1.8 V to 3.3 V CMOS output supply or 1.8 V LVDS
ou
tput supply
Integer 1-to-8 input clock divider
IF sampling frequencies to 450 MHz
Internal ADC voltage reference
Integrated ADC sample-and-hold inputs
Flexible analog input range: 1 V p-p to 2 V p-p
Differential analog inputs with 650 MHz bandwidth
ADC clock duty cycle stabilizer
95 dB channel isolation/crosstalk
Serial port control
User-configurable, built-in self-test (BIST) capability
Energy-saving power-down modes
Integrated receive features
Fast detect/threshold bits
Composite signal monitor
APPLICATIONS
Communications
Diversity radio systems
Multimode digital receivers (3G)
GSM, EDGE, WCDMA,
CDMA2000, WiMAX, TD-SCDMA
I/Q demodulation systems
Smart antenna systems
General-purpose software radios
Broadband data applications
1.8 V Dual Analog-to-Digital Converter
AD9627
FUNCTIONAL BLOCK DIAGRAM
SCLK/
AVDD
FD BITS/THRESHOLD
VIN+A
VIN–A
VREF
SENSE
CML
RBIAS
VIN–B
VIN+B
SHA
REF
SELECT
SHA
AD9627
MULTICHI P
SYNC
AGND SYNCFD(0:3)B
NOTES
1. PIN NAMES ARE F OR THE CMO S PIN CONFIGURATION ONLY;
SEE FIGURE 7 FOR LVDS PI N NAMES.
ast overrange detect and signal monitor with serial output.
3. Si
gnal monitor block with dedicated serial output mode.
4. P
roprietary differential input that maintains excellent SNR
performance for input frequencies up to 450 MHz.
5. O
peration from a single 1.8 V supply and a separate digital
output driver supply to accommodate 1.8 V to 3.3 V logic
families.
tandard serial port interface (SPI) that supports various
6. S
product features and functions, such as data formatting
(offset binary, twos complement, or gray coding), enabling
the clock DCS, power-down, test modes, and voltage
reference mode.
in compatibility with the AD9640, AD9627-11, and AD9600
7. P
for a simple migration from 12 bits to 14 bits, 11 bits, or
10 bits.
SDIO/
DCS
PROGRAMMING DATA
SIGNAL
MONITOR
DIVIDE
1 TO 8
DUTY CYCLE
STABILIZER
ADC
DETECT
Figure 1.
CSB
DFS
SPI
DCO
GENERATIO N
SIGNAL MO NITOR
DATA
SIGNAL MONITOR
INTERFACE
SMI
SMI
SCLK/
SDFS
PDWN
DRVDD
CMOS
CMOS
SMI
SDO/
OEB
D11A
D0A
OUTPUT BUFFER
CLK+
CLK–
DCOA
DCOB
D11B
D0B
OUTPUT BUF FER
DRGND
06571-001
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
The AD9627 is a dual, 12-bit, 80 MSPS/105 MSPS/125 MSPS/
150 MSPS analog-to-digital converter (ADC). The AD9627 is
designed to support communications applications where low
cost, small size, and versatility are desired.
The dual ADC core features a multistage, differential pipelined
a
rchitecture with integrated output error correction logic. Each
ADC features wide bandwidth differential sample-and-hold
analog input amplifiers supporting a variety of user-selectable
input ranges. An integrated voltage reference eases design considerations. A duty cycle stabilizer is provided to compensate for
variations in the ADC clock duty cycle, allowing the converters
to maintain excellent performance.
The AD9627 has several functions that simplify the automatic
ga
in control (AGC) function in the system receiver. The fast detect
feature allows fast overrange detection by outputting four bits of
input level information with very short latency.
In addition, the programmable threshold detector allows monit
oring of the incoming signal power, using the four fast detect
bits of the ADC with very low latency. If the input signal level
exceeds the programmable threshold, the coarse upper threshold
cator goes high. Because this threshold indicator has very
indi
low latency, the user can quickly turn down the system gain to
avoid an overrange condition.
The second AGC-related function is the signal monitor. This block
al
lows the user to monitor the composite magnitude of the
incoming signal, which aids in setting the gain to optimize the
dynamic range of the overall system.
The ADC output data can be routed directly to the two external
12-b
it output ports. These outputs can be set from 1.8 V to 3.3 V
CMOS or 1.8 V LVDS.
Flexible power-down options allow significant power savings,
en desired.
wh
Programming for setup and control is accomplished using a 3-bit
S
PI-compatible serial interface.
