Analog Devices AD9512 Service Manual

1.2 GHz Clock Distribution IC, 1.6 GHz Inputs,

FEATURES

Two 1.6 GHz, differential clock inputs 5 programmable dividers, 1 to 32, all integers Phase select for output-to-output coarse delay adjust 3 independent 1.2 GHz LVPECL outputs
Additive output jitter 225 fs rms
2 independent 800 MHz/250 MHz LVDS/CMOS clock outputs
Additive output jitter 275 fs rms
Fine delay adjust on 1 LVDS/CMOS output Serial control port Space-saving 48-lead LFCSP

APPLICATIONS

Low jitter, low phase noise clock distribution Clocking high speed ADCs, DACs, DDSs, DDCs, DUCs, MxFEs High performance wireless transceivers High performance instrumentation Broadband infrastructure
Dividers, Delay Adjust, Five Outputs
AD9512

FUNCTIONAL BLOCK DIAGRAM

GNDVS
RSET
FUNCTION
DSYNC
DSYNCB
CLK1
CLK1B
CLK2
CLK2B
SCLK
SDIO
SDO CSB
SYNCB,
RESETB
PDB
DETECT
SYNC
SERIAL
CONTROL
PORT
VREF
PROGRAMMABLE
DIVIDERS AND
PHASE ADJUST
/1, /2, /3... /31, /32
/1, /2, /3... /31, /32
/1, /2, /3... /31, /32
/1, /2, /3... /31, /32
/1, /2, /3... /31, /32
Figure 1.
AD9512
DELAY
ADJUST
Δ
T
SYNC
STATUS
LVPECL
LVPECL
LVPECL
LVDS/CMOS
LVDS/CMOS
SYNC STATUS
OUT0 OUT0B
OUT1 OUT1B
OUT2 OUT2B
OUT3 OUT3B
OUT4 OUT4B
05287-001

GENERAL DESCRIPTION

The AD9512 provides a multi-output clock distribution in a design that emphasizes low jitter and low phase noise to maximize data converter performance. Other applications with demanding phase noise and jitter requirements can also benefit from this part.
There are five independent clock outputs. Three outputs are LVPECL (1.2 GHz), and two are selectable as either LVDS (800 MHz) or CMOS (250 MHz) levels.
Each output has a programmable divider that may be bypassed or set to divide by any integer up to 32. The phase of one clock output relative to another clock output may be varied by means of a divider phase select function that serves as a coarse timing adjustment.
One of the LVDS/CMOS outputs features a programmable delay element with a range of up to 10 ns of delay. This fine tuning delay block has 5-bit resolution, giving 32 possible delays from which to choose.
The AD9512 is ideally suited for data converter clocking applications where maximum converter performance is achieved by encode signals with subpicosecond jitter.
The AD9512 is available in a 48-lead LFCSP and can be operated from a single 3.3 V supply. The temperature range is
−40°C to +85°C.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2005 Analog Devices, Inc. All rights reserved.
AD9512

