JESD204A coded serial digital outputs
SNR = 73.7 dBFS at 70 MHz and 80 MSPS
SNR = 71.7 dBFS at 70 MHz and 155 MSPS
SFDR = 92 dBc at 70 MHz and 80 MSPS
SFDR = 92 dBc at 70 MHz and 155 MSPS
Low power: 423 mW at 80 MSPS, 567 mW at 155 MSPS
1.8 V supply operation
Integer 1-to-8 input clock divider
IF sampling frequencies to 250 MHz
−148.6 dBFS/Hz input noise at 180 MHz and 80 MSPS
−150.3 dBFS/Hz input noise at 180 MHz and 155 MSPS
Programmable internal ADC voltage reference
Flexible analog input range: 1.4 V p-p to 2.1 V p-p
ADC clock duty cycle stabilizer
Serial port control
User-configurable, built-in self-test (BIST) capability
Energy-saving power-down modes
APPLICATIONS
Communications
Diversity radio systems
Multimode digital receivers (3G and 4G)
GSM, EDGE, W-CDMA, LTE,
CDMA2000, WiMAX, TD-SCDMA
I/Q demodulation systems
Smart antenna systems
General-purpose software radios
Broadband data applications
Ultrasound equipment
AD9644
FUNCTIONAL BLOCK DIAGRAM
VDD
GND
AD9644
VIN+A
VIN–A
VCMA
VIN+B
VIN–B
VCMB
PDWN
PIPELINE
14-BIT ADC
PIPELINE
14-BIT ADC
REFERENCE
SERIAL PORT
(SPI)
SCLK SDIO CSB
Figure 1. 48-Lead 7 mm × 7 mm LFCSP
PRODUCT HIGHLIGHTS
1. An on-chip PLL allows users to provide a single ADC
sampling clock; the PLL multiplies the ADC sampling
clock to produce the corresponding JESD204A data rate
clock.
2. The configurable JESD204A output block supports up to
1.6 Gbps per channel data rate when using a dedicated
data link per ADC or 3.2 Gbps data rate when using a
single shared data link for both ADCs.
3. Proprietary differential input that maintains excellent SNR
performance for input frequencies up to 250 MHz.
4. Operation from a single 1.8 V power supply.
5. Standard serial port interface (SPI) that supports various
product features and functions, such as data formatting
(offset binary, twos complement, or gray coding),
controlling the clock DCS, power-down, test modes,
voltage reference mode, and serial output configuration.
DRVDDDRGND
14
14
JESD204A 8-BIT/ 10-BIT
CODING, SE RIALIZER AND
PLL
1 TO 8
CLOCK
DIVIDER
CLK+ CLK–
CML DRIVERS
DOUT+A
DOUT–A
DSYNC+A
DSYNC–A
DOUT+B
DOUT–B
DSYNC+B
DSYNC–B
SYNC
9180-001
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Changes to Output Test Modes Section ...................................... 29
Changes to SPI Accessible Features Section ............................... 32
4/11—Rev. 0 to Rev. A
Added Model -155......................................................... Throughout
Changes to Features Section and Figure 1 .....................................1
Changes to General Description Section .......................................3
Changes to Table 1.............................................................................4
Changes to Table 2.............................................................................5
Changes to Table 4.............................................................................8
Additions to TPC Introductory Statement ................................. 13
Changes to Speed Grade ID Bits in Table 17 .............................. 31
Changes to Ordering Guide.......................................................... 40
6/10—Revision 0: Initial Version
Rev. B | Page 2 of 44
AD9644
GENERAL DESCRIPTION
The AD9644 is a dual, 14-bit, analog-to-digital converter (ADC)
with a high speed serial output interface and sampling speeds
of either 80 MSPS or 155 MSPS.
The AD9644 is designed to support communications applications where high performance, combined with low cost, small
size, and versatility, is desired. The JESD204A high speed serial
interface reduces board routing requirements and lowers pin count
requirements for the receiving device.
