ANALOG DEVICES AD9253 Service Manual

Quad, 14-Bit, 80 MSPS/105 MSPS/125 MSPS
A
Serial LVDS 1.8 V Analog-to-Digital Converter
Data Sheet

FEATURES

1.8 V supply operation Low power: 110 mW per channel at 125 MSPS with scalable
power options SNR = 74 dB (to Nyquist) SFDR = 90 dBc (to Nyquist) DNL = ±0.75 LSB (typical); INL = ±2.0 LSB (typical) Serial LVDS (ANSI-644, default) and low power, reduced
signal option (similar to IEEE 1596.3) 650 MHz full power analog bandwidth 2 V p-p input voltage range Serial port control
Full chip and individual channel power-down modes
Flexible bit orientation
Built-in and custom digital test pattern generation
Multichip sync and clock divider
Programmable output clock and data alignment
Programmable output resolution
Standby mode

APPLICATIONS

Medical ultrasound High speed imaging Quadrature radio receivers Diversity radio receivers Test equipment

GENERAL DESCRIPTION

The AD9253 is a quad, 14-bit, 80 MSPS/105 MSPS/125 MSPS analog-to-digital converter (ADC) with an on-chip sample­and-hold circuit designed for low cost, low power, small size, and ease of use. The product operates at a conversion rate of up to 125 MSPS and is optimized for outstanding dynamic performance and low power in applications where a small package size is critical.
The ADC requires a single 1.8 V power supply and LVPECL-/ CMOS-/LVDS-compatible sample rate clock for full performance operation. No external reference or driver components are required for many applications.
The ADC automatically multiplies the sample rate clock for the appropriate LVDS serial data rate. A data clock output (DCO) for capturing data on the output and a frame clock output (FCO) for signaling a new output byte are provided. Individual-channel power-down is supported and typically consumes less than 2 mW when all channels are disabled. The ADC contains several features designed to maximize flexibility and minimize system cost, such
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
AD9253

FUNCTIONAL BLOCK DIAGRAM

VDD PDWN DRVDD
SDIO/OLM
ADC
ADC
ADC
ADC
14
DIGITAL
SERIALIZER
14
DIGITAL
SERIALIZER
1V
AD9253
14
DIGITAL
SERIALIZER
14
DIGITAL
SERIALIZER
CLOCK
MANAGEMENT
CLK+
SYNC
SCLK/DTP
VIN+A
VIN–A
VIN+B
VIN–B
RBIAS
VREF
SENSE
AGND
VIN+C
VIN–C
VIN+D
VIN–D
VCM
PIPELINE
PIPELINE
REF
SELECT
PIPELINE
PIPELINE
SERIAL PORT
INTERFACE
CSB
Figure 1.
as programmable output clock and data alignment and digital test pattern generation. The available digital test patterns include built-in deterministic and pseudorandom patterns, along with custom user-defined test patterns entered via the serial port interface (SPI).
The AD9253 is available in a RoHS-compliant, 48-lead LFCSP. It is specified over the industrial temperature range of −40°C to +85°C. This product is protected by a U.S. patent.

PRODUCT HIGHLIGHTS

1. Small Footprint. Four ADCs are contained in a small, space-
saving package.
2. Low power of 110 mW/channel at 125 MSPS with scalable
power options.
3. Pin compatible to the AD9633 12-bit quad ADC.
4. Ease of Use. A data clock output (DCO) operates at
frequencies of up to 500 MHz and supports double data rate (DDR) operation.
5. User Flexibility. The SPI control offers a wide range of
flexible features to meet specific system requirements.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2011 Analog Devices, Inc. All rights reserved.
SERIAL
LVD S
SERIAL
LVD S
SERIAL
LVD S
SERIAL
LVD S
SERIAL
LVD S
SERIAL
LVD S
SERIAL
LVD S
SERIAL
LVD S
CLK–
D0+A D0–A
D1+A D1–A
D0+B D0–B
D1+B D1–B
FCO+ FCO– D0+C D0–C D1+C D1–C
D0+D D0–D
D1+D D1–D DCO+ DCO–
10065-001
AD9253 Data Sheet

