Analog Devices ADSP-21060 L d Datasheet

ADSP-2106x SHARC

®

a

SUMMARY
High Performance Signal Processor for Communica-

tions, Graphics, and Imaging Applications

Super Harvard Architecture

Four Independent Buses for Dual Data Fetch,
Instruction Fetch, and Nonintrusive I/O

32-Bit IEEE Floating-Point Computation Units—

Multiplier, ALU, and Shifter

Dual-Ported On-Chip SRAM and Integrated I/O

Peripherals—A Complete System-On-A-Chip

Integrated Multiprocessing Features

KEY FEATURES
40 MIPS, 25 ns Instruction Rate, Single-Cycle Instruction

Execution
120 MFLOPS Peak, 80 MFLOPS Sustained Performance
Dual Data Address Generators with Modulo and Bit-

Reverse Addressing
Efficient Program Sequencing with Zero-Overhead

Looping: Single-Cycle Loop Setup

DSP Microcomputer Family

ADSP-21060/ADSP-21060L

IEEE JTAG Standard 1149.1 Test Access Port and

On-Chip Emulation
240-Lead Thermally Enhanced MQFP Package
225 PBGA Package
32-Bit Single-Precision and 40-Bit Extended-Precision

IEEE Floating-Point Data Formats or 32-Bit Fixed-

Point Data Format

Parallel Computations

Single-Cycle Multiply and ALU Operations in Parallel

with Dual Memory Read/Writes and Instruction Fetch
Multiply with Add and Subtract for Accelerated FFT

Butterfly Computation

4 Mbit On-Chip SRAM

Dual-Ported for Independent Access by Core Processor

and DMA

Off-Chip Memory Interfacing

4 Gigawords Addressable
Programmable Wait State Generation, Page-Mode

DRAM Support

DAG1

8 ⴛ 4 ⴛ 32

BUS

CONNECT

(PX)

CORE PROCESSOR

TIMER

DAG2

8 ⴛ 4 ⴛ 24

PM ADDRESS BUS

DM ADDRESS BUS

DATA

REGISTER

FILE

16 ⴛ 40-BIT

SEQUENCER

PM DATA BUS

DM DATA BUS

BARREL
SHIFTER

INSTRUCTION

CACHE

32 ⴛ 48-BIT

PROGRAM

PROCESSOR PORT

24

32

48

40/32

ALUMULTIPLIER

Figure 1. Block Diagram

DUAL-PORTED SRAM

TWO INDEPENDENT

DUAL-PORTED BLOCKS

ADDR DATA

IOP

REGISTERS

(MEMORY MAPPED)

CONTROL,
STATUS &

DATA BUFFERS

I/O PORT

IOD
48

BLOCK 0

ADDRDATAADDR DATA

ADDRDATA

IOA
17

DMA

CONTROLLER

SERIAL PORTS

LINK PORTS

(2)

(6)

I/O PROCESSOR

BLOCK 1

MULTIPROCESSOR

JTAG

TEST &

EMULATION

EXTERNAL

PORT

ADDR BUS

MUX

INTERFACE

DATA BUS

MUX

HOST PORT

4

6

6

36

7

32

48

SHARC is a registered trademark of Analog Devices, Inc.

REV. D

Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone] World Wide Web Site: http://www.analog.com
Fax: [phone] © Analog Devices, Inc., 2000

ADSP-21060/ADSP-21060L

DMA Controller

10 DMA Channels for Transfers Between ADSP-2106x

Internal Memory and External Memory, External
Peripherals, Host Processor, Serial Ports, or Link
Ports

Background DMA Transfers at 40 MHz, in Parallel with

Full-Speed Processor Execution

Host Processor Interface to 16- and 32-Bit Microprocessors

Host Can Directly Read/Write ADSP-2106x Internal

Memory

TABLE OF CONTENTS

GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . 3

ADSP-21000 FAMILY CORE ARCHITECTURE . . . . . . . 3

ADSP-21060/ADSP-21060L FEATURES . . . . . . . . . . . . . . 4

DEVELOPMENT TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . 7

PIN FUNCTION DESCRIPTIONS . . . . . . . . . . . . . . . . . . 8

TARGET BOARD CONNECTOR FOR EZ-ICE

®

PROBE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

RECOMMENDED OPERATING CONDITIONS (5 V) . 13

ELECTRICAL CHARACTERISTICS (5 V) . . . . . . . . . . . 13

POWER DISSIPATION ADSP-21060 (5 V) . . . . . . . . . . . . 14

RECOMMENDED OPERATING CONDITIONS (3.3 V) 15

ELECTRICAL CHARACTERISTICS (3.3 V) . . . . . . . . . . 15

POWER DISSIPATION ADSP-21060L (3.3 V) . . . . . . . . . 16

ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . 17

TIMING SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . 17

Memory Read—Bus Master . . . . . . . . . . . . . . . . . . . . . . . 20

Memory Write—Bus Master . . . . . . . . . . . . . . . . . . . . . . 21

Synchronous Read/Write—Bus Master . . . . . . . . . . . . . . 22

Synchronous Read/Write—Bus Slave . . . . . . . . . . . . . . . . 24

Multiprocessor Bus Request and Host Bus Request . . . . . 25

Asynchronous Read/Write—Host to ADSP-2106x . . . . . . 27

Three-State Timing—Bus Master, Bus Slave,

HBR, SBTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

DMA Handshake . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Link Ports: 1 × CLK Speed Operation . . . . . . . . . . . . . . 32

Link Ports: 2 × CLK Speed Operation . . . . . . . . . . . . . . 33

Serial Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

JTAG Test Access Port and Emulation . . . . . . . . . . . . . . . 38

OUTPUT DRIVE CURRENTS . . . . . . . . . . . . . . . . . . . . . 39

POWER DISSIPATION . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

TEST CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

ENVIRONMENTAL CONDITIONS . . . . . . . . . . . . . . . . 42

240-LEAD MQFP PIN CONFIGURATIONS . . . . . . . . . . 43

PACKAGE DIMENSIONS (240-Lead MQFP) . . . . . . . . . 44

225-Ball Plastic Ball Grid Array (PBGA)

Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45, 46

PACKAGE DIMENSIONS (225-Ball Grid Array PBGA) . . . 47

ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

FIGURES

Figure 1. ADSP-21060/ADSP-21060L Block Diagram . . . . 1

Figure 2. ADSP-2106x System . . . . . . . . . . . . . . . . . . . . . . . 4

Figure 3. Shared Memory Multiprocessing System . . . . . . . . 6

Figure 4. ADSP-21060/ADSP-21060L Memory Map . . . . . 7

Figure 5. Target Board Connector For ADSP-2106x

EZ-ICE Emulator (Jumpers in Place) . . . . . . . . . . . . . . . 11

EZ-ICE is a registered trademark of Analog Devices, Inc.

