Analog Devices ADF4212L a Datasheet

Dual Low Power PLL
Frequency Synthesizer
ADF4212L

FEATURES

Total, 7.5 mA
I
DD
Bandwidth RF/IF, 2.4 GHz/1.0 GHz
2.7 V to 3.3 V Power Supply Separate VP Allows Extended Tuning Voltage Programmable Dual Modulus Prescaler
RF and IF: 8/9, 16/17, 32/33, 64/65 Programmable Charge Pump Currents 3-Wire Serial Interface Analog and Digital Lock Detect Fastlock Mode Power-Down Mode 20-Lead TSSOP and 20-Lead MLF Chip Scale Package
APPLICATIONS Wireless Handsets (GSM, PCS, DCS, CDMA, WCDMA) Base Stations for Wireless Radio (GSM, PCS, DCS,
CDMA, WCDMA) Wireless LANS Cable TV Tuners (CATV) Communications Test Equipment

FUNCTIONAL BLOCK DIAGRAM

VDD1 VDD2 VP1 VP2
ADF4212L
12-BIT IF
IF
REF
CLOCK
DATA
IN
IN
LE
OSCILLATOR
PRESCALER
22-BIT
DATA
REGISTER
IF
SDOUT
B-COUNTER
6-BIT IF
A-COUNTER
14-BIT IF
R-COUNTER
14-BIT RF
R-COUNTER

