Analog Devices AD7397, AD7396 Datasheet

3 V, Parallel Input
a
FEATURES Micropower: 100 A/DAC
0.1 A Typical Power Shutdown Single Supply +2.7 V to +5.5 V Operation Compact 1.1 mm Height TSSOP 24-Lead Package AD7396: 12-Bit Resolution AD7397: 10-Bit Resolution
0.9 LSB Differential Nonlinearity Error
APPLICATIONS Automotive Output Span Voltage Portable Communications Digitally Controlled Calibration PC Peripherals
GENERAL DESCRIPTION
The AD7396/AD7397 series of dual, 12-bit and 10-bit voltage­output digital-to-analog converters are designed to operate from a single +3 V supply. Built using a CBCMOS process, these monolithic DACs offer the user low cost and ease of use in single supply +3 V systems. Operation is guaranteed over the supply voltage range of +2.7 V to +5.5 V, making this device ideal for battery operated applications.
A 12-bit wide data latch loads with a 45 ns write time allowing interface to fast processors without wait states. The double buffered input structure allows the user to load the input registers one at a time, then a single load strobe tied to both LDA+LDB inputs will simultaneously update both DAC out­puts. LDA and LDB can also be independently activated to immediately update their respective DAC registers. An address input (A/B) decodes DACA or DACB when the chip select CS input is strobed. Additionally, an asynchronous RS input sets the output to zero-scale at power on or upon user demand. Power shutdown to submicroamp levels is directly controlled by the active low SHDN pin. While in the power shutdown state register data can still be changed even though the output buffer is in an open circuit state. Upon return to the normal operating state the latest data loaded in the DAC register will establish the output voltage.
Dual 12-Bit /10-Bit DACs
AD7396/AD7397
FUNCTIONAL BLOCK DIAGRAM
V
DD
V
OUTA
V
REF
V
OUTB
AGND
LDA
CS
A/B
DATA
LDB
AD7396
12
DGND
DACA
REGISTER
INPUTA
REGISTER
INPUTB
REGISTER
DACB
REGISTER
12
12-BIT DACA
1
12
12-BIT DACB
RS SHDN
Both parts are offered in the same pinout, allowing users to select the amount of resolution appropriate for their applications without circuit card changes.
The AD7396/AD7397 are specified for operation over the ex-
tended industrial (–40°C to +85°C) temperature range. The AD7397AR is specified for the –40°C to +125°C automotive
temperature range. AD7396/AD7397s are available in plastic DIP, and 24-lead SOIC packages. The AD7397ARU is avail­able for ultracompact applications in a thin 1.1 mm height TSSOP 24-lead package.
1.0
0.8
0.6
0.4
0.2
0.0
DNL – LSB
–0.2
–0.4
–0.6 –0.8
–1.0
0
TA = +258C, +858C, –558C
SUPERIMPOSED
512 1024 1536 2048 2560 3072 3584 4096
CODE – Decimal
VDD = +3V
= +2.5V
V
REF
Figure 1. DNL vs. Digital Code at Temperature
REV. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 1998
AD7396/AD7397–SPECIFICATIONS
AD7396 12-BIT ELECTRICAL CHARACTERISTICS
(@ V
= +2.5 V, –40C < TA < +85C, unless otherwise noted)
REF IN
Parameter Symbol Conditions +3 V 10% +5 V 10% Units
STATIC PERFORMANCE
Resolution Relative Accuracy Relative Accuracy Differential Nonlinearity Differential Nonlinearity Zero-Scale Error V Zero-Scale Error V Full-Scale Voltage Error V Full-Scale Voltage Error V Full-Scale Tempco
1
2
2
2
2
3
N 12 12 Bits INL T INL T DNL T
= +25°C ±1.75 ±1.75 LSB max
A
= –40°C, +85°C ±2.0 ±2.0 LSB max
A
= +25°C, Monotonic ±0.9 ±0.9 LSB max
A
DNL Monotonic ±1 ±1 LSB max
ZSE
ZSE
FSE
FSE
TCV
FS
Data = 000H, T Data = 000H, T T
= +25°C, +85°C, Data = FFFH±8 ±8mV max
A
T
= –40°C, Data = FFF
A
= +25°C, +85°C 4.0 4.0 mV max
A
= –40°C 8.0 8.0 mV max
A
H
±20 ±20 mV max –45 –45 ppm/°C typ
REFERENCE INPUT
V
Range V
REF
Input Resistance R Input Capacitance
3
REF
REF
C
REF
0/V
DD
0/V
DD
V min/max
2.5 2.5 M typ
55pF typ
ANALOG OUTPUT
Output Current (Source) I Output Current (Sink) I Capacitive Load
3
OUT
OUT
C
L
Data = 800 Data = 800
H
H
, ∆V , ∆V
= 5 LSB 1 1 mA typ
OUT
= 5 LSB 3 3 mA typ
OUT
No Oscillation 100 100 pF typ
LOGIC INPUTS
Logic Input Low Voltage V Logic Input High Voltage V Input Leakage Current I Input Capacitance
