ANALOG DEVICES AD9523-1 Service Manual

Low Jitter Clock Generator with
14 LVPECL/LVDS/HSTL/29 LVCMOS Outputs

FEATURES

Output frequency: <1 MHz to 1 GHz Start-up frequency accuracy: <±100 ppm (determined by
VCXO reference accuracy)
Zero delay operation
Input-to-output edge timing: <150 ps Dual VCO dividers 14 outputs: configurable LVPECL, LVDS, HSTL, and LVCMOS 14 dedicated output dividers with jitter-free adjustable delay Adjustable delay: 63 resolution steps of ½ period of VCO
output divider Output-to-output skew: <50 ps Duty cycle correction for odd divider settings Automatic synchronization of all outputs on power-up Absolute output jitter: <150 fs at 122.88 MHz
Integration range: 12 kHz to 20 MHz Broadband timing jitter: 124 fs Digital lock detect Nonvolatile EEPROM stores configuration settings SPI- and I²C-compatible serial control port Dual PLL architecture
PLL1
Low bandwidth for reference input clock cleanup with
external VCXO Phase detector rate of 300 kHz to 75 MHz Redundant reference inputs Auto and manual reference switchover modes
Revertive and nonrevertive switching Loss of reference detection with holdover mode Low noise LVCMOS output from VCXO used for RF/IF
synthesizers
PLL2
Phase detector rate of up to 250 MHz Integrated low noise VCO

APPLICATIONS

LTE and multicarrier GSM base stations Wireless and broadband infrastructure Medical instrumentation Clocking high speed ADCs, DACs, DDSs, DDCs, DUCs, MxFEs Low jitter, low phase noise clock distribution Clock generation and translation for SONET, 10Ge, 10G FC,
and other 10 Gbps protocols Forward error correction (G.710) High performance wireless transceivers ATE and high performance instrumentation
AD9523-1

FUNCTIONAL BLOCK DIAGRAM

OSC_IN, OSC_IN
AD9523-1
REFA, REFA
REFB, REFB
REF_TEST
SCLK/SCL
SDIO/ SDA
SDO
PLL1
CONTROL
INTERFACE
(SPI AND I
EEPROM
2
PLL2
C)
ZERO
DELAY
ZD_IN, ZD_IN
DIVIDE- BY-
3, 4, 5
DIVIDE- BY-
3, 4, 5
Figure 1.
8 OUTPUTS
6 OUTPUTS
14-CLOCK
DISTRIBUTI ON

GENERAL DESCRIPTION

The AD9523-1 provides a low power, multi-output, clock distribution function with low jitter performance, along with an on-chip PLL and VCO with two VCO dividers. The on-chip VCO tunes from 2.94 GHz to 3.1 GHz.
The AD9523-1 is defined to support the clock requirements for long term evolution (LTE) and multicarrier GSM base station designs. It relies on an external VCXO to provide the reference jitter cleanup to achieve the restrictive low phase noise require­ments necessary for acceptable data converter SNR performance.
The input receivers, oscillator, and zero delay receiver provide both single-ended and differential operation. When connected to a recovered system reference clock and a VCXO, the device generates 14 low noise outputs with a range of 1 MHz to 1 GHz, and one dedicated buffered output from the input PLL (PLL1). The frequency and phase of one clock output relative to another clock output can be varied by means of a divider phase select function that serves as a jitter-free, coarse timing adjustment in increments that are equal to half the period of the signal coming out of the VCO.
An in-package EEPROM can be programmed through the serial interface to store user-defined register settings for power-up and chip reset.
OUT0, OUT0
OUT3, OUT3
OUT10, OUT10
OUT13, OUT13
OUT4, OUT4
OUT9, OUT9
09278-001
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
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AD9523-1

TABLE OF CONTENTS

Features.............................................................................................. 1
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Conditions..................................................................................... 3
Supply Current.............................................................................. 3
Power Dissipation......................................................................... 5
REFA
REFA, ZD_IN
OSC_CTRL Output Characteristics .......................................... 6
REF_TEST Input Characteristics............................................... 6
PLL1 Output Characteristics ...................................................... 7
OUT0,
Characteristics .............................................................................. 7
Timing Alignment Characteristics............................................. 8
Jitter and Noise Characteristics .................................................. 9
PLL2 Characteristics .................................................................... 9
Logic Input Pins—PD,
REF_SEL........................................................................................ 9
Status Output Pins—STATUS1, STATUS0 ............................. 10
Serial Control Port—SPI Mode................................................ 10
Serial Control Port—IC Mode................................................ 11
Absolute Maximum Ratings.......................................................... 12
Thermal Resistance .................................................................... 12
ESD Caution................................................................................ 12
Pin Configuration and Function Descriptions........................... 13
Typical Performance Characteristics ........................................... 16
, REFB,
Input Characteristics...................................................... 6
OUT0
REFB
to OUT13,
SYNC, RESET
, OSC_IN,
OUT13
Distribution Output
OSC_IN
, EEPROM_SEL,
, and ZD_IN,
Input/Output Termination Recommendations.......................... 19
Terminology.................................................................................... 20
Theory of Operation ...................................................................... 21
Detailed Block Diagram ............................................................ 21
Overview ..................................................................................... 21
Component Blocks—Input PLL (PLL1).................................. 22
Component Blocks—Output PLL (PLL2) .............................. 23
Clock Distribution ..................................................................... 25
Zero Delay Operation................................................................ 27
Serial Control Port ......................................................................... 28
SPI/IC Port Selection................................................................ 28
IC Serial Port Operation.......................................................... 28
SPI Serial Port Operation.......................................................... 31
SPI Instruction Word (16 Bits)................................................. 32
SPI MSB/LSB First Transfers .................................................... 32
EEPROM Operations..................................................................... 35
Writing to the EEPROM ........................................................... 35
Reading from the EEPROM ..................................................... 35
Programming the EEPROM Buffer Segment......................... 36
Power Dissipation and Thermal Considerations....................... 38
Clock Speed and Driver Mode ................................................. 38
Evaluation of Operating Conditions........................................ 38
Thermally Enhanced Package Mounting Guidelines............ 39
Control Registers............................................................................ 40
Control Register Map ................................................................ 40
Control Register Map Bit Descriptions................................... 45
Outline Dimensions....................................................................... 58
Ordering Guide .......................................................................... 58