TABLE OF CONTENTS

Specifications..................................................................................... 4
Outputs ........................................................................................ 30
Clock Inputs.................................................................................. 4
Clock Outputs............................................................................... 4
Timing Characteristics ................................................................ 5
Clock Output Phase Noise .......................................................... 7
Clock Output Additive Time Jitter........................................... 10
Serial Control Port ..................................................................... 12
FUNCTION Pin ......................................................................... 13
SYNC Status Pin ......................................................................... 13
Power ............................................................................................14
Timing Diagrams............................................................................ 15
Absolute Maximum Ratings.......................................................... 16
Thermal Characteristics ............................................................ 16
ESD Caution................................................................................ 16
Pin Configuration and Function Descriptions........................... 17
Te r mi n ol o g y .................................................................................... 19
Typical Performance Characteristics ........................................... 20
Functional Description .................................................................. 24
Overall.......................................................................................... 24
FUNCTION Pin ......................................................................... 24
RESETB: 58h<6:5> = 00b (Default)..................................... 24
SYNCB: 58h<6:5> = 01b .......................................................24
PDB: 58h<6:5> = 11b............................................................. 24
DSYNC and DSYNCB Pins....................................................... 24
Clock Inputs................................................................................ 24
Dividers........................................................................................ 25
Setting the Divide Ratio ........................................................ 25
Setting the Duty Cycle........................................................... 25
Divider Phase Offset .............................................................. 29
Delay Block.................................................................................. 30
Calculating the Delay............................................................. 30
Power-Down Modes .................................................................. 31
Chip Power-Down or Sleep Mode—PDB........................... 31
Distribution Power-Down .................................................... 31
Individual Clock Output Power-Down............................... 31
Individual Circuit Block Power-Down................................ 31
Reset Modes ................................................................................ 31
Power-On Reset—Start-Up Conditions when
VS is Applied........................................................................... 31
Asynchronous Reset via the FUNCTION Pin ................... 31
Soft Reset via the Serial Port................................................. 31
Single-Chip Synchronization.................................................... 32
SYNCB—Hardware SYNC ................................................... 32
Soft SYNC—Register 58h<2>............................................... 32
Multichip Synchronization ....................................................... 32
Serial Control Port ......................................................................... 33
Serial Control Port Pin Descriptions....................................... 33
General Operation of Serial Control Port............................... 33
Framing a Communication Cycle with CSB ...................... 33
Communication Cycle—Instruction Plus Data................. 33
Wr it e ........................................................................................ 33
Read ......................................................................................... 34
The Instruction Word (16 Bits)................................................ 34
MSB/LSB First Transfers ........................................................... 34
Register Map and Description...................................................... 37
Summary Table........................................................................... 37
Register Map Description ......................................................... 39
Power Supply................................................................................... 43
Power Management ................................................................... 43
Applications..................................................................................... 44
Using the AD9512 Outputs for ADC Clock Applications.... 44
CMOS Clock Distribution ........................................................ 44
Rev. A | Page 2 of 48
AD9512
LVPECL Clock D i s t r ib ut i o n ......................................................45
LVDS Clock Distribution...........................................................45
Power and Grounding Considerations and Power Supply
Rejection.......................................................................................45
Outline Dimensions ........................................................................46
Ordering Guide ...........................................................................46

REVISION HISTORY

6/05—Rev. 0 to Rev. A
Changes to Features..........................................................................1
Changes to General Description .....................................................1
Changes to Table 1 ............................................................................4
Changes to Table 3 ............................................................................5
Changes to Table 4 ............................................................................7
Changes to Table 5 and Table 6 .....................................................12
Changes to Table 7 ..........................................................................13
Changes to Figure 12 and Figure 14 to Figure 16 .......................21
Changes to Figure 17 Caption .......................................................22
Changes to Figure 23 ......................................................................23
Changes to Divider Phase Offset Section ....................................29
Changes to Chip Power-Down or Sleep Mode—PDB Section .31
Changes to Distribution Power-Down Section...........................31
Changes to Individual Clock Output Power-Down Section .....31
Changes to Individual Circuit Block Power-Down Section ......31
Changes to Soft Reset via the Serial Port Section .......................31
Changes to SYNCB—Hardware SYNC Section..........................32
Changes to Soft SYNC Register 58h<2> Section ........................32
Changes to Multichip Synchronization Section..........................32
Changes to Serial Control Port Section .......................................33
Changes to Serial Control Port Pin Descriptions Section.........33
Changes to General Operation of Serial
Control Port Section.......................................................................33
Added Framing a Communication Cycle with CSB Section ....33
Added Communication Cycle—Instruction Plus
Data Section.....................................................................................33
Changes to Write Section ............................................................... 33
Changes to Read Section................................................................34
Changes to Instruction Word (16 Bits) Section ..........................34
Changes to MSB/LSB First Transfers Section..............................34
Changes to Figure 32 and Figure 36 .............................................35
Added Figure 38; Renumbered Sequentially...............................36
Changes to Table 17 ........................................................................37
Changes to Table 18 ........................................................................39
Changes to Power Supply Section.................................................43
Changes to Power Management Section......................................43
4/05—Revision 0: Initial Version
Rev. A | Page 3 of 48
AD9512

SPECIFICATIONS

Typical ( Ty p ) i s g iv e n f o r VS = 3.3 V ± 5%; TA = 25°C, R values are given over full V
and TA (−40°C to +85°C) variation.
S