INTERFACE TIMING
3
3, 5
Chip Select Write Width t DAC Select Setup t DAC Select Hold t Data Setup t Data Hold t Load Setup t Load Hold t Load Pulsewidth t Reset Pulsewidth t
IL
C
CS
AS
AH
DS
DH
LS
LH
LDW
RSW
IL
IH
IL
0.5 0.8 V max VDD – 0.6 4.0 V min
10 10 µA max
10 10 pF max
45 35 ns min 30 15 ns min 0 0 ns min 30 15 ns min 20 10 ns min 20 20 ns min 10 10 ns min 30 30 ns min 40 30 ns min
AC CHARACTERISTICS
Output Slew Rate SR Data = 000 Settling Time Shutdown Recovery Time t
6
t
S
SDR
To ±0.1% of Full Scale 70 60 µs typ
DAC Glitch Q Code 7FF
to FFFH to 000
H
to 800H to 7FF
H
H
0.05 0.05 V/µs typ 90 80 µs typ
H
65 65 nV/s typ
Digital Feedthrough Q 15 15 nV/s typ
V
Feedthrough V
OUT/VREF
= 1.5 VDC +1 V p-p
REF
,
Data = 000H, f = 100 kHz –63 –63 dB typ
SUPPLY CHARACTERISTICS
Power Supply Range V Positive Supply Current I Shutdown Supply Current I Power Dissipation P
DD RANGE
DD
DD_SD
DISS
DNL < ±1 LSB 2.7/5.5 2.7/5.5 V min/max
V
= 0 V, No Load 125/200 125/200 µA typ/max
IL
SHDN = 0, V V
= 0 V, No Load 600 1000 µW max
IL
= 0 V, No Load 0.1/1.5 0.1/1.5 µA typ/max
IL
Power Supply Sensitivity PSS ∆VDD = ±5% 0.006 0.006 %/% max
NOTES
1
One LSB = V
2
The first two codes (000H, 001H) are excluded from the linearity error measurement.
3
These parameters are guaranteed by design and not subject to production testing.
4
Typicals represent average readings measured at +25°C.
5
All input control signals are specified with tR = tF = 2 ns (10% to 90% of +3 V) and timed from a voltage level of +1.6 V.
6
The settling time specification does not apply for negative going transitions within the last 3 LSBs of ground.
Specifications subject to change without notice.
/4096 V for the 12-bit AD7396.
REF
–2–
4
REV. 0
AD7397 10-BIT
AD7396/AD7397
ELECTRICAL CHARACTERISTICS
(@ V
= +2.5 V, –40C < TA < +85C, unless otherwise noted)
REF IN
Parameter Symbol Conditions +3 V 10% +5 V 10% Units
STATIC PERFORMANCE
Resolution Relative Accuracy Relative Accuracy Differential Nonlinearity Zero-Scale Error V Full-Scale Voltage Error V Full-Scale Voltage Error V Full-Scale Tempco
1
2
2
2
3
N 10 10 Bits INL T INL T
= +25°C ±1.75 ±1.75 LSB max
A
= –40°C, +85°C, +125°C ±2.0 ±2.0 LSB max
A
DNL Monotonic ±1 ±1LSB max
ZSE
FSE
FSE
TCV
FS
Data = 000 T
= +25°C, +85°C, +125°C, Data = 3FFH±42 ±42 mV max
A
T
= –40°C, Data = 3FF
A
H
H
9.0 9.0 mV max
±48 ±48 mV max –45 –45 ppm/°C typ
REFERENCE INPUT
V
Range V
REF
Input Resistance R Input Capacitance
3
REF
REF
C
REF
0/V
DD
0/V
DD
V min/max
2.5 2.5 M typ
5 5 pF typ
ANALOG OUTPUT
Output Current (Source) I Output Current (Sink) I Capacitive Load
3
C
OUT
OUT
L
Data = 200 Data = 200
H
H
, ∆V , ∆V
= 5 LSB 1 1 mA typ
OUT
= 5 LSB 3 3 mA typ
OUT
No Oscillation 100 100 pF typ
LOGIC INPUTS
Logic Input Low Voltage V Logic Input High Voltage V Input Leakage Current I Input Capacitance
INTERFACE TIMING
3
3, 5
Chip Select Write Width t DAC Select Setup t DAC Select Hold t Data Setup t Data Hold t Load Setup t Load Hold t Load Pulsewidth t Reset Pulsewidth t
IL
C
CS
AS
AH
DS
DH
LS
LH
LDW
RSW
IL
IH
IL
0.5 0.8 V max VDD – 0.6 4.0 V min
10 10 µA max
10 10 pF max
45 35 ns min 30 15 ns min 0 0 ns min 30 15 ns min 20 10 ns min 20 20 ns min 10 10 ns min 30 30 ns min 40 30 ns min
AC CHARACTERISTICS
Output Slew Rate SR Data = 000 Settling Time Shutdown Recovery Time t
6
t
S
SDR
To ±0.1% of Full Scale 70 60 µs typ
DAC Glitch Q Code 7FF
to 3FFH to 000
H
to 800H to 7FF
H
H
0.05 0.05 V/µs typ 90 80 µs typ
H
65 65 nV/s typ Digital Feedthrough Q 15 15 nV/s typ Feedthrough V
OUT/VREFVREF
= 1.5 VDC +1 V p-p
,
Data = 000H, f = 100 kHz –63 –63 dB typ
SUPPLY CHARACTERISTICS
Power Supply Range V Positive Supply Current I Shutdown Supply Current I Power Dissipation P
DD RANGE
DD
DD_SD
DISS
DNL < ±1 LSB 2.7/5.5 2.7/5.5 V min/max
V
= 0 V, No Load 125/200 125/200 µA typ/max
IL
SHDN = 0, V V
= 0 V, No Load 600 1000 µW max
IL
= 0 V, No Load 0.1/1.5 0.1/1.5 µA typ/max
IL
Power Supply Sensitivity PSS ∆VDD = ±5% 0.006 0.006 %/% max
NOTES
1
One LSB = V
2
The first two codes (000H, 001H) are excluded from the linearity error measurement.
