ANALOG DEVICES ADG 419 BRMZ Datasheet

LC2MOS Precision

S

FEATURES

44 V supply maximum ratings
V

to VDD analog signal range

SS

Low on resistance: <35 Ω
Ultralow power dissipation: < 35 μW
Fast transition time: 160 ns maximum
Break-before-make switching action
Plug-in replacement for DG419

APPLICATIONS

Precision test equipment
Precision instrumentation
Battery-powered systems
Sample hold systems

GENERAL DESCRIPTION

The ADG419 is a monolithic CMOS SPDT switch. This switch
is designed on an enhanced LC
power dissipation yet gives high switching speed, low on resistance,
and low leakage currents.

The on resistance profile of the ADG419 is very flat over the full
analog input range, ensuring excellent linearity and low distortion.
The part also exhibits high switching speed and high signal
bandwidth. CMOS construction ensures ultralow power
dissipation, making the parts ideally suited for portable and
battery-powered instruments.

Each switch of the ADG419 conducts equally well in both
directions when on and has an input signal range that extends
to the supplies. In the off condition, signal levels up to the
supplies are blocked. The ADG419 exhibits break-before-make
switching action.

2

MOS process that provides low

Mini-DIP Analog Switch

ADG419

FUNCTIONAL BLOCK DIAGRAM

D

1

ADG419

SWITCH SHOWN FOR A

LOGIC 1 INPUT

Figure 1.

PRODUCT HIGHLIGHTS

1. Extended Signal Range.

The ADG419 is fabricated on an enhanced LC
process, giving an increased signal range that extends to
the supply rails.

2. Ultralow Power Dissipation.

3. Low R

4. Single-Supply Operation.

For applications where the analog signal is unipolar, the
ADG419 can be operated from a single rail power supply.
The part is fully specified with a single 12 V power supply
and remains functional with single supplies as low as 5 V.

ON

.

S2

IN

7850-001

2

MOS

Rev. B

Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone] www.analog.com
Fax: [phone] ©2009 Analog Devices, Inc. All rights reserved.

ADG419

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications ....................................................................................... 1 

Functional Block Diagram .............................................................. 1

General Description ......................................................................... 1

Product Highlights ........................................................................... 1

Revision History ............................................................................... 2

Specifications ..................................................................................... 3

Dual Supply ................................................................................... 3

Single Supply ................................................................................. 4

REVISION HISTORY

8/09—Rev. B to Rev. C

Updated Format .................................................................. Universal

Changes to Table 1 ............................................................................ 3

Changes to Table 2 ............................................................................ 4

Updated Outline Dimensions ....................................................... 12

Changes to Ordering Guide .......................................................... 13

Absolute Maximum Ratings ............................................................5

ESD Caution...................................................................................5

Pin Configuration and Function Descriptions ..............................6

Typical Performance Characteristics ..............................................7

Test Circuits ........................................................................................9

Terminology .................................................................................... 11

Outline Dimensions ....................................................................... 12

Ordering Guide .......................................................................... 13

Rev. B | Page 2 of 16

ADG419

SPECIFICATIONS

DUAL SUPPLY

VDD = 15 V ± 10%, VSS = −15 V ± 10%, VL = 5 V ± 10%, GND = 0 V, unless otherwise noted.

Table 1.

B Version T Version

−40°C to

Parameter1 +25°C

ANALOG SWITCH

Analog Signal Range

V

+85°C

RON 25 25 Ω typ VD = ±12.5 V, IS = −10 mA
35 45 45 35 45 Ω max VDD = +13.5 V, VSS = −13.5 V
LEAKAGE CURRENTS VDD = +16.5 V, VSS = −16.5 V

Source Off Leakage, IS (Off) ±0.1 ±0.1 nA typ

±0.25 ±5 ±15 ±0.25 ±15 nA max

Drain Off Leakage, ID (Off) ±0.1 ±0.1 nA typ

±0.75 ±5 ±30 ±0.75 ±30 nA max

Channel On Leakage, ID, IS (On) ±0.4 ±0.4 nA typ VS = VD = ±15.5 V; see Figure 13
±0.75 ±5 ±30 ±0.75 ±30 nA max
DIGITAL INPUTS

