Output frequency range: 2400 MHz to 2725 MHz
Divide-by-2 output
3.0 V to 3.6 V power supply
1.8 V logic compatibility
Integer-N synthesizer
Programmable dual-modulus prescaler 16/17, 32/33
Programmable output power level
3-wire serial interface
Analog and digital lock detect
Hardware and software power-down mode
The ADF4360-0 is a fully integrated integer-N synthesizer and
voltage-controlled oscillator (VCO). The ADF4360-0 is designed for a center frequency of 2600 MHz. In addition, a divide-by-2 option is available, whereby the user gets an RF output of between 1200 MHz and 1360 MHz.
Control of all the on-chip registers is through a simple 3-wire
interface. The device operates with a power supply ranging from
3.0 V to 3.6 V and can be powered down when not in use.
CE
PHASE
R
SET
MULTIPLEXER
CHARGE
PUMP
MUTE
MUXOUT
CP
V
VCO
V
TUNE
C
C
C
N
DD
LOCK
DETECT
COMPARATOR
INTEGER
REGISTER
13-BIT B
COUNTER
PRESCALER
P/P+1
N = (BP + A)
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
REFIN Input Sensitivity 0.7/AV
0 to AVDD V max CMOS-compatible.
REFIN Input Capacitance 5.0 pF max
REFIN Input Current ±100 µA max
PHASE DETECTOR
Phase Detector Frequency2 8 MHz max
CHARGE PUMP
ICP Sink/Source3 With R
High Value 2.5 mA typ
Low Value 0.312 mA typ
R
Range 2.7/10 kΩ
SET
ICP Three-State Leakage Current 0.2 nA typ
Sink and Source Current Matching 2 % typ 1.25 V ≤ VCP ≤ 2.5 V.
ICP vs. VCP 1.5 % typ 1.25 V ≤ VCP ≤ 2.5 V.
ICP vs. Temperature 2 % typ VCP = 2.0 V.
LOGIC INPUTS
V
, Input High Voltage 1.5 V min
INH
V
, Input Low Voltage 0.6 V max
INL
I
, Input Current ±1 µA max
INH/IINL
CIN, Input Capacitance 3.0 pF max
LOGIC OUTPUTS
VOH, Output High Voltage DVDD – 0.4 V min CMOS output chosen.
IOH, Output High Current 500 µA max
VOL, Output Low Voltage 0.4 V max IOL = 500 µA.
POWER SUPPLIES
AVDD 3.0/3.6 V min/V max
DVDD AV
V
AV
VCO
4
AI
DD
4
DI
DD
4, 5
I
VCO
4
I
RFOUT
Low Power Sleep Mode4 7 µA typ
RF OUTPUT CHARACTERISTICS5
VCO Output Frequency 2400/2725 MHz min/max I
VCO Sensitivity 56 MHz/V typ
Lock Time
Frequency Pushing (Open-Loop) 1 MHz/V typ
Frequency Pulling (Open-Loop) 15 kHz typ Into 2.00 VSWR load.
Harmonic Content (Second) −30 dBc typ
Harmonic Content (Third) −39 dBc typ
Output Power
Output Power Variation ±3 dB typ For tuned loads, see the Output Matching section.
VCO Tuning Range 1.25/2.50 V min/max
VCO Tuning Port Leakage Current 0.2 nA typ
VCO
6
5, 7
1
= 3.3 V ± 10%; AGND = DGND = 0 V; TA = T
DD
DD
DD
10 mA typ
2.5 mA typ
19.0 mA typ I
3.5 to 11.0 mA typ RF output stage is programmable.
250 µs typ To within 10 Hz of final frequency.
−13/−6.5 dBm typ Programmable in 3 dB steps. See Table 7.
MIN
to T
, unless otherwise noted.
MAX
For f < 10 MHz, use dc-coupled
CMOS-compati
ble square wave, slew rate > 21 V/µs.
V p-p min/max AC-coupled.
= 4.7 kΩ.
SET
= 10 mA.
CORE
= 15 mA.
CORE
Rev. A | Page 3 of 24
ADF4360-0
www.BDTIC.com/ADI
Parameter B Version Unit Conditions/Comments
NOISE CHARACTERISTICS5
VCO Phase-Noise Performance
−133 dBc/Hz typ @ 1 MHz offset from carrier.
