Ultralow power, high performance transceiver
Frequency bands: 902 MHz to 958 MHz
Data rates supported: 1 kbps to 300 kbps
2.2 V to 3.6 V power supply
Single-ended and differential power amplifiers (PAs)
Low IF receiver with programmable IF bandwidths
100 kHz, 150 kHz, 200 kHz, 300 kHz
Receiver sensitivity (BER)
−116 dBm at 1.0 kbps, 2FSK, GFSK
−107.5 dBm at 38.4 kbps, 2FSK, GFSK
−106.5 dBm at 50 kbps, 2FSK, GFSK
−105 dBm at 100 kbps, 2FSK, GFSK
−104 dBm at 150 kbps, GFSK, GMSK
−103 dBm at 200 kbps, GFSK, GMSK
−100.5 dBm at 300 kbps, GFSK, GMSK
Very low power consumption
12.8 mA in PHY_RX mode (maximum front-end gain)
11.9 mA in PHY_RX mode (AGC off, ADC off)
24.1 mA in PHY_TX mode (10 dBm output, single-ended PA)
0.75 µA in PHY_SLEEP mode (32 kHz RC oscillator active)
1.28 µA in PHY_SLEEP mode (32 kHz XTAL oscillator active)
0.33 µA in PHY_SLEEP mode (Deep Sleep Mode 1)
RF output power of −20 dBm to +13.5 dBm (single-ended PA)
RF output power of −20 dBm to +10 dBm (differential PA)
Patented fast settling automatic frequency control (AFC)
Digital received signal strength indication (RSSI)
Integrated PLL loop filter and Tx/Rx switch
Fast automatic voltage controlled oscillator ( VCO) calibration
Automatic synthesizer bandwidth optimization
On-chip, low power, custom 8-bit processor
Radio control
Packet management
Smart wake mode
SPORT mode support
High speed synchronous serial interface to Tx and Rx Data
for direct interfacing to processors and DSPs
Packet management support
Highly flexible for a wide range of packet formats
Insertion/detection of preamble/sync word/CRC/address
Manchester and 8b/10b data encoding and decoding
Data whitening
Smart wake mode
Current saving low power mode with autonomous receiver
acceleration and key sizes of 128 bits, 192 bits, and
256 bits
Reed-Solomon error correction with hardware acceleration
240-byte packet buffer for Tx/Rx data
Efficient SPI control interface with block read/write access
Integrated battery alarm and temperature sensor
Integrated RC and 32.768 kHz crystal oscillator
On-chip, 8-bit ADC
5 mm × 5 mm, 32-lead, LFCSP package
APPLICATIONS
Smart metering
IEEE 802.15.4g
Home automation
Process and building control
Wireless sensor networks (WSNs)
Wireless healthcare
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without n otice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
ADF7023-J Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
The ADF7023-Jis a very low power, high performance, highly
integrated 2FSK/GFSK/MSK/GMSK transceiver designed for
operation in the 902 MHz to 958 MHz frequency band, which
covers the ARIB Standard T96 band at 950 MHz. Data rates
from 1 kbps to 300 kbps are supported.
The transmit RF synthesizer contains a VCO and a low noise
fractional-N phase locked loop (PLL) with an output channel
frequency resolution of 400 Hz. The VCO operates at twice the
fundamental frequency to reduce spurious emissions. The receive
and transmit synthesizer bandwidths are automatically, and
independently, configured to achieve optimum phase noise,
modulation quality, and settling time. The transmitter output
power is programmable from −20 dBm to +13.5 dBm, with
automatic PA ramping to meet transient spurious specifications.
The part possesses both single-ended and differential PAs, which
allow for Tx antenna diversity.
The receiver is exceptionally linear, achieving an IP3 specification
of −12.2 dBm and −11.5 dBm at maximum gain and minimum
gain, respectively, and an IP2 specification of 18.5 dBm and 27 dBm
at maximum gain and minimum gain, respectively. The receiver
achieves an interference blocking specification of 66 dB at a
±2 MHz offset and 74 dB at a ±10 MHz offset. Thus, the part
is extremely resilient to the presence of interferers in spectrally
noisy environments. The receiver features a novel, high speed,
AFC loop, allowing the PLL to find and correct any RF frequency
errors in the recovered packet. A patent pending image rejection
calibration scheme is available by downloading the image rejection
calibration firmware module to program RAM. The algorithm
does not require the use of an external RF source nor does it
require any user intervention once initiated. The results of the
Rev. A | Page 4 of 104
Figure 1.
calibration can be stored in nonvolatile memory for use on
subsequent power-ups of the transceiver.
The ADF7023-J operates with a power supply range of 2.2 V to
3.6 V and has very low power consumption in both Tx and Rx
modes, enabling long lifetimes in battery-operated systems while
maintaining excellent RF performance. The device can enter a
low power sleep mode in which the configuration settings are
retained in the battery backup random access memory (BBRAM).
The ADF7023-J features an ultralow power, on-chip,
communications processor. The communications processor,
which is an 8-bit RISC processor, performs the radio control,
packet management, and smart wake mode (SWM) functionality.
The communications processor eases the processing burden of
the companion processor by integrating the lower layers of a
typical communication protocol stack. The communications
processor also permits the download and execution of firmware
modules. Available modules include image rejection (IR)
calibration, advanced encryption standard (AES) encryption,
and Reed-Solomon coding. These firmware modules are available
online at ftp://ftp.analog.com/pub/RFL/FirmwareModules.
