ASRock B360M-HDV Service Manual

Version 1.0

Published January 2018

Copyright©2018 ASRock INC. All rights reserved.

Copyright Notice:

No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.

Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to

infringe.

Disclaimer:

Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.

With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.

In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.

is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that

may cause undesired operation.

CALIFORNIA, USA ONLY

e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/
perchlorate”

ASRock Website: http://www.asrock.com

AUSTRALIA ONLY

Our goods come with guarantees that cannot be excluded under the Australian
Consumer Law. You are entitled to a replacement or refund for a major failure and
compensation for any other reasonably foreseeable loss or damage caused by our
goods. You are also entitled to have the goods repaired or replaced if the goods fail
to be of acceptable quality and the failure does not amount to a major failure. If
you require assistance please call ASRock Tel : [phone] ext.123 (Standard
International call charges apply)

e terms HDMI™ and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.

Contents

Chapter 1 Introduction 1

1.1 Package Contents 1

1.2 Specications 2

1.3 Motherboard Layout 6

1.4 I/O Panel 8

Chapter 2 Installation 10

2.1 Installing the CPU 11

2.2 Installing the CPU Fan and Heatsink 14

2.3 Installing Memory Modules (DIMM) 15

2.4 Expansion Slots (PCI Express Slots) 17

2.5 Jumpers Setup 18

2.6 Onboard Headers and Connectors 19

Chapter 3 Software and Utilities Operation 27

3.1 Installing Drivers 27

3.2 A-Tuning 28

3.3 ASRock Live Update & APP Shop 31

3.3.1 UI Overview 31

3.3.2 Apps 32

3.3.3 BIOS & Drivers 35

3.3.4 Setting 36

Chapter 4 UEFI SETUP UTILITY 37

4.1 Introduction 37

4.2 EZ Mode 38

4.3 Advanced Mode 39

4.3.1 UEFI Menu Bar 39

4.3.2 Navigation Keys 40

4.4 Main Screen 41

4.5 OC Tweaker Screen 42

4.6 Advanced Screen 51

4.6.1 CPU Conguration 52

4.6.2 Chipset Conguration 54

4.6.3 Storage Conguration 56

4.6.4 Super IO Conguration 57

4.6.5 ACPI Conguration 58

4.6.6 USB Conguration 60

4.6.7 Trusted Computing 61

4.7 Tools 62

4.8 Hardware Health Event Monitoring Screen 64

4.9 Security Screen 66

4.10 Boot Screen 67

4.11 Exit Screen 70

B360M-HDV

Chapter 1 Introduction

ank you for purchasing ASRock B360M-HDV motherboard, a reliable

motherboard produced under ASRock’s consistently stringent quality control.

It delivers excellent performance with robust design conforming to ASRock’s

commitment to quality and endurance.

In this documentation, Chapter 1 and 2 contains the introduction of the

motherboard and step-by-step installation guides. Chapter 3 contains the operation

guide of the soware and utilities. Chapter 4 contains the conguration guide of

the BIOS setup.

Becau se the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any modi­cations of this documentation occur, the updated version will be available on ASRock’s
website w ithout further notice. If you require technical support related to this mother­board, please visit our website for specic information about the model you are using. You
may nd the l atest VGA cards and CPU suppor t list on ASRock’s website a s well. ASRock
website http://www.asrock.com.

1.1 Package Contents

• ASRock B360M-HDV Motherboard (Micro ATX Form Factor)

• ASRock B360M-HDV Quick Installation Guide

• ASRock B360M-HDV Support CD

• 1 x I/O Panel Shield

• 2 x Serial ATA (SATA) Data Cables (Optional)

• 1 x Screw for M.2 Socket (O pt iona l)

English

1

1.2 Specications

English

Platform

CPU

Chipset

Memory

Expansion
Slot

Graphics

• Micro ATX Form Factor

• Solid Capacitor design

• Supports 8th Generation Intel® CoreTM Processors (Socket

1151)

• 5 Power Phase design

• Supports Intel® Turbo Boost 2.0 Technology

• Intel® B360

• Dual Channel DDR4 Memory Technology

• 2 x DDR4 DIMM Slots

• Supports DDR4 2666/2400/2133 non-ECC, un-buered

memory

• Max. capacity of system memory: 32GB

• Supports Intel® Extreme Memory Prole (XMP) 2.0

• 15μ Gold Contact in DIMM Slots

• 1 x PCI Express 3.0 x16 Slot (PCIE1: x16 mode)*

* Supports NVMe SSD as boot disks

• 2 x PCI Express 3.0 x1 Slots (Flexible PCIe)

• Intel® UHD Graphics Built-in Visuals and the VGA outputs

can be supported only with processors which are GPU

integrated.

• Supports Intel® UHD Graphics Built-in Visuals : Intel®

Quick Sync Video with AVC, MVC (S3D) and MPEG-2 Full

HW Encode1, Intel® InTruTM 3D, Intel® Clear Video HD

Technology, Intel® InsiderTM, Intel® UHD Graphics

• DirectX 12

• HWAEncode/Decode: AVC/H.264, HEVC/H.265 8-bit,

HEVC/H.265 10-bit, VP8, VP9 8-bit, VP9 10-bit (Decode

only), MPEG2, MJPEG, VC-1 (Decode only)

2

B360M-HDV

• ree graphics output options: D-Sub, DVI-D and HDMI

• Supports HDMI with max. resolution up to 4K x 2K

(4096x2160) @ 30Hz

• Supports DVI-D with max. resolution up to 1920x1200 @

60Hz

• Supports D-Sub with max. resolution up to 1920x1200 @

60Hz

• Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and

HBR (High Bit Rate Audio) with HDMI Port (Compliant

HDMI monitor is required)

• Supports HDCP with DVI-D and HDMI Ports

• Supports 4K Ultra HD (UHD) playback with HDMI Port

Audio

LAN

Rear Panel
I/O

• 7.1 CH HD Audio (Rea ltek ALC887 Audio Codec)

* To congure 7.1 CH HD Audio, it is required to use an HD

front panel audio module and enable the multi-channel audio

feature through the audio driver.

• Supports Surge Protection

• ELNA Audio Caps

• Gigabit LAN 10/100/1000 Mb/s

• Giga PHY Intel® I219V

• Supports Wake-On-LAN

• Supports Lightning/ESD Protection

• Supports Energy Ecient Ethernet 802.3az

• Supports PXE

• 1 x PS/2 Mouse/Keyboard Port

• 1 x D-Sub Port

• 1 x DVI-D Port

• 1 x HDMI Port

• 2 x USB 2.0 Ports (Supports ESD Protection)

• 4 x USB 3.1 Gen2 Type-A Ports (10 Gb/s)

• 1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED

LED)

• HD Audio Jacks: Line in / Front Speaker / Microphone

English

3

Storage

• 6 x SATA3 6.0 Gb/s Connectors, support NCQ, AHCI and

Hot Plug*

* If M2_1 is occupied by a SATA-type M.2 device, SATA3_3 will

be disabled.

• 1 x Ultra M.2 Socket (M2_1), supports M Key type

2230/2242/2260/2280 M.2 SATA3 6.0 Gb/s module and M.2

PCI Express module up to Gen3 x4 (32 Gb/s)**

** Supports Intel® OptaneTM Tech nolo gy

** Supports NVMe SSD as boot disks

** Supports ASRock U.2 Kit

English

Connector

BIOS
Feature

• 1 x Print Port Header

• 1 x COM Port Header

• 1 x TPM Header

• 1 x Chassis Intrusion and Speaker Header

• 1 x CPU Fan Connector (4-pin)

* e CPU Fan Connector supports the CPU fan of ma ximum

1A (12W) fan power.