GENERAL DESCRIPTION

The ADF4212L is a dual frequency synthesizer that can be used to implement local oscillators (LO) in the up-conversion and down-conversion sections of wireless receivers and transmitters. It can provide the LO for both the RF and IF sections. It con­sists of a low noise digital PFD (Phase Frequency Detector), a precision charge pump, a programmable reference divider, programmable A and B counters, and a dual modulus prescaler (P/P + 1). The A (6-bit) and B (12-bit) counters, in conjunction with the dual modulus prescaler (P/P + 1), implement an N divider (N = BP + A). In addition, the 14-bit reference counter (R counter) allows selectable REFIN frequencies at the PFD input. A complete PLL (Phase-Locked Loop) can be implemented if the synthesizer is used with external loop filters and VCOs (Voltage Controlled Oscillators).
Control of all the on-chip registers is via a simple 3-wire inter­face with 1.8 V compatibility. The devices operate with a power supply ranging from 2.7 V to 3.3 V and can be powered down when not in use.
R
SET
IF PHASE
FREQUENCY
DETECTOR
LOCK
DETECT
LOCK
DETECT
IF
RF
REFERENCE
CHARGE
PUMP
IF CURRENT
SETTING
IFCP3 IFCP2 IFCP1
OUTPUT
MUX
RFCP3
RFCP2 RFCP1
REFERENCE
CP
IF
MUXOUT
12-BIT RF
B-COUNTER
RF
IN
RF
PRESCALER
DGND
RF
AGND
6-BIT RF
A-COUNTER
DGNDIFAGND
RF
REV. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective companies.
IF
RF PHASE
FREQUENCY
DETECTOR
CHARGE
PUMP
REFERENCE
R
SET
FLO SWITCH
CP
FL
RF
O
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ADF4212L–SPECIFICATIONS
AGNDIF = DGNDIF = 0 V; TA = T
Parameter B Version Typical Unit Test Conditions/Comments
RF/IF CHARACTERISTICS
RF Input Frequency (RF RF Input Sensitivity –10/0 –10/0 dBm min/max V IF Input Frequency (IF IF Input Sensitivity –10/0 –10/0 dBm min/max VDD = 3 V
MAXIMUM ALLOWABLE
Prescaler Output Frequency
REFIN CHARACTERISTICS See Figure 2 for Input Circuit
REFIN Input Frequency 10/150 10/150 MHz min/max REFIN Input Sensitivity 500 mV/V
REFIN Input Capacitance 10 10 pF max REFIN Input Current ±100 ±100 µA max
PHASE DETECTOR
Phase Detector Frequency
CHARGE PUMP
ICP Sink/Source Programmable, See Table V
High Value 5 5 mA typ With R Low Value 625 625 µA typ Absolute Accuracy 2 2 % typ With R
Range 1.5/5.6 1.5/5.6 k min/max
R
SET
Three-State Leakage Current 1 1 nA max
I
CP
Sink and Source Current Matching 6 6 % typ 0.5 V < V
vs. V
I
CP
CP
ICP vs. Temperature 2 2 % typ VCP = VP/2
LOGIC INPUTS
V
, Input High Voltage 1.4 1.4 V min
INH
, Input Low Voltage 0.6 0.6 V max
V
INL
I
, Input Current ±1 ±1 µA max
INH/IINL
CIN, Input Capacitance 10 10 pF max
LOGIC OUTPUTS
VOH, Output High Voltage 1.4 1.4 V min Open-Drain 1 k Pull-Up to 1.8 V VOL, Output Low Voltage 0.4 0.4 V max IOL = 500 µA
POWER SUPPLIES
VDD1 2.7/3.3 2.7/3.3 V min/V max
2V
V
DD
VP1, VP2V
(RF and IF)
I
DD
5
RF Only 6 6 mA max 5.0 mA Typical IF Only 4 4 mA max 2.5 mA Typical
(IP1 + IP2) 0.6 0.6 mA typ
I
P
Low Power Sleep Mode 1 1 µA typ
NOTES
1
Operating temperature range is as follows: B Version: –40°C to +85°C.
2
The B Chip specifications are given as typical values.
3