REVISION HISTORY

3/11—Rev. A to Rev. B
Added Table Summary, Table 8 ...................................................... 7
Changes to Figure 24...................................................................... 21
Changes to EEPROM Operations Section and Writing to the
EEPROM Section............................................................................ 35
Changes to Addr (Hex) 0x01A, Bits[4:3], Table 30.................... 40
Changes to Bits[4:3], Table 40....................................................... 47
Rev. B | Page 2 of 60
12/10—Rev. 0 to Rev. A
Changes to General Description Section .......................................1
Changes to Frequency Range, Table 11 ..........................................9
Changes to PLL2 General Description Section.......................... 23
Changes to Table 47, Address 0x0F3, Bit 1 ................................. 48
10/10—Revision 0: Initial Version
AD9523-1

SPECIFICATIONS

f
= 122.88 MHz single-ended, REFA and REFB on differential at 30.72 MHz, f
VCXO
Typical is given for VDD = 3.3 V ± 5%, and T T
(−40°C to +85°C) variation, as listed in Tabl e 1.
A
= 25°C, unless otherwise noted. Minimum and maximum values are given over the full VDD and
A

CONDITIONS

Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
SUPPLY VOLTAGE
VDD3_PLL, Supply Voltage for PLL1 and PLL2 3.135 3.3 3.465 V 3.3 V ± 5%
VDD3_VCO, Supply Voltage for VCO 3.135 3.3 3.465 V 3.3 V ± 5%
VDD3_REF, Supply Voltage Clock Output Drivers Reference 3.135 3.3 3.465 V 3.3 V ± 5%
VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 3.135 3.3 3.465 V 3.3 V ± 5%
VDD1.8_OUT[x:y],1 Supply Voltage Clock Dividers 1.768 1.8 1.832 V 1.8 V ± 5%
TEMPERATURE RANGE, TA −40 +25 +85 °C
1
x and y are the pair of differential outputs that share the same power supply. For example, VDD3_OUT[0:1] is Supply Voltage Clock Output OUT0,
respectively) and Supply Voltage Clock Output OUT1,
OUT1
(Pin 65 and Pin 64, respectively).

SUPPLY CURRENT

Table 2.
Parameter Min Typ Max Unit Test Conditions/Comments
SUPPLIES OTHER THAN CLOCK OUTPUT DRIVERS
VDD3_PLL, Supply Voltage for PLL1 and PLL2 37 41.9 mA Decreases by 9 mA typical if REFB is turned off
VDD3_VCO, Supply Voltage for VCO and VCO Divider M1 70 75.8 mA All outputs use VCO Divider M1
VDD3_REF, Supply Voltage Clock Output Drivers Reference
VCO Divider M1 Enabled
LVPECL Mode, LVDS Mode 4 5.1 mA
HSTL Mode, CMOS Mode 3 3.6 mA
VCO Divider M2 Enabled
LVPECL Mode, LVDS Mode 26 30.1 mA
HSTL Mode, CMOS Mode 24.5 28.6 mA
VDD1.8_OUT[x:y],1 Supply Voltage Clock Dividers 3.2 5.8 mA Current for each divider: f = 122.88 MHz
VDD1.8_OUT[x:y],1 Supply Voltage Clock Dividers 6.4 12 mA Current for each divider: f = 983.04 MHz
CLOCK OUTPUT DRIVERS—LOWER POWER MODE OFF Channel x control register, Bit 4 = 0
LVDS Mode, 7 mA
VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 11.5 13.2 mA f = 122.88 MHz VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 40 45 mA f = 983.04 MHz
LVDS Mode, 3.5 mA
VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 6.5 7.5 mA f = 122.88 MHz VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 23 26.3 mA f = 983.04 MHz
LVPECL Mode
VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 13 14.4 mA f = 122.88 MHz VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 41 46.5 mA f = 983.04 MHz
= 2949.12 MHz, doubler is on, unless otherwise noted.
VCO
OUT0
(Pin 68 and Pin 67,
Use VCO Divider M1; only one output driver is turned on; for each additional output that is turned on, the current increments by 1.2 mA maximum
Use VCO Divider M1; values are independent of the number of outputs turned on
Use VCO Divider M2; only one output driver is turned on; for each additional output that is turned on, the current increments by 1.2 mA maximum
Use VCO Divider M2; values are independent of the number of outputs turned on
Rev. B | Page 3 of 60
AD9523-1
Parameter Min Typ Max Unit Test Conditions/Comments
HSTL Mode, 16 mA
VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 20 24.2 mA f = 122.88 MHz VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 50 59.1 mA f = 983.04 MHz
HSTL Mode, 8 mA
VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 14 16.7 mA f = 122.88 MHz VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 42.5 49 mA f = 983.04 MHz
CMOS Mode (Single-Ended)
VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 2 2.4 mA f = 15.36 MHz, 10 pF Load
CLOCK OUTPUT DRIVERS—LOWER POWER MODE ON Channel x control register, Bit 4 = 1
LVDS Mode, 7 mA
VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 10 10.8 mA f = 122.88 MHz VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 27 29.8 mA f = 983.04 MHz
LVDS Mode, 3.5 mA
VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 6.5 7.5 mA f = 122.88 MHz VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 23 26.3 mA f = 983.04 MHz
LVPECL Mode
VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 11 12.4 mA f = 122.88 MHz VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 28 31.2 mA f = 983.04 MHz
HSTL Mode, 16 mA
VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 20 24.3 mA f = 122.88 MHz VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 50 59.1 mA f = 983.04 MHz
HSTL Mode, 8 mA
VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 11 12.7 mA f = 122.88 MHz VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers 27 31.8 mA f = 983.04 MHz
1
x and y are the pair of differential outputs that share the same power supply. For example, VDD3_OUT[0:1] is Supply Voltage Clock Output OUT0,
respectively) and Supply Voltage Clock Output OUT1,
OUT1
(Pin 65 and Pin 64, respectively).
OUT0
(Pin 68 and Pin 67,
Rev. B | Page 4 of 60
AD9523-1

