2.7 V to 5.5 V Power Supply
Separate Charge Pump Supply (V
) Allows Extended
P
Tuning Voltage in 3 V Systems
Programmable Dual Modulus Prescaler
RF and IF: 8/9, 16/17, 32/33, 64/65
Programmable Charge Pump Currents
3-Wire Serial Interface
Analog and Digital Lock Detect
Fastlock Mode
Power-Down Mode
APPLICATIONS
Base Stations for Wireless Radio (GSM, PCS, DCS,
The ADF4210/ADF4211/ADF4212/ADF4213 is a dual frequency
synthesizer that can be used to implement local oscillators (LO)
in the upconversion and downconversion sections of wireless
receivers and transmitters. They can provide the LO for both
the RF and IF sections. They consist of a low-noise digital PFD
(Phase Frequency Detector), a precision charge pump, a programmable reference divider, programmable A and B Counters
and a dual-modulus prescaler (P/P + 1). The A (6-bit) and B
(12-bit) counters, in conjunction with the dual modulus prescaler
(P/P + 1), implement an N divider (N = BP + A). In addition,
the 14-bit reference counter (R Counter), allows selectable
REFIN frequencies at the PFD input. A complete PLL (PhaseLocked Loop) can be implemented if the synthesizer is used with
an external loop filter and VCO (Voltage Controlled Oscillators).
Control of all the on-chip registers is via a simple 3-wire interface.
The devices operate with a power supply ranging from 2.7 V to
5 V and can be powered down when not in use.
R
SET
12-BIT IF
DGND
B-COUNTER
8-BIT IF
A-COUNTER
14-BIT IF
R-COUNTER
R-COUNTER
12-BIT RF
B-COUNTER
6-BIT RF
A-COUNTER
DGND
IF
14-BIT RF
IF
IN
REF
IN
CLOCK
DATA
LE
RF
IN
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices.
Operating temperature range is as follows: B Version: –40°C to +85°C.
2
The B Chip specifications are given as typical values.
3
This is the maximum operating frequency of the CMOS counters. The prescaler value should be chosen to ensure that the IF/RF input is divided down to a frequency that is
less than this value.
4
VDD1 = VDD2 = 3 V; For VDD1 = VDD2 = 5 V, use CMOS-compatible levels, TA = 25°C.
5
Guaranteed by design. Sample tested to ensure compliance.
6
VDD = 3 V; P = 16; RFIN = 900 MHz; IFIN = 540 MHz, TA = 25°C.
7
The synthesizer phase noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20 logN (where N is the N divider value). See
TPC 16.
8
The phase noise is measured with the EVAL-ADF4210/ADF4212/ADF4213EB Evaluation Board and the HP8562E Spectrum Analyzer. The spectrum analyzer provides the
REFIN for the synthesizer (f
9
f
= 10 MHz; f
REFIN
10
f
= 10 MHz; f
REFIN
11
Same conditions as listed in Note 10.
12
f
= 10 MHz; f
REFIN
13
f
= 10 MHz; f
REFIN
14
f
= 10 MHz; f
REFIN
Specifications subject to change without notice.
= 200 kHz; Offset frequency = 1 kHz; fIF = 540 MHz; N = 2700; Loop B/W = 20 kHz.
PFD
= 200 kHz; Offset frequency = 1 kHz; fRF = 900 MHz; N = 4500; Loop B/W = 20 kHz.
PFD
= 200 kHz; Offset frequency = 1 kHz; fRF = 1750 MHz; N = 8750; Loop B/W = 20 kHz.
PFD
= 10 kHz; Offset frequency = 200 Hz; fRF = 1750 MHz; N = 175000; Loop B/W = 1 kHz.
PFD
= 1 MHz; Offset frequency = 1 kHz; fRF = 1960 MHz; N = 9800; Loop B/W = 20 kHz.
PFD
= 10 MHz @ 0 dBm).
REFOUT
1V
DD
DD
1
VDD1/6.0VDD1/6.0V min/V max VDD1, VDD2 ⱕ VDD1, VDD2 ⱕ 6.0 V
–171–171dBc/Hz typ@ 25 kHz PFD Frequency
–164–164dBc/Hz typ@ 200 kHz PFD Frequency
–65/–70–65/–70dB typ@ 10 kHz/20 kHz and 10 kHz PFD Frequency
REV. A
–3–
ADF4210/ADF4211/ADF4212/ADF4213
WARNING!
