SNR = 70.6 dBFS at 185 MHz AIN and 250 MSPS
SFDR = 85 dBc at 185 MHz AIN and 250 MSPS
−151.6 dBFS/Hz input noise at 185 MHz, −1 dBFS AIN and
250 MSPS
Total power consumption: 785 mW at 250 MSPS
1.8 V supply voltages
LVDS (ANSI-644 levels) outputs
Integer 1-to-8 input clock divider (625 MHz maximum input)
Sample rates of up to 250 MSPS
IF sampling frequencies of up to 400 MHz
Internal ADC voltage reference
Flexible analog input range
1.4 V p-p to 2.0 V p-p (1.75 V p-p nominal)
ADC clock duty cycle stabilizer
95 dB channel isolation/crosstalk
Serial port control
Energy saving power-down modes
User-configurable, built-in self-test (BIST) capability
APPLICATIONS
Communications
Diversity radio systems
Multimode digital receivers (3G)
TD-SCDMA, WiMax, WCDMA, CDMA2000, GSM, EDGE, LTE
I/Q demodulation systems
Smart antenna systems
General-purpose software radios
Ultrasound equipment
Broadband data applications
GENERAL DESCRIPTION
The AD9643 is a dual, 14-bit analog-to-digital converter (ADC)
with sampling speeds of up to 250 MSPS. The AD9643 is designed
to support communications applications, where low cost, small
size, wide bandwidth, and versatility are desired.
The dual ADC cores feature a multistage, differential pipelined
architecture with integrated output error correction logic. Each
ADC features wide bandwidth inputs supporting a variety of
user-selectable input ranges. An integrated voltage reference
eases design considerations. A duty cycle stabilizer is provided
to compensate for variations in the ADC clock duty cycle,
allowing the converters to maintain excellent performance.
The ADC output data is routed directly to the two external
14-bit LVDS output ports and formatted as either interleaved or
channel multiplexed.
Flexible power-down options allow significant power savings,
when desired.
ADC)
AD9643
FUNCTIONAL BLOCK DIAGRAM
DDAGNDDRVDD
VIN+A
VIN–A
VCM
IN+B
VIN–B
NOTES
1. THE D0± TO D13± PI NS REPRESENT BOTH THE CHANNE L A
AD9643
REFERENCE
SCLKSDIOCSBCLK+CLK– SYNC
AND CHANNEL B LVDS OUTPUT DATA.
Programming for setup and control are accomplished using a
3-wire SPI-compatible serial interface.
The AD9643 is available in a 64-lead LFCSP and is specified over
the industrial temperature range of −40°C to +85°C. This
product is protected by a U.S. patent.
performance for input frequencies of up to 400 MHz.
4. SYNC input allows synchronization of multiple devices.
5. 3-pin, 1.8 V SPI port for register programming and register
readback.
6. Pin compatibility with the AD9613, allowing a simple
migration down from 14 bits to 12 bits. This part is also pin
compatible with the AD6649 and the AD6643.
PIPELINE
14-BIT
ADC
PIPELINE
14-BIT
ADC
SERIAL PORT
14
PARALLEL
14
Figure 1.
DDR LVDS
AND
DRIVERS
1TO 8
CLOCK
DIVIDER
D0±
D13±
DCO±
OR±
OEB
PDWN
.
.
.
.
.
