHS
B360M-ITX/ac
3
6
8
7
PS2
Keyb oard
/Mou se
16
15
14
AUDIO
CODEC
5
1
HD_AUDIO1
1
SPEAKE R1
Intel
B360
ATXPW R1
USB3_ 3_4
1
4
2
PANEL1
HDLED RESET
PLED PWRBTN
1
Top:
LINE I N
Cent er:
FRON T
Bott om:
MIC IN
SATA3_3
SATA3_2
1
CLRMOS1
SATA3_1
SATA3_0
1
USB_3_4
M2_ 1
C 1
T
Top:
RJ-45
USB 3.1 Gen2
T: USB1
B: USB2
USB 3.1 Gen1
T: USB1
B: USB2
1
9
10
11
12
BIOS
ROM
M2_WIFI1
DISPLAY1
17
Ultra M.2
PCIe Gen3 x4
HDMI1
DVI 1
CI1
1
BAT1
CHA_FA N2
13
1.3 Motherboard Layout
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No. Description
1ATX 12V Power Connector (ATX12V1)
2Chassis Fan / Waterpump Fan Connector (CHA_FAN1/WP)
** To congure 7.1 CH HD Audio, it i s required to use an HD front panel audio module and enable the multichannel audio feature through the audio driver.
Please set Speaker Conguration to “7.1 Speaker”in the Realtek HD Audio Manager.
Function of the Audio Ports in 7.1-channel Conguration:
PortFunction
Light Blue (Rear panel)Rear Speaker Out
Lime (Rear panel)Front Speaker Out
Pink (Rear panel)Central /Subwoofer Speaker Out
Lime (Front panel)Side Speaker Out
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1.5 WiFi-802.11ac Module and ASRock WiFi 2.4/5 GHz Antenna
WiFi-802.11ac + BT Module
is motherboard comes with an exclusive WiFi 802.11 a/b/g/n/ac + BT v4.2
module (pre-installed on the rear I/O panel) that oers support for WiFi 802.11 a/b/
g/n/ac connectivity standards and Bluetooth v4.2. WiFi + BT module is an easy-to-
use wireless local area network (WLAN) adapter to support WiFi + BT. Bluetooth
v4.2 standard features Smart Ready technology that adds a whole new class of
functionality into the mobile devices. BT 4.2 also includes Low Energy Technolog y
and ensures extraordinary low power consumption for PCs.
* e transmission speed may vary according to the environment.
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WiFi Antennas Installation Guide
B360M-ITX/ac
Step 1
Prepare the WiFi 2.4/5 GHz Antennas that come
with the package.
Step 2
Connect the two WiFi 2.4/5 GHz Antennas to
the antenna connectors. Turn the antenna clock-
wise until it is securely connected.
Step 3
Set the WiFi 2.4/5 GHz Antenna as shown in the
illustration.
*You may need to adjust the direction of
the antenna for a stronger signal.
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Chapter 2 Installation
is is a Mini-ITX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
Make sure to unplug the power cord before installing or removing the motherboard
•
components. Failure to do so may cause physical injuries and damages to motherboard
components.
In order to avoid damage from static electricity to the motherboard’s components,
•
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
Hold components by the edges and do not touch the ICs.
•
Whenever you uninstall any components, place them on a grounded anti-static pad or
•
in the bag that comes with the components.
When placing screws to secure the motherboard to the chassis, please do not over-
•
tighten the screws! Doing so may damage the motherboard.
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2.1 Installing the CPU
1. Before you insert the 1151-Pin CPU into the socket, please check if the PnP cap is on the
socket, if the CPU surface is unclean, or if there are any bent pins in the socket. Do not
force to in sert the CPU into the socket if above situation is found. Otherwise, the CPU
will be seriously damaged.
2. Unplug all power c ables before in stalling the CPU.
1
B360M-ITX/ac
A
B
2
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3
4
5
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Please save and replace the cover if the processor i s removed. e cover must be placed if
you wish to return the motherboard for aer service.
B360M-ITX/ac
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2.2 Installing the CPU Fan and Heatsink
12
FAN
CPU_
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2.3 Installing Memory Modules (DIMM)
is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots,
and supports Dual Channel Memory Technology.