ESD SENSITIVE DEVICE
(VDD1 = VDD2 = 3 V 10%, 5 V 10%; VDD1, VDD2 ≤ VP1, VP2 ≤ 6 V 10%; AGNDRF = DGND
TIMING CHARACTERISTICS
Limit at
to T
T
Parameter(B Version)UnitTest Conditions/Comments
MIN
t
1
t
2
t
3
t
4
t
5
t
6
NOTES
Guaranteed by design but not production tested.
Specifications subject to change without notice.
10ns minDATA to CLOCK Set-Up Time
10ns minDATA to CLOCK Hold Time
25ns minCLOCK High Duration
25ns minCLOCK Low Duration
10ns minCLOCK to LE Set-Up Time
20ns minLE Pulsewidth
CLOCK
DATA
LE
LE
MAX
DB20
(MSB)
= AGNDIF = DGNDIF = 0 V; TA = T
t
3
t
1
t
2
DB19DB2
to T
MIN
MAX
t
4
(CONTROL BIT C2)
unless otherwise noted.)
DB1
DB0 (LSB)
(CONTROL BIT C1)
t
5
RF
t
6
Figure 1. Timing Diagram
ABSOLUTE MAXIMUM RATINGS
(TA = 25°C unless otherwise noted)
VDD1 to GND3 . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
1 to VDD2 . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
V
DD
V
1, VP2 to GND . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
P
V
1, VP2 to VDD1 . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.5 V
P
Digital I/O Voltage to GND . . . . . . –0.3 V to DV
Analog I/O Voltage to GND . . . . . . . . . –0.3 V to V
REF
, RFINA, RFINB,
IN
A, IFINB to GND . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
This device is a high-performance RF integrated circuit with an ESD rating of
< 2 kV and it is ESD sensitive. Proper precautions should be taken for handling
and assembly.
3
GND = AGND = DGND = 0 V.
TRANSISTOR COUNT
11749 (CMOS) and 522 (Bipolar).
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADF4210/ADF4211/ADF4212/ADF4213 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore,
proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
ADF4210BRU–40°C to +85°CThin Shrink Small Outline Package (TSSOP)RU-20
ADF4210BCP–40°C to +85°CChip Scale PackageCP-20
ADF4211BRU–40°C to +85°CThin Shrink Small Outline Package (TSSOP)RU-20
ADF4211BCP–40°C to +85°CChip Scale PackageCP-20
ADF4212BRU–40°C to +85°CThin Shrink Small Outline Package (TSSOP)RU-20
ADF4212BCP–40°C to +85°CChip Scale PackageCP-20
ADF4213BRU–40°C to +85°CThin Shrink Small Outline Package (TSSOP)RU-20
ADF4213BCP–40°C to +85°CChip Scale PackageCP-20
*Contact the factory for chip availability.
–4–
REV. A
ADF4210/ADF4211/ADF4212/ADF4213
PIN FUNCTION DESCRIPTIONS
Pin Number
TSSOPMnemonicFunction
1V
2V
3CP
4DGND
5RF
6AGND
7FL
8REF
9DGND
10MUXOUTThis multiplexer output allows either the IF/RF Lock Detect, the scaled RF, scaled IF or the scaled
11CLKSerial Clock Input. This serial clock is used to clock in the serial data to the registers. The data is
12DATASerial Data Input. The serial data is loaded MSB first with the two LSBs being the control bits. This
13LELoad Enable, CMOS Input. When LE goes high, the data stored in the shift registers is loaded into
14R
15AGND
16IF
17DGND
18CP
19VP2Power Supply for the IF Charge Pump. This should be greater than or equal to VDD2. In systems where
20V
1Power Supply for the RF Section. Decoupling capacitors to the ground plane should be placed as
DD
close as possible to this pin. V
DD
1 should have a value of between 2.7 V and 5.5 V. VDD1 must have
the same potential as VDD2.
1Power Supply for the RF Charge Pump. This should be greater than or equal to VDD1. In systems where
P
RF
V
1 is 3 V, it can be set to 6 V and used to drive a VCO with a tuning range up to 6 V.
DD
Output from the RF Charge Pump. This is normally connected to a loop filter which drives the input
to an external VCO.
RF
IN
RF
O
IN
Ground Pin for the RF Digital Circuitry.
Input to the RF Prescaler. This low level input signal is ac-coupled from the RF VCO.
