Analog Devices ADSST-SALEM-3T, ADSST-EM-3040 User Manual

FEATURES

High accuracy Supports IEC 60687/61036 and ANSI C12.1/12.20 Suitable for class0.5 and class0.2 meter Full four quadrant measurement of parameters SPI® compatible serial interface Pulse output with programmable pulse constant as
pulses/kWh or Wh/pulse Programmable duty cycle for pulse output Embedded calibration routines for gain and dc offset Software based phase and nonlinearity compensation for
current transformers 15 kHz sampling frequency UART mode enables a PC to directly access all computed
parameters Flags to indicate tamper conditions Single 3.0 V supply Developer’s kit to accelerate design process (See
Ordering Guide for separate ordering number.)

GENERAL DESCRIPTION

The ADSST-SALEM-3T energy meter chipset consists of an efficient ADSST-218x digital signal processor (DSP), a fast and accurate 6-channel, 16-bit ADSST-73360LAR sigma-delta ana­log-to-digital converter (ADC), and metering software. Two chipset versions are available to support differing ranges of operating temperature: The ADSST-EM-3040 chipset is rated at 0°C to 70°C for commercial applications, while the ADSST-EM­3041 chipset operates at –25°C to +85°C for industrial use.
SMPS LCD DISPLAY
RESISTOR
BLOCK
CT CT CT
Figure 1. Block Diagram of a Functional Meter
DSP
ADC
ADSST-EM-3040
The ADC and DSP are interfaced to simultaneously acquire voltage and current samples on all three phases and to perform mathematically intensive computations to calculate various instantaneous parameters and perform harmonic analysis. The
SPI BUS
BOOT
FLASH
FLASH
RTC
µC
OPTO
RS-232
03738-0-001
BUTTONS
Powerful Energy Meter Chipset
ADSST-SALEM-3T
chipset can be interfaced to any general-purpose microproces­sor to develop state of the art tri-vector or polyphase energy metering solutions with a wide range of basic currents from 1 A to 30 A. By incorporating a comprehensive data set of parame­ters, including instantaneous measurements, accumulated parameters, and harmonic analysis data, the ADSST-SALEM-3T chipset meets high end energy metering requirements. The abil­ity to easily configure the chipset for various parameters makes it a very flexible solution.
The phase and nonlinearity compensation for current transformers is done in software (patent pending) without having to use any passive components in the circuit for compensation, thus minimizing variations in accuracy with temperature and time.
The ADSST-SALEM-3T measures and computes a large num­ber of parameters essential for high end metering.
Table 1.
Parameter Each Phase Total
RMS Voltage RMS Current Active Power Apparent Power Inductive Reactive Power Capacitive Reactive Power Power Factor Frequency Positive Active Energy Negative Active Energy Apparent Energy Positive Inductive Reactive Energy Negative Inductive Reactive Energy Positive Capacitive Reactive Energy Negative Capacitive Reactive Energy Voltage Magnitude and Phase for All
Odd Harmonics up to 21 Current Magnitude and Phase for All
Odd Harmonics up to 21
st
Order
st
Order
The ADSST-SALEM-3T offers some excellent features that make the final meter cost-effective and easy to manufacture.
       
           
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.326.8703 © 2004 Analog Devices, Inc. All rights reserved.
www.analog.com
ADSST-SALEM-3T

TABLE OF CONTENTS

Easy Calibration............................................................................ 3
Effective Phase Compensation ................................................... 3
Ease of Design............................................................................... 3
Quadrant and Other Conventions ............................................. 3
General Description of the ADSST-218x DSP ......................... 4
General Description of the ADSST-73360LAR ADC................ 11
Specifications—ADSST-73360LAR ............................................. 12
Absolute Maximum Ratings—ADSST-73360LAR .................... 14
ESD Caution................................................................................ 14
Pin Configuration and Pin Function Descriptions— ADSST-73360LAR
.......................................................................... 15
Architecture Overview ................................................................ 4
ADSST-218x Common-Mode Pins ........................................... 6
Clock Signals................................................................................. 7
............................................................................................ 7
RESET
Recommended Operating Conditions ...................................... 7
ADSST-218x Electrical Characteristics ......................................... 8
Absolute Maximum Ratings—ADSST-218x................................. 9
ESD Caution.................................................................................. 9
Pin Configuration—ADSST-218x................................................ 10
REVISION HISTORY
7/04—Revision 0: Initial Version
Pin Function Descriptions ........................................................ 15
Grounding and Layout .............................................................. 16
Power-Up Initialization and Data from the ADSST-SALEM-3T
Voltage and Current Sensing .................................................... 17
Accuracy of Reference Design Using the ADSST-SALEM-3T Chipset
Outline Dimensions....................................................................... 20
Ordering Guide............................................................................... 21
.................................................................... 17
..................................................... 18
Rev. 0 | Page 2 of 24
ADSST-SALEM-3T

EASY CALIBRATION

The ADSST-SALEM-3T chipset has highly advanced calibration routines embedded into the software. Ease of calibration is the key feature in this chipset. By sending specific commands to the ADSST-SALEM-3T chipset, the dc offsets and gains for all volt­age and current channels can be calibrated automatically. Active and reactive power calibration is also available for fine-tuning the errors.
The meter and calibration constants are stored in an external flash memory, and the lock/unlock calibration feature enables protection of the calibration constants. The ability to upgrade the firmware residing in the flash memory makes the meter adaptable to future needs.

EFFECTIVE PHASE COMPENSATION

The ADSST-SALEM-3T chipset employs an algorithm (patent pending) for phase compensation. The ADSST-SALEM­3T chipset based meter, which is very effective and user friendly, can be calibrated for phase compensation at three current points to cover the complete current range. This also reduces the cost of the end product by reducing the cost of the sensing elements, i.e., current transformers.
ACTIVE EXPORT
REACTIVE SIN Φ =–1

EASE OF DESIGN

Designing a complete meter using the ADSST-SALEM-3T is very easy with the ADSST-SALEM-3T-DK developer’s kit. The kit in the UART mode enables a user to evaluate and test the computational element by connecting to a PC, without building the complete hardware.

