ASRock B360M-HDV Service Manual

Version 1.0

Published January 2018

Copyright©2018 ASRock INC. All rights reserved.

Copyright Notice:

No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.

Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to

infringe.

Disclaimer:

Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.

With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.

In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.

is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that

may cause undesired operation.

CALIFORNIA, USA ONLY

e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/
perchlorate”

ASRock Website: http://www.asrock.com

AUSTRALIA ONLY

Our goods come with guarantees that cannot be excluded under the Australian
Consumer Law. You are entitled to a replacement or refund for a major failure and
compensation for any other reasonably foreseeable loss or damage caused by our
goods. You are also entitled to have the goods repaired or replaced if the goods fail
to be of acceptable quality and the failure does not amount to a major failure. If
you require assistance please call ASRock Tel : [phone] ext.123 (Standard
International call charges apply)

e terms HDMI™ and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.

Contents

Chapter 1 Introduction 1

1.1 Package Contents 1

1.2 Specications 2

1.3 Motherboard Layout 6

1.4 I/O Panel 8

Chapter 2 Installation 10

2.1 Installing the CPU 11

2.2 Installing the CPU Fan and Heatsink 14

2.3 Installing Memory Modules (DIMM) 15

2.4 Expansion Slots (PCI Express Slots) 17

2.5 Jumpers Setup 18

2.6 Onboard Headers and Connectors 19

Chapter 3 Software and Utilities Operation 27

3.1 Installing Drivers 27

3.2 A-Tuning 28

3.3 ASRock Live Update & APP Shop 31

3.3.1 UI Overview 31

3.3.2 Apps 32

3.3.3 BIOS & Drivers 35

3.3.4 Setting 36

Chapter 4 UEFI SETUP UTILITY 37

4.1 Introduction 37

4.2 EZ Mode 38

4.3 Advanced Mode 39

4.3.1 UEFI Menu Bar 39

4.3.2 Navigation Keys 40

4.4 Main Screen 41

4.5 OC Tweaker Screen 42

4.6 Advanced Screen 51

4.6.1 CPU Conguration 52

4.6.2 Chipset Conguration 54

4.6.3 Storage Conguration 56

4.6.4 Super IO Conguration 57

4.6.5 ACPI Conguration 58

4.6.6 USB Conguration 60

4.6.7 Trusted Computing 61

4.7 Tools 62

4.8 Hardware Health Event Monitoring Screen 64

4.9 Security Screen 66

4.10 Boot Screen 67

4.11 Exit Screen 70

B360M-HDV

Chapter 1 Introduction

ank you for purchasing ASRock B360M-HDV motherboard, a reliable

motherboard produced under ASRock’s consistently stringent quality control.

It delivers excellent performance with robust design conforming to ASRock’s

commitment to quality and endurance.

In this documentation, Chapter 1 and 2 contains the introduction of the

motherboard and step-by-step installation guides. Chapter 3 contains the operation

guide of the soware and utilities. Chapter 4 contains the conguration guide of

the BIOS setup.

Becau se the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any modi­cations of this documentation occur, the updated version will be available on ASRock’s
website w ithout further notice. If you require technical support related to this mother­board, please visit our website for specic information about the model you are using. You
may nd the l atest VGA cards and CPU suppor t list on ASRock’s website a s well. ASRock
website http://www.asrock.com.

1.1 Package Contents

• ASRock B360M-HDV Motherboard (Micro ATX Form Factor)

• ASRock B360M-HDV Quick Installation Guide

• ASRock B360M-HDV Support CD

• 1 x I/O Panel Shield

• 2 x Serial ATA (SATA) Data Cables (Optional)

• 1 x Screw for M.2 Socket (O pt iona l)

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1

1.2 Specications

English

Platform

CPU

Chipset

Memory

Expansion
Slot

Graphics

• Micro ATX Form Factor

• Solid Capacitor design

• Supports 8th Generation Intel® CoreTM Processors (Socket

1151)

• 5 Power Phase design

• Supports Intel® Turbo Boost 2.0 Technology

• Intel® B360

• Dual Channel DDR4 Memory Technology

• 2 x DDR4 DIMM Slots

• Supports DDR4 2666/2400/2133 non-ECC, un-buered

memory

• Max. capacity of system memory: 32GB

• Supports Intel® Extreme Memory Prole (XMP) 2.0

• 15μ Gold Contact in DIMM Slots

• 1 x PCI Express 3.0 x16 Slot (PCIE1: x16 mode)*

* Supports NVMe SSD as boot disks

• 2 x PCI Express 3.0 x1 Slots (Flexible PCIe)

• Intel® UHD Graphics Built-in Visuals and the VGA outputs

can be supported only with processors which are GPU

integrated.