Ground Pin for the RF Analog Circuitry.
RF/IF Fastlock Mode.
Reference Input. This is a CMOS input with a nominal threshold of VDD/2 and an equivalent input
resistance of 100 kΩ. This input can be driven from a TTL or CMOS crystal oscillator.
IF
Digital Ground for the IF Digital, Interface and Control Circuitry.
Reference Frequency to be accessed externally.
latched into the 24-bit shift register on the CLK rising edge. This input is a high impedance
CMOS input.
input is a high impedance CMOS input.
one of the four latches, the latch being selected using the control bits.
SET
IF
IN
IF
IF
Connecting a resistor between this pin and ground sets the maximum RF and IF charge pump output
current. The nominal voltage potential at the R
13 5.
=
R
SET
= 5 mA for both the RF and IF Charge Pumps.
So, with R
= 2.7 kΩ, I
SET
I
CP MAX
CP MAX
pin is 0.66 V. The relationship between ICP and R
SET
SET
is
Ground Pin for the IF Analog Circuitry.
Input to the RF Prescaler. This low-level input signal is ac-coupled from the IF VCO.
Ground Pin for the IF Digital, Interface, and Control Circuitry.
Output from the IF Charge Pump. This is normally connected to a loop filter which drives the input
to an external VCO.
VDD2 is 3 V, it can be set to 6 V and used to drive a VCO with a tuning range up to 6 V.
2Power Supply for the IF, Digital and Interface Section. Decoupling capacitors to the ground plane should
DD
be placed as close as possible to this pin. V
DD
2 should have a value of between 2.7 V and 5.5 V. VDD2
TPC 16. ADF4213 Phase Noise (Referred to CP Output)
vs. PFD Frequency
–60
VDD = 3V
= 5V
V
–70
P
–80
PHASE NOISE – dBc/Hz
–90
–100
–20
TEMPERATURE – C
100–40020406080
TPC 14. ADF4213 Phase Noise vs. Temperature (900 MHz,
200 kHz, 20 kHz)
–5
–15
–25
–35
–45
–55
–65
–75
–85
FIRST REFERENCE SPUR – dBc
–95
–105
1
TUNING VOLTAGE – Volts
TPC 15. ADF4213 Reference Spurs (200 kHz) vs. V
VDD = 3V
= 5V
V
P
50234
TUNE
(900 MHz, 200 kHz, 20 kHz)
–80
–90
FIRST REFERENCE SPUR – dBc
–100
–20
TEMPERATURE – C
100–40020406080
TPC 17. ADF4213 Reference Spurs vs. Temperature
(900 MHz, 200 kHz, 20 kHz)
–60
VDD = 3V
= 5V
V
–70
–80
PHASE NOISE – dBc/Hz
–90
–100
–20
TEMPERATURE – C
P
100–40020406080
TPC 18. ADF4213 Phase Noise vs. Temperature
(836 MHz, 30 kHz, 3 kHz)
–8–
REV. A
ADF4210/ADF4211/ADF4212/ADF4213
13-BIT B-
COUNTER
5-BIT A-
COUNTER
PRESCALER
P/P + 1
FROM RF
INPUT STAGE
MODULUS
CONTROL
N = BP + A
LOAD
LOAD
TO PFD
–60
VDD = 3V
= 5V
V
–70
–80
–90
FIRST REFERENCE SPUR – dBc
–100
–20
TEMPERATURE – C
P
100–40020406080
TPC 19. ADF4213 Reference Spurs vs. Temperature
(836 MHz, 30 kHz, 3 kHz)
CIRCUIT DESCRIPTION
REFERENCE INPUT SECTION
The reference input stage is shown below in Figure 2. SW1 and
SW2 are normally-closed switches. SW3 is normally-open. When
power-down is initiated, SW3 is closed and SW1 and SW2 are
opened. This ensures that there is no loading of the REF
IN
pin
on power-down.
POWER-DOWN
CONTROL
100k
NC
REF
SW1
NO
SW2
SW3
NC = NO CONNECT
IN
NC
BUFFER
TO R COUNTER
Figure 2. Reference Input Stage
RF/IF INPUT STAGE
The RF/IF input stage is shown in Figure 3. It is followed by a
2-stage limiting amplifier to generate the CML (Current Mode
Logic) clock levels needed for the prescaler.