• 2 x Chassis/Water Pump Fan Connectors (4-pin) (Smart Fan

Speed Control)

* e Chassis/Water Pump Fan supports the water cooler fan of

maximum 2A (24W) fan power.

* CHA_FAN1/WP and CHA_FAN2/WP can auto detect if 3-pin

or 4-pin fan is in use.

• 1 x 24 pin ATX Power Connector

• 1 x 8 pin 12V Power Connector

• 1 x Front Panel Audio Connector

• 2 x USB 2.0 Headers (Support 4 USB 2.0 ports) (Supports

ESD Protection)

• 1 x USB 3.1 Gen1 Header (Supports 2 USB 3.1 Gen1 ports)

(Supports ESD Protection)

• AMI UEFI Legal BIOS with multilingual GUI support

• ACPI 6.0 Compliant wake up events

• SMBIOS 2.7 Support

• CPU, GT_CPU, DRAM, PCH 1.05V Voltage Multi-adjust-

ment

Hardware
Monitor

• Temperature Sensing: CPU, Chassis/Water Pump Fans

• Fan Tachometer: CPU, Chassis/Water Pump Fans

4

B360M-HDV

• Quiet Fan (Auto adjust chassis fan speed by CPU

temperature): CPU, Chassis/Water Pump Fans

• Fan Multi-Speed Control: CPU, Chassis/Water Pump Fans

• CASE OPEN detection

• Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore, DRAM,

PCH 1.05V

OS

Certica­tions

* For detailed product information, please visit our website: http://www.asrock .com

Please realiz e that the re is a certain r isk involved with o verclocking, including adjusting
the setting in the BIOS, applying Untied Overclocking Technolog y, or using third-party
overclocking to ols. O verclocking may aect your system’s stability, or even c ause damage to
the components and devices of your system. It should be don e at your ow n risk and expense.
We are not responsibl e for possible damage caused by overclo cking.

• Microso® Windows® 10 64-bit

• FCC, CE

• ErP/EuP ready (ErP/EuP ready power supply is required)

English

5

Intel

B360

DDR 4_B1 (6 4 bit, 28 8-pin m odule )

DDR 4_A1 (6 4 bit, 28 8-pin m odule )

ATXPWR1

PCIE2

Top:
RJ-45

HDLED RESET

PLED PWRBTN

PANEL1

1

1

SPK_CI1

COM1

1

B360M-HDV

12

9

7

10

8

15

18

16

20

USB 3.1 Gen2
T: USB5
B: USB6

1

3

2

CMOS

Battery

5

CPU_FAN1

13

1

TPMS1

Top:

LINE I N

Cent er:

FRON T

Bott om:

MIC IN

CHA_FAN2/WP

PCIE3

DVI1

VGA1

USB_13_14

1

SATA3_5

SATA3_4

SATA3_0

SATA3_1

SATA3_2

SATA3_3

HDMI1

1

LPT1

BIOS
ROM

21

19

RoHS

ATX12V1

6

PCIE1

4

CHA_FAN1/WP

14

1

HD_AUDIO1

22

USB 3.1 Gen2
T: USB3
B: USB4

LAN

AUDIO
CODEC

USB 2. 0

T: USB1

B: USB 2

PS2

Keyb oard

/Mou se

M2_ 1

CT2CT3CT4CT1

CLRMOS1

1

11

17

USB_7_8

1

1

USB_11_ 12

Ultra M.2

PCIe Gen3x4

1.3 Motherboard Layout

English

6

No. Description

1 ATX 12V Power Connector (ATX12V1)

2 CPU Fan Connector (CPU_FAN1)

3 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)

4 Chassis/Water Pump Fan Connector (CHA_FAN1/WP)

5 ATX Power Connector (ATXPWR1)

6 USB 3.1 Gen1 Header (USB_11_12)

7 SATA3 Connector (SATA3_5)

8 SATA3 Conne ctor (SATA3_4)

9 SATA3 Connector (SATA3_2)

10 SATA3 Connector (SATA3_3)

11 Clear CMOS Jumper (CLRMOS1)

12 SATA3 Connector (SATA3_0)

13 SATA3 Connector (SATA3_1)

14 Chassis/Water Pump Fan Connector (CHA_FAN2/WP)

15 System Panel Header (PANEL1)

16 Chassis Intrusion and Speaker Header (SPK_CI1)

17 USB 2.0 Header (USB_7_8)

18 USB 2.0 Header (USB_13_14)

19 COM Port Header (COM1)

20 Print Port Header (LPT1)

21 TPM Header (TPMS1)

22 Front Panel Audio Header (HD_AUDIO1)

B360M-HDV

English

7

1.4 I/O Panel

1 2 3

4

5

11

10

8

79

No. Description No. Description

1 USB 2.0 Ports (USB12) 7 USB 3.1 Gen2 Ports (USB5_6)

2 D-Sub Port 8 USB 3.1 Gen2 Ports (USB_3_4)

3 LAN RJ-45 Port* 9 HDMI Port

4 Line In (Light Blue)** 10 DVI-D Port

5 Front Speaker (Lime)** 11 PS/2 Keyboard/Mouse Port

6 Microphone (Pink)**

* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications.

ACT/LINK LED

SPEED LED

LAN Por t

Activity / Link LED Speed LED

Status Description Status Description

O No Link O 10Mbps connection
Blinking Data Activity Orange 100Mbps connection
On Link Green 1Gbps connection

6

English

8

B360M-HDV

** To congure 7.1 CH HD Audio, it i s required to use an HD front panel audio module and enable the multi­channel audio feature through the audio driver.

Please set Speaker Conguration to “7.1 Speaker”in the Realtek HD Audio Manager.

Function of the Audio Ports in 7.1-channel Conguration:

Port Function

Light Blue (Rear panel) Rear Speaker Out
Lime (Rear panel) Front Speaker Out
Pink (Rear panel) Central /Subwoofer Speaker Out
Lime (Front panel) Side Speaker Out

English

9

Chapter 2 Installation

is is a Micro ATX form factor motherboard. Before you install the motherboard,

study the conguration of your chassis to ensure that the motherboard ts into it.

Pre-installation Precautions

Take note of the following precautions before you install motherboard components

or change any motherboard settings.

• Make sure to unplug the power cord before installing or removing the motherboard

components. Failure to do so may cause physical injuries and damages to motherboard

components.

• In order to avoid damage from static electricity to the motherboard’s components,

NEVER place your motherboard directly on a carpet. Also remember to use a grounded

wrist strap or touch a safety grounded object before you handle the components.

• Hold components by the edges and do not touch the ICs.

• Whenever you uninstall any components, place them on a grounded anti-static pad or

in the bag that comes with the components.

• When placing screws to secure the motherboard to the chassis, please do not over-

tighten the screws! Doing so may damage the motherboard.

English

10

2.1 Installing the CPU

1. Before you insert the 1151-Pin CPU into the socket, please check if the P nP cap is on the
socket, if the CPU surface is unclean, or if there are any bent pins in the sock et. Do not
force to in sert the CPU into the socket if above situation is found . Otherwise, the CPU
will be seriously damaged.

2. Unplug all power c ables before in stalling the CPU.

1

B360M-HDV

A

B

2

English

11

3

4

English

12

5

B360M-HDV

Please save and replace the cover if the processor i s removed. e cover must be placed if
you wish to return the motherboard for aer service.

13

English

2.2 Installing the CPU Fan and Heatsink

1 2

English

14

FAN

CPU_

B360M-HDV

2.3 Installing Memory Modules (DIMM)

is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots,

and supports Dual Channel Memory Technology.