CLOCK INPUTS

Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
CLOCK INPUTS (CLK1, CLK2)
Input Frequency 0 1.6 GHz Input Sensitivity 1502 mV p-p
Input Level 2
Input Common-Mode Voltage, V Input Common-Mode Range, V Input Sensitivity, Single-Ended 150 mV p-p CLK2 ac-coupled; CLK2B ac bypassed to RF ground. Input Resistance 4.0 4.8 5.6 kΩ Self-biased. Input Capacitance 2 pF
1
CLK1 and CLK2 are electrically identical; each can be used as either differential or single-ended input.
2
With a 50 Ω termination, this is −12.5 dBm.
3
With a 50 Ω termination, this is +10 dBm.
1
CM
CMR
1.5 1.6 1.7 V Self-biased; enables ac coupling.
1.3 1.8 V With 200 mV p-p signal applied; dc-coupled.
= 4.12 kΩ, unless otherwise noted. Minimum (Min) and Maximum (Max)
SET
Jitter performance can be improved with higher slew rates (greater swing).
3
V p-p
Larger swings turn on the protection diodes and can degrade jitter performance.

CLOCK OUTPUTS

Table 2.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL CLOCK OUTPUTS Termination = 50 Ω to VS − 2 V
OUT0, OUT1, OUT2; Differential Output level 3Dh (3Eh) (3Fh)<3:2> = 10b Output Frequency 1200 MHz See Figure 14 Output High Voltage (VOH) VS − 1.22 VS − 0.98 VS − 0.93 V Output Low Voltage (VOL) VS − 2.10 VS − 1.80 VS − 1.67 V Output Differential Voltage (VOD) 660 810 965 mV
LVDS CLOCK OUTPUTS Termination = 100 Ω differential; default
OUT3, OUT4; Differential
Output Frequency 800 MHz See Figure 15 Differential Output Voltage (VOD) 250 360 450 mV Delta V
OD
25 mV Output Offset Voltage (VOS) 1.125 1.23 1.375 V Delta V
OS
25 mV Short-Circuit Current (ISA, ISB) 14 24 mA Output shorted to GND
CMOS CLOCK OUTPUTS
OUT3, OUT4
Output Frequency 250 MHz With 5 pF load each output; see Figure 16 Output Voltage High (VOH) VS − 0.1 V @ 1 mA load Output Voltage Low (VOL) 0.1 V @ 1 mA load
Output level 40h (41h)<2:1> = 01b
3.5 mA termination current
Single-ended measurements; B outputs: inverted, termination open
Rev. A | Page 4 of 48
AD9512