PRESCALER (P/P + 1)
The dual modulus prescaler (P/P + 1), along with the A and
B counters, enables the large division ratio, N, to be realized
(N = PB + A). The dual-modulus prescaler, operating at CML
levels, takes the clock from the RF/IF input stage and divides
it down to a manageable frequency for the CMOS A and B
counters in the RF and If sections. The prescaler in both
sections is programmable. It can be set in software to 8/9, 16/17,
32/33, or 64/65. See Tables IV and VI. It is based on a synchronous 4/5 core.
RF/IF A AND B COUNTERS
The A and B CMOS counters combine with the dual modulus
prescaler to allow a wide ranging division ratio in the PLL
feedback counter. The counters are specified to work when the
prescaler output is 200 MHz or less, when V
= 5 V. Typically,
DD
they will work with 250 MHz output from the prescaler. Thus,
with an RF input frequency of 2.5 GHz, a prescaler value of
16/17 is valid, but a value of 8/9 is not valid.
Pulse Swallow Function
The A and B counters, in conjunction with the dual modulus
prescaler make it possible to generate output frequencies which
are spaced only by the Reference Frequency divided by R. The
equation for the VCO frequency is as follows:
f
= [(P × B) + A] × f
VCO
f
= Output Frequency of external voltage controlled
VCO
REFIN
/R
oscillator (VCO).
P= Preset modulus of dual modulus prescaler (8/9,
16/17, etc.).
B= Preset Divide Ratio of binary 13-bit counter
(3 to 8191).
A= Preset Divide Ratio of binary 6-bit A counter
(0 to 63).
f
= External reference frequency oscillator.
REFIN
R= Preset divide ratio of binary 15-bit programmable refer-
ence counter (1 to 32767).
REV. A
RFINA
RF
GENERATOR
B
IN
BIAS
1.6V
2k2k
Figure 3. RF/IF Input Stage
AV
AGND
DD
Figure 4. RF/IF A and B Counters
RF/IF COUNTER
The 15-bit RF/IF R counter allows the input reference frequency to be divided down to product the input clock to the
phase frequency detector (PFD). Division ratios from 1 to
32767 are allowed.
–9–
ADF4210/ADF4211/ADF4212/ADF4213
PHASE FREQUENCY DETECTOR (PFD) AND CHARGE
PUMP
The PFD takes inputs from the R counter and N counter and
produces an output proportional to the phase and frequency
difference between them. Figure 5 is a simplified schematic.
The PFD includes a fixed-delay element that sets the width of
the antibacklash pulse. This is typically 3 ns. This pulse ensures
that there is no deadzone in the PFD transfer function and gives
a consistent reference spur level.
V
P
CHARGE
PUMP
CP
CPGND
HI
R DIVIDER
HI
N DIVIDER
R DIVIDER
N DIVIDER
CP OUTPUT
U1
CLR1
CLR2
U2
UP
Q1D1
DELAY
DOWN
Q2D2
U3
Lock Detect
MUXOUT can be programmed for two types of lock detect:
Digital Lock Detect and Analog Lock Detect. Digital Lock
Detect is active high. It is set high when the phase error on three
consecutive Phase Detector cycles is less than 15 ns. It will stay
set high until a phase error of greater than 25 ns is detected on
any subsequent PD cycle. The N-channel open-drain analog
lock detect should be operated with an external pull-up resistor
of 10 kΩ nominal. When lock has been detected, it is high with
narrow low-going pulses.
RF/IF INPUT SHIFT REGISTER
The ADF421x family digital section includes a 24-bit input shift
register, a 14-bit IF R counter and a 18-bit IF N counter, comprising a 6-bit IF A counter and a 12-bit IF B counter. Also
present is a 14-bit RF R counter and an 18-bit RF N counter,
comprising a 6-bit RF A counter and a 12-bit RF B counter.
Data is clocked into the 24-bit shift register on each rising edge
of CLK. The data is clocked in MSB first. Data is transferred
from the shift register to one of four latches on the rising edge of
LE. The destination latch is determined by the state of the two
control bits (C2, C1) in the shift register. These are the two LSBs
DB1, DB0 as shown in the timing diagram of Figure 1. The
truth table for these bits is shown in Table VI. Table I shows a
summary of how the latches are programmed.