QUADRANT AND OTHER CONVENTIONS

The metering data computed by the ADSST-SALEM-3T chipset uses the following conventions for various parameters:
Figure 2 gives the quadrant conventions used by the
chipset.
Import means power delivered from the utility to the user.
Export means power delivered by the user to the utility.
Total means total of all three phases.
Import and export are with reference to consumption.
U, I: Magnitude of voltage and current P: Active Power (U × I × cos Φ) Q: Reactive Power (U × I × sin Φ) Φ: Phase angle from the standpoint of I with respect to U, always positive in counterclockwise direction. Phase U: L1 = 0° Abs L2 = 240° Abs L3 = 120° Abs
ACTIVE IMPORT
(–90° Φ) (90° ABS)
REACTIVE EXPORT
ACTIVE
COS Φ =–1
(±180° Φ)
(180° ABS)
REACTIVE IMPORT
P–Q– P+Q–
QUADRANT II QUADRANT I
Φ
I
I
Q
QUADRANT III QUADRANT IV
P+Q+
P–Q+
REACTIVE SIN Φ =+1
Figure 2. Quadrant Conventions
Rev. 0 | Page 3 of 24
(+90° Φ) (270° ABS)
L1, L2, L3
ACTIVE CAPACITIVE (LEAD)
ACTIVE COS Φ = +1
(0° Φ) (0° ABS)
ACTIVE INDUCTIVE (LAG)
03738-0-002
ADSST-SALEM-3T

GENERAL DESCRIPTION OF THE ADSST-218X DSP

The ADSST-218x is a single-chip microcomputer optimized for digital signal processing (DSP) and other high speed numeric processing applications.
The DSP combines the ADSP-2100 family base architecture (three computational units, data address generators, and a pro­gram sequencer) with two serial ports, a 16-bit internal DMA port, a byte DMA port, a programmable timer, flag I/O, exten­sive interrupt capabilities, and on-chip program and data memory.
The ADSST-218x is fabricated in a high speed, low power CMOS process. Every instruction can execute in a single proc­essor cycle.
The ADSST-218x’s flexible architecture and comprehensive instruction set enable the processor to perform multiple opera­tions in parallel. In one processor cycle, the ADSST-218x can:
Generate the next program address
Fetch the next instruction
Perform one or two data moves
Update one or two data address pointers
This takes place while the processor continues to:
Receive and transmit data through the two serial ports
Receive and/or transmit data through the internal
DMA port
Receive and/or transmit data through the byte DMA port
Decrement timer

ARCHITECTURE OVERVIEW

The ADSST-218x instruction set provides flexible data moves and multifunction (one or two data moves with a computation) instructions. Every instruction can be executed in a single proc­essor cycle. The ADSST-218x assembly language uses an algebraic syntax for ease of coding and readability. A compre­hensive set of development tools supports program development.
Figure 3 is the functional block diagram of the ADSST-218x. The processor contains three independent computational units: the ALU, the multiplier/accumulator (MAC), and the shifter. The computational units process 16-bit data directly and have provisions to support multiprecision computations.
Perform a computational operation
DATA ADDRESS
GENERATORS DAG1 DAG2
ARITHMETIC UNITS SERIAL PORTS
ALU MAC SHIFTER
ADSP-2100 BASE
ARCHITECTURE
PROGRAM
SEQUENCER
POWER-DOWN
CONTROL
MEMORY
PROGRAM
MEMORY
16K × 24-BIT
PROGRAM MEMORY ADDRESS
DATA MEMORY ADDRESS
PROGRAM MEMORY DATA
DATA MEMORY DATA
SPORT0
MEMORY
16K × 16-BIT
SPORT1
Figure 3. Functional Block Diagram
DATA
PROGRAMMABLE
I/O
AND
FLAGS
TIMER
FULL MEMORY MODE
EXTERNAL
ADDRESS
BUS
EXTERNAL
DATA
BUS
BYTE DMA
CONTROLLER
OR
EXTERNAL
DATA
BUS
INTERNAL
DMA
PORT
HOST MODE
03738-0-008
Rev. 0 | Page 4 of 24
ADSST-SALEM-3T
Efficient data transfer is achieved with the use of five internal buses:
Program Memory Address (PMA) Bus Program Memory
Data (PMD) Bus
Data Memory Address (DMA) Bus
Data Memory Data (DMD) Bus
Result (R) Bus
The byte memory and I/O memory space interface supports slow memories and I/O memory-mapped peripherals with pro­grammable wait state generation. External devices can gain
BR
control of external buses with bus request/grant signals ( BGH ADSST-218x to continue running from on-chip memory. Nor­mal execution mode requires the processor to halt while buses are granted.
, and
BG0
). One execution mode (go mode) enables the
,
The ADSST-218x can respond to 11 interrupts. There are up to six external interrupts (one edge sensitive, two level sensitive, and three configurable) and seven internal interrupts generated by the timer, the serial ports (SPORTs), the byte DMA port, and
RESET
the power-down circuitry. There is also a master The two serial ports provide a complete synchronous serial interface with optional companding in hardware and a wide variety of framed or frameless data transmit and receive modes of operation.
signal.
Serial Ports
The ADSST-218x incorporates two complete synchronous serial ports (SPORT0 and SPORT1) for serial communications and multiprocessor communication.
Package Description
The ADSST-218x is available in a 100-lead low profile quad flat package (LQFP, refer to Figure 5).
Rev. 0 | Page 5 of 24
ADSST-SALEM-3T