−140 dBc/Hz typ @ 3 MHz offset from carrier.
−145 dBc/Hz typ @ 10 MHz offset from carrier.
Synthesizer Phase-Noise Floor
−163 dBc/Hz typ @ 200 kHz PFD frequency.
−147 dBc/Hz typ @ 8 MHz PFD frequency.
In-Band Phase Noise
10, 11
RMS Integrated Phase Error12 1.4 Degrees typ 100 Hz to 100 kHz.
Spurious Signals due to PFD Frequency
Level of Unlocked Signal with MTLD Enabled −45 dBm typ
1
Operating temperature range is: –40°C to +85°C.
2
Guaranteed by design. Sample tested to ensure compliance.
3
ICP is internally modified to maintain constant loop gain over the frequency range.
4
TA = 25°C; AVDD = DVDD = V
5
These characteristics are guaranteed for VCO core power = 10 mA.
6
Jumping from 2.4 GHz to 2.725 GHz. PFD frequency = 200 kHz; loop bandwidth = 10 kHz.
7
Using 50 Ω resistors to V
8
The noise of the VCO is measured in open-loop conditions.
9
The synthesizer phase-noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20 log N (where N is the N divider value).
10
The phase noise is measured with the EVAL-ADF4360-xEB1 Evaluation Board and the HP8562E Spectrum Analyzer. The spectrum analyzer provides the REFIN for the
synthesizer; offset frequency = 1 kHz.
11
f
= 10 MHz; f
REFIN
12
f
= 10 MHz; f
REFIN
13
The spurious signals are measured with the EVAL-ADF4360-xEB1 Evaluation Board and the HP8562E Spectrum Analyzer. The spectrum analyzer provides the REFIN for
the synthesizer; f
VCO
into a 50 Ω load. For tuned loads, see the Output Matching section.
VCO
= 200 kHz; N = 2600; Loop B/W = 10 kHz.
PFD
= 1 MHz; N = 2600; Loop B/W = 25 kHz.
PFD
= 10 MHz @ 0 dBm.
REFOUT
8
9
= 3.3 V; P = 32.
11, 13
−111 dBc/Hz typ @ 100 kHz offset from carrier.
−172 dBc/Hz typ @ 25 kHz PFD frequency.
−80 dBc/Hz typ @ 1 kHz offset from carrier.
−75 dBc typ
Rev. A | Page 4 of 24
ADF4360-0
K
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TIMING CHARACTERISTICS
AVDD = DVDD = V
Table 2.
Parameter Limit at T
t1 20 ns min LE Setup Time
t2 10 ns min DATA to CLOCK Setup Time
t3 10 ns min DATA to CLOCK Hold Time
t4 25 ns min CLOCK High Duration
t5 25 ns min CLOCK Low Duration
t6 10 ns min CLOCK to LE Setup Time
t7 20 ns min LE Pulse Width
1
See the section for the recommended power-up procedure for this device. Power-Up
= 3.3 V ± 10%; AGND = DGND = 0 V; 1.8 V and 3 V logic levels used; TA = T
VCO
MIN
1
to T
MIN
to T
(B Version) Unit Test Conditions/Comments
MAX
, unless other wise noted.
MAX
CLOC
DATA
t
2
DB23 (MSB)DB22DB2
LE
t
1
LE
t
3
t
4
Figure 2. Timing Diagram
t
5
DB1
(CONTROL BIT C2)
DB0 (LSB)
(CONTROL BIT C1)
t
6
t
7
04644-002
Rev. A | Page 5 of 24
ADF4360-0
www.BDTIC.com/ADI
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter Rating
AVDD to GND
AVDD to DVDD −0.3 V to +0.3 V
V
to GND −0.3 V to +3.9 V
VCO
V
to AVDD −0.3 V to +0.3 V
VCO
Digital I/O Voltage to GND −0.3 V to VDD + 0.3 V
Analog I/O Voltage to GND −0.3 V to VDD + 0.3 V
REFIN to GND −0.3 V to VDD + 0.3 V
Operating Temperature Range −40°C to + 85°C
Storage Temperature Range −65°C to +150°C
Maximum Junction Temperature 150°C
CSP θJA Thermal Impedance
Paddle Soldered 50°C/W
Paddle Not Soldered 88°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
1
GND = AGND = DGND = 0 V.