TIMING CHARACTERISTICS

Table 3.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL
Termination = 50 Ω to V
Output level 3Dh (3Eh) (3Fh)<3:2> = 10b Output Rise Time, t Output Fall Time, t
RP
FP
PROPAGATION DELAY, t
, CLK-TO-LVPECL OUT
PECL
1
130 180 ps 20% to 80%, measured differentially 130 180 ps 80% to 20%, measured differentially
Divide = Bypass 335 490 635 ps Divide = 2 − 32 375 545 695 ps Variation with Temperature 0.5 ps/°C
OUTPUT SKEW, LVPECL OUTPUTS
OUT1 to OUT0 on Same Part, t OUT1 to OUT2 on Same Part, t OUT0 to OUT2 on Same Part, t All LVPECL OUT Across Multiple Parts, t Same LVPECL OUT Across Multiple Parts, t
LVDS
SKP
SKP
SKP
2
2
2
3
SKP_AB
3
SKP_AB
70 100 140 ps 15 45 80 ps 45 65 90 Ps 275 ps 130 ps
Termination = 100 Ω differential
Output level 40h (41h) <2:1> = 01b
3.5 mA termination current Output Rise Time, t Output Fall Time, t
RL
FL
PROPAGATION DELAY, t
, CLK-TO-LVDS OUT
LVDS
1
200 350 ps 20% to 80%, measured differentially 210 350 ps 80% to 20%, measured differentially Delay off on OUT4
OUT3 to OUT4
Divide = Bypass 0.99 1.33 1.59 ns Divide = 2 − 32 1.04 1.38 1.64 ns Variation with Temperature 0.9 ps/°C
OUTPUT SKEW, LVDS OUTPUTS Delay off on OUT4
OUT3 to OUT4 on Same Part, t All LVDS OUTs Across Multiple Parts, t Same LVDS OUT Across Multiple Parts, t
SKV
2
3
SKV_AB
3
SKV_AB
−85 +270 ps 450 ps 325 ps
CMOS B outputs are inverted; termination = open
Output Rise Time, t Output Fall Time, t
RC
FC
PROPAGATION DELAY, t
, CLK-TO-CMOS OUT
CMOS
1
681 865 ps 20% to 80%; C 646 992 ps 80% to 20%; C
LOAD
LOAD
Delay off on OUT4 Divide = Bypass 1.02 1.39 1.71 ns Divide = 2 − 32 1.07 1.44 1.76 ns Variation with Temperature 1 ps/°C
OUTPUT SKEW, CMOS OUTPUTS Delay off on OUT4
OUT3 to OUT4 on Same Part, t All CMOS OUT Across Multiple Parts, t Same CMOS OUT Across Multiple Parts, t
SKC
2
3
SKC_AB
3
SKC_AB
−140 +145 +300
650 ps
500 ps
LVPECL-TO-LVDS OUT Everything the same; different logic type
Output Skew, t
SKP_V
0.74 0.92 1.14 ns LVPECL to LVDS on same part
LVPECL-TO-CMOS OUT Everything the same; different logic type
Output Skew, t
SKP_C
0.88 1.14 1.43 ns LVPECL to CMOS on same part
LVDS-TO-CMOS OUT Everything the same; different logic type
Output Skew, t
SKV_C
158 353 506 ps LVDS to CMOS on same part
= 3 pF = 3 pF
− 2 V
S
Rev. A | Page 5 of 48
AD9512
Parameter Min Typ Max Unit Test Conditions/Comments
DELAY ADJUST OUT4; LVDS and CMOS
Shortest Delay Range
Zero Scale 0.05 0.36 0.68 ns 36h <5:1> 00000b Full Scale 0.72 1.12 1.51 ns 36h <5:1> 11111b Linearity, DNL 0.5 LSB Linearity, INL 0.8 LSB
Longest Delay Range
Zero Scale 0.20 0.57 0.95 ns 36h <5:1> 00000b Full Scale 9.0 10.2 11.6 ns 36h <5:1> 11111b Linearity, DNL 0.3 LSB Linearity, INL 0.6 LSB
Delay Variation with Temperature
Long Delay Range, 10 ns
Zero Scale 0.35 ps/°C Full Scale −0.14 ps/°C
Short Delay Range, 1 ns
Zero Scale 0.51 ps/°C Full Scale 0.67 ps/°C
1
The measurements are for CLK1. For CLK2, add approximately 25 ps.
2
This is the difference between any two similar delay paths within a single device operating at the same voltage and temperature.
3
This is the difference between any two similar delay paths across multiple devices operating at the same voltage and temperature.
4
Incremental delay; does not include propagation delay.
5
All delays between the zero scale and full scale can be estimated by linear interpolation.
4
4
5
5
35h <5:1> 11111b
35h <5:1> 00000b
Rev. A | Page 6 of 48
AD9512