Input High Voltage, V

Input Low Voltage, V

2.4 2.4 2.4 V min

INH

0.8 0.8 0.8 V max

INL

Input Current

I

or I

±0.005 ±0.005 ±0.005 μA typ VIN = V

INL

INH

±0.5 ±0.5 ±0.5 μA max
DYNAMIC CHARACTERISTICS2

t

160 200 200 145 200 ns max

TRANSITION

Break-Before-Make Time Delay, tD 30 30 ns typ

5 5 ns min

Off Isolation 80 80 dB typ RL = 50 Ω, f = 1 MHz; see Figure 16

Channel-to-Channel Crosstalk 90 70 dB typ RL = 50 Ω, f = 1 MHz; see Figure 17

CS (Off) 6 6 pF typ f = 1 MHz

CD, CS (On) 55 55 pF typ f = 1 MHz

POWER REQUIREMENTS VDD = +16.5 V, VSS = −16.5 V

IDD 0.0001 0.0001 μA typ VIN = 0 V or 5 V

1 2.5 2.5 1 2.5 μA max

ISS 0.0001 0.0001 μA typ

1 2.5 2.5 1 2.5 μA max

IL 0.0001 0.0001 μA typ VL = 5.5 V
1 2.5 2.5 1 2.5 μA max

1

Temperature ranges are as follows: B Version: −40°C to +125°C; T Version: −55°C to +125°C.

2

Guaranteed by design, not subject to production test.

−40°C to
+125°C +25°C

−55°C to
+125°C Unit Test Conditions/Comments

to VDD VSS to VDD

SS

V

= ±15.5 V, VS = ∓15.5 V;

D

see Figure 12

V

= ±15.5 V, VS = ∓15.5 V;

D

see Figure 12

= 300 Ω, CL = 35 pF; VS1 = ±10 V,

R

L

VS2 = ∓10 V; see Figure 14

= 300 Ω, CL = 35 pF;

R

L

= VS2 = ±10 V; see Figure 15

V

S1

INL

or V

INH

Rev. B | Page 3 of 16

ADG419

SINGLE SUPPLY

VDD = 12 V ± 10%, VSS = 0 V, VL = 5 V ± 10%, GND = 0 V, unless otherwise noted.

Table 2.

Parameter1 +25°C

B Version T Version

−40°C to
+85°C

−40°C to
+125°C +25°C

−55°C to
+125°C Unit Test Conditions/Comments

ANALOG SWITCH

Analog Signal Range 0 to VDD 0 to VDD V

RON 40 40 Ω typ VD = 3 V, 8.5 V, IS = −10 mA
60 70 70 Ω max VDD = 10.8 V
LEAKAGE CURRENT VDD = 13.2 V

Source OFF Leakage, IS (Off) ±0.1 ±0.1 nA typ

±0.25 ±5 ±15 ±0.25 ±15 nA max

Drain OFF Leakage, ID (Off) ±0.1 ±0.1 nA typ

±0.75 ±5 ±30 ±0.75 ±30 nA max

Channel ON Leakage, ID, IS (On) ±0.4 ±0.4 nA typ VS = VD = 12.2 V/1 V; see Figure 13
±0.75 ±5 ±30 ±0.75 ±30 nA max
DIGITAL INPUTS

Input High Voltage, V

Input Low Voltage, V

2.4 2.4 2.4 V min

INH

0.8 0.8 0.8 V max

INL

Input Current

I

or I

±0.005 ±0.005 ±0.005 μA typ VIN = V

INL

INH

±0.5 ±0.5 ±0.5 μA max
DYNAMIC CHARACTERISTICS2

t

180 250 250 170 250 ns max

TRANSITION

Break-Before-Make Time Delay, tD 60 60 ns typ

Off Isolation 80 80 dB typ RL = 50 Ω, f = 1 MHz; see Figure 16

Channel-to-Channel Crosstalk 90 70 dB typ RL = 50 Ω, f = 1 MHz; see Figure 17

CS (Off) 13 13 pF typ f = 1 MHz

CD, CS (On) 65 65 pF typ f = 1 MHz
POWER REQUIREMENTS VDD = 13.2 V

IDD 0.0001 0.0001 μA typ VIN = 0 V or 5 V

1 2.5 2.5 1 2.5 μA max

IL 0.0001 0.0001 μA typ VL = 5.5 V
1 2.5 2.5 1 2.5 μA max

1

Temperature ranges are as follows: B Version: −40°C to +125°C; T Version: −55°C to +125°C.

2

Guaranteed by design, not subject to production test.

= 12.2 V/1 V, VS = 1 V/12.2 V;

V

D

see Figure 12

= 12.2 V/1 V, VS = 1 V/12.2 V;

V

D

see Figure 12

or V

INL

= 300 Ω, CL = 35 pF; VS1 = 0 V/8 V,

R

L

= 8 V/0 V; see Figure 14

V

S2

= 300 Ω, CL = 35 pF;

R

L

V

= VS2 = 8 V; see Figure 15

S1

INH

Rev. B | Page 4 of 16

ADG419

ABSOLUTE MAXIMUM RATINGS

TA= 25°C unless otherwise noted.