The AD9627 is available in a 64-lead LFCSP and is specified over
t
he industrial temperature range of −40°C to +85°C.
Rev. 0 | Page 3 of 76
AD9627
www.BDTIC.com/ADI
SPECIFICATIONS
ADC DC SPECIFICATIONS—AD9627BCPZ-80/AD9627BCPZ-105
AVDD = 1.8 V, DVDD = 1.8 V, DRVDD = 3.3 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, DCS
enabled, fast detect output pins disabled, and signal monitor disabled, unless otherwise noted.
Table 1.
AD9627BCPZ-80 AD9627BCPZ-105
Parameter Temperature
Min Typ Max Min Typ Max
RESOLUTION Full 12 12 Bits
ACCURACY
No Missing Codes Full Guaranteed Guaranteed
Offset Error Full ±0.2 ±0.6 ±0.3 ±0.7 % FSR
Gain Error Full +0.1 −1.8 −3.7 −0.5 −2.2 −3.7 % FSR
Differential Nonlinearity (DNL)
1
Full ±0.4 ±0.4 LSB
25°C ±0.2 ±0.2 LSB
Integral Nonlinearity (INL)
1
Full ±0.9 ±0.9 LSB
25°C ±0.4 ±0.4 LSB
MATCHING CHARACTERISTIC
Offset Error Full ±0.2 ±0.6 ±0.3 ±0.7 % FSR
Gain Error Full ±0.2 ±0.75 ±0.2 ±0.75 % FSR
TEMPERATURE DRIFT
Offset Error Full ±15 ±15 ppm/°C
Gain Error Full ±95 ±95 ppm/°C
INTERNAL VOLTAGE REFERENCE
Output Voltage Error (1 V Mode) Full ±5 ±16 ±5 ±16 mV
Load Regulation @ 1.0 mA Full 7 7 mV
INPUT REFERRED NOISE
VREF = 1.0 V 25°C 0.3 0.3 LSB rms
ANALOG INPUT
Input Span, VREF = 1.0 V Full 2 2 V p-p
Input Capacitance
2
Full 8 8 pF
VREF INPUT RESISTANCE Full 6 6 kΩ
POWER SUPPLIES
Supply Voltage
AVDD, DVDD Full 1.7 1.8 1.9 1.7 1.8 1.9 V
DRVDD (CMOS Mode) Full 1.7 3.3 3.6 1.7 3.3 3.6 V
DRVDD (LVDS Mode) Full 1.7 1.8 1.9 1.7 1.8 1.9 V
Supply Current
1, 3
I
AVDD
1, 3
I
DVDD
1
I
(3.3 V CMOS) Full 23 34 mA
DRVDD
1
I
(1.8 V CMOS) Full 11 15 mA
DRVDD
1
I
(1.8 V LVDS) Full 47 47 mA
DRVDD
Full 233 310 mA
Full 26
278
34
365
POWER CONSUMPTION
DC Input Full 452 490 600 650 mW
Sine Wave Input1 (DRVDD = 1.8 V) Full 495 657 mW
Sine Wave Input1 (DRVDD = 3.3 V) Full 550 740 mW
Standby Power
4
Full 52 68 mW
Power-Down Power Full 2.5 6 2.5 6 mW
1
Measured with a low input frequency, full-scale sine wave, with approximately 5 pF loading on each output bit.
2
Input capacitance refers to the effective capacitance between one differential input pin and AGND. See Figure 8 for the equivalent analog input structure.
3
The maximum limit applies to the combination of I
4
Standby power is measured with a dc input and with the CLK pins inactive (set to AVDD or AGND).
AVDD
and I
currents.
DVDD
Unit
mA
Rev. 0 | Page 4 of 76
AD9627
www.BDTIC.com/ADI
ADC DC SPECIFICATIONS—AD9627BCPZ-125/AD9627BCPZ-150
AVDD = 1.8 V, DVDD = 1.8 V, DRVDD = 3.3 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, DCS
enabled, fast detect output pins disabled, and signal monitor disabled, unless otherwise noted.
Table 2.