The communications processor provides a simple command-based
radio control interface for the host processor. A single-byte command
transitions the radio between states or performs a radio function.
The communications processor provides support for generic
packet formats. The packet format is highly flexible and fully
programmable, thereby ensuring its compatibility with proprietary
packet profiles. In transmit mode, the communications processor
can be configured to add preamble, sync word, and CRC to the
payload data stored in packet RAM. In receive mode, the
Data Sheet ADF7023-J
communications processor can detect and interrupt the host
processor on reception of preamble, sync word, address, and CRC
and store the received payload to packet RAM. The ADF7023-J
uses an efficient interrupt system comprising MAC level interrupts
and PHY level interrupts that can be individually set. The payload
data plus the 16-bit CRC can be encoded/decoded using
Manchester or 8b/10b encoding. Alternatively, data whitening
and dewhitening can be applied.
The SWM allows the ADF7023-J to wake up autonomously from
sleep using the internal wake-up timer without intervention from
the host processor. After wake-up, the ADF7023-J is controlled
by the communications processor. This functionality allows
carrier sense, packet sniffing, and packet reception while the
host processor is in sleep, thereby reducing overall system current
consumption. The smart wake mode can wake the host processor
on an interrupt condition. These interrupt conditions can be
configured to include the reception of valid preamble, sync
word, CRC, or address match. Wake -up from sleep mode can
also be triggered by the host processor. For systems requiring
very accurate wake-up timing, a 32 kHz oscillator can be used
to drive the wake-up timer. Alternatively, the internal RC oscillator
can be used, which gives lower current consumption in sleep.
The ADF7023-J features an AES engine with hardware
acceleration that provides 128-bit block encryption and
decryption with key sizes of 128 bits, 192 bits, and 256 bits.
Both electronic code book (ECB) and Cipher Block Chaining
Mode 1 (CBC Mode 1) are supported. The AES engine can be
used to encrypt/decrypt packet data and can be used as a standalone engine for encryption/decryption by the host processor.
The AES engine is enabled on the ADF7023-J by downloading
the AES firmware module to program RAM.
An on-chip, 8-bit ADC provides readback of an external analog
input, the RSSI signal, or an integrated temperature sensor. An
integrated battery voltage monitor raises an interrupt flag to the
host processor whenever the battery voltage drops below a userdefined threshold.
Rev. A | Page 5 of 104
ADF7023-J Data Sheet
600 kHz
−116.3
dBc/Hz
130 kHz closed-loop bandwidth1
transmit, and receive, 2FSK/GFSK/MSK/GMSK
Integer Boundary Spurious3
N = 35 or 36
SPECIFICATIONS
VDD = VDDBAT1 = VDDBAT2 = 2.2 V to 3.6 V, GND = 0 V, TA = T
V
= 3 V and TA = 25°C.
DD
RF AND SYNTHESIZER SPECIFICATIONS
Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
RF CHARACTERISTICS
Frequency Range 902 958 MHz
PHASE-LOCKED LOOP
Channel Frequency Resolution 396.7 Hz
Phase Noise at Offset of PA output power = 10 dBm, RF frequency = 950 MHz
Crystal Frequency 26 MHz Parallel load resonant crystal
Recommended Load Capacitance 7 18 pF
Maximum Crystal ESR 1800 Ω 26 MHz crystal with 18 pF load capacitance
Pin Capacitance 2.1 pF Capacitance for XOSC26P and XOSC26N
Start-Up Time 310 µs 26 MHz crystal with 7 pF load capacitance
388 µs 26 MHz crystal with 18 pF load capacitance
1
130 kHz closed-loop bandwidth recommended for T96/15.4 g, 50 kbps and 100 kbps data rates (see Table 31).
2
223 kHz closed-loop bandwidth recommended for T96/15.4 g, 200 kbps data rate (see Table 31).
3
As the 26 MHz XTAL is fixed, integer boundary spurs occur at 910 MHz and 936 MHz (N = 35 and N = 36).
Rev. A | Page 6 of 104
Data Sheet ADF7023-J
DATA RATE
100 kbps
28.9 dB
Modulation index = 1
3
Minimum Power
−20 dBm
TRANSMITTER SPECIFICATIONS
Table 2.