POWER DISSIPATION

Table 3.
Parameter Min Typ Max Unit Test Conditions/Comments
POWER DISSIPATION Does not include power dissipated in termination resistors
Typical Configuration 898 984.7 mW
PD, Power-Down
74 98.2 mW
INCREMENTAL POWER DISSIPATION
Base Typical Configuration 393 434.7 mW
Switched to One Input,
−28.5 −8 mW Running at 30.72 MHz
Reference Single-Ended Mode
Switched to Two Inputs,
26 44.6 mW Running at 30.72 MHz
Reference Differential Mode
Switched to Two Inputs,
−27.5 −5.1 mW Running at 30.72 MHz
Reference Single-Ended Mode VCO Divider M2 76 88.3 mW Incremental power increase VCO Divider M2 (OUT4) from base typical Output Distribution, Driver On Incremental power increase (OUT1) from base typical
LVDS Mode
3.5 mA 29 34.8 mW Single 3.5 mA LVDS output at 122.88 MHz
88 105.6 mW Single 3.5 mA LVDS output at 983.04 MHz
7 mA 43 50 mW Single 7 mA LVDS output at 122.88 MHz
141 164 mW Single 7 mA LVDS output at 983.04 MHz
LVPECL Mode 46 51 mW Single LVPECL output at 122.88 MHz
144 159 mW Single LVPECL output at 983.04 MHz
HSTL Mode
8 mA 44 51 mW Single 8 mA HSTL output at 122.88 MHz 143 165 mW Single 8 mA HSTL output at 983.04 MHz 16 mA 48 55 mW Single 16 mA HSTL output at 122.88 MHz
153 176 mW Single 16 mA HSTL output at 983.04 MHz
CMOS Mode 6.6 7.9 mW Single 3.3 V CMOS output at 15.36 MHz
9.9 11.9 mW Dual complementary 3.3 V CMOS output at 15.36 MHz
9.9 11.9 mW Dual in-phase 3.3 V CMOS output at 15.36 MHz
Output Distribution, Driver On Lower power mode on, (Channel x control register, Bit 4 = 1)
LVDS Mode
3.5 mA 28.5 33.6 mW Single 3.5 mA LVDS output at 122.88 MHz
88 105.6 mW Single 3.5 mA LVDS output at 983.04 MHz
7 mA 37 42.9 mW Single 7 mA LVDS output at 122.88 MHz
98 113.7 mW Single 7 mA LVDS output at 983.04 MHz
LVPECL Mode 40.5 46 mW Single LVPECL output at 122.88 MHz
100 110 mW Single LVPECL output at 983.04 MHz
HSTL Mode
8 mA 34 39.1 mW Single 8 mA HSTL output at 122.88 MHz
94 108.1 mW Single 8 mA HSTL output at 983.04 MHz
16 mA 48 55.2 mW Single 16 mA HSTL output at 122.88 MHz
153 176 mW Single 16 mA HSTL output at 983.04 MHz
Clock distribution outputs running as follows: 7 LVPECL at 122.88 MHz, 3 LVDS (3.5 mA) at 61.44 MHz, 3 LVDS (3.5 mA) at 245.76 MHz, 1 single­ended CMOS 10 pF load at 122.88 MHz, 1 differential input reference at 30.72 MHz; f
= 122.88 MHz, f
VCXO
= 2949.12 MHz, VCO Divider M1
VCO
at 3, and VCO Divider M2 is off; PLL2 BW = 530 kHz PD pin pulled low, with typical configuration conditions
Absolute total power with clock distribution; 1 LVPECL output (OUT0) running at 122.88 MHz; 1 differential input reference at 30.72 MHz;
= 122.88 MHz, f
f
VCXO
= 2949.12 MHz, VCO Divider M1 at 3; VCO
VCO
Divider M2 is off
Rev. B | Page 5 of 60
AD9523-1
REFA, REFA, REFB, REFB, OSC_IN, OSC_IN, AND ZD_IN, ZD_IN INPUT CHARACTERISTICS
Table 4.
Parameter Min Typ Max Unit Test Conditions/Comments
DIFFERENTIAL MODE
Input Frequency Range 400 MHz Input Slew Rate (OSC_IN) 400 V/µs
Common-Mode Internally
Generated Input Voltage Input Common-Mode Range 1.025 1.475 V For dc-coupled LVDS (maximum swing) Differential Input Voltage,
Sensitivity Frequency < 250 MHz
Differential Input Voltage,
Sensitivity Frequency > 250 MHz
Differential Input Resistance 4.8 kΩ Differential Input Capacitance 1 pF Duty Cycle
Pulse Width Low 1 ns
Pulse Width High 1 ns
CMOS MODE, SINGLE-ENDED INPUT
Input Frequency Range 250 MHz Input High Voltage 2.0 V Input Low Voltage 0.8 V Input Capacitance 1 pF Duty Cycle
Pulse Width Low 1.6 ns
Pulse Width High 1.6 ns
0.6 0.7 0.8 V
100 mV p-p
200 mV p-p
Minimum limit imposed for jitter performance
Capacitive coupling required; can accommodate single-ended input by ac grounding of unused input; instantaneous voltage on either pin must not exceed the 1.8 V dc supply rails
Capacitive coupling required; can accommodate single-ended input by ac grounding of unused input; instantaneous voltage on either pin must not exceed the 1.8 V dc supply rails
Duty cycle limits are set by pulse width high and pulse width low
Duty cycle limits are set by pulse width high and pulse width low

OSC_CTRL OUTPUT CHARACTERISTICS

Table 5.
Parameter Min Typ Max Unit Test Conditions/Comments
OUTPUT VOLTAGE
High VDD3_PLL − 0.15 V R Low 150 mV
LOAD
> 20 kΩ

REF_TEST INPUT CHARACTERISTICS

Table 6.
Parameter Min Typ Max Unit Test Conditions/Comments
REF_TEST INPUT
Input Frequency Range 250 MHz Input High Voltage 2.0 V Input Low Voltage 0.8 V
Rev. B | Page 6 of 60
AD9523-1