AD9627BCPZ-125 AD9627BCPZ-150
Parameter Temperature
Min Typ Max Min Typ Max
RESOLUTION Full 12 12 Bits
ACCURACY
No Missing Codes Full Guaranteed Guaranteed
Offset Error Full ±0.3 ±0.6 ±0.2 ±0.6 % FSR
Gain Error Full −0.7 −2.7 −3.9 −0.9 −3.2 −5.2 % FSR
Differential Nonlinearity (DNL)
1
Full ±0.4 ±0.9 LSB
25°C ±0.2 ±0.2 LSB
Integral Nonlinearity (INL)
1
Full ±0.9 ±1.3 LSB
25°C ±0.4 ±0.5 LSB
MATCHING CHARACTERISTIC
Offset Error Full ±15 ±15 ppm/°C
Gain Error Full ±95 ±95 ppm/°C
INTERNAL VOLTAGE REFERENCE
Output Voltage Error (1 V Mode) Full ±5 ±16 ±5 ±16 mV
Load Regulation @ 1.0 mA Full 7 7 mV
INPUT REFERRED NOISE
VREF = 1.0 V 25°C 0.3 0.3 LSB rms
ANALOG INPUT
Input Span, VREF = 1.0 V Full 2 2 V p-p
Input Capacitance2 Full 8 8 pF
VREF INPUT RESISTANCE Full 6 6 kΩ
POWER SUPPLIES
Supply Voltage
AVDD, DVDD Full 1.7 1.8 1.9 1.7 1.8 1.9 V
DRVDD (CMOS Mode) Full 1.7 3.3 3.6 1.7 3.3 3.6 V
DRVDD (LVDS Mode) Full 1.7 1.8 1.9 1.7 1.8 1.9 V
Supply Current
1, 3
I
AVDD
1, 3
I
DVDD
1
I
(3.3 V CMOS) Full 36 42 mA
DRVDD
1
I
(1.8 V CMOS) Full 18 22 mA
DRVDD
1
I
(1.8 V LVDS) Full 48 49 mA
DRVDD
Full 385 419 mA
Full 42
455
50
495
POWER CONSUMPTION
DC Input Full 750 800 820 890 mW
Sine Wave Input1 (DRVDD = 1.8 V) Full 814 895 mW
Sine Wave Input1 (DRVDD = 3.3 V) Full 900 995 mW
Standby Power
4
Full 77 77 mW
Power-Down Power Full 2.5 6 2.5 6 mW
1
Measured with a low input frequency, full-scale sine wave, with approximately 5 pF loading on each output bit.
2
Input capacitance refers to the effective capacitance between one differential input pin and AGND. See Figure 8 for the equivalent analog input structure.
3
The maximum limit applies to the combination of I
4
Standby power is measured with a dc input and with the CLK pins inactive (set to AVDD or AGND).
AVDD
and I
DVDD
currents.
Unit
mA
Rev. 0 | Page 5 of 76
AD9627
www.BDTIC.com/ADI
ADC AC SPECIFICATIONS—AD9627BCPZ-80/AD9627BCPZ-105
AVDD = 1.8 V, DVDD = 1.8 V, DRVDD = 3.3 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, DCS
enabled, fast detect output pins disabled, and signal monitor disabled, unless otherwise noted.
Table 3.
Parameter
SIGNAL-TO-NOISE RATIO (SNR)
fIN = 2.3 MHz 25°C 69.7 69.6 dB
fIN = 70 MHz 25°C 69.5 69.4 dB
Full 68.1 68.6 dB
fIN = 140 MHz 25°C 69.2 69.1 dB
fIN = 220 MHz 25°C 68.5 68.4 dB
SIGNAL-TO-NOISE AND DISTORTION (SINAD)
fIN = 2.3 MHz 25°C 69.6 69.5 dB
fIN = 70 MHz 25°C 69.4 69.3 dB
Full 67.4 68.0 dB
fIN = 140 MHz 25°C 69.0 69.0 dB
fIN = 220 MHz 25°C 68.3 68.1 dB
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 2.3 MHz 25°C 11.5 11.4 Bits
fIN = 70 MHz 25°C 11.4 11.4 Bits
fIN = 140 MHz 25°C 11.4 11.4 Bits
fIN = 220 MHz 25°C 11.3 11.2 Bits
WORST SECOND OR THIRD HARMONIC
fIN = 2.3 MHz 25°C −87 −87 dBc
fIN = 70 MHz 25°C −85 −85 dBc
Full −74 −74 dBc
fIN = 140 MHz 25°C −84 −84 dBc
fIN = 220 MHz 25°C −83 −83 dBc
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
fIN = 2.3 MHz 25°C 87 87 dBc
fIN = 70 MHz 25°C 85 85 dBc
Full 74 74 dBc
fIN = 140 MHz 25°C 84 84 dBc