ADSST-218X COMMON-MODE PINS

Table 2.
Pin Name No. of Pins I/O Function
BG BGH BMS BR CMS DMS IOMS PMS RD RESET WR
IRQ2/ PF7 I/O Programmable I/O Pin IRQL1/ PF6 I/O Programmable I/O Pin IRQL0/ PF5 I/O Programmable I/O Pin IRQE/ PF4 I/O Programmable I/O Pin MODE A 1 I PF0 I/O Programmable I/O Pin during Normal Operation MODE B 1 I PF1 I/O Programmable I/O Pin during Normal Operation MODE C 1 I PF2 I/O Programmable I/O Pin during Normal Operation MODE D 1 I PF3 I/O Programmable I/O Pin during Normal Operation CLKIN, XTAL 2 I Clock or Quartz Crystal Input CLKOUT 1 O Processor Clock Output
EZ-Port 9 I/O For Emulation Use FI, FO Flag In, Flag Out FL0, FL1, FL2 3 O Output Flags GND 10 I Power and Ground IRQ1:0
PWD SPORT0 5 I/O Serial Port I/O Pins SPORT1 5 I/O Serial Port I/O Pins PWDACK 1 O Power-Down Control Output V
DDEXT
V
DDEXT
V
2 I Internal VDD (2.5 V) Power (LQFP)
DDINT
V
4 I Internal VDD (2.5 V) Power (Mini-BGA)
DDINT
1
Interrupt/flag pins retain both functions concurrently. If IMASK is set to enable the corresponding interrupts, the DSP will vector to the appropriate interrupt vector
address when the pin is asserted, either by external devices or set as a programmable flag.
2
SPORT configuration determined by the DSP System Control register. Software configurable.
1 O Bus Grant Output 1 O Bus Grant Hung Output 1 O Byte Memory Select Output 1 I Bus Request Input 1 O Combined Memory Select Output 1 O Data Memory Select Output 1 O Memory Select Output 1 O Program Memory Select Output 1 O Memory Read Enable Output 1 I Processor Reset Input 1 O Memory Write Enable Output
1 I Edge- or Level-Sensitive Interrupt Request
1 I Level-Sensitive Interrupt Requests
1 I Level-Sensitive Interrupt Requests
1 I Edge-Sensitive Interrupt Requests
1
1
1
Mode Select Input−Checked only during RESET
Mode Select Input−Checked only during RESET
Mode Select Input−Checked only during RESET
Mode Select Input−Checked only during RESET
2
Edge- or Level-Sensitive Interrupts 1 I Power-Down Control Input
4 7
I External VDD (2.5 V or 3.3 V) Power (LQFP) I External V
(2.5 V or 3.3 V) Power (Mini-BGA)
DD
1
Rev. 0 | Page 6 of 24
ADSST-SALEM-3T

CLOCK SIGNALS

Either a crystal or a TTL compatible clock signal can clock the ADSST-218x.
If an external clock is used, it should be a TTL compatible signal running at half the instruction rate. The signal is connected to the processor’s CLKIN input. When an external clock is used, the XTAL input must be left unconnected.
RESET
The
The sequence to assure proper initialization.
power-up must be held long enough to enable the internal clock to stabilize. If
clock continues to run and does not require stabilization time.
signal initiates a master reset of the ADSST-2185x.
RESET
signal must be asserted during the power-up
RESET
RESET
is activated any time after power-up, the
RESET
during initial
Because the ADSST-218x includes an on-chip oscillator circuit, an external crystal may be used. The crystal should be connected across the CLKIN and XTAL pins, with two capacitors connected as shown in Figure 4. The capacitor values are dependent on the crystal type and should be specified by the crystal manufacturer. A parallel resonant, fundamental frequency, microprocessor grade crystal should be used.
A clock output (CLKOUT) signal is generated by the processor at the processor’s cycle rate. This can be enabled and disabled by the CLKODIS bit in the SPORT0 autobuffer control register.
CLKIN XTAL
DSP
Figure 4. External Crystal Connections
CLKOUT
03738-0-003
The power-up sequence is defined as the total time required for the crystal oscillator circuit to stabilize after a valid V
DD
is applied to the processor and for the internal phase-locked loop (PLL) to lock onto the specific crystal frequency. A minimum of 2000 CLKIN cycles ensures that the PLL has locked but does not include the crystal oscillator start-up time. During this power-up sequence, the
any subsequent resets, the minimum pulse-width specification, t
The
input contains some hysteresis; however, if an RC
RESET
circuit is used to generate the
signal should be held low. On
RESET
signal must meet the
RESET
.
RSP
signal, the use of an exter-
RESET
nal Schmitt trigger is recommended.

RECOMMENDED OPERATING CONDITIONS

Table 3.
Parameter Min Max Unit
V
DDINT
V
DDEXT
1
V
INPUT
T
AMB
1
The ADSST-2185x is 3.3 V tolerant (always accepts up to 3.6 V max VIH), but
voltage compliance (on output, V
(MAX) = V
V
OH
RFS1, SCLK0, SCLK1, TFS0, A1–A13, PF0–PF7) and input only pins (CLKIN, RESET
, BR, DR0, DR1,
2.37 2.63 V
2.37 3.60 V VIL = –0.3 VIH = 3.6 V 0 70 °C
) depends on the input V
(MAX). This applies to bidirectional pins (D0–D23, RFS0,
DDEXT
PWD
OH
).
DDEXT
; because
Rev. 0 | Page 7 of 24
ADSST-SALEM-3T

