ANALOG DEVICES AD8396 Service Manual

Low Power, High Output Current,
V
Dual-Port ADSL/ADSL2+ Line Driver

FEATURES

2 differential DSL channels comprised of current feedback,
high output current amplifiers Integrated feedback and gain resistors Integrated biasing network Ideal for use as ADSL/ADSL2+ dual-channel Central Office
(CO) line drivers Low power consumption
Dual-supply operation from ±6 V to ±12 V
Single-supply operation from 12 V to 24 V
10.8 mA quiescent supply current in full power mode
1.4 mA quiescent supply current in shutdown mode
Less than 700 mW internal power dissipation while driving
20.4 dBm line power, 1:1 transformer
High output voltage and current drive
43.4 V p-p differential output voltage
Low distortion
−66 dBc typical MTPR @ 20.4 dBm, 26 kHz to 2.2 MHz
High speed: 170 V/μs differential slew rate

APPLICATIONS

ADSL/ADSL2+ CO line drivers

GENERAL DESCRIPTION

The AD8396 is comprised of four high output current, low power consumption operational amplifiers. It is particularly well suited for the CO driver interface in digital subscriber line systems, such as ADSL and ADSL2+. The driver can deliver
20.4 dBm to a line while compensating for losses due to hybrid insertion and back-termination resistors.
The low power consumption, high output current, high output voltage swing, and robust thermal packaging enable the AD8396 to be used as the CO line driver in ADSL and other xDSL systems.
The AD8396 is available in a 4 mm × 4 mm 16-lead LFCSP.
AD8396

PIN CONFIGURATION

VCOM-A
PD_A
VCC
51
41
TOP
VIEW
7
6 B
PD_B
VCOM-
Figure 1.
VOPA 31
8
VEE
CC
AV = 13
VEE
12
VONA
11
DGND
10
VOPB
9
VONB
07022-001
VOPA
VONA
07022-002
61
1
INPA
2
INNA
DGND
INPB
AD8396
3
4
5
INNB
INPA
VCOM-A
INNA
Figure 2. Channel A Internal Schematics
VCC
4k
4k
VEE
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
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AD8396

TABLE OF CONTENTS

Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Pin Configuration ............................................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 4
Thermal Resistance ...................................................................... 4
Maximum Power Dissipation ..................................................... 4
ESD Caution .................................................................................. 4
Pin Configuration and Function Descriptions ............................. 5

REVISION HISTORY

8/09—Revision C: Initial Version
Typical Performance Characteristics ..............................................6
Theory of Operation .........................................................................8
Applications Information .................................................................9
Supplies, Grounding, and Layout ................................................9
Power Management ......................................................................9
Typical ADSL/ADSL2+ Application ...........................................9
Multitone Power Ratio (MTPR) ..................................................9
Lightning and AC Power Fault ................................................. 10
Outline Dimensions ....................................................................... 11
Ordering Guide .......................................................................... 11
Rev. C | Page 2 of 12
AD8396

