Analog Devices ADM8696AN, ADM8697ARW, ADM8697ARU, ADM8696ARW, ADM8696ARU Datasheet

Microprocessor
a
FEATURES Upgrade for ADM696/ADM697, MAX696/MAX697 Specified Over Temperature Adjustable Low Line Voltage Monitor Power OK/Reset Time Delay Reset Assertion Down to 1 V V Watchdog Timer—100 ms, 1.6 s, or Adjustable Low Switch On Resistance
0.7 V Normal, 7 V in Backup 400 nA Standby Current Automatic Battery Backup Switching (ADM8696) Fast On-Board Gating of Chip Enable Signals (ADM8697) Voltage Monitor for Power Fail or Low Battery Warning Also Available in TSSOP Package
APPLICATIONS Microprocessor Systems Computers Controllers Intelligent Instruments Automotive Systems Critical mP Power Monitoring
CC
V
BATT
V
CC
LL
OSC IN
OSC SEL
WATCHDOG
INPUT (WDI)
INPUT (PFI)
Supervisory Circuits
ADM8696/ADM8697
FUNCTIONAL BLOCK DIAGRAMS
BATT ON
IN
RESET GENERATOR
TIMEBASE FOR RESET
AND WATCHDOG
WATCHDOG
TRANSITION DETECTOR
1.3V
WATCHDOG
TIMER
ADM8696
V
OUT
LOW LINE
RESET
RESET
WATCHDOG OUTPUT (WDO)
GENERAL DESCRIPTION
The ADM8696/ADM8697 supervisory circuits offer complete single chip solutions for power supply monitoring and battery control functions in microprocessor systems. These functions include µP reset, backup battery switchover, watchdog timer, CMOS RAM write protection and power failure warning.
The ADM8696/ADM8697 are available in 16-pin DIP and small outline packages (including TSSOP) and provide the following functions:
1. Power-On Reset output during power-up, power-down and brownout conditions. The RESET voltage threshold is adjustable using an external voltage divider. The put remains operational with V
as low as 1 V.
CC
RESET out-
2. A Reset pulse if the optional watchdog timer has not been toggled within specified time.
3. Separate watchdog timeout and low line status outputs.
4. Adjustable reset and watchdog timeout periods.
5. A 1.3 V threshold detector for power fail warning, low battery detection or to monitor a power supply other than VCC.
6. Battery backup switching for CMOS RAM, CMOS micro­processor or other low power logic (ADM8696).
7. Write protection of CMOS RAM or EEPROM (ADM8697).
CE
LL
OSC IN
OSC SEL
WATCHDOG
INPUT (WDI)
POWER FAIL
INPUT (PFI)
IN
IN
RESET GENERATOR
TIMEBASE FOR RESET
AND WATCHDOG
WATCHDOG
TIMER
WATCHDOG
TRANSITION DETECTOR
ADM8697
1.3V
CE
OUT
LOW LINE
RESET
RESET
WATCHDOG OUTPUT (WDO)
POWER FAIL OUTPUT (PFO)
The ADM8696/ADM8697 is fabricated using an advanced epitaxial CMOS process combining low power consumption (0.7 mW), extremely fast Chip Enable gating (2 ns) and high re­liability.
RESET assertion is guaranteed with VCC as low as 1 V. In addition, the power switching circuitry is designed for mini­mal voltage drop thereby permitting increased output current drive of up to 100 mA without the need for an external pass transistor.
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Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 617/329-4700 World Wide Web Site: http://www.analog.com Fax: 617/326-8703 © Analog Devices, Inc., 1997
ADM8696/ADM8697–SPECIFICATIONS
P
arameter Min Typ Max Units Test Conditions/Comments
unless otherwise noted.)
(VCC = Full Operating Range, V
= +2.8 V, TA = T
BATT
VCC Operating Voltage Range 3.0 5.5 V V
Operating Voltage Range 2.0 VCC – 0 3 V
BATT
BATTERY BACKUP SWITCHING (ADM8696)
V
Output Voltage VCC – 0.005 VCC – 0.0025 V I
OUT
VCC – 0.2 VCC – 0.125 V I
V
in Battery Backup Mode V
OUT
Supply Current (Excludes I
) 115 200 µAI
OUT
– 0.005 V
BATT
– 0.002 V I
BATT
Supply Current in Battery Backup Mode 0.4 1 µAVCC = 0 V, V Battery Standby Current 5.5 V > VCC > V
= 1 mA
OUT
100 mA
OUT
= 250 µA, VCC < V
OUT
= 100 mA
OUT
BATT
= 2.8 V
+ 0.2 V
BATT
BATT
(+ = Discharge, – = Charge) –0.1 +0.02 µA Battery Switchover Threshold 70 mV Power-Up VCC – V
BATT