ADSST-218X ELECTRICAL CHARACTERISTICS

Table 4.
Parameter Test Conditions Min Typ Max Unit
VIH High Level Input Voltage VIH High Level CLKIN Voltage @ V VIL Low Level Input Voltage VOH High Level Output Voltage @ V @ V VOL Low Level Output Voltage IIH High Level Input Current IIL Low Level Input Current I
Three-State Leakage Current
OZH
I
Three-State Leakage Current
OZL
IDD Supply Current (Idle) @ V IDD Supply Current (Dynamic) @ V IDD Supply Current (Power-Down) CI Input Pin Capacitance CO Output Pin Capacitance
1
Bidirectional pins: D0–D23, RFS0, RFS1, SCLK0, SCLK1, TFS0, TFS1, A1–A13, PF0–PF7.
2
Input only pins:
3
Input only pins: CLKIN,
4
Output pins: BG,
5
Although specified for TTL outputs, all ADSP-2186 outputs are CMOS compatible and will drive to V
6
Guaranteed but not tested.
7
Three-statable pins: A0–A13, D0–D23,
8
0 V on BR.
9
Idle refers to ADSST-218x state of operation during execution of IDLE instruction. Deasserted pins are driven to either VDD or GND.
10
IDD measurement taken with all instructions executing from internal memory. 50% of the instructions are multifunction (Types 1, 4, 5, 12, 13, 14), 30% are Type 2 and
Type 6, and 20% are idle instructions.
11
VIN = 0 V and 3 V. For typical figures for supply currents, refer to the Power Dissipation section.
12
Applies to LQFP package type.
13
Output pin capacitance is the capacitive load for any three-stated output pin.
RESET, BR
RESET, BR
PMS, DMS, BMS, IOMS, CMS, RD, WR
1, 2
1, 3
3
3
9
10
3, 6
6, 7, 12, 13
, DR0, DR1,
, DR0, DR1,
@ V
= Max 1.5 V
DDINT
= Max 2.0 V
DDINT
@ V
= Min 0.7 V
1, 4, 5
1, 4, 5
7
7
12
DDINT
@ V
= Min, IOH = –0.5 mA 2.0 V
DDEXT
= 3.0 V, IOH = –0.5 mA 2.4 V
DDEXT
= Min, IOH = –100 µA
DDEXT
@ V
= Min, IOL = 2 mA 0.4 V
DDEXT
@ V
= Max, VIN = 3.6 V 10 µA
DDINT
@ V
= Max, VIN = 0 V 10 µA
DDINT
@ V
= Max, VIN = 3.6 V
DDEXT
@ V
= Max, VIN = 0 V
DDEXT
@ V
= 2.5 V, tCK = 15 ns 9 mA
DDINT
= 2.5 V, tCK = 13.3 ns 10 mA
DDINT
@ V
= 2.5 V, tCK = 13.3 ns11, T
DDINT
= 2.5 V, tCK = 15 ns11, T
DDINT
@ V
= 2.5 V, T
DDINT
@ VIN = 2.5 V, fIN = 1.0 MHz, T @ VIN = 2.5 V, fIN = 1.0 MHz, T
PWD
.
PWD
.
, PWDACK, A0, DT0, DT1, CLKOUT, FL2–0,
PMS, DMS, BMS, IOMS, CMS, RD, WR
6
8
8
= +25°C 35 mA
AMB
= +25°C 38 mA
AMB
= +25°C in Lowest Power Mode 100 mA
AMB
= +25°C 8 pF
AMB
= +25°C 8 pF
AMB
BGH
.
and GND, assuming no dc loads.
DDEXT
V
– 0.3 V
DDEXT
10 µA 10 µA
, DT0, DT1, SCLK0, SCLK1, TFS0, TFS1, RFS0, RFS1, PF0–PF7.
Rev. 0 | Page 8 of 24
ADSST-SALEM-3T

ABSOLUTE MAXIMUM RATINGS—ADSST-218X

Table 5.
Rating Parameter Min Max
Internal Supply Voltage (V External Supply Voltage (V Input Voltage
1
Output Voltage Swing Operating Temperature Range 0°C 70°C Storage Temperature Range –65°C +150°C
1
Applies to bidirectional pins (D0–D23, RFS0, RFS1, SCLK0, SCLK1, TFS0, TFS1,
A1–A13, PF0–PF7) and input-only pins (CLKIN,
2
Applies to output pins (BG,
A0, DT0, DT1, CLKOUT, FL2–FL0,
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions above those indicated in the operational sec­tions of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
) –0.3 V +3.0 V
DDINT
) –0.3 V +4.0 V
DDEXT
–0.3 V +4.0 V
2
PMS, DMS, BMS, IOMS, CMS, RD, WR
–0.5 V V
BGH
).
RESET
, BR, DR0, DR1,
+ 0.5 V
DDEXT
PWD
, PWDACK,
).

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. 0 | Page 9 of 24
ADSST-SALEM-3T
A
A
A

PIN CONFIGURATION—ADSST-218X

A4/IAD3 A5/IAD4
GND A6/IAD5 A7/IAD6 A8/IAD7 A9/IAD8
A10/IAD9
11/IAD10 12/IAD11 13/IAD12
GND
CLKIN
XTAL
V
DDEXT
CLKOUT
GND
V
DDINT
WR
RD BMS DMS PMS
IOMS
CMS
A0
A1/IAD0
A3/IAD2
A2/IAD1
999897
100
1
PIN 1
2
IDENTIFIER
3 4 5 6 7 8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
272829
26
GND
IRQE+PF4
IRQL0+PF5
IRQL1+PF6
BGH
PWDACK 96
30
IRQ2+PF7
95
31
DT0
PF0 [MODE A]
PF1 [MODE B]
9493929190
323334
TFS0
RFS0
DDEXT
V
PWD
GND
ADSST-218x
TOP VIEW
(Not to Scale)
35
36
DR0
DDEXT
SCLK0
V
FL0
PF3 [MODE D]
FL1
PF2 [MODE C] 8988878685
3738394041
DT1/FO
FL2
DR1/FI
TFS1/IRQ1
RFS1/IRQ0
D22
D23 8483828180
424344
GND
SCLK1
ERESET
D21
RESET
D18
GND
46 EE
D19
797877
48
47
ECLK
ELOUT
D17
49
ELIN
D16
76
75
D15
74
D14
73
D13
72
D12
71
GND
70
D11
69
D10
68
D9 V
67
DDEXT
66
GND
65
D8 D7/IWR
64 63
D6/IRD
62
D5/IAL
61
D4/IS
60
GND V
59
DDINT
D3/IACK
58
D2/IAD15
57
D1/IAD14
56 55
D0/IAD13
54
BG
53
EBG
52
BR
51
EBR
50
EINT
03738-0-009
D20
45
EMS
Figure 5. Pin Configuration for ADSST-218x in 100-Lead LQFP
Rev. 0 | Page 10 of 24
ADSST-SALEM-3T