1
−0.3 V to +3.9 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any
other conditions above those included in the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
This device is a high performance RF integrated circuit with an
ESD rating of <1 kV and it is ESD sensitive. Proper precautions
should be taken for handling and assembly.
TRANSISTOR COUNT
12543 (CMOS) and 700 (Bipolar).
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic
discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of
functionality.
Rev. A | Page 6 of 24
ADF4360-0
T
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PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
DD
21
PIN 1
IDENTIFIER
ADF4360-0
TOP VIEW
(Not to Scale)
AGND8AGND9AGND10AGND
MUXOU
20LE19
11
18
DATA
CLK
17
REF
16
IN
DGND
15
C
14
N
R
13
SET
12
C
C
04644-003
CPGND
AV
AGND
RF
OUT
RF
OUT
V
VCO
CP24CE23AGND22DV
1
2
DD
3
A
4
B
5
6
7
TUNE
V
Figure 3. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Function
1 CPGND Charge Pump Ground. This is the ground return path for the charge pump.
2 AVDD
Analog Power Supply. This ranges from 3.0 V to 3.6 V. Decoupling capacitors to the analog ground plane
should be placed as close as possible to this pin. AV
must have the same value as DVDD.
DD
3, 8 to 11, 22 AGND Analog Ground. This is the ground return path of the prescaler and VCO.
4 RF
OUT
A
VCO Output. The output level is programmable from −6.5 dBm to −13 dBm. See the Output Matching section
for a description of the various output stages.
5 RF
OUT
B
VCO Complementary Output. The output level is programmable from −6.5 dBm to −13 dBm. See the Output
Matching section for a description of the various output stages.
6 V
7 V
VCO
TUNE
Power Supply for the VCO. This ranges from 3.0 V to 3.6 V. Decoupling capacitors to the analog ground plane
should be placed as close as possible to this pin. V
must have the same value as AVDD.
VCO
Control Input to the VCO. This voltage determines the output frequency and is derived from filtering the CP
output voltage.
12 CC Internal Compensation Node. This pin must be decoupled to ground with a 10 nF capacitor.
13 R
14 C
SET
N
Connecting a resistor between this pin and CP
thesizer. The nominal voltage potential at the R
75.11
I
where R
CPmax
= 4.7 kΩ, I
SET
=
R
SET
= 2.5 mA.
CPmax
Internal Compensation Node. This pin must be decoupled to V
sets the maximum charge pump output current for the syn-
GND
pin is 0.6 V. The relationship between ICP and R
SET
with a 10 µF capacitor.
VCO
15 DGND Digital Ground.
16 REFIN
Reference Input. This is a CMOS input with a nominal threshold of V
/2 and a dc equivalent input resistance of
DD
100 kΩ. See Figure 10. This input can be driven from a TTL or CMOS crystal oscillator or it can be ac-coupled.
17 CLK
Serial Clock Input. This serial clock is used to clock in the serial data to the registers. The data is latched into the
24-bit shift register on the CLK rising edge. This input is a high impedance CMOS input.
18 DATA
Serial Data Input. The serial data is loaded MSB first with the two LSBs being the control bits. This input is a
high impedance CMOS input.
19 LE
Load Enable, CMOS Input. When LE goes high, the data stored in the shift registers is loaded into one of the
four latches, and the relevant latch is selected using the control bits.
20 MUXOUT
This multiplexer output allows either the lock detect, the scaled RF, or the scaled reference frequency to be
accessed externally.
21 DVDD
23 CE
Digital Power Supply. This ranges from 3.0 V to 3.6 V. Decoupling capacitors to the digital ground plane should
be placed as close as possible to this pin. DV
must have the same value as AVDD.
DD
Chip Enable. A logic low on this pin powers down the device and puts the charge pump into three-state mode.
Taking the pin high powers up the device depending on the status of the power-down bits.
24 CP
Charge Pump Output. When enabled, this provides ± I
internal VCO.
to the external loop filter, which in turn, drives the