3
These parameters are guaranteed by design and not subject to production testing.
4
Typicals represent average readings measured at +25°C.
5
All input control signals are specified with tR = tF = 2 ns (10% to 90% of +3 V) and timed from a voltage level of +1.6 V.
6
The settling time specification does not apply for negative going transitions within the last 3 LSBs of ground.
Specifications subject to change without notice.
/4096 V for the 10-bit AD7397.
REF
4
–3–REV. 0
AD7396/AD7397
t
CS
A/B
D0–D11
LDA, LDB
RS
V
OUT
CSW
t
LS
t
AS
t
DS
t
AH
t
DH
t
t
RSW
t
S
LDW
1 LSB
ERROR BAND
t
LH
t
S
DBx
CS
A/B
RS
B REGISTER
1 OF 12 LATCHES OF THE 2 INPUT REGISTERS
TO DAC REGISTERS
Figure 2. Timing Diagram
Figure 3. Digital Control Logic
Table I. Control Logic Truth
CS A/B LDA LDB RS SHDN Input Register DAC Register
L L HHHX Write to B Latched with Previous Data L HHHHX Write to A Latched with Previous Data L L H L H X Write to B B Transparent L H L H H X Write to A A Transparent H X L L H X Latched A and B Transparent H X ^ ^ H X Latched Latched with New Data from Input REG XXXXLX Reset to Zero Scale Reset to Zero Scale HXXX^ X Latched to Zero Latched to Zero
^Denotes positive edge. The SHDN pin has no effect on the digital interface data loading; however, while in the SHDN state (SHDN = 0) the output amplifiers V
and V
exhibit an open circuit condition. Note, the LDx inputs are level-sensitive, the respective DAC registers are in a transparent state when LDx = “0.”
OUTB
OUTA
–4–
REV. 0
AD7396/AD7397
ABSOLUTE MAXIMUM RATINGS*
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V, +8 V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
V
REF
Logic Inputs to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, +8 V
V
to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
OUT
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +2 V
Short Circuit to GND . . . . . . . . . . . . . . . . . . . . +50 mA
I
OUT
Package Power Dissipation . . . . . . . . . . . . . (T
Thermal Resistance θ
JA
max – T
J
)/θ
A
24-Lead Plastic DIP Package (N-24) . . . . . . . . . . +63°C/W
24-Lead SOIC Package (R-24) . . . . . . . . . . . . . . . +70°C/W
24-Lead Thin Shrink Surface Mount (RU-24) . . +143°C/W
Maximum Junction Temperature (T
max) . . . . . . . . .+150°C
J
Operating Temperature Range . . . . . . . . . . . –40°C to +85°C
DD
AD7397AN, AD7397AR Only . . . . . . . . –40°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature
␣ ␣ N-24 (Soldering, 10 sec) . . . . . . . . . . . . . . . . . . . . . .+300°C
␣ ␣ R-24 (Vapor Phase, 60 sec) . . . . . . . . . . . . . . . . . . . .+215°C
␣ ␣ RU-24 (Infrared, 15 sec) . . . . . . . . . . . . . . . . . . . . . .+224°C
JA
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ORDERING GUIDE
Res Temperature Package Package
Model (LSB) Ranges Descriptions Options
AD7396AN 12 –40°C to +85°C 24-Lead P-DIP N-24 AD7396AR 12 –40°C to +85°C 24-Lead SOIC R-24
AD7397AN 10 –40°C to +125°C 24-Lead P-DIP N-24 AD7397AR 10 –40°C to +125°C 24-Lead SOIC R-24 AD7397ARU 10 –40°C to +85°C 24-Lead Thin Shrink Small Outline Package (TSSOP) RU-24
The AD7396/AD7397 contains 1365 transistors. The die size measures 89 mil × 106 mil = 9434 sq mil.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7396/AD7397 features proprietary ESD protection circuitry, permanent dam­age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–5–REV. 0
AD7396/AD7397
PIN FUNCTION DESCRIPTIONS
Pin No. Name
1V
OUTA
2 AGND Analog Ground. 3 DGND Digital Ground. 4 LDA Load DAC A Register Strobe. Transfers input register data to the DAC A register. Active
5 SHDN Power Shutdown Active Low Input. DAC register contents are saved as long as power stays
6 RS Resets Input and DAC Register to Zero Condition. Asynchronous active low input. 7–18 D0–D11 Twelve Parallel Input Data Bits. D11 = MSB Pin 18, D0 = LSB Pin 7, AD7396. 7, 8 NC No Connect Pins 7 and 8 On the AD7397 Only. 9–18 D0–D9 Ten Parallel Input Data Bits. D9 = MSB Pin 18, D0 = LSB Pin 9, AD7397 Only. 19 CS Chip Select Latch Enable, Active Low. 20 A/B DAC Input Register Address Select DACA = 1 or DACB = 0. 21 LDB Load DAC B Register Strobe. Transfers input register data to the DAC B register. Active low
22 V 23 V 24 V
DD
REF
OUTB
DAC A Voltage Output.