The dual ADC core features a multistage, differential pipelined
architecture with integrated output error correction logic. Each
ADC features wide bandwidth differential sample-and-hold
analog input amplifiers that support a variety of user-selectable
input ranges. An integrated voltage reference eases design considerations. A duty cycle stabilizer is provided to compensate for
variations in the ADC clock duty cycle, allowing the converters
to maintain excellent performance.
By default the ADC output data is routed directly to the two
external JESD204A serial output ports. These outputs are at CML
voltage levels. Two modes are supported such that output coded
data is either sent through one data link or two. (L = 1; F = 4 or
L = 2; F = 2). Independent synchronization inputs (DSYNC) are
provided for each channel.
Flexible power-down options allow significant power savings,
when desired.
Programming for setup and control is accomplished using a 3-wire
SPI-compatible serial interface.
The AD9644 is available in a 48-lead LFCSP and is specified over
the industrial temperature range of −40°C to +85°C.
AD9644-80 AD9644-155
Parameter1 Temperature Min Typ Max Min Typ Max Unit
SIGNAL-TO-NOISE-RATIO (SNR)
fIN = 10 MHz 25°C 73.8 71.9 dBFS
fIN = 70 MHz 25°C 73.7 71.7 dBFS
fIN = 180 MHz
AD9644BCPZ-80
AD9644CCPZ-80
AD9644BCPZ-155
fIN = 220 MHz 25°C 72.0 71.0 dBFS
SIGNAL-TO-NOISE AND DISTORTION (SINAD)
fIN = 10 MHz 25°C 72.7 70.8 dBFS
fIN = 70 MHz 25°C 72.6 70.7 dBFS
fIN = 180 MHz 25°C 71.5 70.3 dBFS
AD9644BCPZ-80
AD9644CCPZ-80
AD9644BCPZ-155
fIN = 220 MHz 25°C 71.1 69.9 dBFS
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 10 MHz
fIN = 70 MHz
fIN = 180 MHz
fIN = 220 MHz
WORST SECOND OR THIRD HARMONIC
fIN = 10 MHz
fIN = 70 MHz
fIN = 180 MHz
AD9644BCPZ-80
AD9644CCPZ-80
AD9644BCPZ-155
fIN = 220 MHz
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
fIN = 10 MHz
fIN = 70 MHz
fIN = 180 MHz
AD9644BCPZ-80
AD9644CCPZ-80
AD9644BCPZ-155
fIN = 220 MHz
WORST OTHER (HARMONIC OR SPUR)
fIN = 10 MHz
fIN = 70 MHz
fIN = 180 MHz
AD9644BCPZ-80
AD9644CCPZ-80
AD9644BCPZ-155
fIN = 220 MHz
25°C 72.6 71.4 dBFS
Full 71.8 dBFS
Full 70.0 dBFS
Full 69.8 dBFS
Full 70.4 dBFS
Full 68.6 dBFS
Full 68.7 dBFS
25°C
25°C
25°C
25°C
25°C
25°C
25°C
Full
−94
−92
−87
−80
Full −73
Full
25°C
25°C
25°C
25°C
Full
−85
94
92
87
80
Full 73
Full
25°C
25°C
25°C
25°C
Full
Full
Full
25°C
85
−98
−98
−96
−90
−87
−95
11.8
11.8
11.6
11.5
11.5 Bits
11.5 Bits
11.4 Bits
11.3 Bits
−94 dBc
−92
−92 dBc
dBc
dBc
dBc
−90
−80
dBc
dBc
94 dBc
92 dBc
92 dBc
dBc
dBc
80 dBc
90 dBc
−97
−97
−95
dBc
dBc
dBc
dBc
dBc
−94
−89
dBc
dBc
Rev. B | Page 5 of 44
AD9644
AD9644-80 AD9644-155
Parameter1 Temperature Min Typ Max Min Typ Max Unit
TWO-TONE SFDR
fIN = +30 MHz (−7 dBFS ), +33 MHz (−7 dBFS )
fIN = +169 MHz (−7 dBFS ), +172 MHz (−7 dBFS )
CROSSTALK2
ANALOG INPUT BANDWIDTH3
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions.