Parameter Min Typ Max Unit Test Conditions/Comments
2FSK/GFSK/MSK/GMSK 1 300 kbps
Data Rate Resolution 100 bps
MODULATION ERROR RATIO (MER)1 RF frequency = 957.2 MHz, GFSK
10 kbps to 49.5 kbps 25.4 dB Modulation index = 1
49.6 kbps to 129.5 kbps 25.3 dB Modulation index = 1
129.6 kbps to 179.1 kbps 23.9 dB Modulation index = 0.5
179.2 kbps to 239.9 kbps 23.3 dB Modulation index = 0.5
240 kbps to 300 kbps 23 dB Modulation index = 0.5
MODULATION ERROR RATIO 15.4 g DATA RAT ES With T96 look-up table (LUT)2
50 kbps 25.4 dB Modulation index = 1
200 kbps 25.9 dB Modulation index = 1
100 kbps 24.3 dB Modulation index = 0.5
MODULATION
2FSK/GFSK/MSK/GMSK Frequency Deviation0.1409.5 kHz
Deviation Frequency Resolution 100 Hz
Gaussian Filter Bandwidth-Time (BT) Product 0.5
SINGLE-ENDED PA
Maximum Power
Minimum Power −20 dBm
Transmit Power Variation vs. Temperature ±0.5 dB From −40°C to +85°C, RF frequency =
Transmit Power Variation vs. VDD ±1 dB From 2.2 V to 3.6 V, RF frequency = 958.0 MHz
Transmit Power Flatness ±1 dB From 902 MHz to 928 MHz and 950 MHz to
Programmable Step Size
−20 dBm to +13.5 dBm 0.5 dB Programmable in 63 steps
DIFFERENTIAL PA
Maximum Power
13.5 dBm Programmable, separate PA and LNA
match
4
958.0 MHz
958 MHz
3
10 dBm Programmable
Transmit Power Variation vs. Temp erature ±1 dB From −40°C to +85°C, RF frequency =
Transmit Power Variation vs. VDD ±2 dB From 2.2 V to 3.6 V, RF frequency = 958.0 MHz
Transmit Power Flatness ±1 dB From 902 MHz to 928 MHz and 950 MHz to
Programmable Step Size
−20 dBm to +10 dBm 0.5 dB Programmable in 63 steps
958.0 MHz
958 MHz
Rev. A | Page 7 of 104
ADF7023-J Data Sheet
Parameter Min Typ Max Unit Test Conditions/Comments
SPURIOUS EMISSIONS Measured as per TELEC T-245 for T96
compliance, 950 MHz to 958 MHz band,
single-ended PA with combined output. For
spurious emissions compliance in the
1.8845 GHz to 1.9196 GHz frequency band,
a seventh-order PA harmonic filter is used.
This has an insertion loss of up to 1.5 dB.
30 MHz to 710 MHz −65 dBm/100 kHz
710 MHz to 945 MHz −63 dBm/1 MHz
945 MHz to 950 MHz −66 dBm/100 kHz
958 MHz to 960 MHz −60.7 dBm/100 kHz DR = 100 kbps, MI = 1, n = 2, fC = 957.3 MHz
960 MHz to 1 GHz −64 dBm/100 kHz
1 GHz to 1.215 GHz −72 dBm/1 MHz
1.215 GHz to 1.8845 GHz −76 dBm/1 MHz
1.8845 GHz to 1.9196 GHz5 −69 dBm/1 MHz
1.9196 GHz to 3 GHz −66 dBm/1 MHz
3 GHz to 5 GHz −69 dBm/1 MHz
Maximum < 1 GHz −66 dBm At antenna input, unfiltered conductive
Maximum > 1 GHz −62 dBm At antenna input, unfiltered conductive
1
Sensitivity for combined matching network case is typically 1 dB less than separate matching networks.
2
Follow the matching and layout guidelines to achieve the relevant ARIB-T96/TELEC T-245 specifications.
Rev. A | Page 11 of 104
ADF7023-J Data Sheet
Rx AND Tx TIMING PARAMETERS
See the State Transition and Command
INH
INL
DD
INH/IINL
LOGIC OUTPUTS
Output Low Voltage, VOL
0.1 V
Maximum Output Current
5
mA
TIMING AND DIGITAL SPECIFICATIONS
Table 4.
Parameter Min Typ Max Unit Test Conditions/Comments
Timing section for more details
PHY_ON to PHY_RX (on CMD_PHY_RX) 300 µs Includes VCO calibration and synthesizer
settling
PHY_ON to PHY_TX (on CMD_PHY_TX) 296 µs Includes VCO calibration and synthesizer
settling, does not include PA ramp-up
LOGIC INPUTS
Input High Voltage, V
Input Low Voltage, V
Input Current, I
Input Capacitance, CIN 10 pF
Output High Voltage, VOH VDD − 0.4 V IOH = 500 µA
Output Low Voltage, VOL 0.4 V IOL = 500 µA
GPIO Rise/Fall 5 ns
GPIO Load 10 pF
Maximum Output Current 5 mA
ATB OUTPUTS Used for external PA and LNA control
ADCIN_ATB3 and ATB4
Output High Voltage, VOH 1.8 V
0.7 × VDD V
0.2 × V
±1 µA
V
Maximum Output Current 0.5 mA
XOSC32KP_GP5_ATB1 and XOSC32KN_ATB2
Output High Voltage, VOH VDD V
Output Low Voltage, VOL 0.1 V
Rev. A | Page 12 of 104
Data Sheet ADF7023-J
32 kHz RC OSCILLATOR
Hardware Timer
(calibrated at +25°C)
±3 °C
Overtemperature range −12°C to +79°C
AUXILARY BLOCK SPECIFICATIONS
Table 5.