Multiprocessing

Glueless Connection for Scalable DSP Multiprocessing

Architecture

Distributed On-Chip Bus Arbitration for Parallel Bus

Connect of Up to Six ADSP-2106xs Plus Host

Six Link Ports for Point-to-Point Connectivity and Array

Multiprocessing
240 Mbytes/s Transfer Rate Over Parallel Bus
240 Mbytes/s Transfer Rate Over Link Ports

Serial Ports

Two 40 Mbit/s Synchronous Serial Ports with

Companding Hardware
Independent Transmit and Receive Functions

Figure 6. JTAG Scan Path Connections for Multiple

ADSP-2106x Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Figure 7. JTAG Clocktree for Multiple ADSP-2106x

Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 8. Clock Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Figure 9. Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Figure 10. Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Figure 11. Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 12. Flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 13. Memory Read—Bus Master . . . . . . . . . . . . . . . . 20

Figure 14. Memory Write—Bus Master . . . . . . . . . . . . . . . 21

Figure 15. Synchronous Read/Write—Bus Master . . . . . . . 23

Figure 16. Synchronous Read/Write—Bus Slave . . . . . . . . . 24

Figure 17. Multiprocessor Bus Request and Host Bus

Request . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Figure 18a. Synchronous REDY Timing . . . . . . . . . . . . . . 27

Figure 18b. Asynchronous Read/Write—Host to

ADSP-2106x . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Figure 19a. Three-State Timing (Bus Transition Cycle,

SBTS Assertion) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Figure 19b. Three-State Timing (Host Transition Cycle) . . 29

Figure 20. DMA Handshake Timing . . . . . . . . . . . . . . . . . 31

Figure 21. Link Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Figure 22. Serial Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Figure 23. External Late Frame Sync . . . . . . . . . . . . . . . . . 37

Figure 24. IEEE 11499.1 JTAG Test Access Port . . . . . . . 38

Figure 25. Output Enable/Disable . . . . . . . . . . . . . . . . . . . 40

Figure 26. Equivalent Device Loading for AC Measurements

(Includes All Fixtures) . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Figure 27. Voltage Reference Levels for AC Measurements

(Except Output Enable/Disable) . . . . . . . . . . . . . . . . . . . 40

Figure 28. ADSP-2106x Typical Drive Currents

= 5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

(V

DD

Figure 29. Typical Output Rise Time (10%–90% V

vs. Load Capacitance (V

= 5 V) . . . . . . . . . . . . . . . . . . . 41

DD

DD

)

Figure 30. Typical Output Rise Time (0.8 V–2.0 V)

vs. Load Capacitance (V

= 5 V) . . . . . . . . . . . . . . . . . . . 41

DD

Figure 31. Typical Output Delay or Hold vs. Load Capacitance

(at Maximum Case Temperature) (V

= 5 V) . . . . . . . . . 41

DD

Figure 32. ADSP-2106x Typical Drive Currents

= 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

(V

DD

Figure 33. Typical Output Rise Time (10%–90% V

vs. Load Capacitance (V

= 3.3 V) . . . . . . . . . . . . . . . . . 41

DD

DD

)

Figure 34. Typical Output Rise Time (0.8 V–2.0 V) vs. Load

Capacitance (V

= 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . 42

DD

Figure 35. Typical Output Delay or Hold vs. Load Capacitance

(at Maximum Case Temperature) (V

= 3.3 V) . . . . . . . . 42

DD

–2–

REV. D

S

GENERAL DESCRIPTION

The ADSP-21060 SHARC—Super Harvard Architecture Com­puter—is a signal processing microcomputer that offers new
capabilities and levels of performance. The ADSP-2106x
SHARCs are 32-bit processors optimized for high performance
DSP applications. The ADSP-2106x builds on the ADSP­21000 DSP core to form a complete system-on-a-chip, adding a
dual-ported on-chip SRAM and integrated I/O peripherals sup­ported by a dedicated I/O bus.

Fabricated in a high speed, low power CMOS process, the
ADSP-2106x has a 25 ns instruction cycle time and operates
at 40 MIPS. With its on-chip instruction cache, the processor
can execute every instruction in a single cycle. Table I shows
performance benchmarks for the ADSP-2106x.

The ADSP-2106x SHARC represents a new standard of inte­gration for signal computers, combining a high performance
floating-point DSP core with integrated, on-chip system features
including a 4 Mbit SRAM memory host processor interface,
DMA controller, serial ports, and link port and parallel bus
connectivity for glueless DSP multiprocessing.

Figure 1 shows a block diagram of the ADSP-2106x, illustrating
the following architectural features:

Computation Units (ALU, Multiplier and Shifter) with a

Shared Data Register File
Data Address Generators (DAG1, DAG2)
Program Sequencer with Instruction Cache
Interval Timer
On-Chip SRAM
External Port for Interfacing to Off-Chip Memory and

Peripherals
Host Port and Multiprocessor Interface
DMA Controller
Serial Ports and Link Ports
JTAG Test Access Port

Figure 2 shows a typical single-processor system. A multi­processing system is shown in Figure 3.

Table I. ADSP-21060/ADSP-21060L Benchmarks (@ 40 MHz)

1024-Pt. Complex FFT 0.46 ms 18,221 cycles

(Radix 4, with Digit Reverse)

FIR Filter (per Tap) 25 ns 1 cycle
IIR Filter (per Biquad) 100 ns 4 cycles
Divide (y/x) 150 ns 6 cycles
Inverse Square Root (1/√x) 225 ns 9 cycles
DMA Transfer Rate 240 Mbytes/s

ADSP-21060/ADSP-21060L

ADSP-21000 FAMILY CORE ARCHITECTURE

The ADSP-2106x includes the following architectural features
of the ADSP-21000 family core. The ADSP-21060 is code- and
function-compatible with the ADSP-21061 and ADSP-21062.

Independent, Parallel Computation Units

The arithmetic/logic unit (ALU), multiplier and shifter all per­form single-cycle instructions. The three units are arranged in
parallel, maximizing computational throughput. Single multi­function instructions execute parallel ALU and multiplier opera­tions. These computation units support IEEE 32-bit single­precision floating-point, extended precision 40-bit floating­point, and 32-bit fixed-point data formats.

ADSP-2106x

DATA

CS

ADDR

DATA

ADDR

DATA

PERIPHERALS

OE

(OPTIONAL)

WE

ACK

CS

DMA DEVICE

(OPTIONAL)

DATA

PROCESSOR

INTERFACE

(OPTIONAL)

ADDR

DATA

BOOT

EPROM

(OPTIONAL)

MEMORY

AND

HOST

1x CLOCK

LINK

DEVICES

(6 MAXIMUM)

(OPTIONAL)

SERIAL
DEVICE

(OPTIONAL)

SERIAL
DEVICE

(OPTIONAL)

CLKIN
EBOOT
LBOOT

3

IRQ

2-0

4

FLAG
TIMEXP

LxCLK
LxACK
LxDAT

TCLK0
RCLK0
TFS0
RSF0
DT0
DR0

TCLK1
RCLK1
TFS1
RFS1
DT1
DR1

RPBA
ID

2-0

RESET JTAG

3-0

3-0

BMS

ADDR

31-0

DATA

47-0

RD

WR

ACK

MS

PAGE

SBTS

SW

ADRCLK

DMAR1-2

DMAG1-2

CS
HBR
HBG

REDY

BR

1-6

CPA

7

ADDRESS

CONTROL

3-0

Figure 2. ADSP-2106x System

Data Register File

A general purpose data register file is used for transferring data
between the computation units and the data buses, and for
storing intermediate results. This 10-port, 32-register (16 pri­mary, 16 secondary) register file, combined with the ADSP­21000 Harvard architecture, allows unconstrained data flow
between computation units and internal memory.

Single-Cycle Fetch of Instruction and Two Operands

The ADSP-2106x features an enhanced Harvard architecture in
which the data memory (DM) bus transfers data and the pro­gram memory (PM) bus transfers both instructions and data
(see Figure 1). With its separate program and data memory
buses and on-chip instruction cache, the processor can simulta­neously fetch two operands and an instruction (from the cache),
all in a single cycle.