2
Crosstalk is measured at 100 MHz with −1.0 dBFS on one channel and no input on the alternate channel.
3
Analog input bandwidth specifies the −3 dB input BW of the AD9644 input. The usable full-scale BW of the part with good performance is 250 MHz.
25°C
25°C
Full
25°C
93
89
−105
780
DIGITAL SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, 1.75 V p-p differential input, VIN = −1.0 dBFS differential input, and DCS enabled,
unless otherwise noted.
Table 3.
AD9644-80/AD9644-155
Parameter Temperature Min Typ Max Unit
DIFFERENTIAL CLOCK INPUTS (CLK+, CLK−)
Logic Compliance CMOS/LVDS/LVPECL
Internal Common-Mode Bias Full 0.9 V
Differential Input Voltage Full 0.3 3.6 V p-p
Input Voltage Range Full AGND AVDD V
Input Common-Mode Range Full 0.9 1.4 V
High Level Input Current Full −100 +100 μA
Low Level Input Current Full −100 +100 μA
Input Capacitance Full 4 pF
Input Resistance Full 8 10 12 kΩ
SYNC INPUT
Logic Compliance CMOS
Internal Bias Full 0.9 V
Input Voltage Range Full AGND AVDD V
High Level Input Voltage Full 1.2 AVDD V
Low Level Input Voltage Full AGND 0.6 V
High Level Input Current Full −100 +100 μA
Low Level Input Current Full −100 +100 μA
Input Capacitance Full 1 pF
Input Resistance Full 12 16 20 kΩ
DSYNC INPUT
Logic Compliance CMOS/LVDS
Internal Bias Full 0.9 V
Input Voltage Range Full AGND AVDD V
High Level Input Voltage Full 1.2 AVDD V
Low Level Input Voltage Full AGND 0.6 V
High Level Input Current Full −100 +100 μA
Low Level Input Current Full −100 +100 μA
Input Capacitance Full 1 pF
Input Resistance Full 12 16 20 kΩ
90 dBc
89 dBc
−105 dB
780 MHz
Rev. B | Page 6 of 44
AD9644
AD9644-80/AD9644-155
Parameter Temperature Min Typ Max Unit
LOGIC INPUT (CSB)1
Logic Compliance CMOS
High Level Input Voltage Full 1.22 2.1 V
Low Level Input Voltage Full 0 0.6 V
High Level Input Current Full −10 +10 μA
Low Level Input Current Full 40 132 μA
Input Resistance Full 26 kΩ
Input Capacitance Full 2 pF
LOGIC INPUT (SCLK, PDWN)2
Logic Compliance CMOS
High Level Input Voltage Full 1.22 2.1 V
Low Level Input Voltage Full 0 0.6 V
High Level Input Current (VIN = 1.8 V) Full −92 −135 μA
Low Level Input Current Full −10 +10 μA
Input Resistance Full 26 kΩ
Input Capacitance Full 2 pF
LOGIC INPUT/OUTPUT (SDIO)1
Logic Compliance CMOS
High Level Input Voltage Full 1.22 2.1 V
Low Level Input Voltage Full 0 0.6 V
High Level Input Current Full −10 +10 μA
Low Level Input Current Full 38 128 μA
Input Resistance Full 26 kΩ
Input Capacitance Full 5 pF
DIGITAL OUTPUTS
Logic Compliance Full CML
Differential Output Voltage (VOD) Full 0.6 0.8 1.1 V
Output Offset Voltage (VOS) Full 0.75 DRVDD/2 1.05 V
1
Pull up.
2
Pull down.
