ANALOG DEVICES ADF5001 Service Manual

4 GHz to 18 GHz Divide-by-4 Prescaler

FEATURES

Divide-by-4 prescaler
High frequency operation: 4 GHz to 18 GHz
Integrated RF decoupling capacitors
Low power consumption

Active mode: 30 mA

Power-down mode: 7 mA
Low phase noise: −150 dBc/Hz
Single dc supply: 3.3 V compatible with ADF4xxx PLLs
Temperature range: −40
Small package: 3 mm × 3 mm LFCSP

APPLICATIONS

PLL frequency range extender
Point-to-point radios
VSAT radios
Communications test equipment

GENERAL DESCRIPTION

The ADF5001 prescaler is a low noise, low power, fixed RF
divider block that can be used to divide down frequencies as
high as 18 GHz to a lower frequency suitable for input into a
PLL IC, such as the ADF4156 or ADF4106. The ADF5001
provides a divide-by-4 function. The ADF5001 operates off a

3.3 V supply and has differential 100 Ω RF outputs to allow
direct interface to the differential RF inputs of PLLs such as the
ADF4156 and ADF4106.

o

C to +105oC

ADF5001

FUNCTIONAL BLOCK DIAGRAM

CE

BIAS

3pF

RFIN

50Ω

GND

DIVIDE

BY 4

Figure 1.

ADF5001

100Ω

1pF

100Ω

1pF

VDDx

RFOUT
RFOUT

08402-001

Rev. A

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ADF5001

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications ....................................................................................... 1 

General Description ......................................................................... 1

Functional Block Diagram .............................................................. 1

Revision History ............................................................................... 2

Specifications ..................................................................................... 3

Absolute Maximum Ratings ............................................................ 4

ESD Caution .................................................................................. 4

REVISION HISTORY

6/10—Rev. 0 to Rev. A

Change to Features Section ............................................................. 1

Change to Applications Section ...................................................... 1

Changes to Figure 1 .......................................................................... 1

Changes to Specifications Section .................................................. 3

Changes to Thermal Impedance Ratings, Table 2 ........................ 4

Changes to Figure 4 Through Figure 7 .......................................... 6

Changes to Evaluation Board PCB Section ................................... 7

Changes to Figure 8 .......................................................................... 7

Change to Table 4 ............................................................................. 7

Changes to Figure 10 ........................................................................ 8

Changes to Ordering Guide ............................................................ 9

10/09—Revision 0: Initial Version

Pin Configuration and Function Descriptions ..............................5

Typical Performance Characteristics ..............................................6

Evaluation Board PCB ......................................................................7

PCB Material Stack-Up ................................................................7

Bill of Materials ..............................................................................7

Application Circuit ............................................................................8

Outline Dimensions ..........................................................................9

Ordering Guide .............................................................................9

Rev. A | Page 2 of 12

ADF5001

SPECIFICATIONS

VDD1 = VDD2 = 3.3 V ± 10%, GND = 0 V; dBm referred to 50 Ω; TA = T
range is −40°C to +105°C.

Table 1.

Parameter Min Typ Max Unit Test Conditions/Comments

RF CHARACTERISTICS

Input Frequency 4 18 GHz

RF Input Sensitivity −10 +10 dBm 4 GHz to 18 GHz

Output Power −10 −5 dBm Single-ended output connected into 50 Ω load

−7 −2 dBm

Output Voltage Swing 200 330 mV p-p

400 660 mV p-p

1000 mV p-p

Phase Noise −150 dBc/Hz Input frequency (fIN) = 12 GHz, offset = 100 kHz

Reverse Leakage −60 dBm RF input power (PIN) = 0 dBm, RF

Second Harmonic Content −38 dBc

Third Harmonic Content −12 dBc

Fourth Harmonic Content −20 dBc

Fifth Harmonic Content −19 dBc

CE INPUT

VIH, Input High Voltage 2.2 V

VIL, Input Low Voltage 0.3 V

POWER SUPPLIES

Voltage Supply 3.0 3.3 3.6 V

IDD (IDD1 + IDD2)

Active 30 60 mA CE is high
Power-Down 7 25 mA CE is low

MIN

to T

, unless otherwise noted. The operating temperature

MAX

Differential outputs connected into 100 Ω
differential load

Peak-to-peak voltage swing on each single­ended output, connected into 50 Ω load

Peak-to-peak voltage swing on differential
output, connected into 100 Ω differential load

Peak-to-peak voltage swing on each single­ended output, no load condition

= 4 GHz

OUT

Rev. A | Page 3 of 12

ADF5001

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter Rating

VDDx to GND −0.3 V to +3.9 V
RFIN 10 dBm
Operating Temperature Range

Industrial (B Version) −40°C to +105°C
Storage Temperature Range −65°C to +150°C
Maximum Junction Temperature 150°C
LFCSP Thermal Impedance

θ

(Ambient) 90°C/W

JA

θJC(Case) 30°C/W
Peak Temperature 260°C
Time at Peak Temperature 40 sec

Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.

This device is a high performance RF integrated circuit with an
ESD rating of 2 kV, human body model (HBM) and is ESD
sensitive. Proper precautions should be taken for handling and
assembly.

ESD CAUTION

Rev. A | Page 4 of 12