ANALOG DEVICES ADG 712 BRZ Datasheet

CMOS Low Voltage, 4 Ω Quad,

FEATURES

1.8 V to 5.5 V single supply
Low on resistance (2.5 Ω Typ)
Low on resistance flatness

−3 dB bandwidth > 200 MHz
Rail-to-rail operation
16-lead TSSOP and SOIC packages
Fast switching times: t
Typical power consumption (< 0.01 μW)
TTL/CMOS compatible
Qualified for automotive applications

APPLICATIONS

USB 1.1 signal switching circuits
Cell phones
PDAs
Battery-powered systems
Communication systems
Sample hold systems
Audio signal routing
Video switching
Mechanical reed relay replacement

=16 ns, t

ON

=10 ns

OFF

SPST Switches

ADG711/ADG712/ADG713

FUNCTIONAL BLOCK DIAGRAM

IN1

IN2

IN3

IN4

ADG711

S1

IN1

D1

S2

IN2

D2

S3

D3

S4

D4

SWITCHES SHOWN FOR A LOGIC “1” I NPUT

ADG712

IN3

IN4

Figure 1.

S1

IN1

D1

S2

IN2

D2

S3

D3

S4

D4

ADG713

IN3

IN4

S1

D1

S2

D2

S3

D3

S4

D4

00042-001

GENERAL DESCRIPTION

The ADG711, ADG712, and ADG713 are monolithic CMOS
devices containing four independently selectable switches. These
switches are designed on an advanced submicron process that
provides low power dissipation yet gives high switching speed, low
on resistance, low leakage currents, and high bandwidth.

They are designed to operate from a single 1.8 V to 5.5 V supply,
making them ideal for use in battery-powered instruments and
with the new generation of DACs and ADCs from Analog Devices,
Inc. Fast switching times and high bandwidth make the parts
suitable for switching USB 1.1 data signals and video signals.

The ADG711, ADG712, and ADG713 contain four independent
single-pole/single-throw (SPST) switches. The ADG711 and

ADG712 differ only in that the digital control logic is inverted. The
ADG711 switches are turned on with a logic low on the appropriate

control input, while a logic high is required to turn on the switches
of the ADG712. The ADG713 contains two switches whose digital
control logic is similar to the ADG711, while the logic is inverted
on the other two switches.

Each switch conducts equally well in both directions when On. The

ADG713 exhibits break-before-make switching action.

The ADG711/ADG712/ADG713 are available in 16-lead TSSOP
and 16-lead SOIC packages.

PRODUCT HIGHLIGHTS

1. 1.8 V to 5.5 V Single-Supply Operation.

The ADG711, ADG712, and ADG713 offer high performance
and are fully specified and guaranteed with 3 V and 5 V
supply rails.

2. Ver y L ow R

At supply voltage of 1.8 V, R
temperature range.

3. Low On Resistance Flatness.

4. −3 dB Bandwidth >200 MHz.

5. Low Power Dissipation. CMOS construction ensures low

power dissipation.

6. Fast t

ON/tOFF

7. Break-Before-Make Switching.

This prevents channel shorting when the switches are
configured as a multiplexer (ADG713 only).

8. 16-Lead TSSOP and 16-Lead SOIC Packages.

(4.5 Ω maximum at 5 V, 8 Ω maximum at 3 V).

ON

is typically 35 Ω over the

ON

.

Rev. B

Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone] www.analog.com
Fax: [phone] ©2004–2011 Analog Devices, Inc. All rights reserved.

ADG711/ADG712/ADG713

TABLE OF CONTENTS

Features.............................................................................................. 1

Applications....................................................................................... 1

Functional Block Diagram .............................................................. 1

General Description ......................................................................... 1

Product Highlights ........................................................................... 1

Revision History ............................................................................... 2

Specifications..................................................................................... 3

Absolute Maximum Ratings............................................................ 5

ESD Caution.................................................................................. 5

REVISION HISTORY

6/11—Rev. A to Rev. B

Updated Format..................................................................Universal

Changes to Features Section............................................................ 1

Changes to Absolute Maximum Ratings Table............................. 5

Changes to Ordering Guide.......................................................... 14

Added Automotive Products Section .......................................... 14

3/04—Rev. 0 to Rev. A

Added Applications.......................................................................... 1