Parameter Min Typ Max Unit Test Conditions/Comments
Frequency 32.768 kHz After calibration
Frequency Accuracy 1.5 % After calibration at 25°C
Frequency Drift
Temperature Coefficient 0.14 %/°C
Voltage Coefficient 4 %/V
Calibration Time 1.25 ms
32 kHz XTAL OSCILLATOR
Frequency 32.768 kHz
Start-Up Time 630 ms 32.768 kHz crystal with 7 pF load capacitance
WAKE UP CONTROLLER (WUC)
Wake-Up Period 61 × 10−6 1.31 × 105 sec
Firmware Timer
Wake-Up Period 1 216 Hardware
periods
ADC Maximum input voltage at ADCIN_ATB3 is 1.8 V
Resolution 8 Bits
DNL ±1 LSB VDD from 2.2 V to 3.6 V, TA = 25°C
INL ±1 LSB VDD from 2.2 V to 3.6 V, TA = 25°C
Conversion Time 1
Input Capacitance 12.4 pF
BATTERY MONITOR
Absolute Accuracy ±45 mV
Alarm Voltage Setpoint 1.7 2.7 V
Alarm Voltage Step Size 62 mV 5-bit resolution
Start-Up Time 100 µs
Current Consumption 30 µA When enabled
TEMPERATURE SENSOR
Range −40 +85 °C
Resolution 0.3 °C With averaging
Accuracy of Single Temperature
Readback
±4 °C Overtemperature range −36°C to +84°C
+7/−4 °C Overtemperature range −40°C to +85°C
µs
Firmware counter counts of the number of
hardware wake-ups, resolution of 16 bits
(calibrated at +25°C)
(calibrated at +25°C)
Rev. A | Page 13 of 104
ADF7023-J Data Sheet
TEMPERATURE RANGE, TA
−40 +85
°C
Differential PA, 915 MHz
PHY_OFF
1
mA
Device in PHY_OFF state, 26 MHz oscillator running, digital
GENERAL SPECIFICATIONS
Table 6.
Parameter Min Typ Max Unit Test Conditions/Comments
VOLTAGE SUPPLY
VDD 2.2 3.6 V Applied to VDDBAT1 and VDDBAT2
TRANSMIT CURRENT CONSUMPTION
Single-Ended PA, 915 MHz
−10 dBm 10.3 mA
0 dBm 13.3 mA
10 dBm 24.1 mA
13.5 dBm 32.1 mA
−10 dBm 9.3 mA
0 dBm 12 mA
5 dBm 16.7 mA
10 dBm 28 mA
In the PHY_TX state, single-ended PA matched to 50 Ω,
differential PA matched to 100 Ω, separate single-ended PA
and LNA match, combined differential PA and LNA match
retained
retained
values retained (BBRAM)
values retained (BBRAM)
and synthesizer regulators active, all register values retained
PHY_ON 1 mA Device in PHY_ON state, 26 MHz oscillator running, digital,
synthesizer, VCO, and RF regulators active, baseband filter
calibration performed, all register values retained
PHY_RX (ADC, AGC Off ) 11.9 mA Device in PHY_Rx state, ADC off, manual AGC gain
PHY_RX (ADC, AGC On) 12.8 mA Device in PHY_RX state
SMART WAKE MODE Average current consumption
21.78 µA Autonomous reception every 1 sec, with receive dwell
time of 1.25 ms, using RC oscillator, data rate = 38.4 kbps
11.75 µA Autonomous reception every 1 sec, with receive dwell
time of 0.5 ms, using RC oscillator, data rate = 300 kbps
Rev. A | Page 14 of 104
Data Sheet ADF7023-J
t7 5 ns min
MOSI to SCLK rising edge setup time
t13
20
ns max
SCLK rise time
t
11
t
9
t4t
5
t
13
t
3
t
2
t
14
t
6
t
8
t
7
CS
SCLK
MISO
MOSI
7765432107
BIT 7BIT 6BIT 5BIT 4 BIT 3BIT 2BIT 1BIT 0BIT 7BIT 0XBIT 7
09555-002
SPI STATE
CS
SCLK
MISO
SLEEPWAKE UPSPI READY
X
012345
t
9
67
t
6
t
12
09555-003
TIMING SPECIFICATIONS
VDD = VDDBAT1 = VDDBAT2 = 2.2 V to 3.6 V, V
Table 7. SPI Interface Timing
Parameter Limit Unit Test Conditions/Comments
t2 85 ns min
t3 85 ns min SCLK high time
t4 85 ns min SCLK low time
t5 170 ns min SCLK period
t6 10 ns max SCLK falling edge to MISO delay
t8 5 ns min MOSI to SCLK rising edge hold time
t9 85 ns min SCLK falling edge to CS hold time
t11 270 ns min
t12 310 µs typ
t14 20 ns max SCLK fall time
Timing Diagrams
= GND = 0 V, TA = T
GND
low to SCLK setup time
CS
high time
CS
low to MISO high wake-up time, 26 MHz crystal with 7 pF load capacitance, T
CS
MIN
to T
, unless otherwise noted.
MAX
= 25°C
A
Figure 2. SPI Interface Timing
Figure 3. PHY_SLEEP to SPI Ready State Timing (SPI Ready T12 After Falling Edge of
Rev. A | Page 15 of 104
CS
)
ADF7023-J Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Connect the exposed paddle
of the LFCSP package to ground.
Table 8.
Parameter Rating
VDDBAT1, VDDBAT2 to GND −0.3 V to +3.96 V
Operating Temperature Range
Industrial −40°C to +85°C
Storage Temperature Range −65°C to +125°C
Maximum Junction Temperature 150°C
LFCSP θJA Thermal Impedance 26°C/W
Reflow Soldering
Peak Temperature 260°C
Time at Peak Temperature 40 sec
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
This device is a high performance, RF integrated circuit with an
ESD rating of <2 kV; it is ESD sensitive. Take proper precautions
for handling and assembly.
