JESD204A coded serial digital outputs
SNR = 73.7 dBFS at 70 MHz/80 MSPS
SNR = 72.8 dBFS at 70 MHz and 155 MSPS
SFDR = 94 dBc at 70 MHz and 80 MSPS
SFDR = 90 dBc at 70 MHz and 155 MSPS
Low power: 238 mW at 80 MSPS, 313 mW at 155 MSPS
1.8 V supply operation
Integer 1-to-8 input clock divider
IF sampling frequencies to 250 MHz
−148.6 dBFS/Hz input noise at 180 MHz and 80 MSPS
−148.1 dBFS/Hz input noise at 180 MHz and 155 MSPS
Programmable internal ADC voltage reference
Flexible analog input range: 1.4 V p-p to 2.1 V p-p
ADC clock duty cycle stabilizer (DCS)
Serial port control
User-configurable, built-in self-test (BIST) capability
Energy-saving power-down modes
APPLICATIONS
Communications
Diversity radio systems
Multimode digital receivers (3G and 4G)
GSM, EDGE, W-CDMA, LTE,
CDMA2000, WiMAX, TD-SCDMA
Smart antenna systems
General-purpose software radios
Broadband data applications
Ultrasound equipment
GENERAL DESCRIPTION
The AD9641 is a 14-bit, 80 MSPS/155 MSPS analog-to-digital
converter (ADC) with a high speed serial output interface. The
AD9641 is designed to support communications applications
where high performance, combined with low cost, small size, and
versatility, is desired. The JESD204A high speed serial interface
reduces board routing requirements and lowers pin count
requirements for the receiving device.
The ADC core features a multistage, differential pipelined
architecture with integrated output error correction logic. The
ADC features wide bandwidth, differential sample-and-hold,
analog input amplifiers that support a variety of user-selectable
input ranges. An integrated voltage reference eases the design
considerations. A duty cycle stabilizer (DCS) is provided to
compensate for variations in the ADC clock duty cycle,
allowing the converter to maintain excellent performance.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
AD9641
FUNCTIONAL BLOCK DIAGRAM
VDD
AD9641
VIN+
VIN–
VCM
REFERENCE
MULTICHIP
AGND
The ADC output data is routed directly to the JESD204A serial
output port. This output is at CML voltage levels. A CMOS or
LVDS synchronization input (DSYNC) is provided.
The flexible power-down options allow significant power savings,
when desired.
Programming for setup and control is accomplished using a 3-wire
SPI-compatible serial interface.
The AD9641 is available in a 32-lead LFCSP and is specified over
the industrial temperature range of −40°C to +85°C.
PRODUCT HIGHLIGHTS
1. An on-chip PLL allows users to provide a single ADC
sampling clock. The PLL multiplies the ADC sampling clock
to produce the corresponding JESD204A data rate clock.
2. The configurable JESD204A output block coded data rate
supports up to 1.6 Gbps.
3. A proprietary differential input maintains excellent SNR
performance for input frequencies of up to 250 MHz.
4. Operation is from a single 1.8 V power supply.
5. The standard serial port interface (SPI) supports various
product features and functions, such as data formatting
(offset binary, twos complement, or Gray coding), controlling the clock DCS, power-down, test modes, voltage
reference mode, and serial output configuration.
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions.
2
The analog input bandwidth parameter specifies the −3 dB input BW of the AD9641 input. The usable full-scale BW of the part with good performance is 250 MHz.
25°C 72.6 72.1 dBFS
Full 71.8 69.8 dBFS
11.8
11.7
11.6
11.5
−90
−90
−90
−90
90
90
90
90
−95
−95
−93
−90
90
82
780
Bits
Bits
Bits
Bits
dBc
dBc
dBc
−80 dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
−87 dBc
dBc
dBc
dBc
MHz
Rev. A | Page 4 of 36
AD9641
DIGITAL SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, 1.75 V p-p differential input, VIN = −1.0 dBFS differential input, and DCS enabled,
unless otherwise noted.
Table 3.