1. For dual channel cong uration , you always need to in stall identical (the same b rand,
speed , size and chip-type) DDR4 DIMM pairs.
2. It is unable to activate Du al Channel Memory Technology with only one memory module
installed.
3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4 sl ot;
otherwise , this motherboard and DIM M may be damaged..
e DIMM only ts in one correct orientation. It will cause permanent dam age to the
motherboard and the DIMM if you force the DIMM into the slot at incorrect orientation.
B360M-ITX/ac
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1
2
3
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2.4 Expansion Slot (PCI Express Slot)
ere is 1 PCI Express slot on the motherboard.
Before installing an ex pansion card, please make sure that the power supply is switched o
or the power cord is unplug ged. Pl ease read the documentation of the expansion card and
make necessary hardware settings for the card before you start the installation.
PCIe slot:
PCIE1 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
B360M-ITX/ac
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2.5 Jumpers Setup
e illustration shows how jumpers are setup. When the jumper cap is placed on
the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is
“O pen”.
Clear CMOS Jumper
(CLRMO S1)
(see p.6, No. 14)
CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system
parameters to default setup, please turn o the computer and unplug the power
cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to
short the pins on CLR MOS1 for 5 seconds. However, please do not clear the
CMOS right aer you update the BIOS. If you need to clear the CMOS when you
just nish updating the BIOS, you must boot up the system rst, and then shut it
down before you do the clear-CMOS action. Please be noted that the password,
date, time, and user default prole will be cleared only if the CMOS battery is
removed. Please remember toremove the jumper cap aer clearing the CMOS.
2-pin Jumper
If you clear the CMOS, the case open may be detec ted. Please adjust the BIOS option “Clear
Status” to clear the record of previous chassis intrusion status.
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2.6 Onboard Headers and Connectors
Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over these
heade rs and connectors. Placing jumper caps over the headers and connectors will cause
permanent damage to the motherboard.
B360M-ITX/ac
System Panel Header
(9-pi n PANEL1)
(see p.6, No. 11)
PWRBTN (Power Switch):
Connec t to the power switch on the chassi s front panel. You may congure the way to tur n
o your system using the power switch.
RESET (Reset Switch):
Connec t to the reset switch on the chassi s front panel. P ress the reset sw itch to restart the
computer if the computer f reezes and fails to perform a normal restar t.
PLED (Syste m Power LED):
Connec t to the power status indicator on the chassis front panel. e LED i s on when the
system is operating. e LED keeps blinking when the system is in S1/S3 sleep state. e
LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive ac tivity LED on the chassis front panel. e LED is on when the
hard drive is reading or wr iting data.
e front panel de sign may dier by chassis. A front pane l module mainly consists of power
switch, reset switch , power LED, hard dr ive activity LED, speaker and etc. When connecting your ch assi s front panel module to thi s header, make sure the wire a ssignments and the
pin assignments are matched correctly.
GNDRESET#
PWRBTN#
PLED-
PLED+
GND
GND
HDLED-
HDLED+
1
Connect the power
switch, reset switch and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
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Serial ATA3 Connectors
1
(SATA3_0:
see p.6, No. 8)
(SATA3_1:
see p.6, No. 7)
(SATA3_ 2:
see p.6, No. 10)
(SATA3_ 3:
see p.6, No. 9)
ese four SATA3
connectors support SATA
SA T A3_ 1
SA T A3_ 0
data cables for internal
storage devices with up to
6.0 Gb/s data transfer rate.
SA T A3_ 3
SA T A3_ 2
*If M2_1 i s occupied by a SATAtype M.2 device, SATA3_ 0 will
be disabled.
English
USB 2.0 Header
(9-pin USB_3_4)
(see p.6, No. 12)
USB 3.1 Gen1 Header
(19-pin USB3_3_4)
(see p.6, No. 6)
DUMMY
GNDGND
P+4
P-4
USB_PWR
Vbus
IntA_PA_SSRX-
IntA_PA_SSRX+
GND
IntA_PA_SSTX-
IntA_PA_SSTX+
GND
IntA_PA_D-
IntA_PA_D+
P+3
P-3
USB_PWR
VbusVbus
IntA_PB_SSRX-
IntA_PB_SSRX+
GND
IntA_PB_SSTX-
IntA_PB_SSTX+
GND
IntA_PB_D-
IntA_PB_D+
Dummy
1
ere is one USB2.0
header on this
motherboard. is USB
2.0 header can support
two ports.
ere is one header on
this motherboard. is
USB 3.1 Gen1 header can
support two ports.
