1.8 V supply operation
Low power: 110 mW per channel at 125 MSPS with scalable
power options
SNR = 74 dB (to Nyquist)
SFDR = 90 dBc (to Nyquist)
DNL = ±0.75 LSB (typical); INL = ±2.0 LSB (typical)
Serial LVDS (ANSI-644, default) and low power, reduced
signal option (similar to IEEE 1596.3)
650 MHz full power analog bandwidth
2 V p-p input voltage range
Serial port control
Full chip and individual channel power-down modes
Flexible bit orientation
Built-in and custom digital test pattern generation
Multichip sync and clock divider
Programmable output clock and data alignment
Programmable output resolution
Standby mode
APPLICATIONS
Medical ultrasound
High speed imaging
Quadrature radio receivers
Diversity radio receivers
Test equipment
GENERAL DESCRIPTION
The AD9253 is a quad, 14-bit, 80 MSPS/105 MSPS/125 MSPS
analog-to-digital converter (ADC) with an on-chip sampleand-hold circuit designed for low cost, low power, small size,
and ease of use. The product operates at a conversion rate of
up to 125 MSPS and is optimized for outstanding dynamic
performance and low power in applications where a small
package size is critical.
The ADC requires a single 1.8 V power supply and LVPECL-/
CMOS-/LVDS-compatible sample rate clock for full performance
operation. No external reference or driver components are
required for many applications.
The ADC automatically multiplies the sample rate clock for the
appropriate LVDS serial data rate. A data clock output (DCO) for
capturing data on the output and a frame clock output (FCO)
for signaling a new output byte are provided. Individual-channel
power-down is supported and typically consumes less than 2 mW
when all channels are disabled. The ADC contains several features
designed to maximize flexibility and minimize system cost, such
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
AD9253
FUNCTIONAL BLOCK DIAGRAM
VDDPDWNDRVDD
SDIO/OLM
ADC
ADC
ADC
ADC
14
DIGITAL
SERIALIZER
14
DIGITAL
SERIALIZER
1V
AD9253
14
DIGITAL
SERIALIZER
14
DIGITAL
SERIALIZER
CLOCK
MANAGEMENT
CLK+
SYNC
SCLK/DTP
VIN+A
VIN–A
VIN+B
VIN–B
RBIAS
VREF
SENSE
AGND
VIN+C
VIN–C
VIN+D
VIN–D
VCM
PIPELINE
PIPELINE
REF
SELECT
PIPELINE
PIPELINE
SERIAL PORT
INTERFACE
CSB
Figure 1.
as programmable output clock and data alignment and digital
test pattern generation. The available digital test patterns
include built-in deterministic and pseudorandom patterns, along
with custom user-defined test patterns entered via the serial port
interface (SPI).
The AD9253 is available in a RoHS-compliant, 48-lead LFCSP.
It is specified over the industrial temperature range of −40°C to
+85°C. This product is protected by a U.S. patent.
PRODUCT HIGHLIGHTS
1. Small Footprint. Four ADCs are contained in a small, space-
saving package.
2. Low power of 110 mW/channel at 125 MSPS with scalable
power options.
3. Pin compatible to the AD9633 12-bit quad ADC.
4. Ease of Use. A data clock output (DCO) operates at
frequencies of up to 500 MHz and supports double data
rate (DDR) operation.
5. User Flexibility. The SPI control offers a wide range of
flexible features to meet specific system requirements.