GENERAL DESCRIPTION OF THE ADSST-73360LAR ADC

The ADSST-73360LAR is a 6-channel input analog front end processor for general-purpose applications, including industrial power metering or multichannel analog inputs. It features six 16-bit A/D conversion channels, each of which provides 76 dB signal-to-noise ratio over a dc to 4 kHz signal bandwidth. Each channel also features an input programmable gain amplifier (PGA) with gain settings in eight stages from 0 dB to 38 dB.
VINP1
VINN1
VINP2
VINN2
VINP3
VINN3
REFCAP REFOUT
VINP4
VINN4
SIGNAL
CONDITIONING
SIGNAL
CONDITIONING
SIGNAL
CONDITIONING
SIGNAL
CONDITIONING
0/38DB
PGA
0/38DB
PGA
0/38DB
PGA
REFERENCE
0/38DB
PGA
CONDITIONING
CONDITIONING
CONDITIONING
CONDITIONING
The ADSST-73360LAR is particularly suitable for industrial power metering as each channel samples synchronously, ensur­ing that there is no (phase) delay between the conversions. The ADSST-73360LAR also features low group delay conversions on all channels.
An on-chip reference voltage is included with a nominal value of 1.2 V.
The ADSST-73360LAR is available in a 28-lead SOIC package.
SIGNAL
Σ-
SIGNAL
Σ-
SIGNAL
Σ-
ADSST-73360LAR
SIGNAL
Σ-
DECIMATOR
DECIMATOR
DECIMATOR
DECIMATOR
SERIAL
I/O
PORT
SDI SDIFS SCLK
RESET MCLK SE
VINP5
VINN5
VINP6
VINN6
SIGNAL
CONDITIONING
SIGNAL
CONDITIONING
0/38DB
PGA
0/38DB
PGA
SIGNAL
Σ-
CONDITIONING
SIGNAL
Σ-
CONDITIONING
DECIMATOR
DECIMATOR
03738-0-004
SDO SDOFS
Figure 6. ADSST-73360LAR Functional Block Diagram
Rev. 0 | Page 11 of 24
ADSST-SALEM-3T

SPECIFICATIONS—ADSST-73360LAR

(AVDD = 2.7 V to 3.6 V, DVDD = 2.7 V to 3.6 V, DGND = AGND = 0 V, f
1
, unless otherwise noted.)
T
MAX
Table 6.
Parameter Min Typ Max Unit Test Conditions
REFERENCE REFCAP Absolute Voltage, V
REFCAP
1.08 1.2 1.32 V
REFCAP TC 50 ppm/°C
REFOUT Typical Output Impedance 130 Absolute Voltage, V
REFOUT
1.08 1.2 1.32 V Unloaded Minimum Load Resistance 1 kΩ Maximum Load Capacitance 100 pF ADC SPECIFICATIONS Maximum Input Range at VIN
2, 3
1.578 V p-p Measured Differentially –2.85 dBm
Nominal Reference Level at VIN
1.0954 V p-p Measured Differentially
(0 dBm0) –6.02 dBm Absolute Gain PGA = 0 dB –1.3 +0.6 dB 1.0 kHz PGA = 38 dB
–0.8
+0.8 dB 1.0 kHz Signal to (Noise + Distortion) PGA = 0 dB 76 dB 0 Hz to 4 kHz; fS = 8 kHz PGA = 0 dB 71 76 dB 0 Hz to 2 kHz; fS = 8 kHz f PGA = 38 dB 58 dB 0 Hz to 4 kHz; fS = 64 kHz Total Harmonic Distortion PGA = 0 dB –80 –71 dB 0 Hz to 2 kHz; fS = 8 kHz; fIN = 60 kHz PGA = 38 dB –64 dB 0 Hz to 2 kHz; fS = 64 kHz; fIN = 60 kHz Intermodulation Distortion –78 dB PGA = 0 dB Idle Channel Noise –68 dB PGA = 0 dB, fS = 64 kHz; SCLK = 16 MHz Crosstalk ADC-to-ADC –95 dB ADC1 at Idle; ADC2 to ADC6 Input Signal: 60 Hz DC Offset –30 +30 mV PGA = 0 dB Power Supply Rejection –55 dB
Group Delay
4, 5
25 50 95 190 Input Resistance at VIN
2, 4
25 kΩ Phase Mismatch 0.15 Degrees fIN = 1 kHz
0.01 Degrees fIN = 60 Hz
= 16.384 MHz, f
MCLK
µs µs µs µs
6
= 8.192 MHz, fS = 8 kHz, TA = T
SCLK
MIN
to
0.1 µF Capacitor Required from REFCAP to AGND2
= 60 kHz
IN
Input Signal Level at AVDD and DVDD Pins
1.0 kHz, 100 mV p-p Sine Wave 64 kHz Output Sample Rate
32 kHz Output Sample Rate 16 kHz Output Sample Rate 8 kHz Output Sample Rate DMCLK = 16.384 MHz
Rev. 0 | Page 12 of 24
ADSST-SALEM-3T
Parameter Min Typ Max Unit Test Conditions
FREQUENCY RESPONSE
(ADC)7 Typical Output Frequency (Normalized to f
)
S
0 0 dB
0.03125 –0.1 dB
0.0625 –0.25 dB
0.125 –0.6 dB
0.1875 –1.4 dB
0.25 –2.8 dB
0.3125 –4.5 dB
0.375 –7.0 dB
0.4375 –9.5 dB > 0.5 < –12.5 dB LOGIC INPUTS V
, Input High Voltage VDD – 0.8 V
INH
V
, Input Low Voltage 0 0.8 V
INL
IIH, Input Current 10 CIN, Input Capacitance 10 pF LOGIC OUTPUT
VOH, Output High Voltage VDD – 0.4 V VOL, Output Low Voltage 0 0.4 V Three-State Leakage Current –10 +10
POWER SUPPLIES AVDD1, AVDD2 2.7 3.6 V DVDD 2.7 3.6 V
8
IDD
1
Operating temperature range is as follows: –40°C to +85°C. Therefore, T
2
Test conditions: Input PGA set for 0 dB gain (unless otherwise noted).
3
At input to sigma-delta modulator of ADC.
4
Guaranteed by design.
5
Overall group delay will be affected by the sample rate and the external digital filtering.
6
The ADC’s input impedance is inversely proportional to DMCLK and is approximated by: (4 × 1011)/DMCLK.
7
Frequency response of the ADC measured with input at audio reference level (the input level that produces an output level of 0 dBm0), with 38 dB preamplifier
bypassed and input gain of 0 dB.
8
Test Conditions: no load on digital inputs, analog inputs ac-coupled to ground.
V
DD
µA
V
DD
µA
| 100 µA
|I
OUT
| 100 µA
|I
OUT
See Table 7
= –40°C and T
MIN
= +85°C.
MAX
Table 7. Current Summary (AVDD = DVDD = 3.3 V)
Digital Current,
Conditions
Max (mA)
SE MCLK ON Comments
ADCs Only On 25 1 Yes REFOUT Disabled REFCAP Only On 1.0 0 No REFOUT Disabled REFCAP and REFOUT Only On 3.5 0 No All Sections On 26.5 1 Yes REFOUT Enabled All Sections Off 1.0 1 Yes MCLK Active Levels Equal to 0 V and DVDD All Sections Off 0.05 0 No Digital Inputs Static and Equal to 0 V or DVDD
The above values are in mA and are typical values, unless otherwise noted. MCLK = 16.384 MHz; SCLK = 16.384 MHz.
Rev. 0 | Page 13 of 24
ADSST-SALEM-3T