09636-001
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
No Missing Codes Full Guaranteed Guaranteed Guaranteed
Offset Error Full ±10 ±10 ±10 mV
Gain Error Full +2/−6 +3/−5 ±4 %FSR
Differential Nonlinearity (DNL) Full ±0.75 ±0.75 ±0.75 LSB
25°C ±0.25 ±0.25 ±0.25 LSB
Integral Nonlinearity (INL)1 Full ±1.8 ±2 ±3.5 LSB
25°C ±1.5 ±1.5 ±1.5 LSB
MATCHING CHARACTERISTIC
Offset Error Full ±13 ±13 ±13 mV
Gain Error Full ±2.5/
+3.5
−2/
−2.5/
+3.5
+3.5
TEMPERATURE DRIFT
Offset Error Full ±5 ±5 ±5 ppm/°C
Gain Error Full ±70 ±80 ±100 ppm/°C
INPUT REFERRED NOISE
VREF = 1.0 V 25°C 1.33 1.33 1.33 LSB rms
ANALOG INPUT
Input Span Full 1.75 1.75 1.75 V p-p
Input Capacitance2 Full 2.5 2.5 2.5 pF
Input Resistance3 Full 20 20 20 kΩ
Input Common-Mode Voltage Full 0.9 0.9 0.9 V
POWER SUPPLIES
Supply Voltage
AVDD Full 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 V
DRVDD Full 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 V
Supply Current
1
I
Full 196 250 217 265 256 275 mA
AVDD
1
I
Full 145 160 160 185 180 210 mA
DRVDD
POWER CONSUMPTION
Sine Wave Input (DRVDD = 1.8 V) Full 614 680 785 mW
Standby Power4 Full 90 90 90 mW
Power-Down Power Full 10 10 10 mW
1
Measured with a low input frequency, full-scale sine wave.
2
Input capacitance refers to the effective capacitance between one differential input pin and its complement.
3
Input resistance refers to the effective resistance between one differential input pin and its complement.
4
Standby power is measured with a dc input and the CLK pin inactive (that is, set to AVDD or AGND).
ParameterTe mp Min Typ Max Unit
DIFFERENTIAL CLOCK INPUTS (CLK+, CLK−)
Logic Compliance
Internal Common-Mode Bias
Differential Input Voltage
Input Voltage Range
Input Common-Mode Range
High Level Input Current Full −10 +22 µA
Low Level Input Current Full −22 −10 µA
Input Capacitance Full
Input Resistance Full 8 10 12 kΩ
SYNC INPUT
Logic Compliance CMOS/LVDS
Internal Bias Full 0.9 V
Input Voltage Range Full AGND AVDD V
High Level Input Voltage Full 1.2 AVDD V
Low Level Input Voltage Full AGND 0.6 V
High Level Input Current Full −5 +5 µA
Low Level Input Current Full −5 +5 µA
Input Capacitance Full 1 pF
Input Resistance Full 12 16 20 kΩ
LOGIC INPUT (CSB)1
High Level Input Voltage Full 1.22 2.1 V
Low Level Input Voltage Full 0 0.6 V
High Level Input Current Full −5 +5 µA
Low Level Input Current Full −80 −45 µA
Input Resistance Full 26 kΩ
Input Capacitance Full 2 pF
LOGIC INPUT (SCLK)2
High Level Input Voltage Full 1.22 2.1 V
Low Level Input Voltage Full 0 0.6 V
High Level Input Current Full 45 70 µA
Low Level Input Current Full −5 +5 µA
Input Resistance Full 26 kΩ
Input Capacitance Full 2 pF
LOGIC INPUTS (SDIO)1
High Level Input Voltage Full 1.22 2.1 V
Low Level Input Voltage Full 0 0.6 V
High Level Input Current Full 45 70 µA
Low Level Input Current Full −5 +5 µA
Input Resistance Full 26 kΩ
Input Capacitance Full 5 pF
LOGIC INPUTS (OEB, PDWN)2
High Level Input Voltage Full 1.22 2.1 V
Low Level Input Voltage Full 0 0.6 V
High Level Input Current Full 45 70 µA
Low Level Input Current Full −5 +5 µA
Input Resistance Full 26 kΩ
Input Capacitance Full 5 pF
CMOS/LVDS/LVPECL
Full 0.9 V
Full 0.3 3.6 V p-p
Full AGND AVDD V
Full 0.9 1.4 V
4
pF
Rev. B | Page 6 of 36
Data Sheet AD9643
ParameterTe mp Min Typ Max Unit
DIGITAL OUTPUTS
LVDS Data and OR Outputs
Differential Output Voltage (VOD), ANSI Mode Full 250 350 450 mV
Output Offset Voltage (VOS),
ANSI Mode
Differential Output Voltage (VOD), Reduced Swing Mode Full 150 200 280 mV
Output Offset Voltage (VOS),
Reduced Swing Mode
1
Pull-up.
