ANALOG DEVICES ADCMP563 Service Manual

A
Dual, High Speed ECL Comparators

FEATURES

Differential ECL-compatible outputs 700 ps propagation delay input to output 75 ps propagation delay dispersion Input common-mode range: –2.0 V to +3.0 V Robust input protection Differential latch control Internal latch pull-up resistors Power supply rejection greater than 85 dB 700 ps minimum pulse width
1.5 GHz equivalent input rise time bandwidth Typical output rise/fall time of 500 ps ESD protection > 4kV HBM, >200V MM Programmable hysteresis

APPLICATIONS

Automatic test equipment High speed instrumentation Scope and logic analyzer front ends Window comparators High speed line receivers Threshold detection Peak detection High speed triggers Patient diagnostics Hand-held test instruments Zero crossing detectors Line receivers and signal restoration Clock drivers

GENERAL DESCRIPTION

The ADCMP563/ADCMP564 are high speed comparators fabricated on Analog Devices’ proprietary XFCB process. The devices feature a 700 ps propagation delay with less than 75 ps overdrive dispersion. Dispersion, a measure of the difference in propagation delay under differing overdrive conditions, is a particularly important characteristic of high speed comparators. A separate programmable hysteresis pin is available on the ADCMP564.
A differential input stage permits consistent propagation delay with a wide variety of signals in the common-mode range from
−2.0 V to +3.0 V. Outputs are complementary digital signals
ADCMP563/ADCMP564

FUNCTIONAL BLOCK DIAGRAM

HYS*
NONINVERTING
INPUT
ADCMP563/
INVERTING
INPUT
LATCH ENABLE INPUT
ADCMP564
LATCH ENABLE INPUT
*ADCMP564 ONLY
Figure 1.
GND
04650-0-002
GND
–INA +INA
HYS
QA QA
LEA LEA
V
EE
QA QA
GND
LEA LEA
V –INA +INA
1
2
3
4
5
6
EE
7
8
ADCMP563
BRQ
TOP VIEW
(Not to Scale)
16
QB
15
QB
14
GND
13
LEB
12
LEB
11
V
CC
–INB
10
+INB
9
Figure 2. ADCMP563 16-Lead QSOP Figure 3. ADCMP564 20-Lead QSOP
LEA LEA GND
V
EE
16 15 14 13
1
2
3
4
V
CC
PIN1
ADCMP563
BCP
TOP VIEW
(Not to Scale)
LEB LEB GND
–INA
+INA
+INB
–INB
Figure 4. ADCMP563 16-Lead LFCSP
that are fully compatible with ECL 10 K and 10 KH logic families. The outputs provide sufficient drive current to directly drive transmission lines terminated in 50 Ω to −2 V. A latch input, which is included, permits tracking, track-and-hold, or sample-and-hold modes of operation. The latch input pins contain internal pull-ups that set the latch in tracking mode when left open.
The ADCMP563/ADCMP564 are specified over the industrial temperature range (−40°C to +85°C).
1
2
3
ADCMP564
4
5
TOP VIEW
(Not to Scale)
6
7
8
9
10
QA
12
QA
11
QB
10
9
QB
8765
Q OUTPUT
Q OUTPUT
BRQ
04650-0-026
04650-0-001
GND
20
QB
19
QB
18
GND
17
LEB
16
LEB
15
V
14
–INB
13
+INB
12
HYSB
11
CC
04650-0-012
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113©2004–2011 Analog Devices, Inc. All rights reserved.
ADCMP563/ADCMP564
TABLE OF CONTENTS
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 5
Thermal Considerations.............................................................. 5
ESD Caution.................................................................................. 5
Pin Configurations and Function Descriptions ........................... 6
Typical Performance Characteristics ............................................. 8
Timing Information ....................................................................... 10
Application Information................................................................ 11

