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Antec 902 User Manual

Intel
Core™ i7-800 and i5-700 Desktop Processor Series and LGA1156 Socket
Thermal/Mechanical Specifications and Design Guidelines
September 2009
®
Document Number:322167-002
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel Core™ i7-800 and i5-700 desktop processor series and Intel defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.
®
5 Series Chipset and LGA1156 socket may contain design
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel, Core and the Intel logo are trademarks of Intel Corporation in the U.S and other countries.
* Other brands and names may be claimed as the property of others.
Copyright © 2009 Intel Corporation.
Contents
1Introduction..............................................................................................................9
1.1 References .........................................................................................................9
1.2 Definition of Terms ............................................................................................ 10
2 Package Mechanical and Storage Specifications....................................................... 11
2.1 Package Mechanical Specifications ....................................................................... 11
2.1.1 Package Mechanical Drawing.................................................................... 12
2.1.2 Processor Component Keep-Out Zones...................................................... 12
2.1.3 Package Loading Specifications ................................................................ 13
2.1.4 Package Handling Guidelines.................................................................... 13
2.1.5 Package Insertion Specifications............................................................... 13
2.1.6 Processor Mass Specification.................................................................... 13
2.1.7 Processor Materials................................................................................. 14
2.1.8 Processor Markings................................................................................. 14
2.1.9 Processor Land Coordinates ..................................................................... 15
2.2 Processor Storage Specifications ......................................................................... 16
3 LGA1156 Socket ...................................................................................................... 17
3.1 Board Layout .................................................................................................... 19
3.2 Attachment to Motherboard ................................................................................ 20
3.3 Socket Components........................................................................................... 20
3.3.1 Socket Body Housing .............................................................................. 20
3.3.2 Solder Balls ........................................................................................... 21
3.3.3 Contacts ............................................................................................... 21
3.3.4 Pick and Place Cover............................................................................... 21
3.4 Package Installation / Removal ........................................................................... 22
3.4.1 Socket Standoffs and Package Seating Plane.............................................. 23
3.5 Durability ......................................................................................................... 23
3.6 Markings .......................................................................................................... 24
3.7 Component Insertion Forces ............................................................................... 24
3.8 Socket Size ...................................................................................................... 24
4 Independent Loading Mechanism (ILM)................................................................... 25
4.1 Design Concept................................................................................................. 25
4.1.1 ILM Cover Assembly Design Overview ....................................................... 25
4.1.2 ILM Back Plate Design Overview............................................................... 26
4.1.3 Shoulder Screw and Fasteners Design Overview ......................................... 27
4.2 Assembly of ILM to a Motherboard....................................................................... 28
4.3 ILM Interchangeability ....................................................................................... 29
4.4 Markings .......................................................................................................... 29
5 LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications .31
5.1 Component Mass............................................................................................... 31
5.2 Package/Socket Stackup Height .......................................................................... 31
5.3 Socket Maximum Temperature............................................................................ 32
5.4 Loading Specifications........................................................................................ 32
5.5 Electrical Requirements...................................................................................... 33
5.6 Environmental Requirements .............................................................................. 34
6 Thermal Specifications ............................................................................................ 35
6.1 Thermal Specifications ....................................................................................... 35
6.1.1 Intel
6.1.2 Processor Specification for Operation Where Digital
®
Core™ i7-800 and i5-700 Desktop Processor Series Thermal Profile ..... 37
Thermal Sensor Exceeds T
CONTROL
............................................................ 39
Thermal/Mechanical Specifications and Design Guidelines 3
6.1.3 Thermal Metrology..................................................................................40
6.2 Processor Thermal Features ................................................................................40
6.2.1 Processor Temperature............................................................................40
6.2.2 Adaptive Thermal Monitor ........................................................................41
6.2.3 THERMTRIP# Signal................................................................................44
6.3 Platform Environment Control Interface (PECI) ......................................................44
6.3.1 Introduction...........................................................................................44
6.3.2 PECI Client Capabilities............................................................................45
6.3.3 Temperature Data ..................................................................................45
7 Sensor Based Thermal Specification Design Guidance ..............................................47
