ANPEC APM2509NUC-TU, APM2509NUC-TR Datasheet

APM2509N
N-Channel Enhancement Mode MOSFET
Features
25V/60A , R
R
••
Super High Dense Advanced Cell Design for
••
Extremely Low R
••
Reliable and Rugged
••
••
TO-252 Package
••
=8mΩ(typ.) @ VGS=10V
DS(ON)
=11m(typ.) @ VGS=4.5V
DS(ON)
DS(ON)
Pin Description
Applications
Power Management in Desktop Computer or
DC/DC Converters.
Ordering and Marking Information
12 3
DG
S
Top View of TO-252
D
G
S
N-Channel MOSFET
APM2509N
Temp. Range
Package Code
APM 2509N U :
APM2509N XXXXX
Absolute Maximum Ratings
Symbol
V
DSS
V
GSS
*
I
D
I
DM
Drain-Source Voltage 25
Gate-Source Voltage ±20
Maximum Drain Current – Continuous 60
Maximum Drain Current – Pulsed 110
Parameter Rating Unit
Package Code U : T O -25 2 Operating Junction Temp. Range C : -5 5 to 15 0 C Handling Code T U : Tu be TR : Tape & Reel
XXXXX
°°°°
- Da te C od e
(TA = 25°C unless otherwise noted)
V
A
* Surface Mounted on FR4 Board, t 10 sec.
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright ANPEC Electronics Corp. Rev. A.2 - Jun., 2003
www.anpec.com.tw1
APM2509N
Absolute Maximum Ratings (Cont.) (T
= 25°C unless otherwise noted)
A
Symbol Parameter Rating Unit
50
20
Typ. Max.
P
D
TJ,T
STG
R
JA
θ
R
JC
θ
Electrical Characteristics (T
Maximum Power Dissipation
Maximum Operating and Storage Junction Temperature -55 to 150
Thermal Resistance – Junction to Ambient 50
Thermal Resistance – Junction to Case 2.5
= 25°C unless otherwise noted)
A
Symbol Parameter Test Condition
TA=25°C
=100°C
T
A
Min.
APM2509N
Static
BV
I
V
GS(th)
I
GSS
R
DS(ON)
V
Dynamic
Q Q Q
t
d(ON)
t
d(OFF)
C
C
C
Drain-Source Breakdown
DSS
Zero Gate Voltage Drain
DSS
Current Gate Threshold Voltage
Gate Leakage Current Drain-Source On-state
a
Resistance
a
Diode Forward Voltage ISD=35A, VGS=0V
SD
b
Total Gate Charge
g
Gate-Source Charge
gs
Gate-Drain Charge
gd
V
GS
V
DS
V
DS=VGS
V
GS
VGS=10V, IDS=35A V
GS
V
DS
V
GS
Turn-on Delay Time
V
T
Turn-on Rise Time
r
Turn-off Delay Time
T
Turn-off Fall Time
f
Input Capacitance
iss
Output Capacitance
oss
Reverse Transfer Capacitance
rss
DD
V
GEN
V
GS
V
DS
Frequency =1.0MHz
=0V, IDS=250µA
25 V
=20V , VGS=0V 1 µA
, IDS=250µA
=±20V, VDS=0V
11.52 ±100
89.5
=4.5V, IDS=20A
11 15
0.85 1.3
=15V, IDS=20A
=4.5V,
22 28
12.8 5
10 15
=15V, IDS=1A,
=10V, RG= 0.2
713
35 50 10 20
=0V =15V
2400
500 240
Notes
a
: Pulse test ; pulse width ≤300µs, duty cycle ≤ 2%
b
: Guaranteed by design, not subject to production testing
W
°C
°C/W
C/W
°
Unit
V
nA
m
V
nC
ns
pF
Copyright ANPEC Electronics Corp. Rev. A.2 - Jun., 2003
www.anpec.com.tw2
APM2509N
Typical Characteristics
Output Characteristics
70
60
50
40
30
-Drain Current (A)
20
DS
I
10
0
01234567 8910
VGS=4,4.5,6,8,10V
VGS=3V
VGS=2.5V
VDS-Drain-to-Source Voltage (V)
Threshold Voltage vs. Junction Temperature
1.2
IDS=250µA
1.0
Transfer Characteristics
50
VDS=10V
40
30
20
-Drain Current (A)
DS
I
10
0
1.0 1.5 2.0 2.5 3.0 3.5 4.0
TJ=125°C
TJ=25°C
TJ=-55°C
VGS-Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.015
0.012
VGS=4.5V
0.8
(Normalized)
0.6
VGS(th)-Threshold Voltage (V)
0.4
-50 -25 0 25 50 75 100 125 150
Tj-Junction Temperature (°C)
Copyright ANPEC Electronics Corp. Rev. A.2 - Jun., 2003
0.009
0.006
-On-Resistance (Ω)
DS(ON)
0.003
R
0.000 0 10203040 50 60708090100
VGS=10V
ID-Drain Current (A)
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