REVISION HISTORY

6/11—Rev. B to Rev. C
Changes to Figure 4.......................................................................... 1
Changes to Figure 7 and LFCSP Pin Numbers (Table 3) ............ 6
Updated Outline Dimensions....................................................... 14
Changes to Ordering Guide.......................................................... 15
5/05—Rev. A to Rev. B
Added 16-Lead LFCSP.......................................................Universal
Changes to Applications .................................................................. 1
Changes to Table 1............................................................................ 3
Changes to Optimizing High Speed Performance Section....... 11
Changes to Comparator Hysteresis Section................................ 12
Changes to Minimum Input Slew Rate Requirement Section.. 12
Changes to Ordering Guide.......................................................... 14
Clock Timing Recovery............................................................. 11
Optimizing High Speed Performance ..................................... 11
Comparator Propagation Delay Dispersion............................... 11
Comparator Hysteresis .............................................................. 12
Minimum Input Slew Rate Requirement................................ 12
Typical Application C i r c uits ......................................................... 13
Outline Dimensions ....................................................................... 14
Ordering Guide .......................................................................... 15
7/04—Rev. 0 to Rev. A
Changes to Specification Table ....................................................... 4
Changes to Figure 14........................................................................ 9
Changes to Figure 21...................................................................... 12
Changes to Figure 23...................................................................... 13
4/04—Revision 0: Initial Version
Rev. C | Page 2 of 16
ADCMP563/ADCMP564

SPECIFICATIONS

VCC = +5.0 V, VEE = −5.2 V, TA = −40°C to +85°C. Typical values are at TA = +25°C, unless otherwise noted.
Table 1. Electrical Characteristics
Parameter Symbol Conditions Min Typ Max Unit
DC INPUT CHARACTERISTICS
Input Voltage Range −2.0 3.0 V Input Differential Voltage −5 +5 V Input Offset Voltage VOS V Input Offset Voltage Channel Matching ±2.0 mV Offset Voltage Temperature Coefficient ∆VOS/dT 2.0 μV/°C Input Bias Current IBC @ −IN = −2 V, +IN = +3 V −10.0 ±3 +10.0 μA Input Bias Current Temperature Coefficient 0.5 nA/°C Input Offset Current ±1.0 μA Input Capacitance CIN 0.75 pF Input Resistance, Differential Mode 750 kΩ Input Resistance, Common Mode 1800 kΩ Active Gain AV 63 dB Common-Mode Rejection Ratio CMRR VCM = −2.0 V to +3.0 V 80 dB Hysteresis R
