The APW8819 integrates a synchronous buck PWM controller to generate VDDQ, a sourcing and sinking LDO
linear regulator to generate VTT. It provides a complete
power supply for DDR2 and DDR3 memory system. It
offers the lowest total solution cost in system where space
is at a premium.
The APW8819 provides excellent transient response and
accurate DC voltage output in PFM Mode. In Pulse Frequency Mode (PFM), the APW8819 provides very high efficiency over light to heavy loads with loading-modulated
switching frequencies.
The APW8819 is equipped with accurate current-limit,
output under-voltage, and output over-voltage protections.
A Power-On- Reset function monitors the voltage on VCC
prevents wrong operation during power on.
The LDO is designed to provide a regulated voltage with
bi-directional output current for DDR-SDRAM termination.
The device integrates two power transistors to source or
sink current up to 1.5A. It also incorporates current-limit
and thermal shutdown protection.
An internal resistor divider is used to provide a half voltage of VDDQSNS for VTTREF and VTT Voltage. The VTT
output voltage is only requiring 20µF of ceramic output
capacitance for stability and fast transient response. The
S3 and S5 pins provide the sleep state for VTT (S3 state)
and suspend state (S4/S5 state) for device, when S5 and
S3 are both pulled low the device provides the soft-off for
VTT and VTTREF.The APW8819 is available in
3mmx3mm 20-pin QFN and 3mmx3mm 16-pin TQFN
packages.
Applications
•DDR2, and DDR3 Memory Power Supplies
•SSTL-2 SSTL-18 and HSTL Termination
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright ANPEC Electronics Corp.
Rev. A.6 - May, 2013
www.anpec.com.tw1
APW8819
Simplified Application Circuit
V
IN
+3V~28V
Q1
VDDQ
L
OUT
Q2
PWM
S3
Ordering and Marking Information
APW8819
Assembly Material
Handling Code
Temperature Range
Package Code
APW
APW8819 QA :
8819
XXXXX
5V
VTT
VDDQ/2
R
OC
DDR
VREF
LDO
REFIN
R
MODE
R
MODE
TOP
R
GND
S5
Package Code
QA : QFN-20 QB : TQFN-16
Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel TY : Tray
Assembly Material
G : Halogen and Lead Free Device
XXXXX - Date Code
APW
APW8819 QB :XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
= Thermal Pad (connected to GND plane for better heat dissipation)
MODE
OC
S3
16
15
14
GND
6
5
VREF
7
REFIN
VDDQSNS
TQFN 3x3-16
(Top View)
S5
13
12 BOOT
11 UGATE
10 PHASE
9 VCC
8
LGATE
Absolute Maximum Ratings(Note 1, 2)
Symbol
VCC VCC Supply Voltage (VCC to GND) -0.3 ~ 7 V
V
BOOT Supply Voltage (BOOT to PHASE) -0.3 ~ 7 V
BOOT
BOOT Supply Voltage (BOOT to GND)
V
BOOT-GND
>20ns Pulse Width
UGATE Voltage (UGATE to PHASE)
<20ns Pulse Width
>20ns Pulse Width
LGATE Voltage (LGATE to GND)
<20ns Pulse Width
>20ns Pulse Width
PHASE Voltage (PHASE to GND)
<20ns Pulse Width
>20ns Pulse Width
PGND and VTTGND to GND Voltage -0.3 ~ 0.3 V
All Other Pins (OC, MODE, S3, S5, VDDQSNS, VTTSNS, VLDOIN,
VREF, POK, VTT, VTTREF and REFIN to GND Voltage)
TJ Maximum Junction Temperature 150
T
Storage Temperature -65 ~ 150
STG
T
Maximum Soldering Temperature, 10 Seconds 260
SDR
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability
Note 2: The device is ESD sensitive. Handling precautions are recommended.
Parameter Rating Unit
<20ns Pulse Width
-5 ~ 42
V
-0.3 ~ 35
-5 ~ V
-0.3 ~ V
BOOT
BOOT
+0.3
+0.3
V
-5 ~ VCC+0.3
V
-0.3 ~ VCC+0.3
-5 ~ 35
V
-0.3 ~ 28
-0.3 ~ 7 V
o
C
o
C
o
C
Copyright ANPEC Electro nics Corp.
www.anpec.com.tw3
Rev. A.6 - May, 2013
APW8819
Thermal Characteristics (Note 3)
Symbol
Thermal Resistance - Junction to Ambient
θJA
Note 3: θJA is measured with the component mounted on a high effective the thermal conductivity test board in free air. The exposed
Parameter Typical Value Unit
QFN3x3-20
TQFN3x3-16
95
95
°C/W
pad of package is soldered directly on the PCB.
Recommended Operating Conditions(Note 4)
Symbol
VCC VCC Supply Voltage 4.5 ~ 5.5 V
VIN
Converter Input Voltage 3 ~ 28 V
V
Converter Output Voltage 0.5 ~2V/ DDR2 (1.8V)/ DDR3 (1.5V) V
VDDQ
V
LDO Output Voltage 0.25~ 1 V
VTT
I
Converter Output Current 0 ~ 20 A
OUT
I
LDO Output Current -1.5 ~ +1.5 A
VTT
C
VCC Capacitance 1~ µF
VCC
C
VTT Output Capacitance 10~
VTT
C
VTTREF Output Capacitance 0.22 ~ 2.2 µF
VTTREF
TA
Ambient Temperature -40 ~ 85
TJ
Junction Temperature -40 ~ 125
Parameter Range Unit
µF
o
C
o
C
Electrical Characteristics
Refer to the typical application circuits. These specifications apply over V
VCC=VBOOT
otherwise s pecified. Typical values are at TA=25°C.
Symbol
Parameter Test Conditions
SUPPLY CURRENT
I
VCC Supply Current TA = 25oC, VS3 = VS5 = 5V, no load - 1.2 1.5 mA
VCC
I
VCC Standby Current TA = 25oC, VS3 = 0V, VS5 = 5V, no load - 740 850
VCCSTB
I
VCC Shutdown Current TA =25oC, VS3 = V
VCCSDN
I
LDOIN Supply Current TA = 25oC, VS3 = VS5 = 5V, no load 0.3 0.6 1 mA
LDOIN
I
LDOINSTB
I
LDOINSDN
LDOIN Standby Current TA = 25oC, VS3 = 0V, VS5 = 5V, no load - 0.1 10
LDOIN Shutdown Current TA = 25oC, VS3 = VS5 = 0V, no load - 0.1 1