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B360M-ITX/ac
1
GND
PRESENCE#
MIC2_R
MIC2_L
1
MIC_RET
J_SENSE
OUT2_R
SPEAKER
DUMMY
DUMMY
+5V
OUT_RET
OUT2_L
is header is for
connecting audio devices
to the front audio panel.
Please connect the chassis
speaker to this header.
Front Panel Audio Header
(9-pin HD_ AUDIO1)
(see p.6, No. 17)
1. High Denition Audio support s Jack Sensing , but the panel wire on the cha ssis must sup port HDA to function correctly. Ple ase fol low the instructions in our manual and chassis
manual to install your system.
2. If you use an AC’97 audio panel , please install it to th e front panel audio header by the
steps below:
A. Connect Mic_IN (MIC) to MIC2_ L.
B. Conne ct Audio_R (RIN) to OUT2_R and Audio_ L (LIN) to OUT2_ L.
C. Connect Ground (GND) to Ground (GND).
D. MIC_ RET and OUT_RET are for the HD audio panel only. You don’t need to conn ect
them for the AC’97 audio panel .
E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel and
adjust “Recording Volume”.
For the latest updates of M.2_SSD (NFGG) module support list, please visit our website for
details: http://www.asrock.com
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Chapter 3 Software and Utilities Operation
3.1 Installing Drivers
e Support CD that comes with the motherboard contains necessary drivers and
useful utilities that enhance the motherboard’s features.
Running The Support CD
To begin using the support CD, insert the CD into your CD-ROM drive. e CD
automatically displays the Main Menu if “AUTORUN” is enabled in your computer.
If the Main Menu does not appear automatically, locate and double click on the le
“ASRSETUP.EXE” in the Support CD to display the menu.
Drivers Menu
e drivers compatible to your system will be auto-detected and listed on the
support CD driver page. Please click Install All or follow the order from top to
bottom to install those required drivers. erefore, the drivers you install can work
properly.
Utilities Menu
e Utilities Menu shows the application soware that the motherboard supports.
Click on a specic item then follow the installation wizard to insta ll it.
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3.2 A-Tuning
A-Tuning is ASRock’s multi purpose soware suite with a new interface, more new
features and improved utilities.
3.2.1 Installing A-Tuning
A-Tu ni n g can be downloaded from ASRock Live Update & APP Shop. Aer the
installation, you will nd the icon “A-Tu n ing“ on your desktop. Double-click the
“A-Tu ni n g“ icon, A-Tu n i ng main menu will pop up.
3.2.2 Using A-Tuning
ere are four sections in A-Tuning main menu: Operation Mode, System Info,
FAN-Tastic Tuning and Settings.
Operation Mode
Choose an operation mode for your computer.
B360M-ITX/ac
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System Info
View information about the system.
*e System Browser tab may not appear for certain models.
FAN-Tastic Tuning
Congure up to ve dierent fan speeds using the graph. e fans will automatically shi
to the next speed level when the assigned temperature is met.
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Settings
Congure ASRock A-Tuning. Click to select "Auto run at Windows Startup" if you
want A-Tuning to be launched when you start up the Windows operating system.
B360M-ITX/ac
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3.3 ASRock Live Update & APP Shop
e ASRock Live Update & APP Shop is an online store for purchasing and
downloading soware applications for your ASRock computer. You can quick ly and
easily insta ll various apps and support utilities. With ASRock Live Update & APP
Shop, you can optimize your system and keep your motherboard up to date simply
with a few clicks.
Double-click on your desktop to access ASRock Live Update & APP Shop
utility.
*You need to be connected to the Internet to download apps f rom the ASRock Live Update & APP Shop.
3.3.1 UI Overview
Category Panel
Hot News
Information Panel
Category Panel: e category panel contains several category tabs or buttons that
when selected the information panel below displays the relative information.
