Analog Devices AD8009JRT-REEL7, AD8009JRT-REEL, AD8009AR-REEL7, AD8009AR-REEL, AD8009AR, AD8009ACHIPS Datasheet
1 GHz, 5,500 V/s
a
FEATURES
Ultrahigh Speed
5,500 V/s Slew Rate, 4 V Step, G = +2
545 ps Rise Time, 2 V Step, G = +2
Large Signal Bandwidth
440 MHz, G = +2
320 MHz, G = +10
Small Signal Bandwidth (–3 dB)
1 GHz, G = +1
700 MHz, G = +2
Settling Time 10 ns to 0.1%, 2 V Step, G = +2
Low Distortion Over Wide Bandwidth
SFDR
–44 dBc @ 150 MHz, G = +2, V
–41 dBc @ 150 MHz, G = +10, V
3rd Order Intercept (3IP)
26 dBm @ 70 MHz, G = +10
18 dBm @ 150 MHz, G = +10
Good Video Specifications
Gain Flatness 0.1 dB to 75 MHz
0.01% Differential Gain Error, R
0.01ⴗ Differential Phase Error, R
High Output Drive
175 mA Output Load Drive
10 dBm with –38 dBc SFDR @ 70 MHz, G = +10
Supply Operation
ⴞ5 V Voltage Supply
14 mA (Typ) Supply Current
APPLICATIONS
Pulse Amplifier
IF/RF Gain Stage/Amplifiers
High Resolution Video Graphics
High Speed Instrumentations
CCD Imaging Amplifier
2
1
0
–1
VO = 2Vp–p
–2
–3
–4
–5
NORMALIZED GAIN – dB
–6
–7
–8
1
FREQUENCY RESPONSE – MHz
Figure 1. Large Signal Frequency Response; G = +2 & +10
REV. C
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
= 2 V p-p
O
= 2 V p-p
O
= 150 ⍀
L
= 150 ⍀
L
G = +10
= 200⍀
R
F
RL = 100⍀
100
G = +2
= 301⍀
R
F
RL = 150⍀
100010
Low Distortion Amplifier
AD8009
FUNCTIONAL BLOCK DIAGRAMS
8-Lead Plastic SOIC (SO-8) 5-Lead SOT-23 (RT-5)
AD8009
1
NC
2
–IN
3
+IN
4
–V
S
NC = NO CONNECT
8
NC
7
+V
6
OUT
NC
5
V
S
PRODUCT DESCRIPTION
The AD8009 is an ultrahigh speed current feedback amplifier
with a phenomenal 5,500 V/µs slew rate that results in a rise
time of 545 ps, making it ideal as a pulse amplifier.
The high slew rate reduces the effect of slew rate limiting and
results in the large signal bandwidth of 440 MHz required for
high resolution video graphic systems. Signal quality is maintained over a wide bandwidth with worst case distortion of
–40 dBc @ 250 MHz (G = +10, 1 V p-p). For applications
with multitone signals such as IF signal chains, the third order
Intercept (3IP) of 12 dBm is achieved at the same frequency.
This distortion performance coupled with the current feedback
architecture make the AD8009 a flexible component for a gain
stage amplifier in IF/RF signal chains.
The AD8009 is capable of delivering over 175 mA of load
current and will drive four back terminated video loads while
maintaining low differential gain and phase error of 0.02% and
0.04° respectively. The high drive capability is also reflected in
the ability to deliver 10 dBm of output power @ 70 MHz with
–38 dBc SFDR.
The AD8009 is available in a small SOIC package and will
operate over the industrial temperature range –40°C to +85°C.
The AD8009 is also available in an SOT-23-5 and will operate
over the commercial temperature range 0°C to +70°C.
Storage Temperature Range R Package . . . . –65°C to +125°C
Operating Temperature Range (A Grade) . . . –40°C to +85°C
Operating Temperature Range (J Grade) . . . . . . 0°C to +70°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Specification is for device in free air:
8-Lead SOIC Package: θJA = 155°C/W.