TABLE OF CONTENTS

Features.............................................................................................. 1
Applications....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
DC Specifications ......................................................................... 3
AC Specifications.......................................................................... 4
Digital Specifications ................................................................... 5
Switching Specifications.............................................................. 6
Timing Specifications .................................................................. 6
Absolute Maximum Ratings.......................................................... 11
Thermal Resistance .................................................................... 11
ESD Caution................................................................................ 11
Pin Configuration and Function Descriptions........................... 12
Typical Performance Characteristics ........................................... 14
AD9253-80 ..................................................................................14
AD9253-105 ................................................................................ 16
AD9253-125 ................................................................................ 18
Equivalent Circuits......................................................................... 21
Theory of Operation ...................................................................... 22
Analog Input Considerations.................................................... 22
Voltage Reference....................................................................... 23
Clock Input Considerations...................................................... 24
Power Dissipation and Power-Down Mode ........................... 26
Digital Outputs and Timing ..................................................... 27
Output Test Modes..................................................................... 30
Serial Port Interface (SPI).............................................................. 31
Configuration Using the SPI..................................................... 31
Hardware Interface..................................................................... 32
Configuration Without the SPI................................................ 32
SPI Accessible Features.............................................................. 32
Memory Map .................................................................................. 33
Reading the Memory Map Register Table............................... 33
Memory Map Register Table..................................................... 34
Memory Map Register Descriptions........................................ 37
Applications Information.............................................................. 39
Design Guidelines ...................................................................... 39
Power and Ground Recommendations................................... 39
Exposed Pad Thermal Heat Slug Recommendations............ 39
VCM............................................................................................. 39
Reference Decoupling................................................................ 39
SPI Port........................................................................................ 39
Crosstalk Performance .............................................................. 39
Outline Dimensions....................................................................... 40
Ordering Guide .......................................................................... 40

REVISION HISTORY

10/11—Revision 0: Initial Version
Rev. 0 | Page 2 of 40
Data Sheet AD9253

SPECIFICATIONS

DC SPECIFICATIONS

AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −1.0 dBFS, unless otherwise noted.
Table 1.
AD9253-80 AD9253-105 AD9253-125
Parameter1 Temp
RESOLUTION 14 14 14 Bits ACCURACY
No Missing Codes Full Guaranteed Guaranteed Guaranteed
Offset Error Full −0.7 −0.3 +0.1 −0.7 −0.3 +0.1 −0.7 −0.3 +0.1 % FSR
Offset Matching Full −0.6 +0.2 +0.6 −0.6 +0.2 +0.6 −0.6 +0.2 +0.6 % FSR
Gain Error Full −10 −5 0 −10 −5 0 −10 −5 0 % FSR
Gain Matching Full 1 1.6 1 1.6 1.1 1.6 % FSR
Differential Nonlinearity (DNL) Full −1
25°C ±0.8
Integral Nonlinearity (INL) Full −4.0
25°C ±1.5
TEMPERATURE DRIFT
Offset Error Full ±2 ±2 ±2 ppm/°C
INTERNAL VOLTAGE REFERENCE
Output Voltage (1 V Mode) Full 0.98 1.0 1.02 0.98 1.0 1.02 0.98 1.0 1.02 V
Load Regulation at 1.0 mA (V
= 1 V) Full 2 2 2 mV
REF
Input Resistance Full 7.5 7.5 7.5 kΩ
INPUT-REFERRED NOISE
V
= 1.0 V 25°C 0.94 0.94 0.94 LSB rms
REF
ANALOG INPUTS
Differential Input Voltage (V
= 1 V) Full 2 2 2 V p-p
REF
Common-Mode Voltage Full 0.9 0.9 0.9 V
Differential Input Resistance 5.2 5.2 5.2 kΩ
Differential Input Capacitance Full 3.5 3.5 3.5 pF
POWER SUPPLY
AVDD Full 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 V
DRVDD Full 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 V
2
I
Full 131 144 158 172 183 200 mA
AVDD
I
(ANSI-644 Mode)2 Full 63 81 67 95 71 100 mA
DRVDD
I
(Reduced Range Mode)2 25°C 42
DRVDD
TOTAL POWER CONSUMPTION
DC Input Full 326
Sine Wave Input (Four Channels Including
Full 349 405 405 481 457 540 mW
Output Drivers ANSI-644 Mode)
Sine Wave Input (Four Channels Including
25°C 311 371 425 mW
Output Drivers Reduced Range Mode) Power-Down Full 2 2 2 mW Standby3 Full 178 209 236 mW
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and for details on how these tests were completed.
2
Measured with a low input frequency, full-scale sine wave on all four channels.
3
Can be controlled via the SPI.
Min Typ Max Min Typ Max Min Typ Max Unit
+1.6 −0.8
+4.0 −4.0
±0.75 ±0.75 LSB
±2.0 ±2.0 LSB
48
375 423 mW
+1.5 −0.8
4.0 −4.0
53
+1.5 LSB
+4.0 LSB
mA
Rev. 0 | Page 3 of 40
AD9253 Data Sheet