low inputs, Level sensitive latch. May be connected together with LDB to double-buffer load both DAC registers simultaneously.
on the V
DD
pin.
inputs, Level sensitive latch. May be connected together with LDA to double-buffer load both DAC registers simultaneously.
Positive Power Supply Input. Specified range of operation +2.7 V to +5.5 V. DAC Reference Input Pin. Establishes DAC full-scale voltage. DAC B Voltage Output.
V
OUTA
AGND DGND
LDA
SHDN
RS
D0 D1 D2 D3 D4 D5
1 2 3 4 5
AD7396
6
TOP VIEW
(Not to Scale)
7 8
9 10 11
12
PIN CONFIGURATIONS
1
24
V
OUTB
23
V
REF
22
V
DD
21
LDB
20
A/B
19
CS
18
D11
17
D10
16
D9
15
D8
14
D7
13
D6
V
OUTA
2
AGND
3
DGND
4
LDA
5
SHDN
6
RS
7
NC
8
NC
9
D0
10
D1
11
D2
12
D3
NC = NO CONNECT
(Not to Scale)
AD7397
TOP VIEW
24
V
OUTB
23
V
REF
22
V
DD
21
LDB
20
A/B
19
CS
18
D9
17
D8
16
D7
15
D6
14
D5
13
D4
–6–
REV. 0
Typical Performance Characteristics–
pp
AD7396/AD7397
1.5 VDD = +3V
= +2.5V
V
REF
1.0
0.5
0.0
INL – LSB
–0.5
–1.0
–1.5
0
512 1024 1536 2048 2560 3072 3584 4096
TA = –558C
TA = +258C, +858C
CODE – Decimal
AD7396
Figure 4. AD7396 INL vs. Code and Temperature
1.0
AD7397
0.8
0.6
0.4
0.2
0.0
–0.2
DNL – LSB
–0.4 –0.6 –0.8 –1.0
TA = +258C, +858C, –558C
SUPERIMPOSED
0
128 256 384 512 640 768 896 1024
CODE – Decimal
VDD = +2.7V
= +2.5V
V
REF
Figure 7. AD7397 DNL vs. Code and Temperature
1.0 VDD = +2.7V
0.8 V
= +2.5V
REF
0.6
0.4
0.2
0.0
–0.2
INL – LSB
–0.4 –0.6
TA = +258C, +858C
–0.8 –1.0
0
128 256 384 512 640 768 896 1024
TA = –558C
CODE – Decimal
AD7397
Figure 5. AD7397 INL vs. Code and Temperature
60
40
FREQUENCY
20
0
AD7396
–55
–50 –45 –40
FULL-SCALE OUTPUT TEMPCO
HISTOGRAM –
SS = 200 UNITS V
= +2.7V
DD
= +2.5V
V
REF
= –408C TO +858C
T
A
–35 –30
m/8C
Figure 8. AD7396 Full-Scale Tempco Histogram
30
20
FREQUENCY
10
0
AD7397
–5
0
TOTAL UNADJUSTED ERROR
HISTOGRAM – LSB
SS = 200 UNITS T
= +258C
A
= +2.7V
V
DD
V
= +2.5V
REF
510
Figure 6. AD7397 TUE Histogram
100
80
60
40
FREQUENCY
20
0
SS = 200 UNITS V
= +2.7V
DD
= +2.5V
V
REF
= –408C TO +858C
T
A
–70 –60 –50 –40
FULL-SCALE TEMPCO – ppm/8C
AD7397
–30
Figure 9. AD7397 Full-Scale Tempco Histogram
1.5
1.0
0.5
0
INL – LSB
–0.5
–1.0
–1.5
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VDD = +5V
= +258C
T
A
CODE = HALF SCALE
V
– Volts
REF
Figure 10. INL Error vs. Reference Voltage
40
40
AD7396
20
0
FSE – mV
–20
VDD = +5V
= +258C
T
A
FSE (LSB) = FSE (V) 3 4096/V
–40
01 5
23 4
V
REF
REF
– V
20
0
–20
(V)
–40
Figure 11. Full-Scale Error vs. Refer­ence Voltage
–7–REV. 0
10
8
6
FSE – LSB
4
2
OUTPUT NOISE DENSITY – mV/ Hz
0
10 100 1k 10k 100k
1
FREQUENCY – Hz
Figure 12. Output Noise Voltage Density vs. Frequency
VDD = +5V
= +2.5V
V
REF
= +258C
T
A
AD7396/AD7397
0
–5
–10
VDD = +3V
–15
CODE = FULL SCALE
–20 –25
GAIN – dB
–30 –35 –40 –45 –50
100 1k 10k 100k 1M
FREQUENCY – Hz
Figure 13. Reference Multiplying Gain vs. Frequency
5.0 TA = +258C
4.5
4.0
3.5
3.0
2.5
2.0
LOGIC THRESHOLD – V
1.5
1.0
2
V
FROM
LOGIC
LOW TO HIGH
V
FROM
LOGIC
HIGH TO LOW
34 56 7
VDD – V
Figure 16. Logic Threshold Voltage vs. V
DD
1.262
1.257
1.252
– Volts
OUT
1.247
V
1.242
1.237
VDD = +5V V
= +2.5V
REF
= +25 C
T
A
CODE = 800 5mV/DIV
TIME – 2ms/DIV
TO 7FF
H
Figure 14. Midscale Transition Performance
35
30
25
20
15
10
CURRENT SOURCING – mA
OUT
I
5
0
–120
–100 –80 –60 –40 –20
Figure 17. I
V
OUT
OUT
VDD = +5V
DV
OUT
Source Current vs.