Changes to Ordering Guide............................................................ 4

Updated Outline Dimensions....................................................... 10

Pin Configuration and Function Descriptions..............................6

Typical Performance Characteristics..............................................7

Test Circuits........................................................................................9

Terminology.................................................................................... 11

Applications Information.............................................................. 12

Outline Dimensions....................................................................... 13

Ordering Guide .......................................................................... 14

Automotive Products................................................................. 14

Rev. B | Page 2 of 16

ADG711/ADG712/ADG713

SPECIFICATIONS

VDD = +5 V ± 10%, GND = 0 V. All specifications −40°C to +85°C, unless otherwise noted.

Table 1.

Parameter +25°C −40°C to +85°C Unit Test Conditions/Comments

ANALOG SWITCH

Analog Signal Range 0 V to VDD V
On Resistance (RON) 2.5 Ω typ VS = 0 V to VDD, IS = −10 mA;

4 4.5 Ω max See Figure 11

On Resistance Match Between 0.05 Ω typ VS = 0 V to VDD, IS = −10 mA

Channels (ΔRON) 0.3 Ω max

On Resistance Flatness (R

1.0 Ω max

LEAKAGE CURRENTS VDD = +5.5 V

Source Off Leakage IS (Off) ±0.01 nA typ VS = 4.5 V/1 V, VD = 1 V/4.5 V
±0.1 ±0.2 nA max See Figure 12
Drain Off Leakage ID (Off) ±0.01 nA typ VS = 4.5 V/1 V, VD = 1 V/4.5 V
±0.1 ±0.2 nA max See Figure 12

Channel On Leakage ID, IS (On) ±0.01 nA typ VS = VD = 1 V, or 4.5 V
±0.1 ±0.2 nA max See Figure 13
DIGITAL INPUTS

Input High Voltage, V

Input Low Voltage, V

INH

0.8 V max

INL

Input Current

I

or I

0.005 μA typ VIN = V

INL

INH

±0.1 μA max
DYNAMIC CHARACTERISTICS1

tON 11 ns typ RL = 300 Ω, CL = 35 pF

16 ns max VS = 3 V; see Figure 14

t

6 ns typ RL = 300 Ω, CL = 35 pF

OFF

10 ns max VS = 3 V; see Figure 14

Break-Before-Make Time Delay, tD 6 ns typ RL = 300 Ω, CL = 35 pF

(ADG713 Only) 1 ns min VS1 = VS2 = 3 V; see Figure 15
Charge Injection 3 pC typ VS = 2 V; RS = 0 Ω, CL = 1 nF; see Figure 16
Off Isolation −58 dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz

−78 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 17
Channel-to-Channel Crosstalk −90 dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz; see Figure 18
Bandwidth −3 dB 200 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 19
CS 10 pF typ
CD 10 pF typ
CD, CS (On) 22 pF typ

POWER REQUIREMENTS VDD = +5.5 V

IDD 0.001 μA typ Digital inputs = 0 V or 5 V

1.0 μ max

1

Guaranteed by design, not subject to production test.

) 0.5 Ω typ VS = 0 V to VDD, IS = −10 mA

FLAT(ON)

2.4 V min

or V

INH

INL

Rev. B | Page 3 of 16

ADG711/ADG712/ADG713

VDD = +3 V ± 10%, GND = 0 V. All specifications −40°C to +85°C, unless otherwise noted.

Table 2.

Parameter +25°C −40°C to +85°C Unit Test Conditions/Comments

ANALOG SWITCH

Analog Signal Range 0 V to VDD V
On Resistance (RON) 5 5.5 Ω typ VS = 0 V to VDD, IS = −10 mA;
8 Ω max See Figure 11
On Resistance Match Between 0.1 Ω typ VS = 0 V to VDD, IS = −10 mA

Channels (ΔRON) 0.3 Ω max

On Resistance Flatness (R

LEAKAGE CURRENTS VDD = +3.3 V

Source Off Leakage IS (Off) ±0.01 nA typ VS = 3 V/1 V, VD = 1 V/3 V
±0.1 ±0.2 nA max See Figure 12
Drain Off Leakage ID (Off) ±0.01 nA typ VS = 3 V/1 V, VD = 1 V/ 3 V
±0.1 ±0.2 nA max See Figure 12

