FEATURES
Single Chip Low Power UHF Transmitter
Frequency Band
433 MHz to 435 MHz
868 MHz to 870 MHz
On-Chip VCO and Fractional-N PLL
2.3 V to 3.6 V Supply Voltage
Programmable Output Power
–16 dBm to +12 dBm, 0.3 dB Steps
Data Rates up to 76.8 kbps
Low Current Consumption
29 mA at +10 dBm at 433.92 MHz
Power-Down Mode (<1 A)
24-Lead TSSOP Package Hooks to External VCO for
< 1.4 GHz Operation
APPLICATIONS
Low Cost Wireless Data Transfer
Wireless Metering
Remote Control/Security Systems
Keyless Entry
FUNCTIONAL BLOCK DIAGRAM
CPVDDCP
CLK
OSC1
OSC2
CLK
OUT
GENERAL DESCRIPTION
The ADF7011 is a low power OOK/ASK/FSK/GFSK UHF
transmitter designed for use in ISM band systems. It contains
and integrated VCO and Σ-∆ fractional-N PLL. The output
power, channel spacing, and output frequency are programmable with four 24-bit registers. The fractional-N PLL enables
the user to select any channel frequency within the European
433 MHz and 868 MHz bands, allowing the use of the ADF7011
in frequency hopping systems. The fractional-N also allows the
transmitter to operate in the less congested sub-bands of the
868 MHz to 870 MHz SRD band.
It is possible to choose from the four different modulation
schemes: Binary or Gaussian Frequency Shift Keying (FSK/
GFSK), Amplitude Shift Keying (ASK), or On/Off Keying
(OOK). The device also features a crystal compensation register
that can provide ±1 ppm resolution in the output frequency.
Indirect temperature compensation of the crystal can be accomplished inexpensively using this register.
Control of the four on-chip registers is via a simple 3-wire interface. The devices operate with a power supply ranging from
2.3 V to 3.6 V and can be powered down when not in use.
C
REG
VCO
GND
CP
OUT
VCO
C
VCO
IN
OOK/ASK
GND
V
DD
DV
D
GND
TxCLK
TxDATA
DATA
CLK
DD
OOK/ASK
FSK/GFSK
LE
SERIAL
INTERFACE
R
COMPENSATION
CE
FREQUENCY
CENTER
FREQUENCY
PFD/
CHARGE
PUMP
FRACTIONAL-N
SIGMA-DELTA
ADF7011
A
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective companies.
Second Harmonic, 433 MHz/868 MHz–23/–28–20/–23dBc
Third Harmonic, 433 MHz/868 MHz–25/–29–22/–25dBc
Other Harmonics, 433 MHz/868 MHz–26/–40–23/–35dBc
REFERENCE INPUT
Crystal Reference
433 MHz1.722.1184MHz
868 MHz3.422.1184MHz
External Oscillator
Frequency3.440MHz
Input Level, High Voltage0.7 V
Input Level, Low Voltage0.2 V
FREQUENCY COMPENSATION
Pull In Range of Register1100ppm
PA CHARACTERISTICS
RF Output Impedance
868 MHz16 – j33, Z
433 MHz25 – j2.6, Z
TIMING INFORMATION
Chip Enabled to Regulator Ready
Crystal Oscillator to CLK
4 MHz Crystal1.8ms
22.1184 MHz Crystal2.2ms
TEMPERATURE RANGE – T
NOTES
1
Operating temperature range is as follows: –40C to +85C.
2
Datarates should be limited to adhere to edge of band requirements in accordance with ETSI 300-220
3
Frequency Deviation = (PFD Frequency Mod Deviation )/212.
GFSK Frequency Deviation = (PFD Frequency 2m)/2
4
The output power is limited by the spurious requirements of ETSI at +55C. The addition of an output filter (see Applications section) will allow increased output
levels to >10 dBm at both 433 MHz and 868 MHz
5
VDD = 3 V, PFD = 4 MHz, PA = 10 dBm
6
VDD = 3 V, Loop Filter BW = 100 kHz
7
VDD = 3 V, PFD = 4.42368 MHz, PA = 3 dBm
8
VDD = 3 V, Loop Filter BW = 100 kHz
9
These spurious levels are based on a maximum output power of +3 dBm for 868 MHz and +10 dBm for 433 MHz. It assumes a PFD frequency of <5 MHz.