7.1 Sensor Based Specification Overview....................................................................47
7.2 Sensor Based Thermal Specification .....................................................................49
7.2.1 TTV Thermal Profile.................................................................................49
7.2.2 Specification When DTS value is Greater than T
CONTROL
...............................50
7.3 Thermal Solution Design Process .........................................................................51
7.3.1 Boundary Condition Definition ..................................................................51
7.3.2 Thermal Design and Modelling ..................................................................52
7.3.3 Thermal Solution Validation......................................................................52
7.4 Fan Speed Control (FSC) design process...............................................................54
7.4.1 Fan Speed Control Algorithm without T
7.4.2 Fan Speed Control Algorithm with T
AMBIENT
AMBIENT
Data ....................................54
Data.........................................55
7.5 System Validation..............................................................................................57
7.6 Thermal Solution Characterization........................................................................58
8 ATX Reference Thermal Solution ..............................................................................59
8.1 Heatsink Thermal Solution ..................................................................................59
8.2 Geometric Envelope for the Intel Reference ATX Thermal Mechanical Design..............60
8.3 Heatsink Mass and Center of Gravity ....................................................................60
8.4 Thermal Interface Material ..................................................................................60
9 Thermal Solution Quality and Reliability Requirements ............................................61
9.1 Reference Heatsink Thermal Verification ...............................................................61
9.2 Mechanical Environmental Testing........................................................................61
9.2.1 Recommended Test Sequence ..................................................................62
9.2.2 Post-Test Pass Criteria.............................................................................62
9.2.3 Recommended BIOS/Processor/Memory Test Procedures .............................62
9.3 Material and Recycling Requirements....................................................................63
10 Boxed Processor Specifications................................................................................65
10.1 Introduction......................................................................................................65
10.2 Mechanical Specifications....................................................................................66
10.2.1 Boxed Processor Cooling Solution Dimensions.............................................66
10.2.2 Boxed Processor Fan Heatsink Weight .......................................................68
10.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....68
10.3 Electrical Requirements ......................................................................................68
10.3.1 Fan Heatsink Power Supply ......................................................................68
10.4 Thermal Specifications........................................................................................69
10.4.1 Boxed Processor Cooling Requirements......................................................69
10.4.2 Variable Speed Fan .................................................................................71
A Component Suppliers...............................................................................................73
B Mechanical Drawings ...............................................................................................75
C Socket Mechanical Drawings ....................................................................................89
D Package Mechanical Drawings .................................................................................95
E Heat Sink Back Plate Drawings ................................................................................99
Figures
2-1 Processor Package Assembly Sketch ........................................................................ 11
2-2 Package View ....................................................................................................... 12
2-3 Processor Top-Side Markings .................................................................................. 14
2-4 Processor Package Lands Coordinates ...................................................................... 15
3-1 LGA1156 Socket with Pick and Place Cover ............................................................... 17
3-2 LGA1156 Socket Contact Numbering (Top View of Socket).......................................... 18
3-3 LGA1156 Socket Land Pattern (Top View of Board) .................................................... 19
3-4 Attachment to Motherboard .................................................................................... 20
3-5 Pick and Place Cover.............................................................................................. 22
3-6 Package Installation / Removal Features................................................................... 23
4-1 ILM Cover Assembly .............................................................................................. 26
4-2 Back Plate ............................................................................................................ 26
4-3 Shoulder Screw..................................................................................................... 27
4-4 ILM Assembly ....................................................................................................... 28
4-5 Pin 1 and ILM Lever............................................................................................... 29
5-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology .............................. 34
6-1 Thermal Test Vehicle Thermal Profile for Intel
Processor Series.................................................................................................... 37
6-2 TTV Case Temperature (TCASE) Measurement Location .............................................. 40
6-3 Frequency and Voltage Ordering.............................................................................. 42
6-4 Temperature Sensor Data Format............................................................................ 45
7-1 Comparison of Case Temperature versus Sensor Based Specification............................ 48
7-2 Intel® Core™ i7-800 and i5-700 Desktop Processor Series Thermal Profile .................... 49
7-3 Thermal solution Performance................................................................................. 50
7-4 Required YCA for Various T
AMBIENT
Conditions ........................................................... 52
7-5 Thermal Solution Performance versus Fan Speed ....................................................... 53