PLL1 OUTPUT CHARACTERISTICS

Table 7.
Parameter1 Min Typ Max Unit Test Conditions/Comments
MAXIMUM OUTPUT FREQUENCY 250 MHz
Rise Time/Fall Time (20% to 80%) 387 665 ps 15 pF load Duty Cycle 45 50 55 % f = 250 MHz
OUTPUT VOLTAGE HIGH Output driver static
VDD3_PLL − 0.25 V Load current = 10 mA VDD3_PLL − 0.1 V Load current = 1 mA
OUTPUT VOLTAGE LOW Output driver static
0.2 V Load current = 10 mA
0.1 V Load current = 1 mA
1
CMOS driver strength: strong (see Table 52).
OUT0, OUT0 TO OUT13, OUT13 DISTRIBUTION OUTPUT CHARACTERISTICS
Duty cycle performance is specified with the invert divider bit set to 1, and the divider phase bits set to 0.5. (For example, for Channel 0,
0x190[7] = 1 and 0x192[7:2] = 1.)
Table 8.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL MODE
Maximum Output Frequency 1 GHz Minimum VCO/maximum dividers Rise Time/Fall Time (20% to 80%) 117 147 ps 100 Ω termination across output pair Duty Cycle 47 50 52 % f < 500 MHz 43 48 52 % f = 500 MHz to 800 MHz 40 49 54 % f = 800 MHz to 1 GHz Differential Output Voltage Swing 643 775 924 mV
Common-Mode Output Voltage VDD – 1.5 VDD − 1.4 VDD − 1.25 V Output driver static
SCALED HSTL MODE, 16 mA
Maximum Output Frequency 1 GHz Minimum VCO/maximum dividers Rise Time/Fall Time (20% to 80%) 112 141 ps 100 Ω termination across output pair Duty Cycle 47 50 52 % f < 500 MHz 44 48 51 % f = 500 MHz to 800 MHz 40 49 54 % f = 800 MHz to 1 GHz Differential Output Voltage Swing 1.3 1.6 1.7 mV Nominal supply
Supply Sensitivity 0.6
Common-Mode Output Voltage VDD − 1.76 VDD − 1.6 VDD − 1.42 V
LVDS MODE, 3.5 mA
Maximum Output Frequency 1 GHz Rise Time/Fall Time (20% to 80%) 138 161 ps 100 Ω termination across output pair Duty Cycle 48 51 53 % f < 500 MHz 43 49 53 % f = 500 MHz to 800 MHz 41 49 55 % f = 800 MHz to 1 GHz Differential Output Voltage Swing
Balanced 247 454 mV
Unbalanced 50 mV
Common-Mode Output Voltage 1.125 1.375 V Output driver static Common-Mode Difference 50 mV
Short-Circuit Output Current 3.5 24 mA Output driver static
Rev. B | Page 7 of 60
mV/ mV
Magnitude of voltage across pins; output driver static
Change in output swing vs. VDD3_OUT[x:y] (∆V
Voltage swing between output pins; output driver static
Absolute difference between voltage swing of normal pin and inverted pin
Voltage difference between output pins; output driver static
/∆VDD3)
OD
AD9523-1
Parameter Min Typ Max Unit Test Conditions/Comments
CMOS MODE
Maximum Output Frequency 250 MHz Rise Time/Fall Time (20% to 80%) 387 665 ps 15 pF load Duty Cycle 45 50 55 % f = 250 MHz Output Voltage High Output driver static
VDD − 0.25 V Load current = 10 mA
VDD − 0.1 V Load current = 1 mA
Output Voltage Low Output driver static
0.2 V Load current = 10 mA
0.1 V Load current = 1 mA

TIMING ALIGNMENT CHARACTERISTICS

Table 9.
Parameter Min Typ Max Unit Test Conditions/Comments
OUTPUT TIMING SKEW
Between Outputs in Same Group1
LVPECL, HSTL, and LVDS
Between LVPECL, HSTL, and
30 183 ps
LVDS Outputs
CMOS
Between CMOS Outputs 100 300 ps Single-ended, true phase, high-Z mode Mean Delta Between Groups1 50 Adjustable Delay 0 63 Steps Resolution step; for example, 8 × 0.5/1 GHz
Resolution Step 500 ps ½ period of 1 GHz
Zero Delay
Between Input Clock Edge on
150 500 ps REFA or REFB to ZD_IN Input Clock Edge, External Zero Delay Mode
1
There are three groups of outputs. They are as follows: the top outputs group, consisting of OUT0, OUT1, OUT2, and OUT3; the right outputs group, consisting of
OUT4, OUT5, OUT6, OUT7, OUT8, and OUT9; and the bottom outputs group, consisting of OUT10, OUT11, OUT12, and OUT13.
Delay off on all outputs; maximum deviation between rising edges of outputs; all outputs are on, unless otherwise noted
PLL1 settings: PFD = 7.68 MHz, ICP = 63.5 µA,
= 10 kΩ, antibacklash pulse width is
R
ZERO
at maximum, BW = 40 Hz, REFA and ZD_IN are set to differential mode
Rev. B | Page 8 of 60
AD9523-1

JITTER AND NOISE CHARACTERISTICS

Table 10.
Parameter Min Typ Max Unit Test Conditions/Comments
OUTPUT ABSOLUTE RMS TIME JITTER
LVPECL Mode, HSTL Mode, LVDS Mode 109 fs Integrated BW = 200 kHz to 5 MHz 115 fs Integrated BW = 200 kHz to 10 MHz 150 fs Integrated BW = 12 kHz to 20 MHz 177 fs Integrated BW = 10 kHz to 61 MHz 187 fs Integrated BW = 1 kHz to 61 MHz 124 fs Integrated BW = 1 MHz to 61 MHz

PLL2 CHARACTERISTICS

Table 11.
Parameter Min Typ Max Unit Test Conditions/Comments
VCO (ON CHIP)
Frequency Range 2940 3100 MHz Gain 45 MHz/V
PLL2 FIGURE OF MERIT (FOM) −226 dBc/Hz MAXIMUM PFD FREQUENCY
Antibacklash Pulse Width
Minimum and Low 250 MHz Maximum and High 125 MHz
Application example based on a typical setup (see Table 3); f = 122.88 MHz
LOGIC INPUT PINS—PD, SYNC, RESET, EEPROM_SEL, REF_SEL
Table 12.
Parameter Min Typ Max Unit Test Conditions/Comments
VOLTAGE
Input High 2.0 V Input Low 0.8 V
INPUT LOW CURRENT ±80 ±250 µA
CAPACITANCE 3 pF RESET TIMING
Pulse Width Low 50 ns Inactive to Start of Register
Programming
SYNC TIMING
Pulse Width Low 1.5 ns High speed clock is the CLK input signal
100 ns
The minus sign indicates that, due to the internal pull-up resistor, current is flowing out of the AD9523-1
Rev. B | Page 9 of 60
AD9523-1

STATUS OUTPUT PINS—STATUS1, STATUS0

Table 13.
Parameter Min Typ Max Unit Test Conditions/Comments
VOLTAGE
Output High 2.94 V Output Low 0.4 V