Output Voltage (1 V Mode) Full 0.98 1.0 1.02 0.98 1.0 1.02 0.98 1.0 1.02 V
Load Regulation at 1.0 mA (V
= 1 V) Full 2 2 2 mV
REF
Input Resistance Full 7.5 7.5 7.5 kΩ
INPUT-REFERRED NOISE
V
= 1.0 V 25°C 0.94 0.94 0.94 LSB rms
REF
ANALOG INPUTS
Differential Input Voltage (V
= 1 V) Full 2 2 2 V p-p
REF
Common-Mode Voltage Full 0.9 0.9 0.9 V
Differential Input Resistance 5.2 5.2 5.2 kΩ
Differential Input Capacitance Full 3.5 3.5 3.5 pF
POWER SUPPLY
AVDD Full 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 V
DRVDD Full 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 V
2
I
Full 131 144 158 172 183 200 mA
AVDD
I
(ANSI-644 Mode)2 Full 63 81 67 95 71 100 mA
DRVDD
I
(Reduced Range Mode)2 25°C 42
DRVDD
TOTAL POWER CONSUMPTION
DC Input Full 326
Sine Wave Input (Four Channels Including
Full 349 405 405 481 457 540 mW
Output Drivers ANSI-644 Mode)
Sine Wave Input (Four Channels Including
25°C 311 371 425 mW
Output Drivers Reduced Range Mode)
Power-Down Full 2 2 2 mW
Standby3 Full 178 209 236 mW
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and for details on how these tests were completed.
2
Measured with a low input frequency, full-scale sine wave on all four channels.
3
Can be controlled via the SPI.
Min Typ Max Min Typ Max Min Typ Max Unit
+1.6 −0.8
+4.0 −4.0
±0.75 ±0.75 LSB
±2.0 ±2.0 LSB
48
375 423 mW
+1.5 −0.8
4.0 −4.0
53
+1.5 LSB
+4.0 LSB
mA
Rev. 0 | Page 3 of 40
AD9253 Data Sheet
AC SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −1.0 dBFS, unless otherwise noted.
Table 2.
AD9253-80 AD9253-105 AD9253-125
Parameter1 Temp
Min Typ Max Min Typ Max Min Typ Max
SIGNAL-TO-NOISE RATIO (SNR)
fIN = 9.7 MHz 25°C 75.4 75.1 75.3 dBFS
fIN = 30.5 MHz 25°C 74.9 75.0 75.2 dBFS
fIN = 70 MHz Full 72.2 74.7 72.2 74.4 73 74.2 dBFS
fIN = 140 MHz 25°C 72.3 73.1 72.2 dBFS
fIN = 200 MHz 25°C 70.7 71.2 70.7 dBFS
SIGNAL-TO-NOISE-AND-DISTORTION RATIO (SINAD)
fIN = 9.7 MHz 25°C 75.3 75.0 75.2 dBFS
fIN = 30.5 MHz 25°C 74.8 74.9 75.1 dBFS
fIN = 70 MHz Full 70.8 74.6 69.8 74.2 71.6 74.1 dBFS
fIN = 140 MHz 25°C 72.1 72.8 71.9 dBFS
fIN = 200 MHz 25°C 70.5 70.8 70.4 dBFS
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 9.7 MHz 25°C 12.2 12.1 12.2 Bits
fIN = 30.5 MHz 25°C 12.1 12.1 12.1 Bits
fIN = 70 MHz Full
11.9
12.0
12.0 Bits
fIN = 140 MHz 25°C 11.6 11.8 11.6 Bits
fIN = 200 MHz 25°C 11.5 11.5 11.4 Bits
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
fIN = 9.7 MHz 25°C 98 98 98 dBc
fIN = 30.5 MHz 25°C 93 92 92 dBc
fIN = 70 MHz Full 77 94 75 89 77 90 dBc
fIN = 140 MHz 25°C 85 85 85 dBc
fIN = 200 MHz 25°C 84 82 83 dBc
WORST HARMONIC (SECOND OR THIRD)
fIN = 9.7 MHz 25°C −98 −98 −98 dBc
fIN = 30.5 MHz 25°C −93 −92 −92 dBc
fIN = 70 MHz Full −94 −77 −89 −75 −90 −77 dBc
fIN = 140 MHz 25°C −85 −85 −85 dBc
fIN = 200 MHz 25°C −84 −82 −83 dBc
WORST OTHER HARMONIC (EXCLUDING SECOND OR THIRD)
fIN = 9.7 MHz 25°C −100 −99 −101 dBFS
fIN = 30.5 MHz 25°C −99
−99 −100 dBFS
fIN = 70 MHz Full −98 −77 −95 −77 −95 −84 dBFS
fIN = 140 MHz 25°C −98 −98 −96 dBFS
fIN = 200 MHz 25°C −95 −92 −92 dBFS
TWO-TONE INTERMODULATION DISTORTION (IMD)—AIN1 AND
AIN2 = −7.0 dBFS
f
= 70.5 MHz, f
IN1
= 72.5 MHz 25°C 90 88 86 dBc
IN2
CROSSTALK2 Full −95 −95 −95 dB
CROSSTALK (OVERRANGE CONDITION)3 25°C −89 −89 −89 dB
POWER SUPPLY REJECTION RATIO (PSRR)
1, 4
AVDD 25°C 48 48 48 dB
DRVDD 25°C 75 75 75 dB
ANALOG INPUT BANDWIDTH, FULL POWER 25°C 650 650 650 MHz
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and for details on how these tests were completed.