fIN = 220 MHz 25°C 83 83 dBc
WORST OTHER HARMONIC OR SPUR
fIN = 2.3 MHz 25°C −92 −92 dBc
fIN = 70 MHz 25°C −89 −88 dBc
Full −82 −82 dBc
fIN = 140 MHz 25°C −89 −87 dBc
fIN = 220 MHz 25°C −89 −86 dBc
Logic Compliance CMOS/LVDS/LVPECL
Internal Common-Mode Bias Full 1.2 V
Differential Input Voltage Full 0.2 6 V p-p
Input Voltage Range Full GND − 0.3 AVDD + 1.6 V
Input Common-Mode Range Full 1.1 AVDD V
High Level Input Voltage Full 1.2 3.6 V
Low Level Input Voltage Full 0 0.8 V
High Level Input Current Full −10 +10 μA
Low Level Input Current Full −10 +10 μA
Input Capacitance Full 4 pF
Input Resistance Full 8 10 12 kΩ
SYNC INPUT
Logic Compliance CMOS
Internal Bias Full 1.2 V
Input Voltage Range Full GND − 0.3 AVDD + 1.6 V
High Level Input Voltage Full 1.2 3.6 V
Low Level Input Voltage Full 0 0.8 V
High Level Input Current Full −10 +10 μA
Low Level Input Current Full −10 +10 μA
Input Capacitance Full 4 pF
Input Resistance Full 8 10 12 kΩ
LOGIC INPUT (CSB)1
High Level Input Voltage Full 1.22 3.6 V
Low Level Input Voltage Full 0 0.6 V
High Level Input Current Full −10 +10 μA
Low Level Input Current Full 40 132 μA
Input Resistance Full 26 kΩ
Input Capacitance Full 2 pF
LOGIC INPUT (SCLK/DFS)2
High Level Input Voltage Full 1.22 3.6 V
Low Level Input Voltage Full 0 0.6 V
High Level Input Current (VIN = 3.3 V) Full −92 −135 μA
Low Level Input Current Full −10 +10 μA
Input Resistance Full 26 kΩ
Input Capacitance Full 2 pF
LOGIC INPUTS/OUTPUTS (SDIO/DCS, SMI SDFS)
High Level Input Voltage Full 1.22 3.6 V
Low Level Input Voltage Full 0 0.6 V
High Level Input Current Full −10 +10 μA
Low Level Input Current Full 38 128 μA
Input Resistance Full 26 kΩ
Input Capacitance Full 5 pF
LOGIC INPUTS/OUTPUTS (SMI SDO/OEB, SMI SCLK/PDWN)
High Level Input Voltage Full 1.22 3.6 V
Low Level Input Voltage Full 0 0.6 V
High Level Input Current (VIN = 3.3 V) Full −90 −134 μA
Low Level Input Current Full −10 +10 μA
1
2
Rev. 0 | Page 8 of 76
AD9627
www.BDTIC.com/ADI
Parameter Temperature Min Typ Max Unit
Input Resistance Full 26 kΩ
Input Capacitance Full 5 pF
DIGITAL OUTPUTS
CMOS Mode—DRVDD = 3.3 V
High Level Output Voltage
IOH = 50 μA Full 3.29 V
IOH = 0.5 mA Full 3.25 V
Low Level Output Voltage
IOL = 1.6 mA Full 0.2 V
IOL = 50 μA Full 0.05 V
CMOS Mode—DRVDD = 1.8 V
High Level Output Voltage
IOH = 50 μA Full 1.79 V
IOH = 0.5 mA Full 1.75 V
Low Level Output Voltage
IOL = 1.6 mA Full 0.2 V
IOL = 50 μA Full 0.05 V
LVDS Mode—DRVDD = 1.8 V
Differential Output Voltage (VOD), ANSI Mode Full 250 350 450 mV
Output Offset Voltage (VOS), ANSI Mode Full 1.15 1.25 1.35 V
Differential Output Voltage (VOD), Reduced Swing Mode Full 150 200 280 mV
Output Offset Voltage (VOS), Reduced Swing Mode Full 1.15 1.25 1.35 V
Channel A/Channel B
Aperture Delay (tA) Full 1.0 1.0 ns
Aperture Uncertainty (Jitter, tJ) Full 0.1 0.1 ps rms
Wake-Up Time
3
Full 350 350 μs
OUT-OF-RANGE RECOVERY TIME Full 3 3 Cycles
1
Conversion rate is the clock rate after the divider.