AC SPECIFICATIONS

AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −1.0 dBFS, unless otherwise noted.
Table 2.
AD9253-80 AD9253-105 AD9253-125
Parameter1 Temp
Min Typ Max Min Typ Max Min Typ Max
SIGNAL-TO-NOISE RATIO (SNR)
fIN = 9.7 MHz 25°C 75.4 75.1 75.3 dBFS fIN = 30.5 MHz 25°C 74.9 75.0 75.2 dBFS fIN = 70 MHz Full 72.2 74.7 72.2 74.4 73 74.2 dBFS fIN = 140 MHz 25°C 72.3 73.1 72.2 dBFS fIN = 200 MHz 25°C 70.7 71.2 70.7 dBFS
SIGNAL-TO-NOISE-AND-DISTORTION RATIO (SINAD)
fIN = 9.7 MHz 25°C 75.3 75.0 75.2 dBFS fIN = 30.5 MHz 25°C 74.8 74.9 75.1 dBFS fIN = 70 MHz Full 70.8 74.6 69.8 74.2 71.6 74.1 dBFS fIN = 140 MHz 25°C 72.1 72.8 71.9 dBFS fIN = 200 MHz 25°C 70.5 70.8 70.4 dBFS
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 9.7 MHz 25°C 12.2 12.1 12.2 Bits fIN = 30.5 MHz 25°C 12.1 12.1 12.1 Bits fIN = 70 MHz Full
11.9
12.0
12.0 Bits fIN = 140 MHz 25°C 11.6 11.8 11.6 Bits fIN = 200 MHz 25°C 11.5 11.5 11.4 Bits
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
fIN = 9.7 MHz 25°C 98 98 98 dBc fIN = 30.5 MHz 25°C 93 92 92 dBc fIN = 70 MHz Full 77 94 75 89 77 90 dBc fIN = 140 MHz 25°C 85 85 85 dBc fIN = 200 MHz 25°C 84 82 83 dBc
WORST HARMONIC (SECOND OR THIRD)
fIN = 9.7 MHz 25°C −98 −98 −98 dBc fIN = 30.5 MHz 25°C −93 −92 −92 dBc fIN = 70 MHz Full −94 −77 −89 −75 −90 −77 dBc fIN = 140 MHz 25°C −85 −85 −85 dBc fIN = 200 MHz 25°C −84 −82 −83 dBc
WORST OTHER HARMONIC (EXCLUDING SECOND OR THIRD)
fIN = 9.7 MHz 25°C −100 −99 −101 dBFS fIN = 30.5 MHz 25°C −99
−99 −100 dBFS fIN = 70 MHz Full −98 −77 −95 −77 −95 −84 dBFS fIN = 140 MHz 25°C −98 −98 −96 dBFS fIN = 200 MHz 25°C −95 −92 −92 dBFS
TWO-TONE INTERMODULATION DISTORTION (IMD)—AIN1 AND
AIN2 = −7.0 dBFS f
= 70.5 MHz, f
IN1
= 72.5 MHz 25°C 90 88 86 dBc
IN2
CROSSTALK2 Full −95 −95 −95 dB CROSSTALK (OVERRANGE CONDITION)3 25°C −89 −89 −89 dB POWER SUPPLY REJECTION RATIO (PSRR)
1, 4
AVDD 25°C 48 48 48 dB DRVDD 25°C 75 75 75 dB
ANALOG INPUT BANDWIDTH, FULL POWER 25°C 650 650 650 MHz
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and for details on how these tests were completed.
2
Crosstalk is measured at 70 MHz with −1.0 dBFS analog input on one channel and no input on the adjacent channel.
3
Overrange condition is specified with 3 dB of the full-scale input range.
4
PSRR is measured by injecting a sinusoidal signal at 10 MHz to the power supply pin and measuring the output spur on the FFT. PSRR is calculated as the ratio of the
amplitudes of the spur voltage over the pin voltage, expressed in decibels.
Rev. 0 | Page 4 of 40
Unit
Data Sheet AD9253