V T
VDD = +3V
– mV
= +2.5V
REF
= +258C
A
145 140
H
135
130
125
mA
120
DD
I
115 110
105
100
0
VIN = 0V TO +3V
VIN = +3V TO 0V
0.5 1 1.5 2 2.5 3 LOGIC INPUT – VIN (Volts)
Figure 15. IDD vs. Logic Input Voltage
45
V
= +2.5V
REF
40
= +258C
T
A
35 30
25 20
15
CURRENT SINKING – mA
10
OUT
I
5
0
0
Figure 18. I
V
VDD = +5V
VDD = +3V
0
24 6810
DV
– mV
OUT
Sink Current vs.
OUT
OUT
VDD = +3V T
= +258C
A
12
170
V
= +2.5V
REF
160
VDD = +3.6V, V
150 140
130
mA
120
DD
I
110 100
90 80
–200 204060
–40
= +2.4V
LOGIC
VDD = +5V, V
VDD = +3V, V
TEMPERATURE – 8C
LOGIC
80
= +5V
LOGIC
100 120 140
Figure 19. IDD vs. Temperature
= +3V
200
TA = +258C
180 160 140 120 100
mA
DD
I
80 60 40 20
0
0
12345
V
REF
VDD = +5V
VDD = +3V
– Volts
Figure 20. IDD vs. Reference Voltage
–8–
1000
V
= +2.5V
REF
= +5V
V
DD
SHDN = 0V
100
10
SHUTDOWN CURRENT – nA
SD
_
DD
I
1
–40
–20020 40 60 80 100 120 140
TEMPERATURE – 8C
Figure 21. Shutdown Current vs. Temperature
REV. 0
AD7396/AD7397
1400
AD7396
1200
A: VDD = +2.7V, CODE = 555 B: VDD = +2.7V, CODE = 3FF
1000
C: VDD = +5.5V, CODE = 155 D: VDD = +5.5V, CODE = 3FF
800
mA
DD
600
I
400
200
0
1k 10M
10k 100k 1M
DIGITAL INPUT FREQUENCY – Hz
H H H H
C
Figure 22. IDD vs. Digital Input
D
A
B
80
70
60
50
40
VDD = +3V, 65%
PSRR – dB
30
20
10
0
1 10k
VDD = +5V, 65%
10 100 1k
FREQUENCY – Hz
Figure 23. PSRR vs. Frequency
Frequency
OPERATION
The AD7396 and AD7397 are a set of pin compatible, 12-bit and 10-bit digital-to-analog converters. These single-supply
operation devices consume less than 200 µA of current while
operating from power supplies in the +2.7 V to +5.5 V range, making them ideal for battery operated applications. They contain a voltage-switched, 12-bit/10-bit, digital-to-analog converter, rail-to-rail output op amps, and a parallel-input DAC register. The external reference input has constant
2.5 M input resistance independent of the digital code
setting of the DAC. In addition, the reference input can be tied to the same supply voltage as V output voltage span of 0 to V
resulting in a maximum
DD
. The parallel data interface
DD
consists of 12 data bits, DB0–DB11, for the AD7396, 10 data bits, DB0–DB9, for the AD7397, and a CS write strobe. An RS pin is available to reset the DAC register to zero scale. This function is useful for power-on reset or system failure recovery to a known state. Additional power savings are accomplished by
activating the SHDN pin resulting in a 1.5 µA maximum con-
sumption sleep mode. As long as the supply voltage, remains data will be retained in the DAC and input register to supply the DAC output when the part is taken out of shutdown.