CLOCK OUTPUT PHASE NOISE

Table 4.
Parameter Min Typ Max Unit Test Conditions/Comments
CLK1-TO-LVPECL ADDITIVE PHASE NOISE
CLK1 = 622.08 MHz, OUT = 622.08 MHz Input slew rate > 1 V/ns
Divide Ratio = 1
@ 10 Hz Offset −125 dBc/Hz @ 100 Hz Offset −132 dBc/Hz @ 1 kHz Offset −140 dBc/Hz @ 10 kHz Offset −148 dBc/Hz @ 100 kHz Offset −153 dBc/Hz >1 MHz Offset −154 dBc/Hz
CLK1 = 622.08 MHz, OUT = 155.52 MHz
Divide Ratio = 4
@ 10 Hz Offset −128 dBc/Hz @ 100 Hz Offset −140 dBc/Hz @ 1 kHz Offset −148 dBc/Hz @ 10 kHz Offset −155 dBc/Hz @ 100 kHz Offset −161 dBc/Hz >1 MHz Offset −161 dBc/Hz
CLK1 = 622.08 MHz, OUT = 38.88 MHz
Divide Ratio = 16
@ 10 Hz Offset −135 dBc/Hz @ 100 Hz Offset −145 dBc/Hz @ 1 kHz Offset −158 dBc/Hz @ 10 kHz Offset −165 dBc/Hz @ 100 kHz Offset −165 dBc/Hz >1 MHz Offset −166 dBc/Hz
CLK1 = 491.52 MHz, OUT = 61.44 MHz
Divide Ratio = 8
@ 10 Hz Offset −131 dBc/Hz @ 100 Hz Offset −142 dBc/Hz @ 1 kHz Offset −153 dBc/Hz @ 10 kHz Offset −160 dBc/Hz @ 100 kHz Offset −165 dBc/Hz >1 MHz Offset −165 dBc/Hz
CLK1 = 491.52 MHz, OUT = 245.76 MHz
Divide Ratio = 2
@ 10 Hz Offset −125 dBc/Hz @ 100 Hz Offset −132 dBc/Hz @ 1 kHz Offset −140 dBc/Hz @ 10 kHz Offset −151 dBc/Hz @ 100 kHz Offset −157 dBc/Hz >1 MHz Offset −158 dBc/Hz
CLK1 = 245.76 MHz, OUT = 61.44 MHz
Divide Ratio = 4
@ 10 Hz Offset −138 dBc/Hz @ 100 Hz Offset −144 dBc/Hz @ 1 kHz Offset −154 dBc/Hz @ 10 kHz Offset −163 dBc/Hz @ 100 kHz Offset −164 dBc/Hz >1 MHz Offset −165 dBc/Hz
Rev. A | Page 7 of 48
AD9512
Parameter Min Typ Max Unit Test Conditions/Comments
CLK1-TO-LVDS ADDITIVE PHASE NOISE
CLK1 = 622.08 MHz, OUT = 622.08 MHz
Divide Ratio = 1
@ 10 Hz Offset −100 dBc/Hz @ 100 Hz Offset −110 dBc/Hz @ 1 kHz Offset −118 dBc/Hz @ 10 kHz Offset −129 dBc/Hz @ 100 kHz Offset −135 dBc/Hz @ 1 MHz Offset −140 dBc/Hz >10 MHz Offset −148 dBc/Hz
CLK1 = 622.08 MHz, OUT = 155.52 MHz
Divide Ratio = 4
@ 10 Hz Offset −112 dBc/Hz @ 100 Hz Offset −122 dBc/Hz @ 1 kHz Offset −132 dBc/Hz @ 10 kHz Offset −142 dBc/Hz @ 100 kHz Offset −148 dBc/Hz @ 1 MHz Offset −152 dBc/Hz >10 MHz Offset −155 dBc/Hz