SERIAL CONTROL PORT—SPI MODE

Table 14.
Parameter Min Typ Max Unit Test Conditions/Comments
CS (INPUT)
Voltage
Input Logic 1 2.0 V Input Logic 0 0.8 V
Current
Input Logic 1 30 µA Input Logic 0 −110 µA
Input Capacitance 2 pF
SCLK (INPUT) IN SPI MODE
Voltage
Input Logic 1 2.0 V Input Logic 0 0.8 V
Current
Input Logic 1 240 µA Input Logic 0 1 µA
Input Capacitance 2 pF
SDIO (WHEN INPUT IS IN BIDIRECTIONAL MODE)
Voltage
Input Logic 1 2.0 V Input Logic 0 0.8 V
Current
Input Logic 1 1 µA Input Logic 0 1 µA
Input Capacitance 2 pF
SDIO, SDO (OUTPUTS)
Output Logic 1 Voltage 2.7 V Output Logic 0 Voltage 0.4 V
TIMING
Clock Rate (SCLK, 1/t Pulse Width High, t Pulse Width Low, t
) 25 MHz
SCLK
8 ns
HIGH
12 ns
LOW
SDIO to SCLK Setup, tDS 3.3 ns SCLK to SDIO Hold, tDH 0 ns SCLK to Valid SDIO and SDO, tDV 14 ns CS to SCLK Setup, tS
CS to SCLK Setup and Hold, tS, tC CS Minimum Pulse Width High, t
PWH
CS has an internal 40 kΩ pull-up resistor
The minus sign indicates that, due to the internal pull-up resistor, current is flowing out of the AD9523-1
SCLK has an internal 40 kΩ pull-down resistor in SPI mode but not in I2C mode
10 ns 0 ns 6 ns
Rev. B | Page 10 of 60
AD9523-1

SERIAL CONTROL PORT—I²C MODE

VDD = VDD3_REF, unless otherwise noted.
Table 15.
Parameter Min Typ Max Unit Test Conditions/Comments
SDA, SCL (WHEN INPUTTING DATA)
Input Logic 1 Voltage 0.7 × VDD V Input Logic 0 Voltage 0.3 × VDD V Input Current with an Input Voltage Between
0.1 × VDD and 0.9 × VDD Hysteresis of Schmitt Trigger Inputs 0.015 × VDD V Pulse Width of Spikes That Must Be
Suppressed by the Input Filter, t
SPIKE
SDA (WHEN OUTPUTTING DATA)
Output Logic 0 Voltage at 3 mA Sink Current 0.4 V Output Fall Time from VIH
MIN
to VIL
MAX
with
a Bus Capacitance from 10 pF to 400 pF
TIMING
Clock Rate (SCL, f
) 400 kHz
I2C
Bus Free Time Between a Stop and Start
Condition, t
IDLE
Setup Time for a Repeated Start Condition,
t
SET; STR
Hold Time (Repeated) Start Condition, t
Setup Time for a Stop Condition, t Low Period of the SCL Clock, t High Period of the SCL Clock, t SCL, SDA Rise Time, t SCL, SDA Fall Time, t Data Setup Time, t Data Hold Time, t
20 + 0.1 C
RISE
20 + 0.1 C
FAL L
100 ns
SET; DAT
100 880 ns
HLD; DAT
Capacitive Load for Each Bus Line, C
1
CB is the capacitance of one bus line in picofarads (pF).
2
According to the original I2C specification, an I2C master must also provide a minimum hold time of 300 ns for the SDA signal to bridge the undefined region of the SCL
falling edge.
HLD; STR
SET; STP
1.3 µs
LOW
0.6 µs
HIGH
1
400 pF
B
−10 +10 µA
50 ns
1
20 + 0.1 C
250 ns
B
Note that all I
(0.3 × VDD) and VIL
VIH
MIN
1.3 µs
0.6 µs
0.6 µs
After this period, the first clock pulse is generated
0.6 µs
1
300 ns
B
1
300 ns
B
This is a minor deviation from the original I²C specification of 0 ns minimum2
2
C timing values are referred to
levels (0.7 × VDD)
MAX
Rev. B | Page 11 of 60
AD9523-1

ABSOLUTE MAXIMUM RATINGS

Table 16.
Parameter Rating
VDD3_PLL, VDD3_REF, VDD3_OUT[x:y],
−0.3 V to +3.6 V
LDO_VCO to GND REFA, REFA, REFB, REFB to GND SCLK/SCL, SDIO/SDA, SDO, CS to GND OUT0, OUT0, OUT1, OUT1, OUT2, OUT2,
OUT3, OUT3
, OUT4, OUT4, OUT5, OUT5,
−0.3 V to +3.6 V
−0.3 V to +3.6 V
−0.3 V to +3.6 V
OUT6, OUT6, OUT7, OUT7, OUT8, OUT8,
OUT9, OUT9
, OUT10, OUT10, OUT11, OUT11, OUT12, OUT12, OUT13, OUT13 to GND
SYNC, RESET, PD, REF_SEL to GND
−0.3 V to +3.6 V STATUS0, STATUS1 to GND −0.3 V to +3.6 V SP0, SP1, EEPROM_SEL to GND −0.3 V to +3.6 V VDD1.8_OUT[x:y], LDO_PLL1, LDO_DIV_M1
2 V
to GND Junction Temperature1 115°C Storage Temperature Range −65°C to +150°C Lead Temperature (10 sec) 300°C
1
See Table 17 for θJA.
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages.
Table 17. Thermal Resistance
Package Type
72-Lead LFCSP,
10 mm × 10 mm
1
Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.
2
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3
Per MIL-Std 883, Method 1012.1.
4
Per JEDEC JESD51-8 (still air).
Additional power dissipation information can be found in the
Power Dissipation and Thermal Considerations section.

ESD CAUTION

Airflow Velocity (m/sec) θ
1, 2
1, 3
θ
JA
JC
1, 4
θ
JB
1, 2
Ψ
Unit
JT
0 21.3 1.7 12.6 0.1 °C/W
1.0 20.1 0.2 °C/W
2.5 18.1 0.3 °C/W
Rev. B | Page 12 of 60
AD9523-1