LATCH ENABLE CHARACTERISTICS
Latch Enable Voltage Range −2.0 0 V Latch Enable Differential Input Voltage 0.4 2.0 V Latch Enable Input High Current @ 0.0 V −300 +300 μA Latch Enable Input Low Current @ −2.0 V −300 +300 μA LE Voltage, Open Latch inputs not connected −0.2 0 +0.1 V LE Voltage, Open
Latch inputs not connected −2.8 −2.6 −2.4 V Latch Setup Time tS V Latch Hold Time tH V Latch to Output Delay
t
t
PLOH
PLOL
,
Latch Minimum Pulse Width tPL V
DC OUTPUT CHARACTERISTICS
Output Voltage—High Level VOH ECL 50 Ω to −2.0 V −1.15 −0.81 V Output Voltage—Low Level VOL ECL 50 Ω to −2.0 V −1.95 −1.54 V Rise Time tR 10% to 90% 530 ps Fall Time tF 10% to 90% 450 ps
AC PERFORMANCE
Propagation Delay tPD V V Propagation Delay Temperature Coefficient ∆tPD /dT VOD = 1 V 0.25 ps/°C Prop Delay Skew—Rising Transition to Falling
V
Transition
Within Device Propagation Delay Skew—
V
Channel-to-Channel Overdrive Dispersion 20 mV ≤ VOD ≤ 100 mV 75 ps 100 mV ≤ VOD ≤ 1.5 V 75 ps Slew Rate Dispersion 0.4 V/ns ≤ SR ≤ 1.33 V/ns 50 ps Pulse Width Dispersion 750ps ≤ PW ≤ 10 ns 25 ps Duty Cycle Dispersion 33 MHz, 1 V/ns, 0.5 V 10 ps Common-Mode Voltage Dispersion 1 V swing, −1.5 V ≤ VCM ≤ +2.5 V 10 ps
= 0 V −10.0 ±2.0 +10.0 mV
CM
= ∞ ±1.0 mV
HYS
= 250 mV 200 ps
OD
= 250 mV 200 ps
OD
= 250 mV 500 ps
V
OD
= 250 mV 500 ps
OD
= 1 V 700 ps
OD
= 20 mV 830 ps
OD
= 1 V 50 ps
OD
= 1 V 50 ps
OD
Rev. C | Page 3 of 16
ADCMP563/ADCMP564
Parameter Symbol Conditions Min Typ Max Unit
AC PERFORMANCE (Continued)
Equivalent Input Rise Time Bandwidth1 BWEQ 0 V to 1 V swing, 2 V/ns 1500 MHz Maximum Toggle Rate >50% output swing, 50% duty cycle 800 MHz Minimum Pulse Width PW RMS Random Jitter
Unit to Unit Propagation Delay Skew 100 ps
POWER SUPPLY
Positive Supply Current I Negative Supply Current I Positive Supply Voltage VCC Dual 4.75 5.0 5.25 V Negative Supply Voltage VEE Dual −4.96 −5.2 −5.45 V Power Dissipation PD Dual, without load 90 120 150 mW Dual, with load 150 180 230 mW DC Power Supply Rejection Ratio—VCC PSRR DC Power Supply Rejection Ratio—VEE PSRR
HYSTERESIS (ADCMP564 Only)
Hysteresis R R Hysteresis Pin Bias Voltage Referred to AGND −1 V Hysteresis Pin Series Resistance 3
1
Equivalent input rise time bandwidth assumes a first-order input response and is calculated by the following formula: BWEQ = 0.22/√(tr
20/80 input transition time applied to the comparator and tr
is the effective transition time, as digitized by the comparator input.
COMP
ΔtPD < 25 ps 700 ps
MIN
= 400 mV, 1.3 V/ns, 312 MHz,
V
OD
1.0 ps
50% duty cycle
@ +5.0 V 2 3.2 5 mA
VCC
@ −5.2 V 10 19 25 mA
VEE
85 dB
VCC
85 dB
VEE
= 23.5 kΩ 20 mV
HYS
= 9.0 kΩ 70 mV
HYS
2
2
– tr
COMP
), where trIN is the
IN
Rev. C | Page 4 of 16
ADCMP563/ADCMP564