This is the maximum operating frequency of the CMOS counters. The prescaler value should be chosen to ensure that the RF input is divided down to a frequency less than this value.
4
Guaranteed by design. Sample tested to ensure compliance.
5
TA = 25°C. RF = 1 GHz. Prescaler = 32/33. IF = 500 MHz. Prescaler = 16/17.
Specifications subject to change without notice.
to T
MIN
, unless otherwise noted; dBm referred to 50 .)
MAX
B Chips
) 0.2/2.4 0.2/2.4 GHz min/max For Operation below F
IN
) 100/1000 100/1000 MHz min/max
IN
3
4
200 200 MHz max
500 mV/VDDV p-p min/max
DD
75 75 MHz max
22 % typ 0.5 V < VCP < VP – 0.5 V
1V
DD
1/5.5 VDD1/5.5 V min/V max
DD
10 10 mA max 7.5 mA Typical
(VDD1 = VDD2 = 2.7 V to 3.3 V; VP1, VP2 = VDD to 5.5 V; AGNDRF = DGNDRF =
2
, Use a Square Wave
MIN
DD
= 3 V
DD
AC-Coupled. When DC-Coupled, 0 to V
Max (CMOS Compatible)
DD
= 2.7 k
SET
= 2.7 k
SET
< VP – 0.5 V, 2% typ
CP
1
1
REV. A–2–
SPECIFICATIONS
to T
T
MIN
Parameter B Version B Chips
NOISE CHARACTERISTICS
RF Phase Noise Floor
Phase Noise Performance
Spurious Signals
NOTES
1
Operating temperature range is as follows: B Version: –40°C to +85°C
2
The B Chip specifications are given as typical values.
3
The synthesizer phase noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20logN (where N is the N divider value). See TPC 14.
4
The phase noise is measured with the EVAL-ADF4210/12/13EB Evaluation Board and the HP8562E Spectrum Analyzer. The spectrum analyzer provides the REFIN for the synthesizer (f
5
f
REFIN
6
f
REFIN
7
Same conditions as listed on the preceding line.
8
f
REFIN
9
f
REFIN
Specifications subject to change without notice.
, unless otherwise noted; dBm referred to 50 V.)
MAX
3
4
IF: 540 MHz Output IF: 900 MHz Output RF: 900 MHz Output RF: 1750 MHz Output RF: 2400 MHz Output
IF: 540 MHz Output IF: 900 MHz Output RF: 900 MHz Output RF: 1750 MHz Output RF: 2400 MHz Output
= 10 MHz; f = 10 MHz; f
= 10 MHz; f = 10 MHz; f
PFD
PFD
PFD
PFD
5
6
6
8
9
5
6
6
8
9
= 10 MHz @ 0 dBm).
REFOUT
= 200 kHz; Offset Frequency = 1 kHz; fIF = 540 MHz; N = 2700; Loop B/W = 20 kHz = 200 kHz; Offset Frequency = 1 kHz; fRF = 900 MHz; N = 4500; Loop B/W = 20 kHz
= 200 kHz; Offset Frequency = 1 kHz; fRF = 1750 MHz; N = 8750; Loop B/W = 20 kHz = 1 MHz; Offset Frequency = 1 kHz; fRF = 2400 MHz; N = 9800; Loop B/W = 20 kHz
(VDD1 = VDD2 = 2.7 V to 3.3 V; VP1, VP2 = VDD to 5.5 V; AGNDRF = DGNDRF = AGNDIF = DGNDIF = 0 V; TA =
2
Unit Test Conditions/Comments
–170 –170 dBc/Hz typ @ 25 kHz PFD Frequency –162 –162 dBc/Hz typ @ 200 kHz PFD Frequency
@ VCO Output –89 –89 dBc/Hz typ @ 1 kHz Offset and 200 kHz PFD Frequency –87 –87 dBc/Hz typ See Note 7 –89 –89 dBc/Hz typ See Note 7 –84 –84 dBc/Hz typ See Note 7 –87 –87 dBc/Hz typ @ 1 kHz Offset and 1 MHz PFD Frequency
–88/–90 –88/–90 dB typ @ 200 kHz/400 kHz and 200 kHz PFD Frequency –90/–94 –90/–94 dB typ See Note 7 –90/–94 –90/–94 dB typ See Note 7 –80/–82 –80/–82 dB typ See Note 7 –80/–82 –80/–82 dB typ @ 200 kHz/400 kHz and 200 kHz PFD Frequency
1
ADF4212L
(VDD1 = VDD2 = 2.6 V to 3.3 V; VP1, VP2 = VDD to 5.5 V; AGNDRF = DGNDRF = AGNDIF = DGNDIF = 0 V;