REV. D

–3–

ADSP-21060/ADSP-21060L

Instruction Cache

The ADSP-2106x includes an on-chip instruction cache that
enables three-bus operation for fetching an instruction and two
data values. The cache is selective—only the instructions whose
fetches conflict with PM bus data accesses are cached. This
allows full-speed execution of core, looped operations such as
digital filter multiply-accumulates and FFT butterfly processing.

Data Address Generators with Hardware Circular Buffers

The ADSP-2106x’s two data address generators (DAGs) imple­ment circular data buffers in hardware. Circular buffers allow
efficient programming of delay lines and other data structures
required in digital signal processing, and are commonly used in
digital filters and Fourier transforms. The two DAGs of the
ADSP-2106x contain sufficient registers to allow the creation of
up to 32 circular buffers (16 primary register sets, 16 second­ary). The DAGs automatically handle address pointer wrap­around, reducing overhead, increasing performance, and
simplifying implementation. Circular buffers can start and end
at any memory location.

Flexible Instruction Set

The 48-bit instruction word accommodates a variety of parallel
operations, for concise programming. For example, the ADSP­2106x can conditionally execute a multiply, an add, a subtract
and a branch, all in a single instruction.

ADSP-21060/ADSP-21060L FEATURES

Augmenting the ADSP-21000 family core, the ADSP-21060
adds the following architectural features:

Dual-Ported On-Chip Memory

The ADSP-21060 contains four megabits of on-chip SRAM,
organized as two blocks of 2 Mbits each, which can be config­ured for different combinations of code and data storage.
Each memory block is dual-ported for single-cycle, independent
accesses by the core processor and I/O processor or DMA con­troller. The dual-ported memory and separate on-chip buses
allow two data transfers from the core and one from I/O, all in a
single cycle.

On the ADSP-21060, the memory can be configured as a maxi­mum of 128K words of 32-bit data, 256K words of 16-bit data,
80K words of 48-bit instructions (or 40-bit data), or combina­tions of different word sizes up to four megabits. All of the
memory can be accessed as 16-bit, 32-bit, or 48-bit words.

A 16-bit floating-point storage format is supported that effec­tively doubles the amount of data that may be stored on-chip.
Conversion between the 32-bit floating-point and 16-bit floating­point formats is done in a single instruction.

While each memory block can store combinations of code and
data, accesses are most efficient when one block stores data,
using the DM bus for transfers, and the other block stores
instructions and data, using the PM bus for transfers. Using the
DM bus and PM bus in this way, with one dedicated to each
memory block, assures single-cycle execution with two data
transfers. In this case, the instruction must be available in the
cache. Single-cycle execution is also maintained when one of the
data operands is transferred to or from off-chip, via the ADSP­2106x’s external port.

Off-Chip Memory and Peripherals Interface

The ADSP-2106x’s external port provides the processor’s inter­face to off-chip memory and peripherals. The 4-gigaword off­chip address space is included in the ADSP-2106x’s unified
address space. The separate on-chip buses—for PM addresses,
PM data, DM addresses, DM data, I/O addresses, and I/O
data—are multiplexed at the external port to create an external
system bus with a single 32-bit address bus and a single 48-bit
(or 32-bit) data bus.

Addressing of external memory devices is facilitated by on-chip
decoding of high-order address lines to generate memory bank
select signals. Separate control lines are also generated for sim­plified addressing of page-mode DRAM. The ADSP-2106x
provides programmable memory wait states and external
memory acknowledge controls to allow interfacing to DRAM
and peripherals with variable access, hold, and disable time
requirements.

Host Processor Interface

The ADSP-2106x’s host interface allows easy connection to
standard microprocessor buses, both 16-bit and 32-bit, with
little additional hardware required. Asynchronous transfers at
speeds up to the full clock rate of the processor are supported.
The host interface is accessed through the ADSP-2106x’s exter­nal port and is memory-mapped into the unified address space.
Four channels of DMA are available for the host interface; code
and data transfers are accomplished with low software overhead.

The host processor requests the ADSP-2106x’s external bus
with the host bus request (HBR), host bus grant (HBG), and
ready (REDY) signals. The host can directly read and write the
internal memory of the ADSP-2106x, and can access the DMA
channel setup and mailbox registers. Vector interrupt support is
provided for efficient execution of host commands.

DMA Controller

The ADSP-2106x’s on-chip DMA controller allows zero­overhead data transfers without processor intervention. The
DMA controller operates independently and invisibly to the
processor core, allowing DMA operations to occur while the
core is simultaneously executing its program instructions.

DMA transfers can occur between the ADSP-2106x’s internal
memory and either external memory, external peripherals or a
host processor. DMA transfers can also occur between the
ADSP-2106x’s internal memory and its serial ports or link
ports. DMA transfers between external memory and external
peripheral devices are another option. External bus packing to
16-, 32-, or 48-bit words is performed during DMA transfers.

Ten channels of DMA are available on the ADSP-2106x—two
via the link ports, four via the serial ports, and four via the
processor’s external port (for either host processor, other
ADSP-2106xs, memory or I/O transfers). Four additional link
port DMA channels are shared with serial port 1 and the exter­nal port. Programs can be downloaded to the ADSP-2106x
using DMA transfers. Asynchronous off-chip peripherals can
control two DMA channels using DMA Request/Grant lines
(DMAR1-2, DMAG1-2). Other DMA features include inter-
rupt generation upon completion of DMA transfers and DMA
chaining for automatic linked DMA transfers.

–4–

REV. D

ADSP-21060/ADSP-21060L

Serial Ports

The ADSP-2106x features two synchronous serial ports that
provide an inexpensive interface to a wide variety of digital and
mixed-signal peripheral devices. The serial ports can operate at
the full clock rate of the processor, providing each with a maxi­mum data rate of 40 Mbit/s. Independent transmit and receive
functions provide greater flexibility for serial communications.
Serial port data can be automatically transferred to and from
on-chip memory via DMA. Each of the serial ports offers TDM
multichannel mode.

The serial ports can operate with little-endian or big-endian
transmission formats, with word lengths selectable from 3 bits to
32 bits. They offer selectable synchronization and transmit
modes as well as optional µ-law or A-law companding. Serial
port clocks and frame syncs can be internally or externally
generated.

Multiprocessing

The ADSP-2106x offers powerful features tailored to multi­processing DSP systems. The unified address space (see
Figure 4) allows direct interprocessor accesses of each ADSP­2106x’s internal memory. Distributed bus arbitration logic is
included on-chip for simple, glueless connection of systems
containing up to six ADSP-2106xs and a host processor. Master
processor changeover incurs only one cycle of overhead. Bus
arbitration is selectable as either fixed or rotating priority. Bus lock
allows indivisible read-modify-write sequences for semaphores. A
vector interrupt is provided for interprocessor commands. Maxi­mum throughput for interprocessor data transfer is 240 Mbytes/s
over the link ports or external port. Broadcast writes allow simulta­neous transmission of data to all ADSP-2106xs and can be used
to implement reflective semaphores.

Link Ports

The ADSP-2106x features six 4-bit link ports that provide addi­tional I/O capabilities. The link ports can be clocked twice per
cycle, allowing each to transfer eight bits per cycle. Link port
I/O is especially useful for point-to-point interprocessor commu­nication in multiprocessing systems.