Table I. C2, C1 Truth Table
Control Bits
C2C1Data Latch
00IF R Counter
01IF AB Counter (A and B)
10RF R Counter
11RF AB Counter (A and B)
Figure 5. RF/IF PFD Simplified Schematic and Timing
(In Lock)
MUXOUT AND LOCK DETECT
The output multiplexer on the ADF421x family allows the
user to access various internal points on the chip. The state of
MUXOUT is controlled by P3, P4, P11, and P12. See Tables
III and V. Figure 6 shows the MUXOUT section in block diagram form.
0000LOGIC LOW STATE
0001IF ANALOG LOCK DETECT
0010IF REFERENCE DIVIDER OUTPUT
0011IF N DIVIDER OUTPUT
0100RF ANALOG LOCK DETECT
0101RF/IF ANALOG LOCK DETECT
0110IF DIGITAL LOCK DETECT
0111LOGIC HIGH STATE
1000RF REFERENCE DIVIDER OUTPUT
1001RF N DIVIDER OUTPUT
1010THREE-STATE OUTPUT
1011IF COUNTER RESET
1100RF DIGITAL LOCK DETECT
1101RF/IF DIGITAL LOCK DETECT
1110RF COUNTER RESET
1111IF AND RF COUNTER RESET
0000LOGIC LOW STATE
0001IF ANALOG LOCK DETECT
0010IF REFERENCE DIVIDER OUTPUT
0011IF N DIVIDER OUTPUT
0100RF ANALOG LOCK DETECT
0101RF/IF ANALOG LOCK DETECT
0110IF DIGITAL LOCK DETECT
0111LOGIC HIGH STATE
1000RF REFERENCE DIVIDER OUTPUT
1001RF N DIVIDER OUTPUT
1010THREE-STATE OUTPUT
1011IF COUNTER RESET
1100RF DIGITAL LOCK DETECT
1101RF/IF DIGITAL LOCK DETECT
1110RF COUNTER RESET
1111IF AND RF COUNTER RESET
N = BP + A, P IS PRESCALER VALUE SET IN THE FUNCTION LATCH. B
MUST BE GREATER THAN OR EQUAL TO A. FOR CONTIGUOUS
VALUES OF N F
REF
, N
MIN
is (P2 – P).
ADF4210/ADF4211/ADF4212/ADF4213
PROGRAM MODES
Table III and Table V show how to set up the Program Modes
in the ADF421x family. The following should be noted:
1. IF and RF Analog Lock Detect indicate when the PLL is in
lock. When the loop is locked and either IF or RF Analog
Lock Detect is selected, the MUXOUT pin will show a logic
high with narrow low-going pulses. When the IF/RF Analog
Lock Detect is chosen, the locked condition is indicated only
when both IF and RF loops are locked.
2. The IF Counter Reset mode resets the R and AB counters in
the IF section and also puts the IF charge pump into threestate. The RF Counter Reset mode resets the R and AB
counters in the RF section and also puts the RF charge
pump into three-state. The IF and RF Counter Reset mode
does both of the above. Upon removal of the reset bits, the
AB counter resumes counting in close alignment with the R
counter (maximum error is one prescaler output cycle).
3. The Fastlock mode uses MUXOUT to switch a second loop
filter damping resistor to ground during Fastlock operation.
Activation of Fastlock occurs whenever RF CP Gain in the
RF Reference counter is set to one.
IF Power-Down
It is possible to program the ADF421x family for either synchronous or asynchronous power-down on either the IF or RF side.
Synchronous IF Power-Down
Programming a “1” to P7 of the ADF421x family will initiate a
power-down. If P2 of the ADF421x family has been set to “0”
(normal operation), a synchronous power-down is conducted.
The device will automatically put the charge pump into threestate and then complete the power-down.
Asynchronous IF Power-Down
If P2 of the ADF421x family has been set to “1” (three-state the
IF charge pump), and P7 is subsequently set to “1,” an asynchronous power-down is conducted. The device will go into
power-down on the rising edge of LE, which latches the “1” to
the IF power-down bit (P7).
Synchronous RF Power-Down
Programming a “1” to P16 of the ADF421x family will initiate a
power-down. If P10 of the ADF421x family has been set to “0”
(normal operation), a synchronous power-down is conducted. The
device will automatically put the charge pump into three-state
and then complete the power-down.
Asynchronous RF Power-Down
If P10 of the ADF421x family has been set to “1” (three-state
the RF charge pump), and P16 is subsequently set to “1,” an
asynchronous power-down is conducted. The device will go into
power down on the rising edge of LE, which latches the “1” to
the RF power-down bit (P16).