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

PLL1_OUT
ZD_IN
ZD_IN
VDD1.8_OUT[0:1]
OUT0
OUT0
VDD3_OUT[0:1]
OUT1
OUT1
VDD1.8_OUT[2:3]
OUT2
OUT2
VDD3_OUT[2:3]
OUT3
OUT3
EEPROM_SEL
STATUS0/SP0
STATUS1/SP1
7271706968676665646362616059585756
55
REFA
REFA REFB REFB
PD
1 2 3 4 5 6 7 8 9
10
11 12 13 14 15 16 17SYNC 18VDD3_REF
PIN 1 INDICATOR
AD9523-1
TOP VIEW
(Not to Scale)
192021222324252627282930313233
CS
SDO
OUT13
RESET
SDIO/SDA
SCLK/SCL
OUT13
REF_TEST
VDD3_OUT[12:13]
OUT11
OUT12
OUT11
OUT12
VDD1.8_OUT[12:13]
34
OUT10
VDD3_OUT[10: 11]
54
VDD1.8_OUT[4:5]
53
OUT4
52
OUT4
51
VDD3_OUT[4:5]
50
OUT5
49
OUT5
48
VDD1.8_OUT[6:7]
47
OUT6
46
OUT6
45
VDD3_OUT[6:7]
44
OUT7
43
OUT7
42
VDD1.8_OUT[8:9]
41
OUT8
40
OUT8
39
VDD3_OUT[8:9]
38
OUT9
37
OUT9
35OUT10
36VDD1.8_OUT [10: 11]
LDO_PLL1 VDD3_PLL
LF1_EXT_CAP
OSC_CTRL
OSC_IN OSC_IN
LF2_EXT_CAP
LDO_VCO
VDD3_VCO
LDO_DIV_M1
REF_SEL
NOTES
1. THE EXPOSED PADDLE IS THE GROUND CONNECTION ON THE CHIP. IT MUST BE SOLDERED TO THEANALOG GROUND OF THE PCB TO ENSURE PROPER FUNCTIONALITY AND HEAT DISSIPATION, NOISE, AND MECHANICAL STRENGTH BENEFITS.
Figure 2. Pin Configuration
09278-002
Table 18. Pin Function Descriptions
Pin No. Mnemonic Type
1 LDO_PLL1 P/O
1
Description
1.8 V Internal LDO Regulator Decoupling Pin for PLL1. Connect a 0.47 F decoupling capacitor from this pin to ground. Note that for best performance, the LDO bypass capacitor must be placed in close
proximity to the device. 2 VDD3_PLL P 3.3 V Supply PLL1 and PLL2. Use the same supply as VCXO. 3 REFA I
Reference Clock Input A. Along with REFA
, this pin is the differential input for the PLL reference.
Alternatively, this pin can be programmed as a single-ended 3.3 V CMOS input. 4
REFA
I
Complementary Reference Clock Input A. Along with REFA, this pin is the differential input for the
PLL reference. Alternatively, this pin can be programmed as a single-ended 3.3V CMOS input. 5 REFB I
Reference Clock Input B. Along with REFB
, this pin is the differential input for the PLL reference.
Alternatively, this pin can be programmed as a single-ended 3.3 V CMOS input. 6
REFB
I
Complementary Reference Clock Input B. Along with REFB, this pin is the differential input for the PLL
reference. Alternatively, this pin can be programmed as a single-ended 3.3 V CMOS input. 7 LF1_EXT_CAP O PLL1 External Loop Filter Capacitor. Connect this pin to ground. 8 OSC_CTRL O Oscillator Control Voltage. Connect this pin to the voltage control pin of the external oscillator. 9 OSC_IN I
PLL1 Oscillator Input. Along with OSC_IN
, this pin is the differential input for the PLL reference.
Alternatively, this pin can be programmed as a single-ended 3.3 V CMOS input. 10
OSC_IN
I
Complementary PLL1 Oscillator Input. Along with OSC_IN, this pin is the differential input for the PLL
reference. Alternatively, this pin can be programmed as a single-ended 3.3 V CMOS input.
Rev. B | Page 13 of 60
AD9523-1
Pin No. Mnemonic Type
11 LF2_EXT_CAP O PLL2 External Loop Filter Capacitor Connection. Connect capacitor to this pin and the LDO_VCO pin. 12 LDO_VCO P/O
13 VDD3_VCO P 3.3 V Supply for VCO and VCO M1 Divider. 14 LDO_DIV_M1 P/O
15
PD 16 REF_SEL I Reference Input Select. This pin has an internal 40 kΩ pull-down resistor. 17
SYNC
18 VDD3_REF P 3.3 V Supply for Output Clock Drivers Reference and VCO Divider M2. 19
20
RESET
CS 21 SCLK/SCL I
22 SDIO/SDA I/O Serial Control Port Bidirectional Serial Data In/Data Out for SPI Mode (SDIO) or I²C Mode (SDA). 23 SDO O
24 REF_TEST I Test Input to PLL1 Phase Detector. 25
OUT13
26 OUT13 O
27 VDD3_OUT[12:13] P 3.3 V Supply for Output 12 and Output 13 Clock Drivers. 28
OUT12
29 OUT12 O
30 VDD1.8_OUT[12:13] P 1.8 V Supply for Output 12 and Output 13 Clock Dividers. 31
OUT11
32 OUT11 O
33 VDD3_OUT[10:11] P 3.3 V Supply for Output 10 and Output 11 Clock Drivers. 34
OUT10
35 OUT10 O
36 VDD1.8_OUT[10:11] P 1.8 V Supply for Output 10 and Output 11 Clock Dividers. 37
OUT9
38 OUT9 O
39 VDD3_OUT[8:9] P 3.3 V Supply for Output 8 and Output 9 Clock Drivers. 40
OUT8
41 OUT8 O
42 VDD1.8_OUT[8:9] P 1.8 V Supply for Output 8 and Output 9 Clock Dividers. 43
OUT7
44 OUT7 O
1
Description
2.5 V LDO Internal Regulator Decoupling Pin for VCO. Connect a 0.47 F decoupling capacitor from this pin to ground. Note that, for best performance, the LDO bypass capacitor must be placed in close proximity to the device.
1.8 V LDO Regulator Decoupling Pin for VCO Divider M1. Connect a 0.47 F decoupling capacitor from this pin to ground. Note that, for best performance, the LDO bypass capacitor must be placed in close proximity to the device.
I Chip Power-Down, Active Low. This pin has an internal 40 kΩ pull-up resistor.
I
Manual Synchronization. This pin initiates a manual synchronization and has an internal 40 kΩ pull­up resistor.
I
Digital Input, Active Low. Resets internal logic to default states. This pin has an internal 40 kΩ pull-up resistor.
I Serial Control Port Chip Select, Active Low. This pin has an internal 40 kΩ pull-up resistor.
2
Serial Control Port Clock Signal for SPI Mode (SCLK) or I
C Mode (SCL). Data clock for serial program-
ming. This pin has an internal 40 kΩ pull-down resistor in SPI mode but is high impedance in I²C mode.
Serial Data Output. Use this pin to read data in 4-wire mode (high impedance in 3-wire mode). There is no internal pull-up/pull-down resistor on this pin.
O
Complementary Square Wave Clocking Output 13. This pin can be configured as one side of a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 13. This pin can be configured as one side of a differential LVPECL/ LVDS/HSTL output or as a single-ended CMOS output.
O