CLK1 = 491.52 MHz, OUT = 245.76 MHz
Divide Ratio = 2
@ 10 Hz Offset −108 dBc/Hz @ 100 Hz Offset −118 dBc/Hz @ 1 kHz Offset −128 dBc/Hz @ 10 kHz Offset −138 dBc/Hz @ 100 kHz Offset −145 dBc/Hz @ 1 MHz Offset −148 dBc/Hz >10 MHz Offset −154 dBc/Hz
CLK1 = 491.52 MHz, OUT = 122.88 MHz
Divide Ratio = 4
@ 10 Hz Offset −118 dBc/Hz @ 100 Hz Offset −129 dBc/Hz @ 1 kHz Offset −136 dBc/Hz @ 10 kHz Offset −147 dBc/Hz @ 100 kHz Offset −153 dBc/Hz @ 1 MHz Offset −156 dBc/Hz >10 MHz Offset −158 dBc/Hz
CLK1 = 245.76 MHz, OUT = 245.76 MHz
Divide Ratio = 1
@ 10 Hz Offset −108 dBc/Hz @ 100 Hz Offset −118 dBc/Hz @ 1 kHz Offset −128 dBc/Hz @ 10 kHz Offset −138 dBc/Hz @ 100 kHz Offset −145 dBc/Hz @ 1 MHz Offset −148 dBc/Hz >10 MHz Offset −155 dBc/Hz
Rev. A | Page 8 of 48
AD9512
Parameter Min Typ Max Unit Test Conditions/Comments
CLK1 = 245.76 MHz, OUT = 122.88 MHz
Divide Ratio = 2
@ 10 Hz Offset −118 dBc/Hz @ 100 Hz Offset −127 dBc/Hz @ 1 kHz Offset −137 dBc/Hz @ 10 kHz Offset −147 dBc/Hz @ 100 kHz Offset −154 dBc/Hz @ 1 MHz Offset −156 dBc/Hz >10 MHz Offset −158 dBc/Hz
CLK1-TO-CMOS ADDITIVE PHASE NOISE
CLK1 = 245.76 MHz, OUT = 245.76 MHz
Divide Ratio = 1
@ 10 Hz Offset −110 dBc/Hz @ 100 Hz Offset −121 dBc/Hz @ 1 kHz Offset −130 dBc/Hz @ 10 kHz Offset −140 dBc/Hz @ 100 kHz Offset −145 dBc/Hz @ 1 MHz Offset −149 dBc/Hz > 10 MHz Offset −156 dBc/Hz
CLK1 = 245.76 MHz, OUT = 61.44 MHz
Divide Ratio = 4
@ 10 Hz Offset −122 dBc/Hz @ 100 Hz Offset −132 dBc/Hz @ 1 kHz Offset −143 dBc/Hz @ 10 kHz Offset −152 dBc/Hz @ 100 kHz Offset −158 dBc/Hz @ 1 MHz Offset −160 dBc/Hz >10 MHz Offset −162 dBc/Hz
CLK1 = 78.6432 MHz, OUT = 78.6432 MHz
Divide Ratio = 1
@ 10 Hz Offset −122 dBc/Hz @ 100 Hz Offset −132 dBc/Hz @ 1 kHz Offset −140 dBc/Hz @ 10 kHz Offset −150 dBc/Hz @ 100 kHz Offset −155 dBc/Hz @ 1 MHz Offset −158 dBc/Hz >10 MHz Offset −160 dBc/Hz
CLK1 = 78.6432 MHz, OUT = 39.3216 MHz
Divide Ratio = 2
@ 10 Hz Offset −128 dBc/Hz @ 100 Hz Offset −136 dBc/Hz @ 1 kHz Offset −146 dBc/Hz @ 10 kHz Offset −155 dBc/Hz @ 100 kHz Offset −161 dBc/Hz >1 MHz Offset −162 dBc/Hz
Rev. A | Page 9 of 48
AD9512