TIMING CHARACTERISTICS*

TA = T
MIN
to T
, unless otherwise noted; dBm referred to 50 .)
MAX
Limit at T
to T
MIN
MAX
Parameter (B Version) Unit Test Conditions/Comments
t
1
t
2
t
3
t
4
t
5
t
6
*Guaranteed by design but not production tested.
Specifications subject to change without notice.
10 ns min DATA to CLOCK Setup Time 10 ns min DATA to CLOCK Hold Time 25 ns min CLOCK High Duration 25 ns min CLOCK Low Duration 10 ns min CLOCK to LE Setup Time 20 ns min LE Pulsewidth
t
t
3
4
CLOCK
t
t
1
2
DATA
DB20 (MSB) DB19 DB2
LE
LE
DB1
(CONTROL BIT C2)
DB0 (LSB)
(CONTROL BIT C1)
t
5
t
6
REV. A
Figure 1. Timing Diagram
–3–
ADF4212L

ABSOLUTE MAXIMUM RATINGS

(TA = 25°C, unless otherwise noted.)
1, 2, 3
VDD1 to GND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +3.6 V
V
1 to VDD2 . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
DD
1, VP2 to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V to +3.6 V
V
P
V
1, VP2 to VDD1, VDD2 . . . . . . . . . . . . . . . . –0.3 V to +3.6 V
P
Digital I/O Voltage to GND . . . . . . . –0.3 V to DV
Analog I/O Voltage to GND . . . . . . . . –0.3 V to V
REFIN, RFIN, IFIN to GND . . . . . . . –0.3 V to V
+ 0.3 V
DD
+ 0.3 V
DD
+ 0.3 V
DD
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
2
This device is a high performance RF integrated circuit with an ESD rating of
<2 kV, and is ESD sensitive. Proper precautions should be taken for handling and assembly.
3
GND = AGND = DGND = 0 V
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . 150°C
TSSOP LFCSP LFCSP
Thermal Impedance . . . . . . . . . . . . . . 150.4°C/W
JA
Thermal Impedance (Paddle Soldered) . . 122°C/W
JA
Thermal Impedance (Paddle Not Soldered) 216°C/W
JA
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Model Temperature Range Package Option*
ADF4212LBRU –40°C to +85°C RU-20 ADF4212LBCP –40°C to +85°C CP-20
*RU = Thin Shrink Small Outline Package (TSSOP)
CP = Chip Scale Package (LFCSP) Contact the factory for chip availability.

ORDERING GUIDE

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADF4212L features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
REV. A–4–

PIN CONFIGURATIONS

FL
O
RF
IN
CP
RF
AGND
RF
DGND
RF
1
2
3
4
5
LE
R
SET
AGND
IF
DGND
IF
11
IF
IN
12
13
14
15
1617181920
CP
IF
V
P
2
V
DD
2
V
P
1
V
DD
1
109876
DATA
CLK
MUXOUT
REF
IN
DGND
IF
ADF4212L
TOP VIEW
(NOT TO SCALE)
ADF4212L
LFCSP
VDD1
CP
DGND
RF
AGND
REF
DGND
UXOUT
V
P
RF
RF
RF
FL
1
2
1
3
4
5
IN
6
7
O
8
IN
9
IF
10
TSSOP
ADF4212L
TOP VIEW
(Not To Scale)
20
19
18
17
16
15
14
13
12
11
VDD2
VP2
CP
IF
DGND
IF
IN
AGND
R
SET
LE DATA
CLK
IF
IF