7-6 Fan Response Without T 7-7 Fan Response with T
AMBIENT
AMBIENT
Data ....................................................................... 55
Aware FSC.................................................................... 56
8-1 ATX Heatsink Reference Design Assembly................................................................. 59
8-2 ATX KOZ 3-D Model Primary (Top) Side.................................................................... 60
10-1 Boxed Processor Fan Heatsink................................................................................. 65
10-2 Space Requirements for the Boxed Processor (side view)............................................ 66
10-3 Space Requirements for the Boxed Processor (top view)............................................. 67
10-4 Space Requirements for the Boxed Processor (overall view) ........................................ 67
10-5 Boxed Processor Fan Heatsink Power Cable Connector Description ............................... 68
10-6 Baseboard Power Header Placement Relative to Processor Socket ................................ 69
10-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view) .................... 70
10-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view) ................... 70
10-9 Boxed Processor Fan Heatsink Set Points.................................................................. 71
B-1 Socket / Heatsink / ILM Keepout Zone Primary Side (Top) .......................................... 76
B-2 Socket / Heatsink / ILM Keepout Zone Secondary Side (Bottom) ................................. 77
B-3 Socket / Processor / ILM Keepout Zone Primary Side (Top)......................................... 78
B-4 Socket / Processor / ILM Keepout Zone Secondary Side (Bottom) ................................ 79
B-5 Reference Design Heatsink Assembly ....................................................................... 80
B-6 Reference Fastener (Sheet 1 of 4) ........................................................................... 81
B-7 Reference Fastener (Sheet 2 of 4) ........................................................................... 82
B-8 Reference Fastener (Sheet 3 of 4) ........................................................................... 83
B-9 Reference Fastener (Sheet 4 of 4) ........................................................................... 84
B-10 Reference Clip (Sheet 1 of 2) .................................................................................. 85
B-11 Reference Clip (Sheet 2 of 2) .................................................................................. 86
B-12 Thermocouple Attach Drawing................................................................................. 87
C-1 Socket Mechanical Drawing (Sheet 1 of 4) ................................................................ 90
®
Core™ i7-800 and i5-700 Desktop
Thermal/Mechanical Specifications and Design Guidelines 5
C-2 Socket Mechanical Drawing (Sheet 2 of 4).................................................................91
C-3 Socket Mechanical Drawing (Sheet 3 of 4).................................................................92
C-4 Socket Mechanical Drawing (Sheet 4 of 4).................................................................93
D-1 Processor Package Drawing (Sheet 1 of 2) ................................................................96
D-2 Processor Package Drawing (Sheet 2 of 2) ................................................................97
E-1 Heat Sink Back Plate Keep In Zone ........................................................................100
E-2 Heat Sink Back Plate ............................................................................................101
Tables
1-1 Reference Documents ..............................................................................................9
1-2 Terms and Descriptions.......................................................................................... 10
2-1 Processor Loading Specifications ............................................................................. 13
2-2 Package Handling Guidelines................................................................................... 13
2-3 Processor Materials................................................................................................ 14
2-4 Storage Conditions ................................................................................................ 16
5-1 Socket Component Mass ........................................................................................ 31
5-2 1156-land Package and LGA1156 Socket Stackup Height ............................................ 31
5-3 Socket & ILM Mechanical Specifications .................................................................... 32
5-4 Electrical Requirements for LGA1156 Socket ............................................................. 33
6-1 Processor Thermal Specifications............................................................................. 36
6-2 Thermal Test Vehicle Thermal Profile for Intel
Processor Series.................................................................................................... 38
6-3 Thermal Solution Performance above TCONTROL for the Intel
i5-700 Desktop Processor Series ............................................................................. 39
6-4 Supported PECI Command Functions and Codes ........................................................ 45
6-5 Error Codes and Descriptions .................................................................................. 46
7-1 Thermal Solution Performance above T
8-1 Reference Thermal Solutions................................................................................... 59
9-1 Use Conditions (Board Level) .................................................................................. 61
10-1 Fan Heatsink Power and Signal Specifications............................................................ 69
10-2 Fan Heatsink Set Points.......................................................................................... 71
A-1 Reference Heatsink Enabled Components ................................................................. 73
A-2 LGA1156 Socket and ILM Components ..................................................................... 73
A-3 Supplier Contact Information .................................................................................. 74
B-1 Mechanical Drawing List ......................................................................................... 75
C-1 Mechanical Drawing List ......................................................................................... 89
D-1 Mechanical Drawing List ......................................................................................... 95
E-1 Mechanical Drawing List ......................................................................................... 99
E-2 Supplier Contact Information .................................................................................. 99
CONTROL
®
Core™ i7-800 and i5-700 Desktop
®
Core™ i7-800 and
.......................................................... 58
Thermal/Mechanical Specifications and Design Guidelines 7