Information Panel: e information panel in the center displays data about the
English
currently selected category and allows users to perform job-related tasks.
Hot News: e hot news section displays the various latest news. Click on the image
to visit the website of the selected news and know more.
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3.3.2 Apps
When the "Apps" tab is selected, you will see all the available apps on screen for you
to download.
Installing an App
Step 1
Find the app you want to install.
B360M-ITX/ac
e most recommended app appears on the le side of the screen. e other various
apps are shown on the right. Please scroll up and down to see more apps listed.
You can check the price of the app and whether you have already intalled it or not.
- e red icon displays the price or "Free" if the app is free of charge.
- e green "Installed" icon means the app is installed on your computer.
Step 2
Click on the app icon to see more details about the selected app.
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Step 3
If you want to install the app, click on the red icon
Step 4
When installation completes, you can nd the green "Installed" icon appears on the
upper right corner.
to start downloading.
English
To uninstall it, simply click on the trash can icon .
* e trash icon may not appear for certain apps.
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Upgrading an App
You can only upgrade the apps you have already installed. When there is an
available new version for your app, you will nd the mark of "New Version"
appears below the installed app icon.
Step 1
Click on the app icon to see more details.
B360M-ITX/ac
Step 2
Click on the yellow icon
to start upgrading.
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3.3.3 BIOS & Drivers
Installing BIOS or Drivers
When the "BIOS & Drivers" tab is selected, you will see a list of recommended or
critical updates for the BIOS or drivers. Please update them all soon.
Step 1
Please check the item information before update. Click on
Step 2
Click to select one or more items you want to update.
Step 3
Click Update to start the update process.
to see more details.
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3.3.4 Setting
In the "Setting" page, you can change the language, select the server location, and
determine if you want to automatically run the ASRock Live Update & APP Shop
on Windows startup.
B360M-ITX/ac
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Chapter 4 UEFI SETUP UTILITY
4.1 Introduction
is section explains how to use the UEFI SETUP UTILITY to congure your
system. You may run the UEFI SETUP UTILITY by pressing <F2> or <Del> right
aer you power on the computer, other wise, the Power-On-Self-Test (POST) will
continue with its test routines. If you wish to enter the UEFI SETUP UTILITY aer
POST, restart the system by pressing <Ctl> + <Alt> + <Delete>, or by pressing the
reset button on the system chassis. You may also restart by turning the system o
and then back on.
Becau se the UEFI soware is constantly being upd ated, the following UEFI setup screens
and descriptions are for reference purpose only, and they may not ex actly match what you
see on your screen .
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B360M-ITX/ac
4.2 EZ Mode
e EZ Mode screen appears when you enter the BIOS setup program by default. EZ
mode is a dashboard which contains multiple readings of the system’s current status.
You can check the most crucial information of your system, such as CPU speed,
DRAM frequency, SATA information, fan speed, etc.
Press <F6> or click the "Advanced Mode" button at the upper right corner of the
screen to switch to "Advanced Mode" for more options.
No.Function
Help
1
Load UEFI Defaults
2
Save Changes and Exit
3
Discard Changes
4
Change Language
5
Switch to Advanced Mode
6
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4.3 Advanced Mode
e Advanced Mode provides more options to congure the BIOS settings. Refer to
the following sections for the detailed congurations.
To access the EZ Mode, press <F6> or click the "EZ Mode" button at the upper right
corner of the screen.
4.3.1 UEFI Menu Bar
e top of the screen has a menu bar with the following selections:
Main
OC Tweaker
Advanced
Tool
H/W Monitor
Security
Boot
Exit
For setting system time/date information
For overclocking congurations
For advanced system congurations
Useful tools
Displays current hardware status
For security settings
For conguring boot settings and boot priority
Exit the current screen or the UEFI Setup Utility
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4.3.2 Navigation Keys
Use < > key or < > key to choose among the selections on the menu bar, and
use < > key or < > key to move the cursor up or down to select items, then
press <Enter> to get into the sub screen. You can also use the mouse to click your
required item.
Please check the following table for the descriptions of each navigation key.