ABSOLUTE MAXIMUM RATINGS

Table 2.
Parameter Rating
Supply Voltages
Positive Supply Voltage (VCC to GND) −0.5 V to +6.0 V Negative Supply Voltage (VEE to GND) −6.0 V to +0.5 V Ground Voltage Differential −0.5 V to +0.5 V
Input Voltages
Input Common-Mode Voltage −3.0 V to +4.0 V Differential Input Voltage −7.0 V to +7.0 V Input Voltage, Latch Controls VEE to +0.5 V
Output
Output Current 30 mA
Temperature
Operating Temperature, Ambient −40°C to +85°C Operating Temperature, Junction 125°C Storage Temperature Range −65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL CONSIDERATIONS

The ADCMP563 QSOP 16-lead package option has a θJA (junction-to-ambient thermal resistance) of 104°C/W in still air.
The ADCMP563 LFCSP 16-lead package option has a θ (junction-to-ambient thermal resistance) of 70°C/W in still air.
The ADCMP564 QSOP 20-lead package option has a θ (junction-to-ambient thermal resistance) of 80°C/W in still air.
JA
JA

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. C | Page 5 of 16
ADCMP563/ADCMP564
A

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

QA QA
GND
LEA LEA
V –INA +INA
1
2
3
4
5
6
EE
7
8
ADCMP563
BRQ
TOP VIEW
(Not to Scale)
16
QB
15
QB
14
GND
13
LEB
12
LEB
11
V
CC
10
–INB +INB
9
Figure 5. ADCMP563 16-Lead QSOP
Pin Configuration
GND
1
QA
2
QA
3
ADCMP564
GND
4
5
(Not to Scale)
6
7
8
9
10
BRQ
TOP VIEW
LEA LEA
V
EE
–INA
04650-0-002
+INA
HYS
Figure 6. ADCMP564 20-Lead QSOP
Pin Configuration
GND
20
QB
19
QB
18
GND
17
LEB
16
LEB
15
V
14
CC
–INB
13
+INB
12
HYSB
11
04650-0-012
Table 3. Pin Function Descriptions
Pin No.
ADCMP563 16-Lead QSOP
ADCMP563 16-Lead LFCSP
ADCMP564 20-Lead QSOP
Mnemonic
Function
1 GND Analog Ground. 1 11 2 QA
One of Two Complementary Outputs for Channel A. QA is logic high if the analog voltage at the noninverting input is greater than the analog voltage at the inverting input (provided the comparator is in compare mode). See the description of the LEA pin for more information.
2 12 3
One of Two Complementary Outputs for Channel A. QA is logic low if the
QA
analog voltage at the noninverting input is greater than the analog voltage at the inverting input (provided the comparator is in compare mode). See
the description of the LEA pin for more information. 3 13 4 GND Analog Ground. 4 14 5 LEA
One of Two Complementary Inputs for Channel A Latch Enable. In compare
mode (logic high), the output tracks change at the input of the comparator.
In latch mode (logic low), the output reflects the input state just prior to the
comparator being placed in the latch mode. LEA
conjunction with LEA. If left unconnected, the comparator defaults to
compare mode. 5 15 6
LEA One of Two Complementary Inputs for Channel A Latch Enable. In compare
mode (logic low), the output tracks change at the input of the comparator.
In latch mode (logic high), the output reflects the input state just prior to the
comparator being placed in the latch mode. LEA must be driven in
conjunction with LEA
. If left unconnected, the comparator defaults to
compare mode. 6 16 7 V 7 1 8 −INA
Negative Supply Terminal.
EE
Inverting Analog Input of the Differential Input Stage for Channel A. The
Inverting A input must be driven in conjunction with the Noninverting A input. 8 2 9 +INA
Noninverting Analog Input of the Differential Input Stage for Channel A. The
Noninverting A input must be driven in conjunction with the Inverting A input. 10 HYSA 11 HYSB 9 3 12 +INB
Programmable Hysteresis Input.
Programmable Hysteresis Input.
Noninverting Analog Input of the Differential Input Stage for Channel B. The
Noninverting B input must be driven in conjunction with the Inverting B input. 10 4 13 −INB
Inverting Analog Input of the Differential Input Stage for Channel B. The
Inverting B input must be driven in conjunction with the Noninverting B input. 11 5 14 V
Positive Supply Terminal.
CC
V
LEA LEA GND
EE
16 15 14 13
1
2
3
4
V
CC
PIN1
ADCMP563
BCP
TOP VIEW
(Not to Scale)
LEB LEB GND
QA
12
QA
11
QB
10
9
QB
8765
–INA
+INA
+INB
–INB
NOTES:
1. T HE EXPOSED PAD SHOULD BE EITHER CONNECTED TO VEE OR LEFT FLOATING.
Figure 7. ADCMP563 16-Lead LFCSP
Pin Configuration
must be driven in
04650-0-027
Rev. C | Page 6 of 16
ADCMP563/ADCMP564
Pin No.
ADCMP563 16-Lead QSOP
12 6 15
13 7 16 LEB
14 8 17 GND Analog Ground. 15 9 18
16 10 19 QB
20 GND Analog Ground. EPAD EPAD
ADCMP563 16-Lead LFCSP
ADCMP564 20-Lead QSOP
Mnemonic Function
One of Two Complementary Inputs for Channel B Latch Enable. In compare
LEB
mode (logic low), the output tracks change at the input of the comparator. In latch mode (logic high), the output reflects the input state just prior to the comparator being placed in the latch mode. LEB must be driven in conjunction with LEB
One of Two Complementary Inputs for Channel B Latch Enable. In compare mode (logic high), the output tracks change at the input of the comparator. In latch mode (logic low), the output reflects the input state just prior to the comparator being placed in the latch mode. LEB with LEB. If left unconnected, the comparator defaults to compare mode.
One of Two Complementary Outputs for Channel B. QB is logic low if the
QB
analog voltage at the noninverting input is greater than the analog voltage at the inverting input (provided the comparator is in compare mode). See the description of the LEB pin for more information.
One of Two Complementary Outputs for Channel B. QB is logic high if the analog voltage at the noninverting input is greater than the analog voltage at the inverting input (provided the comparator is in compare mode). See the description of the LEB pin for more information.
Exposed Pad. The exposed pad should be either connected to VEE or left floating.
. If left unconnected, the comparator defaults to compare mode.
must be driven in conjunction
Rev. C | Page 7 of 16
ADCMP563/ADCMP564