Table 3.

Parameter Rating

VDD to VSS 44 V
VDD to GND −0.3 V to +25 V
VSS to GND +0.3 V to −25 V
VL to GND −0.3 V to VDD + 0.3 V
Analog, Digital Inputs1

Continuous Current, S or D 30 mA
Peak Current, S or D (Pulsed at 1 ms,

10% Duty-Cycle Maximum)

Operating Temperature Range

Industrial (B Version) −40°C to +125°C

Extended (T Version) −55°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
CERDIP Package, Power Dissipation 600 mW

θJA, Thermal Impedance 110°C/W

Lead Temperature, Soldering (10 sec) 300°C
PDIP Package, Power Dissipation 400 mW

θJA, Thermal Impedance 100°C/W

Lead Temperature, Soldering (10 sec) 260°C
SOIC Package, Power Dissipation 400 mW

θJA, Thermal Impedance 155°C/W
MSOP Package, Power Dissipation 315 mW

θJA, Thermal Impedance 205°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C

1

Overvoltages at IN, S or D is clamped by internal diodes. Limit current to the

maximum ratings given.

− 2 V to VDD + 2 V

V

SS

or 30 mA, whichever
occurs first

100 mA

Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.

ESD CAUTION

Rev. B | Page 5 of 16

ADG419

G

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

8

S2

7

V

SS

6

IN

V

5

L

07850-002

S1

ND

V

DD

1

D

2

3

4

ADG419

TOP VIEW

(Not to Scale)

Figure 2. Pin Configuration

Table 4. Pin Function Description

Pin No. Mnemonic Description

1 D Drain terminal. May be an input or an output.
2 S1 Source terminal. May be an input or an output.
3 GND Ground (0 V) reference.
4 VDD Most positive power supply potential.
5 VL Logic power supply (5 V).
6 IN Logic control input.
7 VSS

Most negative power supply potential in dual-supply applications. In single-supply applications, it may be
connected to GND.

8 S2 Source terminal. May be an input or an output.

Table 5. Truth Table

Logic Switch 1 Switch 2

0 On Off
1 Off On

Rev. B | Page 6 of 16

ADG419

TYPICAL PERFORMANCE CHARACTERISTICS

50

40

TA = 25°C

VDD = +5V
V

= –5V

SS

100

T

= 25°C

A

VDD = 5V

= 0V

80

V

SS

30

(Ω)

ON

R

20

VDD = +12V
V

= –12V

SS

10

0

–15 –10 –5 0 5 10 15

VDD = +10V

V

= –10V

SS

VS, VD (V)

VDD = +15V
V

= –15V

SS

Figure 3. RON as a Function of VD (VS), Dual-Supply Voltage

50

VDD = +15V
V

= –15V

SS

V

= +5V

L

40

30

(Ω)

ON

R

20

10

0

–15 –10 –5 0 5 10 15

85°C

125°C

25°C

VS, VD (V)

Figure 4. RON as a Function of VD (VS) for Different Temperatures

0.02

0.01

VDD = +15V

= –15V

V

SS

= 25°C

T

A

IS (OFF)

ID (ON)

60

(Ω)

ON

R

40

20

0

01105

07850-003

VDD = 10V

= 0V

V

SS

VS, VD (V)

VDD = 12V
V

SS

VDD = 15V

= 0V

V

SS

= 0V

5

07850-006

Figure 6. RON as a Function of VD (VS), Single-Supply Voltage

100

VDD = 12V

= 0V

V

SS

= 5V

V

L

80

60

(Ω)

ON

R

40

20

0

0369

07850-004

125°C

85°C

VS, VD (V)

25°C

12

07850-007

Figure 7. RON as a Function of VD (VS) for Different Temperatures

0.006
VDD = 12V

= 0V

V

SS

= 25°C

T

0.004

A

ID (ON)

0

–0.01

LEAKAGE CURRENT (n A)

–0.02

–0.03

–15 –10 –5 0 5 10 15

VS, VD (V)

ID (OFF)

Figure 5. Leakage Currents as a Function of VS (VD)

07850-005

Rev. B | Page 7 of 16

IS (OFF)

0.002

0

LEAKAGE CURRENT (n A)

–0.002

–0.004

024681012

ID (OFF)

VS, VD (V)