• Supports Intel® UHD Graphics Built-in Visuals : Intel®

Quick Sync Video with AVC, MVC (S3D) and MPEG-2 Full

HW Encode1, Intel® InTruTM 3D, Intel® Clear Video HD

Technology, Intel® InsiderTM, Intel® UHD Graphics

• DirectX 12

• HWAEncode/Decode: AVC/H.264, HEVC/H.265 8-bit,

HEVC/H.265 10-bit, VP8, VP9 8-bit, VP9 10-bit (Decode

only), MPEG2, MJPEG, VC-1 (Decode only)

2

B360M-HDV

• ree graphics output options: D-Sub, DVI-D and HDMI

• Supports HDMI with max. resolution up to 4K x 2K

(4096x2160) @ 30Hz

• Supports DVI-D with max. resolution up to 1920x1200 @

60Hz

• Supports D-Sub with max. resolution up to 1920x1200 @

60Hz

• Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and

HBR (High Bit Rate Audio) with HDMI Port (Compliant

HDMI monitor is required)

• Supports HDCP with DVI-D and HDMI Ports

• Supports 4K Ultra HD (UHD) playback with HDMI Port

Audio

LAN

Rear Panel
I/O

• 7.1 CH HD Audio (Rea ltek ALC887 Audio Codec)

* To congure 7.1 CH HD Audio, it is required to use an HD

front panel audio module and enable the multi-channel audio

feature through the audio driver.

• Supports Surge Protection

• ELNA Audio Caps

• Gigabit LAN 10/100/1000 Mb/s

• Giga PHY Intel® I219V

• Supports Wake-On-LAN

• Supports Lightning/ESD Protection

• Supports Energy Ecient Ethernet 802.3az

• Supports PXE

• 1 x PS/2 Mouse/Keyboard Port

• 1 x D-Sub Port

• 1 x DVI-D Port

• 1 x HDMI Port

• 2 x USB 2.0 Ports (Supports ESD Protection)

• 4 x USB 3.1 Gen2 Type-A Ports (10 Gb/s)

• 1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED

LED)

• HD Audio Jacks: Line in / Front Speaker / Microphone

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3

Storage

• 6 x SATA3 6.0 Gb/s Connectors, support NCQ, AHCI and

Hot Plug*

* If M2_1 is occupied by a SATA-type M.2 device, SATA3_3 will

be disabled.

• 1 x Ultra M.2 Socket (M2_1), supports M Key type

2230/2242/2260/2280 M.2 SATA3 6.0 Gb/s module and M.2

PCI Express module up to Gen3 x4 (32 Gb/s)**

** Supports Intel® OptaneTM Tech nolo gy

** Supports NVMe SSD as boot disks

** Supports ASRock U.2 Kit

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Connector

BIOS
Feature

• 1 x Print Port Header

• 1 x COM Port Header

• 1 x TPM Header

• 1 x Chassis Intrusion and Speaker Header

• 1 x CPU Fan Connector (4-pin)

* e CPU Fan Connector supports the CPU fan of ma ximum

1A (12W) fan power.

• 2 x Chassis/Water Pump Fan Connectors (4-pin) (Smart Fan

Speed Control)

* e Chassis/Water Pump Fan supports the water cooler fan of

maximum 2A (24W) fan power.

* CHA_FAN1/WP and CHA_FAN2/WP can auto detect if 3-pin

or 4-pin fan is in use.

• 1 x 24 pin ATX Power Connector

• 1 x 8 pin 12V Power Connector

• 1 x Front Panel Audio Connector

• 2 x USB 2.0 Headers (Support 4 USB 2.0 ports) (Supports

ESD Protection)

• 1 x USB 3.1 Gen1 Header (Supports 2 USB 3.1 Gen1 ports)

(Supports ESD Protection)

• AMI UEFI Legal BIOS with multilingual GUI support

• ACPI 6.0 Compliant wake up events

• SMBIOS 2.7 Support

• CPU, GT_CPU, DRAM, PCH 1.05V Voltage Multi-adjust-

ment

Hardware
Monitor

• Temperature Sensing: CPU, Chassis/Water Pump Fans

• Fan Tachometer: CPU, Chassis/Water Pump Fans

4

B360M-HDV

• Quiet Fan (Auto adjust chassis fan speed by CPU

temperature): CPU, Chassis/Water Pump Fans

• Fan Multi-Speed Control: CPU, Chassis/Water Pump Fans

• CASE OPEN detection

• Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore, DRAM,

PCH 1.05V

OS

Certica­tions

* For detailed product information, please visit our website: http://www.asrock .com

Please realiz e that the re is a certain r isk involved with o verclocking, including adjusting
the setting in the BIOS, applying Untied Overclocking Technolog y, or using third-party
overclocking to ols. O verclocking may aect your system’s stability, or even c ause damage to
the components and devices of your system. It should be don e at your ow n risk and expense.
We are not responsibl e for possible damage caused by overclo cking.