Revision History

Revision
Number
-001 • Initial release
-002
• Updated Tables A-2 and A-3.
• Updated Chapters 3, 4, 8, and Appendix B
Description Revision Date
September 2009
September 2009
§
Introduction

1 Introduction

This document differs from previous Thermal and Mechanical Design Guidelines. In this document, mechanical and thermal specifications for the processor and the associated socket are now included. The usual design guidance has been retained.
The components described in this document include:
• The thermal and mechanical specifications for the
— Intel Core™ i7-800 and i5-700 desktop processor series
• The LGA1156 socket and the Independent Loading Mechanism (ILM) and back plate.
• The reference design thermal solution (heatsink) for the processors and associated retention hardware.
Note: When the information is applicable to all products, the this document will use
“processor” or “processors” to simplify the document.

1.1 References

Material and concepts available in the following documents may be beneficial when reading this document.
Table 1-1. Reference Documents
®
Intel
Core™ i7-800 and i5-700 Desktop Processor Series Datasheet, Volume 1
®
Intel
Core™ i7-800 and i5-700 Desktop Processor Series Datasheet, Volume 2
®
Intel
Core™ i7-800 and i5-700 Desktop Processor Series Specification Update
®
Intel
5 Series Chipset and Intel® 3400 Chipset Datasheet
®
Intel
5 Series Chipset and Intel® 3400 Chipset Specification Update
®
5 Series Chipset and Intel® 3400 Chipset – Thermal Mechanical
Intel Specifications and Design Guidelines
4-Wire Pulse Width Modulation (PWM) Controlled Fans
Document Location
http://download.intel.com/ design/processor/datashts/
322164.pdf
http://download.intel.com/ design/processor/datashts/
322165.pdf
http://download.intel.com/
design/processor/
specupdt/322166.pdf
www.intel.com/Assets/
PDF/datasheet/322169.pdf
www.intel.com/Assets/
PDF/specupdate/
322170.pdf
www.intel.com/Assets/
PDF/designguide/
322171.pdf
http://
www.formfactors.org/
Thermal/Mechanical Specifications and Design Guidelines 9

1.2 Definition of Terms

Table 1-2. Terms and Descriptions
Term Description
Bypass
CTE
DTS
FSC Fan Speed Control
IHS
ILM
PCH
LGA1156 socket
PECI
Ψ
CA
Ψ
CS
Ψ
SA
T
CASE or TC
T
CASE_MAX
TCC
T
CONTROL
TDP
Thermal Monitor
Thermal Profile Line that defines case temperature specification of the TTV at a given power level.
TIM
TTV
T
LA
T
SA
Bypass is the area between a passive heatsink and any object that can act to form a duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface.
Coefficient of Thermal Expansion. The relative rate a material expands during a thermal event.
Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature.
Integrated Heat Spreader: a component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface.
Independent Loading Mechanism provides the force needed to seat the 1156-LGA land package onto the socket contacts.
Platform Controller Hub. The PCH is connected to the processor via the Direct Media Interface (DMI) and Intel
The processor mates with the system board through this surface mount, 1156-land socket.
The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices.
Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance using total package power. Defined as (T Package Power. The heat source should always be specified for Ψ measurements.
Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. Defined as (T Power.
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (T
The case temperature of the processor, measured at the geometric center of the topside of the TTV IHS.
The maximum case temperature as specified in a component specification.
Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits.
T trigger point for fan speed control. When DTS > T with the TTV thermal profile.
Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP is not the maximum power that the processor can dissipate.
is a static value that is below the TCC activation temperature and used as a
CONTROL
A power reduction feature designed to decrease temperature after the processor has reached its maximum operating temperature.
Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink.
Thermal Test Vehicle. A mechanically equivalent package that contains a resistive heater in the die to evaluate thermal solutions.
The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink.
The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets.
®
Flexible Display Interface (Intel® FDI).
– TLA) / Total Package Power.
S
, the processor must comply
CONTROL
Introduction
– TLA) / Total
CASE
– TS) / Total Package
CASE
§

Package Mechanical and Storage Specifications

2 Package Mechanical and
Storage Specifications

2.1 Package Mechanical Specifications

The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with the motherboard via the LGA1156 socket. The package consists of a processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor thermal solutions, such as a heatsink. Figure 2-1 shows a sketch of the processor package components and how they are assembled together. Refer to Chapter 3 and Chapter 4 for complete details on the LGA1156 socket.
The package components shown in Figure 2-1 include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Figure 2-1. Processor Package Assembly Sketch
IHS
Substrate
System Board
Note:
1. Socket and motherboard are included for reference and are not part of processor package.
2. For clarity the ILM is not shown.
Core (die)
TIM
Capacitors
LGA1156 Socket
Thermal/Mechanical Specifications and Design Guidelines 11

2.1.1 Package Mechanical Drawing

Figure 2-2 shows the basic package layout and dimensions. The detailed package
mechanical drawings are in Appendix D. The drawings include dimensions necessary to design a thermal solution for the processor. These dimensions include:
1. Package reference dimensions with tolerances (total height, length, width, and so forth.)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm
Figure 2-2. Package View
Package Mechanical and Storage Specifications
37.5

2.1.2 Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component keep­out zone requirements. A thermal and mechanical solution design must not intrude into the required keep-out zones. Decoupling capacitors are typically mounted to either the topside or land-side of the package substrate. See Figure B-3 and Figure B-4 for keep­out zones. The location and quantity of package capacitors may change due to manufacturing efficiencies but will remain within the component keep-in. This keep-in zone includes solder paste and is a post reflow maximum height for the components.
37.5
Package Mechanical and Storage Specifications