1. For dual channel cong uration , you always need to in stall identical (the same

brand, speed , size and chip-type) DDR4 DIMM pairs.

2. It is unable to activate Du al Channel Memory Technology with only one memory

module installed.

3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4

slot; otherwise, this motherboard and DIMM may be damaged.

e DIMM only ts in one correct orie ntation. It will cause permanent dam age to
the motherboard and the DIMM if you force the DIMM into the slot at incor rect
orientation.

15

English

1

2

English

16

3

B360M-HDV

2.4 Expansion Slots (PCI Express Slots)

ere are 3 PCI Express slots on the motherboard.

Before installing an ex pansion card, please make sure that the power supply is
switched o or the power cord is unplugged. Plea se read the documentation of the
expan sion card and mak e necessary h ardware settings for the card before you start
the installation.

PCIe slots:

PCIE1 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

PCIE2 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.

PCIE3 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

17

English

2.5 Jumpers Setup

e illustration shows how jumpers are setup. When the jumper cap is placed on

the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is

“O pen”.

English

Clear CMOS Jumper

(CLRCMO S1)

(see p.6, No. 11)

CLRCMOS1 allows you to clear the data in CMOS. e data in CMOS includes

system setup information such as system password, date, time, and system setup

parameters. To clear and reset the system parameters to default setup, please

turn o the computer and unplug the power cord, then use a jumper cap to short

the pins on CLRCMOS1 for 3 seconds. Please remember to remove the jumper

cap aer clearing the CMOS. If you need to clear the CMOS when you just nish

updating the BIOS, you must boot up the system rst, and then shut it down

before you do the clear-CMOS action.

If you clear the CMOS, the case open may be detec ted. Please a djust the BIOS option
“Clear Status” to clear the record of previou s chassis int rusion status.

2-pin Jumper

Short: Clear CMOS

Open: Default

18

2.6 Onboard Headers and Connectors

1

Onboard headers and connectors are NOT jump ers. Do NOT place jumper caps over
these headers and connectors. Placing jumper caps over the headers and connectors
will cause permanent damage to the motherboard.

B360M-HDV

System Panel Header

(9-pi n PANEL1)

(see p.6, No. 15)

PWRBTN (Power Button):

Connec t to the power button on the ch assi s front panel. You may congure the way to tur n
o your system using the power button.

RESET (Reset B utton):
Connec t to the reset button on the ch assi s front panel. P ress the reset button to re start the
computer if the computer f reezes and fails to per form a normal restar t.

PLED (Syste m Power LED):
Connec t to the power status indicator on the chas sis front panel. e LED i s on when the
system is operating. e LED keeps blinking when the system is in S1/S3 sleep state. e
LED is o when the system is in S4 slee p state or powered o (S5).

HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive ac tivity LED on the chassis front panel. e LED is on when the
hard drive is reading or wr iting data.

e front panel de sign may dier by chassis. A front panel module mainly consists of powe r
button, reset button , power LED, hard dr ive activity LED, speaker and etc. When connect­ing your ch assi s front panel module to thi s header, make sure the wire a ssignments and the
pin assignments are matched correctly.

PLED+

PLED-

HDLED-

HDLED+

PWRBTN#

GND

RESET#

GND

GND

Connect the power

button, reset button and

system status indicator on

the chassis to this header

according to the pin

assignments below. Note

the positive and negative

pins before connecting

the cables.

English

19

Chassis Intrusion and

1

+5V

DUMMY

SIGNAL

GND

DUMMY

SPEAKER

DUMMY

IntA_P3_SSRX+

IntA_P2_SSRX+

IntA_P2_SSTX+

DUMMY

GND

GND

P+

P-

USB_PWR

P+

P-

USB_PWR

1

Speaker Header

(7-pi n SPK _CI1)

(see p.6, No. 16)

Please connect the

chassis power LED and

the chassis speaker to this

header.

English

Serial ATA3 Connectors

(SATA3_0:

see p.6, No. 12)

(SATA3_1:

see p.6, No. 13)

(SATA3_ 2:

see p.6, No. 9)

(SATA3_ 3:

see p.6, No. 10)

(SATA3_4:

see p.6, No. 8)

(SATA3_ 5:

see p.6, No. 7)

USB 2.0 Headers

(9-pin USB_7_8)

(see p.6, No. 17)

(9-pin USB_13_14)

(see p.6, No. 18)

USB 3.1 Gen1 Header

(19-pin USB_11_12)

(see p.6, No. 6)

Vbus

IntA_P2_SSRX-

GND

IntA_P2_SSTX-

GND

IntA_P2_D-

IntA_P2_D+

SATA3_5

SATA3_2

SATA3_0

VbusVbus

IntA_P3_SSRX-

GND

IntA_P3_SSTX-

IntA_P3_SSTX+

GND

IntA_P3_D-

IntA_P3_D+

ID

1

SATA3_4

SATA3_3

SATA3_1

ese six SATA3

connectors support SATA

data cables for internal

storage devices with up to

6.0 Gb/s data transfer rate.

* If M2_1 is occupied by

a SATA-type M.2 device,

SATA3_3 will be disabled.

ere are two USB

2.0 headers on this

motherboard. Each USB

2.0 header can support

two ports.

ere is one header on

this motherboard. is

USB 3.1 Gen1 header can

support two ports.

20

B360M-HDV

J_SENSE

OUT2_L

1

MIC_RET

PRESENCE#

GND

OUT2_R

MIC2_R

MIC2_L

OUT_RET

F

4

FAN_SPEED_CONTROL

1 2 3 4

GND

1 2 3 4

Front Panel Audio Header

(9-pin HD_ AUDIO1)

(see p.6, No. 22)

1. High Denition Audio support s Jack Sensing, but the panel wire on the cha ssis

must support HDA to function cor rectly. Please follow the instr uctions in our
manual and chassis manual to in stall your system.

2. If you use an AC’97 audio panel , please install it to th e front panel audio header by

the steps below:
A. Connect Mic_IN (MIC) to MIC2_ L.
B. Conne ct Audio_R (RIN) to OUT2_R and Audio_ L (LIN) to OUT2_ L.
C. Connect Ground (GND) to Ground (GND).
D. MIC_ RET and OUT_RET are for the HD audio panel only. You don’t ne ed to
connec t them for the AC’97 audio panel.
E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel
and adjust “Recording Volume”.

Chassis/Water Pump Fan

Connectors

(4-pin CHA_FAN1/WP)

(see p.6, No. 4)

(4-pin CHA_FAN2/WP)

(see p.6, No. 14)

FAN_VOLTAGE

FAN_SPEED

FAN_SPEED_CONTROL

AN_SPEED_CONTROL

CHA_FAN_SPEED

FAN_VOLTAGE

GND

is header is for

connecting audio devices

to the front audio panel.

is motherboard

provides two 4-Pin water

cooling

chassis

fan

connectors. If you plan to

connect a 3-Pin

3
2
1

water cooler fan, please

connect it to Pin 1-3.

chassis

CPU Fan Connector

(4-pin CPU_FAN1)

(see p.6, No. 2)

CPU_FAN_SPEED

FAN_VOLTAGE

GND

is motherboard

provides a 4-Pin CPU fan

(Quiet Fan) connector.

If you plan to connect a

3-Pin CPU fan, please

connect it to Pin 1-3.

English

21

ATX Power Connector

1

#

5

1

8

1

1

AFD#

SLCT

(24-p i n ATX PWR1)

(see p.6, No. 5)

12

24

is motherboard

provides a 24-pin ATX

power connector. To use a

20-pin ATX power supply,

please plug it along Pin 1

1

13

and Pin 13.