ESD CAUTION
Rev. A | Page 16 of 104
Data Sheet ADF7023-J
NOTES
1. NC = NO CONNECT. DO NOT CONNECT T O THIS PIN.
2. CONNECT E X P OSED PAD TO GND.
24
CS
23
MOSI
22
SCLK
21
MISO
20
IRQ_GP3
19
GP2
18
GP1
17
G
P0
1
2
3
4
5
6
7
8
CREGRF1
RBIAS
CREGRF2
RFIO_1P
RFIO_1N
RFO2
VDDBAT2
NC
9
10111213141516
CREGVCO
VCOGUARD
CREGSYNTH
CWAKEUP
XOSC26P
XOSC26N
DGUARD
CREGDIG1
32313029282726
25
ADCVREF
ATB4
ADCIN_ATB3
VDDBAT1
XOSC32KN_ATB2
XOSC32KP_GP5_ATB1
CREGDIG2
GP4
TOP VIEW
(Not to S cale)
ADF7023-J
EPAD
09555-004
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 4. Pin Configuration
Table 9. Pin Function Descriptions
Pin No. Mnemonic Description
1 CREGRF1 Regulator Voltage for RF. A 220 nF capacitor should be placed between this pin and ground for
regulator stability and noise rejection.
2 RBIAS External Bias Resistor. A 36 kΩ resistor with 2% tolerance should be used.
3 CREGRF2 Regulator Voltage for RF. A 220 nF capacitor should be placed between this pin and ground for
regulator stability and noise rejection.
4 RFIO_1P LNA Positive Input in Receive Mode. PA p ositive output in transmit mode with differential PA.
5 RFIO_1N LNA Negative Input in Receive Mode. PA negative output in transmit mode with differential PA.
6 RFO2 Single-Ended PA Output.
7 VDDBAT2 Power Supply Pin Two. Decoupling capacitors to the ground plane should be placed as close as
possible to this pin.
8 NC No Connect.
9 CREGVCO Regulator Voltage for the VCO. A 220 nF capacitor should be placed between this pin and ground for
regulator stability and noise rejection.
10 VCOGUARD Guard/Screen for VCO. This pin should be connected to Pin 9.
11 CREGSYNTH Regulator Voltage for the Synthesizer. A 220 nF capacitor should be placed between this pin and
ground for regulator stability and noise rejection.
12 CWAKEUP External Capacitor for Wake-Up Control. A 150 nF capacitor should be placed between this pin and
ground.
13 XOSC26P The 26 MHz reference crystal should be connected between this pin and XOSC26N.
14 XOSC26N The 26 MHz reference crystal should be connected between this pin and XOSC26P.
15 DGUARD Internal Guard/Screen for the Digital Circuitry. A 220 nF capacitor should be placed between this pin
and ground.
16 CREGDIG1 Regulator Voltage for Digital Section of the Chip. A 220 nF capacitor should be placed between this
17 GP0 Digital GPIO Pin 0.
18 GP1 Digital GPIO Pin 1.
19 GP2 Digital GPIO Pin 2.
20 IRQ_GP3 Interrupt Request, Digital GPIO Test Pin 3. An RC filter should be placed between this pin and the
pin and ground for regulator stability and noise rejection. This can be achieved by shorting it to
Pin 15 and sharing the capacitor to ground.
host processor. Recommended values are R = 1.1 kΩ and C = 1.5 nF.
Rev. A | Page 17 of 104
ADF7023-J Data Sheet
Pin No. Mnemonic Description
21 MISO Serial Port Master In/Slave Out.
22 SCLK Serial Port Clock.
23 MOSI Serial Port Master Out/Slave In.
24
25 GP4 Digital GPIO Test Pin 4.
26 CREGDIG2 Regulator Voltage for Digital Section of the Chip. A 220 nF capacitor should be placed between this
27 XOSC32KP_GP5_ATB1 Digital GPIO Test Pin 5. A 32 kHz watch crystal can be connected between this pin and
28 XOSC32KN_ATB2 A 32 kHz watch crystal can be connected between this pin and XOSC32KP_GP5_ATB1. Analog Test
29 VDDBAT1 Digital Power Supply Pin One. Decoupling capacitors to the ground plane should be placed as close
30 ADCIN_ATB3 Analog-to-Digital Converter Input. Can be configured as an external PA enable signal. Analog Test
31 ATB4 Analog Test Pin 4. Can be configured as an external LNA enable signal.
32 ADCVREF ADC Reference Output. A 220 nF capacitor should be placed between this pin and ground for
EPAD The exposed package paddle must be connected to GND.
Chip Select (Active Low). A pull-up resistor of 100 kΩ to VDD is recommended to prevent the host
CS
processor from inadvertently waking the ADF7023-Jfrom sleep.
pin and ground for regulator stability and noise rejection.