2.1.3 Package Loading Specifications

Ta b le 2 - 1 provides dynamic and static load specifications for the processor package.
These mechanical maximum load limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Also, any mechanical system or component testing should not exceed the maximum limits. The processor package substrate should not be used as a mechanical reference or load-bearing surface for
.
Table 2-1. Processor Loading Specifications
thermal and mechanical solution.
Parameter Minimum Maximum Notes
Static Compressive Load — 600 N [135 lbf] 1, 2, 3
Dynamic Compressive
Load
Notes:
1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
2. This is the maximum static force that can be applied by the heatsink and retention solution to maintain the heatsink and processor interface.
3. These specifications are based on limited testing for design characterization. Loading limits are for the package only and do not include the limits of the processor socket.
4. Dynamic loading is defined as an 50g shock load, 2X Dynamic Acceleration Factor with a 500g maximum thermal solution.
— 712 N [160 lbf] 1, 3, 4

2.1.4 Package Handling Guidelines

Ta b le 2 - 2 includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal.
Table 2-2. Package Handling Guidelines
Parameter Maximum Recommended Notes
Shear 311 N [70 lbf] 1, 4
Tensile 111 N [25 lbf] 2, 4
Torque 3.95 N-m [35 lbf-in] 3, 4
Notes:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top surface.
4. These guidelines are based on limited testing for design characterization.

2.1.5 Package Insertion Specifications

The processor can be inserted into and removed from an LGA1156 socket 15 times. The socket should meet the LGA1156 socket requirements detailed in Chapter 5.

2.1.6 Processor Mass Specification

The typical mass of the processor is 21.5g (0.76 oz). This mass [weight] includes all the components that are included in the package.
Thermal/Mechanical Specifications and Design Guidelines 13

2.1.7 Processor Materials

Package Mechanical and Storage Specifications
Tab l e 2- 3 lists some of the package components and associated materials.
Table 2-3. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel Plated Copper
Substrate Fiber Reinforced Resin
Substrate Lands Gold Plated Copper

2.1.8 Processor Markings

Figure 2-3 shows the topside markings on the processor. This diagram is to aid in the
identification of the processor.
Figure 2-3. Processor Top-Side Markings
GRP1LINE1
GRP1LINE1 GRP1LINE2
GRP1LINE2 GRP1LINE3
GRP1LINE3 GRP1LINE4
GRP1LINE4 GRP1LINE5
GRP1LINE5
LOT NO S/N
Legend:
GRP1LINE1 GRP1LINE2 GRP1LINE3 GRP1LINE4 GRP1LINE5
Legend:
GRP1LINE1 GRP1LINE2 GRP1LINE3 GRP1LINE4 GRP1LINE5
Mark Text (Production Mark):
INTEL{M}{C}'08 PROC# BRAND SLxxx C00 SPEED/CACHE/F MB
e4
FPO
Mark Text (Engineering Mark):
INTEL{M}{C}'08 INTEL CONFIDENTIAL Qxxx ES C00 PRODUCT CODE
e4
FPO
Package Mechanical and Storage Specifications

2.1.9 Processor Land Coordinates

.
Figure 2-4. Processor Package Lands Coordinates
Figure 2-4 shows the bottom view of the processor package.
AY
AW
AV
AU
AT
AR
AP
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
P
R
T
N
M
K
K
J
H
G
F
E
D
C
B
A
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32
Thermal/Mechanical Specifications and Design Guidelines 15
33 35 37 39
34 36 38 40
Package Mechanical and Storage Specifications

2.2 Processor Storage Specifications

Tab l e 2- 4 includes a list of the specifications for device storage in terms of maximum
and minimum temperatures and relative humidity. These conditions should not be
.
Table 2-4. Storage Conditions
exceeded in storage or transportation.
Parameter Description Min Max Notes
The non-operating device storage
T
ABSOLUTE STORAGE
T
SUSTAINED STORAGE
RH
SUSTAINED STORAGE
TIME
SUSTAINED STORAGE
Notes:
1. Refers to a component device that is not assembled in a board or socket that is not to be electrically connected to a voltage reference or I/O signals.
2. Specified temperatures are based on data collected. Exceptions for surface mount reflow are specified in applicable JEDEC standard and MAS document. Non-adherence may affect processor reliability.
3. T
ABSOLUTE STORAGE
moisture barrier bags or desiccant.
4. Intel
5. The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all moisture
6. Nominal temperature and humidity conditions and durations are given and tested within the constraints
®
branded board products are certified to meet the following temperature and humidity limits that are given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C, Humidity: 50% to 90%, non-condensing with a maximum wet bulb of 28 °C). Post board attach storage temperature limits are not specified for non-Intel branded boards.
sensitive devices removed from the moisture barrier bag.
imposed by T
SUSTAINED
temperature. Damage (latent or otherwise) may occur when subjected to for any length of time.
The ambient storage temperature limit (in shipping media) for a sustained period of time.
The maximum device storage relative humidity for a sustained period of time.
A prolonged or extended period of time; typically associated with customer shelf life. 0 Months6 Months
applies to the unassembled component only and does not apply to the shipping media,
and customer shelf life in applicable Intel box and bags.
-55 °C 125 °C 1, 2, 3
-5 °C 40 °C 4, 5
60% @ 24 °C 5, 6
6
§
LGA1156 Socket