Channel On Leakage ID, IS (On) ±0.01 nA typ VS = VD = 1 V, or 3 V
±0.1 ±0.2 nA max See Figure 13
DIGITAL INPUTS

Input High Voltage, V

Input Low Voltage, V

INH

0.4 V max

INL

Input Current

I

or I

0.005 μA typ VIN = V

INL

INH

±0.1 μA max
DYNAMIC CHARACTERISTICS1

tON 13 ns typ RL = 300 Ω, CL = 35 pF

20 ns max VS = 2 V; see Figure 14

t

7 ns typ RL = 300 Ω, CL = 35 pF

OFF

12 ns max VS = 2 V; see Figure 14

Break-Before-Make Time Delay, tD 7 ns typ RL = 300 Ω, CL = 35 pF

(ADG713 Only) 1 ns min VS1 = VS2 = 2 V; see Figure 15
Charge Injection 3 pC typ VS = 1.5 V; RS = 0 Ω, CL = 1 nF; see Figure 16
Off Isolation −58 dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz

−78 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 17

Channel-to-Channel Crosstalk −90 dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz; see Figure 18
Bandwidth −3 dB 200 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 19
CS 10 pF typ
CD 10 pF typ
CD, CS (On) 22 pF typ

POWER REQUIREMENTS VDD = +3.3 V

IDD 0.001 μA typ Digital inputs = 0 V or 3 V

1.0 μ max

1

Guaranteed by design, not subject to production test.

) 2.5 Ω typ VS = 0 V to VDD, IS = −10 mA

FLAT(ON)

2.0 V min

or V

INH

INL

Rev. B | Page 4 of 16

ADG711/ADG712/ADG713

ABSOLUTE MAXIMUM RATINGS

TA = +25°C, unless otherwise noted.

Table 3.

Parameter Rating

VDD to GND −0.3 V to +6 V

Analog, Digital Inputs1

Continuous Current, S or D 30 mA

Peak Current, S or D

Operating Temperature Range −40°C to +85°C

Storage Temperature Range −65°C to +150°C

Junction Temperature 150°C

TSSOP Package, Power Dissipation 430 mW

θJA Thermal Impedance 150°C/W
θJC Thermal Impedance 27°C/W

SOIC Package, Power Dissipation 520 mW

θJA Thermal Impedance 125°C/W
θJC Thermal Impedance 42°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C

Soldering(Pb-Free)

Reflow, Peak Temperature 260(+0/−5)°C
Time at Peak Temperature 20 sec to 40 sec

ESD 2 kV

1

Overvoltages at IN, S or D will be clamped by internal diodes. Currents

should be limited to the maximum ratings given.

−0.3 V to V
30 mA, whichever occurs
first

100 mA (Pulsed at 1 ms,
10% duty cycle maximum)

+0.3 V or

DD

Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.

Only one absolute maximum rating may be applied at any
one time.

ESD CAUTION

Rev. B | Page 5 of 16

ADG711/ADG712/ADG713

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

IN1 1

2

D1

ADG711/

3

S1

ADG712/

4

NC

ADG713

5

GND

6

S4

TOP VIEW

7

D4

(Not to Scale)

IN4 8 IN39

NOTES

1. NC = NO CONNEC T. DO NOT
CONNECT TO THIS PIN.

IN216

15

D2

14

S2

13

V

DD

12

NC

11

S3

10

D3

00042-004

Figure 2. Pin Configuration

Table 4.

Pin Number Mnemonic Description

1 IN1 Digital Control Input. Its logic state controls the status of the Switch S1-D1.
2 D1 Drain Pin. Can be used as input or output.
3 S1 Source Pin. Can be used as input or output.
4 NC Not internally connected.
5 GND The most negative power supply pin.
6 S4 Source Pin. Can be used as input or output.
7 D4 Drain Pin. Can be used as input or output.
8 IN4 Digital Control Input. Its logic state controls the status of the Switch S4-D4.
9 IN3 Digital Control Input. Its logic state controls the status of the Switch S3-D3.
10 D3 Drain Pin. Can be used as input or output.
11 S3 Source Pin. Can be used as input or output.
12 NC Not internally connected.
13 VDD The most positive power supply pin.
14 S2 Source Pin. Can be used as input or output.
15 D2 Drain Pin. Can be used as input or output.
16 IN2 Digital Control Input. Its logic state controls the status of the Switch S3-D3.