2
Pull-down.
Full 1.15 1.22 1.35 V
Full 1.15 1.22 1.35 V
Rev. B | Page 7 of 36
AD9643 Data Sheet
SWITCHING SPECIFICATIONS
Table 4.
AD9643-170 AD9643-210 AD9643-250
Parameter Temp Min Typ Max Min Typ Max Min Typ Max Unit
CLOCK INPUT PARAMETERS
Input Clock Rate Full 625 625 625 MHz
Conversion Rate1 Full 40 170 40 210 40 250 MSPS
CLK Period—Divide-by-1 Mode (t
CLK Pulse Width High (tCH)
Divide-by-8 Mode
Aperture Delay (tA) Full 1.0 1.0 1.0 ns
Aperture Uncertainty (Jitter, tJ) Full 0.1 0.1 0.1 ps rms
DATA OUTPUT PARAMETERS
LVDS Mode
Data Propagation Delay (tPD) Full
DCO Propagation Delay (t
DCO-to-Data Skew (t
SKEW
Pipeline Delay (Latency) Full 10 10 10 Cycles
Aperture Delay (tA) Full 1.0 1.0 1.0 ns
Aperture Uncertainty (Jitter, tJ) Full 0.1 0.1 0.1 ps rms
Wake-Up Time (from Standby) Full 10 10 10 µs
Wake-Up Time (from Power-Down) Full 250 250 250 µs
Out-of-Range Recovery Time Full 3 3 3 Cycles
1
Conversion rate is the clock rate after the divider.
) Full 5.8 4.8 4 ns
CLK
Full 0.8
) Full
DCO
4.8 4.8 4.8 ns
5.5 5.5 5.5 ns
0.8
0.8
ns
) Full 0.30.7 1.1 0.30.7 1.1 0.30.7 1.1 ns
Rev. B | Page 8 of 36
Data Sheet AD9643
TIMING SPECIFICATIONS
Table 5.
Parameter Conditions Min Typ Max Unit
SYNC TIMING REQUIREMENTS
t
SYNC to the rising edge of CLK setup time 0.3 ns
SSYNC
t
SYNC to the rising edge of CLK hold time 0.4 ns
HSYNC
SPI TIMING REQUIREMENTS
tDS Setup time between the data and the rising edge of SCLK 2 ns
tDH Hold time between the data and the rising edge of SCLK 2 ns
t
Period of the SCLK 40 ns
CLK
tS Setup time between CSB and SCLK 2 ns
tH Hold time between CSB and SCLK 2 ns
t
Minimum period that SCLK should be in a logic high state 10 ns
HIGH
t
Minimum period that SCLK should be in a logic low state 10 ns
LOW
t
EN_SDIO
t
DIS_SDIO
Time required for the SDIO pin to switch from an input to an output
relative to the SCLK falling edge
Time required for the SDIO pin to switch from an output to an input
relative to the SCLK rising edge
10 ns
10 ns
Rev. B | Page 9 of 36
AD9643 Data Sheet
Timing Diagrams
t
A
t
t
N
DCO
PD
t
CLK
CH A
N – 10
CH A
N – 10
t
SKEW
N + 1
CH B
N – 10
CH B
N – 10
CH A
N – 9
CH A
N – 9
N + 2
CH B
N – 9
CH B
N – 9
CH A
N – 8
CH A
N – 8
N + 3
CH B
N – 8
CH B
N – 8
CH A
N – 7
CH A
N – 7
N + 4
CH B
N – 7
CH B
N – 7
CH A
N – 6
CH A
N – 6
N + 5
PARALLEL INTERLEAVED
CHANNEL A AND
CHANNEL B
VIN
CLK+
CLK–
DCO–
DCO+
D0±
(LSB)
D13±
(MSB)
N – 1
t
CH
.