DIGITAL SPECIFICATIONS

AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −1.0 dBFS, unless otherwise noted.
Table 3.
Parameter1 Temp Min Typ Max Unit
CLOCK INPUTS (CLK+, CLK−)
Logic Compliance CMOS/LVDS/LVPECL Differential Input Voltage2 Full 0.2 3.6 V p-p Input Voltage Range Full AGND − 0.2 AVDD + 0.2 V Input Common-Mode Voltage Full 0.9 V Input Resistance (Differential) 25°C 15 kΩ Input Capacitance 25°C 4 pF
LOGIC INPUTS (PDWN, SYNC, SCLK)
Logic 1 Voltage Full 1.2 AVDD + 0.2 V Logic 0 Voltage Full 0 0.8 V Input Resistance 25°C 30 kΩ Input Capacitance 25°C 2 pF
LOGIC INPUT (CSB)
Logic 1 Voltage Full 1.2 AVDD + 0.2 V Logic 0 Voltage Full 0 0.8 V Input Resistance 25°C 26 kΩ Input Capacitance 25°C 2 pF
LOGIC INPUT (SDIO)
Logic 1 Voltage Full 1.2 AVDD + 0.2 V Logic 0 Voltage Full 0 0.8 V Input Resistance 25°C 26 kΩ Input Capacitance 25°C 5 pF
LOGIC OUTPUT (SDIO)3
Logic 1 Voltage (IOH = 800 μA) Full 1.79 V Logic 0 Voltage (IOL = 50 μA) Full 0.05 V
DIGITAL OUTPUTS (D0±x, D1±x), ANSI-644
Logic Compliance LVDS Differential Output Voltage (VOD) Full 290 345 400 mV Output Offset Voltage (VOS) Full 1.15 1.25 1.35 V Output Coding (Default) Twos complement
DIGITAL OUTPUTS (D0±x, D1±x), LOW POWER,
REDUCED SIGNAL OPTION Logic Compliance LVDS Differential Output Voltage (VOD) Full 160 200 230 mV Output Offset Voltage (VOS) Full 1.15 1.25 1.35 V Output Coding (Default) Twos complement
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and for details on how these tests were completed.
2
This is specified for LVDS and LVPECL only.
3
This is specified for 13 SDIO/OLM pins sharing the same connection.
Rev. 0 | Page 5 of 40
AD9253 Data Sheet