The link ports can operate independently and simultaneously,
with a maximum data throughput of 240 Mbytes/s. Link port
data is packed into 32- or 48-bit words, and can be directly read
by the core processor or DMA-transferred to on-chip memory.

Each link port has its own double-buffered input and output
registers. Clock/acknowledge handshaking controls link port
transfers. Transfers are programmable as either transmit or
receive.

Program Booting

The internal memory of the ADSP-2106x can be booted at
system power-up from either an 8-bit EPROM, a host proces­sor, or through one of the link ports. Selection of the boot
source is controlled by the BMS (Boot Memory Select),
EBOOT (EPROM Boot), and LBOOT (Link/Host Boot) pins.
32-bit and 16-bit host processors can be used for booting.

REV. D

–5–

ADSP-21060/ADSP-21060L

ADSP-2106x #6
ADSP-2106x #5
ADSP-2106x #4

011

010

ADSP-2106x #3

CLKIN

RESET

RPBA

3

ID

2-0

CONTROL

ADSP-2106x #2

CLKIN

RESET

RPBA

3

ID

2-0

CONTROL

BR

ADDR

DATA

1-2

ADDR

DATA

BR

1,

, BR

BR

31-0

47-0

CPA

BR

31-0

47-0

CPA

BR

CONTROL

5

4-6

3

5

3-6

2

DATA

ADDRESS

1x

CLOCK

RESET

001

ADSP-2106x #1

CLKIN

RESET

RPBA

3

ID

2-0

CONTROL

ADDR

DATA

ACK

MS

BMS

PAGE

SBTS

ADRCLK

HBR
HBG

REDY

CPA

BR

BR

31-0

47-0

RD

WR

SW

CS

CONTROL

3-0

5

2-6

1

DATA

ADDRESS

ADDR

DATA

OE
WE

ACK

CS

CS

ADDR

DATA

ADDR

DATA

Figure 3. Shared Memory Multiprocessing System

GLOBAL

MEMORY

AND

PERIPHERALS

(OPTIONAL)

BOOT

EPROM

(OPTIONAL)

HOST

PROCESSOR

INTERFACE

(OPTIONAL)

–6–

REV. D

ADSP-21060/ADSP-21060L

INTERNAL

MEMORY

SPACE

MULTIPROCESSOR

MEMORY SPACE

NORMAL WORD ADDRESSING: 32-BIT DATA WORDS
48-BIT INSTRUCTION WORDS

SHORT WORD ADDRESSING: 16-BIT DATA WORDS

IOP REGISTERS

NORMAL WORD ADDRESSING

SHORT WORD ADDRESSING

INTERNAL MEMORY SPACE

OF ADSP-2106x

WITH ID=001

INTERNAL MEMORY SPACE

OF ADSP-2106x

WITH ID=010

INTERNAL MEMORY SPACE

OF ADSP-2106x

WITH ID=011

INTERNAL MEMORY SPACE

OF ADSP-2106x

WITH ID=100

INTERNAL MEMORY SPACE

OF ADSP-2106x

WITH ID=101

INTERNAL MEMORY SPACE

OF ADSP-2106x

WITH ID=110

BROADCAST WRITE

TO ALL

ADSP-2106xs

0x0000 0000

0x0002 0000

0x0004 0000

0x0008 0000

0x0010 0000

0x0018 0000

0x0020 0000

0x0028 0000

0x0030 0000

0x0038 0000

0x003F FFFF

EXTERNAL

MEMORY

SPACE

BANK 0

DRAM

(OPTIONAL)

BANK 1

BANK 2

BANK 3

NONBANKED

0x0040 0000

MS

0

MS

1

MS

2

MS

3

BANK SIZE IS
SELECTED BY
MSIZE BIT FIELD OF
SYSCON
REGISTER.

0xFFFF FFFF

Figure 4. ADSP-21060/ADSP-21060L Memory Map

DEVELOPMENT TOOLS

The ADSP-21060 is supported with a complete set of software
and hardware development tools, including an EZ-ICE
Circuit Emulator, EZ-Kit, and development software. The
SHARC
tion and prototyping. The EZ-Kit contains a PC plug-in card
(EZ-LAB

EZ-Kit is a complete low cost package for DSP evalua-

®

) with an ADSP-21062 (5 V) processor. The EZ-Kit

In-

also includes an optimizing compiler, assembler, instruction
level simulator, run-time libraries, diagnostic utilities and a
complete set of example programs.

The same EZ-ICE hardware can be used for the ADSP-21061/
ADSP-21062, to fully emulate the ADSP-21060, with the excep­tion of displaying and modifying the two new SPORTS registers
unique to ADSP-21061.

Analog Devices ADSP-21000 Family Development Software
includes an easy to use Assembler based on an algebraic syntax,
Assembly Library/Librarian, Linker, instruction-level Simulator,
an ANSI C optimizing Compiler, the CBUG™ C Source—
Level Debugger and a C Runtime Library including DSP and
mathematical functions. The Optimizing Compiler includes
Numerical C extensions based on the work of the ANSI Nu­merical C Extensions Group. Numerical C provides extensions
to the C language for array selections, vector math operations,
complex data types, circular pointers and variably dimensioned

CBUG and SHARCPAC are trademarks of Analog Devices, Inc.
EZ-LAB is a registered trademark of Analog Devices, Inc.

arrays. The ADSP-21000 Family Development Software is
available for both the PC and Sun platforms.

The ADSP-21060 EZ-ICE

Emulator uses the IEEE 1149.1
JTAG test access port of the ADSP-21060 processor to monitor
and control the target board processor during emulation. The
EZ-ICE

provides full-speed emulation, allowing inspection
and modification of memory, registers, and processor stacks.
Nonintrusive in-circuit emulation is assured by the use of the
processor’s JTAG interface—the emulator does not affect target
system loading or timing.

Further details and ordering information are available in the

ADSP-21000 Family Hardware and Software Development Tools

data sheet (ADDS-210xx-TOOLS). This data sheet can be
requested from any Analog Devices sales office or distributor.

In addition to the software and hardware development tools
available from Analog Devices, third parties provide a wide
range of tools supporting the SHARC
ware tools include SHARC
SHARC

VME boards, and daughter and modules with multiple

PC plug-in cards multiprocessor

processor family. Hard-

SHARCs and additional memory. These modules are based on
the SHARCPAC™ module specification. Third Party software
tools include an Ada compiler, DSP libraries, operating systems
and block diagram design tools.

ADDITIONAL INFORMATION

This data sheet provides a general overview of the ADSP-21060
architecture and functionality. For detailed information on the
ADSP-21000 Family core architecture and instruction set, refer
to the ADSP-2106x SHARC User’s Manual, Second Edition.

REV. D

–7–

ADSP-21060/ADSP-21060L

PIN FUNCTION DESCRIPTIONS

ADSP-21060 pin definitions are listed below. All pins are iden­tical on the ADSP-21060 and ADSP-21060L. Inputs identified
as synchronous (S) must meet timing requirements with respect
to CLKIN (or with respect to TCK for TMS, TDI). Inputs
identified as asynchronous (A) can be asserted asynchronously
to CLKIN (or to TCK for TRST).