2
Output propagation delay is measured from CLK 50% transition to DATA 50% transition, with 5 pF load.
3
Wake-up time is dependent on the value of the decoupling capacitors.
Unit
Rev. 0 | Page 11 of 76
AD9627
C
A
www.BDTIC.com/ADI
TIMING SPECIFICATIONS
Table 8.
Parameter Conditions Min Typ Max Unit
SYNC TIMING REQUIREMENTS
t
SSYNC
t
HSYNC
SPI TIMING REQUIREMENTS
t
DS
t
DH
t
CLK
t
S
t
H
t
HIGH
t
LOW
t
EN_SDIO
t
DIS_SDIO
SPORT TIMING REQUIREMENTS
t
CSSCLK
t
SSCLKSDO
t
SSCLKSDFS
Timing Diagrams
H A/CH B DAT
SYNC to rising edge of CLK setup time 0.24 ns
SYNC to rising edge of CLK hold time 0.40 ns
Setup time between the data and the rising edge of SCLK 2 ns
Hold time between the data and the rising edge of SCLK 2 ns
Period of the SCLK 40 ns
Setup time between CSB and SCLK 2 ns
Hold time between CSB and SCLK 2 ns
SCLK pulse width high 10 ns
SCLK pulse width low 10 ns
Time required for the SDIO pin to switch from an input to an
10 ns
output relative to the SCLK falling edge
Time required for the SDIO pin to switch from an output to an
10 ns
input relative to the SCLK rising edge
Delay from rising edge of CLK+ to rising edge of SMI SCLK 3.2 4.5 6.2 ns
Delay from rising edge of SMI SCLK to SMI SDO −0.4 0 0.4 ns
Delay from rising edge of SMI SCLK to SMI SDFS −0.4 0 0.4 ns
N+2
CLK+
CLK–
N+ 1
N
t
A
t
CLK
t
PD
N – 12N – 11N – 9N – 8N – 7N – 6N – 5N – 4
N – 13
N+ 3
N – 10
N+ 4
N+ 5
N+ 6
N+ 8
N+ 7
CH A/CH B FAST
DETECT
t
S
DCOA/DCOB
Figure 2. CMOS Output Mode Data an
N – 1N + 2N + 3N + 4N + 5N + 6N – 3N – 2
t
H
N
d Fast Detect Output Timing (Fast Detect Mode Select Bits = 000)
Rev. 0 | Page 12 of 76
t
N + 1
DCO
t
CLK
06571-002
AD9627
C
A
www.BDTIC.com/ADI
N
t
A
CLK+
CLK–
H A/CH B DAT
CH A/CH B F AST
DETECT
DCO+
DCO–
t
PD
ABABABABABABABABAAB
N – 13
N – 12N – 11N – 9N – 8N – 7N – 6N – 5N – 4
ABABABABABABABABAAB
N – 6N – 5N – 3N – 2N – 1NN + 1N + 2N – 7
Figure 3. LVDS Mode Data and Fast Detect Output Timing (Fast Detect M
N+ 1
t
CLK
N+2
N+ 3
N – 10
N – 4
t
DCO
N+ 4
N+ 5
t
N+ 6
CLK
N+ 8
N+ 7
ode Select Bits = 001 Through Fast Detect Mode Select Bits = 100)
06571-003
CLK+
CLK+
CLK–
SMI SCLK
SMI SDFS
t
CSSCLK
t
SSYNC
SYNC
Figure 4. SYNC Input Timing Requirements
t
SSCLKSDFS
Figure 5. Signal Monitor SPORT Outpu
t
HSYNC
t
SSCLKSDO
DATADATASMI SDO
t Timing (Divide-by-2 Mode)
06571-004
06571-005
Rev. 0 | Page 13 of 76
AD9627
www.BDTIC.com/ADI
ABSOLUTE MAXIMUM RATINGS
Table 9.