Rev. B | Page 7 of 44
AD9644
SWITCHING SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, 1.75 V p-p differential input, VIN = −1.0 dBFS differential input, and DCS enabled,
unless otherwise noted.
Table 4.
AD9644-80 AD9644-155
Parameter Temperature Min Typ Max Min Typ Max Unit
CLOCK INPUT PARAMETERS
Input Clock Rate Full 640 640 MHz
Conversion Rate1 Full 40 80 40 155 MSPS
CLK Period—Divide-by-1 Mode (t
CLK Pulse Width High (tCH)
Divide-by-1 Mode, DCS Enabled Full 3.75 6.25 8.75 1.935 3.225 4.515 ns
Divide-by-1 Mode, DCS Disabled Full 5.95 6.25 6.55 3.065 3.225 3.385 ns
Divide-by-2 Mode Through Divide-by-8
Mode
Aperture Delay (tA) Full 0.78 0.78 ns
Aperture Uncertainty (Jitter, tJ) Full 0.125 0.125 ps rms
DATA OUTPUT PARAMETERS
Data Output Period or UI (Unit Interval) Full 1/(20 × f
Data Output Duty Cycle
Data Valid Time
PLL Lock Time (t
LOCK
)
Wake Up Time (Standby)
Wake Up Time (Power-Down)2 25°C 2.5 2.5 ms
Pipeline Delay (Latency) Full 23 24 23 24
Data Rate per Channel (NRZ)
Deterministic Jitter
Random Jitter at 1.6 Gbps
Random Jitter at 3.2 Gbps
Output Rise/Fall Time
TERMINATION CHARACTERISTICS
Differential Termination Resistance
OUT-OF-RANGE RECOVERY TIME
1
Conversion rate is the clock rate after the divider.
2
Wake-up time is defined as the time required to return to normal operation from power-down mode.
) Full 12.5 6.45 ns
CLK
Full 0.8 0.8 ns
25°C
25°C
25°C
25°C
) 1/(20 × f
CLK
50
50 %
0.78 0.74 UI
4 4 μs
5
5 μs
) Seconds
CLK
CLK
cycles
25°C
25°C
25°C
25°C
25°C
25°C
25°C
1.6 3.1 Gbps
40 40 ps
9.5 ps rms
5.2 5.2 ps rms
50 50 ps
100 100 Ω
2 2
CLK
cycles
Rev. B | Page 8 of 44
AD9644
A
G
TIMING SPECIFICATIONS
Table 5.
Parameter Conditions Limit
SYNC TIMING REQUIREMENTS
t
SYNC to rising edge of CLK+ setup time 0.30 ns typ
SSYNC
t
SYNC to rising edge of CLK+ hold time 0.30 ns typ
HSYNC
SPI TIMING REQUIREMENTS
tDS Setup time between the data and the rising edge of SCLK 2 ns min
tDH Hold time between the data and the rising edge of SCLK 2 ns min
t
Period of the SCLK 40 ns min
CLK
tS Setup time between CSB and SCLK 2 ns min
tH Hold time between CSB and SCLK 2 ns min
t
SCLK pulse width high 10 ns min
HIGH
t
SCLK pulse width low 10 ns min
LOW
t
EN_SDIO
t
DIS_SDIO
Timing Diagrams
NALO
INPUT
SIGNAL
N – 23
Time required for the SDIO pin to switch from an input to an output relative to the SCLK
falling edge
Time required for the SDIO pin to switch from an output to an input relative to the SCLK
rising edge
SAMPLE
N – 22
N – 21
N – 20
N
N + 1
N – 1
10 ns min
10 ns min
CLK–
CLK+
CLK–
CLK+
DOUT+
DOUT–
SAMPLE N – 23
ENCODED INTO 2
8b/10b SYMBOLS
SAMPLE N – 22
ENCODED INTO 2
8b/10b SYMBOLS
SAMPLE N – 21
ENCODED INTO 2
8b/10b SYMBOLS
09180-002
Figure 2. Data Output Timing
CLK+
t
HSYNC
09180-004
SYNC
t
SSYNC