.
.
CHANNEL MUL TIPL EXED
(EVEN/O DD) MO DE
CHANNEL A
CHANNEL MUL TIPL EXED
(EVEN/O DD) MO DE
CHANNEL B
D0±/D1±
(LSB)
D12±/D13±
(MSB)
D0±/D1±
(LSB)
D12±/D13±
(MSB)
CH A0
CH A1
CH A0
CH A1
CH A0
CH A1
CH A0
CH A1
N – 10
N – 10
CH B0
N – 10
N – 10
N – 10
CH A13
N – 10
CH B1
N – 10
CH B13
N – 10
.
.
.
CH A12
.
.
.
CH B12
N – 9
CH A12
N – 9
CH B0
N – 9
CH B12
N – 9
N – 9
CH A13
N – 9
CH B1
N – 9
CH B13
N – 9
N – 8
CH A12
N – 8
CH B0
N – 8
CH B12
N – 8
N – 8
CH A13
N – 8
CH B1
N – 8
CH B13
N – 8
N – 7
CH A12
N – 7
CH B0
N – 7
CH B12
N – 7
CH A13
CH B13
N – 7
N – 7
CH B1
N – 7
N – 7
CH A0
N – 6
CH A12
N – 6
CH B0
N – 6
CH B12
N – 6
09636-002
Figure 2. LVDS Modes for Data Output Timing
CLK+
SYNC
t
SSYNC
t
HSYNC
09636-003
Figure 3. SYNC Timing Inputs
Rev. B | Page 10 of 36
Data Sheet AD9643
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter Rating
Electrical
AVDD to AGND −0.3 V to +2.0 V
DRVDD to AGND −0.3 V to +2.0 V
VIN+A/VIN+B, VIN−A/VIN−B to AGND −0.3 V to AVDD + 0.2 V
CLK+, CLK− to AGND −0.3 V to AVDD + 0.2 V
SYNC to AGND −0.3 V to AVDD + 0.2 V
VCM to AGND −0.3 V to AVDD + 0.2 V
CSB to AGND −0.3 V to DRVDD + 0.3 V
SCLK to AGND −0.3 V to DRVDD + 0.3 V
SDIO to AGND −0.3 V to DRVDD + 0.3 V
OEB to AGND −0.3 V to DRVDD + 0.3 V
PDWN to AGND −0.3 V to DRVDD + 0.3 V
OR+/OR− to AGND −0.3 V to DRVDD + 0.3 V
D0−/D0+ Through D13−/D13+
−0.3 V to DRVDD + 0.3 V
to AGND
DCO+/DCO− to AGND −0.3 V to DRVDD + 0.3 V
Environmental
Operating Temperature Range
−40°C to +85°C
(Ambient)
Maximum Junction Temperature
150°C
Under Bias
Storage Temperature Range
−65°C to +125°C
(Ambient)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for
the LFCSP package. This increases the reliability of the solder
joints, maximizing the thermal capability of the package.
Table 7. Thermal Resistance
Airflow
Veloc ity
Packa ge Type
64-Lead LFCSP
9 mm × 9 mm
(CP-64-4)
1
Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3
Per MIL-Std 883, Method 1012.1.
4
Per JEDEC JESD51-8 (still air).
(m/sec) θ
0 26.8 1.14 10.4 °C/W
1.0 21.6 °C/W
2.0 20.2 °C/W
1, 2
JA
1, 3
θ
JC
1, 4
θ
Unit
JB
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown in Ta b le 7 , airflow increases heat dissipation,
which reduces θ
. In addition, metal in direct contact with the
JA
package leads from metal traces, through holes, ground, and
power planes, reduces the θ
.
JA
ESD CAUTION
Rev. B | Page 11 of 36
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