Table 5. Truth Table (ADG711/ADG712)

ADG711 In ADG712 In Switch Condition

0 1 On
1 0 Off

Table 6. Truth Table (ADG713)

Logic Switch 1, 4 Switch 2, 3

0 Off On
1 On Off

Rev. B | Page 6 of 16

ADG711/ADG712/ADG713

m

–

–

TYPICAL PERFORMANCE CHARACTERISTICS

6.0

5.5

5.0

4.5

4.0

3.5

(Ω)

3.0

ON

R

2.5

2.0

1.5

1.0

0.5

0

0 0.5 1.0 1.5 2. 0 2.5

DRAIN OR SOURCE VO LTAGE (V)

VDD = 2.7V

VDD = 3.0V

Figure 3. On Resistance as a Function of V

TA = 25°C

VDD = 4.5V

VDD = 5.0V

3.0 3.5 4.0 4.5 5. 0

(VS)

D

00042-005

10

VDD = 5V

1m

100µ

4 SW

8 SW

10k 100k

FREQUENCY (Hz)

(A)

I

SUPPLY

10µ

100n

10n

1µ

1n

100

Figure 6. Supply Current vs. Input Switching Frequency

1M

10M1k

00042-008

6.0

5.5

5.0

4.5

4.0

3.5

(Ω)

3.0

ON

R

2.5

2.0

1.5

1.0

0.5

TA = +85°C

TA = –40°C

0

0 0.5 1.0 1.5 2.0

DRAIN OR SOURCE VO LTAGE (V)

Figure 4. On Resistance as a Function of V

= 3 V

V

DD

6.0

5.5

5.0

4.5

4.0

3.5

(Ω)

3.0

ON

R

2.5

2.0

1.5

1.0

0.5

0

0 0.5 1.0 1.5 2. 0 2.5

TA = +85°C

TA = +25°C

TA = –40°C

DRAIN OR SOURCE VO LTAGE (V)

Figure 5. On Resistance as a Function of V

V

= 5 V

DD

VDD = 3V

TA = +25°C

2.5 3.0

(VS) for Different Temperatures

D

VDD = 5V

3.0 3.5 4.0 4.5 5. 0

(VS) for Different Temperatures

D

30

–40

–50

–60

–70

–80

–90

OFF IS OLATI ON (dB)

–100

–110

–120

–130

10k

00042-006

100k

FREQUENCY (Hz)

VDD = 5V, 3V

1M 100M10M

0042-009

Figure 7. Off Isolation vs. Frequency

30

–40

–50

–60

–70

–80

–90

CROSTALK (d B)

–100

–110

–120

–130

10k

00042-007

100k

FREQUENCY (Hz)

VDD = 5V, 3V

1M 100M10M

0042-010

Figure 8. Crosstalk vs. Frequency

Rev. B | Page 7 of 16

ADG711/ADG712/ADG713

0

VDD = 5V

25

TA = 25°C

20

–2

–4

ON RESPONSE (dB)

–6

10k

100k

1M 100M10M

FREQUENCY (Hz)

00042-011

Figure 9. On Response vs. Frequency

15

10

(pC)

INJ

5

Q

0

–5

–10

0 0.51.01.52.02.53.03.54.04.55.0

VDD = 3V

SOURCE VOLT AGE (V)

VDD = 5V

Figure 10. Charge Injection vs. Source Voltage

00042-012

Rev. B | Page 8 of 16

ADG711/ADG712/ADG713

V

V

V

VS1V

V

TEST CIRCUITS

V

S

Figure 11. On Resistance

I

(OFF) ID (OFF)

S

A

V

S

I

DS

V1

S

RON = V1/I

SD

D

DS

Figure 12. Off Leakage

0.1µF

SD

S

0.1µF

IN

DD

A

V

GND

I

(ON)