Activation of either synchronous or asynchronous power-down
forces the IF/RF loop’s R and AB dividers to their load state
conditions and the IF/RF input section is debiased to a highimpedance state.
The REF
oscillator circuit is only disabled if both the IF and
IN
RF power-downs are set.
The input register and latches remain active and are capable of
loading and latching data during all the power-down modes.
The IF/RF section of the devices will return to normal powered
up operation immediately upon LE latching a “0” to the
appropriate power-down bit.
–16–
IF SECTION
PROGRAMMABLE IF REFERENCE (R) COUNTER
If control bits C2, C1 are 0, 0, the data is transferred from the
input shift register to the 14-bit IFR counter. Table III shows
the input shift register data format for the IFR counter and the
divide ratios possible.
IF Phase Detector Polarity
P1 sets the IF Phase Detector Polarity. When the IF VCO characteristics are positive this should be set to “1.” When they are
negative it should be set to “0.” See Table III.
IF Charge Pump Three-State
P2 puts the IF charge pump into three-state mode when programmed to a “1.” It should be set to “0” for normal operation.
See Table III.
IF PROGRAM MODES
Table III and Table V show how to set up the Program Modes
in the ADF421x family.
IF Charge Pump Currents
IFCP2, IFCP1, IFCP0 program current setting for the IF
charge pump. See Table III.
PROGRAMMABLE IF AB COUNTER
If control bits C2, C1 are 0, 1, the data in the input register is used
to program the IF AB counter. The N counter consists of a 6-bit
swallow counter (A counter) and 12-bit programmable counter
(B counter). Table IV shows the input register data format for
programming the IF AB counter and the possible divide ratios.
IF Prescaler Value
P5 and P6 in the IF A, B Counter Latch sets the IF prescaler
value. See Table IV.
IF Power-Down
Table III and Table V show the power-down bits in the
ADF421x family.
IF Fastlock
The IF CP Gain bit (P8) of the IF N register in the ADF421x
family is the Fastlock Enable Bit. Only when this is “1” is IF
Fastlock enabled. When Fastlock is enabled, the IF CP current
is set to its maximum value. Since the IF CP Gain bit is contained in the IF N Counter, only one write is needed to both
program a new output frequency and also initiate Fastlock. To
come out of Fastlock, the IF CP Gain bit on the IF N register
must be set to “0.” See Table IV.
RF SECTION
PROGRAMMABLE RF REFERENCE (R) COUNTER
If control bits C2, C1 are 1, 0, the data is transferred from the
input shift register to the 14-bit RFR counter. Table V shows
the input shift register data format for the RFR counter and the
possible divide ratios.
RF Phase Detector Polarity
P9 sets the IF Phase Detector Polarity. When the RF VCO
characteristics are positive this should be set to “1.” When they
are negative it should be set to “0.” See Table V.
RF Charge Pump Three-State
P10 puts the RF charge pump into three-state mode when programmed to a “1.” It should be set to “0” for normal operation.
See Table V.
REV. A
ADF4210/ADF4211/ADF4212/ADF4213
RF PROGRAM MODES
Table III and Table V show how to set up the Program Modes
in the ADF421x family.
RF Charge Pump Currents
RFCP2, RFCP1, RFCP0 program current setting for the RF
charge pump. See Table V.
PROGRAMMABLE RF N COUNTER
If control bits C2, C1 are 1, 1, the data in the input register is
used to program the RF N (A + B) counter. The N counter
consists of a 6-bit swallow counter (A Counter) and 12-bit
programmable counter (B Counter). Table IV shows the input
register data format for programming the RF N counter and the
possible divide ratios.
RF Prescaler Value
P14 and P15 in the RF A, B Counter Latch sets the RF prescaler value. See Table VI.
RF Power-Down
Table III and Table V show the power-down bits in the
ADF421x family.
RF Fastlock
The RF CP Gain bit (P17) of the RF N register in the ADF421x
family is the Fastlock Enable Bit. Only when this is “1” is IF
Fastlock enabled. When Fastlock is enabled, the RF CP current
is set to its maximum value. Also an extra loop filter damping
resistor to ground is switched in using the FL
pin, thus com-
O
pensating for the change in loop characteristics while in Fastlock.