ABSOLUTE MAXIMUM RATINGS—ADSST-73360LAR

(TA = 25°C unless otherwise noted)
Table 8.
Parameter Rating
AVDD, DVDD to GND –0.3 V to +4.6 V AGND to DGND –0.3 V to +0.3 V Digital I/O Voltage to DGND –0.3 V to DVDD + 0.3 V Analog I/O Voltage to AGND –0.3 V to AVDD Operating Temperature Range 0°C to +70°C Storage Temperature Range –65°C to +150°C Maximum Junction Temperature 150°C Thermal Impedance θJA (SOIC) 75°C/W
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. 0 | Page 14 of 24
ADSST-SALEM-3T
PIN CONFIGURATION AND PIN FUNCTION DESCRIPTIONS—ADSST-73360LAR
VINP2
1
VINN2
2 3
VINP1
VINN1 REFOUT REFCAP
AVDD2 AGND2
DGND
DVDD
RESET
SCLK
MCLK
SDO
TOP VIEW
(Not to Scale)
4 5 6 7 8
9 10 11 12 13 14
NC = NO CONNECT
Figure 7. ADSST-73360LAR Pin Configuration—RW-28

PIN FUNCTION DESCRIPTIONS

Table 9.
Pin No. Mnemonic Function
1 VINP2 Analog Input to the Positive Terminal of Input Channel 2. 2 VINN2 Analog Input to the Negative Terminal of Input Channel 2. 3 VINP1 Analog Input to the Positive Terminal of Input Channel 1. 4 VINN1 Analog Input to the Negative Terminal of Input Channel 1. 5 REFOUT Buffered Output of the Internal Reference, which has a nominal value of 1.2 V. 6 REFCAP
7 AVDD2 Analog Power Supply Connection. 8 AGND2 Analog Ground/Substrate Connection. 9 DGND Digital Ground/Substrate Connection. 10 DVDD Digital Power Supply Connection. 11
Active Low Reset Signal. This input resets the entire chip, resetting the control registers and
RESET
12 SCLK
13 MCLK Master Clock Input. MCLK is driven from an external clock signal. 14 SDO
15 SDOFS
16 SDIFS
17 SDI
Reference Voltage for ADCs. A bypass capacitor to AGND2 of 0.1 µF is required for the on-chip reference. The capacitor should be fixed to this pin. The internal reference can be overdriven by an external reference connected to this pin if required.
clearing the digital circuitry. Output Serial Clock whose rate determines the serial transfer rate to/from the ADSST-
73360LAR. It is used to clock data or control information to and from the serial port (SPORT). The frequency of SCLK is equal to the frequency of the master clock (MCLK) divided by an integer number that is the product of the external master clock rate divider and the serial clock rate divider.
Serial Data Output of the ADSST-73360LAR. Both data and control information may be output on this pin and are clocked on the positive edge of SCLK. SDO is in three-state when no information is being transmitted and when SE is low.
Framing Signal Output for SDO Serial Transfers. The frame sync is one bit wide and it is active one SCLK period before the first bit (MSB) of each output word. SDOFS is referenced to the positive edge of SCLK. SDOFS is in three-state when SE is low.
Framing Signal Input for SDI Serial Transfers. The frame sync is one bit wide and it is valid one SCLK period before the first bit (MSB) of each input word. SDIFS is sampled on the negative edge of SCLK and is ignored when SE is low.
Serial Data Input of the ADSST-73360LAR. Both data and control information may be input on this pin and are clocked on the negative edge of SCLK. SDI is ignored when SE is low.
VINN3
28 27
VINP3
26
VINN4
25
VINP4
24
VINN5 VINP5
23 22
VINN6
21
VINP6
20
AVDD1
19
AGND1
18
SE
17
SDI
16
SDIFS
15
SDOFS
03738-0-005
Rev. 0 | Page 15 of 24
ADSST-SALEM-3T
Pin No. Mnemonic Function
18 SE
19 AGND1 Analog Ground Connection. 20 AVDD1 Analog Power Supply Connection. 21 VINP6 Analog Input to the Positive Terminal of Input Channel 6. 22 VINN6 Analog Input to the Negative Terminal of Input Channel 6. 23 VINP5 Analog Input to the Positive Terminal of Input Channel 5. 24 VINN5 Analog Input to the Negative Terminal of Input Channel 5. 25 VINP4 Analog Input to the Positive Terminal of Input Channel 4. 26 VINN4 Analog Input to the Negative Terminal of Input Channel 4. 27 VINP3 Analog Input to the Positive Terminal of Input Channel 3. 28 VINN3 Analog Input to the Negative Terminal of Input Channel 3.
SPORT Enable. Asynchronous input enable pin for the SPORT. When SE is set low by the DSP, the output pins of the SPORT are three-stated and the input pins are ignored. SCLK is also disabled internally in order to decrease power dissipation. When SE is brought high, the control and data registers of the SPORT are at their original values (before SE was brought low); however, the timing counters and other internal registers are at their reset values.