Unused inputs should be tied or pulled to VDD or GND,
except for ADDR

, DATA

31-0

, FLAG

47-0

, SW, and inputs that

3-0

DRx, TCLKx, RCLKx, LxDAT
TDI)—these pins can be left floating. These pins have a logic­level hold circuit that prevents the input from floating
internally.

A = Asynchronous G = Ground I = Input
O = Output P = Power Supply S = Synchronous
(A/D) = Active Drive (O/D) = Open Drain
T = Three-State (when SBTS is asserted, or when the
ADSP-2106x is a bus slave)

, LxCLK, LxACK, TMS and

3-0

have internal pull-up or pull-down resistors (CPA, ACK, DTx,

Pin Type Function

ADDR

31-0

I/O/T External Bus Address. The ADSP-2106x outputs addresses for external memory and peripherals on

these pins. In a multiprocessor system the bus master outputs addresses for read/writes of the internal
memory or IOP registers of other ADSP-2106xs. The ADSP-2106x inputs addresses when a host
processor or multiprocessing bus master is reading or writing its internal memory or IOP registers.

DATA

47-0

I/O/T External Bus Data. The ADSP-2106x inputs and outputs data and instructions on these pins. 32-bit

single-precision floating-point data and 32-bit fixed-point data is transferred over bits 47–16 of the
bus. 40-bit extended-precision floating-point data is transferred over bits 47–8 of the bus. 16-bit short
word data is transferred over bits 31–16 of the bus. In PROM boot mode, 8-bit data is transferred over
bits 23–16. Pull-up resistors on unused DATA pins are not necessary.

MS

3-0

O/T Memory Select Lines. These lines are asserted (low) as chip selects for the corresponding banks of

external memory. Memory bank size must be defined in the ADSP-2106x’s system control register
(SYSCON). The MS
other address lines. When no external memory access is occurring the MS

lines are decoded memory address lines that change at the same time as the

3-0

lines are inactive; they are

3-0

active however when a conditional memory access instruction is executed, whether or not the condition
is true. MS
multiprocessing system the MS

can be used with the PAGE signal to implement a bank of DRAM memory (Bank 0). In a

0

lines are output by the bus master.

3-0

RD I/O/T Memory Read Strobe. This pin is asserted (low) when the ADSP-2106x reads from external memory

devices or from the internal memory of other ADSP-2106xs. External devices (including other ADSP­2106xs) must assert RD to read from the ADSP-2106x’s internal memory. In a multiprocessing system

RD is output by the bus master and is input by all other ADSP-2106xs.

WR I/O/T Memory Write Strobe. This pin is asserted (low) when the ADSP-2106x writes to external memory

devices or to the internal memory of other ADSP-2106xs. External devices must assert WR to write to
the ADSP-2106x’s internal memory. In a multiprocessing system WR is output by the bus master and
is input by all other ADSP-2106xs.

PAGE O/T DRAM Page Boundary. The ADSP-2106x asserts this pin to signal that an external DRAM page

boundary has been crossed. DRAM page size must be defined in the ADSP-2106x’s memory control
register (WAIT). DRAM can only be implemented in external memory Bank 0; the PAGE signal can
only be activated for Bank 0 accesses. In a multiprocessing system PAGE is output by the bus master.

ADRCLK O/T Clock Output Reference. In a multiprocessing system ADRCLK is output by the bus master.
SW I/O/T Synchronous Write Select. This signal is used to interface the ADSP-2106x to synchronous

memory devices (including other ADSP-2106xs). The ADSP-2106x asserts SW (low) to provide an
early indication of an impending write cycle, which can be aborted if WR is not later asserted (e.g., in a
conditional write instruction). In a multiprocessing system, SW is output by the bus master and is
input by all other ADSP-2106xs to determine if the multiprocessor memory access is a read or write.
SW is asserted at the same time as the address output. A host processor using synchronous writes must
assert this pin when writing to the ADSP-2106x(s).

ACK I/O/S Memory Acknowledge. External devices can deassert ACK (low) to add wait states to an external

memory access. ACK is used by I/O devices, memory controllers, or other peripherals to hold off
completion of an external memory access. The ADSP-2106x deasserts ACK as an output to add wait
states to a synchronous access of its internal memory. In a multiprocessing system, a slave ADSP­2106x deasserts the bus master’s ACK input to add wait state(s) to an access of its internal memory.
The bus master has a keeper latch on its ACK pin that maintains the input at the level it was last
driven to.

–8–

REV. D

ADSP-21060/ADSP-21060L

Pin Type Function

SBTS I/S Suspend Bus Three-State. External devices can assert SBTS (low) to place the external bus address,

data, selects and strobes in a high impedance state for the following cycle. If the ADSP-2106x
attempts to access external memory while SBTS is asserted, the processor will halt and the memory
access will not be completed until SBTS is deasserted. SBTS should only be used to recover from host
processor/ADSP-2106x deadlock, or used with a DRAM controller.

IRQ

2-0

FLAG

3-0

TIMEXP O Timer Expired. Asserted for four cycles when the timer is enabled and TCOUNT decrements to

HBR I/A Host Bus Request. Must be asserted by a host processor to request control of the ADSP-2106x’s

HBG I/O Host Bus Grant. Acknowledges an HBR bus request, indicating that the host processor may take

CS I/A Chip Select. Asserted by host processor to select the ADSP-2106x.

REDY (O/D) O Host Bus Acknowledge. The ADSP-2106x deasserts REDY (low) to add wait states to an asynchro-

DMAR1 I/A DMA Request 1 (DMA Channel 7).
DMAR2 I/A DMA Request 2 (DMA Channel 8).
DMAG1 O/T DMA Grant 1 (DMA Channel 7).
DMAG2 O/T DMA Grant 2 (DMA Channel 8).
BR

6-1

ID

2-0

RPBA I/S Rotating Priority Bus Arbitration Select. When RPBA is high, rotating priority for multiprocessor

CPA (O/D) I/O Core Priority Access. Asserting its CPA pin allows the core processor of an ADSP-2106x bus slave

DTx O Data Transmit (Serial Ports 0, 1). Each DT pin has a 50 kΩ internal pull-up resistor.
DRx I Data Receive (Serial Ports 0, 1). Each DR pin has a 50 kΩ internal pull-up resistor.
TCLKx I/O Transmit Clock (Serial Ports 0, 1). Each TCLK pin has a 50 kΩ internal pull-up resistor.
RCLKx I/O Receive Clock (Serial Ports 0, 1). Each RCLK pin has a 50 kΩ internal pull-up resistor.

I/A Interrupt Request Lines. May be either edge-triggered or level-sensitive.

I/O/A Flag Pins. Each is configured via control bits as either an input or output. As an input, it can be

tested as a condition. As an output, it can be used to signal external peripherals.

zero.

external bus. When HBR is asserted in a multiprocessing system, the ADSP-2106x that is bus master
will relinquish the bus and assert HBG. To relinquish the bus, the ADSP-2106x places the address,
data, select and strobe lines in a high impedance state. HBR has priority over all ADSP-2106x bus
requests (BR

) in a multiprocessing system.

6-1

control of the external bus. HBG is asserted (held low) by the ADSP-2106x until HBR is released. In a
multiprocessing system, HBG is output by the ADSP-2106x bus master and is monitored by all others.

nous access of its internal memory or IOP registers by a host. Open drain output (O/D) by default; can
be programmed in ADREDY bit of SYSCON register to be active drive (A/D). REDY will only be
output if the CS and HBR inputs are asserted.