TYPICAL PERFORMANCE CHARACTERISTICS

VCC = 3.3 V, TA = 25°C, unless otherwise noted.
3.0
2.5
2.0
1.5
1.0
0.5
0
INPUT BIAS CURRENT (μA)
–0.5
–1.0
–2.5 –1.5 –0.5 0.5 1.5 2.5 3.5
NONINVERTING INPUT VOLTAGE (INVERTING VOLTAGE = 0V)
Figure 8. Input Bias Current vs. Input Voltage
2.00
1.95
1.90
1.85
1.80
1.75
1.70
1.65
OFFSET VOLTAGE (mV)
1.60
1.55
1.50 –40–200 20406080
TEMPERATURE (°C)
Figure 9. Input Offset Voltage vs. Temperature
550
545
540
535
530
525
TIME (ps)
520
515
510
505
500
–40–30–20–100 102030405060708090
TEMPERATURE (°C)
Figure 10. Rise Time vs. Temperature
04650-0-013
04650-0-014
04650-0-015
2.80
2.78
2.76
2.74
2.72
2.70
2.68
(+IN = 3V, –IN = 0V)
2.66
2.64
+IN INPUT BIAS CURRENT (μA)
2.62
2.60 –40–200 20406080
TEMPERATURE (°C)
Figure 11. Input Bias Current vs. Temperature
–0.8
–1.0
–1.2
–1.4
–1.6
OUTPUT RISE AND FALL (V)
–1.8
–2.0
0 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00
TIME (ns)
Figure 12. Rise and Fall of Outputs vs. Time
475
470
465
460
455
450
TIME (ps)
445
440
435
430
425
–40–30–20–100 102030405060708090
TEMPERATURE (°C)
Figure 13. Fall Time vs. Temperature
04650-0-016
04650-0-017
04650-0-018
Rev. C | Page 8 of 16
ADCMP563/ADCMP564
720
705
715
710
705
700
695
690
PROPAGATION DELAY (ps)
685
680
–40–30–20–100 102030405060708090
TEMPERATURE (°C)
Figure 14. Propagation Delay vs. Temperature
140
120
100
80
60
40
04650-0-019
704
703
702
701
700
699
PROPAGATION DELAY (ps)
698
697
2–10123
INPUT COMMON-MODE VOLTAGE (V)
Figure 17. Propagation Delay vs. Common-Mode Voltage
25
20
15
10
5
04650-0-022
PROPAGATION DELAY ERROR (ps)
20
0
0 1.61.41.21.00.80.60.40.2
OVERDRIVE VOLTAGE (V)
Figure 15. Propagation Delay Error vs. Overdrive Voltage
160
140
120
100
80
60
40
PROGRAMMED HYSTERESIS (mV)
20
0
50 010203040
R
(kΩ)
HYS
Figure 16. Comparator Hysteresis vs. R
0
PROPAGATION DELAY ERROR (ps)
04650-0-020
–5
0.7 1.7 2.7 3.7 4.7 5.7 6.7 7.7 8.7 9.7 PULSE WIDTH (ns)
04650-0-023
Figure 18. Propagation Delay Error vs. Pulse Width
160
140
120
100
80
60
40
PROGRAMMED HYSTERESIS (mV)
20
04650-0-021
HYS
0
0 50 100 150
Figure 19. Comparator Hysteresis vs. I
I
HYS
(μA)
HYS
04650-0-024
Rev. C | Page 9 of 16
ADCMP563/ADCMP564

TIMING INFORMATION

LATCH ENABLE
LATCH ENABLE
DIFFERENTIAL
INPUT VOLTAGE
50%
t
S
t
H
V
IN
V
OD
t
PL
V
± V
REF
OS
Q OUTPUT
Q OUTPUT
t
PDL
t
t
PDH
F
t
R
t
PLOH
t
PLOL
50%
50%
04650-0-003
Figure 20. System Timing Diagram
Figure 20 shows the compare and latch features of the ADCMP563. Table 4 describes the terms in the diagram.
Table 4. Timing Descriptions
Symbol Timing Description
t
Input-to-Output High Delay
PDH
Propagation delay measured from the time the input signal crosses the reference (± the input offset voltage) to the 50% point of an output low-to-high transition.
t
Input-to-Output Low Delay
PDL
Propagation delay measured from the time the input signal crosses the reference (± the input offset voltage) to the 50% point of an output high-to-low transition.
t
Latch Enable to Output High Delay
PLOH
Propagation delay measured from the 50% point of the latch enable signal low-to-high transition to the 50% point of an output low-to-high transition.
t
Latch Enable to Output Low Delay
PLOL
Propagation delay measured from the 50% point of the latch enable signal low-to-high transition to the 50% point of an output high-to-low transition.
tH Minimum Hold Time
Minimum time after the negative transition of the latch enable signal that the input signal
must remain unchanged to be acquired and held at the outputs. tPL Minimum Latch Enable Pulse Width Minimum time the latch enable signal must be high to acquire an input signal change. tS Minimum Setup Time
Minimum time before the negative transition of the latch enable signal that an input
signal change must be present to be acquired and held at the outputs. tR Output Rise Time
Amount of time required to transition from a low to a high output as measured at the
20% and 80% points. tF Output Fall Time
Amount of time required to transition from a high to a low output as measured at the
20% and 80% points. VOD Voltage Overdrive Difference between the differential input and reference input voltages.
Rev. C | Page 10 of 16
ADCMP563/ADCMP564