English

ATX 12V Power

Connector

(8-pin ATX12V1)

(see p.6, No. 1)

Serial Port Header

(9-p in CO M1)

(see p.6, No. 19)

TPM Header

(17-pi n TP MS1)

(see p.6, No. 21)

Print Port Header

(25-pin LPT1)

(see p.6, No. 20)

STB#

ERROR#

PINIT#

SPD1

SPD0

GN D

D

GN

SLIN#

SPD2

+3V S B

SER IRQ #

SPD3

RRXD1

DDTR#1

TTXD1

DDCD#1

S_P WRDW N #

SPD5

SPD4

DDSR#1

GND

LAD 0

GN D

SPD6

CCTS#1

RRTS#1

+3 V

LAD 1

GND

SPD7

LAD 3

LAD 2

RRI#1

ACK#

is motherboard

provides an 8-pin ATX

12V power connector. To

use a 4-pin ATX power

supply, please plug it along

Pin 1 and Pin 5.

is COM1 header

supports a serial port

module.

is connector supports Trusted

Platform Module (TPM) system,

PC ICL K

PC IRS T

FRA M E

which can securely store keys,

GN D

digital certicates, passwords,

and data. A TPM system also

helps enhance network security,

SMB _CLK _MA IN

SMB _DAT A_M AIN

protects digital identities, and

ensures platform integrity.

is is an interface

for print port cable

that allows convenient

BUSY

PE

connection of printer

devices.

22

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4

2.7 M.2_SSD (NGFF) Module Installation Guide

The M.2, a lso known as the Next Generation Form Factor (NGFF), is a sma ll size a nd

versatile card edge connec tor t hat aims to replace mPCIe and mSATA. The Ult ra M.2

Socket (M2_1) supports SATA3 6.0 Gb/s module and M.2 PCI Express module up to Gen3

x4 (32 Gb/s).

* If M2_1 is occupied by a SATA-type M.2 device, SATA3_3 will be disabled.

Installing the M.2_SSD (NGFF) Module

Step 1

Prepare a M.2_SSD (NGFF) module

and the screw.

Step 2

3

2

1

Depending on the PCB type and

length of your M.2_SSD (NGFF)

module, nd the corresponding nut

location to be used.

A

BCD

No. 1 2 3 4

Nut Location A B C D

PCB Length 3cm 4.2cm 6cm 8cm

Module Type Type223 0 Ty pe 224 2 Type2 260 Ty pe 2280

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23

Step 3

Move the stando based on the

module type and length.

A

BCD

e stando is placed at the nut

location D by default. Skip Step 3

and 4 and go straight to Step 5 if you

are going to use the default nut.

Otherwise, release the stando by

hand.

Step 4

Peel o the yellow protective lm on

the nut to be used. Hand tighten the

A

BCD

stando into the desired nut location

on the motherboard.

Step 5

Gently insert the M.2 (NGFF) SSD

module into the M.2 slot. Please

be aware that the M.2 (NGFF) SSD

ABCD

module only ts in one orientation.

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24

o

ABCD

20

Step 6

Tighten the screw with a screwdriver

to secure the module into place.

NUT1NUT2D

Please do not overtighten the screw

as this might damage the module.

M.2_SSD (NGFF) Module Support List

Vendor Interface P/N

ADATA SATA3 AXNS381E-128GM-B
ADATA SATA3 AX NS381E -25 6GM-B
ADATA SATA3 ASU800NS38-256GT-C
ADATA SATA3 ASU800NS38-512GT-C
ADATA PCIe3 x4 ASX7000NP-128GT-C
ADATA PCIe3 x4 ASX8000NP-256GM-C
ADATA PCIe3 x4 ASX7000NP-256GT-C
ADATA PCIe3 x4 ASX8000NP-512GM-C
ADATA PCIe3 x4 ASX7000NP-512GT-C
Apacer PCIe3 x4 AP240GZ280
Corsair PCIe3 x4 CSSD-F240GBMP500
Crucial SATA3 CT120M500SSD4
Crucial SATA3 CT240M500SSD4
Intel SATA3 Intel SSDSCKGW080A401/80G
Intel PCIe3 x4 SSDPEKKF256G7
Intel PCIe3 x4 SSDPEKKF512G7
Kingston SATA3 SM2280S3
Kingston PCIe3 x4 SKC1000/480G
Kingston PCIe2 x4 SH2280S3/480G
OCZ PCIe3 x4 RVD400-M2280-512G (NVME)
PAT R IOT PCIe3 x4 PH240GPM280SSDR NVME
Plextor PCIe3 x4 PX-128M8PeG
Plextor PCIe3 x4 PX-1TM8PeG
Plextor PCIe3 x4 PX-256M8PeG
Plextor PCIe3 x4 PX-512 M8PeG
Plextor PCIe PX-G25 6M6e
Plextor PCIe PX-G512M6e
Samsung PCIe3 x4 SM961 MZVPW128HEGM (NVM)
Samsung PCIe3 x4 PM961 MZVLW128HEGR (NVME)
Samsung PCIe3 x4 960 EVO (MZ-V6E250) (NVME)
Samsung PCIe3 x4 960 EVO (MZ-V6E250BW) (NVME)
Samsung PCIe3 x4 SM951 (NV ME)
Samsung PCIe3 x4 SM951 (MZHPV256HDGL)
Samsung PCIe3 x4 SM951 (M ZHPV512HDGL)
Samsung PCIe3 x4 SM951 (NV ME)
Samsung PCIe x4 XP941-512G (MZHPU512HCGL)
SanDisk PCIe SD6PP4M-128G
SanDisk PCIe SD6PP4M-256G
Team SATA3 TM4PS4128GMC105
Team SATA3 TM4PS4256GMC105
Team SATA3 TM8PS4128GMC105
Team SATA3 TM8PS4256GMC105
TEAM PCIe3 x4 TM8FP2240G0 C101

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25

TEAM PCIe3 x4 TM8FP2480GC110
Tra nscend SATA 3 TS256GMTS400
Tra nscend SATA 3 TS512GMTS600
Tra nscend SATA 3 TS512GMTS800
V-Col or SATA3 VLM100-120G-2280B-RD
V-Col or SATA3 VLM10 0-240G-2280RGB
V-Col or SATA3 VSM100-240 G-2280
V-Col or SATA3 VLM10 0-240G-2280B-RD
WD SATA3 WDS100T1B0B-00AS40
WD SATA3 WDS240G1G0B-00RC30
WD PCIe3 x4 WDS256G1X0C-00ENX0 (NVME)
WD PCIe3 x4 WDS512G1X0C-00EN X0 (NVME)

For the latest updates of M.2_SSD (NFGG) module support list, please visit our website for

details: http://www.asrock.com

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26

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Chapter 3 Software and Utilities Operation

3.1 Installing Drivers

e Support CD that comes with the motherboard contains necessary drivers and

useful utilities that enhance the motherboard’s features.

Running The Support CD

To begin using the support CD, insert the CD into your CD-ROM drive. e CD

automatically displays the Main Menu if “AUTORUN” is enabled in your computer.

If the Main Menu does not appear automatically, locate and double click on the le

“ASRSETUP.EXE” in the Support CD to display the menu.

Drivers Menu

e drivers compatible to your system will be auto-detected and listed on the

support CD driver page. Please click Install All or follow the order from top to

bottom to install those required drivers. erefore, the drivers you install can work

properly.

Utilities Menu

e Utilities Menu shows the application soware that the motherboard supports.

Click on a specic item then follow the installation wizard to install it.