2
Crosstalk is measured at 70 MHz with −1.0 dBFS analog input on one channel and no input on the adjacent channel.
3
Overrange condition is specified with 3 dB of the full-scale input range.
4
PSRR is measured by injecting a sinusoidal signal at 10 MHz to the power supply pin and measuring the output spur on the FFT. PSRR is calculated as the ratio of the
amplitudes of the spur voltage over the pin voltage, expressed in decibels.
Rev. 0 | Page 4 of 40
Unit
Data Sheet AD9253
DIGITAL SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −1.0 dBFS, unless otherwise noted.
Table 3.
Parameter1 Temp Min Typ Max Unit
CLOCK INPUTS (CLK+, CLK−)
Logic Compliance CMOS/LVDS/LVPECL
Differential Input Voltage2 Full 0.2 3.6 V p-p
Input Voltage Range Full AGND − 0.2 AVDD + 0.2 V
Input Common-Mode Voltage Full 0.9 V
Input Resistance (Differential) 25°C 15 kΩ
Input Capacitance 25°C 4 pF
LOGIC INPUTS (PDWN, SYNC, SCLK)
Logic 1 Voltage Full 1.2 AVDD + 0.2 V
Logic 0 Voltage Full 0 0.8 V
Input Resistance 25°C 30 kΩ
Input Capacitance 25°C 2 pF
LOGIC INPUT (CSB)
Logic 1 Voltage Full 1.2 AVDD + 0.2 V
Logic 0 Voltage Full 0 0.8 V
Input Resistance 25°C 26 kΩ
Input Capacitance 25°C 2 pF
LOGIC INPUT (SDIO)
Logic 1 Voltage Full 1.2 AVDD + 0.2 V
Logic 0 Voltage Full 0 0.8 V
Input Resistance 25°C 26 kΩ
Input Capacitance 25°C 5 pF
LOGIC OUTPUT (SDIO)3
Logic 1 Voltage (IOH = 800 μA) Full 1.79 V
Logic 0 Voltage (IOL = 50 μA) Full 0.05 V
DIGITAL OUTPUTS (D0±x, D1±x), ANSI-644
Logic Compliance LVDS
Differential Output Voltage (VOD) Full 290 345 400 mV
Output Offset Voltage (VOS) Full 1.15 1.25 1.35 V
Output Coding (Default) Twos complement
DIGITAL OUTPUTS (D0±x, D1±x), LOW POWER,
REDUCED SIGNAL OPTION
Logic Compliance LVDS
Differential Output Voltage (VOD) Full 160 200 230 mV
Output Offset Voltage (VOS) Full 1.15 1.25 1.35 V
Output Coding (Default) Twos complement
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and for details on how these tests were completed.
2
This is specified for LVDS and LVPECL only.
3
This is specified for 13 SDIO/OLM pins sharing the same connection.
Rev. 0 | Page 5 of 40
AD9253 Data Sheet
SWITCHING SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −1.0 dBFS, unless otherwise noted.
Table 4.