GROUNDING AND LAYOUT

Since the analog inputs to the ADSST-73360LAR are differential, most of the voltages in the analog modulator are common-mode voltages. The excellent common-mode rejection of the part will remove common-mode noise on these inputs. The analog and digital supplies of the ADSST-73360LAR are independent and separately pinned out to minimize coupling between analog and digital sections of the device. The digital filters on the encoder section provide rejection of broadband noise on the power supplies, except at integer multiples of the modulator sampling frequency. The digital filters also remove noise from the analog inputs, provided the source does not saturate the analog modulator. However, because the resolution of the ADSST-73360LAR’s ADC is high and the noise levels from the ADSST-73360LAR are so low, care must be taken with regard to grounding and layout.
The printed circuit board that houses the ADSST-73360LAR should be designed in such a way that the analog and digital sections are separated and confined to certain sections of the board. The ADSST-73360LAR pin configuration offers a major advantage in that its analog and digital interfaces are connected on opposite sides of the package. This facilitates the use of ground planes that can be easily separated, as shown in Figure 8.
ANALOG GROUND
DIGITAL GROUND
03738-0-006
Figure 8. Ground Plane Layout
A minimum etch technique is generally best for ground planes as it gives the best shielding. Digital and analog ground planes should be joined in only one place. If this connection is close to the device, it is recommended to use a ferrite bead inductor as shown in Figure 9.
Avoid running digital lines under the device for they will couple noise onto the die. The analog ground plane should be enabled to run under the ADSST-73360LAR to avoid noise coupling. The power supply lines to the ADSST-73360LAR should use as large a trace as possible to provide low impedance paths and reduce the effects of glitches on the power supply lines. Fast switching signals such as clocks should be shielded with digital ground to avoid radiating noise to other sections of the board, and clock signals should never be run near the analog inputs. Traces on opposite sides of the board should run at right angles to each other. This will reduce the effects of feed-through through the board. A microstrip technique is by far the best but is not always possible with a double-sided board. In this tech­nique, the component side of the board is dedicated to ground planes while signals are placed on the other side.
Good decoupling is important when using high speed devices. All analog and digital supplies should be decoupled to AGND and DGND, respectively, with 0.1 µF ceramic capacitors in parallel with 10 µF tantalum capacitors. To achieve the best from these decoupling capacitors, they should be placed as close as possible to the device, ideally right up against it. In systems where a common supply voltage is used to drive both the AVDD and DVDD of the ADSST-73360LAR, it is recommended that the system’s AVDD supply be used. This supply should have the recommended analog supply decoupling between the AVDD pins of the ADSST-73360LAR and AGND, and the recommended digital supply decoupling capacitors between the DVDD pin and DGND.
Rev. 0 | Page 16 of 24
ADSST-SALEM-3T

POWER-UP INITIALIZATION AND DATA FROM THE ADSST-SALEM-3T

The ADSST-SALEM-3T-EV boot loads the code from the nonvolatile flash memory as shown in the block diagram of a functional meter in Figure 1. The configuration and calibra­tion data also gets loaded from the nonvolatile memory. For further details on boot loading, refer to the ADSST-SALEM-3T­DK (Developer’s Kit) User Manual. The user manual also describes various commands for instantaneous and computed parameters.