Parameter Rating
ELECTRICAL
AVDD, DVDD to AGND −0.3 V to +2.0 V
DRVDD to DRGND −0.3 V to +3.9 V
AGND to DRGND −0.3 V to +0.3 V
AVDD to DRVDD −3.9 V to +2.0 V
VIN+A/VIN+B, VIN−A/VIN−B to AGND −0.3 V to AVDD + 0.2 V
CLK+, CLK− to AGND −0.3 V to +3.9 V
SYNC to AGND −0.3 V to +3.9 V
VREF to AGND −0.3 V to AVDD + 0.2 V
SENSE to AGND −0.3 V to AVDD + 0.2 V
CML to AGND −0.3 V to AVDD + 0.2 V
RBIAS to AGND −0.3 V to AVDD + 0.2 V
CSB to AGND −0.3 V to +3.9 V
SCLK/DFS to DRGND −0.3 V to +3.9 V
SDIO/DCS to DRGND −0.3 V to DRVDD + 0.3 V
SMI SDO/OEB −0.3 V to DRVDD + 0.3 V
SMI SCLK/PDWN −0.3 V to DRVDD + 0.3 V
SMI SDFS −0.3 V to DRVDD + 0.3 V
D0A/D0B through D11A/D11B to
DRGND
FD0A/FD0B through FD3A/FD3B to
DRGND
DCOA/DCOB to DRGND
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
ENVIRONMENTAL
Operating Temperature Range
−40°C to +85°C
(Ambient)
Maximum Junction Temperature
150°C
Under Bias
Storage Temperature Range
−65°C to +150°C
(Ambient)
Stresses above those listed under Absolute Maximum Ratings
y cause permanent damage to the device. This is a stress
ma
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the customer
board increases the reliability of the solder joints and maximizes
the thermal capability of the package.
Table 10. Thermal Resistance
Airflow
Package
Typ e
64-Lead LFCSP
9 mm × 9 mm
(CP-64-3)
1
Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3
Per MIL-Std 883, Method 1012.1.
4
Per JEDEC JESD51-8 (still air).
Ve
lo city
(m/s) θ
1, 2
JA
1, 3
θ
JC
1, 4
θ
Unit
JB
0 18.8 0.6 6.0 °C/W
1.0 16.5 °C/W
2.0 15.8 °C/W
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown, airflow improves heat dissipation, which
reduces θ
. In addition, metal in direct contact with the package
JA
leads from metal traces, through holes, ground, and power
planes, reduces the θ
Table 11. Pin Function Descriptions (Parallel CMOS Mode)
Pin No. Mnemonic Type Description
ADC Power Supplies
20, 64 DRGND Ground Digital Output Ground.
1, 21 DRVDD Supply Digital Output Driver Supply (1.8 V to 3.3 V).
24, 57 DVDD Supply Digital Power Supply (1.8 V Nominal).
36, 45, 46 AVDD Supply Analog Power Supply (1.8 V Nominal).
0 AGND Ground Analog Ground. Pin 0 is the exposed thermal pad on the bottom of the package.
12, 13, 58, 59 DNC Do Not Connect.