Figure 8. Leakage Currents as a Function of VS (VD)

07850-008

ADG419

A

10m

VDD = +15V
V

1mA

V

100µA

10µA

SUPPLY

I

1µA

100nA

10nA

1nA

100 1k 10k 100k 1M 10M

Figure 9. Supply Current (I

SS

= +5V

L

= –15V

I+, I–

I

L

FREQUENCY (Hz)

) vs. Input Switching Frequency

SUPPLY

07850-009

220

200

180

(ns)

160

140

TRANSITI ON

t

120

100

80

611412108

Figure 10. Transition Time (t

DUAL SUPPLY

V

= ±5V

IN

SUPPLY VOLTAGE (V)

) vs. Power Supply Voltage

TRANSITION

SINGLE SUPPLY

V

= 0V/+5V

IN

6

07850-010

Rev. B | Page 8 of 16

ADG419

V

V

V

V

V

TEST CIRCUITS

I

DS

V1

S

D

S

= V1/I

R

ON

DS

Figure 11. On Resistance

07850-011

IS(OFF) ID(OFF)

AA

V

S

SD

V

D

07850-012

Figure 12. Off Leakage

SD

V

S

Figure 13. On Leakage

+15

+5

V

V

S1

V

S1

S2

V

S2

IN

V

IN

GND

L

DD

V

–15V

D

R

L

300Ω

SS

C

L

35pF

V

OUT

Figure 14. Transition Time, t

V

IN

OUTPUT

3V

0V

t

TRANSITI ON

50% 50%

90%

TRANSITION

t

TRANSITI ON

90%

07850-014

+15

+5

ID(ON)

A

V

D

07850-013

V

V

L

DD

S1

V

S1

S2

V

S2

IN

V

IN

GND

V

–15V

D

R

L

300Ω

SS

C

L

35pF

V

OUT

ADDRESS
DRIVE (V

Figure 15. Break-Before-Make Time Delay, t

3V

)

IN

0V

t

0.9V

O

D

0.9VO0.9V

D

V

OUT

t

D

0.9V

O

O

7850-015

Rev. B | Page 9 of 16

ADG419

V

V

V+5V

+15

0.1µF0.1µF

V

V

DD

0.1µF

V

–15V

L

D

SS

50Ω

V

IN

|

OUT

07850-017

+15V+5

0.1µF

V

SS

–15V

V

0.1µF

L

D

R
50Ω

V

S

V

OUT

L

07850-016

V

OUT

R

L

50Ω

CHANNEL-TO-CHANNEL CROSSTAL K = 20 × log | VS/V

0.1µF

V

DD

S

IN

S

GND

V

IN

Figure 16. Off Isolation

S1

S2

GND

Figure 17. Crosstalk

Rev. B | Page 10 of 16

ADG419

TERMINOLOGY

C

(Off)

VDD

Most positive power supply potential.

V

SS

Most negative power supply potential in dual-supply applications.
In single-supply applications, it may be connected to GND.

V

L

Logic power supply (5 V).

GND

Ground (0 V) reference.

S

Source terminal. May be an input or an output.

D

Drain terminal. May be an input or an output.

IN

Logic control input.

R

ON

Ohmic resistance between D and S.

I

(Off)

S

Source leakage current with the switch off.

I

(Off)

D

Drain leakage current with the switch off.

I

, IS (On)

D

Channel leakage current with the switch on.

V

(VS)

D

Analog voltage on terminals D, S.

S

Off switch source capacitance.

C

, CS (On)

D

On switch capacitance.

t

TRANSITION

Delay time between the 50% and 90% points of the digital
inputs and the switch on condition when switching from one
address state to another.

t

D

Off time or on time measured between the 90% points of both
switches when switching from one address state to the other.

V

INL

Maximum input voltage for Logic 0.

V

INH

Minimum input voltage for Logic 1.

I

(I

)

INL

INH

Input current of the digital input.

Crosstalk

A measure of unwanted signal that is coupled through from one
channel to another as a result of parasitic capacitance.

Off Isolation

A measure of unwanted signal coupling through an off channel.

I

DD

Positive supply current.

I

SS

Negative supply current.