Figure 41. Mean RSSI Error (via Automatic End of Packet RSSI Measurement)
vs. RF Input Power vs. Data Rate; RF Frequency = 950 MHz, GFSK, 100 RSSI
Measurements at Each Input Power Level
Figure 42. RSSI With and Without Cosine Polynomial Correction (via
Automatic End of Packet RSSI Measurement), 100 RSSI Measurements at
Each Input Power Level
Figure 44. Receiver Eye Diagram Measured Using the Test DAC,
RF Frequency = 915 MHz, RF Input Power = −80 dBm,
Data Rate = 100 kbps, Frequency Deviation = 50 kHz
Figure 45. Rx Sensitivity vs. Modulation Index, Data Rate = 50 kbps,
MOD = GFSK, F
= ±(MI × 2 5 kHz), Data = PRBS9, BER = 1E − 3,
DEV
Bits = 1E + 6, V
= 3.0 V, Temperature = 25°C
BAT
Figure 43. Temperature Sensor Readback vs. Die Temperature, Readback
Value Converted to °C via Formula in the Temperature Sensor Section
Figure 46. Rx Sensitivity vs. Modulation Index, Data Rate = 100 kbps,
MOD = GFSK (0.5), F
Bits = 2E + 5, V
Rev. A | Page 25 of 104
= ±(MI × 50 kHz), Data = PRBS9, BER = 1E − 3,
DEV
= 3.0 V, Temperature = 25°C
BAT
ADF7023-J Data Sheet
TERMINOLOGY
ADC
Analog-to-digital converter
AGC
Automatic gain control
AFC
Automatic frequency control
Battmon
Battery monitor
BBRAM
Battery backup random access memory
CBC
Cipher block chaining
CRC
Cyclic redundancy check
DR
Data rate
ECB
Electronic code book
ECC
Error checking code
2FSK
Two -level frequency shift keying
GFSK
Two -level Gaussian frequency shift keying
GMSK
Gaussian minimum shift keying, GFSK with modulation index = 0.5
LO
Local oscillator
MAC
Media access control
MCR
Modem configuration random access memory
MER
Modulation error ratio
MSK
Minimum shift keying, 2FSK with modulation index = 0.5
NOP
No operation
PA
Power amplifier
PFD
Phase frequency detector
PHY
Physical layer
RCO
RC oscillator
RISC
Reduced instruction set computer
RSSI
Receive signal strength indicator
Rx
Receive
SAR
Successive approximation register
SWM
Smart wake mode
Tx
Transmit
VCO
Volt a ge c ontrolled oscillator
WUC
Wake -up controller
XOSC
Crystal oscillator
Rev. A | Page 26 of 104
Data Sheet ADF7023-J
issuing CMD_HW_RESET
RADIO CONTROL
The ADF7023-J has five radio states designated PHY_SLEEP,
PHY_OFF, PHY_ON, PHY_TX, and PHY_RX. The host processor
can transition the ADF7023-J between states by issuing single
byte commands over the SPI interface. The various commands
and states are illustrated in Figure 47. The communications
processor handles the sequencing of various radio circuits and
critical timing functions, thereby simplifying radio operation
and easing the burden on the host processor.
RADIO STATES
PHY_SLEEP
In this state, the device is in a low power sleep mode. To enter
the state, issue the CMD_PHY_SLEEP command, either from
the PHY_OFF or PHY_ON state. To wake the radio from the
state, set the
RC or 32.768 kHz crystal) to wake the radio from this state. The
wake-up timer should be set up before entering the PHY_SLEEP
state. If retention of BBRAM contents is not required, Deep
Sleep Mode 2 can be used to further reduce the PHY_SLEEP
state current consumption. Deep Sleep Mode 2 is entered by
issuing the CMD_HW_RESET command. The options for
the PHY_SLEEP state are detailed in Table 10. When in
PHY_SLEEP, the IRQ_GP3 interrupt pin is held at logic low
while the other GPIO pins are in a high impedance state.
PHY_OFF
In the PHY_OFF state, the 26 MHz crystal, the digital regulator,
and the synthesizer regulator are powered up. All memories are
fully accessible. The BBRAM registers must be valid before exiting
this state.
PHY_ON
In the PHY_ON state, along with the crystal, the digital regulator,
the synthesizer regulator, the VCO, and the RF regulators are
powered up. A baseband filter calibration is performed when
this state is entered from the PHY_OFF state if the BB_CAL bit
in the MODE_CONTROL register (Address 0x11A) is set. The
CS
pin low or use the wake-up controller (32.768 kHz
device is ready to operate, and the PHY_TX and PHY_RX states
can be entered.
PHY_TX
In the PHY_TX state, the synthesizer is enabled and calibrated.
The power amplifier is enabled, and the device transmits at the
channel frequency defined by the CHANNEL_FREQ[23:0]
setting (Address 0x109 to Address 0x10B). The state is entered by
issuing the CMD_PHY_TX command. The device automatically
transmits the transmit packet stored in the packet RAM. After
transmission of the packet, the PA is disabled, and the device
automatically returns to the PHY_ON state and can, optionally,
generate an interrupt.
In sport mode, the device transmits the data present on the GP2
pin as described in the Sport Mode section. The host processor
must issue the CMD_PHY_ON command to exit the PHY_TX
state when in sport mode.
PHY_RX
In the PHY_RX state, the synthesizer is enabled and calibrated.
The ADC, RSSI, IF filter, mixer, and LNA are enabled. The
radio is in receive mode on the channel frequency defined by
the CHANNEL_FREQ[23:0] setting (Address 0x109 to
Address 0x10B).
After reception of a valid packet, the device returns to the
PHY_ON state and can, optionally, generate an interrupt.
In sport mode, the device remains in the PHY_RX state
until the CMD_PHY_ON command is issued.
Current Consumption
The typical current consumption in each state is detailed
in Table 10.