SWITCHING SPECIFICATIONS

AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −1.0 dBFS, unless otherwise noted.
Table 4.
Parameter
1, 2
Temp Min Typ Max Unit
CLOCK3
Input Clock Rate Full 10 1000 MHz Conversion Rate Full 10 80/105/125 MSPS Clock Pulse Width High (tEH) Full 6.25/4.76/4.00 ns Clock Pulse Width Low (tEL) Full 6.25/4.76/4.00 ns
OUTPUT PARAMETERS3
Propagation Delay (tPD) Full 2.3 ns Rise Time (tR) (20% to 80%) Full 300 ps Fall Time (tF) (20% to 80%) Full 300 ps FCO Propagation Delay (t DCO Propagation Delay (t DCO to Data Delay (t
DATA
DCO to FCO Delay (t
) Full 1.5 2.3 3.1 ns
FCO
)4 Full t
CPD
)4 Full (t
)4 Full (t
FRAME
/16) − 300 (t
SAMPLE
/16) − 300 (t
SAMPLE
+ (t
FCO
SAMPLE
/16) (t
SAMPLE
/16) (t
SAMPLE
/16) ns
/16) + 300 ps
SAMPLE
/16) + 300 ps
SAMPLE
Lane Delay (tLD) 90 ps Data to Data Skew (t
DATA-MAX
− t
) Full ±50 ±200 ps
DATA-MIN
Wake-Up Time (Standby) 25°C 250 ns Wake-Up Time (Power-Down)5 25°C 375 μs Pipeline Latency Full 16
Clock cycles
APERTURE
Aperture Delay (tA) 25°C 1 ns Aperture Uncertainty (Jitter, tJ) 25°C 135 fs rms Out-of-Range Recovery Time 25°C 1
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and for details on how these tests were completed.
2
Measured on standard FR-4 material.
3
Can be adjusted via the SPI. The conversion rate is the clock rate after the divider.
4
t
/16 is based on the number of bits in two LVDS data lanes. t
SAMPLE
5
Wake-up time is defined as the time required to return to normal operation from power-down mode.
SAMPLE
= 1/fS.
Clock cycles

TIMING SPECIFICATIONS

Table 5.
Parameter Description Limit
SYNC TIMING REQUIREMENTS
t
SYNC to rising edge of CLK+ setup time 0.24 ns typ
SSYNC
t
SYNC to rising edge of CLK+ hold time 0.40 ns typ
HSYNC
SPI TIMING REQUIREMENTS See Figure 74
tDS Setup time between the data and the rising edge of SCLK 2 ns min tDH Hold time between the data and the rising edge of SCLK 2 ns min t
Period of the SCLK 40 ns min
CLK
tS Setup time between CSB and SCLK 2 ns min tH Hold time between CSB and SCLK 2 ns min t
SCLK pulse width high 10 ns min
HIGH
t
SCLK pulse width low 10 ns min
LOW
t
EN_SDIO
Time required for the SDIO pin to switch from an input to an output relative to the
10 ns min
SCLK falling edge (not shown in Figure 74)
t
DIS_SDIO
Time required for the SDIO pin to switch from an output to an input relative to the
10 ns min
SCLK rising edge (not shown in Figure 74)
Rev. 0 | Page 6 of 40
Unit
Data Sheet AD9253