Rev. B | Page 11 of 16

ADG419

OUTLINE DIMENSIONS

0.400 (10.16)

0.365 (9.27)

0.355 (9.02)

0.210 (5.33)

0.150 (3.81)

0.130 (3.30)

0.115 (2.92)

0.022 (0.56)

0.018 (0.46)

0.014 (0.36)

MAX

8

1

0.100 (2.54)

0.070 (1.78)

0.060 (1.52)

0.045 (1.14)

BSC

5

4

0.280 (7.11)

0.250 (6.35)

0.240 (6.10)

0.015
(0.38)
MIN

SEATING
PLANE

0.005 (0.13)
MIN

0.060 (1.52)
MAX

0.015 (0.38)
GAUGE

PLANE

0.325 (8.26)

0.310 (7.87)

0.300 (7.62)

0.430 (10.92)
MAX

0.195 (4.95)

0.130 (3.30)

0.115 (2.92)

0.014 (0.36)

0.010 (0.25)

0.008 (0.20)

CONTROLL ING DIMENS IONS ARE IN INCHES; MILLIMETER DI MENSIONS
(IN PARENTHESES) ARE ROUNDED-OF F INCH EQUI VALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRI ATE FOR USE IN DESIGN.
CORNER LEADS MAY BE CONFIGURED AS WHOL E OR HALF LEADS.

COMPLIANT TO JEDEC STANDARDS MS-001

070606-A

Figure 18. 8-Lead Plastic Dual In-Line Package [PDIP]

Narrow Body

(N-8)

Dimensions shown in inches and (millimeters)

0.005 (0.13)

0.200 (5.08)
MAX

0.200 (5.08)

0.125 (3.18)

0.023 (0.58)

0.014 (0.36)

CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

Figure 19. 8-Lead Ceramic Dual In-Line Package [CERDIP]

Dimensions shown in inches and (millimeters)

0.055 (1.40)

MIN

14

0.100 (2.54) BSC

0.405 (10.29) MAX

MAX

58

0.070 (1.78)

0.030 (0.76)

0.310 (7.87)

0.220 (5.59)

0.060 (1.52)

0.015 (0.38)

0.150 (3.81)
MIN

SEATING
PLANE

(Q-8)

0.320 (8.13)

0.290 (7.37)

15°

0°

0.015 (0.38)

0.008 (0.20)

Rev. B | Page 12 of 16

ADG419

0

0

0

.95
.85
.75

0.15

0.00

COPLANARITY

3.20

3.00

2.80

8

5

4

SEATING
PLANE

5.15

4.90

4.65

1.10 MAX

0.23

0.08

3.20

3.00

1

2.80

PIN 1

0.65 BSC

0.38

0.22

0.10

COMPLIANT TO JEDEC STANDARDS MO -187-AA

8°
0°

0.80

0.60

0.40

Figure 20. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

5.00 (0.1968)

4.80 (0.1890)

4.00 (0.1574)

3.80 (0.1497)

0.25 (0.0098)

0.10 (0.0040)

COPLANARITY

0.10
SEATING

PLANE

85

1

1.27 (0.0500)
BSC

6.20 (0.2441)

5.80 (0.2284)

4

1.75 (0.0688)

1.35 (0.0532)

0.51 (0.0201)

0.31 (0.0122)

8°
0°

0.25 (0.0098)

0.17 (0.0067)

0.50 (0.0196)

0.25 (0.0099)

1.27 (0.0500)

0.40 (0.0157)

45°

CONTROLL ING DIMENSI ONS ARE IN MILLIMETERS; INCH DI MENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRI ATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-012-A A

012407-A

Figure 21. 8-Lead Standard Small Outline Package [SOIC_N]

Narrow Body (R-8)

Dimensions shown in millimeters and (inches)

ORDERING GUIDE

Model Temperature Range Package Description Package Option Branding

ADG419BN −40°C to +125°C 8-Lead Plastic Dual In-Line Package [PDIP] N-8
ADG419BNZ1 −40°C to +125°C 8-Lead Plastic Dual In-Line Package [PDIP] N-8
ADG419BR −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8
ADG419BR-REEL −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8
ADG419BR-REEL7 −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8
ADG419BRZ1 −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8
ADG419BRZ-REEL1 −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8
ADG419BRZ-REEL71 −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8
ADG419BRM −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SBB
ADG419BRM-REEL −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SBB
ADG419BRM-REEL7 −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SBB
ADG419BRMZ1 −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SBB#
ADG419BRMZ-REEL1 −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SBB#
ADG419BRMZ-REEL71 −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SBB#
ADG419TQ −55°C to +125°C 8-Lead Ceramic Dual In-Line Package [CERDIP] Q-8

1

Z = RoHS Compliant Part, # denotes that RoHS compliant part is top or bottom marked.

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ADG419

NOTES

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ADG419

NOTES

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ADG419

NOTES

©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07850-0-8/09(B)

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