V
LDA
CS
A/B
DATA
AD7396
DACA
REGISTER
INPUTA
REGISTER
12
INPUTB
REGISTER
12
12-BIT DACA
1
V
V
DD
OUTA
REF
1.0
AD7396
0.9 SAMPLE SIZE = 77
0.8
V
= +2.5V
REF
0.7
0.6
0.5
0.4
0.3
0.2
0.1
NOMINAL CHANGE IN VOLTAGE – mV
0
0
CODE = FFF
CODE = 000
100 200 300 400 500 600
HOURS OF OPERATION AT +1508C
H
H
Figure 24. Long-Term Drift Acceler­ated by Burn-In
× D/2
N
(1)
= V
V
OUT
REF
where D is the decimal data word loaded into the DAC register, and N is the number of bits of DAC resolution. In the case of the 10-bit AD7397 using a 2.5 V reference, Equation 1 simpli­fies to:
= 2.5 × D/1024 (2)
V
OUT
Using Equation 2, the nominal midscale voltage at V
OUT
is
1.25 V for D = 512; full-scale voltage is 2.497 V. The LSB step
size is = 2.5 × 1/1024 = 0.0024 V.
For the 12-bit AD7396 operating from a 5.0 V reference equa­tion [1] becomes:
V
= 5.0 × D/4096 (3)
OUT
Using Equation 3, the AD7396 provides a nominal midscale voltage of 2.50 V for D = 2048, and a full-scale output of
4.998 V. The LSB step size is = 5.0 × 1/4096 = 0.0012 V.
AMPLIFIER SECTION
The internal DAC’s output is buffered by a low power con-
sumption precision amplifier. The op amp has a 60 µs typical
settling time to 0.1% of full scale. There are slight differences in settling time for negative slewing signals versus positive. Also, negative transition settling time to within the last 6 LSBs of zero volts has an extended settling time. The rail-to-rail output stage of this amplifier has been designed to provide precision perfor­mance while operating near either power supply. Figure 26 shows an equivalent output schematic of the rail-to-rail-ampli­fier with its N-channel pull-down FETs that will pull an output load directly to GND. The output sourcing current is provided by a P-channel pull-up device that can source current to GND terminated loads.
LDB
DGND
DACB
REGISTER
12
12-BIT DACB
RS SHDN
V
OUTB
AGND
Figure 25. Functional Block Diagram
D/A CONVERTER SECTION
The voltage switched R-2R DAC generates an output voltage dependent on the external reference voltage connected to the REF pin according to the following equation:
V
DD
P-ch
V
N-ch
OUT
AGND
Figure 26. Equivalent Analog Output Circuit
–9–REV. 0
AD7396/AD7397
V
DD
LOGIC
IN
GND
The rail-to-rail output stage provides ±1 mA of output current.
The N-channel output pull-down MOSFET shown in Figure 26
has a 35 ON resistance, which sets the sink current capability
near ground. In addition to resistive load driving capability, the amplifier has also been carefully designed and characterized for up to 100 pF capacitive load driving capability.
REFERENCE INPUT
The reference input terminal has a constant input resistance independent of digital code, which results in reduced glitches on
the external reference voltage source. The high 2.5 M input
resistance minimizes power dissipation within the AD7396/ AD7397 D/A converters. The V ranging from ground to the positive-supply voltage V
input accepts input voltages
REF
. One of
DD
the simplest applications, which saves an external reference voltage source, is connection of the V
terminal to the positive V
REF
DD
supply. This connection results in a rail-to-rail voltage output span maximizing the programmed range. The reference input will accept AC signals as long as they are kept within the supply voltage range, 0 < V
< VDD. The reference bandwidth
REF IN
and integral nonlinearity error performance are plotted in the Typical Performance Characteristics section, see Figures 10 and
13. The ratiometric reference feature makes the AD7396/AD7397 an ideal companion to ratiometric analog-to-digital converters such as the AD7896.
POWER SUPPLY
The very low power consumption of the AD7396/AD7397 is a direct result of a circuit design optimizing the use of a CBCMOS process. By using the low power characteristics of CMOS for the logic, and the low noise, tight matching of the complemen­tary bipolar transistors, excellent analog accuracy is achieved. One advantage of the rail-to-rail output amplifiers used in the AD7396/AD7397 is the wide range of usable supply voltage. The part is fully specified and tested for operation from +2.7 V to +5.5 V.
POWER SUPPLY BYPASSING AND GROUNDING
Precision analog products such as the AD7396/AD7397 require a well filtered power source. Since the AD7396/AD7397 oper­ates from a single +3 V to +5 V supply, it seems convenient to simply tap into the digital logic power supply. Unfortunately, the logic supply is often a switch-mode design, which generates noise in the 20 kHz to 1 MHz range. In addition, fast logic gates can generate glitches, hundred of millivolts in amplitude, due to wiring resistance and inductance. The power supply noise gen­erated thereby means that special care must be taken to assure that the inherent precision of the DAC is maintained. Good engineering judgment should be exercised when addressing the power supply grounding and bypassing of the 12-bit AD7396.