APPLICATION INFORMATION

The ADCMP563/ADCMP564 comparators are very high speed devices. Consequently, high speed design techniques must be employed to achieve the best performance. The most critical aspect of any ADCMP563/ADCMP564 design is the use of a low impedance ground plane. A ground plane, as part of a multilayer board, is recommended for proper high speed performance. Using a continuous conductive plane over the surface of the circuit board can create this, allowing breaks in the plane only for necessary signal paths. The ground plane provides a low inductance ground, eliminating any potential differences at different ground points throughout the circuit board caused by ground bounce. A proper ground plane also minimizes the effects of stray capacitance on the circuit board.
It is also important to provide bypass capacitors for the power supply in a high speed application. A 1 μF electrolytic bypass capacitor should be placed within 0.5 inches of each power supply pin to ground. These capacitors reduce any potential voltage ripples from the power supply. In addition, a 10 nF ceramic capacitor should be placed as close as possible from the power supply pins on the ADCMP563/ADCMP564 to ground. These capacitors act as a charge reservoir for the device during high frequency switching.
The LATCH ENABLE input is active low (latched). If the latching function is not used, the LATCH ENABLE input can be left open or grounded (ground is an ECL logic high). The complementary input,
tied to −2.0 V. Leaving the latch inputs unconnected or providing the proper voltages disables the latching function.
Occasionally, one of the two comparator stages within the ADCMP563/ADCMP564 is not used. The inputs of the unused comparator should not be allowed to float. The high internal gain can cause the output to oscillate (possibly affecting the comparator that is being used), unless the output is forced into a fixed state. This is easily accomplished by ensuring that the two inputs are at least one diode drop apart, while also appropriately connecting the LATCH ENABLE and LATCH ENABLE
The best performance is achieved with the use of proper ECL terminations. The open emitter outputs of the ADCMP563/ ADCMP564 are designed to be terminated through 50 Ω resistors to −2.0 V, or any other equivalent ECL termination. If a
−2.0 V supply is not available, an 82 Ω resistor to ground and a 130 Ω resistor to −5.2 V provide a suitable equivalent. If high speed ECL signals must be routed more than a centimeter, microstrip or stripline techniques may be required to ensure proper transition times and prevent output ringing.
LATCH ENABLE
inputs as described previously.
, can be left open or

CLOCK TIMING RECOVERY

Comparators are often used in digital systems to recover clock timing signals. High speed square waves transmitted over a distance, even tens of centimeters, can become distorted due to stray capacitance and inductance. Poor layout or improper termination can also cause reflections on the transmission line, further distorting the signal waveform. A high speed comparator can be used to recover the distorted waveform while maintaining a minimum of delay.

OPTIMIZING HIGH SPEED PERFORMANCE

As with any high speed comparator amplifier, proper design and layout techniques should be used to ensure optimal performance from the ADCMP563/ADCMP564. The perfor­mance limits of high speed circuitry all too often are the result of stray capacitance, improper ground impedance, or other layout issues.
Minimizing resistance from source to the input is an important consideration in maximizing the high speed operation of the ADCMP563/ADCMP564. Source resistance, in combination with equivalent input capacitance, could cause a lagged response at the input, thus delaying the output. The input capacitance of the ADCMP563/ADCMP564, in combination with stray capacitance from an input pin to ground, could result in several picofarads of equivalent capacitance. A combination of 3 kΩ source resistance and 5 pF input capacitance yields a time constant of 15 ns, which is significantly slower than the 750 ps capability of the ADCMP563/ADCMP564. Source impedances should be significantly less than 100 Ω for best performance.
Sockets should be avoided due to stray capacitance and induc­tance. If proper high speed techniques are used, the devices should be free from oscillation when the comparator input signal passes through the switching threshold.