27

English

3.2 A-Tuning

A-Tuning is ASRock’s multi purpose soware suite with a new interface, more new

features and improved utilities.

3.2.1 Installing A-Tuning

A-Tu ni n g can be downloaded from ASRock Live Update & APP Shop. Aer the

installation, you will nd the icon “A-Tu n i ng“ on your desktop. Double-click the

“A-Tu ni n g“ icon, A-Tu n i n g main menu will pop up.

3.2.2 Using A-Tuning

ere are four sections in A-Tuning main menu: Operation Mode, System Info,

FAN-Tastic Tuning and Settings.

Operation Mode

Choose an operation mode for your computer.

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28

System Info

View information about the system.

*e System Browser tab may not appear for certain models.

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FAN-Tastic Tuning

Congure up to ve dierent fan speeds using the graph. e fans will automatically shi

to the next speed level when the assigned temperature is met.

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29

Settings

Congure ASRock A-Tuning. Click to select "Auto run at Windows Startup" if you

want A-Tuning to be launched when you start up the Windows operating system.

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30

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3.3 ASRock Live Update & APP Shop

e ASRock Live Update & APP Shop is an online store for purchasing and

downloading soware applications for your ASRock computer. You can quickly and

easily install various apps and support utilities. With ASRock Live Update & APP

Shop, you can optimize your system and keep your motherboard up to date simply

with a few clicks.

Double-click on your desktop to access ASRock Live Update & APP Shop
utility.

*You need to be connected to the Internet to download apps f rom the ASRock Live Update & APP Shop.

3.3.1 UI Overview

Category Panel

Hot News

Information Panel

Category Panel: e category panel contains several category tabs or buttons that

when selected the information panel below displays the relative information.

Information Panel: e information panel in the center displays data about the

currently selected category and allows users to perform job-related tasks.

Hot News: e hot news section displays the various latest news. Click on the image

to visit the website of the selected news and know more.

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31

3.3.2 Apps

When the "Apps" tab is selected, you will see all the available apps on screen for you

to download.

Installing an App

Step 1

Find the app you want to install.

e most recommended app appears on the le side of the screen. e other various

apps are shown on the right. Please scroll up and down to see more apps listed.

You can check the price of the app and whether you have already intalled it or not.

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32

- e red icon displays the price or "Free" if the app is free of charge.

- e green "Installed" icon means the app is installed on your computer.

Step 2

Click on the app icon to see more details about the selected app.

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Step 3

If you want to install the app, click on the red icon to start downloading.

Step 4

When installation completes, you can nd the green "Installed " icon appears on the

upper right corner.

To uninstall it, simply click on the trash can icon .
*e trash icon may not appear for certain apps.

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33

Upgrading an App

You can only upgrade the apps you have already installed. When there is an

available new version for your app, you will nd the mark of "New Version"

appears below the installed app icon.

Step 1

Click on the app icon to see more details.

Step 2

Click on the yellow icon to start upgrading.

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34

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3.3.3 BIOS & Drivers

Installing BIOS or Drivers

When the "BIOS & Drivers" tab is selected, you will see a list of recommended or

critical updates for the BIOS or drivers. Please update them all soon.

Step 1

Please check the item information before update. Click on to see more details.

Step 2

Click to select one or more items you want to update.

Step 3

Click Update to start the update process.

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35

3.3.4 Setting

In the "Setting" page, you can change the language, select the server location, and

determine if you want to automatically run the ASRock Live Update & APP Shop

on Windows startup.

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36

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Chapter 4 UEFI SETUP UTILITY

4.1 Introduction

is section explains how to use the UEFI SETUP UTILITY to congure your

system. You may run the UEFI SETUP UTILITY by pressing <F2> or <Del> right

aer you power on the computer, other wise, the Power-On-Self-Test (POST) will

continue with its test routines. If you wish to enter the UEFI SETUP UTILITY aer

POST, restart the system by pressing <Ctl> + <Alt> + <Delete>, or by pressing the

reset button on the system chassis. You may also restart by turning the system o

and then back on.

Becau se the UEFI soware is constantly being upd ated, the following UEFI setup screens
and descriptions are for reference pur pose only, and they may not exactly match what you
see on your screen.

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English

4.2 EZ Mode

e EZ Mode screen appears when you enter the BIOS setup program by default. EZ

mode is a dashboard which contains multiple readings of the system’s current status.

You can check the most crucial information of your system, such as CPU speed,

DRAM frequency, SATA information, fan speed, etc.

Press <F6> or click the "Advanced Mode" button at the upper right corner of the

screen to switch to "Advanced Mode" for more options.

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38

No. Function

Help

1

Load UEFI Defaults

2

Save Changes and Exit

3

Discard Changes

4

Change Language

5

Switch to Advanced Mode

6

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4.3 Advanced Mode

e Advanced Mode provides more options to congure the BIOS settings. Refer to

the following sections for the detailed congurations.

To access the EZ Mode, press <F6> or click the "EZ Mode" button at the upper right

corner of the screen.

4.3.1 UEFI Menu Bar

e top of the screen has a menu bar with the following selections:

Main

OC Tweaker

Advanced

Tool

H/W Monitor

Security

Boot

Exit

For setting system time/date information

For overclocking congurations

For advanced system congurations

Useful tools

Displays current hardware status

For security settings

For conguring boot settings and boot priority

Exit the current screen or the UEFI Setup Utility

39

English

4.3.2 Navigation Keys

Use < > key or < > key to choose among the selections on the menu bar, and

use < > key or < > key to move the cursor up or down to select items, then

press <Enter> to get into the sub screen. You can also use the mouse to click your

required item.

Please check the following table for the descriptions of each navigation key.

Navigation Key(s) Description

+ / -

<Tab>

<PGUP>

<PGDN>

<HOME>

<END>

<F1>

<F5>

<F7>

<F9>

<F10>

<F12>

<ESC>

To change option for the selected items

Switch to next function

Go to the previous page

Go to the next page

Go to the top of the screen

Go to the bottom of the screen

To display the General Help Screen

Add / Remove Favorite

Discard changes and exit the SETUP UTILITY

Load optimal default values for all the settings

Save changes and exit the SETUP UTILITY

Print screen

Jump to the Exit Screen or exit the current screen

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4.4 Main Screen

When you enter the UEFI SETUP UTILITY, the Main screen will appear and

display the system overview.

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My Favorite

Display your collection of BIOS items. Press F5 to add/remove your favorite items.

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41

4.5 OC Tweaker Screen

In the OC Tweaker screen, you can set up overclocking features.

Becau se the UEFI soware is constantly being upd ated, the following UEFI setup screens
and descriptions are for reference pur pose only, and they may not exactly match what you
see on your screen.

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42

CPU Conguration

Boot Performance Mode

Default is Max Non-Turbo performance mode. It will keep cpu Flex-ratio till OS

hando. Max Battery mode will set CPU ratio as x8 till OS hando. is option is

suggested for BCLK overclocking.

FCLK Frequency

Congure the FCLK Frequency.

Intel SpeedStep Technology

Intel SpeedStep technology allows processors to switch between multiple frequen-

cies and voltage points for better power saving and heat dissipation.

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Intel Turbo Boost Technology

Intel Turbo Boost Technolog y enables the processor to run above its base operating

frequency when the operating system requests the highest performance state.

Intel Speed Shift Technology

Enable/Disable Intel Speed Shi Technology support. Enabling will expose the

CPPC v2 interface to allow for hardware controlled P-sates.

Long Duration Power Limit

Congure Package Power Limit 1 in watts. When the limit is exceeded, the CPU

ratio will be lowered aer a period of time. A lower limit can protect the CPU and

save power, while a higher limit may improve performance.