The AD7396 should be powered directly from the system power supply. Whether or not a separate power supply trace is avail­able generous supply bypassing will reduce supply line-induced
errors. Local supply bypassing consisting of a 10 µF tantalum electrolytic in parallel with a 0.1 µF ceramic capacitor is recom-
mended in all applications (Figure 27).
+2.7V TO +5.5V
*
CS
A/B
LDA LDB
DATA
*
OPTIONAL EXTERNAL
REFERENCE BYPASS
C
REF V
DGND AGND
AD7396
OR
AD7397
DD
+
0.1mF 10mF
V
V
OUTA
OUTB
Figure 27. Recommended Supply Bypassing
INPUT LOGIC LEVELS
All digital inputs are protected with a Zener-type ESD protec­tion structure (Figure 28) that allows logic input voltages to exceed the V
supply voltage. This feature can be useful if the
DD
user is driving one or more of the digital inputs with a 5 V CMOS logic input-voltage level while operating the AD7396/AD7397 on a +3 V power supply. If this mode of interface is used, make sure that the V
of the 5 V CMOS meets the VIL input require-
OL
ment of the AD7396/AD7397 operating at 3 V. See Figure 16 for a graph for digital logic input threshold versus operating V
DD
supply voltage.
Figure 28. Equivalent Digital Input ESD Protection
In order to minimize power dissipation from input-logic levels that are near the V
and VIL logic input voltage specifications, a
IH
Schmitt trigger design was used that minimizes the input-buffer current consumption compared to traditional CMOS input stages. Figure 15 shows a plot of incremental input voltage versus supply current showing that negligible current consump­tion takes place when logic levels are in their quiescent state. The normal crossover current still occurs during logic transi­tions. A secondary advantage of this Schmitt trigger is the pre­vention of false triggers that would occur with slow moving logic transitions when a standard CMOS logic interface or opto­isolators are used. The logic inputs DB11–DB0, A/B CS, RS, SHDN all contain Schmitt trigger circuits.
DIGITAL INTERFACE
The AD7396/AD7397 has a double-buffered, parallel-data input. A functional block diagram of the digital section is shown in Figure 25, while Table I contains the truth table for the logic control inputs. The chip select (CS) and A/B pins control load­ing of data from the data inputs on pins DB11–DB0 into the internal Input Register. The CS active low input places data into the decoded A/B input register. When CS returns to logic high within the data setup-and-hold time specifications the new value of data in the input register will be latched. See Truth Table for complete set of conditions. New data can only be transferred to the corresponding DAC register when its LDx pin is strobed active low. The LDx inputs are level-sensitive (DAC Registers are transparent latches) and can be tied active low
–10–
REV. 0
AD7396/AD7397
allowing any new Input Register data updates to directly control the DAC output voltages for single-buffered applications. For doubled-buffered applications where both DAC outputs, V and V
, need to be changed simultaneously to a new value,
OUTB
OUTA
the two inputs, LDA and LDB, can be tied together and pulsed active low in a synchronous manner.
RESET (RS) PIN
Forcing the asynchronous RS pin low will set the Input and DAC registers to all zeros and the DAC output voltage will be zero volts. The reset function is useful for setting the DAC outputs to zero at power-up or after a power supply interrup­tion. Test systems and motor controllers are two of many appli­cations that benefit from powering up to a known state. The external reset pulse can be generated by the microprocessor’s power-on RESET signal, from the microprocessor, or by an external resistor and capacitor. RESET has a Schmitt trigger input which results in a clean reset function when using external resistor/capacitor generated pulses. See Table I, Control-Logic Truth.
POWER SHUTDOWN (SHDN)
Maximum power savings can be achieved by using the power shutdown control function. This hardware-activated feature is controlled by the active low input SHDN pin. This pin has a Schmitt trigger input which helps to desensitize it to slowly changing inputs. By placing a logic low on this pin the internal consumption of the AD7397 or AD7397 is reduced to nanoamp
levels, guaranteed to 1.5 µA maximum over the operating tem-
perature range. If power is present at all times on the V
DD
pin while in the shutdown mode, the internal DAC register will retain the last programmed data value. This data will be used when the part is returned to the normal active state by placing the DAC back to its programmed voltage setting. Shutdown
recovery time measures 80 µs. In the shutdown state the DAC
output amplifier exhibits an open-circuit high-resistance state. Any load connected will stabilize at its termination voltage. If the power shutdown feature is not needed then the user should tie the SHDN pin to the V
voltage thereby disabling this
DD
function.
UNIPOLAR OUTPUT OPERATION
This is the basic mode of operation for the AD7396. As shown in Figure 29, the AD7396 has been designed to drive loads as
low as 5 k in parallel with 100 pF. The code table for this
operation is shown in Table II.
+2.7V TO +5.5V
R
0.01mF
EXT
REF
mC
16/14
V
DD
AD7396
V
REF
DAC A
DIGITAL
DAC B
DGND AGND
DIGITAL INTERFACE CIRCUITRY OMITTED FOR CLARITY.