Timing Diagrams

Refer to the Memory Map Register Descriptions section and Ta b le 2 1 for SPI register settings.
N – 1
VIN±x
t
A
N
N + 1
DDR
SDR
BITWISE
MODE
BYTEWISE
MODE
CLK–
CLK+
DCO–
DCO+
DCO–
DCO+
FCO–
FCO+
D0–A
D0+A
D1–A
D1+A
FCO–
FCO+
D0–A
D0+A
D1–A
D1+A
t
EH
t
CPD
t
FCO
t
PD
D12
N – 17
MSB
N – 17
D05
N – 17
MSB
N – 17
t
EL
t
FRAME
D10
N – 17
D11
N – 17
D04
N – 17
D12
N – 17
D08
N – 17
D09
N – 17
D03
N – 17
D11
N – 17
D06
N – 17
D07
N – 17
D02
N – 17
D10
N – 17
t
DATA
D04
D02
N – 17
N – 17
D05
D03
N – 17
N – 17
D01
LSB
N – 17
N – 170N – 170N – 17
D09
D08
N – 17
N – 17
LSB
N – 170N – 17
D01
N – 170N – 17
D07
D06
N – 17
N – 17
D12
D10
D08
D06
D04
D02
N – 16
N – 16
N – 16
N – 16
N – 16
t
LD
MSB
D11
D09
D07
N – 16
D05
N – 16
MSB
N – 16
N – 16
D04
N – 16
D12
N – 16
N – 16
D03
N – 16
D11
N – 16
N – 16
D02
N – 16
D10
N – 16
D05
N – 16
D01
N – 16
D09
N – 16
LSB
N – 16
N – 160N – 16
D03
D01
N – 16
N – 160N – 16
LSB
N – 160N – 160N – 16
D08
D07
N – 16
D06
N – 16
N – 16
10065-003
Figure 2. 16-Bit DDR/SDR, Two-Lane, 1× Frame Mode (Default)
Rev. 0 | Page 7 of 40
AD9253 Data Sheet
VIN±x
CLK–
CLK+
DCO–
DDR
N – 1
t
A
t
EH
t
CPD
t
EL
N
N + 1
DCO+
DCO–
SDR
BITWI SE
MODE
DCO+
FCO–
FCO+
D0–A
D0+A
D1–A
D1+A
D10
N – 17
MSB
N – 17
t
FCO
t
PD
D08
N – 17
D09
N – 17
D06
N – 17
D07
N – 17
t
FRAME
N – 17
N – 17
D04
D05
D02
N – 17
D03
N – 17
LSB
N – 17
D01
N – 17
D10
N – 16
MSB
N – 16
t
DATA
D08
N – 16
D09
N – 16
D06
N – 16
D07
N – 16
D04
D02
N – 16
D03
N – 16
LSB
N – 16
D01
N – 16
N – 16
t
LD
D05
N – 16
FCO–
FCO+
BYTEWI SE
MODE
D0–A
D0+A
D1–A
D1+A
D05
N – 17
MSB
N – 17
D04
N – 17
D10
N – 17
D03
N – 17
D09
N – 17
D02
N – 17
D08
N – 17
D01
N – 17
D07
N – 17
LSB
N – 17
D06
N – 17
D05
N – 16
MSB
N – 16
D04
N – 16
D10
N – 16
D03
N – 16
D09
N – 16
D02
N – 16
D08
N – 16
D01
N – 16
D07
N – 16
LSB
N – 16
D06
N – 16
10065-004
Figure 3. 12-Bit DDR/SDR, Two-Lane, 1× Frame Mode
N – 1
VIN±x
t
A
N
N + 1
DDR
SDR
BITWISE
MODE
BYTEWISE
MODE
CLK–
CLK+
DCO–
DCO+
DCO–
DCO+
FCO–
FCO+
D0–A
D0+A
D1–A
D1+A
FCO–
FCO+
D0–A
D0+A
D1–A
D1+A
t
EH
t
CPD
t
FCO
t
PD
D12
N – 17
MSB
N – 17
D05
N – 17
MSB
N – 17
t
EL
t
FRAME
D10
N – 17
D11
N – 17
D04
N – 17
D12
N – 17
D08
N – 17
D09
N – 17
D03
N – 17
D11
N – 17
D06
N – 17
D07
N – 17