I/O/S Multiprocessing Bus Requests. Used by multiprocessing ADSP-2106xs to arbitrate for bus master-

ship. An ADSP-2106x only drives its own BRx line (corresponding to the value of its ID

inputs) and

2-0

monitors all others. In a multiprocessor system with less than six ADSP-2106xs, the unused BRx pins
should be pulled high; the processor’s own BRx line must not be pulled high or low because it is an
output.

I Multiprocessing ID. Determines which multiprocessing bus request (BR1 – BR6) is used by ADSP-

2106x. ID = 001 corresponds to BR1, ID = 010 corresponds to BR2, etc. ID = 000 in single-processor
systems. These lines are a system configuration selection which should be hardwired or only changed
at reset.

bus arbitration is selected. When RPBA is low, fixed priority is selected. This signal is a system con­figuration selection which must be set to the same value on every ADSP-2106x. If the value of RPBA is
changed during system operation, it must be changed in the same CLKIN cycle on every ADSP-2106x.

to interrupt background DMA transfers and gain access to the external bus. CPA is an open drain
output that is connected to all ADSP-2106xs in the system. The CPA pin has an internal 5 kΩ pull-up
resistor. If core access priority is not required in a system, the CPA pin should be left unconnected.

REV. D

–9–

ADSP-21060/ADSP-21060L

Pin Type Function

TFSx I/O Transmit Frame Sync (Serial Ports 0, 1).

RFSx I/O Receive Frame Sync (Serial Ports 0, 1).

LxDAT

LxCLK I/O Link Port Clock (Link Ports 0–5). Each LxCLK pin has a 50 kΩ internal pull-down resistor that is

LxACK I/O Link Port Acknowledge (Link Ports 0–5). Each LxACK pin has a 50 kΩ internal pull-down resistor

EBOOT I EPROM Boot Select. When EBOOT is high, the ADSP-2106x is configured for booting from an 8-

LBOOT I Link Boot. When LBOOT is high, the ADSP-2106x is configured for link port booting. When

BMS I/O/T* Boot Memory Select. Output: Used as chip select for boot EPROM devices (when EBOOT = 1,

CLKIN I Clock In. External clock input to the ADSP-2106x. The instruction cycle rate is equal to CLKIN.

RESET I/A Processor Reset. Resets the ADSP-2106x to a known state and begins execution at the program

TCK I Test Clock (JTAG). Provides an asynchronous clock for JTAG boundary scan.
TMS I/S Test Mode Select (JTAG). Used to control the test state machine. TMS has a 20 kΩ internal pull-up

TDI I/S Test Data Input (JTAG). Provides serial data for the boundary scan logic. TDI has a 20 kΩ internal

TDO O Test Data Output (JTAG). Serial scan output of the boundary scan path.

TRST I/A Test Reset (JTAG). Resets the test state machine. TRST must be asserted (pulsed low) after power-

EMU (O/D) O Emulation Status. Must be connected to the ADSP-2106x EZ-ICE target board connector only.

ICSA O Reserved, leave unconnected.

VDD P Power Supply; nominally +5.0 V dc for 5 V devices or +3.3 V dc for 3.3 V devices. (30 pins).

GND G Power Supply Return. (30 pins).

NC Do Not Connect. Reserved pins which must be left open and unconnected.

3-0

I/O Link Port Data (Link Ports 0–5). Each LxCLK pin has a 50 kΩ internal pull-down resistor that is

enabled or disabled by the LPDRD bit of the LCOM register.

enabled or disabled by the LPDRD bit of the LCOM register.

that is enabled or disabled by the LPDRD bit of the LCOM register.

bit EPROM. When EBOOT is low, the LBOOT and BMS inputs determine booting mode. See table
below. This signal is a system configuration selection that should be hardwired.

LBOOT is low, the ADSP-2106x is configured for host processor booting or no booting. See table
below. This signal is a system configuration selection that should be hardwired.

LBOOT = 0). In a multiprocessor system, BMS is output by the bus master. Input: When low, indi­cates that no booting will occur and that ADSP-2106x will begin executing instructions from external
memory. See table below. This input is a system configuration selection that should be hardwired.

*Three-statable only in EPROM boot mode (when BMS is an output).

EBOOT LBOOT BMS Booting Mode

1 0 Output EPROM (Connect BMS to EPROM chip select.)
0 0 1 (Input) Host Processor
0 1 1 (Input) Link Port
0 0 0 (Input) No Booting. Processor executes from external memory.
0 1 0 (Input) Reserved
1 1 x (Input) Reserved

CLKIN may not be halted, changed, or operated below the minimum specified frequency.

memory location specified by the hardware reset vector address. This input must be asserted (low) at
power-up.

resistor.

pull-up resistor.

up or held low for proper operation of the ADSP-2106x. TRST has a 20 kΩ internal pull-up resistor.

–10–

REV. D

ADSP-21060/ADSP-21060L

TARGET BOARD CONNECTOR FOR EZ-ICE PROBE

The ADSP-2106x EZ-ICE Emulator uses the IEEE 1149.1
JTAG test access port of the ADSP-2106x to monitor and control
the target board processor during emulation. The EZ-ICE probe
requires the ADSP-2106x’s CLKIN, TMS, TCK, TRST, TDI,
TDO, EMU, and GND signals be made accessible on the target
system via a 14-pin connector (a 2 row × 7 pin strip header) such
as that shown in Figure 5. The EZ-ICE

probe plugs directly onto
this connector for chip-on-board emulation. You must add this
connector to your target board design if you intend to use the
ADSP-2106x EZ-ICE. The total trace length between the EZ­ICE connector and the furthest device sharing the EZ-ICE
JTAG pins should be limited to 15 inches maximum for guaran­teed operation. This length restriction must include EZ-ICE
JTAG signals that are routed to one or more ADSP-2106x
devices, or a combination of ADSP-2106x devices and other
JTAG devices on the chain.

GND

KEY (NO PIN)

BTMS

BTCK

BTRST

BTDI

GND

12

34

56

78

910

9

11 12

13 14

TOP VIEW

EMU

CLKIN (OPTIONAL)

TMS

TCK

TRST

TDI

TDO

Figure 5. Target Board Connector For ADSP-2106x EZ-ICE
Emulator (Jumpers in Place)

The 14-pin, 2-row pin strip header is keyed at the Pin 3 location —
Pin 3 must be removed from the header. The pins must be

0.025 inch square and at least 0.20 inch in length. Pin spacing
should be 0.1 × 0.1 inches. Pin strip headers are available from
vendors such as 3M, McKenzie and Samtec.

The BTMS, BTCK, BTRST and BTDI signals are provided so
the test access port can also be used for board-level testing.
When the connector is not being used for emulation, place
jumpers between the Bxxx pins and the xxx pins. If the test
access port will not be used for board testing, tie BTRST to GND
and tie or pull BTCK up to VDD. The TRST pin must be
asserted after power-up (through BTRST on the connector) or
held low for proper operation of the ADSP-2106x. None of the
Bxxx pins (Pins 5, 7, 9, 11) are connected on the EZ-ICE

probe.