75kV
75kV
0.1mF 10mF
V
OUTA
100pF
V
OUTB
100pF
Figure 29. Unipolar Output Operation
Table II. Unipolar Code Table
Hexadecimal Decimal Output Number Number Voltage (V) In DAC Register In DAC Register (V
= 2.5 V)
REF
FFF 4095 2.4994 801 2049 1.2506 800 2048 1.2500 7FF 2047 1.2494 000 0 0
The circuit can be configured with an external reference plus power supply, or powered from a single dedicated regulator or reference, depending on the application performance requirements.
BIPOLAR OUTPUT OPERATION
Although the AD7397 has been designed for single supply op­eration, the output can easily be configured for bipolar opera­tion. A typical circuit is shown in Figure 30. This circuit uses a clean regulated +5 V supply for power, which also provides the circuit’s reference voltage. Since the AD7397 output span swings from ground to very near +5 V, it is necessary to choose an external amplifier with a common-mode input voltage range that extends to its positive supply rail. The micropower con­sumption OP196 has been designed just for this purpose and
results in only 50 µA of maximum current consumption. Con- nection of the equal-value 470 k resistors results in a differen-
tial amplifier mode of operation with a voltage gain of two, which produces a circuit output span of ten volts, that is, –5 V to +5 V. As the AD7397 DAC is programmed from zero­code 000 put voltage V output voltage V
to midscale 200H to full-scale 3FFH, the circuit out-
H
is set at –5 V, 0 V and +5 V (–1 LSB). The
O
is coded in offset binary according to
O
Equation 3.
V
= [(D/512)–1] × 5 (4)
OUT
where D is the decimal code loaded in the AD7397 DAC regis­ter. Note that the LSB step size is 10/1024 = 10 mV. This circuit has been optimized for micropower consumption includ-
ing the 470 k gain setting resistors, which should have low
temperature coefficients to maintain accuracy and matching (preferably the same resistor material, such as metal film). If better stability is required, the power supply could be substi­tuted with a precision reference voltage such as the low dropout
REF195, which can easily supply the circuit’s 262 µA of current
and still provide additional power for the load connected to VO. The micropower REF195 is guaranteed to source 10 mA output
drive current, but consumes only 50 µA internally. If higher
resolution is required, the AD7396 can be used with the addi­tion of two more bits of data inserted into the software coding, which would result in a 2.5 mV LSB step size. Table III shows examples of nominal output voltages, V
, provided by the bipo-
O
lar operation circuit application.
–11–REV. 0
AD7396/AD7397
< 262mA
I
SY
+5V
200mA
V
REF
DD
C
AD7397
GND
Figure 30. Bipolar Output Operation
470kV 470kV
< 50mA
V
OUTA
ONLY ONE CHANNEL SHOWN. DIGITAL INTERFACE CIRCUITRY OMITTED FOR CLARITY.
OP196
–5V
Hexadecimal Number Decimal Number Analog Output In DAC Register In DAC Register Voltage (V)
3FF 1023 4.9902 201 513 0.0097 200 512 0.0000
V
O
+5V
BIPOLAR OUTPUT SWING
–5V
1FF 511 –0.0097 000 0 –5.0000
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
Table III. Bipolar Code Table
C3425–8–10/98
24
1
0.0118 (0.30)
0.0040 (0.10)
PIN 1
24-Lead SOIC Package
(R-24)
0.6141 (15.60)
0.5985 (15.20)
0.1043 (2.65)
0.0926 (2.35)
0.0500
0.0192 (0.49)
(1.27)
0.0138 (0.35)
BSC
13
12
SEATING PLANE
0.2992 (7.60)
0.2914 (7.40)
0.4193 (10.65)
0.0125 (0.32)
0.0091 (0.23)
24-Lead Narrow Body Plastic DIP Package
1.275 (32.30)
1.125 (28.60)
24
112
PIN 1
0.022 (0.558)
0.014 (0.356)
0.100 (2.54)
0.3937 (10.00)
88 08
0.0291 (0.74)
0.0098 (0.25)
0.0500 (1.27)
0.0157 (0.40)
3 458
0.210
(5.33)
MAX
0.200 (5.05)
0.125 (3.18)
24-Lead Thin Surface Mount TSSOP Package
(RU-24)
0.311 (7.90)
0.303 (7.70)
24 13
BSC
(N-24)
0.070 (1.77)
0.045 (1.15)
13
0.280 (7.11)
0.240 (6.10)
0.060 (1.52)
0.015 (0.38)
0.150 (3.81) MIN
SEATING PLANE
0.325 (8.25)
0.300 (7.62)
0.015 (0.381)
0.008 (0.204)
0.195 (4.95)
0.115 (2.93)
0.177 (4.50)
0.006 (0.15)
0.002 (0.05)
SEATING
PLANE
0.169 (4.30)
1
PIN 1
0.0256 (0.65) BSC
0.0118 (0.30)
0.0075 (0.19)
12
–12–
0.256 (6.50)
0.246 (6.25)
0.0433 (1.10) MAX
0.0079 (0.20)
0.0035 (0.090)
88 08
PRINTED IN U.S.A.
0.028 (0.70)
0.020 (0.50)
REV. 0
Loading...