Long Duration Maintained

Congure the period of time until the CPU ratio is lowered when the Long

Duration Power Limit is exceeded.

Short Duration Power Limit

Congure Package Power Limit 2 in watts. When the limit is exceeded, the CPU

ratio will be lowered immediately. A lower limit can protect the CPU and save

power, while a higher limit may improve performance.

CPU Core Current Limit

Congure the current limit of the CPU core. A lower limit can protect the CPU and

save power, while a higher limit may improve performance.

GT Current Limit

Congure the current limit of the GT slice. A lower limit can protect the CPU and

save power, while a higher limit may improve performance.

DRAM Conguration

DRAM Tweaker

Fine tune the DRAM settings by leaving marks in checkboxes. Click OK to conrm and

apply your new settings.

DRAM Timing Conguration

Load XMP Setting

Load XMP settings to overclock the memory and perform beyond standard

specications.

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43

DRAM Reference Clock

Select Auto for optimized settings.

DRAM Frequency

If [Auto] is selected, the motherboard will detect the memory module(s) inserted

and assign the appropriate frequency automatically.

DRAM Clock

Choose a frequency to override to clock delay for memory training. DRAM Clock

controls memor y training only if ASRock Timing Optimization is disabled.

Primary Timing

CAS# Latency (tCL)

e time between sending a column address to the memory and the beginning of the data

in response.

RAS# to CAS# Delay and Row Precharge (tRCDtRP)

RAS# to CAS# Delay : e number of clock cycles required between the opening of

a row of memory and accessing columns within it.

Row Precharge: e number of clock cycles required between the issuing of the

precharge command and opening the next row.

RAS# Active Time (tRAS)

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44

e number of clock cycles required between a bank active command and issuing the

precharge command.

Command Rate (CR)

e delay between when a memor y chip is selected and when the rst active command can

be issued.

Secondary Timing

Write Recovery Time (tWR)

e amount of delay that must elapse aer the completion of a valid write operation,

before an active bank can be precharged.

Refresh Cycle Time (tRFC)

e number of clocks from a Refresh command until the rst Activate command to

the same rank.

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RAS to RAS Delay (tRRD_L)

e number of clocks between two rows activated in dierent banks of the same

rank.

RAS to RAS Delay (tRRD_S)

e number of clocks between two rows activated in dierent banks of the same

rank.

Write to Read Delay (tWTR_L)

e number of clocks between the last valid write operation and the next read command to

the same interna l bank.

Write to Read Delay (tWTR_S)

e number of clocks between the last valid write operation and the next read command to

the same interna l bank.

Read to Precharge (tRTP)

e number of clocks that are inserted between a read command to a row pre-

charge command to the same rank.

Four Activate Window (tFAW)

e time window in which four activates are allowed the same rank.

CAS Write Latency (tCWL)

Congure CAS Write Latency.

Third Timing

tREFI

Congure refresh cycles at an average periodic interval.

tCKE

Congure the period of time the DDR4 initiates a minimum of one refresh

command internally once it enters Self-Refresh mode.

Turn Around Timing

tRDRD_sg

Congure between module read to read delay.

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45

tRDRD_dg

Congure between module read to read delay.

tRDRD_dr

Congure between module read to read delay.

tRDRD_dd

Congure between module read to read delay.

tRDWR_sg

Congure between module read to write delay.

tRDWR_dg

Congure between module read to write delay.

tRDWR_dr

Congure between module read to write delay.

tRDWR_dd

Congure between module read to write delay.

tWRRD_sg

Congure between module write to read delay.

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46

tWRRD_dg

Congure between module write to read delay.

tWRRD_dr

Congure between module write to read delay.

tWRRD_dd

Congure between module write to read delay.

tWRWR_sg

Congure between module write to write delay.

tWRWR_dg

Congure between module write to write delay.

tWRWR_dr

Congure between module write to write delay.

tWRWR_dd

Congure between module write to write delay.

Round Trip Timing

RTL Init Value

Congure round trip latency init value for round trip latency training.

IO-L Init Value

Congure IO latency init value for IO latency training.

RTL (CH A)

Congure round trip latency for channel A.

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RTL (CH B)

Congure round trip latency for channel B.

IO-L (CH A)

Congure IO latency for channel A.

IO-L (CH B)

Congure IO latency for channel B.

IO-L Oset (CH A)

Congure IO latency oset for channel A.

IO-L Oset (CH B)

Congure IO latency oset for channel B.

RFR Delay (CH A)

Congure RFR Delay for Channel A.

RFR Delay (CH B)

Congure RFR Delay for Channel B.

ODT Setting

ODT WR (A1)

Congure the memory on die termination resistors' WR for channel A.

ODT WR (B1)

Congure the memory on die termination resistors' WR for channel B.

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ODT NOM (A1)

Use this to change ODT (CH A) Auto/Manual settings. e default is [Auto].

ODT NOM (B1)

Use this to change ODT (CH B) Auto/Manual settings. e default is [Auto].

ODT PARK (A1)

Congure the memory on die termination resistors' PARK for channel A.

ODT PARK (B1)

Congure the memory on die termination resistors' PARK for channel B.

COMP Setting

RCOMP0: DQ ODT (Read)

Default is 121.

RCOMP1: DQ /CLK Ron (Drive Strength)

Default is 75.

RCOMP2: CMD/CTL Ron (Drive Strength)

Default is 100.

DQ ODT Driving

Adjust ODT Driving for better signal. Default is 60.

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DQ Driving

Adjust DQ Driving for better signal. Default is 26.

Command Driving

Adjust Command Driving for better signal. Default is 20.

Control Driving

Adjust Control Driving for better signa l. Default is 20.

Clock Driving

Adjust Clock Driving for better signal. Default is 26.

DQ Slew Rate

Adjust DQ Slew Rate for better signal. Default is 59.

Command Slew Rate

Adjust Command Slew Rate for better signal. Default is 53 for IN, 89 for 2N.

Contorl Slew Rate

Adjust Control Slew Rate for better signal. Default is 53.

Clock Slew Rate

Adjust Clock Slew Rate for better signal. Default is 53.

MRS Setting

MRS tCL

Congure the tCL for Memory MRS MR0.

MRS tWRtRTP

Congure the tWRtRTP for Memory MRS MRC.

MRS tCWL

Congure the tCWL for Memor y MRS MR2.

MRS tCCD_L

Congure the tCL for Memory MRS MR6.

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Advanced Setting

ASRock Timing Optimization

Congure the fast path through the MRC.

Realtime Memory Timing

Congure the realtime memory timings.

[Enabled] e system will allow performing realtime memory timing changes aer

MRC_DONE.

Command Tristate

Congure the Command Tristate Support.

Exit On Failure

Congure the Exit On Failure for MRC training steps.

Reset On Training Fail

Reset system if the MRC training fails.

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MRC Fast Boot

Enable Memory Fast Boot to skip DRAM memory training for booting faster.

Voltage Conguration

CPU Vcore Voltage

Use this to congure CPU Vcore Voltage. e default value is [Auto].

GT Voltage

Use this to congure GT Voltage. e default value is [Auto].

DRAM Voltage

Use this to congure DRAM Voltage. e default value is [Auto].

PCH +1.0 Voltage

Congure the chipset voltage (1.0V).

Save User Default

Type a prole name and press enter to save your settings as user default.

Load User Default

Load previously saved user defaults.

Save User UEFI Setup Prole to Disk

Save current UEFI settings as an user default prole to disk.

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Load User UEFI Setup Prole to Disk

Load previously saved user defaults from the disk.