Parameter
1, 2
Temp Min Typ Max Unit
CLOCK3
Input Clock Rate Full 10 1000 MHz
Conversion Rate Full 10 80/105/125 MSPS
Clock Pulse Width High (tEH) Full 6.25/4.76/4.00 ns
Clock Pulse Width Low (tEL) Full 6.25/4.76/4.00 ns
OUTPUT PARAMETERS3
Propagation Delay (tPD) Full 2.3 ns
Rise Time (tR) (20% to 80%) Full 300 ps
Fall Time (tF) (20% to 80%) Full 300 ps
FCO Propagation Delay (t
DCO Propagation Delay (t
DCO to Data Delay (t
DATA
DCO to FCO Delay (t
) Full 1.5 2.3 3.1 ns
FCO
)4 Full t
CPD
)4 Full (t
)4 Full (t
FRAME
/16) − 300 (t
SAMPLE
/16) − 300 (t
SAMPLE
+ (t
FCO
SAMPLE
/16) (t
SAMPLE
/16) (t
SAMPLE
/16) ns
/16) + 300 ps
SAMPLE
/16) + 300 ps
SAMPLE
Lane Delay (tLD) 90 ps
Data to Data Skew (t
DATA-MAX
− t
) Full ±50 ±200 ps
DATA-MIN
Wake-Up Time (Standby) 25°C 250 ns
Wake-Up Time (Power-Down)5 25°C 375 μs
Pipeline Latency Full 16
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and for details on how these tests were completed.
2
Measured on standard FR-4 material.
3
Can be adjusted via the SPI. The conversion rate is the clock rate after the divider.
4
t
/16 is based on the number of bits in two LVDS data lanes. t
SAMPLE
5
Wake-up time is defined as the time required to return to normal operation from power-down mode.
SAMPLE
= 1/fS.
Clock cycles
TIMING SPECIFICATIONS
Table 5.
Parameter Description Limit
SYNC TIMING REQUIREMENTS
t
SYNC to rising edge of CLK+ setup time 0.24 ns typ
SSYNC
t
SYNC to rising edge of CLK+ hold time 0.40 ns typ
HSYNC
SPI TIMING REQUIREMENTS See Figure 74
tDS Setup time between the data and the rising edge of SCLK 2 ns min
tDH Hold time between the data and the rising edge of SCLK 2 ns min
t
Period of the SCLK 40 ns min
CLK
tS Setup time between CSB and SCLK 2 ns min
tH Hold time between CSB and SCLK 2 ns min
t
SCLK pulse width high 10 ns min
HIGH
t
SCLK pulse width low 10 ns min
LOW
t
EN_SDIO
Time required for the SDIO pin to switch from an input to an output relative to the
10 ns min
SCLK falling edge (not shown in Figure 74)
t
DIS_SDIO
Time required for the SDIO pin to switch from an output to an input relative to the
10 ns min
SCLK rising edge (not shown in Figure 74)
Rev. 0 | Page 6 of 40
Unit
Data Sheet AD9253
Timing Diagrams
Refer to the Memory Map Register Descriptions section and Ta b le 2 1 for SPI register settings.
AVDD to AGND −0.3 V to +2.0 V
DRVDD to AGND −0.3 V to +2.0 V
Digital Outputs
(D0±x, D1±x, DCO+,
DCO−, FCO+, FCO−) to AGND
CLK+, CLK− to AGND −0.3 V to +2.0 V
VIN+x, VIN−x to AGND −0.3 V to +2.0 V
SCLK/DTP, SDIO/OLM, CSB to AGND −0.3 V to +2.0 V
SYNC, PDWN to AGND −0.3 V to +2.0 V
RBIAS to AGND −0.3 V to +2.0 V
VREF, SENSE to AGND −0.3 V to +2.0 V
Environmental
Operating Temperature
Range (Ambient)
Maximum Junction
Temperature
Lead Temperature
(Soldering, 10 sec)
Storage Temperature
Range (Ambient)
−0.3 V to +2.0 V
−40°C to +85°C
150°C
300°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 7. Thermal Resistance
Air Flow
Veloc ity
Package Type
48-Lead LFCSP 0.0 23.7 7.8 7.1 °C/W
7 mm × 7 mm 1.0 20.0 N/A N/A °C/W
(CP-48-13) 2.5 18.7 N/A N/A °C/W
1
θJA for a 4-layer PCB with solid ground plane (simulated). Exposed pad
soldered to PCB.