Recommended PFD frequencies are 4.42368 MHz (22.1184/5) for 868 MHz, and 4 MHz for 433 MHz operation. Compliance for higher output powers will require
an external filter. See Applications section.
10
Not production tested. Based on characterization.
Specifications subject to change without notice.
433 MHz–81dBc/Hz @ 5 kHz offset
6
8
–90dBc/Hz @ 1 MHz offset
–95dBc/Hz @ 1 MHz offset
100 kHz loop BW
V
V
= 50
REF
= 50
REF
OUT
OK
A
DD
DD
10
50200µs
–40+85C
12
where m = Mod Control.
REV. 0
–3–
ADF7011
TIMING CHARACTERISTICS
(VDD = 3 V ⴞ 10%; VGND = 0 V, TA = 25ⴗC, unless otherwise noted.)
Limit at
to T
T
MIN
MAX
Parameter(B Version)UnitTest Conditions/Comments
t
1
t
2
t
3
t
4
t
5
t
6
Guaranteed by design but not production tested.
Specifications subject to change without notice.
CLOCK
DATA
LE
10ns minDATA to CLOCK Setup Time
10ns minDATA to CLOCK Hold Time
25ns minCLOCK High Duration
25ns minCLOCK Low Duration
10ns minCLOCK to LE Setup Time
20ns minLE Pulsewidth
t
1
DB23 (MSB)DB22DB2
t
2
t
3
t
4
(CONTROL BIT C2)
DB1
DB0 (LSB)
(CONTROL BIT C1)
t
6
Figure 1. Timing Diagram
ABSOLUTE MAXIMUM RATINGS
(TA = 25°C, unless otherwise noted.)
1, 2
VDD to GND3 . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to + 7 V
to GND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to + 7 V
CPV
DD
Digital I/O Voltage to GND . . . . . . . –0.3 V to DV
Storage Temperature Range . . . . . . . . . . . . –65°C to +125°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
This device is a high performance RF integrated circuit with an ESD rating of
<1 kV and is ESD sensitive. Proper precautions should be taken for handling and
assembly.
ADF7011BRU–40ºC to +85ºCRU-24 (TSSOP)
ADF7011BRU-REEL–40ºC to +85ºCRU-24 (TSSOP)
ADF7011BRU-REEL7–40ºC to +85ºCRU-24 (TSSOP)
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADF7011 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
t
5
REV. 0–4–
PIN CONFIGURATION
ADF7011
R
SET
CPV
CP
GND
CP
OUT
DATA
CLK
TxDATA
TxCLK
MUXOUT
D
GND
DD
CE
LE
1
2
3
4
5
ADF7011
6
TOP VIEW
(Not to Scale)
7
8
9
10
11
12
TSSOP
24
C
REG
23
C
VCO
22
VCO
IN
21
A
GND
20
RF
OUT
19
RF
GND
18
DV
DD
17
TEST
16
VCO
GND
15
OSC1
14
OSC2
13
CLK
OUT
PIN FUNCTION DESCRIPTIONS
Pin No.MnemonicFunction
1R
2CPV
SET
DD
External Resistor to Set Change Pump Current and Some Internal Bias Currents. Use 4.7 kΩ as default:
I
CP MAX
So, with R
Charge Pump Supply. This should be biased at the same level as RF
95.
=
R
SET
= 4.7 kΩ, I
SET
CP MAX
= 2.02 mA.
and DVDD. The pin should be
OUT
decoupled with a 0.1 µF capacitor as close to the pin as possible.
3CP
4CP
GND
OUT
Charge Pump Ground.
Charge Pump Output. This output generates current pulses that are integrated in the loop filter. The
integrated current changes the control voltage on the input to the VCO.
5CEChip Enable. A logic low applied to this pin powers down the part. This must be high for the part to
function. This is the only way to power down the regulator circuit.
6DATASerial Data Input. The serial data is loaded MSB first with the two LSBs being the control bits. This is a
high impedance CMOS input.
7CLKSerial Clock Input. This serial clock is used to clock in the serial data to the registers. The data is latched
into the 24-bit shift register on the CLK rising edge. This input is a high impedance CMOS input.