CLOCK OUTPUT ADDITIVE TIME JITTER

Table 5.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL OUTPUT ADDITIVE TIME JITTER
CLK1 = 622.08 MHz 40 fs rms BW = 12 kHz − 20 MHz (OC-12)
Any LVPECL (OUT0 to OUT2) = 622.08 MHz Divide Ratio = 1
CLK1 = 622.08 MHz 55 fs rms BW = 12 kHz − 20 MHz (OC-3)
Any LVPECL (OUT0 to OUT2) = 155.52 MHz Divide Ratio = 4
CLK1 = 400 MHz 215 fs rms
Any LVPECL (OUT0 to OUT2) = 100 MHz Divide Ratio = 4
CLK1 = 400 MHz 215 fs rms
Any LVPECL (OUT0 to OUT2) = 100 MHz Divide Ratio = 4 Other LVPECL = 100 MHz Interferer(s) Both LVDS (OUT3, OUT4) = 100 MHz Interferer(s)
CLK1 = 400 MHz 222 fs rms
Any LVPECL (OUT0 to OUT2) = 100 MHz Divide Ratio = 4 Other LVPECL = 50 MHz Interferer(s) Both LVDS (OUT3, OUT4) = 50 MHz Interferer(s)
CLK1 = 400 MHz 225 fs rms
Any LVPECL (OUT0 to OUT2) = 100 MHz Divide Ratio = 4 Other LVPECL = 50 MHz Interferer(s) Both CMOS (OUT3, OUT4) = 50 MHz (B Outputs Off) Interferer(s)
CLK1 = 400 MHz 225 fs rms
Any LVPECL (OUT0 to OUT2) = 100 MHz Divide Ratio = 4 Other LVPECL = 50 MHz Interferer(s) Both CMOS (OUT3, OUT4) = 50 MHz (B Outputs On) Interferer(s)
LVDS OUTPUT ADDITIVE TIME JITTER
CLK1 = 400 MHz 264 fs rms
LVDS (OUT3) = 100 MHz Divide Ratio = 4
CLK1 = 400 MHz 319 fs rms
LVDS (OUT4) = 100 MHz Divide Ratio = 4
CLK1 = 400 MHz 395 fs rms
LVDS (OUT3) = 100 MHz Divide Ratio = 4 LVDS (OUT4) = 50 MHz Interferer(s) All LVPECL = 50 MHz Interferer(s)
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Calculated from SNR of ADC method; F
= 100 MHz with AIN = 170 MHz
C
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Rev. A | Page 10 of 48
AD9512
Parameter Min Typ Max Unit Test Conditions/Comments
CLK1 = 400 MHz 395 fs rms
LVDS (OUT4) = 100 MHz Divide Ratio = 4 LVDS (OUT3) = 50 MHz Interferer(s) All LVPECL = 50 MHz Interferer(s)
CLK1 = 400 MHz 367 fs rms
LVDS (OUT3) = 100 MHz Divide Ratio = 4 CMOS (OUT4) = 50 MHz (B Outputs Off) Interferer(s) All LVPECL = 50 MHz Interferer(s)
CLK1 = 400 MHz 367 fs rms
LVDS (OUT4) = 100 MHz Divide Ratio = 4 CMOS (OUT3) = 50 MHz (B Outputs Off) Interferer(s) All LVPECL = 50 MHz Interferer(s)
CLK1 = 400 MHz 548 fs rms
LVDS (OUT3) = 100 MHz Divide Ratio = 4 CMOS (OUT4) = 50 MHz (B Outputs On) Interferer(s) All LVPECL = 50 MHz Interferer(s)
CLK1 = 400 MHz 548 fs rms
LVDS (OUT4) = 100 MHz Divide Ratio = 4 CMOS (OUT3) = 50 MHz (B Outputs On) Interferer(s) All LVPECL = 50 MHz Interferer(s)
CMOS OUTPUT ADDITIVE TIME JITTER
CLK1 = 400 MHz 275 fs rms
Both CMOS (OUT3, OUT4) = 100 MHz (B Output On) Divide Ratio = 4
CLK1 = 400 MHz 400 fs rms
CMOS (OUT3) = 100 MHz (B Output On) Divide Ratio = 4 All LVPECL = 50 MHz Interferer(s) LVDS (OUT4) = 50 MHz Interferer(s)
CLK1 = 400 MHz 374 fs rms
CMOS (OUT3) = 100 MHz (B Output On) Divide Ratio = 4 All LVPECL = 50 MHz Interferer(s) CMOS (OUT4) = 50 MHz (B Output Off) Interferer(s)
CLK1 = 400 MHz 555 fs rms
CMOS (OUT3) = 100 MHz (B Output On) Divide Ratio = 4 All LVPECL = 50 MHz Interferer(s) CMOS (OUT4) = 50 MHz (B Output On) Interferer(s)
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Calculated from SNR of ADC method; F
= 100 MHz with AIN = 170 MHz
C
Calculated from SNR of ADC method; F
= 100 MHz with AIN = 170 MHz
C
Calculated from SNR of ADC method; F
= 100 MHz with AIN = 170 MHz
C
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Calculated from SNR of ADC method; F
= 100 MHz with AIN = 170 MHz
C
Calculated from SNR of ADC method; F
= 100 MHz with AIN = 170 MHz
C
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Rev. A | Page 11 of 48
AD9512
Parameter Min Typ Max Unit Test Conditions/Comments
DELAY BLOCK ADDITIVE TIME JITTER
100 MHz Output
Delay FS = 1 ns (1600 A, 1C) Fine Adj. 00000 0.61 ps Delay FS = 1 ns (1600 A, 1C) Fine Adj. 11111 0.73 ps Delay FS = 2 ns (800 A, 1C) Fine Adj. 00000 0.71 ps Delay FS = 2 ns (800 A, 1C) Fine Adj. 11111 1.2 ps Delay FS = 3 ns (800 A, 4C) Fine Adj. 00000 0.86 ps Delay FS = 3 ns (800 A, 4C) Fine Adj. 11111 1.8 ps Delay FS = 4 ns (400 A, 4C) Fine Adj. 00000 1.2 ps Delay FS = 4 ns (400 A, 4C) Fine Adj. 11111 2.1 ps Delay FS = 5 ns (200 A, 1C) Fine Adj. 00000 1.3 ps Delay FS = 5 ns (200 A, 1C) Fine Adj. 11111 2.7 ps Delay FS = 11 ns (200 A, 4C) Fine Adj. 00000 2.0 ps Delay FS = 11 ns (200 A, 4C) Fine Adj. 00100 2.8 ps
1
This value is incremental. That is, it is in addition to the jitter of the LVDS or CMOS output without the delay. To estimate the total jitter, the LVDS or CMOS output jitter
should be added to this value using the root sum of the squares (RSS) method.