Complementary Square Wave Clocking Output 12. This pin can be configured as one side of a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 12. This pin can be configured as one side of a differential LVPECL/ LVDS/HSTL output or as a single-ended CMOS output.
O
Complementary Square Wave Clocking Output 11. This pin can be configured as one side of a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 11. This pin can be configured as one side of a differential LVPECL/ LVDS/HSTL output or as a single-ended CMOS output.
O
Complementary Square Wave Clocking Output 10. This pin can be configured as one side of a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 10. This pin can be configured as one side of a differential LVPECL/ LVDS/HSTL output or as a single-ended CMOS output.
O
Complementary Square Wave Clocking Output 9. This pin can be configured as one side of a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 9. This pin can be configured as one side of a differential LVPECL/ LVDS/HSTL output or as a single-ended CMOS output.
O
Complementary Square Wave Clocking Output 8. This pin can be configured as one side of a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 8. This pin can be configured as one side of a differential LVPECL/ LVDS/HSTL output or as a single-ended CMOS output.
O
Complementary Square Wave Clocking Output 7. This pin can be configured as one side of a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 7. This pin can be configured as one side of a differential LVPECL/ LVDS/HSTL output or as a single-ended CMOS output.
Rev. B | Page 14 of 60
AD9523-1
Pin No. Mnemonic Type
45 VDD3_OUT[6:7] P 3.3 V Supply for Output 6 and Supply Output 7 Clock Drivers. 46
OUT6
47 OUT6 O
48 VDD1.8_OUT[6:7] P 1.8 V Supply for Output 6 and Output 7 Clock Dividers. 49
OUT5
50 OUT5 O
51 VDD3_OUT[4:5] P 3.3 V Supply for Output 4 and Output 5 Clock Drivers. 52
OUT4
53 OUT4 O
54 VDD1.8_OUT[4:5] P 1.8 V Supply for Output 4 and Output 5 Clock Dividers. 55 STATUS1/SP1 I/O
56 STATUS0/SP0 I/O
57 EEPROM_SEL I
58
OUT3
59 OUT3 O
60 VDD3_OUT[2:3] P 3.3 V Supply for Output 2 and Output 3 Clock Drivers. 61
OUT2
62 OUT2 O
63 VDD1.8_OUT[2:3] P 1.8 V Supply for Output 2 and Output 3 Clock Dividers. 64
OUT1
65 OUT1 O
66 VDD3_OUT[0:1] P 3.3 V Supply for Output 0 and Output 1 Clock Drivers. 67
OUT0
68 OUT0 O
69 VDD1.8_OUT[0:1] P 1.8 V Supply for Output 0 and Output 1 Clock Dividers. 70 ZD_IN I
71
ZD_IN
72 PLL1_OUT O
EP EP, GND GND
1
P = power, I = input, O = output, I/O = input/output, P/O = power/output, GND = ground.
1
Description
O
Complementary Square Wave Clocking Output 6. This pin can be configured as one side of a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 6. This pin can be configured as one side of a differential LVPECL/ LVDS/HSTL output or as a single-ended CMOS output.
O
Complementary Square Wave Clocking Output 5. This pin can be configured as one side of a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 5. This pin can be configured as one side of a differential LVPECL/ LVDS/HSTL output or as a single-ended CMOS output.
O
Complementary Square Wave Clocking Output 4. This pin can be configured as one side of a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 4. This pin can be configured as one side of a differential LVPECL/ LVDS/HSTL output or as a single-ended CMOS output.
Lock Detect and Other Status Signals (STATUS1)/I down resistor.
Lock Detect and Other Status Signals (STATUS0)/I down resistor.
EEPROM Select. Setting this pin high selects the register values stored in the internal EEPROM to be loaded at reset and/or power-up. Setting this pin low causes the AD9523-1 to load the hard-coded default register values at power-up/reset. This pin has an internal 40 kΩ pull-down resistor.
O
Complementary Square Wave Clocking Output 3. This pin can be configured as one side of a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 3. This pin can be configured as one side of a differential LVPECL/ LVDS/HSTL output or as a single-ended CMOS output.
O
Complementary Square Wave Clocking Output 2. This pin can be configured as one side of a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 2. This pin can be configured as one side of a differential LVPECL/ LVDS/HSTL output or as a single-ended CMOS output.
O
Complementary Square Wave Clocking Output 1. This pin can be configured as one side of a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 1. This pin can be configured as one side of a differential LVPECL/ LVDS/HSTL output or as a single-ended CMOS output.
O
Complementary Square Wave Clocking Output 0. This pin can be configured as one side of a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 0. This pin can be configured as one side of a differential LVPECL/ LVDS/HSTL output or as a single-ended CMOS output.
External Zero Delay Clock Input. Along with ZD_IN reference. Alternatively, this pin can be programmed as a single-ended 3.3 V CMOS input.
I
Complementary External Zero Delay Clock Input. Along with ZD_IN, this pin is the differential input for the PLL reference. Alternatively, this pin can be programmed as a single-ended 3.3 V CMOS input.
Single-Ended CMOS Output from PLL1. This pin has settings for weak and strong in Register 0x1BA, Bit 4 (see Table 52).
Exposed Paddle. The exposed paddle is the ground connection on the chip. It must be soldered to the analog ground of the PCB to ensure proper functionality and heat dissipation, noise, and mechanical strength benefits.
2
C Address (SP1). This pin has an internal 40 kΩ pull-
2
C Address (SP0). This pin has an internal 40 kΩ pull-
, this pin is the differential input for the PLL
Rev. B | Page 15 of 60
AD9523-1