8LELoad Enable, CMOS Input. When LE goes high, the data stored in the shift registers is loaded into one
of the four latches, the latch being selected using the control bits.
9TxDATADigital data to be transmitted is input on this pin.
10TxCLKGFSK Only. This clock output is used to synchronize microcontroller data to the TxDATA pin of the
ADF7011. The clock is provided at the same frequency as the data rate.
11MUXOUTThis multiplexer output allows either the digital lock detect (most common), the scaled RF, or the scaled
reference frequency to be accessed externally. Used commonly for system debug. See the Function Register Map.
12D
GND
13CLK
OUT
Ground Pin for the RF Digital Circuitry.
The Divided Down Crystal Reference with 50:50 Mark-Space Ratio. May be used to drive the clock
input of a microcontroller. To reduce spurious components in the output spectrum, the sharp edges can
be reduced with a series RC. For 4.8 MHz output clock, a series 50 Ω into 10 pF will reduce spurs to
< –50 dBc. Defaults on power-up to divide by 16.
14OSC2Oscillator Pin. If a single-ended reference (such as a TCXO) is used, it should be applied to this pin.
When using an external signal generator, a 51 Ω resistor should be tied from this pin to ground. The
XOE bit in the R register should set high when using an external reference.
REV. 0
–5–
ADF7011
PIN FUNCTION DESCRIPTIONS (continued)
Pin No.MnemonicFunction
15OSC1Oscillator Pin. For use with crystal reference only. This is three-stated when an external reference oscilla-
tor is used.
16VCO
GND
17TESTInput to the RF Fractional-N Divider. This pin allows the user to connect an external VCO to the part.
18DV
19RF
20RF
21A
22VCO
23C
24C
DD
GND
OUT
GND
IN
VCO
REG
Voltage Controlled Oscillator Ground.
Disabling the internal VCO activates this pin. If the internal VCO is used, this pin should be grounded.
Positive Supply for the Digital Circuitry. This must be between 2.3 V and 3.6 V. Decoupling capacitors
to the analog ground plane should be placed as close as possible to this pin.
Ground for Output Stage of Transmitter.
The modulated signal is available at this pin. Output power levels are from –16 dBm to +12 dBm. The
output should be impedance matched to the desired load using suitable components. See the RF Output
Stage section.
Ground Pin for the RF Analog Circuitry.
The tuning voltage on this pin determines the output frequency of the Voltage Controlled Oscillator
(VCO). The higher the tuning voltage, the higher the output frequency.
A 0.22 µF capacitor should be added to reduce noise on VCO bias lines. Tied to the C
A 2.2 µF capacitor should be added at C
, tied to GND, to reduce regulator noise and improve
REG
REG
pin.
stability. A reduced capacitor will improve regulator power-on time but may cause higher spurious
components.
REV. 0–6–
Typical Performance Characteristics–ADF7011
RL = 10.0dBm
VDD = 3V
PFD FREQUENCY = 19.2MHz
LOOP BW = 100kHz
868.3MHzSPAN 5.000MHz
TPC 1. FSK Modulated Signal, F
RBW = 1kHz
DEVIATION
Data Rate = 19.2 kbps, 10 dBm
RL = 10.0dBm
–36dBm
@ 200kHz
–2dBm
VDD = 3V
PFD FREQUENCY = 19.2MHz
LOOP BW = 1MHz
RBW = 3kHz
= 58 kHz,
885.000MHz
868.000MHz
VDD = 3V
PFD FREQUENCY = 19.2MHz
LOOP BW = 100kHz
851.000MHz
5.00s–20.00s
5.00s/DIV
30.00s
TPC 4. PLL Settling Time, 852 MHz to 878 MHz,
23 s (±400 kHz)
+10dBm
VDD = 3V
PFD FREQUENCY = 19.2MHz
LOOP BW = 100kHz
RBW = 100kHz
+19.2MHz
–61dBc
868.3MHzSPAN 500kHz
TPC 2. OOK Modulated Signal, Data Rate = 4.8 kbps,
4 dBm
+10dBm
SECOND HARMONIC
–22dBc
THIRD HARMONIC
–34dBc
START 800MHzSTOP 7.750GHz
RBW 1.0MHz
TPC 3. Harmonic Levels at 10 dBm Output Power.
See Figure 15.