SD

V

S

D

A

V

D

0042-015

Figure 13. On Leakage

0042-013

V

D

0042-014

DD

DD

V

OUT

R
300Ω

C

L

L

35pF

Figure 14. Switching Times

V

ADG711

IN

V

ADG712

IN

V

OUT

50% 50%

50%

V

S

90%

t

ON

V

IN

0V

50%

90%

t

OFF

50% 50%

00042-016

V

DD

S1 D1

IN1, IN2

S2 D2

R

L2

300Ω

S2

C

L2

35pF

V

OUT2

R

L1

300Ω

C

L1

35pF

V

ADG713

GND

Figure 15. Break-Before-Make Time Delay, t

DD

V

V

R

S

V

S

IN

DD

SD

GND

C

L

15nF

V

OUT

IN

V

OUT

V

OUT1

V

OUT2

0V

90%

0V

D

= CL × V

Q

INJ

OUT1

SW ON SW OFF

90%

t

D

∆V

OUT

OUT

t

90%

D

90%

00042-017

00042-018

Figure 16. Charge Injection

ADG711/ADG712/ADG713

0.1µF

V

DD

0.1µF

V

DD

V

DD

SD

IN

V

V

S

IN

GND

Figure 17. Off Isolation

V

DD

0.1µF

V

DD

S

V

V

IN1

S

NC

CHANNEL-TO-CHANNEL CROSSTALK = 20 × log |V

S

D

V

D

GND

V

OUT

R

L

50Ω

V

00042-019

V

S

IN

50Ω

IN2

V

OUT

R

L

50Ω

|

S/VOUT

00042-020

V

DD

SD

IN

GND

Figure 19. Bandwidth

R
50Ω

V

OUT

L

00042-021

Figure 18. Channel-to-Channel Crosstalk

Rev. B | Page 10 of 16

ADG711/ADG712/ADG713

TERMINOLOGY

t

RON

Ohmic resistance between D and S.

ΔR

ON

On resistance match between any two channels, ie., R
R

min.

ON

FLAT(ON)

R

max −

ON

Flatness is defined as the difference between the maximum and
minimum value of on resistance as measured over the specified
analog signal range.

I

(OFF)

S

Source leakage current with the switch off.

I

(OFF)

D

Drain leakage current with the switch off.

I

, IS (ON)

D

Channel leakage current with the switch on.

V

)

D (VS

Analog voltage on Terminals D, S.

C

(OFF)

S

Off switch source capacitance.

C

(OFF)

D

Off switch drain capacitance.

C

, CS (ON)

D

On switch capacitance.

ON

Delay between applying the digital control input and the output
switching on.

t

OFF

Delay between applying the digital control input and the output
switching off.

t

D

Off time or on time measured between the 90% points of both
switches, when switching from one address state to another

ADG713 only).

(

Crosstalk

A measure of unwanted signal that is coupled through from one
channel to another as a result of parasitic capacitance.

Off Isolation

A measure of unwanted signal coupling through an off switch.

Charge Injection

A measure of the glitch impulse transferred from the digital
input to the analog output during switching.

Bandwidth

The frequency at which the output is attenuated by 3 dB.

On Response

The frequency response of the on switch.

ADG711/ADG712/ADG713

APPLICATIONS INFORMATION

Figure 20 illustrates a photodetector circuit with programmable
gain. An AD820 is used as the output operational amplifier.
With the resistor values shown in the circuit, and using different
combinations of the switches, gain in the range of 2 to 16 can be
achieved.

C1

R1

33kΩ

+5V

AD820

D1

+2.5V

+5V

R4

240kΩ

240kΩ

D1

R6

120kΩ

120kΩ

D2

R8

120kΩ

D3

R9

120kΩ

D4

R10

120kΩ

(LSB) IN1

IN2

IN3

(MSB) IN4

S1

S2

S3

S4

GND

Figure 20. Photodetector Circuit with Programmable Gain

V

OUT

R2
510kΩ

R5

R7

R3
510kΩ

+2.5V

0042-022

Rev. B | Page 12 of 16

ADG711/ADG712/ADG713

OUTLINE DIMENSIONS

10.00 (0.3937)

9.80 (0.3858)

4.00 (0.1575)

3.80 (0.1496)

0.25 (0.0098)

0.10 (0.0039)

COPLANARIT Y

0.10

CONTROLL ING DIMENSIONS ARE IN MILLI METERS; INCH DIMENSI ONS
(IN PARENTHESES) ARE ROUNDED-O FF MILLIMET ER EQUIVALENTS FOR
REFERENCE ON LY AND ARE NOT APPROPRIATE FOR USE I N DESIGN.