Navigation Key(s) Description
B360M-ITX/ac
+ / -
<Tab>
<PGUP>
<PGDN>
<HOME>
<END>
<F1>
<F5>
<F7>
<F9>
<F10>
<F12>
<ESC>
To change option for the selected items
Switch to next function
Go to the previous page
Go to the next page
Go to the top of the screen
Go to the bottom of the screen
To display the General Help Screen
Add / Remove Favorite
Discard changes and exit the SETUP UTILITY
Load optimal default values for all the settings
Save changes and exit the SETUP UTILITY
Print screen
Jump to the Exit Screen or exit the current screen
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4.4 Main Screen
When you enter the UEFI SETUP UTILITY, the Main screen will appear and
display the system overview.
My Favorite
Display your collection of BIOS items. Press F5 to add/remove your favorite items.
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4.5 OC Tweaker Screen
In the OC Tweaker screen, you can set up overclocking features.
B360M-ITX/ac
Becau se the UEFI soware is constantly being upd ated, the following UEFI setup screens
and descriptions are for reference purpose only, and they may not ex actly match what you
see on your screen .
CPU Conguration
Boot Performance Mode
Default is Max Non-Turbo performance mode. It will keep cpu Flex-ratio till OS
hando. Max Battery mode will set CPU ratio as x8 till OS hando. is option is
suggested for BCLK overclocking.
FCLK Frequency
Congure the FCLK Frequency.
Intel SpeedStep Technology
Intel SpeedStep technology allows processors to switch between multiple frequen-
cies and voltage points for better power saving and heat dissipation.
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Intel Turbo Boost Technology
Intel Turbo Boost Technology enables the processor to run above its base operating
frequency when the operating system requests the highest performance state.
Intel Speed Shift Technology
Enable/Disable Intel Speed Shi Technology support. Enabling will expose the
CPPC v2 interface to allow for hardware controlled P-sates.
Long Duration Power Limit
Congure Package Power Limit 1 in watts. When the limit is exceeded, the CPU
ratio will be lowered aer a period of time. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
Long Duration Maintained
Congure the period of time until the CPU ratio is lowered when the Long
Duration Power Limit is exceeded.
Short Duration Power Limit
Congure Package Power Limit 2 in watts. When the limit is exceeded, the CPU
ratio will be lowered immediately. A lower limit can protect the CPU and save
power, while a higher limit may improve performance.
CPU Core Current Limit
Congure the current limit of the CPU core. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
GT Current Limit
Congure the current limit of the GT slice. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
GT Frequency
Congure the frequency of the integrated GPU.
DRAM Conguration
DRAM Tweaker
English
Fine tune the DRAM settings by leaving marks in checkboxes. Click OK to conrm and
apply your new settings.
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B360M-ITX/ac
DRAM Timing Conguration
DRAM Reference Clock
Select Auto for optimized settings.
DRAM Frequency
If [Auto] is selected, the motherboard will detect the memory module(s) inserted
and assign the appropriate frequency automatically.
DRAM Clock
Choose a frequency to override to clock delay for memor y training. DRAM Clock
controls memor y training only if ASRock Timing Optimization is disabled.
Primary Timing
CAS# Latency (tCL)
e time between sending a column address to the memory and the beginning of the data
in response.
RAS# to CAS# Delay and Row Precharge (tRCDtRP)
RAS# to CAS# Delay : e number of clock cycles required between the opening of
a row of memory and accessing columns within it.
Row Precharge: e number of clock cycles required between the issuing of the
precharge command and opening the next row.
RAS# Active Time (tRAS)
e number of clock cycles required between a bank active command and issuing the
precharge command.
Command Rate (CR)
e delay between when a memor y chip is selected and when the rst active command can
be issued.
Secondary Timing
Write Recovery Time (tWR)
e amount of delay that must elapse aer the completion of a valid write operation,
before an active bank can be precharged.
Refresh Cycle Time (tRFC)
e number of clocks from a Refresh command until the rst Activate command to
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the same rank.
RAS to RAS Delay (tRRD_L)
e number of clocks between two rows activated in dierent banks of the same
rank.
RAS to RAS Delay (tRRD_S)
e number of clocks between two rows activated in dierent banks of the same
rank.
Write to Read Delay (tWTR_L)
e number of clocks between the last valid write operation and the next read command to
the same interna l bank.