Parameter Temperature Min Typ Max Unit
DIFFERENTIAL CLOCK INPUTS (CLK+, CLK−)
Logic Compliance CMOS/LVDS/LVPECL
Internal Common-Mode Bias Full 0.9 V
Differential Input Voltage Full 0.3 3.6 V p-p
Input Voltage Range Full AGND AVDD V
Input Common-Mode Range Full 0.9 1.4 V
High Level Input Current Full −100 +100 μA
Low Level Input Current Full −100 +100 μA
Input Capacitance Full 4 pF
Input Resistance Full 8 10 12 kΩ
SYNC INPUT
Logic Compliance CMOS
Internal Bias Full 0.9 V
Input Voltage Range Full AGND AVDD V
High Level Input Voltage Full 1.2 AVDD V
Low Level Input Voltage Full AGND 0.6 V
High Level Input Current Full −100 +100 μA
Low Level Input Current Full −100 +100 μA
Input Capacitance Full 1 pF
Input Resistance Full 12 16 20 kΩ
DSYNC INPUT
Logic Compliance CMOS/LVDS
Internal Bias Full 0.9 V
Input Voltage Range Full AGND AVDD V
High Level Input Voltage Full 1.2 AVDD V
Low Level Input Voltage Full AGND 0.6 V
High Level Input Current Full −100 +100 μA
Low Level Input Current Full −100 +100 μA
Input Capacitance Full 1 pF
Input Resistance Full 12 16 20 kΩ
LOGIC INPUT (CSB)1
Logic Compliance CMOS
High Level Input Voltage Full 1.22 2.1 V
Low Level Input Voltage Full 0 0.6 V
High Level Input Current Full −10 +10 μA
Low Level Input Current Full 40 132 μA
Input Resistance Full 26 kΩ
Input Capacitance Full 2 pF
LOGIC INPUT (SCLK)2
Logic Compliance CMOS
High Level Input Voltage Full 1.22 2.1 V
Low Level Input Voltage Full 0 0.6 V
High Level Input Current (VIN = 1.8 V) Full −92 −135 μA
Low Level Input Current Full −10 +10 μA
Input Resistance Full 26 kΩ
Input Capacitance Full 2 pF
Rev. A | Page 5 of 36
AD9641
Parameter Temperature Min Typ Max Unit
LOGIC INPUT/OUTPUT (SDIO)1
Logic Compliance CMOS
High Level Input Voltage Full 1.22 2.1 V
Low Level Input Voltage Full 0 0.6 V
High Level Input Current Full −10 +10 μA
Low Level Input Current Full 38 128 μA
Input Resistance Full 26 kΩ
Input Capacitance Full 5 pF
DIGITAL OUTPUTS
Logic Compliance Full CML
Differential Output Voltage (VOD) Full 0.6 0.8 1.1 V
Output Offset Voltage (VOS) Full 0.75 DRVDD/2 1.05 V
1
Pull up.
2
Pull down.
SWITCHING SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, 1.75 V p-p differential input, VIN = −1.0 dBFS differential input, and DCS enabled,
unless otherwise noted.
Table 4.
AD9641-80 AD9641-155
Parameter Temperature Min Typ Max Min Typ Max Unit
CLOCK INPUT PARAMETERS
Input Clock Rate Full 640 640 MHz
Conversion Rate1 Full 40 80 40 155 MSPS
CLK Period—Divide-by-1 Mode (t
CLK Pulse Width High (tCH)
Conversion rate is the clock rate after the divider.
2
Wake-up time is defined as the time required to return to normal operation from power-down mode.
) Full 12.5 6.45 ns
CLK
) 1/(20 × f
CLK
50
5
50
5
) sec
CLK
%
μs
Rev. A | Page 6 of 36
AD9641
A
TIMING SPECIFICATIONS
Table 5.