The JTAG signals are terminated on the EZ-ICE probe as
follows:

Signal Termination

TMS Driven through 22 Ω Resistor (16 mA Driver)
TCK Driven at 10 MHz through 22 Ω Resistor (16 mA

Driver)

TRST* Active Low Driven through 22 Ω Resistor (16 mA

Driver) (Pulled Up by On-Chip 20 kΩ Resistor)

TDI Driven by 22 Ω Resistor (16 mA Driver)
TDO One TTL Load, Split Termination (160/220)
CLKIN One TTL Load, Split Termination (160/220)
EMU Active Low 4.7 kΩ Pull-Up Resistor, One TTL Load

(Open-Drain Output from the DSP)

*TRST is driven low until the EZ-ICE probe is turned on by the emulator at

software start-up. After software start-up, TRST is driven high.

Figure 6 shows JTAG scan path connections for systems that
contain multiple ADSP-2106x processors.

REV. D

JTAG

DEVICE

(OPTIONAL)

TDI

TCK

TDO TDO

TMS

TRST

OTHER

JTAG

CONTROLLER

EZ-ICE

JTAG

CONNECTOR

TCK

TMS

EMU

TRST

TDO

CLKIN

TDI

ADSP-2106x

TDI

TCK

OPTIONAL

#1

TMS

TDO

EMU

TRST

Figure 6. JTAG Scan Path Connections for Multiple ADSP-2106x Systems

–11–

ADSP-2106x

TDI

TCK

n

TMS

EMU

TRST

ADSP-21060/ADSP-21060L

Connecting CLKIN to Pin 4 of the EZ-ICE header is optional.
The emulator only uses CLKIN when directed to perform
operations such as starting, stopping and single-stepping mul­tiple ADSP-21061 in a synchronous manner. If you do not need
these operations to occur synchronously on the multiple proces­sors, simply tie Pin 4 of the EZ-ICE

header to ground.

If synchronous multiprocessor operations are needed and
CLKIN is connected, clock skew between the multiple ADSP­21061/ADSP-21061L processors and the CLKIN pin on the
EZ-ICE

header must be minimal. If the skew is too large, syn-
chronous operations may be off by one or more cycles between
processors. For synchronous multiprocessor operation TCK,

TDI TDO TDI TDO

5k⍀

*

TDI TDO

TDI

EMU

TCK

TMS

TRST

TDO

CLKIN

5k⍀

*

*

OPEN DRAIN DRIVER OR EQUIVALENT, i.e.,

TMS, CLKIN and EMU should be treated as critical signals in
terms of skew, and should be laid out as short as possible on
your board. If TCK, TMS and CLKIN are driving a large num­ber of ADSP-21061 (more than eight) in your system, then
treat them as a clock tree using multiple drivers to minimize
skew. (See Figure 7, JTAG Clock Tree, and Clock Distribution
in the High Frequency Design Considerations section of the
ADSP-2106x User’s Manual, Second Edition.)

If synchronous multiprocessor operations are not needed (i.e.,
CLKIN is not connected), just use appropriate parallel termina­tion on TCK and TMS. TDI, TDO, EMU and TRST are not
critical signals in terms of skew.

For complete information on the SHARC EZ-ICE, see the ADSP-
2100 Family JTAG EZ-ICE User’s Guide and Reference.

TDI TDO

TDI TDO

TDI TDO

EMU

SYSTEM
CLKIN

Figure 7. JTAG Clocktree for Multiple ADSP-2106x Systems

–12–

REV. D

ADSP-21060/ADSP-21060L

ADSP-21060–SPECIFICATIONS

RECOMMENDED OPERATING CONDITIONS (5 V)

K Grade

Parameter Test Conditions Min Max Units

V

DD

T

CASE

V

IH1

V

IH2

V

IL

NOTES

1

Applies to input and bidirectional pins: DATA
CPA, TFS0, TFS1, RFS0, RFS1, LxDAT

2

Applies to input pins: CLKIN, RESET, TRST.

ELECTRICAL CHARACTERISTICS (5 V)

Parameter Test Conditions Min Max Units

V

OH

V

OL

I

IH

I

IL

I

ILP

I

OZH

I

OZL

I

OZHP

I

OZLC

I

OZLA

I

OZLAR

I

OZLS

C

IN

NOTES

11

Applies to output and bidirectional pins: DATA
DMAG2, BR

12

See “Output Drive Currents” for typical drive current capabilities.

13

Applies to input pins: SBTS, IRQ

14

Applies to input pins with internal pull-ups: DR0, DR1, TRST, TMS, TDI.

15

Applies to three-statable pins: DATA
TFSX, RFSX, TDO, EMU. (Note that ACK is pulled up internally with 2 kΩ during reset in a multiprocessor system, when ID
not requesting bus mastership.)

16

Applies to three-statable pins with internal pull-ups: DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1.

17

Applies to CPA pin.

18

Applies to ACK pin when pulled up. (Note that ACK is pulled up internally with 2 kΩ during reset in a multiprocessor system, when ID
ADSP-21060 is not requesting bus mastership).

19

Applies to three-statable pins with internal pull-downs: LxDAT

10

Applies to ACK pin when keeper latch enabled.

11

Applies to all signal pins.

12

Guaranteed but not tested.

Specifications subject to change without notice.

Supply Voltage 4.75 5.25 V
Case Operating Temperature 0 +85 °C
High Level Input Voltage
High Level Input Voltage
Low Level Input Voltage

High Level Output Voltage
Low Level Output Voltage
High Level Input Current
Low Level Input Current
Low Level Input Current
Three-State Leakage Current
Three-State Leakage Current
Three-State Leakage Current
Three-State Leakage Current
Three-State Leakage Current
Three-State Leakage Current
Three-State Leakage Current
Input Capacitance

, CPA, DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1, TFS0, TFS1, RFS0, RFS1, LxDAT

6-1

11, 12

, HBR, CS, DMAR1, DMAR2, ID

2-0

47-0

1

2

1, 2

, ADDR

47-0

, LxCLK, LxACK, EBOOT, LBOOT, BMS, TMS, TDI, TCK, HBR, DR0, DR1, TCLK0, TCLK1, RCLK0, RCLK1.

3-0

1

1

3, 4

3

4

5, 6, 7, 8

5, 9

9

7

10

8

6

, ADDR

47-0

, ADDR

31-0

, MS

@ VDD = max 2.0 VDD + 0.5 V
@ VDD = max 2.2 VDD + 0.5 V
@ VDD = min –0.5 0.8 V

, RD, WR, SW, ACK, SBTS, IRQ

31-0

@ VDD = min, IOH = –2.0 mA
@ VDD = min, IOL = 4.0 mA
@ VDD = max, VIN = V

, FLAG

2-0

max 10 µA

DD

, HBG, CS, DMAR1, DMAR2, BR

3-0

2

2

4.1 V

6-1

0.4 V

@ VDD = max, VIN = 0 V 10 µA
@ VDD = max, VIN = 0 V 150 µA
@ VDD = max, VIN = V

max 10 µA

DD

@ VDD = max, VIN = 0 V 10 µA
@ VDD = max, VIN = V

max 350 µA

DD

@ VDD = max, VIN = 0 V 1.5 mA
@ VDD = max, VIN = 1.5 V 350 µA
@ VDD = max, VIN = 0 V 4.2 mA
@ VDD = max, VIN = 0 V 150 µA
fIN = 1 MHz, T

, MS

31-0

, RD, WR, PAGE, ADRCLK, SW, ACK, FLAG

3-0

, RD, WR, PAGE, ADRCLK, SW, ACK, FLAG

3-0

, RPBA, EBOOT, LBOOT, CLKIN, RESET, TCK.