TYPICAL PERFORMANCE CHARACTERISTICS

f
= 122.88 MHz, REFA differential at 30.72 MHz, f
VCXO
60
50
40
HSTL = 16mA
= 2949.12 MHz, and doubler is off, unless otherwise noted.
VCO
45
40
35
30
30
CURRENT (mA)
20
10
0
0 200 400 600 800 1000 1200
HSTL = 8mA
FREQUENCY (MHz)
Figure 3. VDD3_OUT[x:y] Current (Typical) vs. Frequency;
HSTL Mode at 16 mA and 8 mA
45
40
35
30
25
20
CURRENT (mA)
15
10
5
0
0 200 400 600 800 1000 1200
LVD S = 7mA
LVD S = 3 .5m A
FREQUENC Y (MHz)
Figure 4. VDD3_OUT[x:y] Current (Typical) vs. Frequency;
LVDS Mode at 7 mA and 3.5 mA
25
20
CURRENT (mA)
15
10
5
0
0 200 400 600 800 1000 1200
09278-003
FREQUE NCY (MHz )
09278-005
Figure 5. VDD3_OUT[x:y] Current (Typical) vs. Frequency, LVPECL Mode
35
30
25
20
15
CURRENT (mA)
10
5
0
0 100 200 300 400 500 600
09278-004
FREQUENCY (MHz)
20pF
10pF
2pF
09278-006
Figure 6. VDD3_OUT[x:y] Current (Typical) vs. Frequency;
CMOS Mode at 20 pF, 10 pF, and 2 pF Load
Rev. B | Page 16 of 60
AD9523-1
A
A
3.5
3.0
2.5
2.0
L SWING (V p-p)
1.5
1.0
DIFFERENTI
0.5
HSTL = 16mA
HSTL = 8mA
4.0
3.5
3.0
2.5
2.0
1.5
AMPLITUDE (V)
1.0
0.5
2pF
10pF
20pF
0
0 200 400 600 800 1000 1200
FREQUENC Y (MHz)
Figure 7. Differential Voltage Swing vs. Frequency;
HSTL Mode at 16 mA and 8 mA
1.6
1.4
1.2
1.0
0.8
L SWING (V p-p)
0.6
0.4
DIFFERENTI
0.2
0
0 200 400 600 800 1000 1200
FREQUENCY (MHz)
Figure 8. Differential Voltage Swing vs. Frequency, LVPECL Mode
1.4
1.2
LVD S = 7 mA
0
0 100 200 300 400 500 600
09278-007
FREQUENCY (MHz)
09278-010
Figure 10. Amplitude vs. Frequency and Capacitive Load;
CMOS Mode at 2 pF, 10 pF, and 20 pF Load
1
CH1 200mV 2. 5ns/DIV
09278-008
40.0GS/s
A CH1 104mV
09278-013
Figure 11. Output Waveform (Differential), LVPECL at 122.88 MHz
1.0
0.8
0.6
0.4
DIFFERENTIAL SWING (V p-p)
0.2
0
0 200 400 600 800 1000 1200
LVDS = 3.5mA
FREQUENCY (MHz)
Figure 9. Differential Voltage Swing vs. Frequency;
09278-009
1
CH1 500mV 2.5ns/DIV
40.0GS/s
A CH1 80mV
Figure 12. Output Waveform (Differential), HSTL at 16 mA, 122.88 MHz
09278-049
LVDS Mode at 7 mA and 3.5 mA
Rev. B | Page 17 of 60
AD9523-1
80
–90
–100
1: 1kHz, –120.0dBc/Hz 2: 10kHz, –130.6dBc/Hz 3: 100kHz, –137.4dBc/Hz 4: 1MHz, –145.7dBc/Hz 5: 10MHz, –159.6dBc/Hz 6: 40MHz, –160.3dBc/Hz 7: 800kHz, –143.7dBc/Hz
–110
–120
–130
–140
–150
PHASE NOISE (dBc/Hz)
–160
–170
–180
100 1k 10k 100k 1M 10M
1
2
3
NOISE: ANALYSIS RANGE x: START 10kHz TO STO P 40MHz INTG NOISE: –78.1dBc/40MHz RMS NOI SE: 175.4 µRAD
10.0mdeg RMS JITTER: 151.4fsec RESIDUAL FM: 2. 1kHz
7
FREQUENCY (Hz)
Figure 13. Phase Noise, Output = 184.32 MHz
(VCXO = 122.88 MHz, Crystek VCXO CVHD-950); Doubler On
4
5
6
09278-113
80
–90
–100
1: 1kHz, –123.1dBc/Hz 2: 10kHz, –133.8dBc/Hz 3: 100kHz, –140.5dBc/Hz 4: 1MHz, –149.0Bc/Hz 5: 10MHz, –161.5dBc/Hz 6: 40MHz, –162.1dBc/Hz 7: 800kHz, –146.9dBc/Hz
–110
–120
–130
–140
–150
PHASE NOISE (dBc/Hz)
NOISE: ANALYSIS RANGE x: START 1 0kHz TO STOP 40MHz
–160
INTG NOISE: –81.0dBc/40MHz RMS NOISE: 126.6µRAD
7.3mdeg
–170
RMS JITTER: 164.0fsec RESIDUAL FM: 1.7kHz
–180
100 1k 10k 100k 1M 10M
1
2
3
FREQUENCY (Hz)
Figure 15. Phase Noise, Output = 122.88 MHz
(VCXO = 122.88 MHz, Crystek VCXO CVHD-950); Doubler On
7
4
5
6
09278-014
80
–90
–100
1: 1kHz, –118.3dBc/Hz 2: 10kHz, –127.5dBc/Hz 3: 100kHz, –126.0dBc/Hz 4: 1MHz, –151.8dBc/Hz 5: 10MHz, –159.6dBc/Hz 6: 40MHz, –160.3dBc/Hz 7: 800kHz, –149.5dBc/Hz
–110
–120
–130
1
2
3
–140
–150
PHASE NOISE (dBc/Hz)
NOISE: ANALYSIS RANGE x: START 10k Hz
–160
INTG NOISE: –73.1dBc/40MHz RMS NOISE: 312.0µRAD
17.9mdeg
–170
RMS JITTER: 269.4fsec RESIDUAL FM: 2. 0kHz
–180
100 1k 10k 100k 1M 10M
TO STOP 40MHz
FREQUENCY (Hz)
Figure 14. Phase Noise, Output = 184.32 MHz
(VCXO = 122.88 MHz, Crystek VCXO CVHD-950); Doubler On;
Optimized for Low 800 kHz Offset Noise
80
–90
–100
1: 1kHz, –122.0Bc/Hz 2: 10kHz, –130.7dBc/Hz 3: 100kHz, –129.3dBc/Hz 4: 1MHz, –154.9dBc/Hz 5: 10MHz, –161.5dBc/Hz 6: 40MHz, –162.1dBc/Hz 7: 800kHz, –152.7dBc/Hz
–110
–120
–130
PHASE NOISE (dBc/Hz)
–140
–150
–160
7
4
5
6
–170
–180
100 1k 10k 100k 1M 10M
09278-012
1
2
NOISE: ANALYSIS RANGE x: START 10kHz
INTG NOISE: –76.3dBc/40MHz RMS NOISE: 217.0µRAD
12.4mdeg RMS JITTER: 281.1fsec RESIDUAL FM: 1.6kHz
TO STOP 40M Hz
FREQUENCY (Hz)
3
7
4
5
6
09278-015
Figure 16. Phase Noise, Output = 122.88 MHz
(VCXO = 122.88 MHz, Crystek VCXO CVHD-950); Doubler On;
Optimized for Low 800 kHz Offset Noise
Rev. B | Page 18 of 60
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