D02
N – 17
D10
N – 17
t
DATA
D04
D02
N – 17
N – 17
D05
D03
N – 17
N – 17
D01
LSB
N – 17
N – 170N – 170N – 17
D09
D08
N – 17
N – 17
LSB
N – 170N – 17
D01
N – 170N – 17
D07
D06
N – 17
N – 17
D12
D10
D08
D06
D04
D02
N – 16
N – 16
N – 16
N – 16
N – 16
t
LD
MSB
D11
D09
D07
N – 16
D05
N – 16
MSB
N – 16
N – 16
D04
N – 16
D12
N – 16
N – 16
D03
N – 16
D11
N – 16
N – 16
D02
N – 16
D10
N – 16
D05
N – 16
D01
N – 16
D09
N – 16
LSB
N – 16
N – 160N – 16
D03
D01
N – 16
N – 160N – 16
LSB
N – 160N – 160N – 16
D08
D07
N – 16
D06
N – 16
N – 16
10065-005
Figure 4. 16-Bit DDR/SDR, Two-Lane, 2× Frame Mode
Rev. 0 | Page 8 of 40
Data Sheet AD9253
VIN±x
CLK–
CLK+
DCO–
DDR
N – 1
t
A
t
EH
t
CPD
t
N
EL
N + 1
DCO+
DCO–
SDR
BITWI SE
MODE
DCO+
FCO–
FCO+
D0–A
D0+A
D1–A
D1+A
D10
N – 17
MSB
N – 17
t
FCO
t
D08
N – 17
D09
N – 17
t
FRAME
t
PD
D06
D04
D02
N – 17
D07
N – 17
N – 17
D05
N – 17
N – 17
D03
N – 17
LSB
N – 17
D01
N – 17
D10
N – 16
MSB
N – 16
DATA
D08
N – 16
D09
N – 16
D06
N – 16
D07
N – 16
D04
D02
N – 16
D03
N – 16
LSB
N – 16
D01
N – 16
N – 16
t
LD
D05
N – 16
FCO–
FCO+
MODE
D0–A
D0+A
D1–A
D1+A
D05
N – 17
MSB
N – 17
D04
N – 17
D10
N – 17
D03
N – 17
D09
N – 17
D02
N – 17
D08
N – 17
D01
N – 17
D07
N – 17
LSB
N – 17
D06
N – 17
D05
N – 16
MSB
N – 16
D04
N – 16
D10
N – 16
D03
N – 16
D09
N – 16
D02
N – 16
D08
N – 16
D01
N – 16
D07
N – 16
LSB
N – 16
D06
N – 16
10065-006
BYTEWISE
Figure 5. 12-Bit DDR/SDR, Two-Lane, 2× Frame Mode
VIN±x
CLK–
CLK+
DCO–
DCO+
FCO–
FCO+
D0–x
D0+x
N – 1
t
A
t
t
t
FCO
PD
CPD
t
EH
t
FRAME
t
DATA
D12
MSB
N–17
N – 17
D11
D10
N – 17
N – 17D9N – 17D8N – 17D7N – 17D6N – 17D5N – 17D4N – 17D3N – 17D2N – 17D1N – 17
t
EL
N
LSB
N – 170N – 170N – 17
MSB
N – 16
D14
N – 16
D13
N – 16
10065-002
Figure 6. Wordwise DDR, One-Lane, 1× Frame, 16-Bit Output Mode
Rev. 0 | Page 9 of 40
AD9253 Data Sheet
S
VIN±x
CLK–
CLK+
DCO–
DCO+
FCO–
FCO+
D0–x
D0+x
N – 1
t
A
t
EH
t
CPD
t
FCO
t
PD
MSB
N–17
t
FRAME
D10
D9
N – 17
N – 17D8N – 17D7N – 17D6N – 17D5N – 17D4N – 17D3N – 17D2N – 17D1N – 17D0N – 17
t
EL
t
DATA
N
MSB
D10
N – 16
N – 16
10065-082
Figure 7. Wordwise DDR, One-Lane, 1× Frame, 12-Bit Output Mode
CLK+
t
SSYNC
t
HSYNC
YNC
Figure 8. SYNC Input Timing Requirements
10065-079
Rev. 0 | Page 10 of 40
Data Sheet AD9253