2-0

, LxCLK, LxACK.

3-0

= 25°C, VIN = 2.5 V 4.7 pF

CASE

, TIMEXP, HBG, REDY, DMAG1,

3-0

, LxCLK, LxACK, BMS, TDO, EMU, ICSA.

3-0

, REDY, HBG, DMAG1, DMAG2, BMS, BR

3-0

= 001 and another ADSP-21060 is

2-0

= 001 and another

2-0

, ID

, RPBA,

2-0

6–1

,

REV. D

–13–

ADSP-21060/ADSP-21060L

POWER DISSIPATION ADSP-21060 (5 V)

These specifications apply to the internal power portion of VDD only. See the Power Dissipation section of this data sheet for calcula­tion of external supply current and total supply current. For a complete discussion of the code used to measure power dissipation, see
the technical note “SHARC Power Dissipation Measurements.”

Specifications are based on the following operating scenarios:

Operation Peak Activity (I

DDINPEAK

) High Activity (I

DDINHIGH

) Low Activity (I

DDINLOW

)

Instruction Type Multifunction Multifunction Single Function

Instruction Fetch Cache Internal Memory Internal Memory

Core Memory Access 2 per Cycle (DM and PM) 1 per Cycle (DM) None

Internal Memory DMA 1 per Cycle 1 per 2 Cycles 1 per 2 Cycles

To estimate power consumption for a specific application, use the following equation where % is the amount of time your program
spends in that state:

%PEAK × I

DDINPEAK

+ %HIGH × I

DDINHIGH

+ %LOW × I

DDINLOW

+ %IDLE × I

= power consumption

DDIDLE

Parameter Test Conditions Max Units

I

DDINPEAK

I

DDINHIGH

I

DDINLOW

I

DDIDLE

NOTESS

1

The test program used to measure I
power measurements made using typical applications are less than specified.

2

I

3

Idle denotes ADSP-21060L state during execution of IDLE instruction.

is a composite average based on a range of high activity code. I

DDINHIGH

Supply Current (Internal)

Supply Current (Internal)

Supply Current (Internal)

Supply Current (Idle)

DDINPEAK

1

2

2

3

represents worst case processor operation and is not sustainable under normal application conditions. Actual internal

tCK = 30 ns, VDD = max 745 mA
t

= 25 ns, VDD = max 850 mA

CK

tCK = 30 ns, VDD = max 575 mA
t

= 25 ns, VDD = max 670 mA

CK

tCK = 30 ns, VDD = max 340 mA

= 25 ns, VDD = max 390 mA

t

CK

VDD = max 200 mA

is a composite average based on a range of low activity code.

DDINLOW

–14–

REV. D

ADSP-21060/ADSP-21060L

ADSP-21060L–SPECIFICATIONS

RECOMMENDED OPERATING CONDITIONS (3.3 V)

K Grade

Parameter Test Conditions Min Max Units

V

DD

T

CASE

V

IH1

V

IH2

V

IL

NOTES

1

Applies to input and bidirectional pins: DATA
CPA, TFS0, TFS1, RFS0, RFS1, LxDAT
RCLK1.

2

Applies to input pins: CLKIN, RESET, TRST.

Supply Voltage 3.15 3.45 V
Case Operating Temperature 0 +85 °C
High Level Input Voltage
High Level Input Voltage
Low Level Input Voltage

1

2

1, 2

, ADDR

47-0

, LxCLK, LxACK, EBOOT, LBOOT, BMS, TMS, TDI, TCK, HBR, DR0, DR1, TCLK0, TCLK1, RCLK0,

3-0

@ VDD = max 2.0 VDD + 0.5 V
@ VDD = max 2.2 VDD + 0.5 V
@ VDD = min –0.5 0.8 V

, RD, WR, SW, ACK, SBTS, IRQ

31-0

, FLAG

2-0

, HBG, CS, DMAR1, DMAR2, BR

3-0

, ID

6-1

2-0

, RPBA,

ELECTRICAL CHARACTERISTICS (3.3 V)

Parameter Test Conditions Min Max Units

, ADDR

1

1

3, 4

3

4

47-0

31-0

@ VDD = min, IOH = –2.0 mA
@ VDD = min, IOL = 4.0 mA
@ VDD = max, VIN = V
@ VDD = max, VIN = 0 V 10 µA

5, 6, 7, 8

5, 9

9

7

10

8

6

, ADDR

, MS

@ VDD = max, VIN = 0 V 150 µA
@ VDD = max, VIN = V
@ VDD = max, VIN = 0 V 10 µA
@ VDD = max, VIN = V
@ VDD = max, VIN = 0 V 1.5 mA
@ VDD = max, VIN = 1.5 V 350 µA
@ VDD = max, VIN = 0 V 4.2 mA
@ VDD = max, VIN = 0 V 150 µA
fIN = 1 MHz, T

, MS

31-0

, RD, WR, PAGE, ADRCLK, SW, ACK, FLAG

3-0

, RD, WR, PAGE, ADRCLK, SW, ACK, FLAG

3-0

, RPBA, EBOOT, LBOOT, CLKIN, RESET, TCK.

2-0

, LxCLK, LxACK.

3-0

= 25°C, VIN = 2.5 V 4.7 pF

CASE

V

OH

V

OL

I

IH

I

IL

I

ILP

I

OZH

I

OZL

I

OZHP

I

OZLC

I

OZLA

I

OZLAR

I

OZLS

C

IN

NOTESS

11

Applies to output and bidirectional pins: DATA

DMAG2, BR

12

See “Output Drive Currents” for typical drive current capabilities.

13

Applies to input pins: SBTS, IRQ

14

Applies to input pins with internal pull-ups: DR0, DR1, TRST, TMS, TDI.

15

Applies to three-statable pins: DATA
TFSX, RFSX, TDO, EMU. (Note that ACK is pulled up internally with 2 kΩ during reset in a multiprocessor system, when ID
not requesting bus mastership.)

16

Applies to three-statable pins with internal pull-ups: DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1.

17

Applies to CPA pin.

18

Applies to ACK pin when pulled up. (Note that ACK is pulled up internally with 2 kΩ during reset in a multiprocessor system, when ID
ADSP-21060 is not requesting bus mastership).

19

Applies to three-statable pins with internal pull-downs: LxDAT

10

Applies to ACK pin when keeper latch enabled.

11

Applies to all signal pins.

12

Guaranteed but not tested.

Specifications subject to change without notice.

High Level Output Voltage
Low Level Output Voltage
High Level Input Current
Low Level Input Current
Low Level Input Current
Three-State Leakage Current
Three-State Leakage Current
Three-State Leakage Current
Three-State Leakage Current
Three-State Leakage Current
Three-State Leakage Current
Three-State Leakage Current
Input Capacitance

, CPA, DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1, TFS0, TFS1, RFS0, RFS1, LxDAT

6-1

11, 12

, HBR, CS, DMAR1, DMAR2, ID

2-0

47-0

2

2

max 10 µA

DD

max 10 µA

DD

max 350 µA

DD

, LxCLK, LxACK, BMS, TDO, EMU, ICSA.

3-0

, REDY, HBG, DMAG1, DMAG2, BMS, BR

3-0

2.4 V

0.4 V

, TIMEXP, HBG, REDY, DMAG1,

3-0

= 001 and another ADSP-21060 is

2-0

= 001 and another

2-0

6–1

,

REV. D

–15–