ADC Analog
37 VIN+A Input Differential Analog Input Pin (+) for Channel A.
38 VIN−A Input Differential Analog Input Pin (−) for Channel A.
44 VIN+B Input Differential Analog Input Pin (+) for Channel B.
43 VIN−B Input Differential Analog Input Pin (−) for Channel B.
39 VREF Input/Output Voltage Reference Input/Output.
40 SENSE Input Voltage Reference Mode Select. See Tab le 14 for details.
42 RBIAS Input/Output External Reference Bias Resistor.
41 CML Output Common-Mode Level Bias Output for Analog Inputs.
49 CLK+ Input ADC Clock Input—True.
50 CLK− Input ADC Clock Input—Complement.
ADC Fast Detect Outputs
29 FD0A Output Channel A Fast Detect Indicator. See Tab le 17 for details.
30 FD1A Output Channel A Fast Detect Indicator. See Tab le 17 for details.
31 FD2A Output Channel A Fast Detect Indicator. See Tab le 17 for details.
32 FD3A Output Channel A Fast Detect Indicator. See Tab le 17 for details.
53 FD0B Output Channel B Fast Detect Indicator. See Table 17 for details.
54 FD1B Output Channel B Fast Detect Indicator. See Table 17 for details.
55 FD2B Output Channel B Fast Detect Indicator. See Table 17 for details.
56 FD3B Output Channel B Fast Detect Indicator. See Table 17 for details.
Digital Input
52 SYNC Input Digital Synchronization Pin. Slave mode only.
Rev. 0 | Page 15 of 76
AD9627
www.BDTIC.com/ADI
Pin No. Mnemonic Type Description
Digital Outputs
14 D0A (LSB) Output Channel A CMOS Output Data.
15 D1A Output Channel A CMOS Output Data.
16 D2A Output Channel A CMOS Output Data.
17 D3A Output Channel A CMOS Output Data.
18 D4A Output Channel A CMOS Output Data.
19 D5A Output Channel A CMOS Output Data.
22 D6A Output Channel A CMOS Output Data.
23 D7A Output Channel A CMOS Output Data.
25 D8A Output Channel A CMOS Output Data.
26 D9A Output Channel A CMOS Output Data.
27 D10A Output Channel A CMOS Output Data.
28 D11A (MSB) Output Channel A CMOS Output Data.
60 D0B (LSB) Output Channel B CMOS Output Data.
61 D1B Output Channel B CMOS Output Data.
62 D2B Output Channel B CMOS Output Data.
63 D3B Output Channel B CMOS Output Data.
2 D4B Output Channel B CMOS Output Data.
3 D5B Output Channel B CMOS Output Data.
4 D6B Output Channel B CMOS Output Data.
5 D7B Output Channel B CMOS Output Data.
6 D8B Output Channel B CMOS Output Data.
7 D9B Output Channel B CMOS Output Data.
8 D10B Output Channel B CMOS Output Data.
9 D11B (MSB) Output Channel B CMOS Output Data.
11 DCOA Output Channel A Data Clock Output.
10 DCOB Output Channel B Data Clock Output.
SPI Control
48 SCLK/DFS Input SPI Serial Clock/Data Format Select Pin in External Pin Mode.
47 SDIO/DCS Input/Output SPI Serial Data I/O/Duty Cycle Stabilizer Pin in External Pin Mode.
51 CSB Input SPI Chip Select (Active Low).
Signal Monitor Port
33 SMI SDO/OEB Input/Output Signal Monitor Serial Data Output/Output Enable Input (Active Low) in External Pin Mode.
35 SMI SDFS Output Signal Monitor Serial Data Frame Sync.
34 SMI SCLK/PDWN Input/Output Signal Monitor Serial Clock Output/Power-Down Input in External Pin Mode.
Table 12. Pin Function Descriptions (Interleaved Parallel LVDS Mode)
Pin No. Mnemonic Type Description
ADC Power Supplies
20, 64 DRGND Ground Digital Output Ground.
1, 21 DRVDD Supply Digital Output Driver Supply (1.8 V to 3.3 V).
24, 57 DVDD Supply Digital Power Supply (1.8 V Nominal).
36, 45, 46 AVDD Supply Analog Power Supply (1.8 V Nominal).
0 AGND Ground Analog Ground. Pin 0 is the exposed thermal pad on the bottom of the package.
2, 3, 62,
DNC Do Not Connect.
63
ADC Analog
37 VIN+A Input Differential Analog Input Pin (+) for Channel A.
38 VIN−A Input Differential Analog Input Pin (−) for Channel A.
44 VIN+B Input Differential Analog Input Pin (+) for Channel B.
43 VIN−B Input Differential Analog Input Pin (−) for Channel B.
39 VREF Input/Output Voltage Reference Input/Output.
40 SENSE Input Voltage Reference Mode Select. See Table 14 for details.
42 RBIAS Input/Output External Reference Bias Resistor.
41 CML Output Common-Mode Level Bias Output for Analog Inputs.
49 CLK+ Input ADC Clock Input—True.
50 CLK− Input ADC Clock Input—Complement.
ADC Fast Detect Outputs
54 FD0+ Output Channel A/Channel B LVDS Fast Detect Indicator 0—True. See Table 17 for details.
53 FD0− Output Channel A/Channel B LVDS Fast Detect Indicator 0—Complement. See Table 17 for details.
56 FD1+ Output Channel A/Channel B LVDS Fast Detect Indicator 1—True. See Table 17 for details.
55 FD1− Output Channel A/Channel B LVDS Fast Detect Indicator 1—Complement. See Table 17 for details.
59 FD2+ Output Channel A/Channel B LVDS Fast Detect Indicator 2—True. See Table 17 for details.
58 FD2− Output Channel A/Channel B LVDS Fast Detect Indicator 2—Complement. See Table 17 for details.
61 FD3+ Output Channel A/Channel B LVDS Fast Detect Indicator 3—True. See Table 17 for details.
60 FD3− Output Channel A/Channel B LVDS Fast Detect Indicator 3—Complement. See Table 17 for details.
Digital Input
52 SYNC Input Digital Synchronization Pin. Slave mode only.
Rev. 0 | Page 17 of 76
AD9627
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Pin No. Mnemonic Type Description