Since the RF CP Gain bit is contained in the RF N Counter, only
one write is needed to both program a new output frequency and
also initiate Fastlock. To come out of Fastlock, the RF CP Gain bit
on the RF N register must be set to “0.” See Table VI.
APPLICATIONS SECTION
Local Oscillator for GSM Handset Receiver
Figure 7 shows the ADF4210/ADF4211/ADF4212/ADF4213
being used with a VCO to produce the LO for a GSM base
station transmitter.
The reference input signal is applied to the circuit at FREF
IN
and, in this case, is terminated in 50 Ω. A typical GSM system
would have a 13 MHz TCXO driving the reference input without any 50 Ω termination. In order to have a channel spacing of
200 kHz (the GSM standard), the reference input must be
divided by 65, using the on-chip reference.
WIDEBAND PLL
Many of the wireless applications for synthesizers and VCOs in
PLLs are narrowband in nature. These applications include
various wireless standards such as GSM, DSC1800, CDMA, or
WCDMA. In each of these cases, the total tuning range for the
local oscillator is less than 100 MHz. However, there are also
wideband applications where the local oscillator could have up
to an octave tuning range. For example, cable TV tuners have
a total range of about 400 MHz. Figure 8 shows an application where the ADF4213 is used to control and program the
Micronetics M3500–1324. The loop filter was designed for an
RF output of 2100 MHz, a loop bandwidth of 40 kHz, a PFD
frequency of 1 MHz, I
of 10 mA (2.5 mA synthesizer I
CP
CP
multiplied by the gain factor of 4), VCO KD of 80 MHz/V (sensitivity of the M3500–1324 at an output of 2100 MHz) and a
phase margin of 45°C.
In narrowband applications, there is generally a small variation
(less than 10%) in output frequency and also a small variation
(typically < 10%) in VCO sensitivity over the range. However,
100pF
100pF
18
18
18
RF
OUT
IF
OUT
100pF
18
18
100pF
18
DECOUPLING CAPACITORS (22F/10PF) ON VDD, VP OF THE
ADF4211/ADF4212/ADF4213 AND ON V
BEEN OMITTED FROM THE DIAGRAM TO AID CLARITY.
51
V
CC
VCO190-
540T
100pF
FREF
620pF
IN
3.3k
5.6k
8.2nF
1.3nF
2.7k
1000pF1000pF
51
OF THE VCOS HAVE
CC
V
VP2
CP
IF
R
SET
RFINB
P
V
DD
VDD2VDD1
REF
ADF4210/
ADF4211/
ADF4212/
ADF4213
RF
RF
AGND
DGND
IN
MUXOUT
IF
DGND
VP1
CP
RF
CLK
IF
DATA
AGND
V
P
620pF
V
CC
VCO190-
902T
51
RF
1.3nF
IN
LE
3.3k
5.6k
8.2nF
LOCK
DETECT
100pF
SPI-COMPATIBLE SERIAL BUS
Figure 7. GSM Handset Receiver Local Oscillator Using the ADF4210/ADF4211/ADF4212/ADF4213
REV. A
–17–
ADF4210/ADF4211/ADF4212/ADF4213
DD
VDD2
IN
ADF4213
RF
DGND
V
VP1VDD1
MUXOUT
RF
AGND
P
CP
RF
IF
DGND
VP2
R
RF
SET
IN
IF
AGND
2.7k
100pF
3.9nF
LOCK
DETECT
20k
27nF
470
51
DECOUPLING CAPACITORS ON VDD, VP OF THE ADF4213,
ON V
HAVE BEEN OMITTED FROM THE DIAGRAM TO AID CLARITY.
THE IF SECTION OF THE CIRCUIT HAS ALSO BEEN OMITTED TO
SIMPLIFY THE SCHEMATIC.
FREF
1000pF
IN
1000pF
51
SPI-COMPATIBLE SERIAL BUS
V
REF
CE
CLK
DATA
LE
Figure 8. Wideband PLL Circuit
in wide-band applications both of these parameters have a much
greater variation. In Figure 8, for example, we have –25% and
+30% variation in the RF output from the nominal 1.8 GHz.
The sensitivity of the VCO can vary from 130 MHz/V at
1900 MHz to 30 MHz/V at 2400 MHz. Variations in these
parameters will change the loop bandwidth. This in turn can
affect stability and lock time. By changing the programmable
, it is possible to obtain compensation for these varying
I
CP
loop conditions and ensure that the loop is always operating
close to optimal conditions.