SERIAL CONTROL PORT

Table 6.
Parameter Min Typ Max Unit Test Conditions/Comments
CSB, SCLK (INPUTS)
Input Logic 1 Voltage 2.0 V Input Logic 0 Voltage 0.8 V Input Logic 1 Current 110 µA Input Logic 0 Current 1 µA Input Capacitance 2 pF
SDIO (WHEN INPUT)
Input Logic 1 Voltage 2.0 V Input Logic 0 Voltage 0.8 V Input Logic 1 Current 10 nA Input Logic 0 Current 10 nA Input Capacitance 2 pF
SDIO, SDO (OUTPUTS)
Output Logic 1 Voltage 2.7 V Output Logic 0 Voltage 0.4 V
TIMING
Clock Rate (SCLK, 1/t Pulse Width High, t Pulse Width Low, t SDIO to SCLK Setup, t SCLK to SDIO Hold, t SCLK to Valid SDIO and SDO, t CSB to SCLK Setup and Hold, tS, t CSB Minimum Pulse Width High, t
) 25 MHz
SCLK
PWH
PWL
DS
DH
1
Incremental additive jitter
1
CSB and SCLK have 30 kΩ internal pull-down resistors
16 ns 16 ns 2 ns 1 ns
DV
H
PWH
6 ns 2 ns 3 ns
Rev. A | Page 12 of 48
AD9512

FUNCTION PIN

Table 7.
Parameter Min Typ Max Unit Test Conditions/Comments
INPUT CHARACTERISTICS
Logic 1 Voltage 2.0 V Logic 0 Voltage 0.8 V Logic 1 Current 110 µA Logic 0 Current 1 µA Capacitance 2 pF
RESET TIMING
Pulse Width Low 50 ns
SYNC TIMING
Pulse Width Low 1.5 High speed clock cycles

SYNC STATUS PIN

Table 8.
Parameter Min Typ Max Unit Test Conditions/Comments
OUTPUT CHARACTERISTICS
Output Voltage High (VOH) 2.7 V Output Voltage Low (VOL) 0.4 V
The FUNCTION pin has a 30 kΩ internal pull-down resistor. This pin should normally be held high. Do not leave NC.
High speed clock is CLK1 or CLK2, whichever is being used for distribution.
Rev. A | Page 13 of 48
AD9512

POWER

Table 9.
Parameter Min Typ Max Unit Test Conditions/Comments
POWER-UP DEFAULT MODE POWER DISSIPATION 550 600 mW
POWER DISSIPATION 800 mW
850 mW
Full Sleep Power-Down 35 60 mW
Power-Down (PDB) 60 80 mW
POWER DELTA
CLK1, CLK2 Power-Down 10 15 25 mW Divider, DIV 2 − 32 to Bypass 23 27 33 mW For each divider. LVPECL Output Power-Down (PD2, PD3) 50 65 75 mW
LVDS Output Power-Down 80 92 110 mW For each output. CMOS Output Power-Down (Static) 56 70 85 mW For each output. Static (no clock). CMOS Output Power-Down (Dynamic) 115 150 190 mW
CMOS Output Power-Down (Dynamic) 125 165 210 mW
Delay Block Bypass 20 24 60 mW
Power-up default state; does not include power dissipated in output load resistors. No clock.
All outputs on. Three LVPECL outputs @ 800 MHz, two CMOS out @ 62 MHz (5 pF load). Does not include power dissipated in external resistors.
All outputs on. Three LVPECL outputs @ 800 MHz, two CMOS out @ 125 MHz (5 pF load). Does not include power dissipated in external resistors.
Maximum sleep is entered by setting 0Ah<1:0> = 01b and 58h<4> = 1b. This powers off all band gap references. Does not include power dissipated in terminations.
Set FUNCTION pin for PDB operation by setting 58h<6:5> = 11b. Pull PDB low. Does not include power dissipated in terminations.
For each output. Does not include dissipation in termination (PD2 only).
For each CMOS output, single-ended. Clocking at 62 MHz with 5 pF load.
For each CMOS output, single-ended. Clocking at 125 MHz with 5 pF load.
Vs. delay block operation at 1 ns fs with maximum delay; output clocking at 25 MHz.
Rev. A | Page 14 of 48
AD9512
C

TIMING DIAGRAMS

LK1
t
CLK1
DIFFERENTIAL
t
PECL
t
LVDS
t
CMOS
Figure 2. CLK1/CLK1B to Clock Output Timing, DIV = 1 Mode
DIFFERENTIAL
80%
LVPECL
20%
t
RP
Figure 3. LVPECL Timing, Differential
80%
LVDS
20%
t
05287-002
RL
t
FL
05287-065
Figure 4. LVDS Timing, Differential
SINGLE-ENDED
80%
CMOS
3pF LOAD
20%
t
FP
05287-064
t
RC
t
FC
05287-066
Figure 5. CMOS Timing, Single-Ended, 3 pF Load
Rev. A | Page 15 of 48
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