• Microso® Windows® 10 64-bit

• FCC, CE

• ErP/EuP ready (ErP/EuP ready power supply is required)

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Intel

B360

DDR 4_B1 (6 4 bit, 28 8-pin m odule )

DDR 4_A1 (6 4 bit, 28 8-pin m odule )

ATXPWR1

PCIE2

Top:
RJ-45

HDLED RESET

PLED PWRBTN

PANEL1

1

1

SPK_CI1

COM1

1

B360M-HDV

12

9

7

10

8

15

18

16

20

USB 3.1 Gen2
T: USB5
B: USB6

1

3

2

CMOS

Battery

5

CPU_FAN1

13

1

TPMS1

Top:

LINE I N

Cent er:

FRON T

Bott om:

MIC IN

CHA_FAN2/WP

PCIE3

DVI1

VGA1

USB_13_14

1

SATA3_5

SATA3_4

SATA3_0

SATA3_1

SATA3_2

SATA3_3

HDMI1

1

LPT1

BIOS
ROM

21

19

RoHS

ATX12V1

6

PCIE1

4

CHA_FAN1/WP

14

1

HD_AUDIO1

22

USB 3.1 Gen2
T: USB3
B: USB4

LAN

AUDIO
CODEC

USB 2. 0

T: USB1

B: USB 2

PS2

Keyb oard

/Mou se

M2_ 1

CT2CT3CT4CT1

CLRMOS1

1

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17

USB_7_8

1

1

USB_11_ 12

Ultra M.2

PCIe Gen3x4

1.3 Motherboard Layout

English

6

No. Description

1 ATX 12V Power Connector (ATX12V1)

2 CPU Fan Connector (CPU_FAN1)

3 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)

4 Chassis/Water Pump Fan Connector (CHA_FAN1/WP)

5 ATX Power Connector (ATXPWR1)

6 USB 3.1 Gen1 Header (USB_11_12)

7 SATA3 Connector (SATA3_5)

8 SATA3 Conne ctor (SATA3_4)

9 SATA3 Connector (SATA3_2)

10 SATA3 Connector (SATA3_3)

11 Clear CMOS Jumper (CLRMOS1)

12 SATA3 Connector (SATA3_0)

13 SATA3 Connector (SATA3_1)

14 Chassis/Water Pump Fan Connector (CHA_FAN2/WP)

15 System Panel Header (PANEL1)

16 Chassis Intrusion and Speaker Header (SPK_CI1)

17 USB 2.0 Header (USB_7_8)

18 USB 2.0 Header (USB_13_14)

19 COM Port Header (COM1)

20 Print Port Header (LPT1)

21 TPM Header (TPMS1)

22 Front Panel Audio Header (HD_AUDIO1)

B360M-HDV

English

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1.4 I/O Panel

1 2 3

4

5

11

10

8

79

No. Description No. Description

1 USB 2.0 Ports (USB12) 7 USB 3.1 Gen2 Ports (USB5_6)

2 D-Sub Port 8 USB 3.1 Gen2 Ports (USB_3_4)

3 LAN RJ-45 Port* 9 HDMI Port

4 Line In (Light Blue)** 10 DVI-D Port

5 Front Speaker (Lime)** 11 PS/2 Keyboard/Mouse Port

6 Microphone (Pink)**

* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications.

ACT/LINK LED

SPEED LED

LAN Por t

Activity / Link LED Speed LED

Status Description Status Description

O No Link O 10Mbps connection
Blinking Data Activity Orange 100Mbps connection
On Link Green 1Gbps connection

6

English

8

B360M-HDV

** To congure 7.1 CH HD Audio, it i s required to use an HD front panel audio module and enable the multi­channel audio feature through the audio driver.

Please set Speaker Conguration to “7.1 Speaker”in the Realtek HD Audio Manager.

Function of the Audio Ports in 7.1-channel Conguration:

Port Function

Light Blue (Rear panel) Rear Speaker Out
Lime (Rear panel) Front Speaker Out
Pink (Rear panel) Central /Subwoofer Speaker Out
Lime (Front panel) Side Speaker Out

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Chapter 2 Installation

is is a Micro ATX form factor motherboard. Before you install the motherboard,

study the conguration of your chassis to ensure that the motherboard ts into it.

Pre-installation Precautions

Take note of the following precautions before you install motherboard components

or change any motherboard settings.