INTERFACING
The ADF4210/ADF4211/ADF4212/ADF4213 family has a
simple SPI-compatible serial interface for writing to the device.
SCLK, SDATA, and LE control the data transfer. When LE
(Latch Enable) goes high, the 22 bits that have been clocked
into the input register on each rising edge of SCLK will be
transferred to the appropriate latch. See Figure 1 for the Timing
Diagram and Table I for the Latch Truth Table.
The maximum allowable serial clock rate is 20 MHz. This
means that the maximum update rate possible for the device is
909 kHz, or one update every 1.1 ms. This is certainly more
than adequate for systems that will have typical lock times in
hundreds of microseconds.
ADuC812 to ADF421x Family Interface
Figure 9 shows the interface between the ADF421x family and
the ADuC812 microconverter. Since the ADuC812 is based on
an 8051 core, this interface can be used with any 8051-based
microcontroller. The microconverter is set up for SPI Master
Mode with CPHA = 0. To initiate the operation, the I/O port
driving LE is brought low. Each latch of the ADF421x family
needs a 24-bit word. This is accomplished by writing three 8-bit
bytes from the microconverter to the device. When the third
byte has been written, the LE input should be brought high to
complete the transfer.
On first applying power to the ADF421x family, it needs four
writes (one each to the R counter latch and the AB counter latch
for both RF1 and RF2 sides) for the output to become active.
18
RF
18
18
OUT
20V
3k
1k
AD820
130pF
OF THE AD820 AND ON THE VCC OF THE M3500-1324
CC
12V
V
V_TUNE
M3500-1324
GND
CC
OUT
100pF
100pF
When operating in the mode described, the maximum SCLOCK
rate of the ADuC812 is 4 MHz. This means that the maximum
rate at which the output frequency can be changed will be about
180 kHz.
SCLOCK
MOSI
ADuC812
I/O PORTS
SCLK
SDATA
ADF4210/
ADF4211/
LE
ADF4212/
ADF4213
CE
MUXOUT
(LOCK DETECT)
Figure 9. ADuC812 to ADF421x Family Interface
ADSP-21xx to ADF421x Family Interface
Figure 10 shows the interface between the ADF421x family and
the ADSP-21xx Digital Signal Processor. As previously discussed,
the ADF421x family needs a 24-bit serial word for each latch
write. The easiest way to accomplish this, using the ADSP-21xx
family, is to use the Autobuffered Transmit Mode of operation
with Alternate Framing. This provides a means for transmitting
an entire block of serial data before an interrupt is generated.
Set up the word length for eight bits and use three memory
locations for each 24-bit word. To program each 24-bit latch,
store the three 8-bit bytes, enable the Autobuffered mode, and
write to the transmit register of the DSP. This last operation
initiates the autobuffer transfer.
SCLK
SDATA
ADF4210/
ADF4211/
LE
ADF4212/
ADF4213
CE
MUXOUT
(LOCK DETECT)
ADSP-21xx
I/O FLAGS
SCLK
DT
TFS
Figure 10. ADSP-21xx to ADF421x Family Interface
–18–
REV. A
ADF4210/ADF4211/ADF4212/ADF4213
2011
101
0.256 (6.50)
0.246 (6.25)
0.177 (4.50)
0.169 (4.30)
PIN 1
0.260 (6.60)
0.252 (6.40)
SEATING
PLANE
0.006 (0.15)
0.002 (0.05)
0.0118 (0.30)
0.0075 (0.19)
0.0256 (0.65)
BSC
0.0433 (1.10)
MAX
0.0079 (0.20)
0.0035 (0.090)
0.028 (0.70)
0.020 (0.50)
8
0
PCB Guidelines for Chip Scale Package
The lands on the chip scale package (CP-20), are rectangular.
The printed circuit board pad for these should be 0.1 mm
longer than the package land length and 0.05 mm wider than
the package land width. The land should be centered on the
pad. This will ensure that the solder joint size is maximized.
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, there
should be clearance of at least 0.25 mm between the thermal
pad and inner edges of the pad pattern. This will ensure that
shorting is avoided.
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
Thin Shrink Small Outline Package (TSSOP)
(RU-20)
Thermal vias may be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at 1.2 mm
grid pitch. The via diameter should be between 0.3 mm and
0.33 mm and the via barrel should be plated with 1 oz. copper
to plug the via. The user should connect the printed circuit
board pad to AGND.