SPECIFICATIONS

(VCC − VEE) = 24 V, RL = 100 Ω, G
Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
DYNAMIC PERFORMANCE
−3 dB Small-Signal Bandwidth 8 MHz V
−3 dB Large-Signal Bandwidth 8 MHz V
Slew Rate 170 V/μs V
Differential Gain 12.8 13 13.2 V/V
NOISE/DISTORTION PERFORMANCE
Second Harmonic Distortion −90 dBc fC = 2 MHz, V
Third Harmonic Distortion −62 dBc fC = 2 MHz, V
Multitone Input Power Ratio (MTPR) −66 dBc
Differential Output Noise 140 nV/√Hz f = 10 kHz
INPUT CHARACTERISTICS
RTO Offset Voltage −15 −0.7 +15 mV Single-ended
−15 +0.3 +15 mV Differential
RTO Offset Voltage @ PD = (1) −30 +0.1 +30 mV Differential
Input Bias Current −5 −1.5 +5 μA
Input Resistance 8 kΩ Differential
Input Capacitance 1 pF Differential
OUTPUT CHARACTERISTICS
Differential Output Voltage Swing 42.6 43.4 44 V p-p ΔV
Single-Ended Output Voltage Swing 21.3 21.7 22 V p-p ΔV
Output Leakage Current −100 +100 μA PD = (1)
POWER SUPPLY
Operating Range, Dual Supply ±6 ±12 V
Operating Range, Single Supply 12 24 V
Total Quiescent Current
PD = (0) 9.0 10.8 13.0 mA
PD = (1) Shutdown State 0 1.4 3.0 mA Common-Mode Voltage −10 +0.2 +10 mV VCM PD = (0) Threshold 0.8 V (0) = 0 V PD = (1) Threshold 1.6 V (1) = 5 V PD = (0) Input Current −100 −47 +100 μA (0) = 0 V PD = (1) Input Current −100 +1 +100 μA (1) = 5 V +Power Supply Rejection Ratio −80 −60 dB ΔV
−Power Supply Rejection Ratio −80 −60 dB ΔV
= 13 (fixed), PD = (0), T = 25°C, typical DSL application circuit, unless otherwise noted.
DIFF
= 0.1 V p-p, differential
OUT
= 2 V p-p, differential
OUT
= 4 V p-p, differential
OUT
= 2 V p-p, differential
OUT
= 2 V p-p, differential
OUT
26 kHz to 2.2 MHz, Z
= 100 Ω, differential
LINE
load
, RL = 100 Ω
OUT
, RL = 50 Ω
OUT
/ΔVCC, ΔVCC = ±1 V, differential
OS, DM (RTI)
/ΔVEE, ΔVEE = ±1 V, differential
OS, DM (RTI)
Rev. C | Page 3 of 12
AD8396

ABSOLUTE MAXIMUM RATINGS

Table 2.
Parameter Rating
Supply Voltage, VCC − VEE 26.4 V Power Dissipation See Figure 3 Storage Temperature Range −65°C to +150°C Operating Temperature Range −40°C to +85°C Lead Temperature (Soldering, 10 sec) 300°C Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

θJA is specified in still air with exposed pad soldered to 4-layer JEDEC test board. θ
is specified at the exposed pad.
JC
Table 3.
Package Type θJA θ
Unit
JC
16-Lead LFCSP 56 9.1 °C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the AD8396 is limited by its junction temperature on the die.
The maximum safe junction temperature of plastic encapsulated devices, as determined by the glass transition temperature of the plastic, is 150°C. Exceeding this limit can temporarily cause a shift in the parametric performance due to a change in the stresses exerted on the die by the package. Exceeding this limit for an extended period can result in device failure.
Figure 3 shows the maximum power dissipation in the package vs. the ambient temperature for the 16-lead LFCSP on a JEDEC standard 4-layer board. θ
3.5
3.0
2.5
2.0
1.5
1.0
MAXIMUM POW ER DISSIPAT ION (W)
0.5
0
–25 85
–15–5 5 15253545556575
Figure 3. Maximum Power Dissipation vs.
Ambient Temperature for a 4-Layer Board
values are approximations.
JA
AMBIENT TEMPERATURE (°C)
TJ = 150°C
07022-003
The power dissipated in the package (PD) is the sum of the quiescent power dissipation and the power dissipated in the package due to the load drive for all outputs. The quiescent power is the voltage between the supply pins (V quiescent current (I to midsupply, the total drive power is V
). Assuming that the load RL is referenced
S
/2 × I
S
is dissipated in the package and part in the load (V
RMS output voltages should be considered. If R V
, as in single-supply operation, the total power is VS × I
EE
In single supply with R
to VEE, worst case is V
L
Airflow increases heat dissipation, effectively reducing θ
) times the
S
, part of which
OUT
× I
OUT
OUT
is referenced to
L
= VS/2.
OUT
JA
OUT
. In
).
.
addition, more copper in direct contact with the package leads from PCB traces, through-holes, ground, and power planes reduces θ
.
JA

ESD CAUTION

Rev. C | Page 4 of 12
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