50 mV Power-Down Battery Switchover Hysteresis 20 mV BATT ON Output Voltage 0.3 V I BATT ON Output Short Circuit Current 30 mA BATT ON = V
0.5 2.5 25 µA BATT ON = V
= 3.2 mA
SINK
= 2.4 V Sink Current
OUT
, VCC = 0 V, Source Current
OUT
RESET AND WATCHDOG TIMER
Low Line Threshold (LLIN) 1.25 1.3 1.35 V Reset Timeout Delay 35 50 70 ms OSC SEL = HIGH Watchdog Timeout Period, Internal Oscillator 1.0 1.6 2.25 s Long Period
70 100 140 ms Short Period
Watchdog Timeout Period, External Clock 4032 4063 4097 Cycles Long Period
960 1011 1025 Cycles Short Period
Minimum WDI Input Pulse Width 50 ns VIL = 0.8, VIH = 3.75 V, VCC = 5 V
100 ns VIL = 0.8, VIH = 3.5 V, VCC = 5 V
100 ns VIL = 0.8, VIH = 2.6 V, VCC = 3 V RESET Output Voltage @ VCC = +1 V 4 20 mV I RESET, RESET Output Voltage 0.1 0.4 V I
0.1 0.4 V I
3.5 V I
2.7 V I
LOW LINE, WDO Output Voltage 0.4 V I
3.5 V I
2.7 V I Output Short Circuit Source Current 1 10 25 µAVCC = 5 V WDI Input Threshold
1
= 10 µA, VCC = 1 V
SINK
= 400 µA, VCC = 2 V, V
SINK
= 3.2 mA, 3 V < VCC < 5.5 V
SINK
= 1 µA, VCC = 5 V
SOURCE
= 1 µA, VCC = 3 V
SOURCE
= 3.2 mA,
SINK
= 1 µA, VCC = 5 V
SOURCE
= 1 µA, VCC = 3 V
SOURCE
Logic Low 0.8 V Logic High 3.5 V VCC = 5 V
1.2 V VCC = 3 V WDI Input Current 1 10 µA WD1 = V
OUT
, (VCC)
–10 –1 µA WD1 = 0 V
POWER FAIL DETECTOR
PFI Input Threshold 1.2 1.3 1.4 V PFI–LLIN Threshold Difference –50 ±15 +50 mV PFI Input Current –25 ±0.01 +25 nA LLIN Input Current –50 ±0.01 +50 nA PFO Output Voltage 0.4 V I
3.5 V I
2.7 V I
= 3.2 mA
SINK
= 1 µA
SOURCE
= 1 µA, VCC = 3 V
SOURCE
PFO Short Circuit Source Current 1 10 25 µA PFI = Low, PFO = 0 V
CHIP ENABLE GATING (ADM8697)
CE
Threshold 0.8 V V
IN
3.0 V V
IL IH
1.2 V VCC = 3 V
CE
Pull-Up Current 3 µA
IN
CE
Output Voltage 0.4 V I
OUT
VCC – 0.5 V I
= 3.2 mA
SINK SOURCE
= 800 µA
CE Propagation Delay 2 7 ns VCC = 5.0 V
4nsV
= 3.0 V
CC
OSCILLATOR
OSC IN Input Current ±2 µA OSC SEL Input Pull-Up Current 5 µA OSC IN Frequency Range 0 500 kHz OSC SEL = 0 V
OSC IN Frequency with Ext. Capacitor 4 kHz OSC SEL = 0 V, C
NOTE
1
WDI is a three-level input internally biased to 38% of VCC and has an input impedance of approximately 5 M.
= 47 pF
OSC
Specifications subject to change without notice.
–2–
MIN
– 0.2 V
= 0 V
BATT
to T
MAX
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ADM8696/ADM8697
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS*
(TA = +25°C unless otherwise noted)
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V
V
All Other Inputs . . . . . . . . . . . . . . . . . . –0.3 V to V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V
BATT
OUT
+ 0.5 V
Input Current
V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mA
CC
V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
BATT
GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Digital Output Current . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Power Dissipation, N-16 DIP . . . . . . . . . . . . . . . . . . .600 mW
θ
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 135°C/W
JA
Power Dissipation, R-16 SOIC . . . . . . . . . . . . . . . . . .600 mW
θ
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 110°C/W
JA
Operating Temperature Range
Industrial (A Version) . . . . . . . . . . . . . . . . .–40°C to +85°C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . . +300°C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
Storage Temperature Range . . . . . . . . . . . . .–65°C to +150°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum ratings for extended periods of time may affect device reliability.
Power Dissipation, RU-16 TSSOP . . . . . . . . . . . . . . .500 mW
θ
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 158°C/W
JA
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADM8696/ADM8697 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.