Table 10. Current Consumption in ADF7023-J Radio States
State Current (Typical) Conditions
PHY_SLEEP (Deep Sleep Mode 2) 0.18 µA Wake-up timer off, BBRAM contents not retained, entered by
PHY_SLEEP (Deep Sleep Mode 1) 0.33 µA Wake-up timer off, BBRAM contents retained
PHY_SLEEP (RCO Mode ) 0.75 µA Wake-up timer on using a 32 kHz RC oscillator, BBRAM contents retained
PHY_SLEEP (XTO Mode ) 1.28 µA Wake-up timer on using a 32 kHz XTAL oscillator, BBRAM contents retained
PHY_OFF 1.0 mA
PHY_ON 1.0 mA
PHY_TX 24.1 mA 10 dBm, single-ended PA, 950 MHz
PHY_RX 12.8 mA
Rev. A | Page 27 of 104
ADF7023-J Data Sheet
CONFIGURE
PROGRAM RAM
CONFIG
AES
IR CALIBRAT ION
REED-SOLOMON
IF FILTER CAL
CONFIGURE
MEASURE RSSI
RX_TO_TX_AUTO_TURNAROUND
1
TX_TO_RX_AUTO_TURNAROUND
1
CMD_PHY_TX
CMD_PHY_TX
CMD_PHY_RX
CMD_PHY_SLEEP
CMD_PHY_ON
CMD_PHY_ON
CMD_PHY_ON
CMD_PHY_OFF
CMD_PHY_RX
COLD START
(BATTERY APPLIED)
CMD_CONFIG_DEV
CMD_RAM_LOAD_INIT
CMD_RAM_LOAD_DONE
CMD_AES
CMD_IR_CAL
CMD_AES
4
CS LOW
WUC TIME OUT
CMD_PHY_SLEEP
CMD_HW_RESET
(FROM ANY STATE)
PHY_ON
PHY_TXPHY_RX
CMD_PHY_RXCMD_PHY_TX
TX_EOF
3
RX_EOF
3
PHY_OFFPHY_SLEEP
CMD_RS
5
CMD_CONFIG_DEV
CMD_BB_CAL
CMD_GET_RSSI
PROGRAM RAM
2
1
TRANSMIT AND RE CE IVE AUTOMATIC TURNAROUND M US T BE ENABLED BY BITS RX_TO_TX_AUTO _TURNAROUND AND
TX_TO_RX _AUTO_TURNAROUND (0x11A: M ODE_CONTRO L).
2
AES ENCRYPTION/DECRYPTION, IMAGE REJECTION CALIBRATION, AND REED SOL OMON CODI NG ARE AVAILABLE ONLY I F THE NECESS ARY
FIRMWARE M ODULE HAS BEEN DO WNLOADED T O THE PROGRAM RAM.
3
THE END OF FRAME (EOF ) AUTOMATI C TRANSITI ONS ARE DISABL E D IN SPORT M ODE.
4
CMD_AES REFERS TO THE THRE E AV AILABLE AES COMMANDS: CMD_AES _E NCRY P T, CMD_AES_DECRY P T, AND CMD_AES_DECRY P T_INIT.
5
CMD_RS REFERS TO THE THRE E AV AILABLE REE D S OLOMO N COMMANDS: CMD_RS_E NCODE_INIT , CMD_RS_ENCODE,
AND CMD_RS_DECODE.
KEY
TRANSITION INITIATED BY HOST PROCESSOR
AUTOMATIC TRANSITION BY COMM UNICATIONS P ROCESSOR
COMMUNICAT IONS PROCES S OR FUNCTION
DOWNLO ADABLE FIRMW ARE M ODULE STORED ON PROGRAM RAM
RADIO STATE
4
09555-121
Figure 47. Radio State Diagram
Rev. A | Page 28 of 104
Data Sheet ADF7023-J
INITIALIZATION
Initialization After Application of Power
When power is applied to the ADF7023-J (through the
VDDBAT1/VDDBAT2 pins), it registers a power-on reset
(POR) event and transitions to the PHY_OFF state. The
BBRAM memory is unknown, the packet RAM memory is
cleared to 0x00, and the MCR memory is reset to its default
values. The host processor should use the following procedure
to complete the initialization sequence:
1. Bring the
output goes high.
2. Issue the CMD_SYNC command.
3. Wait for the CMD_READY bit in the status word to go high.
4. Configure the part by writing to all 64 of the BBRAM
registers.
5. Issue the CMD_CONFIG_DEV command so that the
radio settings are updated using the BBRAM values.
The ADF7023-Jis now configured in the PHY_OFF state.
CS
pin of the SPI low and wait until the MISO
Initialization After Issuing the CMD_HW_RESET
Command
The CMD_HW_RESET command performs a full power-down
of all hardware, and the device enters the PHY_SLEEP state. To
complete the hardware reset, the host processor should
complete the following procedure:
1. Wai t for 1 ms.
2. Bring the
output goes high. The ADF7023-J registers a POR and
enters the PHY_OFF state.
3. Issue the CMD_SYNC command.
4. Wait for the CMD_READY bit in the status word to go high.
5. Configure the part by writing to all 64 of the BBRAM registers.
6. Issue the CMD_CONFIG_DEV command so that the
radio settings are updated using the BBRAM values.
The ADF7023-Jis now configured in the PHY_OFF state.
CS
pin of the SPI low and wait until the MISO
Initialization on Transitioning from PHY_SLEEP (After CS
Is Brought Low)
The host processor can bring CS low at any time to wake the
ADF7023-J from the PHY_SLEEP state. This event is not
registered as a POR event because the BBRAM contents are
valid. The following is the procedure that the host processor is
required to follow:
1. Bring the
output goes high. The ADF7023-J enters the PHY_OFF state.