COMPARATOR PROPAGATION DELAY DISPERSION

The ADCMP563/ADCMP564 have been specifically designed to reduce propagation delay dispersion over an input overdrive range of 100 mV to 1.5 V. Propagation delay overdrive dispersion is the change in propagation delay that results from a change in the degree of overdrive (how far the switching point is exceeded by the input). The overall result is a higher degree of timing accuracy because the ADCMP563/ADCMP564 are far less sensitive to input variations than most comparator designs.
Rev. C | Page 11 of 16
ADCMP563/ADCMP564
Propagation delay dispersion is important in critical timing applications such as ATE, bench instruments, and nuclear instrumentation. Overdrive dispersion is defined as the varia­tion in propagation delay as the input overdrive conditions are changed (Figure 21). For the ADCMP563/ADCMP564, over­drive dispersion is typically 75 ps as the overdrive is changed from 100 mV to 1.5 V. This specification applies for both positive and negative overdrive because the ADCMP563 and the ADCMP564 have equal delays for positive and negative going inputs.
1.5V OVERDRI VE
INPUT VOLTAGE
20mV OVERDRIVE
± V
V
REF
OS
DISPERSION
Q OUTPUT
Figure 21. Propagation Delay Dispersion

COMPARATOR HYSTERESIS

The addition of hysteresis to a comparator is often useful in a noisy environment, or where it is not desirable for the compar­ator to toggle between states when the input signal is at the switching threshold. The transfer function for a comparator with hysteresis is shown in Figure 22. If the input voltage approaches the threshold from the negative direction, the comparator switches from 0 to 1 when the input crosses +V The new switching threshold becomes −V remains in a 1 state until the threshold −V coming from the positive direction. In this manner, noise centered on 0 V input does not cause the comparator to switch states unless it exceeds the region bounded by ±V
The customary technique for introducing hysteresis into a comparator uses positive feedback from the output back to the input. A limitation of this approach is that the amount of hysteresis varies with the output logic levels, resulting in hysteresis that can be load dependent and is not symmetrical about the threshold. The external feedback network can also introduce significant parasitics, which reduce high speed performance and can induce oscillation in some cases.
In the ADCMP564, hysteresis is generated through the programmable hysteresis pin. A resistor from the HYS pin to GND creates a current into the part that is used to generate hysteresis. Hysteresis generated in this manner is independent of output swing and is symmetrical around the trip point. The hysteresis vs. resistance curve is shown in Figure 23.
/2. The comparator
H
/2 is crossed while
H
04650-0-004
/2.
H
/2.
H
A current may be sourced into the HYS pin. The pin is biased approximately 1 V below AGND and has a 3 kΩ series resistance. The relationship between the current applied to the HYS pin and the resulting hysteresis is shown in Figure 19.
–V
H
2
0
0V
OUTPUT
Figure 22. Comparator Hysteresis Transfer Function
160
140
120
100
80
60
40
PROGRAMMED HYSTERESIS (mV)
20
0
50 010203040
R
HYS
Figure 23. Comparator Hysteresis vs. R
+V
H
2
INPUT
1
04650-0-005
04650-0-021
(kΩ)
HYS

MINIMUM INPUT SLEW RATE REQUIREMENT

As for all high speed comparators, a minimum slew rate must be met to ensure that the device does not oscillate as the input crosses the threshold. This oscillation is due in part to the high input bandwidth of the comparator and the parasitics of the package. ADI recommends a slew rate of 1 V/μs or faster to ensure a clean output transition. If slew rates less than 1 V/μs are used, hysteresis can be added to prevent the oscillation.
Rev. C | Page 12 of 16
ADCMP563/ADCMP564
A
V
V

TYPICAL APPLICATION CIRCUITS

V
IN
V
REF
ADCMP563/ ADCMP564
LATCH
ENABLE
INPUTS
ALL RESIS TORS 50Ω
–2.0V
Figure 24. High Speed Sampling Circuits
+V
REF
V
IN
–V
REF
LL RESISTORS 50Ω UNLESS OTHERWISE NOTED
ADCMP563/ ADCMP564
ADCMP563/ ADCMP564
LATCH
ENABLE
INPUTS
–2V
–2V
Figure 25. High Speed Window Comparator
OUTPUTS
OUTPUTS
OUTPUTS
04650-0-007
04650-0-008
V
IN
REF
ALL RESISTORS 50Ω, UNLESS OTHERWISE NOTED
ADCMP564
HYS
0Ω TO 80kΩ
OUTPUTS
–2.0V
Figure 26. Adding Hysteresis Using the HYS Control Pin
30Ω 50Ω
IN
ADCMP563/
ADCMP564
–5.2V
30Ω
127Ω127Ω
50Ω
Figure 27. One Method to Interface an ECL Output to an
Instrument with a 50 Ω to Ground Input
04650-0-009
04650-0-011
Rev. C | Page 13 of 16
ADCMP563/ADCMP564