Digital Outputs
5 D0+ (LSB) Output Channel A/Channel B LVDS Output Data 0—True.
4 D0− (LSB) Output Channel A/Channel B LVDS Output Data 0—Complement.
7 D1+ Output Channel A/Channel B LVDS Output Data 1—True.
6 D1− Output Channel A/Channel B LVDS Output Data 1—Complement.
9 D2+ Output Channel A/Channel B LVDS Output Data 2—True.
8 D2− Output Channel A/Channel B LVDS Output Data 2—Complement.
13 D3+ Output Channel A/Channel B LVDS Output Data 3—True.
12 D3− Output Channel A/Channel B LVDS Output Data 3—Complement.
15 D4+ Output Channel A/Channel B LVDS Output Data 4 —True.
14 D4− Output Channel A/Channel B LVDS Output Data 4—Complement.
17 D5+ Output Channel A/Channel B LVDS Output Data 5—True.
16 D5− Output Channel A/Channel B LVDS Output Data 5—Complement.
19 D6+ Output Channel A/Channel B LVDS Output Data 6—True.
18 D6− Output Channel A/Channel B LVDS Output Data 6—Complement.
23 D7+ Output Channel A/Channel B LVDS Output Data 7—True.
22 D7− Output Channel A/Channel B LVDS Output Data 7—Complement.
26 D8+ Output Channel A/Channel B LVDS Output Data 8—True.
25 D8− Output Channel A/Channel B LVDS Output Data 8—Complement.
28 D9+ Output Channel A/Channel B LVDS Output Data 9—True.
27 D9− Output Channel A/Channel B LVDS Output Data 9—Complement.
30 D10+ Output Channel A/Channel B LVDS Output Data 10—True.
29 D10− Output Channel A/Channel B LVDS Output Data 10—Complement.
32 D11+ (MSB) Output Channel A/Channel B LVDS Output Data 11—True.
31 D11− (MSB) Output Channel A/Channel B LVDS Output Data 11—Complement.
11 DCO+ Output Channel A/Channel B LVDS Data Clock Output—True.
10 DCO− Output Channel A/Channel B LVDS Data Clock Output—Complement.
SPI Control
48 SCLK/DFS Input SPI Serial Clock/Data Format Select Pin in External Pin Mode.
47 SDIO/DCS Input/Output SPI Serial Data I/O/Duty Cycle Stabilizer Pin in External Pin Mode.
51 CSB Input SPI Chip Select (Active Low).
Signal Monitor Port
33 SMI SDO/OEB Input/Output Signal Monitor Serial Data Output/Output Enable Input (Active Low) in External Pin Mode.
35 SMI SDFS Output Signal Monitor Serial Data Frame Sync.
34 SMI SCLK/PDWN Input/Output Signal Monitor Serial Clock Output/Power-Down Input in External Pin Mode.
Rev. 0 | Page 18 of 76
AD9627
V
C
S
V
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EQUIVALENT CIRCUITS
LK+
IN
06571-008
Figure 8. Equivalent Analog Input Circuit
AVDD
1.2V
10kΩ10kΩ
Figure 9. Equivalent Clock Input Circuit
DRVDD
CLK–
SCLK/DFS
26kΩ
1kΩ
06571-012
Figure 12. Equivalent SCLK/DFS Input Circuit
SENSE
06571-009
1kΩ
06571-013
Figure 13. Equivalent SENSE Circuit
AVDD
26kΩ
CSB
1kΩ
DRGND
6571-010
Figure 10. Digital Output
DRVDD
DRVDD
26kΩ
DIO/DCS
1kΩ
06571-011
Figure 11. Equivalent SDIO/DCS or SMI SDFS Circuit
Rev. 0 | Page 19 of 76
Figure 14. Equivalent CSB Input Circuit
AVDD
REF
6kΩ
06571-015
Figure 15. Equivalent VREF Circuit
06571-014
AD9627
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TYPICAL PERFORMANCE CHARACTERISTICS
AVDD = 1.8 V, DVDD = 1.8 V, DRVDD = 3.3 V, sample rate = 150 MSPS, DCS enabled, 1.0 V internal reference, 2 V p-p differential input,
VIN = −1.0 dBFS, and 64k sample, T
0
–20
–40
= 25°C, unless otherwise noted.
A
150MSPS
2.3MHz @ –1dBF S
SNR = 69.4dBc (70.4dBFS)
ENOB = 11.4 BI TS
SFDR = 86.5dBc