2. Issue the CMD_SYNC command.
3. Wait for the CMD_READY bit in the status word to go high.
4. Issue the CMD_CONFIG_DEV command so that the
radio settings are updated using the BBRAM values.
The ADF7023-J is now configured and ready to transition to
the PHY_ON state.
CS
line of the SPI low and wait until the MISO
Initialization After a WUC Timeout
The ADF7023-J can autonomously wake from the PHY_SLEEP
state using the wake-up controller. If the ADF7023-J wakes after
a WUC timeout in smart wake mode (SWM), it follows the SWM
routine based on the smart wake mode configuration in BBRAM
(see the Low Power Modes section). If the ADF7023-J wakes
after a WUC timeout with SWM disabled and the firmware
timer disabled, it wakes in the PHY_OFF state, and the following
is the procedure that the host processor is required to follow:
1. Issue the CMD_SYNC command.
2. Wait for the CMD_READY bit in the status word to go high.
3. Issue the CMD_CONFIG_DEV command so that the
radio settings are updated using the BBRAM values.
The ADF7023-Jis now configured in the PHY_OFF state.
Rev. A | Page 29 of 104
ADF7023-J Data Sheet
COMMANDS
The commands that are supported by the radio controller are
detailed in this section. They initiate transitions between radio
states or perform tasks as indicated in Figure 47. The execution
times for all radio state transitions are detailed in Table 11 and
Table 12.
CMD_PHY_OFF (0xB0)
This command transitions the ADF7023-J to the PHY_OFF
state. It can be issued in the PHY_ON state. It powers down
the RF and VCO regulators.
CMD_PHY_ON (0xB1)
This command transitions the ADF7023-J to the PHY_ON state.
If the command is issued in the PHY_OFF state, it powers up
the RF and VCO regulators and performs an IF filter calibration
if the BB_CAL bit is set in the MODE_CONTROL register
(Address 0x11A).
If the command is issued from the PHY_TX state, the host
processor performs the following procedure:
1. Ramps down the PA.
2. Sets the external PA signal low (if enabled).
3. Turns off the digital transmit clocks.
4. Powers down the synthesizer.
5. Sets FW_STAT E = PHY_ON.
If the command is issued from the PHY_RX state, the
communications processor performs the following procedure:
1. Copies the measured RSSI to the RSSI_READBACK register.
2. Sets the external LNA signal low (if enabled).
3. Turns off the digital receiver clocks.
4. Powers down the synthesizer and the receiver circuitry
(ADC, RSSI, IF filter, mixer, and LNA).
5. Sets FW_STAT E = PHY_ON.
CMD_PHY_SLEEP (0xBA)
This command transitions the ADF7023-J to the very low
power PHY_SLEEP state in which the WUC is operational (if
enabled), and the BBRAM contents are retained. It can be issued
from the PHY_OFF or PHY_ON state.
CMD_PHY_RX (0xB2)
This command can be issued in the PHY_ON, PHY_RX, or
PHY_TX state. If the command is issued in the PHY_ON state,
the communications processor performs the following procedure:
1. Powers up the synthesizer.
2. Powers up the receiver circuitry (ADC, RSSI, IF filter,
mixer, and LNA).
3. Sets the RF channel based on the CHANNEL_FREQ[23:0]
setting in BBRAM.
4. Sets the synthesizer bandwidth.
5. Does a VCO calibration.
6. Delays for synthesizer settling.
7. Enables the digital receiver blocks.
8. Sets the external LNA enable signal high (if enabled).
9. Sets FW_STAT E = PHY_RX.
Rev. A | Page 30 of 104
If the command is issued in the PHY_RX state, the communications
processor performs the following procedure:
ets the external LNA signal low (if enabled).
1. S
2. Unlocks the AFC and AGC.
3. Turns off the receive blocks.
4. Sets the RF channel based on the CHANNEL_FREQ[23:0]
setting in BBRAM.
5. Sets the synthesizer bandwidth.
6. Does a VCO calibration.
7. Delays for synthesizer settling.
8. Enables the digital receiver blocks.
9. Sets the external LNA enable signal high (if enabled).
10. Sets FW_STATE = PHY_RX.
If the command is issued in the PHY_TX state, the communications
processor performs the following procedure:
1. Ramps down the PA.
2. Sets the external PA signal low (if enabled).
3. Turns off the digital transmit blocks.
4. Powers up the receiver circuitry (ADC, RSSI, IF filter,
mixer, and LNA).
5. Sets the RF channel based on the CHANNEL_FREQ[23:0]
setting in BBRAM.
6. Sets the synthesizer bandwidth.
7. Does a VCO calibration.
8. Delays for synthesizer settling.
9. Enables the digital receiver blocks.
10. Sets the external LNA enable signal high (if enabled).
11. Sets FW_STATE = PHY_RX.
CMD_PHY_TX (0xB5)
This command can be issued in the PHY_ON, PHY_TX, or
PHY_RX state. If the command is issued in the PHY_ON state,
the communications processor performs the following procedure:
1. Powers up the synthesizer.
2. Sets the RF channel based on the CHANNEL_FREQ[23:0]
setting in BBRAM.
3. Sets the synthesizer bandwidth.
4. Does a VCO calibration.
5. Delays for synthesizer settling.
6. Enables the digital transmit blocks.
7. Sets the external PA enable signal high (if enabled).
8. Ramps up the PA.
9. Sets FW_STAT E = PHY_TX.
10. Transmits data.
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