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4.6 Advanced Screen

In this section, you may set the congurations for the following items: CPU

Conguration, Chipset Conguration, Storage Conguration, Super IO Congura-

tion, ACPI Conguration, USB Conguration and Trusted Computing.

Setting wrong values in this sec tion may cause the system to malfunction.

UEFI Conguration

UEFI Setup Style

Select the default mode when entering the UEFI setup utility.

Active Page on Entry

Select the default page when entering the UEFI setup utility.

Full HD UEFI

When [Auto] is selected, the resolution will be set to 1920 x 1080 if the monitor

supports Full HD resolution. If the monitor does not support Full HD resolution,

then the resolution will be set to 1024 x 768. When [Disable] is selected, the

resolution will be set to 1024 x 768 directly.

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4.6.1 CPU Conguration

Intel Hyper Threading Technology

Intel Hyper reading Technology allows multiple threads to run on each core, so that the

overall performance on threaded soware is improved.

Active Processor Cores

Select the number of cores to enable in each processor package.

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CPU C States Support

Enable CPU C States Support for power saving. It is recommended to keep C3, C6

and C7 all enabled for better power saving.

Enhanced Halt State (C1E)

Enable Enhanced Halt State (C1E) for lower power consumption.

CPU C6 State Support

Enable C6 sleep state for lower power consumption.

CPU C7 State Support

Enable C7 sleep state for lower power consumption.

Package C State Support

Enable CPU, PCIe, Memor y, Graphics C State Support for power saving.

B360M-HDV

CFG Lock

is item allows you to disable or enable the CFG Lock.

CPU Thermal Throttling

Enable CPU internal thermal control mechanisms to keep the CPU from overheat-

ing.

Intel Virtualization Technology

Intel Virtualization Technology allows a platform to run multiple operating systems

and applications in independent partitions, so that one computer system can

function as multiple virtual systems.

Hardware Prefetcher

Automatically prefetch data and code for the processor. Enable for better

performance.

Adjacent Cache Line Prefetch

Automatically prefetch the subsequent cache line while retrieving the currently

requested cache line. Enable for better performance.

Software Guard Extensions (SGX)

Use this item to enable or disable So ware Controlled Soware Guard Extensions

(SGX).

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4.6.2 Chipset Conguration

Primary Graphics Adapter

Select a primary VGA.

Above 4G Decoding

Enable or disable 64bit capable Devices to be decoded in Above 4G Address Space

(only if the system supports 64 bit PCI decoding).

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VT-d

Intel® Virtualization Technology for Directed I/O helps your virtual machine

monitor better utilize hardware by improving application compatibility and

reliability, and providing additional levels of manageability, security, isolation, and

I/O performance.

PCIE1 Link Speed

Select the link speed for PCIE1.

PCIE2 Link Speed

Select the link speed for PCIE2.

PCIE3 Link Speed

Select the link speed for PCIE3.

PCI Express Native Control

Select Enable for enhanced PCI Express power saving in OS.

B360M-HDV

PCIE ASPM Support

is option enables/disables the ASPM support for all CPU downstream devices.

PCH PCIE ASPM Support

is option enables/disables the ASPM support for all PCH PCIE devices.

DMI ASPM Support

is option enables/disables the control of ASPM on CPU side of the DMI Link.

PCH DMI ASPM Support

is option enables/disables the ASPM support for all PCH DMI devices.

Share Memory

Congure the size of memory that is allocated to the integrated graphics processor when

the system boots up.

IGPU Multi-Monitor

Select disable to disable the integrated graphics when an external graphics card is installed.

Select enable to keep the integrated graphics enabled at all times.

Inte(R) Ethernet Connection I219-V

Enable or disable the onboard network interface controller (Intel® I219V).

Onboard HD Audio

Enable/disable onboard HD audio. Set to Auto to enable onboard HD audio and

automatically disable it when a sound card is installed.

Front Panel

Enable/disable front panel HD audio.

Onboard HDMI HD Audio

Enable audio for the onboard digital outputs.

Deep Sleep

Congure deep sleep mode for power saving when the computer is shut down.

Restore on AC/Power Loss

Select the power state aer a power failure. If [Power O] is selected, the power will

remain o when the power recovers. If [Power On] is selected, the system will start

to boot up when the power recovers.

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4.6.3 Storage Conguration

SATA Controller(s)

Enable/disable the SATA controllers.

SATA Aggressive Link Power Management

SATA Aggressive Link Power Management allows SATA devices to enter a low

power state during periods of inactivity to save power. It is only supported by AHCI

mode.

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Hard Disk S.M.A.R.T.

S.M.A.R.T stands for Self-Monitoring, Analysis, and Reporting Technology. It is a

monitoring system for computer hard disk drives to detect and report on various

indicators of reliability.

4.6.4 Super IO Conguration

Serial Port

Enable or disable the Serial port.

B360M-HDV

Serial Port Address

Select the address of the Serial port.

Parallel Port

Enable or disable the Parallel port.

Change Settings

Select the address of the Parallel port.

Device Mode

Select the device mode according to your connected device.

PS2 Y- Cable

Enable the PS2 Y-Cable or set this option to Auto.

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4.6.5 ACPI Conguration

Suspend to RAM

Select disable for ACPI suspend type S1. It is recommended to select auto for ACPI

S3 power saving.

PS/2 Keyboard Power On

Allow the system to be waked up by a PS/2 Keyboard.

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PCIE Devices Power On

Allow the system to be waked up by a PCIE device and enable wake on LAN.

I219 LAN Power On

Allow the system to be waked up by I219 LAN.

Ring-In Power On

Allow the system to be waked up by onboard COM port modem Ring-In signals.

RTC Alarm Power On

Allow the system to be waked up by the real time clock alarm. Set it to By OS to let

it be handled by your operating system.

USB Keyboard/Remote Power On

Allow the system to be waked up by an USB keyboard or remote controller.

USB Mouse Power On

Allow the system to be waked up by an USB mouse.

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4.6.6 USB Conguration

Legacy USB Support

Enable or disable Legacy OS Support for USB 2.0 devices. If you encounter USB

compatibility issues it is recommended to disable legacy USB support. Select UEFI

Setup Only to support USB devices under the UEFI setup and Windows/Linux

operating systems only.

XHCI Hand-o

is is a workaround for OSes without XHCI hand-o support. e XHCI

ownership change should be claimed by XHCI driver.

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4.6.7 Trusted Computing

Security Device Support

Enable or disable BIOS support for security device.

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4.7 Tools

UEFI Tech Service

Contact ASRock Tech Service if you are having trouble with your PC. Please setup

network conguration before using UEFI Tech Service.

Instant Flash

Save UEFI les in your USB storage device and run Instant Flash to update your

UEFI.

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Internet Flash - DHCP (Auto IP), Auto

ASRock Internet Flash downloads and updates the latest UEFI rmware version

from our servers for you. Please setup network conguration before using Internet

Flash.

*For BIOS backup and recovery purpose, it is recommended to plug in your USB

pen drive before using this function.

Network Conguration

Use this to congure internet connection settings for Internet Flash.

Internet Setting

Enable or disable sound eects in the setup utility.

B360M-HDV

UEFI Download Server

Select a server to download the UEFI rmware.

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4.8 Hardware Health Event Monitoring Screen

is section allows you to monitor the status of the hardware on your system,

including the parameters of the CPU temperature, motherboard temperature, fan

speed and voltage.

Fan Tuning

Measure Fan Min Duty Cycle.

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Fan-Tastic Tuning

Select a fan mode for CPU Fans 1&2, or choose Customize to set 5 CPU

temperatures and assign a respective fan speed for each temperature.