5-Lead SOT-23 Package: θJA = 240°C/W.
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8009 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic
encapsulated devices is determined by the glass transition
temperature of the plastic, approximately 150°C. Exceeding
this limit temporarily may cause a shift in parametric performance due to a change in the stresses exerted on the die by the
package. Exceeding a junction temperature of 175°C for an
extended period can result in device failure.
While the AD8009 is internally short circuit protected, this
may not be sufficient to guarantee that the maximum junction
temperature (150°C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the maximum power derating curves.
2.0
TJ = +150°C
1.5
8-LEAD SOIC PACKAGE
1.0
0.5
MAXIMUM POWER DISSIPATION – Watts
0
–50
5-LEAD SOT-23 PACKAGE
AMBIENT TEMPERATURE – °C
9080
706050403020100–40 –30 –20 –10
Figure 3. Plot of Maximum Power Dissipation vs.
Temperature
ORDERING GUIDE
TemperaturePackagePackageBranding
ModelRangeDescriptionOptionInformation
AD8009ACHIPS–40°C to +85°CDie
AD8009AR–40°C to +85°C8-Lead SOICSO-8
AD8009AR-REEL–40°C to +85°C8-Lead SOIC13" Tape and Reel
AD8009AR-REEL7–40°C to +85°C8-Lead SOIC7" Tape and Reel
AD8009JRT-REEL0°C to +70°C5-Lead SOT-2313" Tape and ReelHKJ
AD8009JRT-REEL70°C to +70°C5-Lead SOT-237" Tape and ReelHKJ
AD8009-EBEvaluation BoardSO-8
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8009 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
REV. C
–3–
AD8009
–Typical Performance Characteristics
3
NORMALIZED GAIN – dB
2
1
0
–1
–2
–3
–4
–5
–6
–7
1
R PACKAGE
R
L
V
O
G = +1, +2: R
G = +10: R
RT PACKAGE
G = +1: RF = 332⍀
G = +2: RF = 226⍀
G = +10: R
:
= 100⍀
= 200mV p–p
F
= 200⍀
F
= 191⍀
F
= 301⍀
:
10100
FREQUENCY – MHz
G = +1, RT
G = +2, R & RT
G = +10, R & RT
G = +1, R
1000
Figure 4. Frequency Response; G = +1, +2, +10, R and RT
Packages
8
7
6
5
G = +2
4
R
= 301⍀
GAIN – dB
3
2
1
0
–1
–2
F
RL = 150⍀
VO AS SHOWN
FREQUENCY – MHz
4V p–p
2V p–p
1001100010
Figure 5. Large Signal Frequency Response; G = +2
6.2
6.1
6.0
5.9
G = +2
R
= 301⍀
5.8
F
= 150⍀
R
L
5.7
VO = 200mV p–p
5.6
5.5
GAIN FLATNESS – dB
5.4
5.3
5.2
101001
FREQUENCY – MHz
1000
Figure 7. Gain Flatness; G = +2
22
21
20
19
GAIN – dB
G = +10
18
17
16
15
14
13
12
= 200⍀
R
F
RL = 100⍀
AS SHOWN
V
O
4V p–p
1001100010
FREQUENCY – MHz
2V p–p
Figure 8. Large Signal Frequency Response; G = +10
8
GAIN – dB
7
6
5
4
3
2
1
0
–1
–2
G = +2
RF = 301⍀
= 150⍀
R
L
VO = 2V p–p
–40ⴗC
1001100010
FREQUENCY – MHz
+85ⴗC
–40ⴗC
+85ⴗC
Figure 6. Large Signal Frequency Response vs.
Temperature; G = +2
–4–
22
21
20
GAIN – dB
19
G = +10
18
= 200⍀
R
F
RL = 100⍀
17
= 2V p–p
V
O
16
15
14
13
12
FREQUENCY – MHz
1001100010
–40ⴗC
+85ⴗC
Figure 9. Large Signal Frequency Response vs.
Temperature; G = +10
REV. C
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