16

1

1.27 (0.0500)
BSC

0.51 (0.0201)

0.31 (0.0122)

COMPLIANT TO JEDEC STANDARDS MS-012-AC

9

6.20 (0.2441)

5.80 (0.2283)

8

1.75 (0.0689)

1.35 (0.0531)

SEATING
PLANE

8°
0°

0.25 (0.0098)

0.17 (0.0067)

0.50 (0.0197)

0.25 (0.0098)

1.27 (0.0500)

0.40 (0.0157)

45°

060606-A

Figure 21. 16-Lead Standard Small Outline Package [SOIC]

Narrow Body

(R-16)

Dimensions shown in millimeters and (inches)

5.10

5.00

4.90

16

4.50

4.40

4.30

PIN 1

0.15

0.05

0.65

BSC

COPLANARITY

COMPLIANT TO JEDEC S TANDARDS MO-153-AB

Figure 22. 16-Lead Thin Shrink Small Outline Package [TSSOP]

9

6.40
BSC

81

1.20
MAX

0.20

SEATING
PLANE

0.09

0.10

0.30

0.19

(RU-16)

Dimensions shown in millimeters

8°
0°

0.75

0.60

0.45

Rev. B | Page 13 of 16

ADG711/ADG712/ADG713

ORDERING GUIDE

1, 2

Model

ADG711BR −40°C to +85°C Standard Small Outline(SOIC) R-16
ADG711BR-REEL −40°C to +85°C Standard Small Outline(SOIC) R-16
ADG711BR-REEL7 −40°C to +85°C Standard Small Outline(SOIC) R-16
ADG711BRZ −40°C to +85°C Standard Small Outline(SOIC) R-16
ADG711BRZ-REEL −40°C to +85°C Standard Small Outline(SOIC) R-16
ADG711BRZ-REEL7 −40°C to +85°C Standard Small Outline(SOIC) R-16
ADG711BRU −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16
ADG711BRU-REEL −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16
ADG711BRU-REEL7 −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16
ADG711BRUZ −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16
ADG711BRUZ-REEL −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16
ADG711BRUZ-REEL7 −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16
ADG711WBRUZ-REEL −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16
ADG712BR −40°C to +85°C Standard Small Outline(SOIC) R-16
ADG712BR-REEL −40°C to +85°C Standard Small Outline(SOIC) R-16
ADG712BR-REEL7 −40°C to +85°C Standard Small Outline(SOIC) R-16
ADG712BRZ −40°C to +85°C Standard Small Outline(SOIC) R-16
ADG712BRZ-REEL −40°C to +85°C Standard Small Outline(SOIC) R-16
ADG712BRZ-REEL7 −40°C to +85°C Standard Small Outline(SOIC) R-16
ADG712BRU −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16
ADG712BRU-REEL −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16
ADG712BRU-REEL7 −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16
ADG712BRUZ −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16
ADG712BRUZ-REEL −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16
ADG712BRUZ-REEL7 −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16
ADG713BR −40°C to +85°C Standard Small Outline(SOIC) R-16
ADG713BRZ −40°C to +85°C Standard Small Outline(SOIC) R-16
ADG713BRZ-REEL −40°C to +85°C Standard Small Outline(SOIC) R-16
ADG713BRZ-REEL7 −40°C to +85°C Standard Small Outline(SOIC) R-16
ADG713BRU −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16
ADG713BRU-REEL −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16
ADG713BRU-REEL7 −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16
ADG713BRUZ −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16
ADG713BRUZ-REEL −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16
ADG713BRUZ-REEL7 −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16

1

Z = RoHS Compliant Part.

2

W = Qualified for Automotive Applications.

Temperature range Package Description Package Option

AUTOMOTIVE PRODUCTS

The AD711W models are available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.

Rev. B | Page 14 of 16

ADG711/ADG712/ADG713

NOTES

Rev. B | Page 15 of 16

ADG711/ADG712/ADG713

NOTES

©2004–2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00042-0-6/11(B)

Rev. B | Page 16 of 16