Parameter Test Conditions Limit
SYNC TIMING REQUIREMENTS
t
SYNC to rising edge of CLK+ setup time 0.30 ns typ
SSYNC
t
SYNC to rising edge of CLK+ hold time 0.30 ns typ
HSYNC
SPI TIMING REQUIREMENTS
tDS Setup time between the data and the rising edge of SCLK 2 ns min
tDH Hold time between the data and the rising edge of SCLK 2 ns min
t
Period of the SCLK 40 ns min
CLK
tS Setup time between CSB and SCLK 2 ns min
tH Hold time between CSB and SCLK 2 ns min
t
SCLK pulse width high 10 ns min
HIGH
t
SCLK pulse width low 10 ns min
LOW
t
EN_SDIO
t
DIS_SDIO
Timing Diagrams
NALOG
INPUT
SIGNAL
N – 23
Time required for the SDIO pin to switch from an input to an output relative to the SCLK
falling edge
Time required for the SDIO pin to switch from an output to an input relative to the SCLK
rising edge
SAMPLE
N – 22
N – 21
N – 20
N
N + 1
N – 1
10 ns min
10 ns min
CLK–
CLK+
CLK–
CLK+
DOUT+
DOUT–
SAMPLE N – 23
ENCODED INTO 2
8b/10b SYMBOLS
SAMPLE N – 22
ENCODED INTO 2
8b/10b SYMBOLS
SAMPLE N – 21
ENCODED INTO 2
8b/10b SY MBOLS
09210-002
Figure 2. Data Output Timing
CLK+
t
HSYNC
09210-003
SYNC
t
SSYNC
Figure 3. SYNC Input Timing Requirements
Rev. A | Page 7 of 36
AD9641
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter Rating
ELECTRICAL
AVDD to AGND −0.3 V to +2.0 V
DRVDD to AGND −0.3 V to +2.0V
VIN+, VIN− to AGND −0.3 V to AVDD + 0.2 V
CLK+, CLK− to AGND −0.3 V to AVDD + 0.2 V
SYNC to AGND −0.3 V to AVDD + 0.2 V
VCM to AGND −0.3 V to AVDD + 0.2 V
CSB to AGND −0.3 V to DRVDD + 0.2 V
SCLK to AGND −0.3 V to DRVDD + 0.2 V
SDIO to AGND −0.3 V to DRVDD + 0.2 V
PDWN to AGND −0.3 V to DRVDD + 0.2 V
DOUT+, DOUT− to AGND
DSYNC+, DSYNC− to AGND
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
ENVIRONMENTAL
Operating Temperature Range
−40°C to +85°C
(Ambient)
Maximum Junction Temperature
150°C
Under Bias
Storage Temperature Range
−65°C to +150°C
(Ambient)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints and maximizes the
thermal capability of the package.
Table 7. Thermal Resistance
Airflow
Veloc ity
Packa ge Type
32-Lead LFCSP
5 mm × 5 mm
(CP-32-12)
1 Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3 Per MIL-Std 883, Method 1012.1.
4 Per JEDEC JESD51-8 (still air).
(m/sec) θ
0 36 3 20 °C/W
1.0 32 °C/W
2.5 28 °C/W
1, 2
JA
1, 3
θ
JC
1, 4
θ
Unit
JB
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown in Ta b le 7 , airflow improves heat dissipation,
which reduces θ
. In addition, metal in direct contact with the
JA
package leads from metal traces, through holes, ground, and
power planes, reduces θ
.
JA
ESD CAUTION
Rev. A | Page 8 of 36
AD9641
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
AVDD
AVDD
AVDD
VIN+
VIN–
AVDD
AVDD
VCM
52
6
72
82
92
13
03
2
3
AVDD
1
PIN 1
2
DNC
AVDD
CLK+
CLK–
AVDD
SYNC
AVDD
NOTES
1. DNC = DO NOT CONNECT.
2. THE EXPOSED THERMAL PAD ON THE BOTTOM OF THE PACKAGE
PROVIDES T HE ANALOG GROUND FOR THE PART. THIS EXPOSED PAD
MUST BE CONNECT ED TO GROUND FOR PRO PER OPERATION.
3
4
5
6
7
8
INDICATOR
AD9641
TOP VIEW
(Not to Scale)
9
01
DSYNC–
DSYNC+
Figure 4. LFCSP Pin Configuration (Top View)
11
DRGND
21
DRVDD
31
DRGND
2
24
PDWN
23
DNC
22
CSB
SCLK
21
20
SDIO
DRVDD
19
18
DRVDD
DRGND
17
51
41
61
DOUT–
DOUT+
DRVDD
09210-004
Table 8. Pin Function Descriptions
Pin No. Mnemonic Type Description
ADC Power Supplies
12, 16, 18, 19 DRVDD Supply Digital Output Driver Supply (1.8 V Nominal).
1, 3, 6, 8, 26, 27, 30, 31, 32 AVDD Supply Analog Power Supply (1.8 V Nominal).
2, 23 DNC Do Not Connect.
11, 13, 17 DRGND Driver ground Digital Driver Supply Ground.
0 AGND, Exposed pad Ground
The exposed thermal pad on the bottom of the package provides
the analog ground for the part. This exposed pad must be connected
to ground for proper operation.