ABSOLUTE MAXIMUM RATINGS

Table 6.
Parameter Rating Electrical
AVDD to AGND −0.3 V to +2.0 V DRVDD to AGND −0.3 V to +2.0 V Digital Outputs
(D0±x, D1±x, DCO+,
DCO−, FCO+, FCO−) to AGND CLK+, CLK− to AGND −0.3 V to +2.0 V VIN+x, VIN−x to AGND −0.3 V to +2.0 V SCLK/DTP, SDIO/OLM, CSB to AGND −0.3 V to +2.0 V SYNC, PDWN to AGND −0.3 V to +2.0 V RBIAS to AGND −0.3 V to +2.0 V VREF, SENSE to AGND −0.3 V to +2.0 V
Environmental
Operating Temperature
Range (Ambient) Maximum Junction
Temperature Lead Temperature
(Soldering, 10 sec) Storage Temperature
Range (Ambient)
−0.3 V to +2.0 V
−40°C to +85°C
150°C
300°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

Table 7. Thermal Resistance
Air Flow Veloc ity
Package Type
48-Lead LFCSP 0.0 23.7 7.8 7.1 °C/W
7 mm × 7 mm 1.0 20.0 N/A N/A °C/W (CP-48-13) 2.5 18.7 N/A N/A °C/W
1
θJA for a 4-layer PCB with solid ground plane (simulated). Exposed pad
soldered to PCB.
(m/sec)
1
θ
θ
JA
JB
θJC Unit

ESD CAUTION

Rev. 0 | Page 11 of 40
AD9253 Data Sheet

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

N+C
SYNC
AVDD
AVDD
VIN–C
VI
47
48
VREF
SENSE
VCM
RBIAS
VIN+B
AVDD
VIN–B
41
37
39
42
43
40
44
45
46
38
1
VIN+D
2
VIN–D
3
AVD D
4
AVD D
5
CLK–
6
CLK+
7
AVD D
8
DRVDD
9
D1–D
10
D1+D
11
D0–D
12
D0+D
NOTES
1. THE EXPOSED THERMAL PAD ON THE BOTTOM OF THE PACKAGE PROVI DES THE ANALO G GROUND F OR THE PART . THIS EXPO SED PAD MUST BE CONNECTED TO GRO UND FOR PROPER OPERATION.
(Not to Scale)
13
14
15
D1–C
D0–C
D1+C
AD9253
TOP VIEW
19
18
17
16
D0+C
FCO
DCO–
DCO+
20
21
D1–B
FCO+
Figure 9. 48-Lead LFCSP Pin Configuration, Top View
Table 8. Pin Function Descriptions
Pin No. Mnemonic Description
0
1 2
AGND, Exposed Pad
Analog Ground, Exposed Pad. The exposed thermal pad on the bottom of the package provides the
analog ground for the part. This exposed pad must be connected to ground for proper operation. VIN+D ADC D Analog Input True. VIN−D ADC D Analog Input Complement.
3, 4, 7, 34, 39, 45, 46 AVDD 1.8 V Analog Supply Pins. 5, 6 8, 29 9, 10
CLK−, CLK+ Differential Encode Clock. PECL, LVDS, or 1.8 V CMOS inputs. DRVDD Digital Output Driver Supply. D1−D, D1+D Channel D Digital Outputs.
11, 12 D0−D, D0+D Channel D Digital Outputs. 13, 14 15, 16 17, 18 19, 20 21, 22 23, 24
D1−C, D1+C Channel C Digital Outputs. D0−C, D0+C Channel C Digital Outputs. DCO−, DCO+ Data Clock Outputs. FCO−, FCO+ Frame Clock Outputs. D1−B, D1+B Channel B Digital Outputs. D0−B, D0+B Channel B Digital Outputs.
25, 26 D1−A, D1+A Channel A Digital Outputs. 27, 28 D0−A, D0+A Channel A Digital Outputs. 30 31 32 33
SCLK/DTP SPI Clock Input/Digital Test Pattern. SDIO/OLM SPI Data Input and Output Bidirectional SPI Data/Output Lane Mode. CSB SPI Chip Select Bar. Active low enable; 30 kΩ internal pull-up. PDWN
Digital Input, 30 kΩ Internal Pull-Down.
PDWN high = power-down device.
PDWN low = run device, normal operation.
35 VIN−A ADC A Analog Input Complement. 36 37
VIN+A ADC A Analog Input True. VIN+B ADC B Analog Input True.
38 VIN−B ADC B Analog Input Complement. 40 41 42 43
RBIAS Sets Analog Current Bias. Connect to 10 kΩ (1% tolerance) resistor to ground. SENSE Reference Mode Selection. VREF Voltage Reference Input and Output. VCM Analog Input Common-Mode Voltage.
Rev. 0 | Page 12 of 40
36
VIN+A VIN–A
35
AVD D
34
PDWN
33 32
CSB SDIO/OLM
31
SCLK/DTP
30
DRVDD
29 28
D0+A D0–A
27
D1+A
26 25
D1–A
22
23
24
D0–B
D1+B
D0+B
10065-007
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