OUTLINE DIMENSIONS

0.197 (5.00)
0.193 (4.90)
0.189 (4.80)
0.065 (1.65)
0.049 (1.25)
0.010 (0.25)
0.004 (0.10)
COPLANARITY
0.004 (0.10)
16
1
0.025 (0.64) BSC
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLYAND ARE NOT APPROPRIATE FOR USE IN DESIGN.
9
0.158 (4.01)
0.154 (3.91)
0.150 (3.81)
8
0.069 (1.75)
0.053 (1.35)
SEATING
0.012 (0.30)
0.008 (0.20)
COMPLIANT TO JEDEC STANDARDS MO-137-AB
PLANE
0.244 (6.20)
0.236 (5.99)
0.228 (5.79)
8° 0°
0.010 (0.25)
0.006 (0.15)
0.050 (1.27)
0.016 (0.41)
0.020 (0.51)
0.010 (0.25)
0.041 (1.04) REF
01-28-2008-A
Figure 28. 16-Lead Shrink Small Outline Package [QSOP]
(RQ-16)
Dimensions shown in inches and (millimeters)
0.345 (8.76)
0.341 (8.66)
0.337 (8.55)
20
11
0.158 (4.01)
0.154 (3.91)
0.150 (3.81)
101
0.244 (6.20)
0.236 (5.99)
0.228 (5.79)
0.065 (1.65)
0.049 (1.25)
0.010 (0.25)
0.004 (0.10)
COPLANARITY
0.004 (0.10)
8° 0°
0.010 (0.25)
0.006 (0.15)
0.050 (1.27)
0.016 (0.41)
0.069 (1.75)
0.053 (1.35)
SEATING
0.025 (0.64) BSC
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLYAND ARE NOT APPROPRIATE FOR USE IN DESIGN.
0.012 (0.30)
0.008 (0.20)
COMPLIANT TO JEDEC STANDARDS MO-137-AD
PLANE
Figure 29. 20-Lead Shrink Small Outline Package [QSOP]
(RQ-20)
Dimensions shown in inches and (millimeters)
Rev. C | Page 14 of 16
0.020 (0.51)
0.010 (0.25)
0.041 (1.04) REF
08-19-2008-A
ADCMP563/ADCMP564
0.45
0.50
BSC
1.50 REF
0.60 MAX
BOTTOM VIEW
13
12
9 8
FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET.
PIN 1
INDICATOR
0.90
0.85
0.80
SEATING
PLANE
12° MAX
3.00
BSC SQ
TOP
VIEW
0.30
0.23
0.18
2.75
BSC SQ
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.20 REF
*
COMPLIANT
EXCEPT FOR EXPOSED PAD DIMENSION.
TO
JEDEC STANDARDS MO-220-VEED-2
EXPOSED
PAD
0.50
0.40
0.30
16
1
4
5
P
N
I
N
I
D
*
1.65
1.50 SQ
1.35
0.25 MIN
1
A
R
O
T
C
I
07-17-2008-A
Figure 30. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm × 3 mm Body, Very Thin Quad
(CP-16-3)
Dimensions shown in millimeters

ORDERING GUIDE

Model1 Temperature Range Package Description Package Option Branding
ADCMP563BRQZ −40°C to +85°C 16-Lead QSOP RQ-16 ADCMP563BCPZ-R2 −40°C to +85°C 16-Lead LFCSP_VQ, 250 Unit Reel CP-16-3 G01 ADCMP563BCPZ-RL7 −40°C to +85°C 16-Lead LFCSP_VQ, 1,500 Unit Reel CP-16-3 G01 ADCMP563BCPZ-WP −40°C to +85°C 16-Lead LFCSP_VQ, 50 Unit Waffle Pack CP-16-3 G01 EVAL-ADCMP563BRQZ Evaluation Board ADCMP564BRQZ −40°C to +85°C 20-Lead QSOP RQ-20 EVAL-ADCMP564BRQZ Evaluation Board
1
Z = RoHS Compliant Part.
Rev. C | Page 15 of 16
ADCMP563/ADCMP564
NOTES
©2004–2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.
D04650–0–6/11(C)
Rev. C | Page 16 of 16
Loading...