Write to Read Delay (tWTR_S)
e number of clocks between the last valid write operation and the next read command to
the same interna l bank.
Read to Precharge (tRTP)
e number of clocks that are inserted between a read command to a row pre-
charge command to the same rank.
Four Activate Window (tFAW)
e time window in which four activates are allowed the same rank.
CAS Write Latency (tCWL)
Congure CAS Write Latency.
Third Timing
tREFI
Congure refresh cycles at an average periodic interval.
tCKE
Congure the period of time the DDR4 initiates a minimum of one refresh
command internally once it enters Self-Refresh mode.
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Turn Around Timing
tRDRD_sg
Congure between module read to read delay.
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tRDRD_dg
Congure between module read to read delay.
tRDRD_dr
Congure between module read to read delay.
tRDRD_dd
Congure between module read to read delay.
tRDWR_sg
Congure between module read to write delay.
tRDWR_dg
Congure between module read to write delay.
tRDWR_dr
Congure between module read to write delay.
tRDWR_dd
Congure between module read to write delay.
B360M-ITX/ac
tWRRD_sg
Congure between module write to read delay.
tWRRD_dg
Congure between module write to read delay.
tWRRD_dr
Congure between module write to read delay.
tWRRD_dd
Congure between module write to read delay.
tWRWR_sg
Congure between module write to write delay.
tWRWR_dg
Congure between module write to write delay.
tWRWR_dr
Congure between module write to write delay.
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tWRWR_dd
Congure between module write to write delay.
Round Trip Timing
RTL Init Value
Congure round trip latency init value for round trip latency training.
IOL Init Value
Congure IO latency init value for IO latency traning.
RTL (CH A)
Congure round trip latency for channel A.
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RTL (CH B)
Congure round trip latency for channel B.
IOL (CH A)
Congure IO latency for channel A.
IOL (CH B)
Congure IO latency for channel B.
IOL Oset (CH A)
Congure IO latency oset for channel A.
IOL Oset (CH B)
Congure IO latency oset for channel B.
RFR Delay (CH A)
Congure RFR Delay for Channel A.
RFR Delay (CH B)
Congure RFR Delay for Channel B.
ODT Setting
ODT WR (A1)
Congure the memory on die termination resistors' WR.
ODT WR (B1)
Congure the memory on die termination resistors' WR.
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ODT NOM (A1)
Use this to change ODT Auto/Manual settings. e default is [Auto].
ODT NOM (B1)
Use this to change ODT Auto/Manual settings. e default is [Auto].
ODT PARK (A1)
Congure the memory on die termination resistors' PARK.
ODT PARK (B1)
Congure the memory on die termination resistors' PARK.
COMP Setting
RCOMP0: DQ ODT (Read)
Default is 121.
RCOMP1: DQ /CLK Ron (Drive Strength)
Default is 75.
RCOMP2: CMD /CTL Ron (Drive Strength)
Default is 100.
B360M-ITX/ac
DQ ODT Driving
Adjust DQ Driving for better signal. Default is 26.
DQ Driving
Adjust DQ Driving for better signal. Default is 26.
Command Driving
Adjust Command Driving for better signal. Default is 20.
Control Driving
Adjust Control Driving for better signal. Default is 20.
Clock Driving
Adjust Clock Driving for better signal. Default is 26.
DQ Slew Rate
Adjust DQ Slew Rate for better signal. Default is 59.
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Command Slew Rate
Adjust Command Slew Rate for better signal. Default is 53 for IN. 89 for 2N.
Control Slew Rate
Adjust Control Slew Rate for better signal. Default is 53.
Clock Slew Rate
Adjust Clock Slew Rate for better signal. Default is 53.
MRS Setting
MRS tCL
Congure the tCL for Memory MRS MR0.
MRS tWRtRTP
Congure the tWRtRTP for Memory MRS MR0.
MRS tCWL
Congure the tCWL for Memory MRS MR2.
MRS tCCD_L
Congure the tCL for Memory MRS MR6.
Advanced Setting
ASRock Timing Optimization
Enable/Disable ASRock Timing Optimization. When enabled, the memory timing
will use ASRock optimized value.
Realtime Memory Timing
Enable/Disable realtime memory timings. When enabled, the system will allow