3 LGA1156 Socket

This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the processors. The socket provides I/O, power, and ground contacts. The socket contains 1156 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard.
The contacts are arranged in two opposing L-shaped patterns within the grid array. The grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the array and selective depopulation elsewhere.
The socket must be compatible with the package (processor) and the Independent Loading Mechanism (ILM). The ILM design includes a back plate that is integral to having a uniform load on the socket solder joints. Socket loading specifications are listed in Chapter 5.
Figure 3-1. LGA1156 Socket with Pick and Place Cover
Thermal/Mechanical Specifications and Design Guidelines 17
Figure 3-2. LGA1156 Socket Contact Numbering (Top View of Socket)
30
30
30
30
29
29
29
29
28
28
28
28
27
27
27
27
26
26
26
26
25
25
25
25
24
24
24
24
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23
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22
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21
21
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LGA1156 Socket
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A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AWA C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF
B D F H K M P T V Y AB AD AF
B D F H K M P T V Y AB AD AF
B D F H K M P T V Y AB AD AF
AM AP AT AV AY
AM AP AT AV AY
AM AP AT AV AY
AM AP AT AV AY
AH AK
AH AK
AH AK
AH AK
LGA1156 Socket

3.1 Board Layout

The land pattern for the LGA1156 socket is 36 mils X 36 mils (X by Y) within each of the two L-shaped sections. Note that there is no round-off (conversion) error between socket pitch (0.9144 mm) and board pitch (36 mil) as these values are equivalent. The two L-sections are offset by 0.9144 mm (36 mil) in the x direction and 3.114 mm (122.6 mil) in the y direction (see Figure 3-3). This was to achieve a common package land to PCB land offset that ensures a single PCB layout for socket designs from the multiple vendors.
Figure 3-3. LGA1156 Socket Land Pattern (Top View of Board)
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
36mil (0.9144 mm)
36mil (0.9144 mm)
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1
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
122.6 mil (3.1144mm)
122.6 mil (3.1144mm)
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Thermal/Mechanical Specifications and Design Guidelines 19

3.2 Attachment to Motherboard

The socket is attached to the motherboard by 1156 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, etc.) to attach the socket.
As indicated in Figure 3-1, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process.
Figure 3-4. Attachment to Motherboard
Load plate
Load plate
Frame
Frame
Shoulder
Shoulder Screw
Screw
LGA1156 Socket
Load Lever
Load Lever
Back Plate
Back Plate

3.3 Socket Components

The socket has two main components, the socket body and Pick and Place (PnP) cover, and is delivered as a single integral assembly. Refer to Appendix C for detailed drawings.

3.3.1 Socket Body Housing

The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable of withstanding 260 °C for 40 seconds, which is compatible with typical reflow/rework profiles. The socket coefficient of thermal expansion (in the XY plane), and creep properties, must be such that the integrity of the socket is maintained for the conditions listed in Chapter 5.
The color of the housing will be dark as compared to the solder balls to provide the contrast needed for pick and place vision systems.
LGA1156 Socket

3.3.2 Solder Balls

A total of 1156 solder balls corresponding to the contacts are on the bottom of the socket for surface mounting with the motherboard. The socket solder ball has the following characteristics:
• Lead free SAC (SnAgCu) 305 solder alloy with a silver (Ag) content between 3% and 4% and a melting temperature of approximately 217 °C. The alloy must be compatible with immersion silver (ImAg) and Organic Solderability Protectant (OSP) motherboard surface finishes and a SAC alloy solder paste.
The co-planarity (profile) and true position requirements are defined in Appendix C.

3.3.3 Contacts

Base material for the contacts is high strength copper alloy.
For the area on socket contacts where processor lands will mate, there is a 0.381 μm [15 μinches] minimum gold plating over 1.27 μm [50 μinches] minimum nickel underplate.
No contamination by solder in the contact area is allowed during solder reflow.