(m/sec)
1
θ
θ
JA
JB
θJC Unit
ESD CAUTION
Rev. 0 | Page 11 of 40
AD9253 Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
N+C
SYNC
AVDD
AVDD
VIN–C
VI
47
48
VREF
SENSE
VCM
RBIAS
VIN+B
AVDD
VIN–B
41
37
39
42
43
40
44
45
46
38
1
VIN+D
2
VIN–D
3
AVD D
4
AVD D
5
CLK–
6
CLK+
7
AVD D
8
DRVDD
9
D1–D
10
D1+D
11
D0–D
12
D0+D
NOTES
1. THE EXPOSED THERMAL PAD ON THE BOTTOM OF THE
PACKAGE PROVI DES THE ANALO G GROUND F OR THE PART .
THIS EXPO SED PAD MUST BE CONNECTED TO GRO UND FOR
PROPER OPERATION.
(Not to Scale)
13
14
15
D1–C
D0–C
D1+C
AD9253
TOP VIEW
19
18
17
16
–
D0+C
FCO
DCO–
DCO+
20
21
D1–B
FCO+
Figure 9. 48-Lead LFCSP Pin Configuration, Top View
Table 8. Pin Function Descriptions
Pin No. Mnemonic Description
0
1
2
AGND,
Exposed Pad
Analog Ground, Exposed Pad. The exposed thermal pad on the bottom of the package provides the
analog ground for the part. This exposed pad must be connected to ground for proper operation.
VIN+D ADC D Analog Input True.
VIN−D ADC D Analog Input Complement.
3, 4, 7, 34, 39, 45, 46 AVDD 1.8 V Analog Supply Pins.
5, 6
8, 29
9, 10
CLK−, CLK+ Differential Encode Clock. PECL, LVDS, or 1.8 V CMOS inputs.
DRVDD Digital Output Driver Supply.
D1−D, D1+D Channel D Digital Outputs.
11, 12 D0−D, D0+D Channel D Digital Outputs.
13, 14
15, 16
17, 18
19, 20
21, 22
23, 24
D1−C, D1+C Channel C Digital Outputs.
D0−C, D0+C Channel C Digital Outputs.
DCO−, DCO+ Data Clock Outputs.
FCO−, FCO+ Frame Clock Outputs.
D1−B, D1+B Channel B Digital Outputs.
D0−B, D0+B Channel B Digital Outputs.
25, 26 D1−A, D1+A Channel A Digital Outputs.
27, 28 D0−A, D0+A Channel A Digital Outputs.
30
31
32
33
SCLK/DTP SPI Clock Input/Digital Test Pattern.
SDIO/OLM SPI Data Input and Output Bidirectional SPI Data/Output Lane Mode.
CSB SPI Chip Select Bar. Active low enable; 30 kΩ internal pull-up.
PDWN
Digital Input, 30 kΩ Internal Pull-Down.
PDWN high = power-down device.
PDWN low = run device, normal operation.
35 VIN−A ADC A Analog Input Complement.
36
37
VIN+A ADC A Analog Input True.
VIN+B ADC B Analog Input True.
38 VIN−B ADC B Analog Input Complement.
40
41
42
43
RBIAS Sets Analog Current Bias. Connect to 10 kΩ (1% tolerance) resistor to ground.
SENSE Reference Mode Selection.
VREF Voltage Reference Input and Output.
VCM Analog Input Common-Mode Voltage.
Rev. 0 | Page 12 of 40
36
VIN+A
VIN–A
35
AVD D
34
PDWN
33
32
CSB
SDIO/OLM
31
SCLK/DTP
30
DRVDD
29
28
D0+A
D0–A
27
D1+A
26
25
D1–A
22
23
24
D0–B
D1+B
D0+B
10065-007
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