CPU Fan 1 Setting

Select a fan mode for CPU Fans 1, or choose Customize to set 5 CPU temperatures and

assign a respective fan speed for each temperature.

CPU Fan Step Up

Set the value of CPU Fan Step Up.

CPU Fan Step Down

Set the value of CPU Fan Step Down.

CHA_FAN1 / W_Pump Switch

Select CHA_FAN1 / W_Pump mode.

B360M-HDV

CHA_FAN2 Control Mode

Select PWM mode or DC mode for CHA_FAN2.

Chassis Fan 1 Setting

Select a fan mode for Chassis Fan 1, or choose Customize to set 5 CPU temperatures

and assign a respective fan speed for each temperature.

Chassis Fan 1 Temp Source

Select a fan temperature source for Chassis Fan 1.

Chassis Fan 1 Step Up

Set the value of Chassis Fan 1 Step Up.

Chassis Fan 1 Step Down

Set the value of Chassis Fan 1 Step Down.

CHA_FAN2 / W_Pump Switch

Select CHA_FAN2 / W_Pump mode.

CHA_FAN2 Control Mode

Select PWM mode or DC mode for CHA_FAN2.

CHA_FAN2 Setting

Select a fan mode for CHA_FAN2, or choose Customize to set 5 CPU temperatures

and assign a respective fan speed for each temperature.

Chassis Fan 2 Temp Source

Select a fan temperature source for Chassis Fan 2.

Chassis Fan 2 Step Up

Set the value of Chassis Fan 2 Step Up.

Chassis Fan 2 Step Down

Set the value of Chassis Fan 2 Step Down.

Over Temperature Protection

When Over Temperature Protection is enabled, the system automatically shuts

down when the motherboard is overheated.

Case Open Feature

Enable or disable Case Open Feature to detect whether the chassis cover has been

removed.

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4.9 Security Screen

In this section you may set or change the supervisor/user password for the system.

You may also clear the user password.

Supervisor Password

Set or change the password for the administrator account. Only the administrator

has authority to change the settings in the UEFI Setup Utility. Leave it blank and

press enter to remove the password.

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User Password

Set or change the password for the user account. Users are unable to change the

settings in the UEFI Setup Utility. Leave it blank and press enter to remove the

password.

Secure Boot

Use this item to enable or disable support for Secure Boot.

Intel(R) Platform Trust Technology

Enable/disable Intel PTT in ME. Disable this option to use discrete TPM Module.

B360M-HDV

4.10 Boot Screen

is section displays the available devices on your system for you to congure the

boot settings and the boot priority.

Fast Boot

Fast Boot minimizes your computer's boot time. In fast mode you may not boot

from an USB storage device. e VBIOS must support UEFI GOP if you are using

an external graphics card. Please notice that Ultra Fast mode will boot so fast that

the only way to enter this UEFI Setup Utility is to Clear CMOS or run the Restart to

UEFI utility in Windows.

Boot From Onboard LAN

Allow the system to be waked up by the onboard LAN.

Setup Prompt Timeout

Congure the number of seconds to wait for the setup hot key.

Bootup Num-Lock

Select whether Num Lock should be turned on or o when the system boots up.

Boot Beep

Select whether the Boot Beep should be turned on or o when the system boots up. Please

note that a buzzer is needed.

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Full Screen Logo

Enable to display the boot logo or disable to show normal POST messages.

AddOn ROM Display

Enable AddOn ROM Display to see the AddOn ROM messages or congure the

AddOn ROM if you've enabled Full Screen Logo. Disable for faster boot speed.

Boot Failure Guard Message

If the computer fails to boot for a number of times the system automatically restores

the default settings.

CSM (Compatibility Support Module)

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CSM

Enable to launch the Compatibility Support Module. Please do not disable unless

you’re running a WHCK test.

Launch PXE OpROM Policy

Select UEFI only to run those that support UEFI option ROM only. Select Legacy

only to run those that support legacy option ROM only. Select Do not launch to not

execute both legacy and UEFI option ROM.

B360M-HDV

Launch Storage OpROM Policy

Select UEFI only to run those that support UEFI option ROM only. Select Legacy

only to run those that support legacy option ROM only. Select Do not launch to not

execute both legacy and UEFI option ROM.

Other PCI Device ROM Priority

For PCI devices other than Network. Mass storage or Video denes which OpROM

to launch.

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4.11 Exit Screen

Save Changes and Exit

When you select this option the following message, “Save conguration changes

and exit setup?” will pop out. Select [OK] to save changes and exit the UEFI SETUP

UTILITY.

Discard Changes and Exit

When you select this option the following message, “Discard changes and exit

setup?” will pop out. Select [OK] to exit the UEFI SETUP UTILITY without saving

any changes.

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Discard Changes

When you select this option the following message, “Discard changes?” will pop

out. Select [OK] to discard all changes.

Load UEFI Defaults

Load UEFI default values for a ll options. e F9 key can be used for this operation.

Launch EFI Shell from lesystem device

Copy shellx64.e to the root directory to launch EFI Shell.

Contact Information

If you need to contact ASRock or want to know more about ASRock, you’re welcome

to visit ASRock’s website at http://ww w.asrock.com; or you may contact your dealer

for further information. For technical questions, please submit a support request

form at https://event.asrock.com/tsd.asp

ASRock Incorporation

2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District,

Taipei City 112, Taiwan (R.O.C.)

ASRock EUROPE B.V.

Bijsterhuizen 11-11

6546 AR Nijmegen

e Netherlands

Phone: [phone]

Fax: [phone]

ASRock America, Inc.

13848 Magnolia Ave, Chino, CA91710

U.S.A.

Phone: [phone]

Fax: [phone]

DECLARATION OF CONFORMITY

Responsible Party Name:

Phone/FaxNo:

hereby declares that the product

Product Name : Motherboard

Per FCC Part 2 Section 2.1077(a)

ASRock Incorporation

Address:

13848 Magnolia Ave, Chino, CA91710

[phone]/[phone]

Model Number :

Conforms to the following specications:

FCC Part 15, Subpart B, Unintentional Radiators

Supplementary Information:

B360M-HDV

is device complies with part 15 of the FCC Rules. Operation is subject to the

following two conditions: (1) is device may not cause harmful interference,

and (2) this device must accept any interference received, including interference

that may cause undesired operation.

James

Representative Person’s Name:

Signature :

Date :

May 12, 2017

EU Declaration of Conformity

EMC —Directive 2014/30/EU (from April 20th, 2016)

ڛ

☐

For the following equipment:

Motherboard

(Product Name)

B360M-HDV / ASRock

(Model Designation / Trade Name)

ASRock Incorporation

(Manufacturer Name)

2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District, Taipei City 112, Taiwan (R.O.C.)

(Manufacturer Address)

☐ EN 55022:2010/AC:2011 Class B EN 55024:2010/A1:2015

ڛ EN 55032:2012+AC:2013 Class B ڛڛ EN 61000-3-3:2013
ڛ EN 61000-3-2:2014

☐

LVD —Directive 2014/35/EU (from April 20th, 2016)

EN 60950-1 : 2011+ A2: 2013 ☐

ڛ RoHS — Directive 2011/65/EU
ڛ CE marking

EN 60950-1 : 2006/A12: 2011

(EU conformity marking)

ASRock EUROPE B.V.

(Company Name)

Bijsterhuizen 1111 6546 AR Nijmegen e Netherlands

(Company Address)

Person responsible for making this declaration:

(Name, Surname)

A.V.P

(Position / Title)

March 9, 2018

(Date)

P/N: 15G062081000AK V1.0