ORDERING GUIDE

PIN CONFIGURATIONS
Package
Model Temperature Range Option*
1
V
ADM8696AN –40°C to +85°C N-16 ADM8696ARW –40°C to +85°C R-16 ADM8696ARU –40°C to +85°C RU-16
ADM8697AN –40°C to +85°C N-16 ADM8697ARW –40°C to +85°C R-16 ADM8697ARU –40°C to +85°C RU-16
*N = Plastic DIP; R = Small Outline (Wide Body); RU = Thin Shrink Small
Outline (TSSOP).
BATT
V
OUT
V
GND
BATT ON
LOW LINE
OSC IN
OSC SEL
CC
2
3
ADM8696
4
(Not to Scale)
5 6
7
8
TOP VIEW
16
15 14
13
12
11
10
9
RESET
RESET
WDO LL
IN
NC
WDI
PFO
PFI
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–3–
TEST
V LL
GND
LOW LINE
OSC IN
OSC SEL
NC
CC
IN
1
2
3
ADM8697
4
TOP VIEW
(Not to Scale)
5
6
7
8
16
RESET
15
RESET
14
WDO
13
CE
IN
12
CE
OUT
11
WDI
10
PFO
9
PFI
ADM8696/ADM8697
Pin No.
Mnemonic ADM8696 ADM8697 Function

PIN FUNCTION DESCRIPTION

V V V
CC BATT OUT
3 3 Power Supply Input +3 V to +5 V. 1 Backup Battery Input. 2 Output Voltage, VCC or V
the highest potential. When V threshold, V reset threshold, V RAM. Connect V
is switched to V
CC
is switched to V
BATT
to VCC if V
OUT
is internally switched to V
BATT
is higher than V
CC
. When VCC is lower than V
OUT
OUT
OUT
and V
depending on which is at
OUT
and LLIN is higher than the reset
BATT
. V
can supply up to 100 mA to power CMOS
OUT
are not used.
BATT
and LLIN is below the
BATT
GND 4 5 0 V. Ground reference for all signals. RESET 15 15 Logic Output. RESET goes low whenever LLIN falls below 1.3 V and remains low for 50 ms
after LL abled but not serviced within its timeout period. The
goes above 1.3 V. RESET also goes low for 50 ms if the watchdog timer is en-
IN
RESET pulse width can be adjusted as
shown in Table I.
WDI 11 11 Watchdog Input, WDI is a three level input. If WDI remains either high or low for longer
than the watchdog timeout period,
RESET pulses low and WDO goes low. The timer resets with each transition at the WDI input. The watchdog timer is disabled when WDI is left floating or is driven to midsupply.
PFI 9 9 Power Fail Input. PFI is the noninverting input to the Power Fail Comparator when PFI is
less than 1.3 V,
PFO goes low. Connect PFI to GND or V
OUT
when not used. See Figure 1.
PFO 10 10 Power Fail Output. PFO is the output of the Power Fail Comparator. It goes low when PFI
is less than 1.3 V. The comparator is turned off and V
.
BATT
CE
CE
IN OUT
13 Logic Input. The input to the CE gating circuit. Connect to GND or V — 12 Logic Output. CE
is above 1.3 V. If LLIN is below 1.3 V, CE
is a gated version of the CEIN signal. CE
OUT
OUT
BATT ON 5 Logic Output. BATT ON goes high when V
It goes low when V
is internally switched to VCC. The output typically sinks 7 mA and
OUT
OUT
PFO goes low when VCC is below
OUT
tracks CEIN when LL
OUT
is forced high.
is internally switched to the V
if not used.
input.
BATT
IN
can directly drive the base of an external PNP transistor to increase the output current above the 100 mA rating of V
OUT
.
LOW LINE 6 6 Logic Output. LOW LINE goes low when LLIN falls below 1.3 V. It returns high as soon as
LL
rises above 1.3 V.
IN
RESET 16 16 Logic Output. RESET is an active high output. It is the inverse of
RESET.
OSC SEL 8 8 Logic Oscillator Select Input. When OSC SEL is unconnected or driven high, the internal
oscillator sets the reset time delay and watchdog timeout period. When OSC SEL is low, the external oscillator input, OSC IN, is enabled. OSC SEL has a 3 µA internal pull-up. See Table I and Figure 4.
OSC IN 7 7 Logic Oscillator Input. When OSC SEL is low, OSC IN can be driven by an external clock
to adjust both the reset delay and the watchdog timeout period. The timing can also be adjusted by connecting an external capacitor to this pin. See Table I and Figure 4. When OSC SEL is high or floating, OSC IN selects between fast and slow watchdog timeout periods.
WDO 14 14 Logic Output. The Watchdog Output, WDO, goes low if WDI remains either high or low
for longer than the watchdog timeout period. WDI. If WDI is unconnected or at midsupply, when
LOW LINE goes low.
WDO is set high by the next transition at
WDO remains high. WDO also goes high
NC 12 2 No Connect. It should be left open. LL
IN
13 4 Voltage Sensing Input. The voltage on the low line input, LLIN, is compared with a 1.3 V
reference voltage. This input is normally used to monitor the power supply voltage. The output of the comparator generates a RESET/
RESET output. The comparator output also controls the battery switchover circuitry.
LOW LINE output signal. It also generates a
TEST 1 This is a special test pin using during device manufacture. It should be connected to GND.
–4–
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