3.3.4 Pick and Place Cover

The cover provides a planar surface for vacuum pick up used to place components in the Surface Mount Technology (SMT) manufacturing line. The cover remains on the socket during reflow to help prevent contamination during reflow. The cover can withstand 260 °C for 40 seconds (typical reflow/rework profile) and the conditions listed in Chapter 5 without degrading.
As indicated in Figure 3-5, the cover remains on the socket during ILM installation, and should remain on whenever possible to help prevent damage to the socket contacts.
Cover retention must be sufficient to support the socket weight during lifting, translation, and placement (board manufacturing), and during board and system shipping and handling. Covers can be removed without tools.
The socket vendors have a common interface on the socket body where the PnP cover attaches to the socket body. This should allow the PnP covers to be compatible between socket suppliers.
As indicated in Figure 3-5, a Pin1 indicator on the cover provides a visual reference for proper orientation with the socket.
Thermal/Mechanical Specifications and Design Guidelines 21
Figure 3-5. Pick and Place Cover
Pin 1
Pin 1
LGA1156 Socket
Pick & Place Cover
Pick & Place Cover

3.4 Package Installation / Removal

As indicated in Figure 3-6, access is provided to facilitate manual installation and removal of the package.
To assist in package orientation and alignment with the socket:
• The package Pin 1 triangle and the socket Pin1 chamfer provide visual reference for proper orientation.
• The package substrate has orientation notches along two opposing edges of the package, offset from the centerline. The socket has two corresponding orientation posts to physically prevent mis-orientation of the package. These orientation features also provide initial rough alignment of package to socket.
• The socket has alignment walls at the four corners to provide final alignment of the package.
ILM Installation
ILM Installation
LGA1156 Socket
(
)
.
Figure 3-6. Package Installation / Removal Features
Package Pin 1 Indicator
Orientation Notch (2 Places)
Alignment Post
2 Places

3.4.1 Socket Standoffs and Package Seating Plane

Pin 1 Chamfer
Finger Access (2 Places)
Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Appendix C.
Similarly, a seating plane on the top-side of the socket establishes the minimum package height. See Section 5.2 for the calculated IHS height above the motherboard.

3.5 Durability

The socket must withstand 20 cycles of processor insertion and removal. The max chain contact resistance from Tab l e 5 - 4 must be met when mated in the 1st and 20th cycles.
The socket Pick and Place cover must withstand 15 cycles of insertion and removal.
Thermal/Mechanical Specifications and Design Guidelines 23

3.6 Markings

There are three markings on the socket:
• LGA1156: Font type is Helvetica Bold - minimum 6 point (2.125 mm).
• Manufacturer's insignia (font size at supplier's discretion).
• Lot identification code (allows traceability of manufacturing date and location).
All markings must withstand 260°C for 40 seconds (typical reflow/rework profile) without degrading, and must be visible after the socket is mounted on the motherboard.
LGA1156 and the manufacturer's insignia are molded or laser marked on the side wall.

3.7 Component Insertion Forces

Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/ Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force to insert the package into the socket.
LGA1156 Socket

3.8 Socket Size

Socket information needed for motherboard design is given in Appendix C.
This information should be used in conjunction with the reference motherboard keep­out drawings provided in Appendix B to ensure compatibility with the reference thermal mechanical components.
§

Independent Loading Mechanism (ILM)

4 Independent Loading
Mechanism (ILM)
The Independent Loading Mechanism (ILM) provides the force needed to seat the 1156-LGA land package onto the socket contacts. The ILM is physically separate from the socket body. The assembly of the ILM to the board is expected to occur after wave solder. The exact assembly location is dependent on manufacturing preference and test flow. See the Manufacturing Advantage Service collateral for this platform for additional guidance.
Note: The ILM has two critical functions: deliver the force to seat the processor onto the
socket contacts and distribute the resulting compressive load evenly through the socket solder joints.
Note: The mechanical design of the ILM is integral to the overall functionality of the LGA1156
socket. Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be “build to print” from Intel controlled drawings. Intel recommends using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from Intel's detailed studies and may not incorporate critical design parameters.

4.1 Design Concept

The ILM consists of two assemblies that will be procured as a set from the enabled vendors. These two components are ILM cover assembly and back plate. To secure the two assemblies, two types of fasteners are required a pair (2) of standard 6-32 thread screws and a custom 6-32 thread shoulder screw. The reference design incorporates a T-20 Torx* head fastener. The Torx* head fastener was chosen to ensure end users do not inadvertently remove the ILM assembly and for consistency with the LGA1366 socket ILM. The Torx* head fastener is also less susceptible to driver slippage. Once assembled the ILM is not required to be removed to install / remove the motherboard from a chassis.