VOLTAGE AND CURRENT SENSING

Figure 9 shows the input section for the voltage and current sections. Based on the voltage and current values, the GUI software in the ADSST-SALEM-3T-DK computes the values of resistors R1, R2, and R3. The closest available values to those calculated by the GUI software should be selected and used.
VOLTAGE INPUT
PHASE
VOLTAGE
NEUTRAL
CURRENT INPUT
PHASE
CURRENT
Figure 9. Input Section
R1
R2
R3
TO ADC CHANNEL
TO ADC CHANNEL
NEUTRAL
03738-0-007
The ADSST-73360LAR has a peak-to-peak input range of V (V
× 0.6525) to V
REF
REF
+ (V
REF
× 0.6525); for V
= 2.5 V, this is
REF
0.856 V to 4.14 V p-p. This limit defines the resistance network on the potential circuits and the burden resistance on the sec­ondary side of the CT. Since the ADSST-73360LAR is a unipolar ADC, the ac potential and current signals have to be offset by some dc level. The reference design has a dc offset of 2.5 V. This limits the peak-to-peak signal range of potential and current to
3.28 V p-p or 1.16 V rms.
Potential Section
The selection of the potential divider circuit should be such that it can:
Handle high surge voltages
Have minimum VA burden
Give approximately 1 V peak headroom to accommodate
overvoltages.
Current Section
The selection of CT ratio and burden resistance should be such that it can:
Handle the complete dynamic range for the current signal
input.
Give approximately 1 V peak headroom to accommodate
loads with high crest factors.
The reference design has a CT with a turns ratio of 1:2500 and burden resistance of 82 Ω. This generates 0.656 V rms or
0.928 V peak at 20 A current. This leaves enough margin for current pulses or low crest factor loads, such as SMPS. The maximum current can be up to 32.768 A.
REF
Rev. 0 | Page 17 of 24
ADSST-SALEM-3T
ACCURACY OF REFERENCE DESIGN USING THE ADSST-SALEM-3T CHIPSET
Overall Accuracy, Power, and Energy Measurement
The accuracy figures are measured under typical specified conditions, unless otherwise indicated.
Table 10. Test Conditions for Reference Design Using a µ Metal CT of Class 0.5 Accuracy
Parameter Nominal Value
Nominal Voltage (Phase to Neutral) V
N
VN = 230 V ± 1% Maximum Voltage (Phase to Neutral) 300 V Nominal Current IN = 5 A Maximum Current I
MAX
I
MAX
= 20 A Frequency FN = 50 Hz/60 Hz ± 10% Temperature 23 ± 2°C
Table 11. Maximum Error (Power and Energies)
Current Voltage PF Min Typ Max Unit
0.01 IN I < 0.05 I
0.05 IN I < I
MAX
0.02 IN I< 0.1 I
V
N
N
N
V
N
V
N
1.0
1.0
0.5 Lagging
0.8 Leading
0.05 IN I < I
MAX
V
N
0.5 Lagging
0.8 Leading
Table 12. Unbalanced Load Error
Current Voltage PF Min Typ Max Unit
0.05 IN I I
0.1 IN I I
MAX
MAX
V
N
V
N
1.0
0.5 Lagging
Table 13. Voltage Variation Error
Voltage Current PF Min Typ Max Unit
VN ± 10% 0.05 IN I I VN ± 10% 0.1 IN I I
MAX
MAX
1.0
0.5 Lagging
Table 14. Frequency Variation Errors
Frequency Current PF Min Typ Max Unit
fN ± 10% 0.05 IN I I fN ± 10% 0.1 IN I I
MAX
MAX
1.0
0.5 Lagging
Table 15. Harmonic Distortion Error
Current Current Min Typ Max Unit
10% of 3
rd
Harmonic
0.05 IN I I
MAX
Table 16. Reverse Phase Sequence Error
Current Voltage Min Typ Max Unit
0.1 I
N
V
N
±0.1 ±0.2 ±0.1 ±0.2 ±0.15 ±0.35 ±0.15 ±0.35 ±0.1 ±0.2 ±0.1 ±0.2
±0.15 ±0.2 ±0.15 ±0.2
±0.05 ±0.1 ±0.05
±0.1
±0.05 ±0.1 ±0.05 ±0.1
±0.05 ±0.1
±0.05
% % % % % %
% %
% %
% %
%
%
Rev. 0 | Page 18 of 24
ADSST-SALEM-3T
Table 17. Voltage Unbalance Error
Current Voltage Min Typ Max Unit
I
N
Table 18. Starting Current
Min Typ Max Unit
0.07 0.1 % of I
VN + 15% V
±0.1 ±0.2
%
N
Rev. 0 | Page 19 of 24
ADSST-SALEM-3T

OUTLINE DIMENSIONS

1.60 MAX
0.75
0.60
0.45
SEATING
PLANE
12° TYP
16.00 BSC SQ
14.00 BSC SQ
1
PIN 1
76100
75
1.45
1.40
1.35
0.15
0.05
10°
6° 2°
SEATING PLANE
ROTATED 90° CCW
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
VIEW A
0.10
0.08 MAX COPLANARITY
TOP VIEW
(PINS DOWN)
0.20
0.09
3.5° 0°
COMPLIANT TO JEDEC STANDARDS MS-026BED
VIEW A
25
26
0.50 BSC
Figure 10. 100-Lead Low Profile Quad Flat Package [LQFP]
(ST-100)
Dimensions shown in millimeters
18.10 (0.7126)
17.70 (0.6969)
28 15
1
1.27 (0.0500) BSC
0.51 (0.0201)
0.31 (0.0122)
14
2.65 (0.1043)
2.35 (0.0925)
SEATING PLANE
7.60 (0.2992)
7.40 (0.2913)
10.65 (0.4193)
10.00 (0.3937)
0.33 (0.0130)
0.20 (0.0079)
0.75 (0.0295)
0.25 (0.0098)
8° 0°
0.27
0.22
0.17
× 45°
1.27 (0.0500)
0.40 (0.0157)
12.00 REF
51
50
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-013AE
Figure 11. 28-Lead Standard Small Outline Package [SOIC]
Wide Body
(RW-28)
Dimensions shown in millimeters and (inches)
Rev. 0 | Page 20 of 24
ADSST-SALEM-3T

ORDERING GUIDE

Part Number
ADSST-EM-3040 0°C to +70°C ADSST-2185MKST-300 ST-100 ADSST-73360LAR RW-28 ADSST-EM-3041 −25°C to +85°C ADSST-2185MBST-266 ST-100 ADSST-73360LAR RW-28
1
For developer’s kit, order ADSST-SALEM-3T-DK.
1
Temperature Range Processors Included Package
Rev. 0 | Page 21 of 24
ADSST-SALEM-3T
NOTES
Rev. 0 | Page 22 of 24
ADSST-SALEM-3T
NOTES
Rev. 0 | Page 23 of 24
ADSST-SALEM-3T
NOTES
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and regis­tered trademarks are the property of their respective owners.
D03738–0–7/04(0)
Rev. 0 | Page 24 of 24
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