PIN FUNCTION DESCRIPTION

Mnemonic Description
CP
RF
RF Charge Pump Output. When enabled, this provides ±ICP to the external RF loop filter, which in turn drives the external RF VCO.
DGND
RF
IN
AGND
FL
O
REF
IN
RF
RF
Digital Ground Pin for the RF Digital Circuitry.
Input to the RF Prescaler. This small signal input is normally ac-coupled from the RF VCO.
Ground Pin for the RF Analog Circuitry.
Multiplexed Output of RF/IF Programmable or Reference Dividers, RF/IF Fastlock Mode. CMOS output.
Reference Input. This is a CMOS input with a nominal threshold of VDD/2 and an equivalent input resistance of 100 k. See Figure 2. This input can be driven from a TTL or CMOS crystal oscillator, or can be ac-coupled.
DGND
IF
Digital Ground Pin for the IF Digital, Interface, and Control Circuitry.
MUXOUT This multiplexer output allows either the IF/RF lock detect, the scaled RF, the scaled IF, or the scaled reference
frequency to be accessed externally.
CLK Serial Clock Input. This serial clock is used to clock in the serial data to the registers. The data is latched into the
24-bit shift register on the CLK rising edge. This input is a high impedance CMOS input.
DATA Serial Data Input. The serial data is loaded MSB first with the two LSBs being the control bits. This input is a
high impedance CMOS input.
LE Load Enable, CMOS Input. When LE goes high, the data stored in the shift registers is loaded into one of the four
latches, the latch being selected using the control bits.
R
SET
AGND
IF
IF
IN
CP
IF
V
2 Power Supply for the IF Charge Pump. This should be greater than or equal to VDD2. In systems where VDD2 is 3 V, it
P
Connecting a resistor between this pin and ground sets the maximum RF and IF charge pump output current. The nominal voltage potential at the R
therefore, with R
= 2.7 k, I
SET
pin is 0.66 V. The relationship between ICP and R
SET
I
CP MAX
= 5 mA for both the RF and IF charge pumps.
CP MAX
13 5.
=
R
SET
SET
is
Ground Pin for the IF Analog Circuitry.
Input to the IF Prescaler. This small signal input is normally ac-coupled from the IF VCO.
Output from the IF Charge Pump. This is normally connected to a loop filter that drives the input to an external VCO.
can be set to 5.5 V and used to drive a VCO with a tuning range up to 5.5 V.
V
2Power Supply for the IF, Digital, and Interface Section. Decoupling capacitors to the ground plane should be
DD
V
DD
V
1 Power Supply for the RF Charge Pump. This should be greater than or equal to VDD1. In systems where VDD1 is 3 V, it
P
REV. A
1Power Supply for the RF Section. Decoupling capacitors to the ground plane should be placed as close as possible
placed as close as possible to this pin. V same potential as V
to this pin. V
can be set to 5.5 V and used to drive a VCO with a tuning range up to 5.5 V.
DD
1.
DD
1 should have a value of between 2.6 V and 3.3 V. VDD1 must have the same potential as VDD2.
2 should have a value of between 2.6 V and 3.3 V. VDD2 must have the
DD
–5–
ADF4212L–Typical Performance Characteristics
0
= 3V
V
DD
VP = 5V
–5
–10
–15
–20
AMPLITUDE – dBm
–25
–30
0 500 1000 1500 2000
FREQUENCY – MHz
2500 3000
TPC 1. Input Sensitivity (RF Input)
0
VDD = 3V V
= 5V
P
–5
–10
–15
–20
AMPLITUDE – dBm
–25
–30
–35
0 500 1000 1500
FREQUENCY – MHz
TPC 2. Input Sensitivity (IF Input)
0
–10
–20
–30
–40
–50
–60
–70
OUTPUT POWER – dB
–80
–90
–100
REFERENCE LEVEL = –3.0dBm
–400k –200k 1.75G 200k 400k
FREQUENCY – Hz
VDD = 3V, VP = 5V I
= 5mA
CP
PFD FREQUENCY = 200kHz LOOP BANDWIDTH = 20kHz RES. BANDWIDTH = 1Hz VIDEO BANDWIDTH = 1Hz SWEEP = 2.5 SECONDS AVERAGES = 20
–85.9dB
TPC 4. Reference Spurs, RF Side (1750 MHz, 200 kHz, 20 kHz)
rms NOISE =
= –50dBc/Hz
10dB/DIV
–50
–60
–70
–80
–90
–100
–110
–120
PHASE NOISE – dBc/Hz
–130
–140
–150
100Hz 1MHz
R
L
FREQUENCY OFFSET
FROM 1.75GHz CARRIER
1.38 DEGREES
1.38 rms
TPC 5. Integrated Phase Noise (1750 MHz, 200 kHz/20 kHz)
0
VDD = 3V, VP = 5V I
= 5mA
–10
CP
PFD FREQUENCY = 200kHz LOOP BANDWIDTH = 20kHz
–20
RES. BANDWIDTH = 10Hz VIDEO BANDWIDTH = 10Hz
–30
SWEEP = 1.9 SECONDS AVERAGES = 22
–40
–50
–60
–70
OUTPUT POWER – dB
–80
–90
–100
–2k –1k 1.75G 1k 2k
FREQUENCY – Hz
REFERENCE LEVEL = –3.2dBm
–84.2dBc/Hz
TPC 3. Phase Noise, RF Side (1750 MHz, 200 kHz, 20 kHz)
0
–10
–20
–30
–40
–50
–60
–70
OUTPUT POWER – dB
–80
–90
–100
REFERENCE LEVEL = –4.3dBm
–2k –1k 540M 1k 2k
FREQUENCY – Hz
VDD = 3V, VP = 5V I
= 5mA
CP
PFD FREQUENCY = 200kHz LOOP BANDWIDTH = 20kHz RES. BANDWIDTH = 10Hz VIDEO BANDWIDTH = 10Hz SWEEP = 1.9 SECONDS AVERAGES = 22
–88.8dBc/Hz
TPC 6. Phase Noise, IF Side (540 MHz, 200 kHz/20 kHz)
REV. A–6–
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