4.1.1 ILM Cover Assembly Design Overview

The ILM Cover assembly consists of three major pieces: load lever, load plate and the hinge frame assembly.
All of the pieces in the ILM cover assembly except the hinge frame and the screws used to attach the back plate are fabricated from stainless steel. The hinge frame is plated. The frame provides the hinge locations for the load lever and load plate. An insulator is pre-applied to the bottom surface of the hinge frame.
The cover assembly design ensures that once assembled to the back plate the only features touching the board are the shoulder screw and the insulated hinge frame assembly. The nominal gap of the load plate to the board is ~1 mm.
Thermal/Mechanical Specifications and Design Guidelines 25
When closed, the load plate applies two point loads onto the IHS at the “dimpled”
r
r
features shown in Figure 4-1. The reaction force from closing the load plate is transmitted to the hinge frame assembly and through the fasteners to the back plate. Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints.
A pin 1 indicator will be marked on the ILM cover assembly.
Figure 4-1. ILM Cover Assembly
Hinge /
Hinge / Frame
Frame Assy
Assy
Load
Load Plate
Plate
Independent Loading Mechanism (ILM)
Fasteners
Fasteners
Load
Load Leve
Leve
Pin 1 Indicator
Pin 1 Indicator
Shoulder Screw
Shoulder Screw

4.1.2 ILM Back Plate Design Overview

The back plate (see Figure 4-2) is a flat steel back plate with pierced and extruded features for ILM attach. A clearance hole is located at the center of the plate to allow access to test points and backside capacitors if required. An insulator is pre-applied. A notch is placed in one corner to assist in orienting the back plate during assembly.
Figure 4-2. Back Plate
Assembly
Assembly Orient ation
Orient ation Featur e
Featur e
Pierced & Extruded
Pierced & Extruded Thread Features
Thread Features
Die Cut
Die Cut Insulator
Insulator
Independent Loading Mechanism (ILM)

4.1.3 Shoulder Screw and Fasteners Design Overview

The shoulder screw is fabricated from carbonized steel rod. The shoulder height and diameter are integral to the mechanical performance of the ILM. The diameter provides alignment of the load plate. The height of the shoulder ensures the proper loading of the IHS to seat the processor on the socket contacts. The design assumes the shoulder screw has a minimum yield strength of 235 MPa.
Note: The reference design incorporates a T-20 Torx* head fastener. The Torx* head fastener
was chosen to ensure end users do not inadvertently remove the ILM assembly and for consistency with the LGA1366 socket ILM.
Figure 4-3. Shoulder Screw
Cap
6-32 thread
Shoulder
Thermal/Mechanical Specifications and Design Guidelines 27
Independent Loading Mechanism (ILM)

4.2 Assembly of ILM to a Motherboard

The ILM design allows a bottoms up assembly of the components to the board. See
Figure 4-4 for step by step assembly sequence.
1. Place the back plate in a fixture. The motherboard is aligned with the fixture.
2. Install the shoulder screw in the single hole near Pin 1 of the socket. Torque to a minimum and recommended 8 inch-pounds, but not to exceed 10 inch-pounds.
3. Align and place the ILM cover assembly over the socket.
4. Install two (2) 6-32 fasteners. Torque to a minimum and recommended 8 inch­pounds, but not to exceed 10 inch-pounds.
The thread length of the shoulder screw accommodates a nominal board thicknesses of
.
Figure 4-4. ILM Assembly
0.062”.
Step 1 Step 2
Step 1 Step 2
Step 1 Step 2
Step 4
Step 4
Step 3
Step 3
Step 3
Step 4
Independent Loading Mechanism (ILM)
Alignment
As indicated in Figure 4-5, the shoulder screw, socket protrusion and ILM key features prevent 180 degree rotation of ILM cover assembly with respect to socket. The result is a specific Pin 1 orientation with respect to ILM lever.
Figure 4-5. Pin 1 and ILM Lever
Shoulder Screw
Load Lever
Features
Pin 1
Load plate not
shown for
clarity

4.3 ILM Interchangeability

ILM cover assemblies and ILM back plates built from the Intel controlled drawings are intended to be interchangeable. Interchangeability is defined as an ILM from Vendor A that will demonstrate acceptable manufacturability and reliability with a socket body from Vendor A, B, or C. ILM covers assemblies and ILM back plates from all vendors that are also interchangeable.
The ILMs are an integral part of the socket validation testing. ILMs from each vendor have been tested with the socket bodies from each of the current vendors. The tests include manufacturability, bake and thermal cycling.
See Appendix A for vendor part numbers that were tested.
Note: Desktop and Server ILM backplate/screws are NOT interchangeable.
Note: ILMs that are not compliant with the Intel controlled ILM drawings can not be assured
to be interchangeable.

4.4 Markings

There are four markings on the ILM:
• 115XLM: Font type is Helvetica Bold - minimum 6 point (2.125 mm).
• Manufacturer's insignia (font size at supplier's discretion).
• Lot identification code (allows traceability of manufacturing date and location).
• Pin 1 indicator on the load plate.
All markings must be visible after the ILM is assembled on the motherboard.
115XLM and the manufacturer's insignia can be ink stamped or laser marked on the side wall.
§
Thermal/Mechanical Specifications and Design Guidelines 29
Independent Loading Mechanism (ILM)
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