Figure 3. SYNC Input Timing Requirements
Rev. B | Page 9 of 44
AD9644
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter Rating
ELECTRICAL
AVDD to AGND −0.3 V to +2.0 V
DRVDD to AGND −0.3 V to +2.0V
VIN+A/VIN+B, VIN−A/VIN−B to AGND −0.3 V to AVDD + 0.2 V
CLK+, CLK− to AGND −0.3 V to AVDD + 0.2 V
SYNC to AGND −0.3 V to AVDD + 0.2 V
VCMA, VCMB to AGND −0.3 V to AVDD + 0.2 V
CSB to AGND −0.3 V to DRVDD + 0.2 V
SCLK to AGND −0.3 V to DRVDD + 0.2 V
SDIO to AGND −0.3 V to DRVDD + 0.2 V
PDWN to AGND −0.3 V to DRVDD + 0.2 V
DOUT+A, DOUT0−A, DOUT0+B,
DOUT−B to AGND
DSYNC+A, DSYNC−A, DSYNC+B,
DSYNC−B to AGND
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
ENVIRONMENTAL
Operating Temperature Range
−40°C to +85°C
(Ambient)
Maximum Junction Temperature
150°C
Under Bias
Storage Temperature Range
−65°C to +150°C
(Ambient)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints and maximizes the
thermal capability of the package.
Table 7. Thermal Resistance
Airflow
Veloc ity
Packa ge Type
48-Lead LFCSP
7 mm × 7 mm
(CP-48-8)
1
Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3
Per MIL-STD 883, Method 1012.1.
4
Per JEDEC JESD51-8 (still air).
(m/sec) θ
0 25 2 14 °C/W
1.0 22 °C/W
2.5 20 °C/W
1, 2
JA
1, 3
θ
JC
1, 4
θ
Unit
JB
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown Tabl e 7, airflow improves heat dissipation,
which reduces θ
. In addition, metal in direct contact with the
JA
package leads from metal traces, through holes, ground, and
power planes, reduces θ
.
JA
ESD CAUTION
Rev. B | Page 10 of 44
AD9644
B
A
A
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
D
AVDD
84
AVDD
AVDD
74
AVDD
VIN–B
VIN+
AVD
64
54
44
VIN–
AVDD
AVDD
AVDD
VIN+
93
14
34
24
73
83
04
1
VCMB
2
AVDD
3
DNC
4
AVDD
5
CLK+
6
CLK–
7
AVDD
8
SYNC
9
AVDD
10
DRGND
11
DRVDD
12
DNC
NOTES
1. DNC = DO NOT CO NNECT.
2. THE EXPO SED THERMAL PAD ON THE BOTTOM OF THE PACKAGE
PROVIDES THE ANALOG GROUND FOR THE PART. THIS EXPOSED PAD
MUST BE CONNECTED TO GROUND FOR PROPER OPERATION.
42, 43, 44, 47, 48
3, 12, 25, 32, 34, 35 DNC Do Not Connect.
10, 16, 21, 26 DRGND
Driver
Digital Driver Supply Ground.
Ground
0
AGND,
Exposed Pad
Ground
The exposed thermal pad on the bottom of the package provides the analog
ground for the part. This exposed pad must be connected to ground for
proper operation.
ADC Analog
40 VIN+A Input Differential Analog Input Pin (+) for Channel A.
39 VIN−A Input Differential Analog Input Pin (−) for Channel A.
45 VIN+B Input Differential Analog Input Pin (+) for Channel B.
46 VIN−B Input Differential Analog Input Pin (−) for Channel B.
36 VCMA Output Common-Mode Level Bias Output for Channel A Analog Input.
1 VCMB Output Common-Mode Level Bias Output for Channel B Analog Input.
5 CLK+ Input ADC Clock Input—True.
6 CLK− Input ADC Clock Input—Complement.