• Make sure to unplug the power cord before installing or removing the motherboard

components. Failure to do so may cause physical injuries and damages to motherboard

components.

• In order to avoid damage from static electricity to the motherboard’s components,

NEVER place your motherboard directly on a carpet. Also remember to use a grounded

wrist strap or touch a safety grounded object before you handle the components.

• Hold components by the edges and do not touch the ICs.

• Whenever you uninstall any components, place them on a grounded anti-static pad or

in the bag that comes with the components.

• When placing screws to secure the motherboard to the chassis, please do not over-

tighten the screws! Doing so may damage the motherboard.

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2.1 Installing the CPU

1. Before you insert the 1151-Pin CPU into the socket, please check if the P nP cap is on the
socket, if the CPU surface is unclean, or if there are any bent pins in the sock et. Do not
force to in sert the CPU into the socket if above situation is found . Otherwise, the CPU
will be seriously damaged.

2. Unplug all power c ables before in stalling the CPU.

1

B360M-HDV

A

B

2

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3

4

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12

5

B360M-HDV

Please save and replace the cover if the processor i s removed. e cover must be placed if
you wish to return the motherboard for aer service.

13

English

2.2 Installing the CPU Fan and Heatsink

1 2

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14

FAN

CPU_

B360M-HDV

2.3 Installing Memory Modules (DIMM)

is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots,

and supports Dual Channel Memory Technology.

1. For dual channel cong uration , you always need to in stall identical (the same

brand, speed , size and chip-type) DDR4 DIMM pairs.

2. It is unable to activate Du al Channel Memory Technology with only one memory

module installed.

3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4

slot; otherwise, this motherboard and DIMM may be damaged.

e DIMM only ts in one correct orie ntation. It will cause permanent dam age to
the motherboard and the DIMM if you force the DIMM into the slot at incor rect
orientation.

15

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1

2

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16

3

B360M-HDV

2.4 Expansion Slots (PCI Express Slots)

ere are 3 PCI Express slots on the motherboard.

Before installing an ex pansion card, please make sure that the power supply is
switched o or the power cord is unplugged. Plea se read the documentation of the
expan sion card and mak e necessary h ardware settings for the card before you start
the installation.

PCIe slots:

PCIE1 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

PCIE2 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.

PCIE3 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

17

English

2.5 Jumpers Setup

e illustration shows how jumpers are setup. When the jumper cap is placed on

the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is

“O pen”.

English

Clear CMOS Jumper

(CLRCMO S1)

(see p.6, No. 11)

CLRCMOS1 allows you to clear the data in CMOS. e data in CMOS includes

system setup information such as system password, date, time, and system setup

parameters. To clear and reset the system parameters to default setup, please

turn o the computer and unplug the power cord, then use a jumper cap to short

the pins on CLRCMOS1 for 3 seconds. Please remember to remove the jumper

cap aer clearing the CMOS. If you need to clear the CMOS when you just nish

updating the BIOS, you must boot up the system rst, and then shut it down

before you do the clear-CMOS action.

If you clear the CMOS, the case open may be detec ted. Please a djust the BIOS option
“Clear Status” to clear the record of previou s chassis int rusion status.

2-pin Jumper

Short: Clear CMOS

Open: Default

18

2.6 Onboard Headers and Connectors

1

Onboard headers and connectors are NOT jump ers. Do NOT place jumper caps over
these headers and connectors. Placing jumper caps over the headers and connectors
will cause permanent damage to the motherboard.

B360M-HDV

System Panel Header

(9-pi n PANEL1)

(see p.6, No. 15)

PWRBTN (Power Button):

Connec t to the power button on the ch assi s front panel. You may congure the way to tur n
o your system using the power button.

RESET (Reset B utton):
Connec t to the reset button on the ch assi s front panel. P ress the reset button to re start the
computer if the computer f reezes and fails to per form a normal restar t.

PLED (Syste m Power LED):
Connec t to the power status indicator on the chas sis front panel. e LED i s on when the
system is operating. e LED keeps blinking when the system is in S1/S3 sleep state. e
LED is o when the system is in S4 slee p state or powered o (S5).

HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive ac tivity LED on the chassis front panel. e LED is on when the
hard drive is reading or wr iting data.

e front panel de sign may dier by chassis. A front panel module mainly consists of powe r
button, reset button , power LED, hard dr ive activity LED, speaker and etc. When connect­ing your ch assi s front panel module to thi s header, make sure the wire a ssignments and the
pin assignments are matched correctly.

PLED+

PLED-

HDLED-

HDLED+

PWRBTN#

GND

RESET#

GND

GND

Connect the power

button, reset button and

system status indicator on

the chassis to this header

according to the pin

assignments below. Note

the positive and negative

pins before connecting

the cables.

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